SF0140BA03107S [ICSI]
140 MHz Filter 10 MHz Bandwidth; 140 MHz滤波器10 MHz带宽型号: | SF0140BA03107S |
厂家: | INTEGRATED CIRCUIT SOLUTION INC |
描述: | 140 MHz Filter 10 MHz Bandwidth |
文件: | 总4页 (文件大小:189K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
140 MHz Filter
10 MHz Bandwidth
Part Number SF0140BA03107S
Integrated
Circuit
Systems, Inc.
TYPICAL PERFORMANCE
Horizontal: 4 MHz/div
Vertical (from top):
Magnitude
Phase Deviation
10,1 dB/div
10 deg/div
Group Delay Variation
50 ns/div
SPECIFICATION
Parameter
Min
139.8
Typ
140
8.3
Max
140.2
9.5
Units
MHz
dB
Center Frequency 1
Insertion Loss
1 dB Bandwidth
3 dB Bandwidth
35 dB Bandwidth
Passband Ripple 2
9.6
10.5
9.92
10.9
14.0
0.25
3
MHz
MHz
MHz
dB
deg
ns
15
1
6
Phase Deviation from Linear 2
Group Delay Variation 2
30
100
Absolute Delay
1.0
us
Ultimate Rejection (30-350 MHz)
Substrate Material
40
dB
YZ Lithium Niobate
Temperature Coefficient of Frequency (Tc) 3
Ambient Temperature
-94
25
ppm/°C
°C
Source and Load Impedance
50
Ω
Notes: 1. Average of lower & upper 3 dB frequencies.
2. Evaluated over 80% of the 3 dB bandwidth.
3. Typical change of filter frequency response with temperature is Δf/fref = (T-Tref)*Tc ppm.
Rev X7 22-Mar-05
Page 1 of 4
Integrated Circuit Systems • Surface Acoustic Wave Products
324 Clark Street, Worcester, MA 01606, USA • Phone 508-852-5400 • Fax 508-852-8456
www.icst.com
QF12/3
140 MHz Filter
10 MHz Bandwidth
Part Number SF0140BA03107S
Integrated
Circuit
Systems, Inc.
PACKAGE AND SUGGESTED PCB FOOTPRINT
PACKAGE INFORMATION
SUGGESTED PCB FOOTPRINT
15.37
13.33 ±.20
.89
10
9
8
7
11
12
6
5
ICS
BA03107S
YYJJJM
8.53
2.98
2.54
2.59
6.50 ±.20
1
2
3
4
2.54
7.62
1.98 MAX
PIN CONFIGURATION
INPUT
11
12
5
.80
INPUT RETURN
OUTPUT
1
3
8
2
9
4
6
OUTPUT RETURN
GROUND
12
11
5
6
ALL OTHERS
NOTES:
10
7
DIMENSIONS SHOWN ARE NOMINAL IN
MILLIMETERS. ALL TOLERANCES ARE
±0.15MM EXCEPT OVERALL LENGTH
AND WIDTH
2.54
12X 1.4
Package Material:
Body: Al2O3 ceramic
Lid: Kovar, Ni plated
Terminations: Au plating 1 µm min,
over a 1.3-8.9 µm Ni plating
MARKING
10
9
8
7
LOGO
ICS
BA03107S
11
12
6
MARKING
ESD PIN 1
5
YYJJJM
1
2
3
4
The date code consists of:
YY = last two digits of year; JJJ = Julian day;
M = manufacturing site code
Rev X7 22-Mar-05
Page 2 of 4
Integrated Circuit Systems • Surface Acoustic Wave Products
324 Clark Street, Worcester, MA 01606, USA • Phone 508-852-5400 • Fax 508-852-8456
www.icst.com
QF12/3
140 MHz Filter
10 MHz Bandwidth
Part Number SF0140BA03107S
Integrated
Circuit
Systems, Inc.
MATCHING CIRCUIT
11
5
1, 2,3,4,6,7,8,9,10,12
Component values in 50 Ω:
(Minimum Q = 40)
Ls1 = 68 nH
Cp1 = 15 pF
Ls2 = 100 nH
Cp2 = 10 pF
Notes:
1. Optimum values may differ from these when using a different fixture or board layout. The values shown
here are intended as a guide only.
MAXIMUM RATINGS
Parameter
Min
-45
Max
+85
15
Units
ºC
dBm
V
Storage Temperature Range
Maximum Input Power Level
D. C. Voltage between Each Terminal
15
Rev X7 22-Mar-05
Page 3 of 4
Integrated Circuit Systems • Surface Acoustic Wave Products
324 Clark Street, Worcester, MA 01606, USA • Phone 508-852-5400 • Fax 508-852-8456
www.icst.com
QF12/3
140 MHz Filter
10 MHz Bandwidth
Part Number SF0140BA03107S
Integrated
Circuit
Systems, Inc.
PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
Parameter
Qualification Conditions
Life Testing
High temperature bake at +85 ºC for 168 hours.
MIL-STD 883, Method 1010:
Temperature Cycling
-40 ºC to +85 ºC, 10 cycles, 10 minutes dwell at
temperature extremes
MIL-STD-202, Method 201A:
Vibration
10 to 55 Hz, double amplitude of 0.06” for 2 hours in each
axis.
MIL-STD-883, Method 2002, Test Condition B:
1500 g, 3 impacts each axis
Mechanical Shock
Peak temperature 240+/-5 ºC for 10 seconds.
Pre-heat: 150-170 ºC for 60 to 90 seconds.
Peak dwell: over 200 ºC for 23 to 26 seconds.
Handling: Class 1 per MIL-STD-1686
Reflow Profile is shown at the bottom of this table.
MIL-STD 883 Method 2004, Condition D
8 oz for 30 seconds.
Solder Heat Resistance and Reflow
Condition
Lead Integrity
Solderability
MIL-STD-883 Method 2003:
245 ºC +/-5 ºC; 95% coverage; no steam aging
MIL-STD 883 Method 1014:
Hermeticity
Condition A2 and Condition C (no bomb)
Class I per MIL-STD-883 Method 3015
Do not subject devices to ultrasonic cleaning, which may
cause deterioration and destruction of the device.
ESD Classification
Precautions
Reflow Profile
250
200
150
100
50
0
0
50
100
150
200
250
300
TIME (sec)
ISO 9001
Registered
Rev X7 22-Mar-05
Page 4 of 4
Integrated Circuit Systems • Surface Acoustic Wave Products
324 Clark Street, Worcester, MA 01606, USA • Phone 508-852-5400 • Fax 508-852-8456
www.icst.com
QF12/3
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