ICS9212YF-13LF [ICSI]

Direct Rambus⑩ Clock Generator; 直接Rambus ™时钟发生器
ICS9212YF-13LF
型号: ICS9212YF-13LF
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

Direct Rambus⑩ Clock Generator
直接Rambus ™时钟发生器

时钟发生器
文件: 总7页 (文件大小:161K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ICS9212-13  
Integrated  
Circuit  
Systems, Inc.  
Direct Rambus™ Clock Generator  
General Description  
Features  
Compatible with all Direct Rambus™ based IC s  
Up to 600 MHz differential clock source for direct  
Rambus™ memory system  
Cycle to cycle jitter is less than 40ps  
3.3 + 5% supply  
Synchronization flexibility: Supports Systems that  
need clock domains of Rambus channel to  
synchronize with system or processor clock, or  
systems that do not require synchronization of the  
Rambus clock to another system clock  
The ICS9212-13 is a High-speed clock generator providing  
up to 600 MHz differential clock source for direct Rambus  
memory system. It includes DDLL (Distributed Delay  
locked loop) and phase detection mechanism to  
synchronize the direct Rambuschannel clock to an  
external system clock. ICS9212-13 provides a solution for  
a broad range of Direct Rambus memory applications.The  
device works in conjunction with the ICS9250-09.  
The ICS9212-13 power management support system  
turns “off” the Rambuschannel clock to minimize power  
consumption for mobile and other power–sensitive  
applications. In “clock off” mode the device remains “on”  
while the output is disabled, allowing fast transitions  
between clock-off and clock–on states. In “power down”  
mode it completely powers down for minimum power  
dissipation.  
Excellent power management support  
REFCLK input is from the ICS9250-09.  
The ICS9212-13meetstherequirementsforinputfrequency  
tracking when the input frequency clock is using Spread  
Spectrum clocking and also the optimum bandwidth is  
maintained while attenuating the jitter of the reference  
signal.  
Block Diagram  
BUSCLK_STOP#  
Pin Configuration  
VDDREF  
REFCLK  
VDD1  
1
2
3
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
FS0  
FS1  
VDD-OUT  
GND-OUT  
BUSCLKT  
N/C  
PD#  
FS(0:1)  
Test MUX  
GND1  
4
Bypass MUX  
GND3  
5
GND  
Bypclk  
PCLK/M  
SYNCLK/N  
GND2  
6
7
8
9
10  
11  
12  
PLLclk  
PLL  
BUSCLKC  
GND-OUT  
VDD-OUT  
MULTI0  
MULTI1  
FS2  
Refclk  
B
A
BUSCLKT  
BUSCLKC  
Phase  
Aligner  
VDD2  
VDDPD  
BUSCLK_STOP#  
PD#  
PAclk  
GND  
Phase  
Detector  
Multi(0:1)  
2
Pclk/M  
Synclk/N  
24-Pin 150 Mil SSOP  
0272F—08/08/07  
ICS9212-13  
Pin Descriptions  
Pin #  
Name  
Type  
Description  
1
VDDREF  
REFV  
Reference voltage for refclk, to be connected to CK133  
2
3
4
5
REFCLK  
VDD1  
GND1  
IN  
Reference clock, to be connected to CK133  
3.3 V power supply used for PLL  
Ground for PLL  
PWR  
PWR  
PWR  
GND3  
Ground for control inputs  
Phase controller input, used to drive a phase aligner  
that adjusts the phase of the busclk.  
Ground for phase aligner  
3.3 V power supply used for phase aligner  
Reference voltage for phase detector inputs connected  
to the controller  
6,7  
PCLK/M, SYNCLK/N  
IN  
8
9
GND2  
VDD2  
PWR  
PWR  
10  
11  
12  
VDDPD  
BUSCLK_ STOP#  
PD#  
REFV  
IN  
Active low output enable/disable  
3.3V CMOS active low power down, the device is  
powered down when the "(PD#) =0"  
3.3V CMOS PLL Multiplier select, logic for selecting  
the multiply ratio for the PLL from the input REFCLK  
3.3V supply for clock out puts  
IN  
14,15  
MULTI (0:1)  
IN  
16  
17  
VDD_OUT  
GND_OUT  
PWR  
PWR  
Ground for clock outputs  
Out put clock connected to the Rambus channel. This  
output is the complement of BUSCLK  
NOT USED  
Output clock connected to the Rambus channel. This  
output is the true component of BUSCLK  
Ground for clock outputs  
18  
19  
20  
BUSCLKC  
N/C  
OUT  
N/C  
BUSCLKT  
OUT  
21  
22  
GND_OUT  
VDD_OUT  
PWR  
PWR  
3.3V supply for clock out puts  
3.3V CMOS Mode control, used in selecting bypass,  
test, normal, and output test (OE)  
13,23,24  
FS(0:2)  
IN  
0272F—08/08/07  
2
ICS9212-13  
PLL Divider Selection and PLL Values (PLLCLK = REFCLK*A/B)  
Multo  
Mult1  
A
4
6
16  
8
B
1
1
3
1
PLLCLK for REFCLK=50MHz  
PLLCLK for REFCLK=66.66MHz  
0
0
1
1
0
1
0
1
Reserved  
300  
266.7  
400  
266.6  
400.0  
355.5  
533.3  
Bypass and Test Mode Selection  
Mode  
FS0  
FS1  
FS2  
0
Bypclk (int.)  
BusClk  
BusClkB  
Normal  
0
0
Gnd  
PAclk  
PAclkB  
Bypass  
1
0
0
PLLclk  
PLLclk  
PLLclkB  
Test  
1
1
0
Refclk  
Refclk  
RefclkB  
Vendor Test A  
Vendor Test B  
Reserved  
0
0
1
-
-
-
-
-
-
1
0
1
-
-
-
-
1
1
1
Output Test (OE)  
0
1
X
Hi-Z  
Hi-Z  
Power Management Modes  
State  
PwrDnB  
StopB  
NORMAL  
Clk Off  
Powerdown  
1
1
0
1
0
X
0272F—08/08/07  
3
ICS9212-13  
Absolute Maximum Ratings  
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . 4.0 V  
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . GND –0.5 V to VDD +0.5 V  
Ambient Operating Temperature . . . . . . . . . . 0°C to +70°C  
Storage Temperature . . . . . . . . . . . . . . . . . . . . –65°C to +150°C  
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These  
ratings are stress specifications only and functional operation of the device at these or any other conditions above those  
listed in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions  
for extended periods may affect product reliability.  
Electrical Characteristics-input/supply/Outputs  
Parameters  
Symbol  
Min  
Max  
Unit  
Supply Voltage  
VDD  
3.135  
3.465  
V
Refclk Input cycle time  
Input cycle-to-cycle Jitter  
tCYCLE,IN  
tJ,IN  
10  
-
40  
ns  
ps  
250  
Input Duty cycle over 10k cycles  
40%  
30  
60%  
33  
DCIN  
Fm,in  
tCYCLE  
kHz  
Input frequency of modulation  
Modulation index  
PM,IN  
0.25  
30  
-0.5  
25%  
0.5  
100  
0.5  
%
ns  
tCYCLE,PD  
tCYCLE,PD  
Phase detector input cycle time at PDclk/M & Synclk/N  
Initial phase error at phase detector inputs  
Phase detector input duty cycle over 10k cycles  
Input rise & fall times ( measured at 20%-80% of input voltage) for  
PDCLK/M & SYNCLK/N,&REfCLK  
tCYCLE,PD  
Terr,init  
DCIN,PD  
75%  
TIR,TIF  
-
1
ns  
Input capacitance at PDCLK/M,Synclk/N,&REFCLK  
Input Capacitance matching at PCLK/M & SYNCLK/N  
Input capacitance at CMOS pins  
CIN,PD  
DCIN,PD  
CIN,CMOS  
VIL  
-
7
pF  
pF  
pF  
-
-
-
0.5  
10  
0.3  
-
Input (CMOS) signal low voltage  
Vdd  
Vdd  
Vddi,R  
Input (CMOS) signal high voltage  
VIH  
0.7  
-
REFCLK input low voltage  
VIL,R  
0.3  
REFCLK input high voltage  
Input signal low voltage for PD inputs and STOP  
VIH,R  
0.7  
-
-
Vddi,R  
Vddi,PD  
0.3  
VIL,PD  
VIH,PD  
VDD,IR  
VDDI,PD  
Input signal high voltage for PD inputs and STOP  
Input supply referance for REFCLK  
0.7  
1.3  
1.3  
-
Vddi,PD  
3.465  
3.465  
V
V
Input supply referance vfor PD inputs  
Phase detector phase error for distributed loop measured at  
PDCLK/M & SYNCLK/N(rising  
tERR,PD  
-100  
100  
ps  
Cycle cycle time  
tCYCLE  
2.5  
3.75  
40  
ns  
ps  
ps  
Cycle-to-cycle jitter at Busclk/BUSCLKB (533 MHz)  
Total jitter over 1 - 6 cycles (533MHz)  
tJ  
tJ  
-
-
30  
Phase aligner, phase step size (BSCLK/BUSCLKB)  
PLL out put phase error when tracking SSC  
tSTEP  
1
-
ps  
ps  
tERR,SSC  
-100  
100  
Out put crossing-point voltage  
Output voltage swing  
VX  
1.3  
0.4  
1.8  
0.6  
V
V
VCOS  
Output high voltage  
VH  
-
40%  
-
2
V
tCYCLE  
ps  
Out put duty cycle over 10k cycle  
DC  
60%  
50  
Output cycle -to-cycle duty cycle error  
tDC,ERR  
tCR,tCF  
tCR,CF  
IDD  
Output rise & fall times ( measured at 20%-80% of output voltage)  
Difference between rise and fall times on a single device(20%-80%)  
300  
-
500  
100  
ps  
ps  
Opearting Supply Current  
150  
mA  
0272F—08/08/07  
4
ICS9212-13  
Recommended Layout  
General Layout Precautions:  
1) Use a ground plane on the top layer of  
the PCB in all areas not used by traces.  
2) Make all power traces and vias as wide  
as possible to lower inductance.  
Capacitor Values:  
C3 : 100pF ceramic  
All unmarked capacitors are 0.01µF ceramic  
Connections to VDD:  
0272F—08/08/07  
5
ICS9212-13  
COMMON  
DIMENSIONS  
VARIATIONS  
D
S
SYMBOL  
MIN. NOM. MAX.  
MIN. NOM. MAX. MIN. NOM. MAX.  
N
A
A1  
A2  
B
.061  
.004  
.055  
.008  
.0075  
.064  
.006  
.058  
.010  
.008  
.068  
.0098  
.061  
.012  
.0098  
AA  
AB  
AC  
AD  
.189  
.337  
.337  
.386  
.194  
.342  
.342  
.391  
.196  
.344  
.344  
.393  
.0020 .0045 .0076  
.0500 .0525 .0550  
.0250 .0275 .0300  
.0250 .0280 .0300  
16  
20  
24  
28  
C
D
E
e
H
L
SEE VARIATIONS  
.150  
.155  
.025 BSC  
.236  
.157  
150 mil SSOP Package  
.230  
.010  
.244  
.016  
.013  
N
S
SEE VARIATIONS  
SEE VARIATIONS  
Diminisions are in inches  
0°  
0.85  
5°  
0.93  
8°  
.100  
X
Ordering Information  
ICS9212yF-13LF  
Example:  
ICS XXXX y F - PPLF T  
Designation for tape and reel packaging  
Lead Free, RoHS Compliant (Optional)  
Pattern Number (2 or 3 digit number for parts with ROM code patterns)  
Package Type  
F = SSOP  
Revision Designator (will not correlate with datasheet revision)  
Device Type (consists of 3 or 4 digit numbers)  
Prefix  
ICS = Standard Device  
0272F—08/08/07  
6
ICS9212-13  
Revision History  
Rev.  
Issue Date Description  
Page #  
F
08/08/07 Fixed typo on Electrical Characteristics.  
4
0272F—08/08/07  
7

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