ICSLV810RILF [ICSI]

Buffer/Clock Driver; 缓冲器/时钟驱动器
ICSLV810RILF
型号: ICSLV810RILF
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

Buffer/Clock Driver
缓冲器/时钟驱动器

时钟驱动器 逻辑集成电路 光电二极管
文件: 总12页 (文件大小:244K)
中文:  中文翻译
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ICSLV810  
Buffer/Clock Driver  
Description  
Features  
The ICSLV810 is a low skew 1.5 V to 2.5 V, 1:10 fanout  
buffer. This device is specifically designed for data  
communications clock management. The large fanout  
from a single input line reduces loading on the input  
clock. The TTL level outputs reduce noise levels on the  
part. Typical applications are clock and signal  
distribution.  
Packaged in 20-pin QSOP/SSOP  
Split 1:10 fanout Buffer  
Maximum skew between outputs of different  
packages 0.75 ns  
Max propagation delay of 3.8 ns  
Operating voltage of 1.5 V to 2.5 V on Bank A  
Operating voltage of 1.5 V to 2.5 V on Banks B and C  
Advanced, low power, CMOS process  
Industrial temperature range -40° C to +85° C  
3.3 V tolerant input when VDDA=2.5 V  
Available in Pb (lead) free packaging  
Block Diagram  
VDDA  
CLK 1  
CLK 2  
CLK 3  
CLK 4  
CLK 5  
CLKIN  
CLK 6  
CLK 7  
CLK 8  
CLK 9  
CLK 10  
VDDB  
VDDC  
MDS LV810 F  
1
Revision 101305  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICSLV810  
Buffer/Clock Driver  
Pin Assignment  
1
2
3
4
5
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
CLKIN  
GND  
VDDB  
CLK 10  
CLK 9  
GND  
CLK 1  
VDDA  
CLK 2  
GND  
CLK 8  
VDDC  
CLK 7  
GND  
6
7
CLK 3  
VDDA  
CLK 4  
GND  
8
9
CLK 6  
CLK 5  
10  
20 pin (150mil) SSOP  
Pin Descriptions  
Pin  
Number  
Pin  
Name  
Pin  
Type  
Pin Description  
1
2
CLKIN  
GND  
Input  
Clock input.  
Power  
Connect to ground.  
3
CLK1  
VDDA  
CLK2  
GND  
Output Clock output.  
4
Power  
Connect to +1.5 - +2.5 V.  
5
Output Clock output.  
6
Power  
Connect to ground.  
7
CLK3  
VDDA  
CLK4  
GND  
Output Clock output.  
8
Power  
Connect to +1.5 - +2.5 V.  
9
Output Clock output.  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
Power  
Connect to ground.  
CLK5  
CLK6  
GND  
Output Clock output.  
Output Clock output.  
Power  
Connect to ground.  
CLK7  
VDDC  
CLK8  
GND  
Output Clock output.  
Power  
Connect to +1.5 - 2.5 V.  
Output Clock output.  
Power  
Connect to ground.  
CLK9  
CLK10  
VDDB  
Output Clock output.  
Output Clock output.  
Power  
Connect to +1.5 - 2.5 V.  
MDS LV810 F  
2
Revision 101305  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICSLV810  
Buffer/Clock Driver  
with the clock line, as close to the clock output pin as  
possible. The nominal impedance of the clock output is  
20.  
External Components  
The ICSLV810 requires a minimum number of external  
components for proper operation.  
PCB Layout Recommendations  
Decoupling Capacitors  
For optimum device performance and lowest output  
phase noise, the following guidelines should be  
observed.  
Decoupling capacitors of 0.01µF must be connected  
between VDD and GND, as close to these pins as  
possible. For optimum device performance, the  
decoupling capacitors should be mounted on the  
component side of the PCB. Avoid the use of vias in the  
decoupling circuit.  
1) The 0.01µF decoupling capacitors should be  
mounted on the component side of the board as close  
to the VDD pins as possible. No vias should be used  
between the decoupling capacitors and VDD pins. The  
PCB trace to VDD pin should be kept as short as  
possible, as should the PCB trace to the ground via.  
Series Termination Resistor  
When the PCB trace between the clock outputs and the  
loads are over 1 inch, series termination should be  
used. To series terminate a 50trace (a commonly  
used trace impedance) place a 33resistor in series  
2) To minimize EMI the 33series termination resistor,  
if needed, should be placed close to the clock output.  
Absolute Maximum Ratings  
Stresses above the ratings listed below can cause permanent damage to the ICSLV810. These ratings,  
which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of  
the device at these or any other conditions above those indicated in the operational sections of the  
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can  
affect product reliability. Electrical parameters are guaranteed only over the recommended operating  
temperature range.  
Item  
Rating  
Supply Voltage, VDD MAX  
All Inputs and Outputs  
7 V  
-0.5 V to VDDA + 1.2 V  
-40 to +85°C  
-65 to +150°C  
125°C  
Ambient Operating Temperature  
Storage Temperature  
Junction Temperature  
Soldering Temperature  
260°C  
Recommended Operation Conditions  
Parameter  
Min.  
-40  
Typ.  
Max.  
+85  
Units  
Ambient Operating Temperature  
°C  
V
Power Supply Voltage (measured with respect to GND), VDDA  
Power Supply Voltage (measured with respect to GND), VDDB  
Power Supply Voltage (measured with respect to GND), VDDC  
1.425  
1.425  
1.425  
2.625  
2.625  
2.625  
V
V
MDS LV810 F  
3
Revision 101305  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICSLV810  
Buffer/Clock Driver  
DC Electrical Characteristics—CLKIN and Bank A  
VDDA = 2.5 V, Ambient Temperature -40° C to +85° C  
Parameter  
Symbol  
VDDA  
Conditions  
Min.  
Typ.  
Max. Units  
Operating Voltage  
1.425  
2.625  
V
Quiescent Power Supply  
Current  
IDDA  
No Load  
F = 40 MHz  
15  
80  
mA  
mA  
V
Short Circuit Current  
IOS  
CLK 1 - 5  
Input High Voltage,  
CLKIN  
Guaranteed  
Logic Level  
High  
1.6  
1.8  
V
IH  
Input Low Voltage,  
CLKIN  
V
Guaranteed  
Logic Level Low  
0.8  
0.4  
V
V
V
IL  
IOH = -7 mA  
IOL =12 mA  
Output High Voltage  
V
VIN = VIH or  
VIL  
OH  
Output Low Voltage  
V
VIN = VIH or  
VIL  
OL  
Input High Current  
Input Low Current  
Input High Current  
IIH  
VDD = max  
VDD = max  
VDD = max  
VIN = 2.4 V  
VIN = 0.5 V  
1
µA  
µA  
µA  
IIL  
II  
-1  
20  
VIN = VDD  
(max)  
Input Capacitance  
Output Capacitance  
CIN  
VIN = 0V, Note1  
5
6.0  
8.0  
pF  
pF  
COUT  
V
= 0V,  
5.5  
OUT  
Note1  
Note1: This parameter is not tested, guaranteed by design.  
DC Electrical Characteristics—Bank B  
VDDB = 2.5 V, Ambient Temperature -40° C to +85° C, unless otherwise noted  
Parameter  
Symbol  
VDDB  
IDDB  
Conditions  
Min.  
Typ.  
Max.  
Units  
Operating Voltage  
1.425  
2.625  
V
Quiescent Power  
Supply Current  
VDDB = 2.5 V  
No Load  
7
3
mA  
mA  
F = 40 MHz  
VDDB = 1.5 V  
No Load  
F = 40 MHz  
Short Circuit  
Current  
IOS  
VDDB = 1.5 V  
VDDB = 2.5 V  
CLK8-10  
CLK8-10  
35  
80  
mA  
mA  
MDS LV810 F  
4
Revision 101305  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICSLV810  
Buffer/Clock Driver  
Parameter  
Symbol  
Conditions  
Min.  
Typ.  
Max.  
Units  
IOH = -7 mA  
IOH = -7 mA  
IOL =12 mA  
IOL =12 mA  
Output High Voltage  
V
VDDB = 1.5 V  
VIN = VIH or VIL  
1.1  
V
OH  
VDDB = 2.5 V  
VIN = VIH or VIL  
1.8  
V
V
V
Output Low Voltage  
V
VDDB = 1.5 V  
VIN = VIH or VIL  
0.42  
0.4  
OL  
VDDB = 2.5 V  
VIN = VIH or VIL  
Input High Current  
Input Low Current  
Input High Current  
IIH  
VDDB = max  
VDDB = max  
1
µA  
µA  
µA  
IIL  
II  
-1  
20  
VDDB = max,  
VIN = VDD (max)  
Input Capacitance  
Output Capacitance  
CIN  
VIN = 0V, Note1  
5
6.0  
8.0  
pF  
pF  
COUT  
V
= 0V,  
5.5  
OUT  
Note 1  
Note1: This parameter is not tested, guaranteed by design.  
DC Electrical Characteristics—Bank C  
VDDC = 2.5 V, Ambient Temperature -40° C to +85° C, unless otherwise noted  
Parameter  
Symbol  
VDDC  
IDDC  
Conditions  
Min.  
Typ.  
Max.  
Units  
Operating Voltage  
1.425  
2.625  
V
Quiescent Power  
Supply Current  
VDDC = 2.5 V  
No Load  
3
2
mA  
mA  
F = 40 MHz  
VDDC = 1.5 V  
No Load  
F = 40 MHz  
Short Circuit Current  
Output High Voltage  
IOS  
VDDC = 1.5 V  
VDDC = 2.5 V  
CLK6-7  
CLK6-7  
35  
80  
mA  
mA  
V
IOH = -7 mA  
V
VDDC = 1.5 V  
VIN = VIH or VIL  
1.1  
1.8  
OH  
IOH = -7 mA  
IOL =12 mA  
IOL =12 mA  
VDDC = 2.5 V  
VIN = VIH or VIL  
V
V
V
Output Low Voltage  
V
VDDC = 1.5 V  
VIN = VIH or VIL  
0.42  
0.4  
OL  
VDDC = 2.5 V  
VIN = VIH or VIL  
Input High Current  
Input Low Current  
IIH  
IIL  
VDDC = max  
VDDC = max  
1
µA  
µA  
-1  
MDS LV810 F  
5
Revision 101305  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICSLV810  
Buffer/Clock Driver  
Parameter  
Symbol  
Conditions  
Min.  
Typ.  
Max.  
Units  
Input High Current  
VDDC = max,  
VIN = VDD (max)  
20  
µA  
II  
Input Capacitance  
Output Capacitance  
CIN  
VIN = 0V, Note1  
5
6.0  
8.0  
pF  
pF  
COUT  
V
= 0V,  
5.5  
OUT  
Note 1  
Note1: This parameter is not tested, guaranteed by design.  
AC Electrical Characteristics—Bank A  
VDDA = 2.5 V, Ambient Temperature -40° C to +85° C  
Parameter  
Symbol  
Conditions  
Min.  
Typ. Max. Units  
Output Skew: skew between  
outputs of same package  
tSK(0)  
CL = 3 pF,  
RL = 500Ω  
Figure 3  
-200  
-200  
1.5  
200  
200  
3.5  
ps  
ps  
ns  
ps  
Pulse Skew: skew between  
opposite transitions of same  
output (tPLH-tPHL)  
tSK(P)  
CL = 3 pF,  
RL = 500Ω  
Figure 4  
Propagation Delay  
tpLH / tpHL CL = 3 pF,  
RL = 500Ω  
2.6  
Figure 2  
Part to Part Skew  
tSK(t)  
CL = 3 pF,  
RL = 500Ω  
Figure 5  
-650  
650  
Output Rise Time  
20% to 80%  
tr(o)  
tf(o)  
CL = 3 pF,  
RL = 500Ω  
0.8  
0.8  
ns  
ns  
Output Fall Time  
80% to 20%  
CL = 3 pF,  
RL = 500Ω  
Additive Jitter  
t
All Outputs  
50  
55  
ps  
%
J
Duty Cycle  
DC  
CL = 3 pF,  
45  
Measured at VDD/2  
RL = 500Ω  
Duty Cycle, VDDA=1.8V  
Output Frequency Range  
DC  
40  
1
50  
60  
%
133  
MHz  
MDS LV810 F  
6
Revision 101305  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICSLV810  
Buffer/Clock Driver  
AC Electrical Characteristics—Bank B  
VDDB = 2.5 V, Ambient Temperature -40° C to +85° C, unless otherwise noted  
Parameter  
Symbol  
Conditions  
Min.  
Typ. Max. Units  
Output Skew: skew between  
outputs of same package  
tSK(0)  
CL = 3 pF, RL = 500Ω  
Figure 3  
-200  
200  
ps  
Pulse Skew: skew between  
opposite transitions of same  
output (tPLH-tPHL)  
tSK(P)  
CL = 3 pF, RL = 500Ω  
Figure 4  
-200  
200  
ps  
Propagation Delay  
Part to Part Skew  
tpLH / tpHL CL = 3 pF, RL = 500Ω,  
VDDB = 1.5 V  
5.5  
2.6  
ns  
ns  
ns  
ps  
Figure 2  
CL = 3 pF, RL = 500Ω,  
VDDB = 2.5 V  
Figure 2  
1.5  
-1  
3.5  
1
CL = 3 pF, RL = 500Ω  
VDDB = 1.5 V  
Figure 5  
CL = 3 pF, RL = 500Ω  
VDDB = 2.5 V  
Figure 5  
-650  
650  
Output Rise Time  
20% to 80%  
tr(o)  
tf(o)  
CL = 3 pF, RL = 500Ω  
VDDB = 1.5 V  
1.0  
0.8  
1.0  
0.8  
ns  
ns  
ns  
ns  
ps  
ps  
%
CL = 3 pF, RL = 500Ω  
VDDB = 2.5 V  
Output Fall Time  
80% to 20%  
CL = 3 pF, RL = 500Ω  
VDDB = 1.5 V  
CL = 3 pF, RL = 500Ω  
VDDB = 2.5 V  
Additive Jitter  
t
All Outputs,  
VDDB = 1.5 V  
34  
50  
55  
J
All Outputs,  
VDDB = 2.5 V  
Duty Cycle  
Measured at VDD/2  
DC  
DC  
CL = 3 pF,  
RL = 500Ω  
45  
Duty Cycle, VDDB = 1.8V  
Output Frequency Range  
40  
1
50  
60  
%
133  
MHz  
MDS LV810 F  
7
Revision 101305  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICSLV810  
Buffer/Clock Driver  
AC Electrical Characteristics—Bank C  
VDDC = 2.5 V, Ambient Temperature -40° C to +85° C, unless otherwise noted  
Parameter  
Symbol  
Conditions  
Min.  
Typ. Max. Units  
Output Skew: skew between  
outputs of same package  
tSK(0)  
CL = 3 pF, RL = 500Ω  
Figure 3  
-200  
200  
ps  
Pulse Skew: skew between  
opposite transitions of same  
output (tPLH-tPHL)  
tSK(P)  
CL = 3 pF, RL = 500Ω  
Figure 4  
-200  
200  
ps  
Propagation Delay  
tpLH / tpHL  
CL = 3 pF, RL = 500Ω,  
VDDC = 1.5 V  
Figure 2  
5.5  
2.6  
ns  
ns  
ns  
ps  
CL = 3 pF, RL = 500Ω,  
VDDC = 2.5 V  
Figure 2  
1.5  
-1  
3.5  
1
Part to Part Skew  
CL = 3 pF, RL = 500Ω  
VDDC = 1.5 V  
Figure 5  
CL = 3 pF, RL = 500Ω  
VDDC = 2.5 V  
Figure 5  
-650  
650  
Output Rise Time  
20% to 80%  
tr(o)  
tf(o)  
CL = 3 pF, RL = 500Ω  
VDDC = 1.5 V  
1.0  
0.8  
1.0  
0.8  
ns  
ns  
ns  
ns  
ps  
ps  
%
CL = 3 pF, RL = 500Ω  
VDDC = 2.5 V  
Output Fall Time  
80% to 20%  
CL = 3 pF, RL = 500Ω  
VDDC = 1.5 V  
CL = 3 pF, RL = 500Ω  
VDDC = 2.5 V  
Additive Jitter  
t
All Outputs,  
VDDC = 1.5 V  
34  
50  
55  
J
All Outputs,  
VDDC = 2.5 V  
Duty Cycle  
Measured at VDD/2  
DC  
DC  
CL = 3 pF,  
RL = 500Ω  
45  
Duty Cycle, VDDC=1.8V  
Output Frequency Range  
40  
1
50  
60  
%
133  
MHz  
MDS LV810 F  
8
Revision 101305  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICSLV810  
Buffer/Clock Driver  
Thermal Characteristics for 20QSOP  
Parameter  
Symbol  
Conditions  
Min.  
Min.  
Typ. Max. Units  
Thermal Resistance Junction to  
Ambient  
θ
θ
θ
Still air  
135  
93  
°C/W  
°C/W  
°C/W  
°C/W  
JA  
JA  
JA  
JC  
1 m/s air flow  
3 m/s air flow  
78  
Thermal Resistance Junction to Case  
θ
60  
Thermal Characteristics for 20SOIC  
Parameter  
Symbol  
Conditions  
Still air  
Typ. Max. Units  
Thermal Resistance Junction to  
Ambient  
θ
θ
θ
83  
71  
58  
46  
°C/W  
°C/W  
°C/W  
°C/W  
JA  
JA  
JA  
JC  
1 m/s air flow  
3 m/s air flow  
Thermal Resistance Junction to Case  
θ
From Output  
Under Test  
500 ohm  
CL=3pF  
Figure 1. Load Circuit  
VIH  
VIL  
Input  
Input  
tPLH  
tPHL  
tPLH1  
tPHL1  
VOH  
VOL  
VOH  
VOL  
Output  
Output 1  
Figure 2. Propagation Delay  
Figure 4. Pulse Skew ( tSK(p)=|tpLH – tpH| )  
Input  
Input  
tPLH1  
tPHL1  
tPLH1  
tPHL1  
VOH  
VOH  
Package  
1 Output  
Output 1  
tSK  
tSK  
VOL  
VOH  
VOL  
VOH  
tSK  
tSK  
Package  
2 Output  
Output 2  
VOL  
VOL  
tPLH2  
( tSK(O)=|tPLH2-tPHL2| or |tPLH1-tPHL1| )  
Figure 5. Part-to-Part Skew  
tPHL2  
tPLH2  
( tSK(O)=|tPLH2-tPHL2| or |tPLH1-tPHL1| )  
Figure 3. Output Skew  
tPHL2  
MDS LV810 F  
9
Revision 101305  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICSLV810  
Buffer/Clock Driver  
Package Outline and Package Dimensions (20-pin QSOP, 150 Mil. Body)  
Package dimensions are kept current with JEDEC Publication No. 95  
Millimeters  
Inches*  
Min  
20  
Symbol  
A
Min  
Max  
1.75  
0.25  
1.50  
0.30  
0.25  
8.75  
6.20  
4.00  
Max  
.069  
.010  
.059  
0.012  
.010  
.344  
.244  
.157  
1.35  
0.10  
--  
.053  
.0040  
--  
A1  
A2  
b
C
D
E
E1  
e
E1  
E
INDEX  
AREA  
0.20  
0.18  
8.55  
5.80  
3.80  
0.008  
.007  
.337  
.228  
.150  
1
2
0.635 Basic  
0.025 Basic  
D
L
α
0.40  
0°  
1.27  
8°  
.016  
.050  
0°  
8°  
*For reference only. Controlling dimensions in mm.  
A
2
A
A
1
c
- C -  
e
SEATING  
PLANE  
b
L
.10 (.004)  
C
MDS LV810 F  
10  
Revision 101305  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICSLV810  
Buffer/Clock Driver  
Package Outline and Package Dimensions (20-pin SSOP, 209 Mil. Body)  
Package dimensions are kept current with JEDEC Publication No. 95  
20  
Millimeters  
Inches*  
Symbol  
Min  
Max  
2.00  
Min  
Max  
.079  
A
A1  
A2  
b
0.05  
1.65  
0.22  
0.09  
6.90  
7.40  
5.00  
.002  
.065  
0.009  
.0035  
.271  
.291  
.197  
E1  
E
1.85  
0.38  
0.25  
7.50  
8.20  
5.60  
.073  
0.015  
.010  
.295  
.323  
.220  
INDEX  
AREA  
c
D
E
E1  
e
1
2
0.65 Basic  
0.0256 Basic  
D
L
0.55  
0.95  
.022  
.037  
α
0°  
8°  
0°  
8°  
*For reference only. Controlling dimensions in mm.  
A
2
A
A
1
c
- C -  
e
SEATING  
PLANE  
b
L
.10 (.004)  
C
Ordering Information  
Part / Order Number  
ICSLV810RI  
Marking  
ICSLV810RI  
Shipping Packaging  
Tubes  
Package  
Temperature  
-40 to +85° C  
-40 to +85° C  
-40 to +85° C  
-40 to +85° C  
-40 to +85° C  
-40 to +85° C  
-40 to +85° C  
-40 to +85° C  
20-pin QSOP  
20-pin QSOP  
20-pin SSOP  
20-pin SSOP  
20-pin QSOP  
20-pin QSOP  
20-pin SSOP  
20-pin SSOP  
ICSLV810RIT  
ICSLV810RI  
ICSLV810FI  
ICSLV810FI  
LV810RILF  
LV810RILF  
LV810FILF  
LV810FILF  
Tape and Reel  
Tubes  
ICSLV810FI  
ICSLV810FIT  
Tape and Reel  
Tubes  
ICSLV810RILF  
ICSLV810RILFT  
ICSLV810FILF  
ICSLV810FILFT  
Tape and Reel  
Tubes  
Tape and Reel  
Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.  
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS) assumes no  
responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other  
circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as  
those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without  
additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant  
any ICS product for use in life support devices or critical medical instruments.  
MDS LV810 F  
11  
Revision 101305  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICSLV810  
Buffer/Clock Driver  
Revision History  
Rev. Originator  
Date  
Description of Change  
A
B
P.Griffith  
P.Griffith  
03/25/05 New device/datasheet.  
05/02/05 Released from Preliminary to final; changed Short Circuit Current parameter in 2.5 V DC  
Char table to 80 mA; changed Short Circuit Current parameter in 1.5 V DC Char table to  
35 mA  
C
P.Griffith  
05/12/05 Added bullet in “Features” for operating voltage of 2.5 V on Bank A and specified that  
operating voltages of 1.5 and 2.5 V are on Banks B and C; changed block diagram input  
and pin 1 from IN to CLKIN; removed +1.5 V spec from pin 4 and pin 8 descriptions; added  
“VDDA + 1.2 V” to “All Inputs and Outputs” section of Absolute Maximum Ratings; added  
min and max values for Banks A, B, and C “Power Supply Voltage” in Recommended  
Operating Conditions; expanded DC Electrical Char tables in to include a separate table  
for Banks A, B, and C; expanded AC Electrical Char tables in to include a separate table  
for Banks A, B, and C;  
D
E
P.Griffith  
06/21/05 Added 209 mil 20-pin SSOP package and ordering info.  
K. Beckmeyer 07/27/05 Specified operating voltage on Bank A from 1.5V to 2.5V; Added figures 4 and 5 on page  
10 to explain Pulse Skew and Part-to-Part Skew; Changed Output Frequency Max  
Specification to 133MHz in AC Electrical Char tables for Banks A, B, and C; Added Duty  
Cycle Spec for VDD = 1.5V in AC Electrical Char tables for Banks A, B, C; Changed CLK  
conditions in DC Electrical Char tables on Banks B and C; removed SOIC package.  
F
K. Beckmeyer 10/13/05 Added “LF” packaging and ordering info to both “R” and”F” packages.  
MDS LV810 F  
12  
Revision 101305  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  

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