ICS9112BM-18T [ICSI]

Zero Delay, Low Skew Buffer; 零延迟,低偏移缓冲器
ICS9112BM-18T
型号: ICS9112BM-18T
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

Zero Delay, Low Skew Buffer
零延迟,低偏移缓冲器

文件: 总4页 (文件大小:66K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ICS9112-18  
Zero Delay, Low Skew Buffer  
Features  
Description  
The ICS9112-18 is a low jitter, low-skew, high  
performance PLL based zero delay buffer for high  
speed applications. Based on ICS’s proprietary low  
jitter Phase Locked Loop (PLL) techniques, the  
device provides eight low skew outputs at speeds  
up to 160 MHz at 3.3 V. The ICS9112-18  
includes a bank of four outputs running at 1X, and  
another four outputs running at 1/2X. In the zero  
delay mode, the rising edge of the input clock is  
aligned with the rising edges of all eight outputs.  
Compared to competitive CMOS devices, the  
ICS9112-18 has the lowest jitter of all.  
• Packaged in 16 pin narrow SOIC  
• Zero input-output delay  
• Four 1X outputs plus four half-X outputs  
• Output to output skew is less than 250 ps  
• Output clocks up to 160 MHz at 3.3 V  
• Ability to generate 2X the input  
• Full CMOS outputs with 18 mA output drive  
capability at TTL levels at 3.3 V  
• Spread Smart™ technology works with spread  
spectrum clock generators  
ICS manufactures the largest variety of clock  
generators and buffers, and is the largest clock  
supplier in the world.  
• Advanced, low power, sub-micron CMOS process  
• 3.0 to 5.5 V operating voltage  
Block Diagram  
FBIN  
PLL  
CLKA1  
CLKA2  
CLKA3  
CLKA4  
CLKIN  
Mux  
÷ 2  
CLKB1  
CLKB2  
CLKB3  
CLKB4  
2
Control  
Logic  
S2, S1  
MDS 9112-18 F  
1
Revision 050400  
Printed 11/15/00  
Integrated Circuit Systems, Inc.• 525 Race Street • San Jose • CA • 95126 • (408)295-9800tel• www.icst.com  
ICS9112-18  
Zero Delay, Low Skew Buffer  
Pin Assignment  
ICS9112-18  
16 FBIN  
CLKIN  
CLKA1  
CLKA2  
1
2
3
4
5
6
7
8
15 CLKA4  
14 CLKA3  
VDD  
13  
VDD  
GND  
12 GND  
Feedback Configuration Table  
11 CLKB4  
CLKB1  
CLKB2  
Feedback From  
Bank A  
CLKA1:A4  
CLKIN  
CLKB1:B4  
CLKIN/2  
CLKIN  
CLKB3  
S1  
10  
9
Bank B  
2XCLKIN  
S2  
16 pin narrow (150 mil) SOIC  
Output Clock Mode Select Table  
S2  
0
S1  
0
Clocks A1-A4  
Clocks B1-B4  
Internal Generation  
PLL Status  
On  
Tri-state (high impedance) Tri-state (high impedance)  
None  
0
1
Running  
Running  
Running  
Tri-state (high impedance)  
Running  
PLL  
Buffer Only (no zero delay)  
PLL  
On  
1
0
Off  
1
1
Running  
On  
Pin Descriptions  
Number  
Name  
CLKIN  
CLKA1:4  
VDD  
Type Description  
1
I
O
P
P
O
I
CLocK INput. Connect to input clock source.  
CLocK A bank of four outputs.  
2, 3, 14, 15  
4, 13  
Power supply. Connect both pins to same voltage (either 3.3V or 5V).  
Connect to ground.  
5, 12  
GND  
6, 7, 10, 11  
CLKB1:4  
S2  
CLocK B bank of four outputs. These are low skew divide by two of bank A.  
Select input #2. Selects mode for outputs per table above.  
8
9
S1  
I
Select input #1. Selects mode for outputs per table above.  
16  
FBIN  
I
FeedBack INput. Determines outputs per Feedback Configuration Table above.  
Key: I = Input; O = output; P = power supply connection.  
External Components  
The ICS9112-18 requires a minimum number of external components for proper operation. Decoupling  
capacitors of 0.1µF should be connected between VDD and GND on pins 4 and 5, and VDD and GND  
on pins 13 and 12, as close to the device as possible. A series termination resistor of 33 Wmay be used close  
to the pin for each clock output to reduce reflections.  
MDS 9112-18 F  
2
Revision 050400  
Printed 11/15/00  
Integrated Circuit Systems, Inc.• 525 Race Street • San Jose • CA • 95126 • (408)295-9800tel• www.icst.com  
ICS9112-18  
Zero Delay, Low Skew Buffer  
Electrical Specifications  
Parameter  
Conditions  
Minimum  
Typical  
Maximum Units  
ABSOLUTE MAXIMUM RATINGS (note 1)  
Supply voltage, VDD  
Referenced to GND  
-0.5  
-0.5  
2000  
0
7
V
V
Inputs and Clock Outputs  
Electrostatic Discharge  
Ambient Operating Temperature  
Soldering Temperature  
Junction temperature  
Referenced to GND  
MIL-STD-883  
VDD+0.5  
V
70  
°C  
°C  
°C  
°C  
Max of 10 seconds  
260  
150  
150  
Storage temperature  
-65  
DC CHARACTERISTICS (VDD = 3.3 V unless specified otherwise)  
Operating Voltage, VDD  
3.00  
5.50  
VDD/2-1  
0.8  
V
V
Input High Voltage, VIH, CLKIN pin only  
Input Low Voltage, VIL, CLKIN pin only  
Input High Voltage, VIH  
VDD/2+1  
VDD/2  
VDD/2  
V
2
V
Input Low Voltage, VIL  
V
Output High Voltage, VOH  
IOH=-18 mA  
IOL=18 mA  
2.4  
V
Output Low Voltage, VOL  
0.4  
V
Output High Voltage, VOH, CMOS level  
Operating Supply Current, IDD (Note 2)  
IOH=-5 mA  
VDD-0.4  
V
No Load, S1 = S2 = 1  
Each output  
44  
±65  
7
mA  
mA  
pF  
Short Circuit Current  
Input Capacitance  
S2, S1, FBIN  
AC CHARACTERISTICS (VDD = 3.3 V unless specified otherwise)  
FBIN to CLKA1, S1=S2=1  
FBIN to CLKA1, S1=S2=1  
0.8 to 2.0V  
Input Clock Frequency  
20  
20  
160  
160  
1.5  
1.5  
60  
MH z  
MH z  
ns  
Output Clock Frequency  
Output Clock Rise Time, CL=30pF  
Output Clock Fall Time, CL=30pF  
Output Clock Duty Cycle, VDD=3.3V  
Device to Device Skew, equally loaded  
Output to Output Skew, equally loaded  
Maximum Absolute Jitter  
2.0 to 0.8V  
ns  
At 1.4V  
40  
50  
%
rising edges at VDD/2  
rising edges at VDD/2  
700  
250  
ps  
ps  
300  
ps  
Cycle to Cycle Jitter, 30pF loads  
66.67 MHz outputs  
500  
ps  
Notes: 1. Stresses beyond those listed under Absolute Maximum Ratings could cause permanent damage to the device. Prolonged  
exposure to levels above the operating limits but below the Absolute Maximums may affect device reliability.  
2. With CLKIN = 160 MHz, FBIN to CLKA1  
Using Spread Spectrum Input Clocks  
The ICS9112-18 uses ICS’ Spread Smart technology, allowing it to accurately track (pass through) any  
clocks that use spread spectrum techniques.  
MDS 9112-18 F  
3
Revision 050400  
Printed 11/15/00  
Integrated Circuit Systems, Inc.• 525 Race Street • San Jose • CA • 95126 • (408)295-9800tel• www.icst.com  
ICS9112-18  
Zero Delay, Low Skew Buffer  
Package Outline and Package Dimensions  
(For current dimensional specifications, see JEDEC Publication No. 95.)  
16 pin SOIC narrow  
Inches  
Min  
Millimeters  
Symbol  
A
Max  
Min  
1.35  
0.10  
0.33  
0.19  
9.80  
3.80  
1.27 BSC  
5.80  
0.25  
0.41  
Max  
0.0532 0.0688  
0.0040 0.0098  
0.0130 0.0200  
0.0075 0.0098  
0.3859 0.3937  
0.1497 0.1574  
.050 BSC  
1.75  
0.24  
0.51  
0.24  
10.00  
4.00  
A1  
E
H
B
C
INDEX  
AREA  
D
E
e
1
2
H
h
0.2284 0.2440  
0.0099 0.0195  
0.0160 0.0500  
6.20  
0.50  
1.27  
h x 45°  
L
D
A
L
A1  
C
B
e
Ordering Information  
Part/Order Number  
ICS9112BM-18  
Marking*  
9112BM-18  
9112BM-18  
Shipping packaging  
tubes  
Package  
Temperature  
0-70 °C  
16 pin SOIC  
16 pin SOIC  
ICS9112BM-18T  
tape and reel  
0-70 °C  
*Also indicated on the top of the package are the initials ICS in a box.  
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its  
use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is  
intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary  
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does  
not authorize or warrant any ICS product for use in life support devices or critical medical instruments.  
MDS 9112-18 F  
4
Revision 050400  
Printed 11/15/00  
Integrated Circuit Systems, Inc.• 525 Race Street • San Jose • CA • 95126 • (408)295-9800tel• www.icst.com  

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