70V07L25GGI8 [IDT]

HIGH-SPEED 3.3V 32K x 8 DUAL-PORT STATIC RAM;
70V07L25GGI8
型号: 70V07L25GGI8
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

HIGH-SPEED 3.3V 32K x 8 DUAL-PORT STATIC RAM

文件: 总19页 (文件大小:182K)
中文:  中文翻译
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IDT70V07S/L  
HIGH-SPEED 3.3V  
32K x 8 DUAL-PORT  
STATIC RAM  
LEAD FINISH (SnPb) ARE IN EOL PROCESS - LAST TIME BUY EXPIRES JUNE 15, 2018  
Features  
IDT70V07 easily expands data bus width to 16 bits or more  
using the Master/Slave select when cascading more than  
one device  
M/S = VIH for BUSY output flag on Master  
M/S = VIL for BUSY input on Slave  
On-chip port arbitration logic  
True Dual-Ported memory cells which allow simultaneous  
access of the same memory location  
High-speed access  
– Commercial:25/35/55ns(max.)  
– Industrial:25/35ns(max.)  
Low-power operation  
Full on-chip hardware support of semaphore signaling  
between ports  
– IDT70V07S  
Active: 300mW (typ.)  
Standby: 3.3mW (typ.)  
– IDT70V07L  
Active: 300mW (typ.)  
Fully asynchronous operation from either port  
TTL-compatible, single 3.3V ( 0.3V) power supply  
Available in 68-pin PGA and PLCC, and a 80-pin TQFP  
Industrial temperature range (-40°C to +85°C) is available  
for selected speeds  
Standby: 660µW(typ.)  
Interrupt Flag  
Green parts available, see ordering information  
Functional Block Diagram  
OE  
R
R
OE  
L
CE  
CEL  
R/WR  
R/W  
L
I/O0L- I/O7L  
I/O0R-I/O7R  
(1,2)  
I/O  
Control  
I/O  
Control  
,
(1,2)  
BUSY  
L
BUSY  
R
A
14R  
0R  
A
14L  
Address  
Decoder  
MEMORY  
ARRAY  
Address  
Decoder  
A
A
0L  
15  
15  
ARBITRATION  
INTERRUPT  
SEMAPHORE  
LOGIC  
CE  
L
L
CE  
OE  
R/W  
R
R
OE  
R
R/W  
L
SEM  
L
SEMR  
M/S  
(2)  
(2)  
INTR  
INTL  
2943 drw 01  
NOTES:  
1. (MASTER): BUSY is output; (SLAVE): BUSY is input.  
2. BUSY and INT outputs are non-tri-stated push-pull.  
MARCH 2018  
1
DSC 2943/10  
©2018 Integrated Device Technology, Inc.  
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
address,andI/Opinsthatpermitindependent,asynchronousaccessfor  
reads or writes to any location in memory. An automatic power down  
featurecontrolledbyCEpermitstheon-chipcircuitryofeachporttoenter  
a very low standby power mode.  
Fabricatedusing CMOShigh-performancetechnology,thesedevices  
typically operate on only 300mW of power.  
Description  
The IDT70V07 is a high-speed 32K x 8 Dual-Port Static RAM. The  
IDT70V07 is designed to be used as a stand-alone 256K-bit Dual-Port  
RAM or as a combination MASTER/SLAVE Dual-Port RAM for 16-bit-  
or-morewordsystems.UsingtheIDTMASTER/SLAVEDual-PortRAM  
approach in 16-bit or wider memory system applications results in full-  
speed,error-freeoperationwithouttheneedforadditionaldiscretelogic.  
This device provides two independent ports with separate control,  
TheIDT70V07ispackagedinaceramic68-pinPGAandPLCCand  
a 80-pin thin quad flatpack (TQFP).  
Pin Configurations(1,2,3)  
10/25/01  
INDEX  
9
8
7
6
5
4
3
2
1 68 67 66 65 64 63 62 61  
60  
I/O2L  
I/O3L  
I/O4L  
I/O5L  
GND  
I/O6L  
I/O7L  
A
A
A
A
A
A
5L  
4L  
3L  
2L  
1L  
0L  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
IDT70V07J  
J68-1(4)  
INT  
L
VCC  
BUSY  
GND  
M/S  
L
68-Pin PLCC  
Top View(5)  
GND  
I/O0R  
I/O1R  
I/O2R  
BUSY  
R
INT  
R
VCC  
A
A
A
A
A
0R  
I/O3R  
I/O4R  
I/O5R  
I/O6R  
1R  
2R  
3R  
4R  
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43  
2943 drw 02  
NOTES:  
1. All VCC pins must be connected to power supply.  
2. All GND pins must be connected to ground.  
3. J68-1 package body is approximately .95 in x .95 in x .17 in.  
4. This package code is used to reference the package diagram.  
5. This text does not indicate orientation of the actual part-marking.  
2
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Pin Configurations(1,2,3) (con't.)  
10/25/01  
INDEX  
79  
80  
78 77 76 75 74 73  
71 70 69 68 67 66 65 64 63 62 61  
72  
1
2
3
4
N/C  
A5L  
A4L  
A3L  
A2L  
A1L  
A0L  
INTL  
BUSYL  
GND  
M/S  
BUSYR  
INTR  
A0R  
A1R  
A2R  
A3R  
A4R  
N/C  
N/C  
I/O2L  
I/O3L  
I/O4L  
I/O5L  
GND  
I/O6L  
I/O7L  
VCC  
N/C  
GND  
I/O0R  
I/O1R  
I/O2R  
VCC  
I/O3R  
I/O4R  
I/O5R  
I/O6R  
60  
59  
58  
57  
56  
55  
54  
53  
5
6
7
8
9
IDT70V07PF  
PN80-1(4)  
52  
51  
50  
49  
48  
47  
46  
10  
11  
12  
13  
14  
15  
16  
80-Pin TQFP  
Top View(5)  
45  
44  
43  
42  
41  
17  
18  
19  
20  
N/C  
N/C  
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40  
2943 drw 03  
NOTES:  
1. All VCC pins must be connected to power supply.  
2. All GND pins must be connected to ground.  
3. PN80-1 package body is approximately 14mm x 14mm x 1.4mm.  
4. This package code is used to reference the package diagram.  
5. This text does not indicate orientation of the actual part-marking.  
3
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Pin Configurations(1,2,3) (con't.)  
10/25/01  
51  
A5L  
52  
A6L  
54  
A8L  
56  
50  
A4L  
48  
A2L  
46  
A0L  
44  
BUSYL  
42  
M/S  
40  
INTR  
38  
A1R  
36  
A3R  
11  
10  
09  
08  
07  
53  
A7L  
49  
A3L  
47  
A1L  
45  
INTL  
43  
GND  
41  
39  
37  
35  
A4R  
34  
A5R  
BUSYR A0R A2R  
55  
A9L  
32  
A7R  
33  
A6R  
57  
A11L  
30  
A9R  
31  
A8R  
A10L  
58  
A12L  
60  
A13L  
62  
59  
VCC  
28  
A11R  
29  
A10R  
IDT70V07G  
G68-1(4)  
61  
26  
GND  
27  
A12R  
06  
05  
A14L  
68-Pin PGA  
Top View(5)  
63  
SEML  
24  
25  
A14R A13R  
CEL  
65  
64  
22  
SEMR  
23  
CER  
04  
03  
02  
01  
OEL  
R/WL  
66  
67  
20  
OER  
21  
R/WR  
I/O0L  
N/C  
1
3
5
7
9
68  
11  
13  
VCC  
15  
18  
I/O7R  
19  
N/C  
GND  
GND  
I/O7L  
I/O1L  
I/O4L  
I/O2L  
I/O1R  
I/O4R  
,
2
4
6
8
10  
12  
14  
16  
17  
I/O5L  
I/O0R I/O2R I/O3R I/O5R I/O6R  
VCC  
E
I/O6L  
I/O3L  
K
A
B
C
D
F
G
H
J
L
INDEX  
2943 drw 04  
NOTES:  
1. All VCC pins must be connected to power supply.  
2. All GND pins must be connected to ground.  
3. Package body is approximately 1.18 in x 1.18 in x .16 in.  
4. This package code is used to reference the package diagram.  
5. This text does not indicate orientation of the actual part-marking.  
Pin Names  
Left Port  
Right Port  
Names  
Chip Enable  
CE  
R/W  
OE  
L
CE  
R/W  
OE  
R
L
R
Read/Write Enable  
Output Enable  
Address  
L
R
A
0L - A14L  
A
0R - A14R  
I/O0R - I/O7R  
SEM  
INT  
I/O0L - I/O7L  
SEM  
INT  
BUSY  
Data Input/Output  
Semaphore Enable  
Interrupt Flag  
L
R
L
R
Busy Flag  
L
BUSY  
M/S  
R
Master or Slave Select  
Power (3.3V)  
V
CC  
GND  
Ground (0V)  
2943 tbl 01  
4
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Truth Table I: Non-Contention Read/Write Control  
Outputs  
Inputs(1)  
R/W  
I/O0-7  
Mode  
CE  
H
L
OE  
X
SEM  
H
X
L
High-Z  
DATAIN  
DATAOUT  
High-Z  
Deselected: Power-Down  
Write to Memory  
X
H
L
H
X
L
H
Read Memory  
X
H
X
Outputs Disabled  
2943 tbl 02  
NOTE:  
1. A0L — A14L A0R — A14R  
Truth Table II: Semaphore Read/Write Control  
Inputs(1)  
Outputs  
R/W  
I/O0-7  
Mode  
CE  
H
OE  
L
SEM  
H
L
L
L
DATAOUT  
Read Data in Semaphore Flag  
Write I/O into Semaphore Flag  
H
X
DATAIN  
0
____  
L
X
X
Not Allowed  
2943 tbl 03  
NOTE:  
1. There are eight semaphore flags written to via I/O0 and read from all I/O's (I/O0-I/O7). These eight semaphores are addressed by A0-A2  
Absolute Maximum Ratings(1)  
Maximum Operating Temperature  
and Supply Voltage(1)  
Symbol  
Rating  
Commercial  
& Industrial  
Unit  
Grade  
Commercial  
Industrial  
Ambient Temperature  
GND  
Vcc  
(2)  
V
TERM  
Terminal Voltage  
-0.5 to +4.6  
V
0OC to +70OC  
0V  
3.3V  
3.3V  
+
+
0.3  
0.3  
with Respect to GND  
-40OC to +85OC  
0V  
(3)  
T
BIAS  
STG  
JN  
OUT  
Temperature Under Bias  
StorageTemperature  
Junction Temperature  
DC Output Current  
-55 to +125  
-65 to +150  
+150  
oC  
oC  
oC  
2943 tbl 05  
T
NOTES:  
1. This is the parameter TA. This is the "instant on" case temperature.  
T
I
50  
mA  
2943 tbl 04  
NOTES:  
Recommended DC Operating  
Conditions(2)  
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may  
cause permanent damage to the device. This is a stress rating only and functional  
operation of the device at these or any other conditions above those indicated in  
the operational sections of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect reliability.  
2. VTERM must not exceed Vcc + 0.3V.  
Symbol  
Parameter  
Supply Voltage  
Ground  
Min.  
Typ.  
Max.  
Unit  
V
V
CC  
3.0  
3.3  
3.6  
3. Ambient Temperature Under Bias. No AC Conditions. Chip Deselected.  
GND  
0
0
0
V
CC+0.3(2)  
0.8  
V
____  
V
V
IH  
IL  
Input High Voltage  
Input Low Voltage  
2.0  
V
Capacitance(1)  
(TA = +25°C, f = 1.0MHz) TQFP Only  
-0.3(1)  
V
____  
2943 tbl 06  
Symbol  
Parameter  
Input Capacitance  
Output Capacitance  
Conditions  
IN = 0V  
OUT = 0V  
Max. Unit  
NOTES:  
1. VIL > -1.5V for pulse width less than 10ns.  
2. VTERM must not exceed Vcc + 0.3V.  
CIN  
V
9
pF  
(2)  
OUT  
C
V
10  
pF  
2943 tbl 07  
NOTES:  
1. This parameter is determined by device characterization but is not production  
tested.  
2. COUT also references CI/O.  
5
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
DC Electrical Characteristics Over the Operating  
Temperature and Supply Voltage Range (VCC = 3.3V ± 0.3V)  
70V07S  
70V07L  
Symbol  
|ILI  
|ILO  
Parameter  
Input Leakage Current(1)  
Output Leakage Current  
Output Low Voltage  
Test Conditions  
Min.  
Max.  
10  
Min.  
Max.  
Unit  
µA  
µA  
V
___  
___  
|
V
CC = 3.6V, VIN = 0V to VCC  
5
5
___  
___  
___  
___  
|
10  
CE = VIH, VOUT = 0V to VCC  
OL = +4mA  
V
OL  
OH  
I
0.4  
0.4  
___  
___  
V
Output High Voltage  
IOH = -4mA  
2.4  
2.4  
V
2943 tbl 08  
NOTE:  
1. At VCC < 2.0V, input leakages are undefined.  
DC Electrical Characteristics Over the Operating  
Temperature and Supply Voltage Range(1) (VCC = 3.3V ± 0.3V)  
70V07X25  
Com'l  
& Ind  
70V07X35  
Com'l  
& Ind  
70V07X55  
Com'l Only  
Symbol  
Parameter  
Test Condition  
Version  
COM'L  
Typ.(2)  
Max.  
Typ.(2)  
Max.  
Typ.(2)  
Max.  
Unit  
ICC  
Dynamic Operating  
Current  
(Both Ports Active)  
S
L
100  
100  
170  
140  
90  
90  
140  
120  
90  
90  
140  
120  
mA  
CE = VIL, Outputs Disabled  
SEM = VIL  
(3)  
f = fMAX  
____  
____  
____  
____  
____  
____  
____  
____  
IND  
S
L
100  
185  
90  
155  
I
SB1  
Standby Current  
(Both Ports - TTL  
Level Inputs)  
COM'L  
IND  
S
L
14  
12  
30  
24  
12  
10  
30  
24  
12  
10  
30  
24  
mA  
mA  
mA  
mA  
CE  
SEM  
f = fMAX  
R
= CE  
L
= VIH  
= VIH  
R
= SEM  
L
(3)  
____  
____  
____  
____  
____  
____  
____  
____  
S
L
12  
50  
10  
50  
(5)  
ISB2  
Standby Current  
(One Port - TTL  
Level Inputs)  
COM'L  
IND  
S
L
50  
50  
95  
85  
45  
45  
87  
75  
45  
45  
87  
75  
CE"A" = VIL and CE"B" = VIH  
Active Port Outputs Disabled,  
(3)  
f=fMAX  
SEM  
____  
____  
____  
____  
____  
____  
____  
____  
S
L
R
= SEM  
L
= VIH  
50  
105  
45  
95  
ISB3  
Full Standby Current  
(Both Ports -  
CMOS Level Inputs)  
Both Ports CE  
L
and  
COM'L  
IND  
S
L
1.0  
0.2  
6
3
1.0  
0.2  
6
3
1.0  
0.2  
6
3
CE  
R
> VCC - 0.2V,  
V
IN > VCC - 0.2V or  
____  
____  
____  
____  
____  
____  
____  
____  
V
IN < 0.2V, f = 0(4)  
S
L
0.2  
3
0.2  
3
SEMR = SEML > VCC - 0.2V  
ISB4  
Full Standby Current  
(One Port -  
CMOS Level Inputs)  
COM'L  
IND  
S
L
60  
60  
90  
80  
55  
55  
85  
74  
55  
55  
85  
74  
CE"A" < 0.2V and  
CE"B" > VCC - 0.2V(5)  
SEM  
R = SEML > VCC - 0.2V  
____  
____  
____  
____  
____  
____  
____  
____  
S
L
V
IN > VCC - 0.2V or VIN < 0.2V  
Active Port Outputs Disabled,  
60  
90  
55  
85  
(3)  
f = fMAX  
2943 tbl 09  
NOTES:  
1. 'X' in part number indicates power rating (S or L).  
2. VCC = 3.3V, TA = +25°C, and are not production tested. ICCDC = 80mA (Typ.)  
3. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/ tRC, and using “AC Test Conditions" of input levels  
of GND to 3V.  
4. f = 0 means no address or control lines change.  
5. Port "A" may be either left or right port. Port "B" is the opposite from port "A".  
6
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
3.3V  
3.3V  
AC Test Conditions  
Input Pulse Levels  
GND to 3.0V  
3ns  
590  
590Ω  
Input Rise/Fall Times  
DATAOUT  
BUSY  
INT  
Input Timing Reference Levels  
Output Reference Levels  
Output Load  
1.5V  
DATAOUT  
1.5V  
30pF  
5pF*  
435Ω  
435Ω  
Figures 1 and 2  
2943 tbl 10  
2943 drw 06  
2943 drw 05  
Figure 2. Output Test Load  
(for tLZ, tHZ, tWZ, tOW)  
Figure 1. AC Output Test Load  
* Including scope and jig.  
AC Electrical Characteristics Over the  
Operating Temperature and Supply Voltage Range(4)  
70V07X25  
Com'l  
& Ind  
70V07X35  
Com'l  
& Ind  
70V07X55  
Com'l Only  
Symbol  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
READ CYCLE  
____  
____  
____  
t
RC  
AA  
ACE  
AOE  
OH  
LZ  
HZ  
PU  
PD  
SOP  
SAA  
Read Cycle Time  
25  
35  
55  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
____  
____  
____  
t
Address Access Time  
25  
25  
35  
35  
55  
55  
Chip Enable Access Time(3)  
____  
____  
____  
____  
____  
____  
t
t
Output Enable Access Time  
15  
20  
30  
____  
____  
____  
t
Output Hold from Address Change  
Output Low-Z Time(1,2)  
3
3
3
____  
____  
____  
t
3
3
3
Output High-Z Time(1,2)  
15  
20  
25  
____  
____  
____  
t
t
Chip Enable to Power Up Time(2)  
Chip Disable to Power Down Time(2)  
Semaphore Flag Update Pulse (OE or SEM)  
Semaphore Address Access Time  
0
0
0
____  
____  
____  
____  
____  
____  
t
25  
35  
50  
____  
____  
____  
t
15  
15  
15  
____  
____  
____  
t
35  
45  
65  
ns  
2943 tbl 11  
NOTES:  
1. Transition is measured 0mV from Low- or High-impedance voltage with Output Test Load (Figure 2).  
2. This parameter is guaranteed by device characterization, but is not production tested.  
3. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL.  
4. 'X' in part number indicates power rating (S or L).  
Timing of Power-Up Power-Down  
CE  
tPU  
tPD  
ICC  
ISB  
,
2943 drw 07  
7
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Waveform of Read Cycles(5)  
tRC  
ADDR  
(4)  
AA  
t
(4)  
tACE  
CE  
OE  
(4)  
tAOE  
R/W  
DATAOUT  
BUSYOUT  
(1)  
t
OH  
(2)  
tLZ  
VALID DATA(4)  
t
HZ  
(3,4)  
2943 drw 08  
t
BDD  
NOTES:  
1. Timing depends on which signal is asserted last, OE or CE.  
2. Timing depends on which signal is de-asserted first, CE or OE.  
3. tBDD delay is required only in cases where the opposite port is completing a write operation to the same address location. For simultaneous read operations BUSY has no  
relation to valid output data.  
4. Start of valid data depends on which timing becomes effective last tAOE, tACE, tAA or tBDD.  
5. SEM = VIH.  
AC Electrical Characteristics Over the  
Operating Temperature and Supply Voltage(5)  
70V07X25  
Com'l  
& Ind  
70V07X35  
Com'l  
& Ind  
70V07X55  
Com'l Only  
Symbol  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
WRITE CYCLE  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
tWC  
tEW  
tAW  
tAS  
Write Cycle Time  
25  
20  
20  
0
35  
30  
30  
0
55  
45  
45  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Chip Enable to End-of-Write(3)  
Address Valid to End-of-Write  
Address Set-up Time(3)  
tWP  
tWR  
tDW  
tHZ  
Write Pulse Width  
20  
0
25  
0
40  
0
Write Recovery Time  
Data Valid to End-of-Write  
Output High-Z Time(1,2)  
15  
20  
30  
____  
____  
____  
15  
20  
25  
tDH  
Data Hold Time(4)  
0
0
0
____  
____  
____  
Write Enable to Output in High-Z(1,2)  
Output Active from End-of-Write(1,2,4)  
SEM Flag Write to Read Time  
SEM Flag Contention Window  
15  
20  
25  
____  
____  
____  
tWZ  
tOW  
tSWRD  
tSPS  
____  
____  
____  
0
5
5
0
5
5
0
5
5
____  
____  
____  
____  
____  
____  
ns  
2943 tbl 12  
NOTES:  
1. Transition is measured 0mV from Low or High impedance voltage with Output Test Load (Figure 2).  
2. This parameter is guaranteed by device characterization, but is not production tested.  
3. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. Either condition must be valid for the entire tEW time.  
4. The specification for tDH must be met by the device supplying write data to the SRAM under all operating conditions. Although tDH and tOW values will vary over voltage and  
temperature, the actual tDH will always be smaller than the actual tOW.  
5. 'X' in part number indicates power rating (S or L).  
8
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Write Cycle No. 1, R/W Controlled Timing(1,5,8)  
t
WC  
ADDRESS  
(7)  
tHZ  
OE  
tAW  
CE or SEM(9)  
(7)  
tHZ  
(3)  
(6)  
(2)  
tWR  
tAS  
tWP  
R/W  
(7)  
tLZ  
t
OW  
tWZ  
(4)  
(4)  
OUT  
DATA  
tDH  
tDW  
IN  
DATA  
,
2943 drw 09  
Timing Waveform of Write Cycle No. 2, CE Controlled Timing(1,5)  
tWC  
ADDRESS  
tAW  
CE or SEM(9)  
(3)  
WR  
(6)  
(2)  
t
tAS  
tEW  
R/W  
tDW  
tDH  
DATAIN  
2943 drw 10  
NOTES:  
1. R/W or CE must be HIGH during all address transitions.  
2. A write occurs during the overlap (tEW or tWP) of a LOW CE and a LOW R/W for memory array writing cycle.  
3. tWR is measured from the earlier of CE or R/W (or SEM or R/W) going HIGH to the end of write cycle.  
4. During this period, the I/O pins are in the output state and input signals must not be applied.  
5. If the CE or SEM LOW transition occurs simultaneously with or after the R/W LOW transition, the outputs remain in the High-impedance state.  
6. Timing depends on which enable signal is asserted last, CE or R/W.  
7. This parameter is guaranteed by device characterization, but is not production tested. Transition is measured 0mV from steady state with the Output Test Load  
(Figure 2).  
8. If OE is LOW during R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers to turn off and data to be placed on the  
bus for the required tDW. If OE is HIGH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified tWP.  
9. To access SRAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. tEW must be met for either condition.  
9
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Semaphore Read after Write Timing, Either Side(1)  
tSAA  
tOH  
A0-A2  
VALID ADDRESS  
VALID ADDRESS  
t
AW  
tWR  
tACE  
tEW  
SEM  
tDW  
tSOP  
OUT  
DATA  
DATA  
0
IN  
DATA VALID  
VALID(2)  
tAS  
tWP  
tDH  
R/W  
tSWRD  
tAOE  
OE  
t
SOP  
Write Cycle  
Read Cycle  
2943 drw 11  
NOTES:  
1. CE = VIH for the duration of the above timing (both write and read cycle).  
2. “DATAOUT VALID” represents all I/O's (I/O0-I/O7) equal to the semaphore value.  
Timing Waveform of Semaphore Write Contention(1,3,4)  
A0"A"-A2"A"  
MATCH  
(2)  
SIDE "A"  
R/W"A"  
SEM"A"  
t
SPS  
A0"B"-A2"B"  
MATCH  
(2)  
SIDE  
R/W"B"  
SEM"B"  
"B"  
2943 drw 12  
NOTES:  
1. DOR = DOL = VIL, CER = CEL = VIH.  
2. All timing is the same for left and right ports. Port "A" may be either left or right port. "B" is the opposite from port "A".  
3. This parameter is measured from R/W"A" or SEM"A" going HIGH to R/WB or SEM"B" going HIGH.  
4. If tSPS is not satisfied, the semaphore will fall positively to one side or the other, but there is no guarantee which side will obtain the flag.  
10  
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
AC Electrical Characteristics Over the  
Operating Temperature and Supply Voltage Range(6)  
70V07X25  
Com'l  
& Ind  
70V07X35  
Com'l  
& Ind  
70V07X55  
Com'l Only  
Symbol  
BUSY TIMING (M/S = VIH  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
)
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
BAA  
BDA  
BAC  
BDC  
APS  
BDD  
25  
25  
25  
35  
35  
35  
45  
45  
45  
ns  
ns  
ns  
ns  
ns  
ns  
BUSY Access Time from Address  
BUSY Disable Time from Address  
BUSY Access Time from Chip Enable  
BUSY Disable Time from Chip Enable  
Arbitration Priority Set-up Time(2)  
BUSY Disable to Valid Data(3)  
t
t
t
25  
35  
45  
____  
____  
____  
t
5
5
5
____  
____  
____  
t
35  
40  
50  
BUSY TIMING (M/S - VIL  
)
____  
____  
____  
____  
____  
____  
BUSY Input to Write(4)  
Write Hold After BUSY(5)  
t
WB  
0
0
0
ns  
ns  
tWH  
20  
25  
25  
PORT-TO-PORT DELAY TIMING  
____  
____  
____  
____  
____  
____  
t
WDD  
Write Pulse to Data Delay(1)  
55  
50  
65  
60  
85  
80  
ns  
tDDD  
Write Data Valid to Read Data Delay(1)  
ns  
2943 tbl 13  
NOTES:  
1. Port-to-port delay through RAM cells from writing port to reading port, refer to "Timing Waveform of Write with Port-to-Port Read and BUSY".  
2. To ensure that the earlier of the two ports wins.  
3. tBDD is a calculated parameter and is the greater of 0, tWDD – tWP (actual) or tDDD – tDW (actual).  
4. To ensure that the write cycle is inhibited on port "B" during contention on port "A".  
5. To ensure that a write cycle is completed on port "B" after contention on port "A".  
6. 'X' in part numbers indicates power rating (S or L).  
Timing Waveform of Write with Port-to-Port Read and BUSY(2,4,5)  
tWC  
ADDR"A"  
R/W"A"  
MATCH  
tWP  
tDW  
t
DH  
DATAIN "A"  
VALID  
(1)  
tAPS  
ADDR"B"  
MATCH  
tBDA  
tBDD  
tBAA  
BUSY"B"  
tWDD  
DATAOUT "B"  
VALID  
(3)  
tDDD  
NOTES:  
1. To ensure that the earlier of the two ports wins. tAPS is ignored for M/S = VIL (SLAVE).  
2. CEL = CER = VIL  
2943 drw 13  
3. OE = VIL for the reading port.  
4. If M/S = VIL (SLAVE), then BUSY is an input (BUSY"A" = VIH and BUSY"B" = "don't care", for this example).  
5. All timing is the same for left and right ports. Port "A" may be either the left or right port. Port "B" is the port opposite from port "A".  
11  
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Write with BUSY  
tWP  
R/W"A"  
tWB  
BUSY"B"  
(1)  
t
WH  
(2)  
R/W"B"  
2943 drw 14  
NOTES:  
1. tWH must be met for both BUSY input (SLAVE) and output (MASTER).  
2. BUSY is asserted on Port "B" blocking R/W"B", until BUSY"B" goes HIGH.  
Waveform of BUSY Arbitration Controlled by CE Timing(1)  
ADDR"A"  
ADDRESSES MATCH  
and "B"  
CE"A"  
(2)  
tAPS  
CE"B"  
tBAC  
tBDC  
BUSY"B"  
2943 drw 15  
Waveform of BUSY Arbitration Cycle Controlled by Address Match Timing(1)  
ADDR"A"  
ADDRESS "N"  
(2)  
tAPS  
ADDR"B"  
MATCHING ADDRESS "N"  
tBAA  
tBDA  
BUSY"B"  
2943 drw 16  
NOTES:  
1. All timing is the same for left and right ports. Port “A” may be either the left or right port. Port “B” is the port opposite from Port “A”.  
2. If tAPS is not satisfied, the BUSY signal will be asserted on one side or the other, but there is no guarantee on which side busy will be asserted.  
12  
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
AC Electrical Characteristics Over the  
Operating Temperature and Supply Voltage Range(1)  
70V07X25  
Com'l  
& Ind  
70V07X35  
Com'l  
& Ind  
70V07X55  
Com'l Only  
Symbol  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
INTERRUPT TIMING  
____  
____  
____  
____  
____  
____  
t
AS  
WR  
INS  
INR  
Address Set-up Time  
Write Recovery Time  
Interrupt Set Time  
0
0
0
ns  
ns  
ns  
t
0
0
0
____  
____  
____  
t
25  
30  
30  
35  
40  
45  
____  
____  
____  
t
Interrupt Reset Time  
ns  
2043 tbl 14  
NOTE:  
1. 'X' in part number indicates power rating (S or L).  
Waveform of Interrupt Timing(1)  
tWC  
INTERRUPT SET ADDRESS (2)  
ADDR"A"  
CE"A"  
(3)  
(4)  
tAS  
tWR  
R/W"A"  
INT"B"  
(3)  
tINS  
2943 drw 17  
t
RC  
ADDR"B"  
CE"B"  
INTERRUPT CLEAR ADDRESS (2)  
(3)  
tAS  
OE"B"  
(3)  
tINR  
INT"B"  
2943 drw 18  
NOTES:  
1. All timing is the same for left and right ports. Port “A” may be either the left or right port. Port “B” is the port opposite from port “A”.  
2. See Interrupt Truth Table III.  
3. Timing depends on which enable signal (CE or R/W) is asserted last.  
4. Timing depends on which enable signal (CE or R/W) is de-asserted first.  
13  
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Truth Table III — Interrupt Flag(1)  
Left Port  
Right Port  
R/W  
L
A14L-A0L  
R/WR  
A14R-A0R  
Function  
CEL  
OEL  
INTL  
CER  
OER  
INTR  
L
X
X
X
L
X
X
L
X
7FFF  
X
X
X
X
L
L
X
X
X
L(2)  
Set Right INT  
Reset Right INT  
Set Left INT Flag  
Reset Left INT  
R Flag  
(3)  
X
X
X
L
7FFF  
7FFE  
X
H
R Flag  
X
X
L(3)  
H(2)  
L
X
X
X
L
L
7FFE  
X
X
L Flag  
2943 tbl 15  
NOTES:  
1. Assumes BUSYL = BUSYR =VIH.  
2. If BUSYL = VIL, then no change.  
3. If BUSYR = VIL, then no change.  
Truth Table IV — Address BUSY  
Arbitration  
Inputs  
Outputs  
A
0L-A14L  
(1)  
(1)  
A0R-A14R  
Function  
Normal  
Normal  
Normal  
CE  
L
CE  
R
BUSY  
L
BUSYR  
X
H
X
L
X
X
H
L
NO MATCH  
MATCH  
H
H
H
H
MATCH  
H
H
MATCH  
(2)  
(2)  
Write Inhibit(3)  
2943 tbl 16  
NOTES:  
1. Pins BUSYL and BUSYR are both outputs when the part is configured as a master. Both are inputs when configured as a slave. BUSY outputs on the IDT70V07 are push-  
pull, not open drain outputs. On slaves the BUSY input internally inhibits writes.  
2. "L" if the inputs to the opposite port were stable prior to the address and enable inputs of this port. "H" if the inputs to the opposite port became stable after the address and  
enable inputs of this port. If tAPS is not met, either BUSYL or BUSYR = LOW will result. BUSYL and BUSYR outputs can not be LOW simultaneously.  
3. Writes to the left port are internally ignored when BUSYL outputs are driving LOW regardless of actual logic level on the pin. Writes to the right port are internally ignored when  
BUSYR outputs are driving LOW regardless of actual logic level on the pin.  
Truth Table V — Example of Semaphore Procurement Sequence(1,2,3)  
Functions  
D0  
- D7  
Left  
D0  
- D7  
Right  
Status  
No Action  
1
1
1
1
0
0
1
1
0
1
1
1
Semaphore free  
Left Port Writes "0" to Semaphore  
Right Port Writes "0" to Semaphore  
Left Port Writes "1" to Semaphore  
Left Port Writes "0" to Semaphore  
Right Port Writes "1" to Semaphore  
Left Port Writes "1" to Semaphore  
Right Port Writes "0" to Semaphore  
Right Port Writes "1" to Semaphore  
Left Port Writes "0" to Semaphore  
Left Port Writes "1" to Semaphore  
0
0
1
1
0
1
1
1
0
1
Left port has semaphore token  
No change. Right side has no write access to semaphore  
Right port obtains semaphore token  
No change. Left port has no write access to semaphore  
Left port obtains semaphore token  
Semaphore free  
Right port has semaphore token  
Semaphore free  
Left port has semaphore token  
Semaphore free  
2943 tbl 17  
NOTES:  
1. This table denotes a sequence of events for only one of the eight semaphores on the IDT70V07.  
2. There are eight semaphore flags written to via I/O0 and read from all I/O's (I/O0 - I/O7). These eight semaphores are addressed by A0 -A2.  
3. CE = VIH, SEM = VIL to access the semaphores. Refer to the Semaphore Read/Write Control Truth Table.  
14  
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
programmedbytyingtheBUSYpinsHIGH.Ifdesired,unintendedwrite  
operationscanbepreventedtoaportbytyingtheBUSYpinforthatport  
LOW.  
The BUSY outputs on the IDT 70V07 RAM in master mode, are  
push-pull type outputs and do not require pull up resistors to operate.  
If these RAMs are being expanded in depth, then the BUSY indication  
for the resulting array requires the use of an external AND gate.  
Functional Description  
The IDT70V07 provides two ports with separate control, address  
and I/O pins that permit independent access for reads or writes to any  
location in memory. The IDT70V07 has an automatic power down  
featurecontrolledbyCE.TheCEcontrolson-chippowerdowncircuitry  
thatpermitstherespectiveporttogointoastandbymodewhennotselected  
(CEHIGH). Whenaportisenabled, accesstotheentirememoryarray  
ispermitted.  
Width Expansion with BUSY Logic  
Master/Slave Arrays  
Interrupts  
When expanding an IDT70V07 RAM array in width while using  
BUSY logic, one master part is used to decide which side of the RAM  
array will receive a BUSY indication, and to output that indication. Any  
number of slaves to be addressed in the same address range as the  
master, use the BUSY signal as a write inhibit signal. Thus on the  
IDT70V07 RAM the BUSY pin is an output if the part is used as a  
master (M/S pin = VIH), and the BUSY pin is an input if the part used  
as a slave (M/S pin = VIL) as shown in Figure 3.  
If the user chooses the interrupt function, a memory location (mail  
boxormessagecenter)isassignedtoeachport. Theleftportinterrupt  
flag (INTL) is asserted when the right port writes to memory location  
7FFE (HEX), where a write is defined as CER = R/WR = VIL per Truth  
Table III. The left port clears the interrupt through access of address  
location 7FFE when CEL = OEL = VIL, R/W is a "don't care". Likewise,  
the right port interrupt flag (INTR) is asserted when the left port writes  
to memory location 7FFF (HEX) and to clear the interrupt flag (INTR),  
the right port must read the memory 7FFF location 7FFF. The  
message (8 bits) at 7FFE or 7FFF is user-defined since it is an  
addressable SRAM location. If the interrupt function is not used,  
address locations 7FFE and 7FFF are not used as mail boxes, but as  
part of the random access memory. Refer to Truth Table III for the  
interrupt operation.  
If two or more master parts were used when expanding in width, a  
splitdecisioncouldresultwithonemasterindicatingBUSYononeside  
of the array and another master indicating BUSY on one other side of  
the array. This would inhibit the write operations from one port for part  
of a word and inhibit the write operations from the other port for the  
other part of the word.  
TheBUSYarbitration,onamaster,isbasedonthechipenableand  
address signals only. It ignores whether an access is a read or write.  
In a master/slave array, both address and chip enable must be valid  
long enough for a BUSY flag to be output from the master before the  
actual write pulse can be initiated with the R/W signal. Failure to  
observe this timing can result in a glitched internal write inhibit signal  
and corrupted data in the slave.  
CE  
CE  
MASTER  
Dual Port  
RAM  
SLAVE  
Dual Port  
RAM  
BUSY  
L
BUSY  
L
BUSY  
R
BUSYR  
MASTER  
Dual Port  
RAM  
SLAVE  
Dual Port  
RAM  
CE  
CE  
Semaphores  
BUSY  
R
BUSY  
L
BUSY  
L
BUSY  
R
BUSYR  
BUSY  
L
The IDT70V07 is an extremely fast Dual-Port 32K x 8 CMOS Static  
RAM with an additional 8 address locations dedicated to binary  
semaphore flags. These flags allow either processor on the left or right  
side of the Dual-Port SRAM to claim a privilege over the other  
processor for functions defined by the system designer’s software. As  
an example, the semaphore can be used by one processor to inhibit  
the other from accessing a portion of the Dual-Port SRAM or any other  
shared resource.  
,
2943 drw 19  
Figure 3. Busy and chip enable routing for both width and depth expansion  
with IDT70V07 RAMs.  
Busy Logic  
Busy Logic provides a hardware indication that both ports of the  
SRAM have accessed the same location at the same time. It also  
allows one of the two accesses to proceed and signals the other side  
that the SRAM is “busy”. The busy pin can then be used to stall the  
access until the operation on the other side is completed. If a write  
operation has been attempted from the side that receives a BUSY  
indication, the write signal is gated internally to prevent the write from  
proceeding.  
The use of BUSY logic is not required or desirable for all applica-  
tions. InsomecasesitmaybeusefultologicallyORthe BUSYoutputs  
togetheranduseanyBUSYindicationasaninterruptsourcetoflagthe  
event of an illegal or illogical operation. If the write inhibit function of  
BUSYlogicisnotdesirable, theBUSYlogiccanbedisabledbyplacing  
the part in slave mode with the M/Spin. Once in slave mode theBUSY  
pinoperatessolelyasawriteinhibitinputpin. Normaloperationcanbe  
The Dual-Port SRAM features a fast access time, and both ports  
are completely independent of each other. This means that the activity  
on the left port in no way slows the access time of the right port. Both  
ports are identical in function to standard CMOS Static RAM and can  
be read from, or written to, at the same time with the only possible  
conflict arising from the simultaneous writing of, or a simultaneous  
READ/WRITE of, a non-semaphore location. Semaphores are pro-  
tected against such ambiguous situations and may be used by the  
system program to avoid any conflicts in the non-semaphore portion  
of the Dual-Port SRAM. These devices have an automatic power-  
downfeaturecontrolledbyCE, theDual-PortSRAMenable, andSEM,  
the semaphore enable. The CE and SEM pins control on-chip power  
down circuitry that permits the respective port to go into standby mode  
when not selected. This is the condition which is shown in Truth Table  
15  
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
I where CE and SEM are both HIGH.  
semaphoreflagsusefulininterprocessorcommunications.(Athorough  
Systems which can best use the IDT70V07 contain multiple discussionontheuseofthisfeaturefollowsshortly.)Azerowrittenintothe  
processors or controllers and are typically very high-speed systems samelocationfromtheothersidewillbestoredinthesemaphorerequest  
which are software controlled or software intensive. These systems  
can benefit from a performance increase offered by the IDT70V07's  
hardware semaphores, which provide a lockout mechanism without  
requiring complex programming.  
L PORT  
R PORT  
SEMAPHORE  
REQUEST FLIP FLOP  
SEMAPHORE  
REQUEST FLIP FLOP  
Softwarehandshakingbetweenprocessorsoffersthemaximumin  
system flexibility by permitting shared resources to be allocated in  
varying configurations. The IDT70V07 does not use its semaphore  
flags to control any resources through hardware, thus allowing the  
system designer total flexibility in system architecture.  
An advantage of using semaphores rather than the more common  
methods of hardware arbitration is that wait states are never incurred  
in either processor. This can prove to be a major advantage in very  
high-speed systems.  
0
D
0
D
D
D
Q
Q
WRITE  
WRITE  
SEMAPHORE  
READ  
SEMAPHORE  
READ  
,
2943 drw 20  
Figure 4. IDT70V07 Semaphore Logic  
latchforthatsideuntilthesemaphoreisfreedbythefirstside.  
How the Semaphore Flags Work  
The semaphore logic is a set of eight latches which are indepen-  
dent of the Dual-Port SRAM. These latches can be used to pass a flag,  
or token, from one port to the other to indicate that a shared resource  
is in use. The semaphores provide a hardware assist for a use  
assignmentmethodcalledTokenPassingAllocation.Inthismethod,  
thestateofasemaphorelatchisusedasatokenindicatingthatshared  
resource is in use. If the left processor wants to use this resource, it  
requests the token by setting the latch. This processor then verifies its  
success in setting the latch by reading it. If it was successful, it  
proceeds to assume control over the shared resource. If it was not  
successful in setting the latch, it determines that the right side  
processor has set the latch first, has the token and is using the shared  
resource. The left processor can then either repeatedly request that  
semaphore’s status or remove its request for that semaphore to  
perform another task and occasionally attempt again to gain control of  
the token via the set and test sequence. Once the right side has  
relinquished the token, the left side should succeed in gaining control.  
The semaphore flags are active LOW. A token is requested by  
writing a zero into a semaphore latch and is released when the same  
side writes a one to that latch.  
The eight semaphore flags reside within the IDT70V07 in a  
separate memory space from the Dual-Port SRAM. This address  
space is accessed by placing a LOW input on the SEM pin (which acts  
as a chip select for the semaphore flags) and using the other control  
pins (Address, OE, and R/W) as they would be used in accessing a  
standard Static RAM. Each of the flags has a unique address which  
can be accessed by either side through address pins A0 – A2. When  
accessing the semaphores, none of the other address pins has any  
effect.  
Whenasemaphoreflagisread,itsvalueisspreadintoalldatabitsso  
thataflagthatisaonereadsasaoneinalldatabitsandaflagcontaining  
azeroreadsasallzeros.Thereadvalueislatchedintooneside’soutput  
registerwhenthatside'ssemaphoreselect(SEM)andoutputenable(OE)  
signalsgoactive.Thisservestodisallowthesemaphorefromchanging  
stateinthemiddleofareadcycleduetoawritecyclefromtheotherside.  
Becauseofthislatch,arepeatedreadofasemaphoreinatestloopmust  
cause either signal (SEM or OE) to go inactive or the output will never  
change.  
A sequence WRITE/READ must be used by the semaphore in  
order to guarantee that no system level contention will occur. A  
processor requests access to shared resources by attempting to write  
a zero into a semaphore location. If the semaphore is already in use,  
the semaphore request latch will contain a zero, yet the semaphore  
flag will appear as one, a fact which the processor will verify by the  
subsequent read (see Truth Table V). As an example, assume a  
processorwritesazerototheleftportatafreesemaphorelocation. On  
asubsequentread, theprocessorwillverifythatithaswrittensuccess-  
fully to that location and will assume control over the resource in  
question. Meanwhile, if a processor on the right side attempts to write  
a zero to the same semaphore flag it will fail, as will be verified by the  
factthataonewillbereadfromthatsemaphoreontherightsideduring  
subsequent read. Had a sequence of READ/WRITE been used  
instead, system contention problems could have occurred during the  
gap between the read and write cycles.  
It is important to note that a failed semaphore request must be  
followed by either repeated reads or by writing a one into the same  
location. The reason for this is easily understood by looking at the  
simple logic diagram of the semaphore flag in Figure 4. Two sema-  
phore request latches feed into a semaphore flag. Whichever latch is  
first to present a zero to the semaphore flag will force its side of the  
semaphore flag LOW and the other side HIGH. This condition will  
continue until a one is written to the same semaphore request latch.  
Should the other side’s semaphore request latch have been written to  
a zero in the meantime, the semaphore flag will flip over to the other  
side as soon as a one is written into the first side’s request latch. The  
second side’s flag will now stay LOW until its semaphore request latch  
iswrittentoaone.Fromthisitiseasytounderstandthat,ifasemaphore  
When writing to a semaphore, only data pin D0 is used. If a LOW  
level is written into an unused semaphore location, that flag will be set  
to a zero on that side and a one on the other side (see Truth Table V).  
That semaphore can now only be modified by the side showing the  
zero. When a one is written into the same location from the same side,  
the flag will be set to a one for both sides (unless a semaphore request  
fromtheothersideispending)andthencanbewrittentobybothsides.  
The fact that the side which is able to write a zero into a semaphore  
subsequently locks out writes from the other side is what makes  
16  
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
is requested and the processor which requested it no longer needs the side.  
resource, the entire system can hang up until a one is written into that  
Once the left side was finished with its task, it would write a one to  
semaphorerequestlatch.  
Semaphore 0 and may then try to gain access to Semaphore 1. If  
The critical case of semaphore timing is when both sides request Semaphore 1 was still occupied by the right side, the left side could  
a single token by attempting to write a zero into it at the same time. The undo its semaphore request and perform other tasks until it was able  
semaphore logic is specially designed to resolve this problem. If to write, then read a zero into Semaphore 1. If the right processor  
simultaneous requests are made, the logic guarantees that only one performsasimilartaskwithSemaphore0,thisprotocolwouldallowthe  
side receives the token. If one side is earlier than the other in making two processors to swap 16K blocks of Dual-Port SRAM with each  
the request, the first side to make the request will receive the token. If other.  
bothrequestsarriveatthesametime, theassignmentwillbearbitrarily  
made to one port or the other.  
The blocks do not have to be any particular size and can even be  
variable, depending upon the complexity of the software using the  
One caution that should be noted when using semaphores is that semaphore flags. All eight semaphores could be used to divide the  
semaphores alone do not guarantee that access to a resource is Dual-Port SRAM or other shared resources into eight parts. Sema-  
secure. As with any powerful programming technique, if semaphores phores can even be assigned different meanings on different sides  
are misused or misinterpreted, a software error can easily happen. rather than being given a common meaning as was shown in the  
Initialization of the semaphores is not automatic and must be example above.  
handled via the initialization program at power-up. Since any sema-  
Semaphores are a useful form of arbitration in systems like disk  
phore request flag which contains a zero must be reset to a one, all interfaces where the CPU must be locked out of a section of memory  
semaphores on both sides should have a one written into them at during a transfer and the I/O device cannot tolerate any wait states.  
initialization from both sides to assure that they will be free when With the use of semaphores, once the two devices has determined  
needed.  
which memory area was “off-limits” to the CPU, both the CPU and the  
I/O devices could access their assigned portions of memory continu-  
ously without any wait states.  
Semaphores are also useful in applications where no memory  
“WAIT” state is available on one or both sides. Once a semaphore  
handshake has been performed, both processors can access their  
assigned SRAM segments at full speed.  
Anotherapplicationisintheareaofcomplexdatastructures. Inthis  
case, block arbitration is very important. For this application one  
processor may be responsible for building and updating a data  
structure. The other processor then reads and interprets that data  
structure. If the interpreting processor reads an incomplete data  
structure, a major error condition may exist. Therefore, some sort of  
arbitration must be used between the two different processors. The  
building processor arbitrates for the block, locks it and then is able to  
goinandupdatethedatastructure.Whentheupdateiscompleted,the  
data structure block is released. This allows the interpreting processor  
to come back and read the complete data structure, thereby guaran-  
teeing a consistent data structure.  
Using Semaphores—Some Examples  
Perhaps the simplest application of semaphores is their applica-  
tionasresourcemarkersfortheIDT70V07’sDual-PortSRAM. Saythe  
32K x 8 SRAM was to be divided into two 16K x 8 blocks which were  
to be dedicated at any one time to servicing either the left or right port.  
Semaphore 0 could be used to indicate the side which would control  
thelowersectionofmemory,andSemaphore1couldbedefinedasthe  
indicator for the upper section of memory.  
To take a resource, in this example the lower 16K of Dual-Port  
SRAM, the processor on the left port could write and then read a zero  
in to Semaphore 0. If this task were successfully completed (a zero  
was read back rather than a one), the left processor would assume  
controlofthelower16K.Meanwhiletherightprocessorwasattempting  
to gain control of the resource after the left processor, it would read  
back a one in response to the zero it had attempted to write into  
Semaphore 0. At this point, the software could choose to try and gain  
control of the second 16K section by writing, then reading a zero into  
Semaphore1.Ifitsucceededingainingcontrol,itwouldlockouttheleft  
17  
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Ordering Information  
XXXXX  
A
999  
A
A
A
A
Device  
Type  
Power Speed Package  
Process/  
Temperature  
Range  
Blank  
8
Tube or Tray  
Tape and Reel  
Blank  
I(1)  
Commercial (0°C to +70°C)  
Industrial (-40°C to +85°C)  
G(2)  
Green  
PF  
G
J
80-pin TQFP (PN80-1)  
68-pin PGA (G68-1)  
68-pin PLCC (J68-1)  
,
25  
35  
55  
Commercial & Industrial  
Commercial & Industrial  
Commercial Only  
Speed in nanoseconds  
S
L
Standard Power  
Low Power  
256K (32K x 8) 3.3V Dual-Port RAM  
70V07  
2943 drw 21  
NOTES:  
1. Contact your local sales office for Industrial temp range in other speeds, packages and powers.  
2. Greenpartsavailable.Forspecificspeeds,packagesandpowerscontactyourlocalsalesoffice.  
LEADFINISH(SnPb)partsareinEOLprocess.ProductDiscontinuationNotice-PDN#SP-17-02  
Datasheet Document History:  
03/24/99:  
Initiateddatasheetdocumenthistory  
Converted to new format  
Cosmetic and typographical corrections  
Page2and3Addedadditionalnotestopinconfigurations  
Changeddrawingformatt  
06/09/99:  
10/14/04:  
RemovedPreliminarystatus  
Page 1 Added I-temp offering  
Page 4 Updated Capacitance table  
Increased Storage Temp parameter in Absolute Maximum Rating table  
Added Junction Temp to Absolute Maximum Rating table  
Page 4, 5, 6, 7 & 10 Removed I-temp footnote from tables  
Page5 AddedI-temp25nspowernumberstotheDCElectricalCharacteristicstable  
DC Electrical parameters–changed wording from "open" to "disabled"  
Page5&6 Changedtransitionmeasurementfrom 200mVto0mVinfootnotes  
Page6, 7, 10, &12AddedI-temptoallACElectricalCharacteristicstable  
Page 8 Updated Timing Waveform of Write Cycle No. 1, R/WControlled Timing  
Page 1 & 17 Replaced old IDTTM logo with new IDTTM logo  
Page 17 Added I-temp to 25ns speed grade in ordering information  
Page 18 Removed "IDT" from orderable part number  
01/29/09:  
01/30/09:  
Page 1 Addedgreenavailabilitytofeatures  
Page 18 Addedgreenindicatortoorderinginformation  
06/28/12:  
Page 17 AddedT&Rindicatortoorderinginformation  
18  
IDT70V07S/L  
High-Speed 32K x 8 Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Datasheet Document History (cont'd)  
01/28/13:  
Page 1 Added 35nstoIndustrialofferinginFeaturessection  
Page 2 RemovedreferencetoIDT's fabricationofCMOShigh-performancetechnologyinDescriptionsection  
Page 6 Added 35ns Industrial Chars values to the DC Elec Chars table  
Page7,8,11,13, &15AddedIndustrialtothe70V07X35columnheading  
Page 18 AddedIndustrialtothe35nsspeedgradeintheorderinginformation  
ProductDiscontinuationNotice-PDN#SP-17-02  
03/19/18:  
Last time buy expires June 15, 2018  
CORPORATE HEADQUARTERS  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
for SALES:  
for Tech Support:  
408-284-2794  
DualPortHelp@idt.com  
800-345-7015 or 408-284-8200  
fax: 408-284-2775  
www.idt.com  
TheIDTlogoisaregisteredtrademarkofIntegratedDeviceTechnology,Inc.  
19  

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