70V3569S4DRG [IDT]

Dual-Port SRAM, 16KX36, 4.2ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM, GREEN, PLASTIC, QFP-208;
70V3569S4DRG
型号: 70V3569S4DRG
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Dual-Port SRAM, 16KX36, 4.2ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM, GREEN, PLASTIC, QFP-208

时钟 静态存储器 输出元件 内存集成电路
文件: 总17页 (文件大小:187K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HIGH-SPEED 3.3V 16K x 36  
SYNCHRONOUS PIPELINED  
DUAL-PORT STATIC RAM  
WITH 3.3V OR 2.5V INTERFACE  
IDT70V3569S  
Š
Features:  
– Data input, address, byte enable and control registers  
– Self-timedwriteallowsfastcycletime  
Separate byte controls for multiplexed bus and bus  
matching compatibility  
LVTTL- compatible, single 3.3V (±150mV) power supply for  
core  
LVTTL- compatible, selectable 3.3V (±150mV)/2.5V (±125mV)  
power supply for I/Os and control signals on each port  
Industrial temperature range (-40°C to +85°C) is  
available for selected speeds  
Available in a 208-pin Plastic Quad Flatpack (PQFP),  
208-ball fine-pitch Ball Grid Array, and 256-pin Ball  
GridArray  
True Dual-Port memory cells which allow simultaneous  
access of the same memory location  
High-speed clock to data access  
– Commercial:4.2/5/6ns(max.)  
– Industrial: 5ns (max)  
Pipelined output mode  
Counter enable and reset features  
Dual chip enables allow for depth expansion without  
additional logic  
Full synchronous operation on both ports  
– 7.5ns cycle time, 133MHz operation (9.6 Gbps bandwidth)  
– Fast 4.2ns clock to data out  
– 1.8ns setup to clock and 0.7ns hold on all control, data, and  
address inputs @ 133MHz  
Green parts availble, see ordering instructions  
FunctionalBlockDiagram  
BE3L  
BE3R  
BE2R  
BE1R  
BE0R  
BE2L  
BE1L  
BE0L  
R/W  
L
R/WR  
B
B
B
B
B
B B B  
W W W W W WW W  
0
L
1
L
2
L
3
L
3
R
2
1
0
R
CE0L  
R R  
CE0R  
CE1L  
CE1R  
OE  
L
OER  
Dout0-8_L  
Dout0-8_R  
Dout9-17_R  
Dout18-26_R  
Dout27-35_R  
Dout9-17_L  
Dout18-26_L  
Dout27-35_L  
16K x 36  
MEMORY  
ARRAY  
I/O0L- I/O35L  
Din_L  
I/O0R - I/O35R  
Din_R  
,
CLK  
L
CLKR  
A
13L  
A
A
13R  
0R  
Counter/  
Address  
Reg.  
Counter/  
Address  
Reg.  
A
0L  
L
ADDR_L  
ADDR_R  
CNTRST  
ADS  
CNTEN  
CNTRST  
ADS  
CNTEN  
R
R
L
L
R
4831 tbl 01  
OCTOBER 2014  
1
DSC 4831/13  
©2014 Integrated Device Technology, Inc.  
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
Description:  
TheIDT70V3569isahigh-speed16Kx36bitsynchronousDual-Port inbursts.Anautomaticpowerdownfeature,controlledbyCE0andCE1,  
RAM. The memory array utilizes Dual-Port memory cells to allow permitstheon-chipcircuitryofeachporttoenteraverylowstandbypower  
simultaneousaccessofanyaddressfrombothports.Registersoncontrol, mode.  
data,andaddressinputsprovideminimalsetupandholdtimes.Thetiming  
The 70V3569 can support an operating voltage of either 3.3V or  
latitudeprovidedbythisapproachallowssystemstobedesignedwithvery 2.5V on one or both ports, controllable by the OPT pins. The power  
shortcycletimes.Withaninputdataregister,theIDT70V3569hasbeen supply for the core of the device (VDD) remains at 3.3V.  
optimizedforapplicationshavingunidirectionalorbidirectionaldataflow  
PinConfiguration(1,2,3,4)  
12/12/01  
A8  
A9  
BE1L  
A11  
A12  
A13  
A14  
A17  
A1  
A2  
A3  
A6  
A7  
A10  
A15  
A16  
A4  
A5  
A
8L  
CLK  
L
CNTEN  
L
A4L  
A
0L  
V
SS  
IO19L IO18L  
VSS  
NC  
A
12L  
VDD  
OPT  
L
I/O17L  
NC  
NC  
B1  
B2  
B3  
B6  
B7  
B9  
CE0L  
B11  
B12  
B13  
B17  
B4  
B5  
B8  
B10  
B14  
B15  
B16  
I/O20R  
V
SS I/O18R  
A
13L  
A
9L  
ADS  
L
A
5L  
A
1L  
I/O15R  
V
SS  
NC  
BE2L  
V
SS  
V
SS  
V
DDQR I/O16L  
C1  
C5  
C6  
C2  
C3  
C4  
C7  
C8  
C9  
C10  
C11  
C12  
C13  
C16  
C14  
C15  
C17  
VDDQL  
NC  
NC  
I/O19R  
V
DDQR  
VDD  
A10L BE3L CE1L  
VSS  
R/W  
L
A6L  
A2L  
I/O15L  
V
DD I/O16R  
VSS  
D1  
D2  
D6  
D9  
D11  
CNTRSTL  
D3  
D5  
D7  
D8  
D10  
D12  
D13  
D14 D15  
D16  
D17  
D4  
I/O22L  
V
SS  
A
11L  
V
DD  
I/O21L  
NC  
A
7L BE0L  
OE  
L
A
3L  
VDD I/O17R  
VDDQL I/O14L I/O14R  
I/O20L  
E1  
E2  
E3  
E4  
E14  
E16  
E17  
E15  
I/O23L I/O22R  
VDDQR I/O21R  
I/O12L  
V
SS I/O13L  
I/O13R  
F1  
F2  
F3  
F14  
F15  
F16  
F17  
F4  
VDDQL I/O23R I/O24L  
VSS I/O12R I/O11L VDDQR  
V
SS  
G1  
I/O26L  
G2  
G4  
G14  
G15  
G16  
G3  
G17  
V
SS  
I/O24R  
I/O9L  
VDDQL I/O10L  
I/O25L  
I/O11R  
H3  
H4  
H1  
H2  
H16  
H17  
H14  
H15  
70V3569BF  
BF-208(5)  
VDDQR I/O25R  
V
DD I/O26R  
V
SS I/O10R  
V
DD IO9R  
J1  
J2  
J3  
J4  
J14  
J15  
J16  
J17  
VDDQL  
V
DD  
VSS  
V
SS  
V
SS  
VDD  
V
SS  
VDDQR  
208-Pin fpBGA  
Top View(6)  
K2  
K4  
K15  
K16  
K1  
K3  
K14  
K17  
V
SS  
V
SS  
VDDQL I/O8R  
I/O7R  
I/O28R  
I/O27R  
VSS  
L3  
L4  
L15  
L16  
L17  
L1  
L2  
L14  
V
DDQR I/O27L  
I/O7L  
V
SS  
I/O8L  
I/O29R I/O28L  
I/O6R  
M1  
M2  
M3  
M4  
M16  
M17  
DDQR  
M14  
M15  
VDDQL I/O29L I/O30R  
V
SS  
I/O5R V  
V
SS  
I/O6L  
N16  
N17  
N4  
N15  
N1  
N2  
N3  
N14  
I/O4R I/O5L  
VDDQL  
I/O30L  
I/O31L  
V
SS I/O31R  
I/O3R  
P1  
P2  
P3  
P4  
P5  
P7  
P8  
P9  
P10  
P11  
P12  
P14  
P15  
P16  
P17  
P6  
P13  
I/O32R I/O32L  
V
DDQR I/O35R NC  
A12R  
A8R BE1R  
V
DD CLK  
R
CNTEN  
R
I/O2L I/O3L  
VSS I/O4L  
NC  
A4R  
R5  
R6  
R7  
R8  
R9  
R10  
R11  
R16  
R1 R2  
R3  
R4  
R12  
R13  
R14  
R17  
R15  
NC  
A13R  
A9R  
BE2R CE0R  
V
SS ADS  
R
I/O1R  
V
VDDQL  
VSS I/O33L I/O34R NC  
A
5R  
A1R  
V
SS  
DDQR  
T2  
I/O34L  
T3  
T1  
T4  
T5  
T8  
T9  
T15  
T16  
T17  
T6  
T7  
T10  
T11  
T12  
T13  
T14  
V
DDQL  
I/O33R  
V
SS  
NC  
BE3R CE1R  
I/O0R  
V
SS I/O2R  
NC  
A
10R  
V
SS R/W  
R
A
6R  
A
2R  
V
SS  
U1  
U2  
SS I/O35L  
U3  
U4  
U5  
U6  
U7  
U17  
U8  
BE0R  
U9  
U10  
U12  
U13  
U14  
U16  
U15  
V
V
DD  
NC  
NC  
A
11R  
A
7R  
I/O1L  
V
DD  
OE  
R
A
3R  
A0R  
V
DD  
I/O0L  
OPT  
R
,
4831 drw 02c  
NOTES:  
1. All VDD pins must be connected to 3.3V power supply.  
2. All VDDQ pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to VIH (3.3V), and 2.5V if OPT pin for that port is  
set to VIL (0V).  
3. All VSS pins must be connected to ground supply.  
4. Package body is approximately 15mm x 15mm x 1.4mm, with 0.8mm ball pitch.  
5. This package code is used to reference the package diagram.  
6. This text does not indicate orientation of the actual part-marking.  
6.42  
2
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
Pin Configuration(1,2,3,4) (con't.)  
70V3569BC  
BC-256(5)  
256-Pin BGA  
Top View(6)  
12/12/01  
A1  
A2  
A3  
A6  
A7  
A8  
A9  
A11  
A12  
A13  
A14  
A4  
A5  
A10  
A15  
A16  
NC  
NC  
NC  
A
11L  
A
8L  
BE2L CE1L  
CNTEN  
L
A
5L  
4L  
A
2L  
A
0L  
NC  
NC  
OE  
L
NC  
NC  
B1  
B2  
B3  
B6  
B7  
C7  
D7  
B9  
CE0L  
B11  
B12  
B13  
B4  
B5  
B8  
B10  
B14  
B15  
B16  
I/O18L NC  
NC  
A
12L  
A
9L  
CNTRST  
L
A
A
1L  
NC  
NC  
BE3L  
R/W  
L
V
DD I/O17L NC  
C1  
C5  
C6  
C2  
C3  
C4  
C8  
C9  
C10  
C11  
C12  
C13  
C16  
C14  
C15  
I/O18R  
A13L  
A
10L  
I/O19L  
VSS  
NC  
A7L  
BE1L BE0L CLK  
L
ADS  
L
A
6L  
A
3L  
I/O16L  
OPT  
L
I/O17R  
D1  
D2  
D6  
DDQL  
D9  
D11  
D3  
D5  
DDQL  
D8  
D10  
D12  
D13  
D14  
D15  
D16  
D4  
I/O20R I/O19R  
V
V
DDQL  
VDDQR  
I/O20L  
V
V
DDQR  
VDDQR  
VDDQL  
V
DDQR  
VDD I/O15R I/O15L I/O16R  
VDD  
E5  
E6  
E7  
E8  
E9  
E10  
E11  
E12  
E13  
E1  
E2  
E3  
E4  
DDQL  
E14  
E16  
E15  
V
DD  
V
DD  
SS  
SS  
V
SS  
V
SS  
V
SS  
V
SS  
VDD  
V
DD  
V
DDQR  
I/O13L  
I/O21R I/O21L I/O22L  
V
I/O14R  
I/O14L  
F7  
F5  
F6  
F9  
G9  
H9  
F10  
F1  
F2  
F3  
F11  
F13  
F14  
F15  
F16  
F8  
F12  
F4  
V
SS  
I/O23L I/O22R I/O23R  
V
DD  
V
V
SS  
V
SS  
I/O12R I/O13R I/O12L  
DDQR  
VSS  
V
VDDQL  
V
SS  
SS  
SS  
V
DD  
G1  
G2  
G3  
G5  
H5  
G4  
G6  
G8  
G14  
G15  
G16  
G7  
G10  
G12  
G13  
G11  
I/O24R  
V
SS  
I/O24L  
VDDQR  
V
V
VSS  
I/O25L  
I/O10L I/O11L I/O11R  
H16  
V
SS  
V
SS  
V
SS  
V
DDQL  
VSS  
H11  
H12  
H13  
H7  
H8  
H10  
H14  
H15  
H6  
H3  
I/O26R  
H4  
H1  
H2  
VSS  
V
SS  
I/O10R  
V
DDQL  
V
SS  
V
V
SS  
V
SS  
SS  
I/O9R IO9L  
VDDQR  
V
SS  
VSS  
I/O26L I/O25R  
J1  
J2  
J3  
J4  
J5  
J6  
J7  
J8  
J9  
J10  
J11  
J12  
J13  
J14  
J15  
J16  
I/O27L  
V
SS  
I/O28R I/O27R  
VDDQL  
V
SS  
SS  
V
SS  
V
SS  
SS  
VSS  
V
DDQR  
I/O8R  
V
VSS  
V
SS  
I/O7R I/O8L  
K6  
K8  
K10  
K12  
K13  
K2  
K4  
K5  
K7  
K9  
K11  
K15  
K16  
K1  
K3  
K14  
V
V
V
SS  
SS  
V
SS  
V
DDQR  
I/O6R  
I/O29L  
VDDQL  
V
SS  
V
SS  
V
SS  
VSS  
I/O6L I/O7L  
I/O29R  
I/O28L  
L7  
L8  
L11  
L12  
L13  
L5  
L6  
L9  
L10  
L3  
L4  
L15  
L16  
L1  
L2  
L14  
V
SS  
V
SS  
VSS  
V
DD  
V
DDQL  
I/O30R  
VDDQR  
V
DD  
V
SS  
V
SS  
V
I/O4R I/O5R  
I/O30L I/O31R  
I/O5L  
M5  
M6  
M7  
M8  
M9  
M10  
M11  
M12  
M13  
M1 M2  
M3  
M4  
M16  
M14  
M15  
V
DD  
V
DD  
VSS  
VSS  
VSS  
V
SS  
VDD  
V
DD  
V
DDQL  
I/O32R I/O32L I/O31L  
VDDQR  
I/O4L  
I/O3R I/O3L  
N8  
N12  
N13  
N16  
N5  
N6  
DDQR  
N7  
N9  
N10  
N11  
N4  
N15  
N1  
N2  
N3  
N14  
VDDQL  
VDDQL  
I/O2R  
VDD  
V
DD  
VDDQR  
V
V
DDQL  
V
DDQR  
VDDQR  
VDDQL  
I/O1R  
I/O33L I/O34R I/O33R  
I/O2L  
P1  
P2  
P3  
P4  
P5  
P7  
P8  
P9  
P10  
P11  
P12  
P14  
P15  
P16  
P6  
P13  
I/O35R I/O34L NC  
NC  
A13R  
A
7R BE1R BE0R CLK  
R
ADS  
R
A
6R  
I/O0L I/O0R I/O1L  
A
10R  
A3R  
R5  
R6  
R7  
R8  
R9  
R10  
R11  
R16  
R1  
R2  
R3  
R4  
R12  
R13  
R14  
R15  
,
NC  
A
12R  
A
9R  
BE3R CE0R R/W  
R
CNTRST  
R
NC  
I/O35L NC  
NC  
NC  
A
4R  
A1R OPTR  
NC  
T2  
T3  
T1  
T4  
T5  
T8  
T9  
T15  
T16  
T6  
T7  
T10  
T11  
T12  
T13  
T14  
NC  
NC  
NC  
NC  
NC  
BE2R CE1R  
NC  
NC  
A
11R  
A8R  
OER  
CNTEN  
R
A5R  
A2R  
A0R  
4831 drw 02d  
NOTES:  
1. All VDD pins must be connected to 3.3V power supply.  
2. All VDDQ pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to VIH (3.3V), and 2.5V if OPT pin for that port is  
set to VIL (0V).  
,
3. All VSS pins must be connected to ground supply.  
4. Package body is approximately 17mm x 17mm x 1.4mm, with 1.0mm ball-pitch.  
5. This package code is used to reference the package diagram.  
6. This text does not indicate orientation of the actual part-marking.  
6.42  
3
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
Pin Configuration(1,2,3,4) (con't.)  
12/12/01  
I/O16L  
156  
1
2
3
4
5
6
I/O19L  
I/O19R  
I/O20L  
I/O20R  
I/O16R  
155  
I/O15L  
154  
I/O15R  
153  
VSS  
VDDQL  
152  
151  
150  
149  
148  
147  
146  
145  
144  
143  
142  
141  
140  
139  
138  
137  
136  
135  
134  
133  
132  
131  
130  
129  
128  
127  
126  
125  
124  
123  
122  
121  
120  
119  
118  
117  
116  
115  
114  
113  
112  
111  
110  
109  
108  
107  
106  
105  
VDDQL  
VSS  
I/O14L  
I/O14R  
I/O13L  
I/O13R  
7
8
9
I/O21L  
I/O21R  
I/O22L  
I/O22R  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
VSS  
VDDQR  
VDDQR  
VSS  
I/O12L  
I/O12R  
I/O11L  
I/O11R  
I/O23L  
I/O23R  
I/O24L  
I/O24R  
VSS  
VDDQL  
VDDQL  
VSS  
I/O10L  
I/O10R  
I/O9L  
I/O25L  
I/O25R  
I/O26L  
I/O26R  
I/O9R  
V
V
V
V
V
V
V
V
SS  
V
DDQR  
SS  
DD  
DD  
70V3569DR  
DR-208  
DDQR  
DD  
V
V
V
(5)  
DD  
SS  
V
V
SS  
SS  
SS  
SS  
VDDQL  
DDQL  
208-Pin PQFP  
VSS  
I/O8R  
I/O8L  
I/O7R  
I/O7L  
I/O27R  
I/O27L  
I/O28R  
I/O28L  
(6)  
Top View  
VSS  
VDDQR  
VDDQR  
VSS  
I/O6R  
I/O6L  
I/O5R  
I/O5L  
I/O29R  
I/O29L  
I/O30R  
I/O30L  
VSS  
VDDQL  
VDDQL  
VSS  
I/O4R  
I/O4L  
I/O3R  
I/O3L  
I/O31R  
I/O31L  
I/O32R  
I/O32L  
VSS  
VDDQR  
VDDQR  
VSS  
I/O2R  
I/O2L  
I/O1R  
I/O1L  
I/O33R  
I/O33L  
I/O34R  
I/O34L  
,
4831 drw 02a  
NOTES:  
1. All VDD pins must be connected to 3.3V power supply.  
2. All VDDQ pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to VIH (3.3V), and 2.5V if OPT pin for that port is  
set to VIL (0V).  
3. All VSS pins must be connected to ground supply.  
4. Package body is approximately 28mm x 28mm x 3.5mm.  
5. This package code is used to reference the package diagram.  
6. This text does not indicate orientation of the actual part-marking.  
6.42  
4
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
PinNames  
Left Port  
Right Port  
Names  
Chip Enables  
CE0L  
R/W  
OE  
,
CE1L  
CE0R, CE1R  
L
R/WR  
Read/Write Enable  
Output Enable  
L
OER  
A
0L - A13L  
A
0R - A13R  
Address  
I/O0L - I/O35L  
CLK  
I/O0R - I/O35R  
CLK  
Data Input/Output  
Clock  
L
R
Address Strobe Enable  
Counter Enable  
ADS  
CNTEN  
CNTRST  
BE0L - BE3L  
L
ADS  
CNTEN  
CNTRST  
BE0R - BE3R  
R
L
R
Counter Reset  
L
R
NOTES:  
1. VDD, OPTX, and VDDQX must be set to appropriate operating levels prior to  
applying inputs on the I/Os and controls for that port.  
Byte Enables (9-bit bytes)  
Power (I/O Bus) (3.3V or 2.5V)  
2. OPTX selects the operating voltage levels for the I/Os and controls on that port.  
If OPTX is set to VIH (3.3V), then that port's I/Os and controls will operate at 3.3V  
levels and VDDQX must be supplied at 3.3V. If OPTX is set to VIL (0V), then that  
port's I/Os and controls will operate at 2.5V levels and VDDQX must be supplied  
at 2.5V. The OPT pins are independent of one another—both ports can operate  
at 3.3V levels, both can operate at 2.5V levels, or either can operate at 3.3V  
with the other at 2.5V.  
(1)  
V
DDQL  
VDDQR  
(1,2)  
OPT  
L
OPTR  
Option for selection VDDQX  
(1)  
V
V
DD  
SS  
Power (3.3V)  
Ground (0V)  
4831 tbl 01  
Truth Table I—Read/Write and Enable Control(1,2,3,4)  
Byte 3  
I/O27-35  
Byte 2  
I/O18-26  
Byte 1  
I/O9-17  
Byte 0  
I/O0-8  
CLK  
CE  
X
1
R/W  
X
X
X
L
MODE  
OE  
CE  
0
BE  
3
BE  
2
BE  
1
BE0  
X
H
X
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
X
X
H
H
H
H
L
X
X
H
H
H
L
X
X
H
H
L
X
X
H
L
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z Deselected–Power Down  
High-Z Deselected–Power Down  
X
L
X
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
High-Z  
All Bytes Deselected  
Write to Byte 0 Only  
Write to Byte 1 Only  
Write to Byte 2 Only  
Write to Byte 3 Only  
Write to Lower 2 Bytes Only  
Write to Upper 2 bytes Only  
Write to All Bytes  
X
DIN  
X
H
H
H
L
L
DIN  
High-Z  
High-Z  
High-Z  
X
H
H
L
L
DIN  
High-Z  
High-Z  
X
H
H
L
L
DIN  
High-Z  
High-Z  
X
H
L
L
High-Z  
DIN  
DIN  
X
H
L
H
L
L
D
IN  
IN  
D
IN  
IN  
High-Z  
High-Z  
X
L
L
L
D
D
DIN  
DIN  
L
H
H
H
L
H
H
L
H
L
L
H
H
H
H
H
H
H
X
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
DOUT  
Read Byte 0 Only  
L
H
H
H
L
DOUT  
High-Z Read Byte 1 Only  
High-Z Read Byte 2 Only  
High-Z Read Byte 3 Only  
L
H
H
L
DOUT  
High-Z  
High-Z  
L
H
H
L
DOUT  
High-Z  
High-Z  
L
H
L
High-Z  
DOUT  
DOUT  
Read Lower 2 Bytes Only  
High-Z Read Upper 2 Bytes Only  
Read All Bytes  
High-Z Outputs Disabled  
L
H
L
H
L
DOUT  
D
OUT  
OUT  
High-Z  
L
H
L
L
DOUT  
D
DOUT  
DOUT  
L
L
L
L
High-Z  
High-Z  
High-Z  
4831 tbl 02  
NOTES:  
1. "H" = VIH, "L" = VIL, "X" = Don't Care.  
2. ADS, CNTEN, CNTRST = X.  
3. OE is an asynchronous input signal.  
4. It is possible to read or write any combination of bytes during a given access. A few representative samples have been illustrated here.  
6.42  
5
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
Truth Table II—Address Counter Control(1,2)  
Previous  
Address  
Addr  
Used  
Address  
CLK(6)  
I/O(3)  
MODE  
ADS CNTEN CNTRST  
X
X
X
0
An  
X
X
L(4)  
H
D
I/O(0)  
I/O (n) External Address Used  
I/O(p) External Address Blocked—Counter disabled (Ap reused)  
DI/O(p+1) Counter Enabled—Internal Address generation  
Counter Reset to Address 0  
An  
An  
X
L(4)  
H
X
D
Ap  
Ap  
Ap  
H
H
D
Ap + 1  
H
L(5)  
H
4831 tbl 03  
NOTES:  
1. "H" = VIH, "L" = VIL, "X" = Don't Care.  
2. Read and write operations are controlled by the appropriate setting of R/W, CE0, CE1, BEn and OE.  
3. Outputs are in Pipelined mode: the data out will be delayed by one cycle.  
4. ADS and CNTRST are independent of all other memory control signals including CE0, CE1 and BEn  
5. The address counter advances if CNTEN = VIL on the rising edge of CLK, regardless of all other memory control signals including CE0, CE1, BEn.  
RecommendedDCOperating  
Conditions with VDDQ at 2.5V  
RecommendedOperating  
TemperatureandSupplyVoltage(1)  
Symbol  
Parameter  
Core Supply Voltage  
I/O Supply Voltage(3)  
Ground  
Min. Typ.  
3.15 3.3  
2.375 2.5  
Max.  
3.45  
2.625  
0
Unit  
V
Ambient  
Grade  
Commercial  
Temperature  
0OC to +70OC  
-40OC to +85OC  
GND  
0V  
V
+
+
DD  
V
DD  
DDQ  
SS  
3.3V  
3.3V  
150mV  
150mV  
V
V
V
0
0
V
Industrial  
0V  
Input High Voltage(3)  
(Address & Control Inputs)  
1.7  
V
____  
4831 tbl 04  
V
V
DDQ + 125mV(2)  
V
IH  
NOTES:  
1. Industrial temperature: for specific speeds, packages and powers contact your  
sales office.  
____  
____  
V
IH  
IL  
Input High Voltage - I/O(3)  
Input Low Voltage  
1.7  
DDQ + 125mV(2)  
0.7  
V
V
-0.3(1)  
V
4831 tbl 05a  
NOTES:  
1. VIL > -1.5V for pulse width less than 10 ns.  
2. VTERM must not exceed VDDQ + 125mV.  
3. To select operation at 2.5V levels on the I/Os and controls of a given port, the  
OPT pin for that port must be set to VIL (0V), and VDDQX for that port must be  
supplied as indicated above.  
AbsoluteMaximumRatings(1)  
Symbol  
Rating  
Commercial  
& Industrial  
Unit  
(2)  
V
TE RM  
Terminal Vol tage  
with Respect to  
GND  
-0.5 to +4.6  
V
RecommendedDCOperating  
Conditions with VDDQ at 3.3V  
Temperature  
Under Bias  
-55 to +125  
-65 to +150  
50  
oC  
oC  
T
BIAS  
Symbol  
Parameter  
Core Supply Voltage  
I/O Supply Voltage(3)  
Ground  
Min. Typ.  
3.15 3.3  
3.15 3.3  
Max.  
Unit  
V
Storage  
Temperature  
TSTG  
V
DD  
DDQ  
SS  
3.45  
V
3.45  
V
IOUT  
DC Output Current  
mA  
V
0
0
0
V
4831 tbl 06  
NOTES:  
Input High Voltage  
2.0  
V
V
DDQ + 150mV(2)  
V
____  
V
IH  
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may  
cause permanent damage to the device. This is a stress rating only and functional  
operation of the device at these or any other conditions above those indicated  
in the operational sections of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect reliability.  
2. VTERM must not exceed VDD + 150mV for more than 25% of the cycle time or  
4ns maximum, and is limited to < 20mA for the period of VTERM > VDD + 150mV.  
(Address & Control Inputs)(3)  
V
IH  
IL  
Input High Voltage - I/O(3)  
Input Low Voltage  
2.0  
DDQ + 150mV(2)  
0.8  
V
V
____  
____  
V
-0.3(1)  
4831 tbl 05b  
NOTES:  
1. VIL > -1.5V for pulse width less than 10 ns.  
2. VTERM must not exceed VDDQ + 150mV.  
3. To select operation at 3.3V levels on the I/Os and controls of a given port, the  
OPT pin for that port must be set to VIH (3.3V), and VDDQX for that port must be  
supplied as indicated above.  
6.42  
6
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
Capacitance(1)  
(TA = +25°C, F = 1.0MHZ) PQFP ONLY  
Symbol  
Parameter  
Input Capacitance  
Output Capacitance  
Conditions(2)  
IN = 3dV  
OUT = 3dV  
Max. Unit  
CIN  
V
8
pF  
(3 )  
OUT  
C
V
10.5  
pF  
4831 tbl 07  
NOTES:  
1. These parameters are determined by device characterization, but are not  
production tested.  
2. 3dV references the interpolated capacitance when the input and output switch  
from 0V to 3V or from 3V to 0V.  
3. COUT also references CI/O.  
DC Electrical Characteristics Over the Operating  
Temperature and Supply Voltage Range (VDD = 3.3V ± 150mV)  
70V3569S  
Symbol  
Parameter  
Input Leakage Current(1)  
Output Leakage Current  
Test Conditions  
VDDQ = Max., VIN = 0V to VDDQ  
Min.  
Max.  
10  
Unit  
µA  
µA  
V
___  
___  
___  
|ILI|  
|ILO  
|
10  
CE  
OL = +4mA, VDDQ = Min.  
OH = -4mA, VDDQ = Min.  
OL = +2mA, VDDQ = Min.  
OH = -2mA, VDDQ = Min.  
0 = VIH or CE1 = VIL, VOUT = 0V to VDDQ  
V
OL (3.3V) Output Low Voltage(2)  
OH (3.3V) Output High Voltage(2)  
OL (2.5V) Output Low Voltage(2)  
OH (2.5V) Output High Voltage(2)  
I
0.4  
___  
V
I
2.4  
V
___  
V
I
0.4  
V
___  
V
I
2.0  
V
4831 tbl 08  
NOTE:  
1. At VDD < - 2.0V input leakages are undefined.  
2. VDDQ is selectable (3.3V/2.5V) via OPT pins. Refer to p.4 for details.  
6.42  
7
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
DC Electrical Characteristics Over the Operating  
Temperature and Supply Voltage Range(3) (VDD = 3.3V ± 150mV)  
70V3569S4  
Com'l Only  
70V3569S5  
Com'l  
& Ind  
70V3569S6  
Com'l Only  
Symbol  
Parameter  
Test Condition  
= VIL  
Outputs Disabled,  
f = fMAX  
Version  
COM'L  
Typ.(4)  
375  
Max.  
460  
Typ.(4)  
Max.  
360  
415  
145  
175  
260  
300  
Typ.(4)  
245  
245  
95  
Max. Unit  
IDD  
Dynamic Operating  
Current (Both  
Ports Active)  
mA  
mA  
mA  
mA  
CE  
L
and CE  
R
,
S
S
S
S
S
S
285  
285  
105  
105  
190  
190  
310  
360  
125  
150  
225  
260  
____  
____  
(1)  
IND  
ISB1  
Standby Current  
(Both Ports - TTL  
Level Inputs)  
CE  
f = fMAX  
L = CER = VIH  
(1)  
COM'L  
IND  
145  
190  
____  
____  
95  
(5)  
ISB2  
Standby Current  
(One Port - TTL  
Level Inputs)  
CE"A" = VIL and CE"B" = VIH  
Active Port Outputs Disabled,  
COM'L  
IND  
265  
325  
175  
175  
____  
____  
(1)  
f=fMAX  
ISB3  
Full Standby Current Both Ports CE  
L and  
> VDDQ - 0.2V,  
VIN > VDDQ - 0.2V or VIN < 0.2V,  
COM'L  
IND  
S
S
6
15  
6
6
15  
30  
6
6
15  
30  
(Both Ports - CMOS CE  
R
Level Inputs)  
____  
____  
f = 0(2)  
ISB4  
Full Standby Current  
(One Port - CMOS  
Level Inputs)  
mA  
CE"A" < 0.2V and  
COM'L  
IND  
S
S
265  
325  
180  
180  
260  
300  
170  
170  
225  
260  
CE"B" > VDDQ - 0.2V(5)  
V
IN > VDDQ - 0.2V or VIN < 0.2V,  
Active Port, Outputs Disabled,  
____  
____  
(1)  
f = fMAX  
4831 tbl 09  
NOTES:  
1. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency clock cycle of 1/tCYC, using "AC TEST CONDITIONS" at input  
levels of GND to 3V.  
2. f = 0 means no address, clock, or control lines change. Applies only to input at CMOS level standby.  
3. Port "A" may be either left or right port. Port "B" is the opposite from port "A".  
4. VDD = 3.3V, TA = 25°C for Typ, and are not production tested. IDD DC(f=0) = 120mA (Typ).  
5. CEX = VIL means CE0X = VIL and CE1X = VIH  
CEX = VIH means CE0X = VIH or CE1X = VIL  
CEX < 0.2V means CE0X < 0.2V and CE1X > VDDQ - 0.2V  
CEX > VDDQ - 0.2V means CE0X > VDDQ - 0.2V or CE1X - 0.2V  
"X" represents "L" for left port or "R" for right port.  
6.42  
8
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
2.5V  
AC Test Conditions  
Input Pulse Levels (Address & Controls)  
Input Pulse Levels (I/Os)  
Input Rise/Fall Times  
GND to 3.0V/GND to 2.35V  
GND to 3.0V/GND to 2.35V  
3ns  
833Ω  
DATAOUT  
Input Timing Reference Levels  
Output Reference Levels  
Output Load  
1.5V/1.25V  
1.5V/1.25V  
5pF*  
770Ω  
Figures 1, 2, and 3  
4831 tbl 10  
,
3.3V  
590Ω  
5pF*  
50Ω  
50Ω  
,
DATAOUT  
1.5V/1.25  
DATAOUT  
10pF  
(Tester)  
4831 drw 03  
435Ω  
Figure 1. AC Output Test load.  
,
4831 drw 04  
Figure 2. Output Test Load  
(For tCKLZ, tCKHZ, tOLZ, and tOHZ).  
*Including scope and jig.  
10.5pF is the I/O capacitance of this  
device, and 10pF is the AC Test Load  
Capacitance.  
7
6
5
4
3
ΔtCD  
(Typical, ns)  
2
1
,
20.5  
50  
80 100  
200  
30  
-1  
Capacitance (pF)  
4831 drw 05  
Figure 3. Typical Output Derating (Lumped Capacitive Load).  
·
6.42  
9
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
AC Electrical Characteristics Over the Operating  
Temperature Range (Read and Write Cycle Timing)(1,2)  
(VDD = 3.3V ± 150mV, TA = 0°C to +70°C)  
70V3569S4  
Com'l Only  
70V3569S5  
Com'l  
70V3569S6  
Com'l Only  
& Ind  
Symbol  
Parameter  
Clock Cycle Time (Pipelined)  
Clock High Time (Pipelined)  
Clock Low Time (Pipelined)  
Clock Rise Time  
Min.  
7.5  
3
Max.  
Min.  
10  
Max.  
Min.  
12  
Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
CYC2  
CH2  
CL2  
t
4
5
t
3
4
5
____  
____  
____  
tR  
3
3
3
____  
____  
____  
tF  
Clock Fall Time  
3
3
3
____  
____  
____  
t
SA  
HA  
SC  
HC  
SB  
HB  
SW  
HW  
SD  
HD  
SAD  
HA D  
SCN  
HCN  
SRST  
Address Setup Time  
1.8  
0.7  
1.8  
0.7  
1.8  
0.7  
1.8  
0.7  
1.8  
0.7  
1.8  
0.7  
1.8  
0.7  
1.8  
2.0  
0.7  
2.0  
0.7  
2.0  
0.7  
2.0  
0.7  
2.0  
0.7  
2.0  
0.7  
2.0  
0.7  
2.0  
2.0  
1.0  
2.0  
1.0  
2.0  
1.0  
2.0  
1.0  
2.0  
1.0  
2.0  
1.0  
2.0  
1.0  
2.0  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
Address Hold Time  
t
Chip Enable Setup Time  
Chip Enable Hold Time  
Byte Enable Setup Time  
Byte Enable Hold Time  
R/W Setup Time  
t
t
t
t
t
R/W Hold Time  
t
Input Data Setup Time  
Input Data Hold Time  
t
t
ADS Setup Time  
t
ADS Hold Time  
t
CNTEN Setup Time  
t
CNTEN Hold Time  
t
CNTRST Setup Time  
t
HRST  
0.7  
0.7  
1.0  
CNTRST Hold Time  
(1)  
____  
____  
____  
tOE  
Output Enable to Data Valid  
Output Enable to Output Low-Z  
Output Enable to Output High-Z  
Clock to Data Valid (Pipelined)  
Data Output Hold After Clock High  
Clock High to Output High-Z  
Clock High to Output Low-Z  
4
5
6
____  
____  
____  
t
OL Z  
OHZ  
CD2  
DC  
CKHZ  
CKLZ  
0
0
0
t
1
4
1
4.5  
1
5
____  
____  
____  
t
4.2  
5
6
____  
____  
____  
t
1
1
1
1
1
1
1
1.5  
1
t
3
4.5  
6
____  
____  
____  
t
Port-to-Port Delay  
Clock-to-Clock Offset  
____  
____  
____  
tCO  
6
8
10  
ns  
4831 tbl 11  
NOTES:  
1. All input signals are synchronous with respect to the clock except for the asynchronous Output Enable (OE).  
2. These values are valid for either level of VDDQ (3.3V/2.5V). See page 4 for details on selecting the desired I/O voltage levels for each port.  
6.42  
10  
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Read Cycle for Pipelined Operation(2)  
t
CYC2  
tCH2  
tCL2  
CLK  
CE  
0
t
SC  
tHC  
t
SC  
SB  
t
HC  
HB  
(3)  
CE1  
t
SB  
tHB  
t
t
(5)  
BE(0-3)  
R/W  
tHW  
tSW  
tSA  
tHA  
ADDRESS(4)  
DATAOUT  
An  
An + 1  
An + 2  
Qn  
An + 3  
(1 Latency)  
t
DC  
tCD2  
Qn + 1  
Qn + 2 (5)  
(1)  
tCKLZ  
t
OHZ  
tOLZ  
OE (1)  
tOE  
NOTES:  
4831 drw 06  
1. OE is asynchronously controlled; all other inputs are synchronous to the rising clock edge.  
2. ADS = VIL, CNTEN and CNTRST = VIH.  
3. The output is disabled (High-Impedance state) by CE0 = VIH, CE1 = VIL, BEn = VIH following the next rising edge of the clock. Refer to  
Truth Table 1.  
4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers  
are for reference use only.  
5. If BEn was HIGH, then the appropriate Byte of DATAOUT for Qn + 2 would be disabled (High-Impedance state).  
Timing Waveform of a Multi-Device Pipelined Read(1,2)  
t
CYC2  
t
CH2  
tCL2  
CLK  
ADDRESS(B1)  
CE0(B1)  
t
SA  
tHA  
A6  
A5  
A4  
A3  
A
2
A
0
A1  
tSC  
tHC  
t
SC  
tHC  
tCD2  
tCD2  
tCKHZ  
tCD2  
Q
0
Q3  
Q
1
DATAOUT(B1)  
ADDRESS(B2)  
tDC  
tCKLZ  
tDC  
tCKHZ  
tSA  
tHA  
A6  
A5  
A4  
A3  
A2  
A
0
A1  
tSC  
tHC  
CE0(B2)  
tSC  
tHC  
tCD2  
tCKHZ  
tCD2  
DATAOUT(B2)  
Q4  
Q2  
tCKLZ  
t
CKLZ  
NOTES:  
4831 drw 07  
1. B1 Represents Device #1; B2 Represents Device #2. Each Device consists of one IDT70V3569 for this waveform,  
and are setup for depth expansion in this example. ADDRESS(B1) = ADDRESS(B2) in this situation.  
2. BEn, OE, and ADS = VIL; CE1(B1), CE1(B2), R/W, CNTEN, and CNTRST = VIH.  
6.42  
11  
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Left Port Write to Pipelined  
Right Port Read(1,2)  
CLK  
L
t
SW  
tHW  
R/W  
L
t
SA  
MATCH  
SD HD  
VALID  
t
HA  
NO  
MATCH  
ADDRESS  
L
t
t
DATAINL  
(3)  
CO  
t
CLKR  
tCD2  
R/WR  
t
SW  
SA  
t
HW  
t
tHA  
NO  
MATCH  
ADDRESS  
R
MATCH  
VALID  
DATAOUTR  
t
DC  
4831 drw 08  
NOTES:  
1. CE0, BEn, and ADS = VIL; CE1, CNTEN, and CNTRST = VIH.  
2. OE = VIL for the Right Port, which is being read from. OE = VIH for the Left Port, which is being written to.  
3. If tCO < minimum specified, then data from right port read is not valid until following right port clock cycle (ie, time from write to valid read on opposite port will  
be tCO + 2 tCYC2 + tCD2). If tCO > minimum, then data from right port read is available on first right port clock cycle (ie, time from write to valid read on opposite  
port will be tCO + tCYC + tCD2).  
Timing Waveform of Pipelined Read-to-Write-to-Read  
(OE = VIL)(2)  
tCYC2  
tCH2  
tCL2  
CLK  
CE0  
tSC  
tHC  
CE1  
tSB  
tHB  
BEn  
tSW tHW  
R/W  
tSW tHW  
ADDRESS(3)  
An + 3  
An + 4  
An  
An +1  
An + 2  
An + 2  
t
SA  
tHA  
t
SD  
tHD  
DATAIN  
Dn + 2  
tCD2  
tCD2  
(1)  
tCKHZ  
tCKLZ  
Qn + 3  
Qn  
DATAOUT  
READ  
NOP(4)  
WRITE  
READ  
4831 drw 09  
NOTES:  
1. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals.  
2. CE0, BEn, and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. "NOP" is "No Operation".  
3. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers  
are for reference use only.  
4. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.  
6.42  
12  
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Pipelined Read-to-Write-to-Read (OE Controlled)(2)  
t
CYC2  
tCH2  
tCL2  
CLK  
CE  
0
tSC  
tHC  
CE1  
tSB  
tHB  
BE  
n
tSW tHW  
R/W  
tSW tHW  
(3)  
An + 4  
An  
An +1  
An + 2  
An + 3  
Dn + 3  
An + 5  
ADDRESS  
t
SA  
tHA  
t
SD  
tHD  
DATAIN  
Dn + 2  
tCD2  
tCD2  
t
CKLZ  
(1)  
Qn  
Qn + 4  
DATAOUT  
(4)  
tOHZ  
OE  
READ  
WRITE  
READ  
4831 drw 10  
NOTES:  
1. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals.  
2. CE0, BEn, and ADS = VIL; CE1, CNTEN, and CNTRST = VIH.  
3. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use  
only.  
4. This timing does not meet requirements for fastest speed grade. This waveform indicates how logically it could be done if timing so allows.  
Timing Waveform of Pipelined Read with Address Counter Advance(1)  
t
CYC2  
tCH2  
tCL2  
CLK  
tSA  
tHA  
An  
ADDRESS  
t
SAD tHAD  
ADS  
t
SAD tHAD  
CNTEN  
tSCN tHCN  
tCD2  
Qn + 2(2)  
Qx - 1(2)  
Qx  
Qn + 3  
Qn + 1  
Qn  
DATAOUT  
tDC  
READ  
EXTERNAL  
ADDRESS  
READ  
WITH  
COUNTER  
COUNTER  
HOLD  
READ WITH COUNTER  
4831 drw 11  
NOTES:  
1. CE0, OE, BEn = VIL; CE1, R/W, and CNTRST = VIH.  
2. If there is no address change via ADS = VIL (loading a new address) or CNTEN = VIL (advancing the address), i.e. ADS = VIH and CNTEN = VIH, then the data output remains  
constantforsubsequentclocks.  
6.42  
13  
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Write with Address Counter Advance(1)  
t
CYC2  
tCH2  
tCL2  
CLK  
tSA  
tHA  
An  
ADDRESS  
INTERNAL(3)  
ADDRESS  
An(7)  
An + 4  
An + 2  
An + 1  
An + 3  
t
SAD tHAD  
ADS  
tSCN tHCN  
CNTEN  
t
SD tHD  
Dn + 4  
Dn + 1  
Dn + 3  
Dn  
Dn + 1  
Dn + 2  
DATAIN  
WRITE  
EXTERNAL  
ADDRESS  
WRITE  
WITH COUNTER  
WRITE  
COUNTER HOLD  
WRITE WITH COUNTER  
4831 drw 12  
Timing Waveform of Counter Reset(2)  
t
CYC2  
tCH2  
tCL2  
CLK  
tSA tHA  
(4)  
An + 2  
An  
An + 1  
ADDRESS  
INTERNAL(3)  
ADDRESS  
Ax  
0
1
An  
An + 1  
tSW tHW  
R/  
W
ADS  
tSAD tHAD  
CNTEN  
tSCN tHCN  
tSRST  
tHRST  
CNTRST  
tSD  
tHD  
D0  
DATAIN  
(5)  
Qn  
Q
1
Q0  
DATAOUT  
COUNTER(6)  
RESET  
WRITE  
ADDRESS 0  
READ  
READ  
READ  
READ  
ADDRESS 1  
ADDRESS 0  
ADDRESS n ADDRESS n+1  
NOTES:  
1. CE0, BEn, and R/W = VIL; CE1 and CNTRST = VIH.  
CE0, BEn = VIL; CE1 = VIH.  
4831 drw 13  
2.  
3. The "Internal Address" is equal to the "External Address" when ADS = VIL and equals the counter output when ADS = VIH.  
4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference  
use only.  
5. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals.  
6. No dead cycle exists during counter reset. A READ or WRITE cycle may be coincidental with the counter reset cycle: ADDR 0 will be accessed. Extra cycles  
are shown here simply for clarification.  
7. CNTEN = VIL advances Internal Address from ‘An’ to ‘An +1’. The transition shown indicates the time required for the counter to advance. The ‘An +1’Address is  
written to during this cycle.  
6.42  
14  
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
FunctionalDescription  
Depth and Width Expansion  
TheIDT70V3569providesatruesynchronousDual-PortStaticRAM  
interface. Registered inputs provide minimal set-up and hold times on  
address,data,andallcriticalcontrolinputs.Allinternalregistersareclocked  
ontherisingedgeoftheclock signal,however,theself-timedinternalwrite  
pulseisindependentoftheLOWtoHIGHtransitionoftheclocksignal.  
An asynchronous output enable is provided to ease asyn-  
chronousbusinterfacing.Counterenableinputsarealsoprovidedtostall  
the operation of the address counters for fast interleaved  
memoryapplications.  
The IDT70V3569 features dual chip enables (refer to Truth  
Table I) in order to facilitate rapid and simple depth expansion with no  
requirements for external logic. Figure 4 illustrates how to control the  
various chip enables in order to expand two devices in depth.  
TheIDT70V3569canalsobeusedinapplicationsrequiringexpanded  
width,asindicatedinFigure4.Throughcombiningthecontrolsignals,the  
devices can be grouped as necessary to accommodate applications  
needing 72-bits or wider.  
A HIGHonCE0oraLOWonCE1foroneclockcyclewillpowerdown  
the internal circuitry to reduce static power consumption. Multiple chip  
enablesalloweasierbankingofmultipleIDT70V3569sfordepthexpan-  
sion configurations. Two cycles are required with CE0 LOW and CE1  
HIGH tore-activatetheoutputs.  
A15  
IDT70V3569  
IDT70V3569  
CE0  
CE0  
CE1  
CE1  
VDD  
VDD  
Control Inputs  
Control Inputs  
IDT70V3569  
IDT70V3569  
CE1  
CE1  
CE0  
CE0  
BE,  
R/W,  
Control Inputs  
Control Inputs  
OE,  
CLK,  
ADS,  
CNTRST,  
CNTEN  
4831 drw 14  
Figure 4. Depth and Width Expansion with IDT70V3569  
6.42  
15  
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
OrderingInformation  
NOTES:  
1. Contact your local sales office for Industrial temp range in other speeds, packages and powers.  
2. Greenpartsavailable. Forspecificspeeds, packagesandpowerscontactyourlocalsalesoffice.  
DatasheetDocumentHistory  
1/8/99:  
3/12/99:  
4/28/99:  
6/8/99:  
InitialPublicRelease  
AddedfpBGApackage  
Fixed typo on page 10  
Changeddrawingformat  
Page 2 Changedpackagebodydimensions  
Page 3 Fixed typo  
6/15/99:  
8/4/99:  
Page 5 Deleted note 6 for Table II  
Page 2 Fixed typographical error  
Page 6 Improved power number  
Upgraded speed to 133MHz, added 2.5V I/O capability  
Page 4 Corrected I/O numbers in Truth Table I  
Replaced IDT logo  
10/14/99:  
10/19/99:  
11/12/99:  
4/10/00:  
AddednewBGApackages,addedfull2.5Vinterfacecapability  
Continued on page 17  
6.42  
16  
IDT70V3569S  
High-Speed 16K x 36 Dual-Port Synchronous Pipelined Static RAM  
Industrial and Commercial Temperature Ranges  
DatasheetDocumentHistory(cont'd)  
01/12/01:  
Page 6 Updated Truth Table II  
Increatedstoragetemperatureparameter  
ClarifiedTA Parameter  
Page 8 DCElectricalparameters–changedwordingfrom"open"to"disabled"  
Removednote7onDCElectricalCharacteristicstable  
RemovedPreliminarystatus  
04/10/01:  
12/12/01:  
AddedIndustrialTemperatureRangesandremovedrelatednotes  
Page 2, 3 & 4 Added date revision to pin configurations  
Page 6 Removedindustrialtempfootnotefromtable04  
Page8&10 Removedindustrialtempfor6nsfromDC&ACElectricalCharacteristics  
Page 16 Removedindustrialtempfrom6nsinorderinginformation  
Addedindustrialtempfootnote  
Page 1 & 17 Replaced TM logo with ® logo  
3/23/05:  
Page 1 Added green availability to features  
Page16Addedgreenindicatortoorderinginformation  
Page 1 & 17 Replaced old IDT TM with new IDT TM logo  
Page 5 Changed footnote 2 for Truth Table I from ADS, CNTEN, CNTRST = VIH to ADS, CNTEN, CNTRST = X  
Page 8 Corrected a typo in the DC Chars table  
Page 16 Removed "IDT" from orderable part number  
Page 16 Added Tape and Reel to the Ordering Information  
02/08/06:  
07/25/08:  
10/23/08:  
10/08/14:  
CORPORATE HEADQUARTERS  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
for SALES:  
for Tech Support:  
408-284-2794  
DualPortHelp@idt.com  
800-345-7015 or 408-284-8200  
fax: 408-284-2775  
www.idt.com  
Š
The IDT logo is a registered trademark of Integrated Device Technology, Inc.  
6.42  
17  

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