IS41C16256-60K [ICSI]

256K x 16 (4-MBIT) DYNAMIC RAM WITH EDO PAGE MODE; 256K ×16 ( 4兆位)动态RAM与EDO页模式
IS41C16256-60K
型号: IS41C16256-60K
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

256K x 16 (4-MBIT) DYNAMIC RAM WITH EDO PAGE MODE
256K ×16 ( 4兆位)动态RAM与EDO页模式

文件: 总20页 (文件大小:211K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IS41C16256  
IS41LV16256  
256K x 16 (4-MBIT) DYNAMIC RAM  
WITH EDO PAGE MODE  
DESCRIPTION  
FEATURES  
The ICSI IS41C16256 and IS41LV16256 is a 262,144 x 16-  
bit high-performance CMOS Dynamic Random Access Memo-  
ries. The IS41C16256 offer an accelerated cycle access  
called EDO Page Mode. EDO Page Mode allows 512 random  
accesses within a single row with access cycle time as short  
as 10 ns per 16-bit word. The Byte Write control, of upper and  
lower byte, makes the IS41C16256 ideal for use in  
16-, 32-bit wide data bus systems.  
• Extended Data-Out (EDO) Page Mode access cycle  
• TTL compatible inputs and outputs; tristate I/O  
• Refresh Interval: 512 cycles /8 ms  
• Refresh Mode: RAS-Only, CAS-before-RAS (CBR),  
Hidden  
• Single power supply:  
5V ± 10% (IS41C16256)  
3.3V ± 10% (IS41LV16256)  
• Byte Write and Byte Read operation via two CAS  
• Industrial Temperature Range -40oC to 85oC  
These features make the IS41C16256and IS41LV16256 ideally  
suited for high-bandwidth graphics, digital signal processing,  
high-performance computing systems, and peripheral  
applications.  
The IS41C16256 is packaged in a 40-pin 400mil SOJ and  
400mil TSOP-2.  
KEY TIMING PARAMETERS  
Parameter  
-25(5V)  
-35  
35  
10  
18  
12  
60  
-50  
50  
14  
25  
20  
90  
-60  
60  
Unit  
ns  
Max. RAS Access Time (tRAC)  
Max. CAS Access Time (tCAC)  
Max. Column Address Access Time (tAA)  
Min. EDO Page Mode Cycle Time (tPC)  
Min. Read/Write Cycle Time (tRC)  
25  
10  
12  
10  
45  
15  
ns  
30  
ns  
25  
ns  
110  
ns  
PIN CONFIGURATIONS  
40-Pin TSOP-2  
40-Pin SOJ  
PIN DESCRIPTIONS  
VCC  
I/O0  
I/O1  
I/O2  
I/O3  
VCC  
I/O4  
I/O5  
I/O6  
I/O7  
1
2
3
4
5
6
7
8
9
10  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
GND  
I/O15  
I/O14  
I/O13  
I/O12  
GND  
I/O11  
I/O10  
I/O9  
VCC  
I/O0  
I/O1  
I/O2  
I/O3  
VCC  
I/O4  
I/O5  
I/O6  
I/O7  
NC  
1
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
GND  
A0-A8  
I/O0-15  
WE  
Address Inputs  
2
I/O15  
I/O14  
I/O13  
I/O12  
GND  
I/O11  
I/O10  
I/O9  
I/O8  
NC  
Data Inputs/Outputs  
Write Enable  
3
4
5
OE  
Output Enable  
6
7
RAS  
UCAS  
LCAS  
Vcc  
Row Address Strobe  
Upper Column Address Strobe  
Lower Column Address Strobe  
Power  
8
9
I/O8  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
NC  
NC  
WE  
RAS  
NC  
A0  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
NC  
NC  
LCAS  
UCAS  
OE  
LCAS  
UCAS  
OE  
WE  
RAS  
NC  
GND  
NC  
Ground  
A8  
No Connection  
A8  
A0  
A7  
A7  
A1  
A6  
A1  
A6  
A2  
A5  
A2  
A5  
A3  
A4  
A3  
A4  
VCC  
GND  
VCC  
GND  
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors  
which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc.  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
1
IS41C16256  
IS41LV16256  
FUNCTIONAL BLOCK DIAGRAM  
OE  
WE  
WE  
CONTROL  
LOGICS  
OE  
CONTROL  
LOGIC  
CAS  
CLOCK  
GENERATOR  
LCAS  
UCAS  
CAS  
WE  
DATA I/O BUS  
RAS  
CLOCK  
RAS  
GENERATOR  
COLUMN DECODERS  
SENSE AMPLIFIERS  
REFRESH  
COUNTER  
I/O0-I/O15  
MEMORY ARRAY  
262,144 x 16  
ADDRESS  
BUFFERS  
A0-A8  
2
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
IS41C16256  
IS41LV16256  
TRUTH TABLE  
Function  
RAS  
LCAS UCAS  
WE  
X
OE  
X
Address tR/tC I/O  
Standby  
H
L
L
H
L
L
H
X
High-Z  
Read: Word  
Read: Lower Byte  
L
H
L
ROW/COL  
ROW/COL  
DOUT  
H
H
L
Lower Byte, DOUT  
Upper Byte, High-Z  
Read: Upper Byte  
L
H
L
H
L
ROW/COL  
Lower Byte, High-Z  
Upper Byte, DOUT  
Write: Word (Early Write)  
L
L
L
L
L
L
L
X
X
ROW/COL  
ROW/COL  
DIN  
Write: Lower Byte (Early Write)  
H
Lower Byte, DIN  
Upper Byte, High-Z  
Write: Upper Byte (Early Write)  
Read-Write(1,2)  
EDO Page-Mode Read(2) 1st Cycle:  
2nd Cycle:  
Any Cycle:  
EDO Page-Mode Write(1) 1st Cycle:  
2nd Cycle:  
L
L
H
L
L
L
L
X
ROW/COL  
ROW/COL  
Lower Byte, High-Z  
Upper Byte, DIN  
H
L
L
H
DOUT, DIN  
L
L
L
H
H
L
L
L
H
H
H
L
L
L
H
H
H
H
L
L
L
ROW/COL  
NA/COL  
NA/NA  
DOUT  
DOUT  
DOUT  
L
L
H
H
L
L
H
H
L
L
L
L
X
X
ROW/COL  
NA/COL  
DIN  
DIN  
EDO Page-Mode  
Read-Write(1,2)  
Hidden Refresh(2)  
1st Cycle:  
2nd Cycle:  
L
L
H
H
L
L
H
L
L
H
L
L
L
H
H
ROW/COL  
NA/COL  
DOUT, DIN  
DOUT, DIN  
H  
H→  
L→  
Read L  
Write L  
H
H
L
L
L
L
L
L
H
L
L
X
ROW/COL  
ROW/COL  
DOUT  
DOUT  
RAS-Only Refresh  
L
H
L
H
L
X
X
X
X
ROW/NA  
X
High-Z  
High-Z  
CBR Refresh(3)  
HL  
Notes:  
1. These WRITE cycles may also be BYTE WRITE cycles (either LCAS or UCAS active).  
2. These READ cycles may also be BYTE READ cycles (either LCAS or UCAS active).  
3. At least one of the two CAS signals must be active (LCAS or UCAS).  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
3
IS41C16256  
IS41LV16256  
FunctionalDescription  
Refresh Cycle  
The IS41C16256 and IS41LV16256 is a CMOS DRAM  
optimized for high-speed bandwidth, low power applica-  
tions. During READ or WRITE cycles, each bit is uniquely  
addressed through the 18 address bits. These are en-  
tered 9 bits (A0-A8) at a time. The row address is latched  
by the Row Address Strobe (RAS). The column address  
is latched by the Column Address Strobe (CAS). RAS is  
used to latch the first nine bits and CAS is used the latter  
nine bits.  
To retain data, 512 refresh cycles are required in each  
8 ms period. There are two ways to refresh the memory.  
1. By clocking each of the 512 row addresses (A0 through  
A8) with RAS at least once every 8 ms. Any read, write,  
read-modify-write or RAS-only cycle refreshes the  
addressed row.  
2. Using a CAS-before-RAS refresh cycle. CAS-before-  
RAS refresh is activated by the falling edge of RAS,  
while holding CAS LOW. In CAS-before-RAS refresh  
cycle, an internal 9-bit counter provides the row ad-  
dresses and the external address inputs are ignored.  
The IS41C16256 and IS41LV16256 has two CAS controls,  
LCAS and UCAS. The LCAS and UCAS inputs internally  
generates a CAS signal functioning in an identical man-  
ner to the single CAS input on the other 256K x 16  
DRAMs. The key difference is that each CAS controls its  
corresponding I/O tristate logic (in conjunction with OE  
and WE and RAS). LCAS controls I/O0 through I/O7 and  
UCAS controls I/O8 through I/O15.  
The IS41C16256 and IS41LV16256 CAS function is  
determined by the first CAS (LCAS or UCAS) transitioning  
LOW and the last transitioning back HIGH. The two CAS  
controls give the IS41C16256 both BYTE READ and  
BYTE WRITE cycle capabilities.  
CAS-before-RAS is a refresh-only mode and no data  
access or device selection is allowed. Thus, the output  
remains in the High-Z state during the cycle.  
Extended Data Out Page Mode  
EDO page mode operation permits all 512 columns within  
a selected row to be randomly accessed at a high data  
rate.  
In EDO page mode read cycle, the data-out is held to the  
next CAS cycle’s falling edge, instead of the rising edge.  
For this reason, the valid data output time in EDO page  
mode is extended compared with the fast page mode. In  
the fast page mode, the valid data output time becomes  
shorter as the CAS cycle time becomes shorter. Therefore,  
in EDO page mode, the timing margin in read cycle is  
larger than that of the fast page mode even if the CAS cycle  
time becomes shorter.  
Memory Cycle  
A memory cycle is initiated by bring RAS LOW and it is  
terminated by returning both RAS and CAS HIGH. To  
ensures proper device operation and data integrity any  
memory cycle, once initiated, must not be ended or  
aborted before the minimum tRAS time has expired. A new  
cycle must not be initiated until the minimum precharge  
time tRP, tCP has elapsed.  
In EDO page mode, due to the extended data function, the  
CAS cycle time can be shorter than in the fast page mode  
if the timing margin is the same.  
The EDO page mode allows both read and write opera-  
tions during one RAS cycle, but the performance is  
equivalent to that of the fast page mode in that case.  
Read Cycle  
A read cycle is initiated by the falling edge of CAS or OE,  
whichever occurs last, while holding WE HIGH. The  
column address must be held for a minimum time specified  
by tAR. Data Out becomes valid only when tRAC, tAA, tCAC  
and tOEA are all satisfied. As a result, the access time is  
dependent on the timing relationships between these  
parameters.  
Power-On  
After application of the VCC supply, an initial pause of  
200 µs is required followed by a minimum of eight initial-  
ization cycles (any combination of cycles containing a  
RAS signal).  
Write Cycle  
During power-on, it is recommended that RAS track with  
VCC or be held at a valid VIH to avoid current surges.  
A write cycle is initiated by the falling edge of CAS and  
WE, whichever occurs last. The input data must be valid  
at or before the falling edge of CAS or WE, whichever  
occurs first.  
4
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
IS41C16256  
IS41LV16256  
ABSOLUTE MAXIMUM RATINGS(1)  
Symbol Parameters  
Rating  
Unit  
VT  
Voltage on Any Pin Relative to GND  
5V  
3.3V  
–1.0 to +7.0  
–0.5 to +4.6  
V
VCC  
Supply Voltage  
5V  
3.3V  
–1.0 to +7.0  
–0.5 to +4.6  
V
IOUT  
PD  
Output Current  
50  
1
mA  
W
Power Dissipation  
TA  
Commercial Operation Temperature  
Industrial Operationg Temperature  
0 to +70  
–40 to +85  
°C  
°C  
TSTG  
Storage Temperature  
–55 to +125  
°C  
Note:  
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent  
damage to the device. This is a stress rating only and functional operation of the device at these  
or any other conditions above those indicated in the operational sections of this specification is  
not implied. Exposure to absolute maximum rating conditions for extended periods may affect  
reliability.  
RECOMMENDED OPERATING CONDITIONS (Voltages are referenced to GND.)  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
Unit  
VCC  
Supply Voltage  
5V  
3.3V  
4.5  
3.0  
5.0  
3.3  
5.5  
3.6  
V
VIH  
VIL  
TA  
Input High Voltage  
Input Low Voltage  
5V  
3.3V  
2.4  
2.0  
VCC + 1.0  
VCC + 0.3  
V
V
5V  
3.3V  
–1.0  
–0.3  
0.8  
0.8  
Commercial Ambient Temperature  
Industrial Ambient Temperature  
0
–40  
70  
85  
°C  
°C  
CAPACITANCE(1,2)  
Symbol  
Parameter  
Input Capacitance: A0-A8  
Max.  
Unit  
CIN1  
CIN2  
CIO  
5
7
7
pF  
pF  
pF  
Input Capacitance: RAS, UCAS, LCAS, WE, OE  
Data Input/Output Capacitance: I/O0-I/O15  
Notes:  
1. Tested initially and after any design or process changes that may affect these parameters.  
2. Test conditions: TA = 25°C, f = 1 MHz.  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
5
IS41C16256  
IS41LV16256  
ELECTRICAL CHARACTERISTICS(1)  
(Recommended Operating Conditions unless otherwise noted.)  
Symbol Parameter  
TestCondition  
Speed Min.  
Max.  
Unit  
IIL  
Input Leakage Current  
Any input 0V < VIN < Vcc  
–10  
10  
µA  
Other inputs not under test = 0V  
IIO  
Output Leakage Current  
Output is disabled (Hi-Z)  
0V < VOUT < Vcc  
–10  
10  
µA  
VOH  
VOL  
ICC1  
Output High Voltage Level  
Output Low Voltage Level  
Standby Current: TTL  
IOH = –2.5 mA  
IOL =+2.1mA  
2.4  
V
V
0.4  
RAS, LCAS, UCAS > VIH Commerical 5V  
Industrial 5V  
Commerical 3.3V  
2
3
1
2
mA  
Industrial  
3.3V  
ICC2  
ICC3  
Standby Current: CMOS  
RAS, LCAS, UCAS > VCC – 0.2V  
5V  
3.3V  
1
0.5  
mA  
mA  
Operating Current:  
RAS, LCAS, UCAS,  
Address Cycling, tRC = tRC (min.)  
-25  
-35  
-50  
-60  
260  
230  
180  
170  
Random Read/Write(2,3,4)  
Average Power Supply Current  
ICC4  
ICC5  
ICC6  
Operating Current:  
RAS = VIL, LCAS, UCAS,  
-25  
-35  
-50  
-60  
250  
220  
170  
160  
mA  
mA  
mA  
EDO Page Mode(2,3,4)  
Cycling tPC = tPC (min.)  
Average Power Supply Current  
Refresh Current:  
RAS Cycling, LCAS, UCAS > VIH  
tRC = tRC (min.)  
-25  
-35  
-50  
-60  
260  
230  
180  
170  
RAS-Only(2,3)  
Average Power Supply Current  
Refresh Current:  
RAS, LCAS, UCAS Cycling  
tRC = tRC (min.)  
-25  
-35  
-50  
-60  
260  
230  
180  
170  
CBR(2,3,5)  
Average Power Supply Current  
Notes:  
1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycles (RAS-Only or CBR) before proper device  
operation is assured. The eight RAS cycles wake-up should be repeated any time the tREF refresh requirement is exceeded.  
2. Dependent on cycle rates.  
3. Specified values are obtained with minimum cycle time and the output open.  
4. Column-address is changed once each EDO page cycle.  
5. Enables on-chip refresh and address counters.  
6
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
IS41C16256  
IS41LV16256  
AC CHARACTERISTICS(1,2,3,4,5,6)  
(Recommended Operating Conditions unless otherwise noted.)  
-25  
-35  
-50  
-60  
Symbol  
Parameter  
Min. Max. Min. Max.  
Min. Max. Min. Max. Units  
tRC  
Random READ or WRITE Cycle Time  
45  
25  
10  
12  
60  
35  
10  
18  
90  
50  
14  
25  
110  
60  
15  
30  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
(6, 7)  
tRAC  
tCAC  
tAA  
Access Time from RAS  
(6, 8, 15)  
Access Time from CAS  
Access Time from Column-Address(6)  
RAS Pulse Width  
tRAS  
tRP  
25 10K  
35 10K  
50 10K  
60 10K  
40  
10 10K  
RAS Precharge Time  
15  
4
10K  
20  
6
10K  
30  
8
10K  
tCAS  
tCP  
CAS Pulse Width(26)  
CAS Precharge Time(9, 25)  
CAS Hold Time (21)  
4
5
8
10  
60  
20  
0
45  
tCSH  
tRCD  
tASR  
tRAH  
tASC  
tCAH  
tAR  
25  
10  
0
35  
11  
0
50  
19  
0
RAS to CAS Delay Time(10, 20)  
Row-Address Setup Time  
Row-Address Hold Time  
Column-Address Setup Time(20)  
Column-Address Hold Time(20)  
17  
28  
36  
6
6
8
10  
0
0
0
0
5
6
8
10  
40  
Column-Address Hold Time  
19  
30  
40  
(referenced to RAS)  
tRAD  
tRAL  
tRPC  
tRSH  
tCLZ  
tCRP  
tOD  
RAS to Column-Address Delay Time(11)  
Column-Address to RAS Lead Time  
RAS to CAS Precharge Time  
RAS Hold Time(27)  
8
12  
0
20  
12  
8
10  
18  
0
20  
12  
10  
14  
25  
0
25  
12  
15  
15  
30  
0
30  
12  
15  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
7
8
14  
3
15  
3
CAS to Output in Low-Z(15, 29)  
CAS to RAS Precharge Time(21)  
Output Disable Time(19, 28, 29)  
3
3
5
5
5
5
2
3
3
3
tOE  
Output Enable Time(15, 16)  
0
0
0
10  
10  
5
tOEHC  
tOEP  
tOES  
tRCS  
tRRH  
OE HIGH Hold Time from CAS HIGH  
OE HIGH Pulse Width  
10  
10  
5
10  
10  
5
10  
10  
5
OE LOW to CAS HIGH Setup Time  
Read Command Setup Time(17, 20)  
0
0
0
0
Read Command Hold Time  
0
0
0
0
(referenced to RAS)(12)  
tRCH  
Read Command Hold Time  
0
0
0
0
ns  
(referenced to CAS)(12, 17, 21)  
tWCH  
tWCR  
Write Command Hold Time(17, 27)  
5
5
8
10  
50  
ns  
ns  
Write Command Hold Time  
19  
30  
40  
(referenced to RAS)(17)  
tWP  
Write Command Pulse Width(17)  
5
10  
7
5
10  
8
8
10  
10  
15  
15  
0
ns  
ns  
ns  
ns  
ns  
ns  
tWPZ  
tRWL  
tCWL  
tWCS  
tDHR  
WE Pulse Widths to Disable Outputs  
Write Command to RAS Lead Time(17)  
Write Command to CAS Lead Time(17, 21)  
Write Command Setup Time(14, 17, 20)  
Data-in Hold Time (referenced to RAS)  
10  
14  
14  
0
5
8
0
0
19  
30  
40  
40  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
7
IS41C16256  
IS41LV16256  
AC CHARACTERISTICS (Continued)(1,2,3,4,5,6)  
(Recommended Operating Conditions unless otherwise noted.)  
-25  
-35  
-50  
-60  
Symbol  
Parameter  
Min. Max. Min. Max.  
Min. Max. Min. Max. Units  
tACH  
Column-Address Setup Time to CAS  
15  
15  
15  
10  
15  
15  
ns  
ns  
Precharge during WRITE Cycle  
tOEH  
OE Hold Time from WE during  
5
8
READ-MODIFY-WRITE cycle(18)  
tDS  
Data-In Setup Time(15, 22)  
Data-In Hold Time(15, 22)  
0
5
0
6
0
8
0
ns  
ns  
ns  
ns  
tDH  
10  
tRWC  
tRWD  
READ-MODIFY-WRITE Cycle Time  
65  
35  
80  
45  
125  
70  
140  
80  
RAS to WE Delay Time during  
READ-MODIFY-WRITE Cycle(14)  
tCWD  
tAWD  
tPC  
CAS to WE Delay Time(14, 20)  
17  
21  
10  
25  
30  
12  
34  
42  
20  
36  
49  
25  
ns  
ns  
ns  
Column-Address to WE Delay Time(14)  
EDO Page Mode READ or WRITE  
Cycle Time(24)  
tRASP  
tCPA  
RAS Pulse Width in EDO Page Mode  
Access Time from CAS Precharge(15)  
25 100K 35 100K  
50 100K  
50 100K ns  
14  
21  
27  
34  
ns  
ns  
tPRWC  
EDO Page Mode READ-WRITE  
32  
40  
47  
56  
Cycle Time(24)  
tCOH  
tOFF  
Data Output Hold after CAS LOW  
5
3
5
3
5
3
5
3
ns  
ns  
Output Buffer Turn-Off Delay from  
15  
15  
15  
15  
(13,15,19, 29)  
CAS or RAS  
tWHZ  
Output Disable Delay from WE  
3
15  
3
15  
3
15  
3
15  
ns  
ns  
tCLCH  
Last CAS going LOW to First CAS  
10  
10  
10  
10  
returning HIGH(23)  
tCSR  
tCHR  
tORD  
CAS Setup Time (CBR REFRESH)(30, 20)  
5
7
0
8
8
0
10  
10  
0
10  
10  
0
ns  
ns  
ns  
CAS Hold Time (CBR REFRESH)(30, 21)  
OE Setup Time prior to RAS during  
HIDDEN REFRESH Cycle  
tREF  
tT  
Refresh Period (512 Cycles)  
Transition Time (Rise or Fall)(2, 3)  
1
8
1
8
1
8
1
8
ms  
ns  
50  
50  
50  
50  
AC TEST CONDITIONS  
Output load:  
Two TTL Loads and 50 pF (Vcc = 5.0V ±10%)  
One TTL Load and 50 pF (Vcc = 3.3V ±10%)  
Input timing reference levels: VIH = 2.4V, VIL = 0.8V (Vcc = 5.0V ±10%);  
VIH = 2.0V, VIL = 0.8V (Vcc = 3.3V ±10%)  
Output timing reference levels: VOH = 2.0V, VOL = 0.8V (Vcc = 5V ±10%, 3.3V ±10%)  
8
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
IS41C16256  
IS41LV16256  
Notes:  
1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycle (RAS-Only or CBR) before proper device  
operation is assured. The eight RAS cycles wake-up should be repeated any time the tREF refresh requirement is exceeded.  
2. VIH (MIN) and VIL (MAX) are reference levels for measuring timing of input signals. Transition times, are measured between VIH  
and VIL (or between VIL and VIH) and assume to be 1 ns for all inputs.  
3. In addition to meeting the transition rate specification, all input signals must transit between VIH and VIL (or between VIL and VIH)  
in a monotonic manner.  
4. If CAS and RAS = VIH, data output is High-Z.  
5. If CAS = VIL, data output may contain data from the last valid READ cycle.  
6. Measured with a load equivalent to one TTL gate and 50 pF.  
7. Assumes that tRCD tRCD (MAX). If tRCD is greater than the maximum recommended value shown in this table, tRAC will increase  
by the amount that tRCD exceeds the value shown.  
8. Assumes that tRCD tRCD (MAX).  
9. If CAS is LOW at the falling edge of RAS, data out will be maintained from the previous cycle. To initiate a new cycle and clear the  
data output buffer, CAS and RAS must be pulsed for tCP.  
10. Operation with the tRCD (MAX) limit ensures that tRAC (MAX) can be met. tRCD (MAX) is specified as a reference point only; if tRCD  
is greater than the specified tRCD (MAX) limit, access time is controlled exclusively by tCAC.  
11. Operation within the tRAD (MAX) limit ensures that tRCD (MAX) can be met. tRAD (MAX) is specified as a reference point only; if tRAD  
is greater than the specified tRAD (MAX) limit, access time is controlled exclusively by tAA.  
12. Either tRCH or tRRH must be satisfied for a READ cycle.  
13. tOFF (MAX) defines the time at which the output achieves the open circuit condition; it is not a reference to VOH or VOL.  
14. tWCS, tRWD, tAWD and tCWD are restrictive operating parameters in LATE WRITE and READ-MODIFY-WRITE cycle only. If tWCS tWCS  
(MIN), the cycle is an EARLY WRITE cycle and the data output will remain open circuit throughout the entire cycle. If tRWD tRWD  
(MIN), tAWD tAWD (MIN) and tCWD tCWD (MIN), the cycle is a READ-WRITE cycle and the data output will contain data read from  
the selected cell. If neither of the above conditions is met, the state of I/O (at access time and until CAS and RAS or OE go back  
to VIH) is indeterminate. OE held HIGH and WE taken LOW after CAS goes LOW result in a LATE WRITE (OE-controlled) cycle.  
15. Output parameter (I/O) is referenced to corresponding CAS input, I/O0-I/O7 by LCAS and I/O8-I/O15 by UCAS.  
16. During a READ cycle, if OE is LOW then taken HIGH before CAS goes HIGH, I/O goes open. If OE is tied permanently LOW, a LATE  
WRITE or READ-MODIFY-WRITE is not possible.  
17. Write command is defined as WE going low.  
18. LATE WRITE and READ-MODIFY-WRITE cycles must have both tOD and tOEH met (OE HIGH during WRITE cycle) in order to ensure  
that the output buffers will be open during the WRITE cycle. The I/Os will provide the previously written data if CAS remains LOW  
and OE is taken back to LOW after tOEH is met.  
19. The I/Os are in open during READ cycles once tOD or tOFF occur.  
20. The first χCAS edge to transition LOW.  
21. The last χCAS edge to transition HIGH.  
22. These parameters are referenced to CAS leading edge in EARLY WRITE cycles and WE leading edge in LATE WRITE or READ-  
MODIFY-WRITE cycles.  
23. Last falling χCAS edge to first rising χCAS edge.  
24. Last rising χCAS edge to next cycle’s last rising χCAS edge.  
25. Last rising χCAS edge to first falling χCAS edge.  
26. Each χCAS must meet minimum pulse width.  
27. Last χCAS to go LOW.  
28. I/Os controlled, regardless UCAS and LCAS.  
29. The 3 ns minimum is a parameter guaranteed by design.  
30. Enables on-chip refresh and address counters.  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
9
IS41C16256  
IS41LV16256  
READ CYCLE  
t
RC  
t
RAS  
t
RP  
RAS  
t
CSH  
t
RSH  
t
RRH  
t
CRP  
ASR  
t
CAS CLCH  
t
t
RCD  
UCAS-LCAS  
t
AR  
t
RAD  
tRAL  
t
t
RAH  
t
CAH  
t
ASC  
ADDRESS  
WE  
Row  
Column  
Row  
t
RCS  
t
RCH  
t
AA  
t
RAC  
(1)  
OFF  
t
t
CAC  
CLC  
t
Open  
Open  
Valid Data  
I/O  
OE  
t
OE  
tOD  
t
OES  
Undefined  
Don’t Care  
Note:  
1. tOFF is referenced from rising edge of RAS or CAS, whichever occurs last.  
10  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
IS41C16256  
IS41LV16256  
EARLY WRITE CYCLE (OE = DON'T CARE)  
t
RC  
t
RAS  
tRP  
RAS  
t
CSH  
t
RSH  
t
CRP  
ASR  
t
CAS CLCH  
t
t
RCD  
UCAS/LCAS  
ADDRESS  
t
AR  
t
RAD  
t
t
t
RAL  
CAH  
ACH  
t
t
RAH  
t
ASC  
Row  
Column  
Row  
t
t
CWL  
RWL  
t
WCR  
t
WCS  
tWCH  
t
WP  
WE  
I/O  
t
DHR  
t
DH  
t
DS  
Valid Data  
Don’t Care  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
11  
IS41C16256  
IS41LV16256  
READ WRITE CYCLE (LATE WRITE and READ-MODIFY-WRITE Cycles)  
t
t
RWC  
RAS  
t
RP  
RAS  
t
CSH  
t
RSH  
t
CRP  
ASR  
t
CAS CLCH  
t
t
RCD  
UCAS-LCAS  
t
AR  
t
RAD  
tRAL  
t
t
RAH  
tCAH  
t
ASC  
t
ACH  
ADDRESS  
WE  
Row  
Column  
Row  
t
RWD  
tCWL  
t
RCS  
t
CWD  
t
RWL  
t
AWD  
t
WP  
t
AA  
t
RAC  
t
t
CAC  
CLZ  
t
DS  
tDH  
Open  
Open  
Valid DOUT  
Valid DIN  
I/O  
OE  
t
OD  
tOEH  
t
OE  
Undefined  
Don’t Care  
12  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
IS41C16256  
IS41LV16256  
EDO-PAGE-MODE READ CYCLE  
t
RASP  
t
RP  
RAS  
(1)  
PC  
t
CSH  
t
t
RSH  
t
CRP  
t
RCD  
t
CAS,  
t
CP  
t
CAS,  
t
CP  
t
CAS,  
tCP  
t
CLCH  
t
CLCH  
tCLCH  
UCAS/LCAS  
t
AR  
t
RAD  
t
RAL  
CAH  
t
ASR  
t
ASC  
t
CAH  
t
ASC  
t
CAH  
t
ASC  
t
ADDRESS  
WE  
Row  
Column  
Column  
Column  
Row  
t
RAH  
t
RRH  
t
RCS  
t
RCH  
t
AA  
t
AA  
t
AA  
t
RAC  
CAC  
CLZ  
t
CPA  
t
CPA  
t
t
t
CAC  
t
t
CAC  
CLZ  
t
COH  
t
OFF  
Open  
Open  
Valid Data  
Valid Data  
Valid Data  
I/O  
OE  
t
OE  
t
OEHC  
tOE  
t
OD  
t
OES  
t
OD  
t
OES  
t
OEP  
Undefined  
Don’t Care  
Note:  
1. tPC can be measured from falling edge of CAS to falling edge of CAS, or from rising edge of CAS to rising edge of CAS. Both  
measurements must meet the tPC specifications.  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
13  
IS41C16256  
IS41LV16256  
EDO-PAGE-MODE EARLY-WRITE CYCLE  
t
RASP  
t
RP  
RAS  
t
CSH  
t
PC  
t
RSH  
t
CRP  
t
RCD  
t
CAS,  
t
CP  
t
CAS,  
t
CP  
t
CAS,  
tCP  
t
CLCH  
t
CLCH  
tCLCH  
UCAS/LCAS  
ADDRESS  
t
AR  
tACH  
t
ACH  
t
ACH  
CAH  
t
RAD  
t
RAL  
t
ASR  
t
ASC  
t
CAH  
t
ASC  
t
t
ASC  
t
CAH  
Row  
Column  
Column  
Column  
Row  
t
RAH  
t
CWL  
WCS  
WCH  
t
CWL  
tCWL  
t
t
WCS  
t
WCS  
t
t
WCH  
tWCH  
t
WP  
t
WP  
t
WP  
WE  
t
WCR  
DHR  
tRWL  
t
tDS  
tDS  
tDS  
t
DH  
t
DH  
tDH  
I/O  
OE  
Valid Data  
Valid Data  
Valid Data  
Don’t Care  
14  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
IS41C16256  
IS41LV16256  
EDO-PAGE-MODE READ-WRITE CYCLE (LATE WRITE and READ-MODIFY WRITE Cycles)  
t
RASP  
t
RP  
RAS  
(1)  
tPC / tPRWC  
t
CSH  
t
RSH  
CLCH  
t
CRP  
t
RCD  
t
CAS,  
t
CLCH  
t
CP  
t
CAS,  
t
CLCH  
t
CP  
t
CAS,  
t
tCP  
UCAS/LCAS  
t
AR  
t
ASR  
t
t
RAD  
t
RAL  
t
ASC  
t
CAH  
t
ASC  
t
CAH  
t
ASC  
tCAH  
RAH  
ADDRESS  
Row  
Column  
Column  
Column  
Row  
tRWD  
tRCS  
t
t
t
RWL  
CWL  
WP  
t
t
CWL  
WP  
t
t
CWL  
WP  
t
AWD  
t
AWD  
t
AWD  
t
CWD  
t
CWD  
t
CWD  
WE  
t
AA  
t
AA  
CPA  
t
AA  
tCPA  
t
t
RAC  
t
DH  
DS  
t
DH  
DS  
t
DH  
tDS  
t
t
t
CAC  
t
CAC  
t
CAC  
t
CLZ  
t
CLZ  
t
CLZ  
Open  
Open  
I/O  
OE  
DOUT  
DIN  
OD  
DOUT  
DIN  
OD  
DOUT  
DIN  
OD  
t
t
t
t
OE  
t
OE  
tOE  
t
OEH  
Undefined  
Don’t Care  
Note:  
1. tPC in this diagram is for LATE write cycles only, tPC can be measured from falling edge of CAS to falling edge of CAS, or from  
rising edge of CAS to rising edge of CAS. Both measurements must meet the tPC specifications.  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
15  
IS41C16256  
IS41LV16256  
EDO-PAGE-MODE READ-EARLY-WRITE CYCLE (Psuedo READ-MODIFY WRITE)  
t
RASP  
t
RP  
RAS  
t
CSH  
t
PC  
tPC  
t
RSH  
t
CRP  
t
RCD  
t
CAS  
t
CP  
t
CAS  
t
CP  
t
CAS  
tCP  
UCAS/LCAS  
t
AR  
t
ACH  
RAL  
CAH  
t
ASR  
t
t
RAD  
t
t
ASC  
t
CAH  
t
ASC  
t
CAH  
t
ASC  
t
RAH  
ADDRESS  
WE  
Row  
Column (A)  
Column (B)  
Column (N)  
Row  
t
RCS  
t
RCH  
t
WCS  
tWCH  
t
WHZ  
t
AA  
t
AA  
t
CPA  
CAC  
COH  
t
RAC  
CAC  
t
t
t
t
DS  
tDH  
Open  
Open  
I/O  
OE  
Valid Data (A)  
Valid Data (B)  
DIN  
t
OE  
Don’t Care  
16  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
IS41C16256  
IS41LV16256  
AC WAVEFORMS  
READ CYCLE (With WE-Controlled Disable)  
RAS  
tCSH  
tCRP  
tRCD  
tCP  
tCAS  
UCAS/LCAS  
tAR  
tRAD  
tASR  
tRAH  
tCAH  
tRCH  
tASC  
tASC  
ADDRESS  
WE  
Row  
Column  
Column  
tWPZ tRCS  
tRCS  
tAA  
tRAC  
tCAC  
tCLZ  
tWHZ  
tCLZ  
Open  
Open  
Valid Data  
I/O  
OE  
tOE  
tOD  
Undefined  
Don’t Care  
RAS-ONLY REFRESH CYCLE (OE, WE = DON'T CARE)  
t
RC  
t
RAS  
tRP  
RAS  
t
CRP  
t
RPC  
UCAS/LCAS  
t
ASR  
tRAH  
ADDRESS  
I/O  
Row  
Row  
Open  
Don’t Care  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
17  
IS41C16256  
IS41LV16256  
CBR REFRESH CYCLE (Addresses; WE, OE = DON'T CARE)  
t
RP  
t
RAS  
t
RP  
t
RAS  
RAS  
t
CHR  
t
CHR  
t
RPC  
CP  
tRPC  
t
t
CSR  
tCSR  
UCAS/LCAS  
I/O  
Open  
HIDDEN REFRESH CYCLE(1) (WE = HIGH; OE = LOW)  
t
RAS  
t
RAS  
t
RP  
RAS  
t
CRP  
t
RCD  
t
RSH  
tCHR  
UCAS/LCAS  
t
AR  
t
RAD  
t
RAL  
t
ASR  
t
RAH  
tCAH  
t
ASC  
ADDRESS  
Row  
Column  
t
AA  
t
RAC  
(2)  
t
OFF  
t
CAC  
t
CLZ  
Open  
Open  
Valid Data  
I/O  
OE  
t
OE  
tOD  
t
ORD  
Undefined  
Don’t Care  
Notes:  
1. A Hidden Refresh may also be performed after a Write Cycle. In this case, WE = LOW and OE = HIGH.  
2. tOFF is referenced from rising edge of RAS or CAS, whichever occurs last.  
18  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
IS41C16256  
IS41LV16256  
ORDERING INFORMATION  
IS41C16256  
Commercial Range: 0°C to 70°C  
ORDERING INFORMATION:  
IS41LV16256  
Commercial Range: 0°C to 70°C  
Speed (ns) Order Part No.  
Package  
Speed (ns) Order Part No.  
Package  
25  
35  
50  
60  
IS41C16256-25K 400mil SOJ  
IS41C16256-25T 400mil TSOP-2  
35  
50  
60  
IS41LV16256-35K 400mil SOJ  
IS41LV16256-35T 400mil TSOP-2  
IS41C16256-35K 400mil SOJ  
IS41C16256-35T 400mil TSOP-2  
IS41LV16256-50K 400mil SOJ  
IS41LV16256-50T 400mil TSOP-2  
IS41C16256-50K 400mil SOJ  
IS41C16256-50T 400mil TSOP-2  
IS41LV16256-60K 400mil SOJ  
IS41LV16256-60T 400mil TSOP-2  
IS41C16256-60K 400mil SOJ  
IS41C16256-60T 400mil TSOP-2  
Industrial Range: -40°C to 85°C  
Industrial Range: -40°C to 85°C  
Speed (ns) Order Part No.  
Package  
Speed (ns) Order Part No.  
Package  
25  
35  
50  
60  
IS41C16256-25KI 400mil SOJ  
IS41C16256-25TI 400mil TSOP-2  
35  
50  
60  
IS41LV16256-35K 400mil SOJ  
IS41LV16256-35T 400mil TSOP-2  
IS41C16256-35KI 400mil SOJ  
IS41C16256-35TI 400mil TSOP-2  
IS41LV16256-50KI 400mil SOJ  
IS41LV16256-50TI 400mil TSOP-2  
IS41C16256-50KI 400mil SOJ  
IS41C16256-50TI 400mil TSOP-2  
IS41LV16256-60KI 400mil SOJ  
IS41LV16256-60TI 400mil TSOP-2  
IS41C16256-60KI 400mil SOJ  
IS41C16256-60TI 400mil TSOP-2  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  
19  
IS41C16256  
IS41LV16256  
Integrated Circuit Solution Inc.  
HEADQUARTER:  
NO.2, TECHNOLOGY RD. V, SCIENCE-BASED INDUSTRIAL PARK,  
HSIN-CHU, TAIWAN, R.O.C.  
TEL: 886-3-5780333  
Fax: 886-3-5783000  
BRANCH OFFICE:  
7F, NO. 106, SEC. 1, HSIN-TAI 5TH ROAD,  
HSICHIH TAIPEI COUNTY, TAIWAN, R.O.C.  
TEL: 886-2-26962140  
FAX: 886-2-26962252  
http://www.icsi.com.tw  
20  
Integrated Circuit Solution Inc.  
DR001-0E 01/25/2002  

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