709089S12PF9 [IDT]

Dual-Port SRAM, 64KX8, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100;
709089S12PF9
型号: 709089S12PF9
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Dual-Port SRAM, 64KX8, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

静态存储器
文件: 总18页 (文件大小:306K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HIGH-SPEED 64/32K x 8  
SYNCHRONOUS  
IDT709089/79S/L  
DUAL-PORT STATIC RAM  
Features:  
True Dual-Ported memory cells which allow simultaneous  
Dual chip enables allow for depth expansion without  
additional logic  
Full synchronous operation on both ports  
– 4ns setup to clock and 1ns hold on all control, data,  
and address inputs  
access of the same memory location  
High-speed clock to data access  
– Commercial:6/7/9/12/15ns(max.)  
– Industrial: 12ns (max.)  
Low-power operation  
– Data input, address, and control registers  
– IDT709089/79S  
Active: 950mW (typ.)  
Standby: 5mW (typ.)  
– IDT709089/79L  
Active: 950mW (typ.)  
Standby: 1mW (typ.)  
Flow-Through or Pipelined output mode on either port via  
the FT/PIPE pin  
Counter enable and reset features  
– Fast 6.5ns clock to data out in the Pipelined output mode  
– Self-timed write allows fast cycle time  
– 10ns cycle time, 100MHz operation in the Pipelined  
output mode  
TTL- compatible, single 5V (±10%) power supply  
Industrial temperature range (–40°C to +85°C) is available  
for selected speeds  
Available in 100-pin Thin Quad Flatpack (TQFP) package  
Functional Block Diagram  
R/W  
OE  
R
R/W  
L
OE  
L
R
CE0R  
CE1R  
CE0L  
CE1L  
1
0
1
0
0/1  
0/1  
0
1
0
1
FT/PIPE  
L
0/1  
0/1  
FT/PIPE  
R
I/O0L - I/O7L  
I/O0R - I/O7R  
I/O  
Control  
I/O  
Control  
(1)  
(1)  
A
15L  
A
A
15R  
Counter/  
Address  
Reg.  
Counter/  
Address  
Reg.  
C0LRK  
R
MEMORY  
ARRAY  
A
0L  
CLK  
L
ADS  
R
ADS  
L
CNTEN  
R
CNTEN  
L
CNTRST  
R
CNTRST  
L
.
3242 drw 01  
NOTE:  
1. A15X is a NC for IDT709079.  
JUNE 2004  
1
DSC-3242/12  
©2004 IntegratedDeviceTechnology,Inc.  
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Description:  
Withaninputdataregister,theIDT709089/79hasbeenoptimizedfor  
applications having unidirectional or bidirectional data flow in bursts.  
An automatic power down feature, controlled by CE0and CE1, permits  
the on-chip circuitry of each port to enter a very low standby power  
mode. Fabricated using IDT’s CMOS high-performance technology,  
these devices typically operate on only 950mW of power.  
TheIDT709089/79isahigh-speed64/32Kx8bitsynchronous Dual-  
Port RAM. The memory array utilizes Dual-Port memory cells to allow  
simultaneousaccessofanyaddressfrombothports.Registersoncontrol,  
data,andaddressinputsprovideminimalsetupandholdtimes.Thetiming  
latitudeprovidedbythisapproachallowssystemstobedesignedwithvery  
shortcycletimes.  
Pin Configuration(1,2,3)  
08/19/03  
Index  
10099 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76  
1
NC  
NC  
NC  
NC  
75  
74  
73  
2
A
A
A
A
A
A
A
A
A
7R  
3
A
A
A
7L  
8L  
9L  
8R  
4
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
9R  
5
10R  
11R  
12R  
13R  
14R  
15R  
6
A
A
A
A
A
A
10L  
11L  
12L  
13L  
14L  
15L  
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
IDT709089/79PF  
(5)  
PN100-1  
NC  
GND  
NC  
NC  
NC  
NC  
CE0R  
CE1R  
NC  
V
CC  
100-PIN TQFP  
(6)  
NC  
NC  
NC  
NC  
CE0L  
CE1L  
TOP VIEW  
CNTRST  
R/W  
R
CNTRST  
R/W  
OE  
FT/PIPE  
L
R
L
OER  
L
FT/PIPE  
GND  
NC  
R
L
NC  
NC  
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50  
3242 drw 02  
NOTES:  
1. A15X is a NC for IDT709079.  
2. All VCC pins must be connected to power supply.  
3. All GND pins must be connected to ground supply.  
4. Package body is approximately 14mm x 14mm x 1.4mm.  
5. This package code is used to reference the package diagram.  
6. This text does not indicate orientation of the actual part-marking.  
6.42  
2
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
PinNames  
Left Port  
Right Port  
CE0R, CE1R  
R/W  
OE  
Names  
Chip Enables  
CE0L, CE1L  
R/W  
OE  
L
R
Read/Write Enable  
Output Enable  
Address  
L
R
(1)  
(1)  
A0L - A15L  
A0R - A15R  
I/O0L - I/O7L  
CLK  
I/O0R - I/O7R  
CLK  
Data Input/Output  
Clock  
L
R
Address Strobe  
Counter Enable  
Counter Reset  
Flow-Through/Pipeline  
Power  
ADS  
CNTEN  
CNTRST  
FT/PIPE  
L
ADS  
CNTEN  
CNTRST  
FT/PIPE  
R
L
R
NOTE:  
1. A15X is a NC for IDT709079.  
L
R
L
R
V
CC  
GND  
Ground  
3242 tbl 01  
Truth Table I—  
Read/Write and Enable Control(1,2,3)  
CLK  
CE  
1
R/W  
I/O0-7  
Mode  
OE  
CE0  
X
H
X
L
X
X
High-Z Deselected  
High-Z Deselected  
X
L
X
X
H
H
H
L
D
IN  
Write  
Read  
L
L
H
DOUT  
H
X
L
X
High-Z Outputs Disabled  
3242 tbl 02  
NOTES:  
1. "H" = VIH, "L" = VIL, "X" = Don't Care.  
2. ADS, CNTEN, CNTRST = X.  
3. OE is an asynchronous input signal.  
Truth Table II—Address Counter Control(1,2)  
Previous  
Internal  
Address  
Internal  
Address  
Used  
External  
Address  
MODE  
CLK  
I/O(3)  
DI/O (n) External Address Used  
ADS CNTEN CNTRST  
An  
X
X
An  
An  
L(4)  
X
H
H
An + 1  
An + 1  
H
L(5)  
H
D
I/O(n+1) Counter Enabled—Internal Address generation  
X
An + 1  
X
H
H
D
I/O(n+1) External Address Blocked—Counter disabled (An + 1 reused)  
X
A0  
X
X
L(4)  
DI/O(0)  
Counter Reset to Address 0  
5640 tbl 03  
NOTES:  
1. "H" = VIH, "L" = VIL, "X" = Don't Care.  
2. CE0 and OE = VIL; CE1 and R/W = VIH.  
3. Outputs configured in Flow-Through Output mode; if outputs are in Pipelined mode the data out will be delayed by one cycle.  
4. ADS is independent of all other signals including CE0 and CE1.  
5. The address counter advances if CNTEN = VIL on the rising edge of CLK, regardless of all other signals including CE0 and CE1.  
6.342  
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Recommended Operating  
Recommended DC Operating  
Temperature and Supply Voltage(1) Conditions  
Symbol  
Parameter  
Min.  
4.5  
Typ.  
Max. Unit  
Grade  
Ambient  
Temperature  
GND  
VCC  
V
CC  
Supply Voltage  
5.0  
5.5  
0
V
V
V
Commercial  
0OC to +70OC  
0V  
0V  
5.0V  
5.0V  
+
+
10%  
GND  
Ground  
0
0
Industrial  
-40OC to +85OC  
10%  
____  
V
IH  
IL  
Input High Voltage  
Input Low Voltage  
2.2  
6.0(1)  
0.8  
3242 tbl 04  
____  
NOTES:  
V
-0.5(2)  
V
1. This is the parameter TA. This is the "instant on" case temperature.  
3242 tbl 05  
NOTES:  
1. VTERM must not exceed VCC + 10%.  
2. VIL > -1.5V for pulse width less than 10ns.  
Absolute Maximum Ratings(1)  
Capacitance(1)  
(TA = +25°C, f = 1.0MHz)  
Symbol  
Rating  
Commercial  
& Industrial  
Unit  
Symbol  
Parameter  
Input Capacitance  
Output Capacitance  
Conditions(2 )  
IN = 3dV  
OUT = 3dV  
Max. Unit  
(2)  
V
TERM  
Terminal Voltage  
with Respect to GND  
-0.5 to +7.0  
V
CIN  
V
9
pF  
(3)  
OUT  
C
V
10  
pF  
T
BIAS  
STG  
JN  
OUT  
Temperature Under Bias  
Storage Temperature  
Junction Temperature  
DC Output Current  
-55 to +125  
-65 to +150  
+150  
oC  
oC  
oC  
3242 tbl 07  
NOTES:  
T
1. These parameters are determined by device characterization, but are not  
production tested.  
2. 3dV references the interpolated capacitance when the input and output  
switch from 0V to 3V or from 3V to 0V.  
T
I
50  
mA  
3. COUT also references CI/O.  
3242 tbl 06  
NOTES:  
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may  
cause permanent damage to the device. This is a stress rating only and functional  
operation of the device at these or any other conditions above those indicated in  
the operational sections of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect reliability.  
2. VTERM must not exceed VCC+ 10% for more than 25% of the cycle time or 10ns  
maximum, and is limited to < 20mA for the period of VTERM > VCC + 10%.  
3. Ambient Temperature Under DC Bias. No AC Conditions. Chip Deselected.  
DC Electrical Characteristics Over the Operating  
Temperature and Supply Voltage Range (VCC = 5.0V ± 10%)  
709089/79S/L  
Min. Max.  
Symbol  
|ILI  
|ILO  
Parameter  
Input Leakage Current(1)  
Test Conditions  
CC = 5.5V, VIN = 0V to VCC  
CE  
OL = +4mA  
OH = -4mA  
Unit  
µA  
µA  
V
___  
___  
___  
|
V
10  
10  
|
Output Leakage Current  
Output Low Voltage  
Output High Voltage  
0
= VIH or CE1 = VIL, VOUT = 0V to VCC  
V
OL  
OH  
I
0.4  
___  
V
I
2.4  
V
3242 tbl 08  
NOTE:  
1. At VCC < 2.0V input leakages are undefined.  
6.42  
4
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
DC Electrical Characteristics Over the Operating  
Temperature and Supply Voltage Range(6) (VCC = 5V ± 10%)  
709089/79X6  
Com'l Only  
709089/79X7  
Com'l Only  
709089/79X9  
Com'l Only  
Symbol  
Parameter  
Test Condition  
Version  
COM'L  
Typ.(4)  
Max.  
Typ.(4)  
Max.  
Typ.(4)  
Max.  
Unit  
ICC  
Dynamic Operating  
Current  
(Both Ports Active)  
S
L
270  
270  
585  
525  
250  
250  
490  
440  
210  
210  
390  
350  
mA  
CEL and CER= VIL  
Outputs Disabled  
(1)  
f = fMAX  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
IND  
S
L
ISB1  
ISB2  
ISB3  
ISB4  
Standby Current  
(Both Ports - TTL  
Level Inputs)  
COM'L  
IND  
S
L
80  
80  
205  
175  
65  
65  
170  
145  
50  
50  
135  
115  
mA  
mA  
CEL = CER = VIH  
(1)  
f = fMAX  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
S
L
Standby Current  
(One Port - TTL  
Level Inputs)  
COM'L  
IND  
S
L
180  
180  
405  
360  
160  
160  
340  
295  
140  
140  
270  
240  
CE"A" = VIL and  
(3)  
CE"B" = VIH  
Active Port Outputs  
Disabled, f=fMAX  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
(1)  
S
L
Full Standby Current  
(Both Ports -  
CMOS Level Inputs)  
Both Ports CER and  
CEL > VCC - 0.2V  
VIN > VCC - 0.2V or  
VIN < 0.2V, f = 0(2)  
COM'L  
IND  
S
L
1.0  
0.2  
15  
5
1.0  
0.2  
15  
5
1.0  
0.2  
15  
5
mA  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
S
L
Full Standby Current  
(One Port -  
CMOS Level Inputs)  
mA  
COM'L  
IND  
S
L
170  
170  
395  
340  
150  
150  
330  
290  
130  
130  
245  
225  
CE"A" < 0.2V and  
CE"B" > VCC - 0.2V(5)  
VIN > VCC - 0.2V or  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
S
L
VIN < 0.2V, Active Port Outputs  
Disabled, f = fMAX  
(1)  
3242 tbl 09  
NOTES:  
1. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency clock cycle of 1/tCYC, using "AC TEST CONDITIONS" at input levels of  
GND to 3V.  
2. f = 0 means no address, clock, or control lines change. Applies only to input at CMOS level standby.  
3. Port "A" may be either left or right port. Port "B" is the opposite from port "A".  
4. VCC = 5V, TA = 25°C for Typ, and are not production tested. ICC DC(f=0) = 150mA (Typ).  
5. CEX = VIL means CE0X = VIL and CE1X = VIH  
CEX = VIH means CE0X = VIH or CE1X = VIL  
CEX < 0.2V means CE0X < 0.2V and CE1X > VCC - 0.2V  
CEX > VCC - 0.2V means CE0X > VCC - 0.2V or CE1X < 0.2V  
"X" represents "L" for left port or "R" for right port.  
6. 'X' in part numbers indicate power (S or L).  
6.542  
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
DC Electrical Characteristics Over the Operating  
Temperature and Supply Voltage Range(6) (VCC = 5V ± 10%)(cont'd)  
709089/79X12  
Com'l  
709089/79X15  
Com'l Only  
& Ind  
Symbol  
Parameter  
Test Condition  
and CE = VIL  
Version  
COM'L  
Typ.(4)  
Max.  
Typ.(4)  
Max.  
Unit  
ICC  
Dynamic Operating  
Current  
(Both Ports Active)  
S
L
200  
200  
345  
305  
190  
190  
325  
285  
mA  
CE  
L
R
(1)  
Outputs Disabled f = fMAX  
____  
____  
____  
____  
IND  
S
L
200  
200  
380  
340  
I
SB1  
Standby Current  
(Both Ports - TTL  
Level Inputs)  
COM'L  
IND  
S
L
50  
50  
110  
90  
50  
50  
110  
90  
mA  
mA  
CE  
L = CER = VIH  
(1)  
f = fMAX  
____  
____  
____  
____  
S
L
50  
50  
125  
105  
ISB2  
Standby Current  
(One Port - TTL  
Level Inputs)  
COM'L  
IND  
S
L
130  
130  
230  
200  
120  
120  
220  
190  
CE"A" = VIL and  
(3)  
CE"B" = VIH  
Active Port Outputs  
____  
____  
____  
____  
(1)  
S
L
130  
130  
245  
215  
Disabled, f=fMAX  
ISB3  
Full Standby Current  
(Both Ports -  
CMOS Level Inputs)  
Both Ports CE  
R
and  
COM'L  
IND  
S
L
1.0  
0.2  
15  
5
1.0  
0.2  
15  
5
mA  
CE  
L
> VCC - 0.2V  
V
IN > VCC - 0.2V or  
____  
____  
____  
____  
IN < 0.2V, f = 0(2)  
S
L
1.0  
0.2  
15  
5
V
ISB4  
Full Standby Current  
(One Port -  
CMOS Level Inputs)  
mA  
COM'L  
IND  
S
L
120  
120  
205  
185  
110  
110  
195  
175  
CE"A" < 0.2V and  
CE"B" > VCC - 0.2V(5)  
V
IN > VCC - 0.2V or  
IN < 0.2V, Active Port Outputs  
____  
____  
____  
____  
S
L
120  
120  
220  
200  
V
(1)  
Disabled, f = fMAX  
3242 tbl 09a  
NOTES:  
1. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency clock cycle of 1/tCYC, using "AC TEST CONDITIONS" at input levels of  
GND to 3V.  
2. f = 0 means no address, clock, or control lines change. Applies only to input at CMOS level standby.  
3. Port "A" may be either left or right port. Port "B" is the opposite from port "A".  
4. VCC = 5V, TA = 25°C for Typ, and are not production tested. ICC DC(f=0) = 150mA (Typ).  
5. CEX = VIL means CE0X = VIL and CE1X = VIH  
CEX = VIH means CE0X = VIH or CE1X = VIL  
CEX < 0.2V means CE0X < 0.2V and CE1X > VCC - 0.2V  
CEX > VCC - 0.2V means CE0X > VCC - 0.2V or CE1X < 0.2V  
"X" represents "L" for left port or "R" for right port.  
6. 'X' in part numbers indicate power (S or L).  
6.42  
6
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
AC Test Conditions  
Input Pulse Levels  
GND to 3.0V  
3ns Max.  
Input Rise/Fall Times  
Input Timing Reference Levels  
Output Reference Levels  
Output Load  
1.5V  
1.5V  
Figures 1,2 and 3  
3242 tbl 10  
5V  
5V  
893  
893Ω  
DATAOUT  
DATAOUT  
30pF  
347Ω  
5pF*  
347Ω  
3242 drw 04  
3242 drw 05  
Figure 1. AC Output Test load.  
Figure 2. Output Test Load  
(For tCKLZ, tCKHZ, tOLZ, and tOHZ).  
*Including scope and jig.  
8
-10 pF is the I/O capacitance  
of this device, and 30pF is the  
AC Test Load Capacitance  
7
6
5
4
tCD  
tCD  
(Typical, ns)  
1
,
2
3
2
1
0
20 40 60 80 100 120 140 160 180 200  
Capacitance (pF)  
,
-1  
3242 drw 06  
Figure 3. Typical Output Derating (Lumped Capacitive Load).  
6.742  
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
AC Electrical Characteristics Over the Operating Temperature Range  
(Read and Write Cycle Timing)(3,4) (VCC = 5V ± 10%, TA = 0°C to +70°C)  
709089/79X6  
Com'l Only  
709089/79X7  
Com'l Only  
709089/79X9  
Com'l Only  
709089/79X12  
Com'l  
709089/79X15  
Com'l Only  
& Ind  
Symbol  
Parameter  
Clock Cycle Time (Flow-Through)(2)  
Min.  
Max.  
Min.  
22  
Max.  
Min.  
Max.  
Min.  
30  
20  
12  
12  
8
Max.  
Min.  
35  
Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
____  
____  
____  
____  
____  
t
CYC1  
CYC2  
CH1  
CL1  
CH2  
CL2  
19  
10  
6.5  
6.5  
4
25  
15  
12  
12  
6
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
Clock Cycle Time (Pipelined)(2)  
Clock High Time (Flow-Through)(2)  
Clock Low Time (Flow-Through)(2)  
Clock High Time (Pipelined)(2)  
Clock Low Time (Pipelined)(2)  
Clock Rise Time  
12  
25  
t
7.5  
7.5  
5
12  
t
12  
t
10  
t
4
5
6
8
10  
____  
____  
____  
____  
____  
tR  
3
3
3
3
3
____  
____  
____  
____  
____  
tF  
Clock Fall Time  
3
3
3
3
3
____  
____  
____  
____  
____  
t
SA  
HA  
SC  
HC  
SW  
HW  
SD  
HD  
SAD  
HAD  
SCN  
HCN  
SRST  
HRST  
OE  
OLZ  
OHZ  
CD1  
CD2  
DC  
CKHZ  
CKLZ  
Address Setup Time  
Address Hold Time  
3.5  
0
4
0
4
0
4
0
4
0
4
0
4
0
4
4
1
4
1
4
1
4
1
4
1
4
1
4
4
1
4
1
4
1
4
1
4
1
4
1
4
4
1
4
1
4
1
4
1
4
1
4
1
4
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
t
Chip Enable Setup Time  
Chip Enable Hold Time  
R/W Setup Time  
3.5  
0
t
t
3.5  
0
t
R/W Hold Time  
t
Input Data Setup Time  
Input Data Hold Time  
ADS Setup Time  
3.5  
0
t
t
3.5  
0
t
ADS Hold Time  
t
3.5  
0
CNTEN Setup Time  
t
CNTEN Hold Time  
t
3.5  
CNTRST Setup Time  
CNTRST Hold Time  
t
0
0
1
1
1
____  
____  
____  
____  
____  
t
Output Enable to Data Valid  
6.5  
7.5  
9
12  
15  
(1)  
____  
____  
____  
____  
____  
t
Output Enable to Output Low-Z  
2
2
2
2
2
t
Output Enable to Output High-Z(1)  
Clock to Data Valid (Flow-Through)(2)  
Clock to Data Valid (Pipelined)(2)  
Data Output Hold After Clock High  
Clock High to Output High-Z(1)  
Clock High to Output Low-Z(1)  
1
7
1
7
1
7
1
7
1
7
____  
____  
____  
____  
____  
t
15  
18  
20  
25  
30  
____  
____  
____  
____  
____  
t
6.5  
7.5  
9
12  
15  
____  
____  
____  
____  
____  
t
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
t
9
9
9
9
9
____  
____  
____  
____  
____  
t
Port-to-Port Delay  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
CWDD  
Write Port Clock High to Read Data Delay  
Clock-to-Clock Setup Time  
24  
9
28  
10  
35  
15  
40  
15  
50  
20  
ns  
tCCS  
ns  
3242 tbl 11  
NOTES:  
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). This parameter is guaranteed by device  
characterization, but is not production tested.  
2. The Pipelined output parameters (tCYC2, tCD2) apply to either or both left and right ports when FT/PIPE = VIH. Flow-through parameters (tCYC1, tCD1) apply when  
FT/PIPE = VIL for that port.  
3. All input signals are synchronous with respect to the clock except for the asynchronous Output Enable (OE) and FT/PIPE. FT/PIPE should be treated as a DC  
signal, i.e. steady state during operation.  
4. 'X' in part number indicates power rating (S or L).  
6.42  
8
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Read Cycle for  
Flow-Through Output (FT/PIPE"X" = VIL)(3,6)  
tCYC1  
t
CH1  
t
CL1  
CLK  
CE0  
t
SC  
tHC  
tSC  
tHC  
CE1  
R/W  
t
HW  
t
SW  
SA  
t
HA  
t
ADDRESS(5)  
An  
An + 1  
An + 2  
An + 3  
(1)  
t
DC  
t
CD1  
tCKHZ  
Qn  
Qn + 1  
Qn + 2  
DATAOUT  
(1)  
(1)  
t
CKLZ  
tDC  
(1)  
tOHZ  
tOLZ  
,
OE(2)  
tOE  
3242 drw 07  
Timing Waveform of Read Cycle for Pipelined Output  
(FT/PIPE"X" = VIH)(3,6)  
tCYC2  
t
CH2  
t
CL2  
CLK  
CE  
0
t
SC  
(4)  
t
HC  
tSC  
tHC  
CE1  
R/W  
tHW  
tSW  
t
SA  
tHA  
ADDRESS(5)  
DATAOUT  
An  
An + 1  
An + 2  
Qn  
An + 3  
(1 Latency)  
t
DC  
tCD2  
Qn + 1  
Qn + 2  
(1)  
t
CKLZ  
(1)  
(1)  
t
OHZ  
tOLZ  
(2)  
OE  
tOE  
NOTES:  
3242 drw 08  
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).  
2. OE is asynchronously controlled; all other inputs are synchronous to the rising clock edge.  
3. ADS = VIL, CNTEN and CNTRST = VIH.  
4. The output is disabled (High-Impedance state) by CE0 = VIH or CE1 = VIL following the next rising edge of clock. Refer to Truth Table 1.  
5. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use  
only.  
6. "X" denotes Left or Right port. The diagram is with respect to that port.  
6.942  
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of a Bank Select Pipelined Read(1,2)  
t
CYC2  
tCH2  
tCL2  
CLK  
ADDRESS(B1)  
CE0(B1)  
t
SA  
tHA  
A6  
A5  
A4  
A3  
A
2
A
0
A1  
tSC  
tHC  
t
SC  
tHC  
(3)  
tCD2  
tCD2  
tCKHZ  
tCD2  
Q
0
Q3  
Q
1
DATAOUT(B1)  
ADDRESS(B2)  
(3)  
(3)  
tDC  
tCKLZ  
t
DC  
tCKHZ  
t
SA  
tHA  
A6  
A5  
A4  
A3  
A2  
A
0
A1  
tSC  
tHC  
CE0(B2)  
tSC  
tHC  
(3)  
tCD2  
tCKHZ  
tCD2  
DATAOUT(B2)  
Q4  
Q2  
(3)  
(3)  
tCKLZ  
tCKLZ  
3242 drw 09  
Timing Waveform of a Bank Select Flow-Through Read(6,7)  
t
CYC1  
tCH1  
tCL1  
CLK  
tSA  
tHA  
A6  
A5  
A4  
A3  
A2  
A0  
A1  
ADDRESS(B1)  
tSC  
tHC  
CE0(B1)  
tSC  
tHC  
(1)  
tCD1  
tCD1  
t
CKHZ  
t
CD1  
(1)  
tCD1  
D0  
D3  
D
5
6
D1  
DATAOUT(B1)  
ADDRESS(B2)  
(1)  
(1)  
tDC  
t
CKLZ  
tCKLZ  
tDC  
tCKHZ  
tSA  
tHA  
A
A5  
A4  
A3  
A2  
A
0
A1  
tSC  
tHC  
CE0(B2)  
tSC  
tHC  
(1)  
(1)  
t
CD1  
t
CKHZ  
t
CD1  
(1)  
tCKHZ  
D4  
DATAOUT(B2)  
D2  
(1)  
t
CKLZ  
tCKLZ  
3242 drw 09a  
NOTES:  
1. B1 Represents Bank #1; B2 Represents Bank #2. Each Bank consists of one IDT709089/79 for this waveform, and are setup for depth expansion in this  
example. ADDRESS(B1) = ADDRESS(B2) in this situation.  
2. OE and ADS = VIL; CE1(B1), CE1(B2), R/W, CNTEN, and CNTRST = VIH.  
3. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).  
4. CE0 and ADS = VIL; CE1, CNTEN, and CNTRST = VIH.  
5. OE = VIL for the Right Port, which is being read from. OE = VIH for the Left Port, which is being written to.  
6. If tCCS < maximum specified, then data from right port READ is not valid until the maximum specified for tCWDD.  
If tCCS > maximum specified, then data from right port READ is not valid until tCCS + tCD1. tCWDD does not apply in this case.  
7. All timing is the same for both Left and Right ports. Port "A" may be either Left or Right port. Port "B" is the opposite of Port "A".  
6.42  
10  
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform with Port-to-Port Flow-Through Read(1,2,3,5)  
CLK "A"  
tSW  
tHW  
R/W"A"  
ADDRESS"A"  
DATAIN"A"  
CLK"B"  
t
SA  
MATCH  
SD HD  
VALID  
tHA  
NO  
MATCH  
t
t
(4)  
tCCS  
tCD1  
R/W"B"  
t
HW  
HA  
t
SW  
t
tSA  
NO  
MATCH  
ADDRESS"B"  
DATAOUT"B"  
MATCH  
(4)  
tCD1  
tCWDD  
VALID  
VALID  
t
DC  
tDC  
3242 drw 10  
NOTES:  
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).  
2. CE0 and ADS = VIL; CE1, CNTEN, and CNTRST = VIH.  
3. OE = VIL for the Right Port, which is being read from. OE = VIH for the Left Port, which is being written to.  
4. If tCCS < maximum specified, then data from right port READ is not valid until the maximum specified for tCWDD.  
If tCCS > maximum specified, then data from right port READ is not valid until tCCS + tCD1. tCWDD does not apply in this case.  
5. All timing is the same for both Left and Right ports. Port "A" may be either Left or Right port. Port "B" is the opposite of Port "A".  
61.412  
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Pipelined Read-to-Write-to-Read (OE = VIL)(3)  
tCYC2  
tCH2  
tCL2  
CLK  
CE0  
t
SC  
tHC  
CE1  
tSW tHW  
R/W  
tSW tHW  
(4)  
An + 3  
An + 4  
An  
An +1  
An + 2  
An + 2  
ADDRESS  
t
SA  
tHA  
t
SD  
t
HD  
DATAIN  
Dn + 2  
(1)  
tCD2  
(1)  
tCD2  
(2)  
tCKHZ  
tCKLZ  
Qn + 3  
Qn  
DATAOUT  
READ  
NOP(5)  
WRITE  
READ  
3242 drw 11  
Timing Waveform of Pipelined Read-to-Write-to-Read (OE Controlled)(3)  
t
CYC2  
tCH2  
tCL2  
CLK  
CE0  
tSC  
tHC  
CE1  
tSW tHW  
R/W  
tSW tHW  
(4)  
An + 4  
An  
An +1  
An + 2  
An + 3  
Dn + 3  
An + 5  
ADDRESS  
t
SA  
tHA  
t
SD  
t
HD  
DATAIN  
Dn + 2  
(1)  
tCKLZ  
tCD2  
tCD2  
(2)  
Qn  
Qn + 4  
DATAOUT  
(1)  
OHZ  
t
OE  
READ  
WRITE  
READ  
3242 drw 12  
NOTES:  
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).  
2. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals.  
3. CE0 and ADS = VIL; CE1, CNTEN, and CNTRST = VIH.  
4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only.  
5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.  
6.42  
12  
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform Flow-Through Read-to-Write-to-Read (OE = VIL)(3)  
t
CYC1  
tCH1  
tCL1  
CLK  
CE0  
tSC  
tHC  
CE1  
tSW tHW  
R/W  
tSW tHW  
(4)  
An + 4  
An  
An + 3  
An +1  
An + 2  
An + 2  
ADDRESS  
tSA  
tHA  
t
SD tHD  
DATAIN  
Dn + 2  
tCD1  
tCD1  
tCD1  
tCD1  
(2)  
Qn + 3  
Qn  
READ  
Qn + 1  
DATAOUT  
(1)  
(1)  
tDC  
tDC  
tCKLZ  
t
CKHZ  
NOP(5)  
WRITE  
READ  
3242 drw 13  
TimingWaveformofFlow-ThroughRead-to-Write-to-Read(OEControlled)(3)  
tCYC1  
tCH1  
tCL1  
CLK  
CE0  
tSC tHC  
CE1  
tSW tHW  
R/W  
tSW tHW  
(4)  
An + 5  
An  
tSA tHA  
An +1  
An + 2  
An + 3  
Dn + 3  
An + 4  
ADDRESS  
tSD tHD  
DATAIN  
Dn + 2  
tOE  
tCD1  
tDC  
tCD1  
tCD1  
(2)  
Qn + 4  
tDC  
Qn  
DATAOUT  
OE  
(1)  
tCKLZ  
(1)  
tOHZ  
READ  
WRITE  
READ  
3242 drw 14  
NOTES:  
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).  
2. Output state (High, Low, or High-impedance is determined by the previous cycle control signals.  
3. CE0 and ADS = VIL; CE1, CNTEN, and CNTRST = VIH.  
4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only.  
5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.  
61.432  
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Pipelined Read with Address Counter Advance(1)  
t
CYC2  
tCH2  
tCL2  
CLK  
tSA  
tHA  
An  
ADDRESS  
tSAD  
tHAD  
ADS  
t
SAD tHAD  
CNTEN  
t
SCN tHCN  
tCD2  
Qn + 2(2)  
Qx - 1(2)  
Qn + 3  
Qn + 1  
Qn  
Qx  
DATAOUT  
tDC  
READ  
EXTERNAL  
ADDRESS  
READ  
WITH  
COUNTER  
COUNTER  
HOLD  
READ WITH COUNTER  
3242 drw 15  
TimingWaveformof Flow-ThroughReadwithAddressCounterAdvance(1)  
tCYC1  
t
CH1  
tCL1  
CLK  
tSA  
tHA  
An  
ADDRESS  
tSAD tHAD  
tSAD  
tHAD  
ADS  
tSCN  
tHCN  
CNTEN  
tCD1  
Qn + 3(2)  
Qx(2)  
Qn + 4  
Qn + 1  
Qn + 2  
Qn  
DATAOUT  
tDC  
READ  
WITH  
READ  
EXTERNAL  
ADDRESS  
READ WITH COUNTER  
COUNTER  
HOLD  
COUNTER  
3242 drw 16  
NOTES:  
1. CE0 and OE = VIL; CE1, R/W, and CNTRST = VIH.  
2. If there is no address change via ADS = VIL (loading a new address) or CNTEN = VIL (advancing the address), i.e. ADS = VIH and CNTEN = VIH, then the data output  
remains constant for subsequent clocks.  
6.42  
14  
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Write with Address Counter Advance  
(Flow-Through or Pipelined Outputs)(1)  
t
CYC2  
tCH2  
tCL2  
CLK  
tSA  
tHA  
An  
ADDRESS  
INTERNAL(3)  
ADDRESS  
An(7)  
An + 2  
An + 4  
An + 1  
An + 3  
t
SAD tHAD  
ADS  
CNTEN  
tSD tHD  
Dn + 4  
Dn + 1  
Dn + 3  
Dn  
Dn + 1  
Dn + 2  
DATAIN  
WRITE  
EXTERNAL  
ADDRESS  
WRITE  
WITH COUNTER  
WRITE  
COUNTER HOLD  
WRITE WITH COUNTER  
3242 drw 17  
Timing Waveform of Counter Reset (Pipelined Outputs)(2)  
t
CYC2  
tCH2  
tCL2  
CLK  
tSA tHA  
(4)  
An + 2  
An  
An + 1  
ADDRESS  
INTERNAL(3)  
ADDRESS  
Ax(6)  
0
An + 1  
1
An  
tSW tHW  
R/W  
ADS  
t
SAD  
SCN  
tHAD  
CNTEN  
t
tHCN  
tSRST  
tHRST  
CNTRST  
tSD  
tHD  
D0  
DATAIN  
(5)  
Qn  
Q1  
Q0  
DATAOUT  
COUNTER (6)  
RESET  
WRITE  
ADDRESS 0  
READ  
ADDRESS 0  
READ  
READ  
READ  
ADDRESS 1  
ADDRESS n ADDRESS n+1  
3242 drw 18  
NOTES:  
1. CE0 and R/W = VIL; CE1 and CNTRST = VIH.  
CE0 = VIL; CE1 = VIH.  
2.  
3. The "Internal Address" is equal to the "External Address" when ADS = VIL and equals the counter output when ADS = VIH.  
4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only.  
5. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals.  
6. No dead cycle exists during counter reset. A READ or WRITE cycle may be coincidental with the counter reset. ADDR0 will be accessed. Extra cycles are shown here  
simply for clarification.  
7. CNTEN = VIL advances Internal Address from ‘An’ to ‘An +1’. The transition shown indicates the time required for the counter to advance. The ‘An +1’Address is written  
to during this cycle.  
61.452  
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Depth and Width Expansion  
FunctionalDescription  
The IDT709089/79 features dual chip enables (refer to Truth Table  
I)inordertofacilitaterapidandsimpledepthexpansionwithnorequire-  
mentsforexternallogic.Figure4illustrateshowtocontrolthevariouschip  
enables in order to expand two devices in depth.  
The IDT709089/79 provides a true synchronous Dual-Port Static  
RAM interface. Registered inputs provide minimal set-up and hold  
times on address, data, and all critical control inputs. All internal  
registers are clocked on the rising edge of the clock signal, however,  
the self-timed internal write pulse is independent of the LOW to HIGH  
transition of the clock signal.  
The IDT709089/79 can also be used in applications requiring ex-  
pandedwidth,asindicatedinFigure4.Sincethebanksareallocatedat  
thediscretionoftheuser,theexternalcontrollercanbesetuptodrivethe  
input signals for the various devices as required to allow for 16-bit or  
wider applications.  
An asynchronous output enable is provided to ease asynchronous  
bus interfacing. Counter enable inputs are also provided to stall the  
operation of the address counters for fast interleaved memory appli-  
cations.  
A HIGH on CE0 or a LOW on CE1 for one clock cycle will power  
down the internal circuitry to reduce static power consumption.  
MultiplechipenablesalloweasierbankingofmultipleIDT709089/79'sfor  
depth expansion configurations. When the Pipelined output mode is  
enabled, two cycles are required with CE0 LOW and CE1 HIGH to re-  
activate the outputs.  
(1)  
A15/A14  
IDT709089/79  
IDT709089/79  
CE0  
CE0  
VCC  
VCC  
CE1  
CE1  
Control Inputs  
Control Inputs  
IDT709089/79  
IDT709089/79  
CE1  
CE1  
CE0  
CE0  
CNTRST  
CLK  
Control Inputs  
Control Inputs  
,
ADS  
CNTEN  
R/W  
3242 drw 19  
OE  
Figure 4. Depth and Width Expansion with IDT709089/79  
NOTE:  
1. A15 is for IDT709089, A14 is for IDT709079.  
6.42  
16  
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Ordering Information  
IDT XXXXX  
A
99  
A
A
Device  
Type  
Power Speed  
Package  
Process/  
Temperature  
Range  
Commercial (0°C to +70°C)  
Industrial (-40°C to +85°C)  
Blank  
I(1)  
PF  
100-pin TQFP (PN100-1)  
6
Commercial Only  
Commercial Only  
7
Speed in nanoseconds  
Commercial Only  
9
12  
15  
Commercial & Industrial  
Commercial Only  
S
L
Standard Power  
Low Power  
709089 512K (64K x 8-Bit) Synchronous Dual-Port RAM  
709079 256K (32K x 8-Bit) Synchronous Dual-Port RAM  
3242 drw 20  
NOTE:  
1. Contact your local sales office for industrial temp range for other speeds, packages and powers.  
Ordering Information for Flow-through Devices  
Old Flow-through Part  
New Combined Part  
70908S/L20  
709089S/L9  
70908S/L25  
709089S/L12  
70908S/L30  
709089S/L15  
3242 tbl 12  
IDT Clock Solution for IDT709089/79 Dual-Port  
Dual-Port I/O Specitications  
Clock Specifications  
Input Duty  
Cycle  
IDT  
PLL  
IDT  
Non-PLL  
IDT Dual-Port  
Part Number  
Input  
Capacitance  
Maximum  
Frequency Tolerance  
Jitter  
Voltage  
5
I/O  
Clock Device Clock Device  
Requirement  
49FCT805T  
FCT88915TT 49FCT806T  
74FCT807T  
709089/79  
TTL  
9pF  
40%  
100  
150ps  
3242 tbl 13  
61.472  
IDT709089/79S/L  
High-Speed 64/32K x 8 Synchronous Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
DatasheetDocumentHistory  
1/12/99:  
Initiated datasheet document history  
Converted to new format  
Cosmetic and typographical corrections  
Added additional notes to pin configurations  
Page 15 AddedDepthandWidthExpansionnote  
Changeddrawingformat  
6/7/99:  
Page 4 Deleted note 6 for Table II  
Replaced IDT logo  
Page 1 Removed "Separate upper-byte..." line  
CombinedPipelined709089familyandFlow-through70908familyofferingsintoonedatasheet  
Changed±200mVinwaveformnotesto0mV  
11/10/99:  
12/22/99:  
1/12/00:  
Addedcorrespondingpartchartwithorderinginformation  
Pages 8 and 9 Changed ±220mV waveform notes to 0mV  
Page 9 Changed "Operation" in heading to "Pipelined Output", fixed drawing 08  
RemovedPGApackage  
2/18/00:  
5/24/00:  
Page 3 Changed information in Truth Table II  
Page 4 Increasedstoragetemperatureparameters  
ClarifiedTAparameter  
Page 5 DCElectricalparameters–changedwordingfrom"open"to"disabled"  
AddedIndustrialTemperatureRangesandremovedrelatednotes  
Page 2 Addeddaterevisionforpinconfiguration  
Page5&7 Removedindustrialtempfromcolumnheadingsandvaluesfor15nsfromAC&DCElectricalCharacteristics  
Page 16 Removedindustrialofferingfrom15nsorderinginfoandaddedindustrialtempfootnote  
Page 1 & 17 Replaced IDT TM logo with ® logo  
01/10/02:  
06/21/04:  
Consolidatedmultipledevicesintoonedatasheet  
RemovedPreliminarystatusfromdatasheet  
Page 4 AddedJunctionTemperaturetoAbsoluteMaximumRatingsTable  
AddedAmbientTemperaturefootnote  
Page 5 Added6ns&7nsspeedDCtimingnumberstotheDCElectricalCharacteristicsTable  
Page 8 Added6ns&7nsspeedACtimingnumberstotheACElectricalCharacteristicsTable  
Page 17 Added 6ns & 7ns speed grades to ordering information  
Added IDT Clock Solution Table  
Page 1 & 18 Replaced old logo with new TM logo  
CORPORATE HEADQUARTERS  
2975 Stender Way  
Santa Clara, CA 95054  
for SALES:  
for Tech Support:  
831-754-4613  
DualPortHelp@idt.com  
800-345-7015 or 408-727-6116  
fax: 408-492-8674  
www.idt.com  
The IDT logo is a registered trademark of Integrated Device Technology, Inc.  
6.42  
18  

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