5P49V5914_17 [IDT]
Programmable Clock Generator;
| 型号： | 5P49V5914_17 |
| 厂家： | 
INTEGRATED DEVICE TECHNOLOGY |
| 描述： | Programmable Clock Generator |
| 文件： | 总37页 (文件大小：447K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Programmable Clock Generator
5P49V5914
DATASHEET
Description
Features
The 5P49V5914 is a programmable clock generator intended
for high performance consumer, networking, industrial,
computing, and data-communications applications.
Configurations may be stored in on-chip One-Time
• Generates up to three independent output frequencies
• High performance, low phase noise PLL, <0.7 ps RMS
typical phase jitter on outputs:
2
– PCIe Gen1, 2, 3 compliant clock capability
– USB 3.0 compliant clock capability
– 1 GbE and 10 GbE
Programmable (OTP) memory or changed using I C
interface. This is IDTs fifth generation of programmable clock
®
technology (VersaClock 5).
The frequencies are generated from a single reference clock.
The reference clock can come from one of the two redundant
clock inputs. A glitchless manual switchover function allows
one of the redundant clocks to be selected during normal
operation.
• Three fractional output dividers (FODs)
• Independent Spread Spectrum capability on each output
pair
• Four banks of internal non-volatile in-system
programmable or factory programmable OTP memory
Two select pins allow up to 4 different configurations to be
programmed and accessible using processor GPIOs or
bootstrapping. The different selections may be used for
different operating modes (full function, partial function, partial
power-down), regional standards (US, Japan, Europe) or
system production margin testing.
2
• I C serial programming interface
• One reference LVCMOS output clock
• Three universal output pairs:
– Each configurable as one differential output pair or two
LVCMOS outputs
2
The device may be configured to use one of two I C
• I/O Standards:
addresses to allow multiple devices to be used in a system.
– Single-ended I/Os: 1.8V to 3.3V LVCMOS
– Differential I/Os - LVPECL, LVDS and HCSL
Pin Assignment
• Input frequency ranges:
– LVCMOS Reference Clock Input (XIN/REF) – 1MHz to
200MHz
– LVDS, LVPECL, HCSL Differential Clock Input (CLKIN,
CLKINB) – 1MHz to 350MHz
– Crystal frequency range: 8MHz to 40MHz
• Output frequency ranges:
– LVCMOS Clock Outputs – 1MHz to 200MHz
24 23 22 21 20 19
1
2
VDDO
2
– LVDS, LVPECL, HCSL Differential Clock Outputs –
1MHz to 350MHz
18
17
16
15
14
CLKIN
CLKINB
XOUT
OUT2
• Individually selectable output voltage (1.8V, 2.5V, 3.3V) for
each output pair
3
4
OUT2B
EPAD
GND
VDDO
3
XIN/REF
VDDA
• Redundant clock inputs with manual switchover
• Programmable loop bandwidth
• Programmable slew rate control
• Programmable crystal load capacitance
• Individual output enable/disable
• Power-down mode
5
6
OUT3
13
OUT3B
CLKSEL
8
9
10 11 12
7
• 1.8V, 2.5V or 3.3V core V
, V
DDA
DDD
• Available in 24-pin VFQFPN 4mm x 4mm package
• -40° to +85°C industrial temperature operation
24-pin VFQFPN
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1
©2017 Integrated Device Technology, Inc.
5P49V5914 DATASHEET
Functional Block Diagram
VDDO
OUT0_SEL_I2CB
VDDO
0
XIN/REF
XOUT
1
OUT1
FOD1
FOD2
FOD3
OUT1B
CLKIN
VDDO
2
CLKINB
OUT2
OUT2B
CLKSEL
SD/OE
PLL
VDDO
3
OUT3
OUT3B
SEL1/SDA
OTP
SEL0/SCL
and
Control Logic
VDDA
VDDD
Applications
• Ethernet switch/router
• PCI Express 1.0/2.0/3.0
• Broadcast video/audio timing
• Multi-function printer
• Processor and FPGA clocking
• Any-frequency clock conversion
• MSAN/DSLAM/PON
• Fiber Channel, SAN
• Telecom line cards
• 1 GbE and 10 GbE
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Table 1:Pin Descriptions
Number
Name
Type
Description
Internal
Pull-down
1
CLKIN
Input
Differential clock input. Weak 100kohms internal pull-down.
Internal
Pull-down
2
3
CLKINB
XOUT
Input
Input
Complementary differential clock input. Weak 100kohms internal pull-down.
Crystal Oscillator interface output.
Crystal Oscillator interface input, or single-ended LVCMOS clock input. Ensure that
the input voltage is 1.2V max.Refer to the section “Overdriving the XIN/REF
Interface”.
4
5
XIN/REF
VDDA
Input
Analog functions power supply pin.Connect to 1.8V to 3.3V. VDDA and VDDD should
have the same voltage applied.
Power
Input clock select. Selects the active input reference source in manual switchover
mode.
Internal
Pull-down
6
CLKSEL
Input
Input
0 = XIN/REF, XOUT (default)
1 = CLKIN, CLKINB
CLKSEL Polarity can be changed by I2C programming as shown in Table 4.
Enables/disables the outputs (OE) or powers down the chip (SD). The SH bit
controls the configuration of the SD/OE pin. The SH bit needs to be high for SD/OE
pin to be configured as SD. The SP bit (0x02) controls the polarity of the signal to be
either active HIGH or LOW only when pin is configured as OE (Default is active
LOW.) Weak internal pull down resistor. When configured as SD, device is shut
down, differential outputs are driven high/low, and the single-ended LVCMOS
outputs are driven low. When configured as OE, and outputs are disabled, the
outputs can be selected to be tri-stated or driven high/low, depending on the
programming bits as shown in the SD/OE Pin Function Truth table.
Internal
Pull-down
7
SD/OE
Internal
Configuration select pin, or I2C SDA input as selected by OUT0_SEL_I2CB. Weak
8
9
SEL1/SDA
SEL0/SCL
VDDA
Input
Input
Pull-down internal pull down resistor.
Internal
Configuration select pin, or I2C SCL input as selected by OUT0_SEL_I2CB. Weak
Pull-down internal pull down resistor.
Analog functions power supply pin.Connect to 1.8V to 3.3V. VDDA and VDDD should
have the same voltage applied.
10
Power
11
12
NC
NC
–
–
–
–
No connect.
No connect.
Complementary Output Clock 3. Please refer to the Output Drivers section for more
details.
13
14
15
OUT3B
OUT3
Output
Output
Power
Output Clock 3. Please refer to the Output Drivers section for more details.
Output power supply. Connect to 1.8 to 3.3V. Sets output voltage levels for
OUT3/OUT3B.
VDDO
3
Complementary Output Clock 2. Please refer to the Output Drivers section for more
details.
16
17
18
OUT2B
OUT2
Output
Output
Power
Output Clock 2. Please refer to the Output Drivers section for more details.
Output power supply. Connect to 1.8 to 3.3V. Sets output voltage levels for
OUT2/OUT2B.
VDDO
2
Complementary Output Clock 1. Please refer to the Output Drivers section for more
details.
19
20
21
OUT1B
OUT1
Output
Output
Power
Output Clock 1. Please refer to the Output Drivers section for more details.
Output power supply. Connect to 1.8 to 3.3V. Sets output voltage levels for
OUT1/OUT1B.
VDDO
1
Digital functions power supply pin. Connect to 1.8 to 3.3V. VDDA and VDDD should
have the same voltage applied.
22
VDDD
Power
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5P49V5914 DATASHEET
Number
Name
VDDO
Type
Description
Power supply pin for OUT0_SEL_I2CB. Connect to 1.8 to 3.3V. Sets output voltage
levels for OUT0.
23
0
Power
Latched input/LVCMOS Output. At power up, the voltage at the pin
OUT0_SEL_I2CB is latched by the part and used to select the state of pins 8 and 9.
If a weak pull up (10kohms) is placed on OUT0_SEL_I2CB, pins 8 and 9 will be
configured as hardware select pins, SEL1 and SEL0. If a weak pull down (10Kohms)
is placed on OUT0_SEL_I2CB or it is left floating, pins 8 and 9 will act as the SDA
and SCL pins of an I2C interface. After power up, the pin acts as a LVCMOS
reference output.
Input/
Output
Internal
Pull-down
24
OUT0_SEL_I2CB
GND
ePAD
GND
Connect to ground pad.
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PLL Features and Descriptions
If OUT0_SEL_I2CB was 0 at POR, alternate configurations
can only be loaded via the I2C interface.
Spread Spectrum
To help reduce electromagnetic interference (EMI), the
5P49V5914 supports spread spectrum modulation. The
output clock frequencies can be modulated to spread energy
across a broader range of frequencies, lowering system EMI.
The 5P49V5914 implements spread spectrum using the
Fractional-N output divide, to achieve controllable modulation
rate and spreading magnitude. The Spread spectrum can be
applied to any output clock, any clock frequency, and any
spread amount from ±0.25% to ±2.5% center spread and
-0.5% to -5% down spread.
Table 4: Input Clock Select
Input clock select. Selects the active input reference source in
manual switchover mode.
0 = XIN/REF, XOUT (default)
1 = CLKIN, CLKINB
CLKSEL Polarity can be changed by I C programming as
2
shown in Table 4.
PRIMSRC
CLKSEL
Source
XIN/REF
0
0
1
1
0
1
0
1
Table 2: Loop Filter
PLL loop bandwidth range depends on the input reference
frequency (Fref) and can be set between the loop bandwidth
range as shown in the table below.
CLKIN, CLKINB
CLKIN, CLKINB
XIN/REF
Input Reference
Frequency–Fref
(MHz)
Loop
Bandwidth
Min (kHz)
Loop
Bandwidth
Max (kHz)
PRIMSRC is bit 1 of Register 0x13.
5
40
126
350
300
1000
Table 3: Configuration Table
This table shows the SEL1, SEL0 settings to select the
configuration stored in OTP. Four configurations can be stored
in OTP. These can be factory programmed or user
programmed.
2
OUT0_SEL_I2CB SEL1 SEL0
@ POR
I C
REG0:7 Config
Access
1
1
1
1
0
0
0
1
1
X
0
1
0
1
X
No
No
No
No
Yes
0
0
0
0
1
0
1
2
3
I2C
defaults
0
X
X
Yes
0
0
At power up time, the SEL0 and SEL1 pins must be tied to
either the VDDD/VDDA power supply so that they ramp with
that supply or are tied low (this is the same as floating the
pins). This will cause the register configuration to be loaded
that is selected according to Table 3 above. Providing that
OUT0_SEL_I2CB was 1 at POR and OTP register 0:7=0, after
the first 10mS of operation the levels of the SELx pins can be
changed, either to low or to the same level as VDDD/VDDA.
The SELx pins must be driven with a digital signal of < 300ns
Rise/Fall time and only a single pin can be changed at a time.
After a pin level change, the device must not be interrupted for
at least 1ms so that the new values have time to load and take
effect.
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5P49V5914 DATASHEET
The capacitance at each crystal pin inside the chip starts at
9pF with setting 000000b and can be increased up to 25pF
with setting 111111b. The step per bit is 0.5pF.
Reference Clock Input Pins and
Selection
The 5P49V5914 supports up to two clock inputs. One input
supports a crystal between XIN and XOUT. XIN can also be
driven from a single ended reference clock. XIN can accept
small amplitude signals like from TCXO or one channel of a
differential clock.
You can write the following equation for this capacitance:
Ci = 9pF + 0.5pF × XTAL[5:0]
The PCB where the IC and the crystal will be assembled adds
some stray capacitance to each crystal pin and more
capacitance can be added to each crystal pin with additional
external capacitors.
The second clock input (CLKIN, CLKINB) is a fully differential
input that only accepts a reference clock. The differential input
accepts differential clocks from all the differential logic types
and can also be driven from a single ended clock on one of the
input pins.
The CLKSEL pin selects the input clock between either
XTAL/REF or (CLKIN, CLKINB).
Either clock input can be set as the primary clock. The primary
clock designation is to establish which is the main reference
clock to the PLL. The non-primary clock is designated as the
secondary clock in case the primary clock goes absent and a
backup is needed. See the previous page for more details
about primary versus secondary clock operation.
The two external reference clocks can be manually selected
using the CLKSEL pin. The SM bits must be set to “0x” for
manual switchover which is detailed in Manual Switchover
Mode section.
You can write the following equations for the total capacitance
at each crystal pin:
Crystal Input (XIN/REF)
C
C
= Ci + Cs + Ce
1 1 1
XIN
= Ci + Cs + Ce
XOUT
2
2
2
The crystal used should be a fundamental mode quartz
crystal; overtone crystals should not be used.
Ci and Ci are the internal, tunable capacitors. Cs and Cs
2
1
2
1
are stray capacitances at each crystal pin and typical values
are between 1pF and 3pF.
A crystal manufacturer will calibrate its crystals to the nominal
frequency with a certain load capacitance value. When the
oscillator load capacitance matches the crystal load
capacitance, the oscillation frequency will be accurate. When
the oscillator load capacitance is lower than the crystal load
capacitance, the oscillation frequency will be higher than
nominal and vice versa so for an accurate oscillation
frequency you need to make sure to match the oscillator load
capacitance with the crystal load capacitance.
Ce and Ce are additional external capacitors that can be
1
2
added to increase the crystal load capacitance beyond the
tuning range of the internal capacitors. However, increasing
the load capacitance reduces the oscillator gain so please
consult the factory when adding Ce and/or Ce to avoid
1
2
crystal startup issues. Ce and Ce can also be used to adjust
1
2
for unpredictable stray capacitance in the PCB.
To set the oscillator load capacitance there are two tuning
capacitors in the IC, one at XIN and one at XOUT. They can
be adjusted independently but commonly the same value is
used for both capacitors. The value of each capacitor is
composed of a fixed capacitance amount plus a variable
capacitance amount set with the XTAL[5:0] register.
Adjustment of the crystal tuning capacitors allows for
maximum flexibility to accommodate crystals from various
manufacturers. The range of tuning capacitor values available
are in accordance with the following table.
The final load capacitance of the crystal:
CL = C
× C
/ (C
+ C
)
XIN
XOUT
XIN
XOUT
For most cases it is recommended to set the value for
capacitors the same at each crystal pin:
C
= C
= Cx → CL = Cx / 2
XIN
XOUT
The complete formula when the capacitance at both crystal
pins is the same:
CL = (9pF + 0.5pF × XTAL[5:0] + Cs + Ce) / 2
XTAL[5:0] Tuning Capacitor Characteristics
Parameter
Bits
Step (pF)
Min (pF)
Max (pF)
XTAL
6
0.5
9
25
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Example 1: The crystal load capacitance is specified as 8pF
and the stray capacitance at each crystal pin is Cs=1.5pF.
Assuming equal capacitance value at XIN and XOUT, the
equation is as follows:
8pF = (9pF + 0.5pF × XTAL[5:0] + 1.5pF) / 2 →
0.5pF × XTAL[5:0] = 5.5pF → XTAL[5:0] = 11 (decimal)
Example 2: The crystal load capacitance is specified as 12pF
and the stray capacitance Cs is unknown. Footprints for
external capacitors Ce are added and a worst case Cs of 5pF
is used. For now we use Cs + Ce = 5pF and the right value for
Ce can be determined later to make 5pF together with Cs.
12pF = (9pF + 0.5pF × XTAL[5:0] + 5pF) / 2 →
XTAL[5:0] = 20 (decimal)
Manual Switchover Mode
When SM[1:0] is “0x”, the redundant inputs are in manual
switchover mode. In this mode, CLKSEL pin is used to switch
between the primary and secondary clock sources. The
primary and secondary clock source setting is determined by
the PRIMSRC bit. During the switchover, no glitches will occur
at the output of the device, although there may be frequency
and phase drift, depending on the exact phase and frequency
relationship between the primary and secondary clocks.
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OTP Interface
Table 5: SD/OE Pin Function Truth Table
The 5P49V5914 can also store its configuration in an internal
OTP. The contents of the device's internal programming
registers can be saved to the OTP by setting burn_start
(W114[3]) to high and can be loaded back to the internal
programming registers by setting usr_rd_start(W114[0]) to
high.
SH bit SP bit OSn bit OEn bit SD/OE
OUTn
0
0
0
0
0
0
0
0
0
1
1
1
x
0
1
1
x
x
0
1
Tri-state2
Output active
Output active
Output driven High Low
0
0
0
0
1
1
1
1
0
1
1
1
x
0
1
1
x
x
0
1
Tri-state2
Output active
Output driven High Low
Output active
2
To initiate a save or restore using I C, only two bytes are
transferred. The Device Address is issued with the read/write
bit set to “0”, followed by the appropriate command code. The
save or restore instruction executes after the STOP condition
is issued by the Master, during which time the 5P49V5914 will
not generate Acknowledge bits. The 5P49V5914 will
1
1
1
0
0
0
0
1
1
x
0
1
0
0
0
Tri-state2
Output active
Output active
1
1
1
1
1
1
0
1
1
x
0
1
0
0
0
Tri-state2
acknowledge the instructions after it has completed execution
Output active
Output driven High Low
Output driven High Low 1
2
of them. During that time, the I C bus should be interpreted as
busy by all other users of the bus.
1
x
x
x
1
On power-up of the 5P49V5914, an automatic restore is
performed to load the OTP contents into the internal
programming registers. The 5P49V5914 will be ready to
accept a programming instruction once it acknowledges its
Note 1 : Global Shutdown
Note 2 : Tri-state regardless of OEn bits
2
Output Alignment
7-bit I C address.
2
Each output divider block has a synchronizing POR pulse to
provide startup alignment between outputs. This allows
alignment of outputs for low skew performance. The phase
alignment works both for integer output divider values and for
fractional output divider values.
Availability of Primary and Secondary I C addresses to allow
2
programming for multiple devices in a system. The I C slave
address can be changed from the default 0xD4 to 0xD0 by
programming the I2C_ADDR bit D0. VersaClock 5
2
Programming Guide provides detailed I C programming
guidelines and register map.
Besides the POR at power up, the same synchronization reset
is also triggered when switching between configurations with
the SEL0/1 pins. This ensures that the outputs remain aligned
in every configuration. This reset causes the outputs to
suspend for a few hundred microseconds so the switchover is
not glitch-less. The reset can be disabled for applications
where glitch-less switch over is required and alignment is not
critical.
SD/OE Pin Function
The polarity of the SD/OE signal pin can be programmed to be
either active HIGH or LOW with the SP bit (W16[1]). When SP
is “0” (default), the pin becomes active LOW and when SP is
“1”, the pin becomes active HIGH. The SD/OE pin can be
configured as either to shutdown the PLL or to enable/disable
the outputs. The SH bit controls the configuration of the
SD/OE pin The SH bit needs to be high for SD/OE pin to be
configured as SD.
2
When using I C to reprogram an output divider during
operation, alignment can be lost. Alignment can be restored
2
by manually triggering the reset through I C.
SP
When alignment is required for outputs with different
OUTn
frequencies, the outputs are actually aligned on the falling
edges of each output by default. Rising edge alignment can
also be achieved by utilizing the programmable skew feature
to delay the faster clock by 180 degrees. The programmable
skew feature also allows for fine tuning of the alignment.
SD/OE Input
OEn
Global Shutdown
OSn
SH
For details of register programming, please see VersaClock 5
Family Register Descriptions and Programming Guide for
details.
When configured as SD, device is shut down, differential
outputs are driven High/low, and the single-ended LVCMOS
outputs are driven low. When configured as OE, and outputs
are disabled, the outputs are driven high/low.
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Output Divides
Device Hardware Configuration
Each of the four output divides are comprised of a 12-bit
integer counter, and a 24-bit fractional counter. The output
divide can operate in integer divide only mode for improved
performance, or utilize the fractional counters to generate any
frequency with a synthesis accuracy better than 50ppb.
The 5P49V5914 supports an internal One-Time
Programmable (OTP) memory that can be pre-programmed
at the factory with up to 4 complete device configuration.
These configurations can be over-written using the serial
interface once reset is complete. Any configuration written via
the programming interface needs to be re-written after any
power cycle or reset. Please contact IDT if a specific
factory-programmed configuration is desired.
The Output Divide also has the capability to apply a spread
modulation to the output frequency. Independent of output
frequency, a triangle wave modulation between 30 and 63kHz
may be generated.
Device Start-up & Reset Behavior
Output Skew
The 5P49V5914 has an internal power-up reset (POR) circuit.
The POR circuit will remain active for a maximum of 10ms
after device power-up.
For outputs that share a common output divide value, there
will be the ability to skew outputs by quadrature values to
minimize interaction on the PCB. The skew on each output
can be adjusted from 0 to 360 degrees. Skew is adjusted in
units equal to 1/32 of the VCO period. So, for 100 MHz output
and a 2800 MHz VCO, you can select how many 11.161pS
units you want added to your skew (resulting in units of 0.402
degrees). For example, 0, 0.402, 0.804, 1.206, 1.408, and so
on. The granularity of the skew adjustment is always
Upon internal POR circuit expiring, the device will exit reset
and begin self-configuration.
The device will load internal registers according toTable 3.
Once the full configuration has been loaded, the device will
respond to accesses on the serial port and will attempt to lock
the PLL to the selected source and begin operation.
dependent on the VCO period and the output period.
Power Up Ramp Sequence
Output Drivers
VDDA and VDDD must ramp up together. VDDO0~3 must
ramp up before, or concurrently with, VDDA and VDDD. All
power supply pins must be connected to a power rail even if
the output is unused. All power supplies must ramp in a linear
fashion and ramp monotonically.
The LVCMOS clock outputs are provided with
register-controlled output drivers. By selecting the output drive
type in the appropriate register, any of these outputs can
support LVCMOS logic levels
The operating voltage ranges of each output is determined by
its independent output power pin (V
) and thus each can
DDO
have different output voltage levels. Output voltage levels of
2.5V or 3.3V are supported for differential HCSL, LVPECL
operation, and 1. 8V, 2.5V, or 3.3V are supported for LVCMOS
and differential LVDS operation.
VDDO0~3
Each output may be enabled or disabled by register bits.
When disabled an output will be in a logic 0 state as
determined by the programming bit table shown on page 6.
VDDA
VDDD
LVCMOS Operation
When a given output is configured to provide LVCMOS levels,
then both the OUTx and OUTxB outputs will toggle at the
selected output frequency. All the previously described
configuration and control apply equally to both outputs.
Frequency, phase alignment, voltage levels and enable /
disable status apply to both the OUTx and OUTxB pins. The
OUTx and OUTxB outputs can be selected to be
phase-aligned with each other or inverted relative to one
another by register programming bits. Selection of
phase-alignment may have negative effects on the phase
noise performance of any part of the device due to increased
simultaneous switching noise within the device.
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2
I C Mode Operation
2
The device acts as a slave device on the I C bus using one of
2
the two I C addresses (0xD0 or 0xD4) to allow multiple
devices to be used in the system. The interface accepts
byte-oriented block write and block read operations. Two
address bytes specify the register address of the byte position
of the first register to write or read. Data bytes (registers) are
accessed in sequential order from the lowest to the highest
byte (most significant bit first). Read and write block transfers
can be stopped after any complete byte transfer. During a
write operation, data will not be moved into the registers until
the STOP bit is received, at which point, all data received in
the block write will be written simultaneously.
2
For full electrical I C compliance, it is recommended to use
external pull-up resistors for SDATA and SCLK. The internal
pull-down resistors have a size of 100k typical.
Current Read
S
Dev Addr + R
A
A
A
Data 0
A
Data 1
A
A
Data n
Data 0
A
Abar
A
P
Sequential Read
S
Dev Addr + W
Reg start Addr
Reg start Addr
A
A
Sr
Dev Addr + R
A
Data 1
A
A
Data n
Abar
P
Sequential Write
S
Dev Addr + W
Data 0
A
Data 1
A
Data n
A
P
S = start
from master to slave
from slave to master
Sr = repeated start
A = acknowledge
Abar= none acknowledge
P = stop
I2C Slave Read and Write Cycle Sequencing
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Table 6:I2C Bus DC Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
2
Input HIGH Level
For SEL1/SDA pin and
SEL0/SCL pin.
V
0.7xV
5.5
V
IH
DDD
Input LOW Level
For SEL1/SDA pin and
SEL0/SCL pin.
V
GND-0.3
0.3xV
V
IL
DDD
Hysteresis of Inputs
Input Leakage Current
Output LOW Voltage
V
0.05xV
-1
V
µA
V
HYS
DDD
I
30
IN
IOL = 3 mA
V
0.4
OL
Table 7:I2C Bus AC Characteristics
Symbol
Parameter
Min
10
Typ
Max
Unit
kHz
µs
Serial Clock Frequency (SCL)
F
400
SCLK
Bus free time between STOP and START
Setup Time, START
t
1.3
0.6
0.6
0.1
0
BUF
t
µs
SU:START
HD:START
Hold Time, START
t
µs
Setup Time, data input (SDA)
Hold Time, data input (SDA) 1
Output data valid from clock
Capacitive Load for Each Bus Line
Rise Time, data and clock (SDA, SCL)
Fall Time, data and clock (SDA, SCL)
HIGH Time, clock (SCL)
t
µs
SU:DATA
t
µs
HD:DATA
t
0.9
400
300
300
µs
OVD
C
pF
ns
B
t
20 + 0.1xC
R
B
B
t
20 + 0.1xC
ns
F
t
0.6
1.3
0.6
µs
HIGH
LOW Time, clock (SCL)
t
µs
LOW
Setup Time, STOP
t
µs
SU:STOP
Note 1: A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH(MIN) of the SCL signal) to bridge
the undefined region of the falling edge of SCL.
Note 2: I2C inputs are 5V tolerant.
MARCH 3, 2017
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PROGRAMMABLE CLOCK GENERATOR
5P49V5914 DATASHEET
Table 8:Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the 5P49V5914. These ratings, which are standard values for IDT
commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect
product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range.
Item
Rating
Supply Voltage, VDDA, VDDD, VDDO
3.465V
Inputs
XIN/REF
CLKIN, CLKINB
Other inputs
0V to 1.2V voltage swing
0V to 1.2V voltage swing single-ended
-0.5V to VDDD
Outputs, VDDO (LVCMOS)
Outputs, IO (SDA)
-0.5V to VDDO+ 0.5V
10mA
Package Thermal Impedance, JA
Package Thermal Impedance, JC
Storage Temperature, TSTG
ESD Human Body Model
Junction Temperature
42C/W (0 mps)
41.8C/W (0 mps)
-65C to 150C
2000V
125°C
Table 9:Recommended Operation Conditions
Symbol
Parameter
Min
1.71
Typ
1.8
2.5
3.3
Max
1.89
Unit
V
Power supply voltage for supporting 1.8V outputs
Power supply voltage for supporting 2.5V outputs
Power supply voltage for supporting 3.3V outputs
Power supply voltage for core logic functions
V
V
V
DDOX
DDOX
DDOX
2.375
3.135
1.71
2.625
3.465
3.465
3.465
V
V
V
V
DDD
DDA
Analog power supply voltage. Use filtered analog power
supply.
V
1.71
V
Operating temperature, ambient
T
-40
+85
15
°C
pF
A
Maximum load capacitance (3.3V LVCMOS only)
External reference crystal
C
LOAD_OUT
F
1
5
40
MHz
IN
External reference clock CLKIN, CLKINB
350
5
Power up time for all VDDs to reach minimum specified
voltage (power ramps must be monotonic)
t
0.05
ms
PU
Note: VDDO1, VDDO2, and VDDO3, must be powered on either before or simultaneously with VDDD, VDDA and VDDO0.
PROGRAMMABLE CLOCK GENERATOR
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Table 10:Input Capacitance, LVCMOS Output Impedance, and Internal Pull-down
Resistance (T = +25 °C)
A
Symbol
Parameter
Min
Typ
Max Unit
Input Capacitance (CLKIN, CLKINB, CLKSEL, SD/OE, SEL1/SDA,
SEL0/SCL)
C
3
7
pF
IN
CLKSEL, SD/OE, SEL1/SDA, SEL0/SCL, CLKIN, CLKINB,
OUT0_SEL_I2CB
Pull-down
Resistor
100
300
k
LVCMOS Output Driver Impedance (VDDO = 1.8V, 2.5V, 3.3V)
Programmable input capacitance at XIN/REF
R
17
OUT
XIN/REF
XOUT
0
0
8
8
pF
pF
Programmable input capacitance at XOUT
Table 11:Crystal Characteristics
Parameter
Test Conditions
Minimum
Typical Maximum
Units
Mode of Oscillation
Frequency
Fundamental
25
8
40
100
7
MHz
Ω
pF
Equivalent Series Resistance (ESR)
Shunt Capacitance
10
Load Capacitance (CL) @ <=25 MHz
Load Capacitance (CL) >25M to 40M
Maximum Crystal Drive Level
6
6
8
12
8
100
pF
pF
µW
Note: Typical crystal used is FOX 603-25-150. For different reference crystal options please go to www.foxonline.com.
Table 12:DC Electrical Characteristics
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
100 MHz on all outputs, 25 MHz
REFCLK
Iddcore3
Core Supply Current
30
42
37
18
17
16
29
28
16
14
12
36
27
16
10
34
47
42
21
20
19
33
33
18
16
13
42
32
19
14
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
µA
LVPECL, 350 MHz, 3.3V VDDOx
LVPECL, 350 MHz, 2.5V VDDOx
LVDS, 350 MHz, 3.3V VDDOx
LVDS, 350 MHz, 2.5V VDDOx
LVDS, 350 MHz, 1.8V VDDOx
HCSL, 250 MHz, 3.3V VDDOx, 2 pF load
HCSL, 250 MHz, 2.5V VDDOx, 2 pF load
Iddox
Output Buffer Supply Current
1,2
LVCMOS, 50 MHz, 3.3V, VDDOx
1,2
LVCMOS, 50 MHz, 2.5V, VDDOx
1,2
LVCMOS, 50 MHz, 1.8V, VDDOx
LVCMOS, 200 MHz, 3.3V VDDOx1
LVCMOS, 200 MHz, 2.5V VDDOx1,2
LVCMOS, 200 MHz, 1.8V VDDOx1,2
SD asserted, I2C Programming
Iddpd
Power Down Current
1. Single CMOS driver active.
2. Measured into a 5” 50 Ohm trace with 2 pF load.
3. Iddcore = IddA+ IddD, no loads.
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5P49V5914 DATASHEET
Table 13:Electrical Characteristics – Differential Clock Input Parameters 1,2 (Supply
Voltage V
, V
, V
0 = 3.3V ±5%, 2.5V ±5%, 1.8V ±5%, TA = -40°C to +85°C)
DDO
DDA
DDD
Symbol
Parameter
Test Conditions
Min
0.55
Typ
Max
1.7
0.4
1200
8
Unit
V
Input HIGH Voltage–CLKIN, CLKINB
Input LOW Voltage–CLKIN, CLKINB
Input Amplitude - CLKIN, CLKINB
Input Slew Rate - CLKIN, CLKINB
Input Leakage Low Current
Single-ended input
V
IH
Single-ended input
Peak to Peak value, single-ended
Measured differentially
VIN = GND
V
GND - 0.3
200
V
IL
SWING
V
mV
V/ns
µA
µA
%
dv/dt
0.4
I
-5
5
IL
Input Leakage High Current
Input Duty Cycle
VIN = 1.7V
I
20
IH
Measurement from differential
waveform
d
45
55
TIN
1. Guaranteed by design and characterization, not 100% tested in production.
2. Slew rate measured through ±75mV window centered around differential zero.
1
Table 14:DC Electrical Characteristics for 3.3V LVCMOS (V
= 3.3V±5%, TA = -40°C to +85°C)
DDO
Symbol
VOH
VOL
IOZDD
IOZDD
VIH
Parameter
Test Conditions
Min
Typ
Max
Unit
V
IOH = -15mA
Output HIGH Voltage
Output LOW Voltage
Output Leakage Current (OUT1~3)
Output Leakage Current (OUT0)
Input HIGH Voltage
2.4
VDDO
IOL = 15mA
0.4
V
Tri-state outputs, VDDO = 3.465V
Tri-state outputs, VDDO = 2.625V
Single-ended inputs - CLKSEL, SD/OE
Single-ended inputs - CLKSEL, SD/OE
Single-ended input OUT0_SEL_I2CB
Single-ended input OUT0_SEL_I2CB
Single-ended input - XIN/REF
Single-ended input - XIN/REF
CLKSEL, SD/OE, SEL1/SDA, SEL0/SCL
5
30
µA
µA
V
0.7xVDDD
GND - 0.3
2
VDDD + 0.3
0.3xVDDD
VDDO0 + 0.3
0.4
VIL
Input LOW Voltage
V
VIH
Input HIGH Voltage
V
VIL
Input LOW Voltage
GND - 0.3
0.8
V
VIH
Input HIGH Voltage
1.2
V
VIL
Input LOW Voltage
GND - 0.3
0.4
V
TR/TF
Input Rise/Fall Time
300
ns
1. See “Recommended Operating Conditions” table.
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Table 15:DC Electrical Characteristics for 2.5V LVCMOS (V
= 2.5V±5%, TA = -40°C to +85°C)
DDO
Symbol
VOH
VOL
IOZDD
IOZDD
VIH
Parameter
Test Conditions
Min
Typ
Max
Unit
V
IOH = -12mA
Output HIGH Voltage
Output LOW Voltage
Output Leakage Current (OUT1~3)
Output Leakage Current (OUT0)
Input HIGH Voltage
0.7xVDDO
IOL = 12mA
0.4
V
Tri-state outputs, VDDO = 2.625V
Tri-state outputs, VDDO = 2.625V
Single-ended inputs - CLKSEL, SD/OE
Single-ended inputs - CLKSEL, SD/OE
Single-ended input OUT0_SEL_I2CB
Single-ended input OUT0_SEL_I2CB
Single-ended input - XIN/REF
Single-ended input - XIN/REF
CLKSEL, SD/OE, SEL1/SDA, SEL0/SCL
5
30
µA
µA
V
0.7xVDDD
GND - 0.3
1.7
VDDD + 0.3
0.3xVDDD
VDDO0 + 0.3
0.4
VIL
Input LOW Voltage
V
VIH
Input HIGH Voltage
V
VIL
Input LOW Voltage
GND - 0.3
0.8
V
VIH
Input HIGH Voltage
1.2
V
VIL
Input LOW Voltage
GND - 0.3
0.4
V
TR/TF
Input Rise/Fall Time
300
ns
Table 16:DC Electrical Characteristics for 1.8V LVCMOS (V
= 1.8V±5%, TA = -40°C to +85°C)
DDO
Symbol
VOH
VOL
IOZDD
IOZDD
VIH
Parameter
Test Conditions
Min
Typ
Max
Unit
V
IOH = -8mA
Output HIGH Voltage
Output LOW Voltage
Output Leakage Current (OUT1~3)
Output Leakage Current (OUT0)
Input HIGH Voltage
0.7 xVDDO
VDDO
IOL = 8mA
0.25 x VDDO
V
Tri-state outputs, VDDO = 3.465V
Tri-state outputs, VDDO = 2.625V
Single-ended inputs - CLKSEL, SD/OE
Single-ended inputs - CLKSEL, SD/OE
Single-ended input OUT0_SEL_I2CB
Single-ended input OUT0_SEL_I2CB
Single-ended input - XIN/REF
Single-ended input - XIN/REF
CLKSEL, SD/OE, SEL1/SDA, SEL0/SCL
5
30
µA
µA
V
0.7 * VDDD
GND - 0.3
0.65 * VDDO0
GND - 0.3
0.8
VDDD + 0.3
0.3 * VDDD
VDDO0 + 0.3
0.4
VIL
Input LOW Voltage
V
VIH
Input HIGH Voltage
V
VIL
Input LOW Voltage
V
VIH
Input HIGH Voltage
1.2
V
VIL
Input LOW Voltage
GND - 0.3
0.4
V
TR/TF
Input Rise/Fall Time
300
ns
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PROGRAMMABLE CLOCK GENERATOR
5P49V5914 DATASHEET
Table 17:DC Electrical Characteristics for LVDS(V
= 3.3V+5% or 2.5V+5%, TA = -40°C to +85°C)
DDO
Symbol
Parameter
Min
247
Typ
Max
454
-454
50
Unit
mV
mV
mV
V
Differential Output Voltage for the TRUE binary state
Differential Output Voltage for the FALSE binary state
Change in VOT between Complimentary Output States
Output Common Mode Voltage (Offset Voltage)
V
(+)
(-)
OT
V
-247
OT
V
OT
V
1.125
1.25
1.375
50
OS
Change in VOS between Complimentary Output States
Outputs Short Circuit Current, VOUT+ or VOUT - = 0V or VDDO
V
mV
mA
mA
OS
I
9
6
24
OS
Differential Outputs Short Circuit Current, VOUT+ = VOUT
-
I
12
OSD
Table 18:DC Electrical Characteristics for LVDS (V
= 1.8V+5%, TA = -40°C to +85°C)
DDO
Symbol
Parameter
Min
247
Typ
Max
454
-454
50
Unit
mV
mV
mV
V
Differential Output Voltage for the TRUE binary state
Differential Output Voltage for the FALSE binary state
Change in VOT between Complimentary Output States
Output Common Mode Voltage (Offset Voltage)
V
(+)
(-)
OT
V
-247
OT
V
OT
V
0.8
0.875
0.95
50
OS
Change in VOS between Complimentary Output States
Outputs Short Circuit Current, VOUT+ or VOUT - = 0V or VDDO
V
mV
mA
mA
OS
I
9
6
24
OS
Differential Outputs Short Circuit Current, VOUT+ = VOUT
-
I
12
OSD
Table 19:DC Electrical Characteristics for LVPECL (V
= 3.3V+5% or 2.5V+5%, TA = -40°C to
DDO
+85°C)
Symbol
Parameter
Min
Typ
Max
Unit
V
Output Voltage HIGH, terminated through 50 tied to VDD - 2 V
Output Voltage LOW, terminated through 50 tied to VDD - 2 V
Peak-to-Peak Output Voltage Swing
V
V
V
- 1.19
- 1.94
V
- 0.69
DDO
OH
DDO
DDO
V
V
- 1.4
DDO
V
OL
V
0.55
0.993
V
SWING
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Table 20:Electrical Characteristics – DIF 0.7V HCSL Differential Outputs (V
= 3.3V±5%,
DDO
2.5V±5%, TA = -40°C to +85°C)
Symbol
Parameter
Slew Rate
Slew Rate
Conditions
Min
Typ
Max
4
Units
V/ns
Notes
1,2,3
1,2,3
dV/dt
Scope averaging on
1
dV/dt
Δ
Scope averaging on
20
%
Statistical measurement on single-ended
signal using oscilloscope math function
(Scope averaging ON)
VHIGH
VLOW
VMAX
VMIN
Voltage High
660
850
150
mV
mV
mV
mV
mV
mV
mV
1,6,7
1,6
1
Voltage Low
-150
Maximum Voltage
Minimum Voltage
1150
Measurement on single-ended signal using
absolute value (Scope averaging off)
Scope averaging off
-300
300
250
1
VSWING Voltage Swing
1,2,6
1,4,6
1,5
Scope averaging off
Scope averaging off
VCROSS Crossing Voltage Value
?VCROSS Crossing Voltage variation
550
140
Note 1: Guaranteed by design and characterization. Not 100% tested in production
Note 2: Measured from differential waveform.
Note 3: Slew rate is measured through the VSWING voltage range centered around differential 0V. This results in a +/-150mV window around differntial
0V.
Note 4: VCROSS is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising edge (i.e.
Clock rising and Clock# falling).
Note 5: the total variation of all VCROSS measurements in any particular system. Note that this is a subset of VCROSS min/max (VCROSS absolute)
allowed. The intent is to limit VCROSS induced modulation by setting ?VCROSS to be smaller than VCROSS absolute.
Note 6: Measured from single-ended waveform.
Note 7. Measured with scope averaging off, using statistics function. Variation is difference between min. and max.
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Table 21:1AC Timing Electrical Characteristics
(VDDO = 3.3V+5% or 2.5V+5% or 1.8V ±5%, TA = -40°C to +85°C)
(Spread Spectrum Generation = OFF)
Symbol
Min.
Typ.
Max.
40
Units
MHz
MHz
MHz
Parameter
Test Conditions
8
1
1
1
Input frequency limit (XIN)
Input frequency limit (REF)
Input frequency limit (CLKIN, CLKINB)
fIN 1
Input Frequency
200
350
200
Single ended clock output limit (LVCMOS)
Differential clock output limit (LVPECL/
LVDS/HCSL)
fOUT
Output Frequency
MHz
1
350
fVCO
fPFD
fBW
t2
VCO Frequency
PFD Frequency
Loop Bandwidth
Input Duty Cycle
2500
1 1
2900
150
0.9
MHz
MHz
MHz
%
VCO operating frequency range
PFD operating frequency range
Input frequency = 25MHz
0.06
45
55
Duty Cycle
Measured at VDD/2, all outputs except
Reference output OUT0, VDDOX= 2.5V or
3.3V
Measured at VDD/2, all outputs except
Reference output OUT0, VDDOX=1.8V
Measured at VDD/2, Reference output
OUT0 (5MHz - 120MHz) with 50% duty
cycle input
45
40
40
50
50
50
55
60
60
%
%
%
t3 5
Output Duty Cycle
Measured at VDD/2, Reference output
OUT0 (150.1MHz - 200MHz) with 50% duty
cycle input
30
50
70
%
Slew Rate, SLEW[1:0] = 00
Slew Rate, SLEW[1:0] = 01
Slew Rate, SLEW[1:0] = 10
Slew Rate, SLEW[1:0] = 11
Slew Rate, SLEW[1:0] = 00
Slew Rate, SLEW[1:0] = 01
Slew Rate, SLEW[1:0] = 10
Slew Rate, SLEW[1:0] = 11
Slew Rate, SLEW[1:0] = 00
Slew Rate, SLEW[1:0] = 01
Slew Rate, SLEW[1:0] = 10
Slew Rate, SLEW[1:0] = 11
Rise Times
2.2
2.3
2.4
2.7
1.3
1.4
1.4
1.7
0.7
0.8
0.9
1.2
300
300
400
400
1.0
1.2
1.3
1.7
0.6
0.7
0.6
1.0
0.3
0.4
0.4
0.7
Single-ended 3.3V LVCMOS output clock
rise and fall time, 20% to 80% of VDDO
(Output Load = 5 pF) VDDOX=3.3V
Single-ended 2.5V LVCMOS output clock
rise and fall time, 20% to 80% of VDDO
(Output Load = 5 pF) VDDOX=2.5V
t4 2
V/ns
Single-ended 1.8V LVCMOS output clock
rise and fall time, 20% to 80% of VDDO
(Output Load = 5 pF) VDDOX=1.8V
LVDS, 20% to 80%
LVDS, 80% to 20%
LVPECL, 20% to 80%
LVPECL, 80% to 20%
Fall Times
t5
ps
Rise Times
Fall Times
PROGRAMMABLE CLOCK GENERATOR
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MARCH 3, 2017
5P49V5914 DATASHEET
Cycle-to-Cycle jitter (Peak-to-Peak),
multiple output frequencies switching,
differential outputs (1.8V to 3.3V nominal
output voltage)
OUT0=25MHz
OUT1=100MHz
46
ps
ps
ps
OUT2=125MHz
OUT3=156.25MHz
Cycle-to-Cycle jitter (Peak-to-Peak),
multiple output frequencies switching,
LVCMOS outputs (1.8 to 3.3V nominal
output voltage)
OUT0=25MHz
OUT1=100MHz
74
OUT2=125MHz
OUT3=156.25MHz
t6
Clock Jitter
RMS Phase Jitter (12kHz to 5MHz
integration range) reference clock (OUT0),
25 MHz LVCMOS outputs (1.8 to 3.3V
nominal output voltage).
OUT0=25MHz
0.5
OUT1=100MHz
OUT2=125MHz
OUT3=156.25MHz
RMS Phase Jitter (12kHz to 20MHz
integration range) differential output, VDDO
= 3.465V, 25MHz crystal, 156.25MHz
output frequency
OUT0=25MHz
OUT1=100MHz
0.75
75
1.5
ps
ps
OUT2=125MHz
OUT3=156.25MHz
Skew between the same frequencies, with
outputs using the same driver format and
phase delay set to 0 ns.
t7
Output Skew
PLL lock time from power-up, measured
after all VDD's have raised above 90% of
their target value.
t8 3
t9 4
10
2
ms
ms
Startup Time
Startup Time
PLL lock time from shutdown mode
1. Practical lower frequency is determined by loop filter settings.
2. A slew rate of 2.75V/ns or greater should be selected for output frequencies of 100MHz or higher.
3. Includes loading the configuration bits from EPROMto PLL registers. It does not include EPROMprogramming/write time.
4. Actual PLL lock time depends on the loop configuration.
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Table 22:PCI Express Jitter Specifications (V
= 3.3V+5% or 2.5V+5%, T = -40°C to +85°C)
DDO
A
Symbol
Parameter
Conditions
Min Typ Max PCIe Industry Units Notes
Specification
tJ
ƒ = 100MHz, 25MHz Crystal Input
Evaluation Band: 0Hz - Nyquist
(clock frequency/2)
30
86
ps
1,4
Phase Jitter
Peak-to-Peak
(PCIe Gen1)
tREFCLK_HF_RMS
(PCIe Gen2)
ƒ = 100MHz, 25MHz Crystal Input
Phase Jitter RMS High Band: 1.5MHz - Nyquist (clock
frequency/2)
2.56
3.10
ps
2,4
tREFCLK_LF_RMS
(PCIe Gen2)
ƒ = 100MHz, 25MHz Crystal Input
Phase Jitter RMS
0.27
0.8
3.0
1.0
ps
ps
2,4
3,4
Low Band: 10kHz - 1.5MHz
tREFCLK_RMS
(PCIe Gen3)
ƒ = 100MHz, 25MHz Crystal Input
Phase Jitter RMS
Evaluation Band: 0Hz - Nyquist
(clock frequency/2)
Note: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal
equilibrium has been reached under these conditions.
1. Peak-to-Peak jitter after applying system transfer function for the Common Clock Architecture. Maximum limit for PCI Express Gen 1.
2. RMS jitter after applying the two evaluation bands to the two transfer functions defined in the Common Clock Architecture and reporting the
worst case results for each evaluation band. Maximum limit for PCI Express Generation 2 is 3.1ps RMS for tREFCLK_HF_RMS (High Band)
and 3.0ps RMS for tREFCLK_LF_RMS (Low Band).
3. RMS jitter after applying system transfer function for the common clock architecture. This specification is based on the
PCI_Express_Base_r3.0 10 Nov, 2010 specification, and is subject to change pending the final release version of the specification.
4. This parameter is guaranteed by characterization. Not tested in production.
Table 23:Jitter Specifications 1,2,3
Parameter
Symbol
Test Condition
Crystal in = 25 MHz, All CLKn at 125 MHz5
Crystal in = 25 MHz, All CLKn at 125 MHz5
CLKIN = 19.44 MHz, All CLKn at 155.52 MHz5
Total Jitter6
RMS Jitter6, 10 kHz to 1.5MHz
RMS Jitter6, 1.5MHz to 50MHz
RMS Jitter6
Min
Typ
0.79
0.32
0.69
9.1
Max
0.95
0.5
Unit
ps
GbE Random Jitter (12 kHz–20 MHz)4
GbE Random Jitter (1.875–20 MHz)
OC-12 Random Jitter (12 kHz–5 MHz)
PCI Express 1.1 Common Clocked
-
-
-
-
-
-
-
JGbE
RJGbE
JOC12
ps
0.95
12
ps
ps
0.1
0.3
ps
PCI Express 2.1 Common Clocked
PCI Express 3.0 Common Clocked
0.9
1.1
ps
0.2
0.4
ps
Notes:
1 All measurements w ith Spread Spectrum Off.
2 For best jitter performance, keep the single ended clock input slew rates at more than 1.0 V/ns and the differential clock input slew rates more than 0.3 V/ns.
3 All jitter data in this table is based upon all output formats being differential. When single-ended outputs are used, there is the potential that the output jitter may increase
due to the nature of single-ended outputs. If your configuration implements any single-ended output and any output is required to have jitter less than 3 ps rms, contact
IDT for support to validate your configuration and ensure the best jitter performance. In many configurations, CMOS outputs have little to no effect upon jitter.
4 DJ for PCI and GbEis < 5 ps pp.
5 Output FOD in Integer mode.
6 All output clocks 100 MHz HCSL format. Jitter is from the PCIEjitter filter combination that produces the highest jitter. Jitter is measured w ith the Intel Clock Jitter Tool,
Ver. 1.6.6.
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5P49V5914 DATASHEET
Table 24:Spread Spectrum Generation Specifications
Symbol
Parameter
Output Frequency
Mod Frequency
Spread Value
Description
Min Typ Max
Unit
MHz
kHz
Output Frequency Range
Modulation Frequency
f
5
300
OUT
f
30 to 63
MOD
Amount of Spread Value (programmable) - Center Spread
Amount of Spread Value (programmable) - Down Spread
f
±0.25% to ±2.5%
-0.5% to -5%
%f
OUT
SPREAD
Test Circuits and Loads
VDDOx
VDDD
VDDA
OUTx
CLKOUT
0.1µF
0.1µF
0.1µF
CL
GND
HCSL Differential Output Test Load
Zo=100ohm differential
33
2pF
2pF
33
50
50
HCSL Output
Test Circuits and Loads for Outputs
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Typical Phase Noise at 100MHz (3.3V, 25°C)
NOTE: All outputs operational at 100MHz, Phase Noise Plot with Spurs On.
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5P49V5914 Applications Schematic
2
2
1
1
2
1
1
1
2
2
E P A D
3 3
E P A D
3 2
1
1
1
1
2
2
2
2
1
1
2
2
E P A D
3 1
E P A D
3 0
E P A D
2 9
E P A D
2 8
E P A D
2 7
E P A D
2 6
E P A D
2 5
1
2
2
2
1
1
1
2
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5P49V5914 DATASHEET
Overdriving the XIN/REF Interface
LVCMOS Driver
The XIN/REF input can be overdriven by an LVCMOS driver
or by one side of a differential driver through an AC coupling
capacitor. The XOUT pin can be left floating. The amplitude of
the input signal should be between 500mV and 1.2V and the
slew rate should not be less than 0.2V/ns. Figure General
Diagram for LVCMOS Driver to XTALInput Interface shows an
example of the interface diagram for a LVCMOS driver.
This configuration has three properties; the total output
impedance of Ro and Rs matches the 50 ohm transmission
line impedance, the Vrx voltage is generated at the CLKIN
inputs which maintains the LVCMOS driver voltage level
across the transmission line for best S/N and the R1-R2
voltage divider values ensure that the clock level at XIN is less
than the maximum value of 1.2V.
VDD
XOUT
C3
Ro
Rs
Zo = 50 Ohm
R1
V_XIN
XIN / REF
Ro + Rs
LVCMOS
=
50 ohms
0. 1 uF
R2
General Diagram for LVCMOS Driver to XTAL Input Interface
Table 25 Nominal Voltage Divider Values vs LVCMOS VDD for
XIN shows resistor values that ensure the maximum drive
level for the XIN/REF port is not exceeded for all combinations
of 5% tolerance on the driver VDD, the VersaClock VDDAand
5% resistor tolerances. The values of the resistors can be
adjusted to reduce the loading for slower and weaker
LVCMOS driver by increasing the voltage divider attenuation
as long as the minimum drive level is maintained over all
tolerances. To assist this assessment, the total load on the
driver is included in the table.
Table 25: Nominal Voltage Divider Values vs LVCMOS VDD for XIN
LVCMOS Driver VDD
Ro+Rs
50.0
R1
130
100
62
R2
75
V_XIN (peak) Ro+Rs+R1+R2
3.3
2.5
1.8
0.97
1.00
0.97
255
250
242
50.0
100
130
50.0
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5P49V5914 DATASHEET
LVPECL Driver
Figure General Diagram for LVPECL Driver to XTAL Input
Interface shows an example of the interface diagram for a
+3.3V LVPECL driver. This is a standard LVPECL termination
with one side of the driver feeding the XIN/REF input. It is
recommended that all components in the schematics be
placed in the layout; though some components might not be
used, they can be utilized for debugging purposes. The
datasheet specifications are characterized and guaranteed by
using a quartz crystal as the input. If the driver is 2.5V
LVPECL, the only change necessary is to use the appropriate
value of R3.
XOUT
C1
Zo = 50 Ohm
XIN / REF
0. 1 uF
Zo = 50 Ohm
R1
50
R2
50
+3.3V LVPECL Dr iv er
R3
50
General Diagram for +3.3V LVPECL Driver to XTAL Input Interface
CLKIN Equivalent Schematic
Figure CLKIN Equivalent Schematic below shows the basis of
the requirements on VIH max, VIL min and the 1200 mV p-p
single ended Vswing maximum.
• The CLKIN and CLKINB Vih max spec comes from the
cathode voltage on the input ESD diodes D2 and D4, which
are referenced to the internal 1.2V supply. CLKIN or
CLKINB voltages greater than 1.2V + 0.5V =1.7V will be
clamped by these diodes. CLKIN and CLKINB input
voltages less than -0.3V will be clamped by diodes D1 and
D3.
• The 1.2V p-p maximum Vswing input requirement is
determined by the internally regulated 1.2V supply for the
actual clock receiver. This is the basis of the Vswing spec in
Table 13.
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CLKIN Equivalent Schematic
Wiring the Differential Input to Accept Single-Ended Levels
Figure Recommended Schematic for Wiring a Differential
Input to Accept Single-ended Levels shows how a differential
input can be wired to accept single ended levels. This
configuration has three properties; the total output impedance
of Ro and Rs matches the 50 ohm transmission line
impedance, the Vrx voltage is generated at the CLKIN inputs
which maintains the LVCMOS driver voltage level across the
transmission line for best S/N and the R1-R2 voltage divider
values ensure that Vrx p-p at CLKIN is less than the maximum
value of 1.2V.
VDD
Ro
Rs
Zo = 50 Ohm
R1
Vrx
CLKIN
Ro + Rs = 50
LVCMOS
CLKINB
R2
VersaClock 5 Receiver
Recommended Schematic for Wiring a Differential Input to Accept Single-ended Levels
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Table 26 Nominal Voltage Divider Values vs Driver VDD
shows resistor values that ensure the maximum drive level for
the CLKIN port is not exceeded for all combinations of 5%
tolerance on the driver VDD, the VersaClock Vddo_0 and 5%
resistor tolerances. The values of the resistors can be
adjusted to reduce the loading for slower and weaker
LVCMOS driver by increasing the impedance of the R1-R2
divider. To assist this assessment, the total load on the driver
is included in the table.
Table 26: Nominal Voltage Divider Values vs Driver VDD
LVCMOS Driver VDD
Ro+Rs
50.0
R1
130
100
62
R2
75
Vrx (peak) Ro+Rs+R1+R2
3.3
2.5
1.8
0.97
1.00
0.97
255
250
242
50.0
100
130
50.0
HCSL Differential Clock Input Interface
CLKIN/CLKINB will accept DC coupled HCSL signals.
Zo=50ohm
Q
CLKIN
Zo=50ohm
nQ
CLKINB
VersaClock 5 Receiver
CLKIN, CLKINB Input Driven by an HCSL Driver
3.3V Differential LVPECL Clock Input Interface
The logic levels of 3.3V LVPECL and LVDS can exceed VIH
max for the CLKIN/B pins. Therefore the LVPECL levels must
be AC coupled to the VersaClock differential input and the DC
bias restored with external voltage dividers. A single table of
bias resistor values is provided below for both for 3.3V
LVPECL and LVDS. Vbias can be VDDD, V or any other
available voltage at the VersaClock receiver that is most
conveniently accessible in layout.
DDOX
Vbias
Rpu1
Rpu2
C5
0.01µF
Zo=50ohm
Zo=50ohm
CLKIN
C6
0.01µF
CLKINB
R9
50ohm
R10
50ohm
+3.3V LVPECL
Driver
VersaClock 5 Receiver
R13
4.7kohm
R15
4.7kohm
RTT
50ohm
CLKIN, CLKINB Input Driven by a 3.3V LVPECL Driver
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5P49V5914 DATASHEET
Vbias
Rpu1
Rpu2
C1
0.1µF
Zo=50ohm
CLKIN
C2
0.1µF
Rterm
100ohm
Zo=50ohm
CLKINB
VersaClock 5 Receiver
LVDS Driver
R2
4.7kohm
R1
4.7kohm
CLKIN, CLKINB Input Driven by an LVDS Driver
Table 27: Bias Resistors for 3.3V LVPECL and LVDS Drive to CLKIN/B
Vbias
(V)
Rpu1/2
(kohm)
CLKIN/B Bias Voltage
(V)
3.3
2.5
1.8
22
15
10
0.58
0.60
0.58
2.5V Differential LVPECL Clock Input Interface
The maximum DC 2.5V LVPECL voltage meets the VIH max
CLKIN requirement. Therefore 2.5V LVPECL can be
connected directly to the CLKIN terminals without AC coupling
Zo=50ohm
CLKIN
Zo=50ohm
CLKINB
+2.5V LVPECL
Driver
Versaclock 5 Receiver
R1
50ohm
R2
50ohm
RTT
18ohm
CLKIN, CLKINB Input Driven by a 2.5V LVPECL Driver
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5P49V5914 DATASHEET
LVDS Driver Termination
For a general LVDS interface, the recommended value for the
termination impedance (ZT) is between 90. and 132. The
actual value should be selected to match the differential
impedance (Zo) of your transmission line. A typical
point-to-point LVDS design uses a 100 parallel resistor at the
receiver and a 100. differential transmission-line
environment. In order to avoid any transmission-line reflection
issues, the components should be surface mounted and must
be placed as close to the receiver as possible. The standard
termination schematic as shown in figure Standard
Termination or the termination of figure Optional Termination
can be used, which uses a center tap capacitance to help filter
common mode noise. The capacitor value should be
approximately 50pF. In addition, since these outputs are LVDS
compatible, the input receiver's amplitude and common-mode
input range should be verified for compatibility with the IDT
LVDS output. If using a non-standard termination, it is
recommended to contact IDT and confirm that the termination
will function as intended. For example, the LVDS outputs
cannot be AC coupled by placing capacitors between the
LVDS outputs and the 100 ohm shunt load. If AC coupling is
required, the coupling caps must be placed between the 100
ohm shunt termination and the receiver. In this manner the
termination of the LVDS output remains DC coupled.
ZO ZT
LVDS
ZT
LVDS
Driver
Receiver
Standard Termination
ZT
2
ZO ZT
LVDS
Driver
LVDS
Receiver
ZT
2
C
Optional Termination
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5P49V5914 DATASHEET
Termination for 3.3V LVPECL Outputs
The clock layout topology shown below is a typical termination
for LVPECL outputs. The two different layouts mentioned are
recommended only as guidelines.
The differential outputs generate ECL/LVPECL compatible
outputs. Therefore, terminating resistors (DC current path to
ground) or current sources must be used for functionality.
These outputs are designed to drive 50 transmission lines.
Matched impedance techniques should be used to maximize
operating frequency and minimize signal distortion. The figure
below show two different layouts which are recommended
only as guidelines. Other suitable clock layouts may exist and
it would be recommended that the board designers simulate
to guarantee compatibility across all printed circuit and clock
component process variations.
3.3V
3.3V
Zo=50ohm
Zo=50ohm
+
-
LVPECL
Input
R1
50ohm
R2
50ohm
RTT
50ohm
3.3V LVPECL Output Termination (1)
3.3V
3.3V
3.3V
R3
R4
125ohm
125ohm
Zo=50ohm
+
-
Zo=50ohm
Input
LVPECL
R1
84ohm
R2
84ohm
3.3V LVPECL Output Termination (2)
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5P49V5914 DATASHEET
Termination for 2.5V LVPECL Outputs
Figures 2.5V LVPECL Driver Termination Example (1) and (2)
show examples of termination for 2.5V LVPECL driver. These
terminations are equivalent to terminating 50 to VDDO – 2V.
For VDDO = 2.5V, the VDDO – 2V is very close to ground level.
The R3 in Figure 2.5V LVPECL Driver Termination Example
(3) can be eliminated and the termination is shown in example
(2).
VDDO = 2.5V
2.5V
2.5V
VDDO = 2.5V
Zo=50ohm
Zo=50ohm
2.5V
R1
250ohm
R3
250ohm
+
-
Zo=50ohm
+
-
2.5V LVPECL
Driver
Zo=50ohm
R1
50ohm
R2
50ohm
2.5V LVPECL
Driver
R2
62.5ohm
R4
62.5ohm
R3
18ohm
2.5V LVPECL Driver Termination Example (3)
2.5V LVPECL Driver Termination Example (1)
VDDO = 2.5V
2.5V
Zo=50ohm
+
Zo=50ohm
-
2.5V LVPECL
R1
50ohm
R2
50ohm
Driver
2.5V LVPECL Driver Termination Example (2)
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PCI Express Application Note
two evaluation ranges for PCI Express Gen 2 are 10kHz – 1.5MHz
(Low Band) and 1.5MHz – Nyquist (High Band). The plots show the
individual transfer functions as well as the overall transfer function Ht.
PCI Express jitter analysis methodology models the system
response to reference clock jitter. The block diagram below
shows the most frequently used Common Clock Architecture
in which a copy of the reference clock is provided to both ends
of the PCI Express Link.
In the jitter analysis, the transmit (Tx) and receive (Rx) serdes
PLLs are modeled as well as the phase interpolator in the
receiver. These transfer functions are called H1, H2, and H3
respectively. The overall system transfer function at the
receiver is:
Hts = H3s H1s – H2s
The jitter spectrum seen by the receiver is the result of
applying this system transfer function to the clock spectrum
X(s) and is:
Ys = Xs H3s H1s – H2s
In order to generate time domain jitter numbers, an inverse
Fourier Transform is performed on X(s)*H3(s) * [H1(s) -
H2(s)].
PCIe Gen2A Magnitude of Transfer Function
PCI Express Common Clock Architecture
For PCI Express Gen 1, one transfer function is defined and the
evaluation is performed over the entire spectrum: DC to Nyquist (e.g
for a 100MHz reference clock: 0Hz – 50MHz) and the jitter result is
reported in peak-peak.
PCIe Gen2B Magnitude of Transfer Function
For PCI Express Gen 3, one transfer function is defined and the
evaluation is performed over the entire spectrum. The transfer
function parameters are different from Gen 1 and the jitter result is
reported in RMS.
PCIe Gen1 Magnitude of Transfer Function
For PCI Express Gen2, two transfer functions are defined with 2
evaluation ranges and the final jitter number is reported in RMS. The
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MARCH 3, 2017
5P49V5914 DATASHEET
PCIe Gen3 Magnitude of Transfer Function
For a more thorough overview of PCI Express jitter analysis
methodology, please refer to IDT Application Note PCI Express
Reference Clock Requirements.
Marking Diagram
5914B
ddd
YWW**$
1. Line 1 is the truncated part number.
2. “ddd” denotes dash code.
3. “YWW” is the last digit of the year and week that the part was assembled.
4. “**” denotes lot number.
5. “$” denotes mark code.
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5P49V5914 DATASHEET
Package Outline and Dimensions (24-pin 4 x 4 mm VFQFPN)
PROGRAMMABLE CLOCK GENERATOR
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5P49V5914 DATASHEET
Package Outline and Dimensions, cont. (24-pin 4 x 4 mm VFQFPN)
MARCH 3, 2017
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PROGRAMMABLE CLOCK GENERATOR
5P49V5914 DATASHEET
Ordering Information
Part / Order Number
5P49V5914BdddNLGI
5P49V5914BdddNLGI8
Marking
see page 32
Shipping Packaging
Trays
Package
24-pin VFQFPN
24-pin VFQFPN
Temperature
-40° to +85C
-40° to +85C
Tape and Reel
“G” after the two-letter package code denotes Pb-Free configuration, RoHS compliant.
Revision History
Date
Description of Change
March 3, 2017
Updated POD drawings and legal disclaimer.
February 24, 2017 1. Added “Output Alignment” section.
2. Update “Output Divides” section
PROGRAMMABLE CLOCK GENERATOR
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MARCH 3, 2017
Corporate Headquarters
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San Jose, CA 95138 USA
www.IDT.com
Sales
Tech Support
www.idt.com/go/support
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time, without
notice, at IDT’s sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed
in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any
particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intel-
lectual property rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably
expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of
IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. Integrated Device Technology, Inc.. All rights reserved.
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