ICSSSTV16859YG-T [ICSI]

DDR 13-Bit to 26-Bit Registered Buffer; DDR 13位至26位寄存缓冲器
ICSSSTV16859YG-T
型号: ICSSSTV16859YG-T
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

DDR 13-Bit to 26-Bit Registered Buffer
DDR 13位至26位寄存缓冲器

触发器 逻辑集成电路 电视 光电二极管 双倍数据速率
文件: 总8页 (文件大小:94K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Integrated  
Circuit  
Systems,Inc.  
ICSSSTV16859  
DDR 13-Bit to 26-Bit Registered Buffer  
Recommended Applications:  
• DDR Memory Modules  
Pin Configurations  
• Provides complete DDR DIMM logic solution with  
Q13A  
1
2
3
4
5
6
7
8
9
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
VDDQ  
GND  
D13  
Q12A  
Q11A  
Q10A  
Q9A  
VDDQ  
GND  
Q8A  
Q7A  
Q6A  
Q5A  
Q4A  
Q3A  
Q2A  
GND  
Q1A  
Q13B  
VDDQ  
Q12B  
Q11B  
Q10B  
Q9B  
ICS93V857 or ICS95V857  
• SSTL_2 compatible data registers  
D12  
VDD  
VDDQ  
GND  
D11  
D10  
D9  
GND  
D8  
D7  
RESET#  
GND  
CLK#  
CLK  
VDDQ  
VDD  
VREF  
D6  
Product Features:  
• Differential clock signals  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
• Meets SSTL_2 signal data  
• Supports SSTL_2 class II specifications on outputs  
• Low-voltage operation  
- VDD = 2.3V to 2.7V  
• Available in 64 pin TSSOP and 56 pin VFQFN (MLF2)  
packages  
Truth Table1  
GND  
D5  
D4  
Q8B  
Q7B  
Q6B  
GND  
VDDQ  
Q5B  
Q4B  
Q3B  
Inputs  
CLK  
X or  
Q Outputs  
Q
D3  
RESET#  
CLK#  
D
GND  
VDDQ  
VDD  
D2  
D1  
GND  
VDDQ  
X or  
X or  
L
L
Floating Floating Floating  
Q2B  
Q1B  
H
H
H
-
-
¯
¯
H
L
H
L
(2)  
L or H  
L or H  
X
Q0  
64-Pin TSSOP  
Notes:  
6.10 mm. Body, 0.50 mm. pitch  
1.  
H = "High" Signal Level  
L = "Low" Signal Level  
= Transition "Low"-to-"High"  
= Transition "High"-to-"Low"  
X = Don't Care  
56  
43  
1
Q7A  
Q6A  
Q5A  
42  
D10  
D9  
D8  
2.  
Output level before the indicated steady state  
input conditions were established.  
Q4A  
D7  
Q3A  
Q2A  
Q1A  
Q13B  
VDDQ  
Q12B  
Q11B  
Q10B  
Q9B  
RESET#  
GND  
CLK#  
CLK  
VDDQ  
VDD  
VREF  
D6  
Block Diagram  
ICSSSTV16859  
CLK  
CLK#  
RESET#  
R
Q1A  
Q1B  
CLK  
D1  
VREF  
D5  
29  
D4  
D1  
14  
Q8B  
15  
28  
To 12 Other Channels  
56 pin VFQFN (MLF2)  
0003G—05/21/02  
ICSSSTV16859  
General Description  
The 13-bit-to-26-bit ICSSSTV16859 is a universal bus driver designed for 2.3V to 2.7V VDD operation and  
SSTL_2 I/O levels, except for the LVCMOS RESET# input.  
Data flow from D to Q is controlled by the differential clock (CLK/CLK#) and a control signal (RESET#). The  
positive edge of CLK is used to trigger the data flow whereas CLK# is used to maintain sufficient noise margins  
where as RESET#, an LVCMOS asynchronous signal, is intended for use at the time of power-up only.  
ICSSSTV16859 supports low-power standby operation. A logic level “Low” at RESET# assures that all internal  
registers and outputs (Q) are reset to the logic “Low” state, and all input receivers, data (D) and clock (CLK/  
CLK#) are switched off. Please note that RESET# must always be supported with LVCMOS levels at a valid  
logic state because VREF may not be stable during power-up.  
To ensure that outputs are at a defined logic state before a stable clock has been supplied, RESET# must be  
held at a logic “low” level during power up.  
In the DDR DIMM application, RESET# is specified to be completely asynchronous with respect to CLK and  
CLK#.Therefore, no timing relationship can be guaranteed between the two signals.When entering a low-power  
standby state, the register will be cleared and the outputs will be driven to a logic “Low” level quickly relative  
to the time to disable the differential input receivers. This ensures there are no glitches on the output. However,  
when coming out of low-power standby state, the register will become active quickly relative to the time to  
enable the differential input receivers. When the data inputs are at a logic level “low” and the clock is stable  
during the “Low”-to-”High” transition of RESET# until the input receivers are fully enabled, the design ensures  
that the outputs will remain at a logic “Low” level.  
Pin Configuration (64-Pin TSSOP)  
PIN NUMBER  
PIN NAME  
TYPE  
DESCRIPTION  
1-5, 8-14, 16, 17, 19-25, 28-32  
Q (13:1)  
OUTPUT  
Data output  
Ground  
7, 15, 26, 34, 39, 43, 50, 54,  
58, 63  
GND  
VDDQ  
D (13:1)  
PWR  
PWR  
6, 18, 27, 33, 38, 47, 59, 64  
Output supply voltage, 2.5V nominal  
Data input  
35, 36, 40-42, 44, 52, 53, 55-  
57, 61, 62  
INPUT  
48  
49  
CLK  
CLK#  
INPUT  
INPUT  
PWR  
Positive master clock input  
Negative master clock input  
Core supply voltage, 2.5V nominal  
Reset (active low)  
37, 46, 60  
51  
VDD  
RESET#  
VREF  
INPUT  
INPUT  
45  
Input reference voltage, 2.5V nominal  
Pin Configuration (56-Pin MLF2)  
PIN NUMBER  
PIN NAME  
Q (13:1)  
GND  
TYPE  
OUTPUT  
PWR  
DESCRIPTION  
Data output  
1-8, 10-16, 18-22, 50-54, 56  
37, 48  
Ground  
9, 17, 23, 27, 34, 44, 49, 55  
VDDQ  
PWR  
Output supply voltage, 2.5V nominal  
Data input  
24, 25, 28-31, 39-43, 46, 47  
D (13:1)  
CLK  
INPUT  
INPUT  
INPUT  
PWR  
35  
Positive master clock input  
Negative master clock input  
Core supply voltage, 2.5V nominal  
Reset (active low)  
36  
CLK#  
26, 33, 45  
VDD  
38  
32  
-
RESET#  
VREF  
INPUT  
INPUT  
PWR  
Input reference voltage, 2.5V nominal  
Ground (MLF2 package only)  
Center PAD  
0003G—05/21/02  
2
ICSSSTV16859  
Absolute Maximum Ratings  
Notes:  
Storage Temperature . . . . . . . . . . . . . . . . . . . . –65°C to +150°C  
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 3.6V  
Input Voltage1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to VDD +0.5  
Output Voltage1,2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to VDDQ +0.5  
Input Clamp Current . . . . . . . . . . . . . . . . . . . . ±50 mA  
Output Clamp Current . . . . . . . . . . . . . . . . . . . ±50 mA  
Continuous Output Current. . . . . . . . . . . . . . . ±50 mA  
VDD, VDDQ or GND Current/Pin . . . . . . . . . . . ±100 mA  
1. The input and output negative voltage  
ratings may be excluded if the input  
andoutputclampratingsareobserved.  
2. This current will flow only when the  
output is in the high state level  
V0 >VDDQ  
.
3. The package thermal impedance is  
calculated in accordance with  
JESD 51.  
Package Thermal Impedance3 . . . . . . . . . . . . . . . 55°C/W  
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These  
ratings are stress specifications only and functional operation of the device at these or any other conditions above those  
listed in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions  
for extended periods may affect product reliability.  
Recommended Operating Conditions  
DESCRIPTION  
PARAMETER  
MIN  
2.3  
TYP  
2.5  
MAX  
2.7  
UNITS  
Supply Voltage  
VDD  
I/O Supply Voltage  
VDDQ  
VREF  
2.3  
2.5  
2.7  
Reference Voltage  
1.15  
1.25  
VREF  
1.35  
Termination Voltage  
Input Voltage  
VTT  
VREF - 0.04  
0
VREF + 0.04  
VDDQ  
VI  
VIH (DC)  
VIH (AC)  
VIL (DC)  
VIL (DC)  
VIH  
DC Input High Voltage  
AC Input High Voltage  
DC Input Low Voltage  
AC Input Low Voltage  
Input High Voltage Level  
Input Low Voltage Level  
Common mode Input Range  
Differential Input Voltage  
VREF + 0.15  
VREF + 0.31  
Data Inputs  
V
VREF - 0.15  
VREF - 0.31  
1.7  
RESET#  
VIL  
0.7  
VICR  
0.97  
0.36  
1.53  
CLK, CLK#  
VID  
Cross Point Voltage of Differential Clock  
Pair  
VIX  
(VDDQ/2) - 0.2  
(VDDQ/2) + 0.2  
High-Level Output Current  
Low-Level Output Current  
Operating Free-Air Temperature  
IOH  
IOL  
TA  
-20  
20  
70  
mA  
°C  
0
1Guarenteed by design, not 100% tested in production.  
0003G—05/21/02  
3
ICSSSTV16859  
Electrical Characteristics - DC  
TA = 0 - 70º C; VDD = 2.5 +/-0.2V, VDDQ=2.5 +/-0.2V; (unless otherwise stated)  
CONDITIONS  
SYMBOL  
VIK  
PARAMETERS  
VDDQ  
2.3V  
MIN  
TYP MAX  
-1.2  
UNITS  
V
II = -18mA  
OH = -100µA  
VDDQ  
0.2  
-
I
2.3V-2.7V  
VOH  
IOH = -16mA  
2.3V  
2.3V-2.7V  
2.3V  
1.95  
IOL = 100µA  
0.2  
0.35  
±5  
VOL  
II  
IOL = 16mA  
All Inputs  
VI = VDD or GND  
RESET# = GND  
VI = VIH(AC) or VIL(AC)  
RESET# = VDD  
2.7V  
µA  
µA  
Standby (Static)  
0.01  
IDD  
,
Operating (Static)  
50  
70  
mA  
RESET# = VDD  
,
Dynamic operating  
(clock only)  
µ/clock  
MHz  
VI = VIH(AC) or VIL(AC)  
,
CLK and CLK# switching  
50% duty cycle.  
IO = 0  
2.7V  
RESET# = VDD  
,
IDDD  
VI = VIH(AC) or VIL (AC)  
,
CLK and CLK# switching  
50% duty cycle. One data  
input switching at half  
clock frequency, 50%  
duty cycle  
Dynamic Operating  
(per each data input)  
µA/ clock  
MHz/data  
30  
rOH  
rOL  
Output High  
Output Low  
IOH = -20mA  
2.3V-2.7V  
2.3V-2.7V  
7
7
13.5  
13  
20  
20  
IOL = 20mA  
[rOH - rOL] each  
separate bit  
Data Inputs  
rO(D)  
IO = 20mA, TA = 25° C  
2.5V  
2.5V  
4
VI = VREF ±350mV  
VICR = 1.25V, VI(PP) = 360mV  
2.5  
2.5  
3.5  
3.5  
Ci  
pF  
CLK and CLK#  
Notes:  
1 - Guaranteed by design, not 100% tested in production.  
0003G—05/21/02  
4
ICSSSTV16859  
Timing Requirements1  
(over recommended operating free-air temperature range, unless otherwise noted)  
V
DDQ = 2.5V ± 0.2V  
SYMBOL  
PARAMETERS  
Clock frequency  
UNITS  
MIN  
MAX  
200  
fclock  
tPD  
tRST  
tSL  
MHz  
ns  
ns  
TSSOP  
VFQFN (MLF2)  
1.7  
1.6  
2.7  
2.6  
5
Clock to output time  
Reset to output time  
Output slew rate  
Setup time, fast slew rate 2 & 4  
Setup time, slow slew rate 3 & 4  
Hold time, fast slew rate 2 & 4  
Hold time, slow slew rate 3 & 4  
ns  
1
4
V/ns  
ns  
0.60  
0.80  
0.40  
0.50  
↑ ↓  
Data before CLK , CLK#  
tS  
ns  
ns  
↑ ↓  
Data after CLK , CLK#  
Th  
ns  
1 - Guaranteed by design, not 100% tested in production.  
2 - For data signal input slew rate of 1V/ns.  
Notes:  
3 - For data signal input slew rate of 0.5V/ns and < 1V/ns.  
4 - CLK, CLK# signals input slew rate of 1V/ns.  
Switching Characteristics  
(over recommended operating free-air temperature range, unless otherwise noted) (see Figure 1)  
From  
(Input)  
To  
(Output)  
VDD = 2.5V ±0.2V  
SYMBOL  
fmax  
UNITS  
MIN  
TYP  
MAX  
200  
1.7  
1.6  
MHz  
ns  
ns  
CLK, CLK# (TSSOP)  
CLK, CLK# (VFQFN[MLF2])  
RESET#  
Q
Q
Q
2.3  
2.1  
2.7  
2.6  
5
tPD  
tphl  
ns  
0003G—05/21/02  
5
ICSSSTV16859  
VTT  
RL 50W  
=
From Output  
Under Test  
Test Point  
CL = 30 pF  
(see Note 1)  
Load Circuit  
LVCMOS  
RESET#  
Input  
VDDQ  
0 V  
VDDQ/2  
VDDQ/2  
VI(pp)  
Timing  
Input  
VICR  
VICR  
tinact  
tact  
IDDH  
tPHL  
tPHL  
IDD  
90%  
(see note 2)  
10%  
VOH  
VOL  
IDDL  
VTT  
VTT  
Voltage and Current Waveforms  
Inputs Active and Inactive Times  
Output  
Voltage Waveforms - Propagation Delay Times  
tw  
VIH  
VIL  
Input  
VREF  
VREF  
Voltage Waveforms - Pulse Duration  
LVCMOS  
RESET#  
Input  
VIH  
VIL  
VI(pp)  
V
DD/2  
Timing  
Input  
VICR  
tPHL  
VOH  
VOL  
Output  
th  
tS  
VTT  
Voltage Waveforms - Propagation Delay Times  
VIH  
VIL  
VREF  
Input  
VREF  
Voltage Waveforms - Setup and Hold Times  
Figure 1 - Parameter Measurement Information (V  
= 2.5V ±0.2V)  
DDQ  
Notes: 1. CL incluces probe and jig capacitance.  
2. IDD tested with clock and data inputs held at VDDQ or GND, and IO = 0 mA.  
3. All input pulses are supplied by generators having the following characteristics: PRR @10 MHz,  
Zo=50W, input slew rate = 1 V/ns ±20% (unless otherwise specified).  
4. The outputs are measured one at a time with one transition per measurement.  
5. VTT = VREF = VDDQ/2  
6. VIH = VREF + 310mV (AC voltage levels) for differential inputs. VIH = VDDQ for LVCMOS input.  
7. VIL = VREF - 310mV (AC voltage levels) for differential inputs. VIL = GND for LVCMOS input.  
8. tPLH and tPHL are the same as tpd  
0003G—05/21/02  
6
ICSSSTV16859  
c
N
In Millimeters  
In Inches  
L
SYMBOL  
COMMON DIMENSIONS COMMON DIMENSIONS  
MIN  
--  
0.05  
0.80  
0.17  
0.09  
MAX  
1.20  
0.15  
1.05  
0.27  
0.20  
MIN  
--  
.002  
.032  
.007  
.0035  
MAX  
.047  
.006  
.041  
.011  
.008  
E1  
E
A
A1  
A2  
b
INDEX  
AREA  
c
1
2
D
E
SEE VARIATIONS  
8.10 BASIC  
SEE VARIATIONS  
0.319 BASIC  
a
D
E1  
e
6.00  
6.20  
.236  
0.020 BASIC  
.244  
0.50 BASIC  
L
0.45  
0.75  
.018  
.030  
N
SEE VARIATIONS  
SEE VARIATIONS  
A
A2  
0°  
--  
8°  
0.10  
0°  
--  
8°  
.004  
α
aaa  
A1  
- CC --  
VARIATIONS  
D mm.  
D (inch)  
e
SEATING  
PLANE  
N
b
MIN  
16.90  
MAX  
17.10  
MIN  
.665  
MAX  
.673  
64  
aaa  
C
Reference Doc.: JEDEC Publication 95, M O-153  
10-0039  
6.10 mm. Body, 0.50 mm. pitch TSSOP  
(0.020 mil)  
(240 mil)  
Ordering Information  
ICSSSTV16859yG-T  
Example:  
ICS XXXX y G - PPP - T  
Designation for tape and reel packaging  
Pattern Number (2 or 3 digit number for parts with ROM code  
patterns)  
Package Type  
G=TSSOP  
Revision Designator (will not correlate with datasheet revision)  
DeviceType (consists of 3 or 4 digit numbers)  
Prefix  
ICS, AV = Standard Device  
0003G—05/21/02  
7
ICSSSTV16859  
Symbol  
Common Dimensions  
A
A1  
A2  
A3  
D
-
0.00  
-
0.85  
1.00  
0.05  
0.80  
0.01  
0.65  
0.20 BSC  
8.00 BSC  
7.75 BSC  
8.00 BSC  
7.75 BSC  
D1  
E
56 pin MLF2  
E1  
Θ
12  
P
0.24  
0.13  
0.42  
0.17  
0.60  
0.23  
R
Pitch Varation D  
e
N
0.50 BSC  
56  
Nd  
Ne  
L
14  
14  
0.30  
0.18  
0.00  
4.35  
5.05  
0.40  
0.23  
0.20  
4.50  
5.20  
0.50  
0.30  
0.45  
4.65  
5.35  
Ordering Information  
b
Q
ICSSSTV16859yK  
D2  
E2  
Example:  
ICS XXXX y K - PPP - T  
Designation for tape and reel packaging  
Pattern Number (2 or 3 digit number for parts with ROM code  
patterns)  
Package Type  
Revision Designator (will not correlate with datasheet revision)  
Device Type (consists of 3 or 4 digit numbers)  
Prefix  
ICS, AV = Standard Device  
0003G—05/21/02  
8

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