71V416YS12Y [IDT]

Standard SRAM, 256KX16, 12ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, SOJ-44;
71V416YS12Y
型号: 71V416YS12Y
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Standard SRAM, 256KX16, 12ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, SOJ-44

静态存储器 光电二极管
文件: 总9页 (文件大小:104K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
3.3V CMOS Static RAM  
4 Meg (256K x 16-Bit)  
IDT71V416YS  
IDT71V416YL  
Description  
Features  
TheIDT71V416isa4,194,304-bithigh-speedStaticRAMorganized  
as256Kx16.ItisfabricatedusingIDT’shigh-perfomance,high-reliability  
CMOStechnology.Thisstate-of-the-arttechnology,combinedwithinno-  
vativecircuitdesigntechniques,providesacost-effectivesolutionforhigh-  
speedmemoryneeds.  
256K x 16 advanced high-speed CMOS Static RAM  
JEDEC Center Power / GND pinout for reduced noise.  
Equal access and cycle times  
– CommercialandIndustrial:10/12/15ns  
One Chip Select plus one Output Enable pin  
Bidirectional data inputs and outputs directly  
TheIDT71V416has anoutputenablepinwhichoperates as fastas  
5ns,withaddressaccesstimesasfastas10ns.Allbidirectionalinputsand  
outputsoftheIDT71V416areLVTTL-compatibleandoperationisfroma  
single3.3Vsupply.Fullystaticasynchronouscircuitryisused,requiring  
noclocks orrefreshforoperation.  
The IDT71V416 is packaged in a 44-pin, 400 mil Plastic SOJ and a  
44-pin, 400 mil TSOP Type II package and a 48 ball grid array, 9mm x  
9mmpackage.  
LVTTL-compatible  
Low power consumption via chip deselect  
Upper and Lower Byte Enable Pins  
Single 3.3V power supply  
Available in 44-pin, 400 mil plastic SOJ package and a 44-  
pin, 400 mil TSOP Type II package and a 48 ball grid array,  
9mm x 9mm package.  
FunctionalBlockDiagram  
Output  
Enable  
Buffer  
OE  
Address  
Buffers  
Row / Column  
Decoders  
A0 - A17  
High  
8
8
8
8
Byte  
Output  
Buffer  
I/O 1  
Chip  
Select  
Buffer  
CS  
High  
Byte  
I/O 8  
Write  
Sense  
Amps  
and  
4,194,304-bit  
Memory  
Array  
Buffer  
16  
Write  
Drivers  
Write  
Enable  
Buffer  
Low  
Byte  
8
8
8
8
WE  
I/O 7  
I/O 0  
Output  
Buffer  
Low  
Byte  
Write  
Buffer  
BHE  
BLE  
Byte  
Enable  
Buffers  
6442 drw 01  
OCTOBER 2003  
1
©2003IntegratedDeviceTechnology,Inc.  
DSC-6442/00  
IDT71V416YS, IDT71V416YL 3.3V CMOS Static RAM  
4 Meg (256K x 16-Bit)  
Commercial and Industrial Temperature Ranges  
Pin Configurations - SOJ/TSOP  
Pin Configurations - 48 BGA  
A0  
A1  
A2  
A3  
A4  
1
2
44  
A17  
1
2
3
4
5
6
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
A16  
A15  
OE  
A
B
C
D
E
A0  
A1  
A2  
NC  
BLE  
OE  
3
4
I/O0  
I/O1  
VSS  
VDD  
I/O6  
I/O7  
NC  
A3  
A5  
A4  
A6  
I/O8  
I/O9  
VDD  
VSS  
BHE  
I/O2  
I/O3  
I/O4  
I/O5  
NC  
CS  
BHE  
5
BLE  
6
CS  
I/O10  
I/O11  
I/O12  
I/O13  
WE  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
VDD  
VSS  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
WE  
7
I/O 15  
I/O 14  
I/O 13  
I/O 12  
VSS  
8
A17  
NC  
A14  
A12  
A9  
A7  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
A16  
A15  
A13  
A10  
SO44-1  
SO44-2  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
V
DD  
F
I/O14  
I/O15  
I/O 11  
I/O 10  
I/O 9  
G
H
I/O 8  
NC*  
A14  
A8  
A11  
NC  
6442 tbl 11  
A5  
A6  
A13  
A12  
A7  
A8  
A11  
A10  
A9  
6442 drw 02  
*Pin 28 can either be a NC or connected to Vss  
Top View  
SOJCapacitance  
(TA = +25°C, f = 1.0MHz)  
PinDescriptions  
Parameter(1)  
Input Capacitance  
I/O Capacitance  
Conditions  
Max. Unit  
A0 - A17  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
I/O  
Symbol  
CIN  
Chip Select  
CS  
VIN = 3dV  
7
8
pF  
Write Enable  
Output Enable  
High Byte Enable  
Low Byte Enable  
Data Input/Output  
3.3V Power  
WE  
CI/O  
VOUT = 3dV  
pF  
6442 tbl 02  
OE  
BHE  
BLE  
48BGACapacitance  
(TA = +25°C, f = 1.0MHz)  
I/O0 - I/O15  
VDD  
Symbol  
CIN  
Parameter(1)  
Input Capacitance  
I/O Capacitance  
Conditions  
VIN = 3dV  
VOUT = 3dV  
Max. Unit  
Pwr  
6
7
pF  
VSS  
Ground  
Gnd  
CI/O  
pF  
6442 tbl 01  
6442 tbl 02b  
NOTE:  
1. This parameter is guaranteed by device characterization, but not production  
tested.  
6.422  
IDT71V416YS, IDT71V416YL 3.3V CMOS Static RAM  
4 Meg (256K x 16-Bit)  
Commercial and Industrial Temperature Ranges  
AbsoluteMaximumRatings(1)  
RecommendedOperating  
TemperatureandSupply  
Voltage  
Symbol  
Rating  
Value  
Unit  
V
Supply Voltage Relative to  
VSS  
Terminal Voltage Relative to  
VSS  
VDD  
-0.5 to +4.6  
-0.5 to VDD+0.5  
Grade  
Commercial  
Industrial  
Temperature  
0OC to +70OC  
–40OC to +85OC  
VSS  
0V  
0V  
VDD  
V
See Below  
See Below  
VIN, VOUT  
TBIAS  
TSTG  
PT  
Temperature Under Bias  
Storage Temperature  
Power Dissipation  
-55 to +125  
oC  
oC  
W
6442 tbl 05  
-55 to +125  
1
RecommendedDCOperating  
Conditions  
IOUT  
DC Output Current  
50  
mA  
6442 tbl 04  
NOTE:  
Symbol  
Parameter  
Supply Voltage  
Ground  
Min.  
3.0  
0
Typ.  
Max.  
3.6  
0
Unit  
V
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may  
cause permanent damage to the device. This is a stress rating only and functional  
operation of the device at these or any other conditions above those indicated  
in the operational sections of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect reliability.  
VDD  
3.3  
VSS  
0
V
(1)  
____  
VDD+0.3  
0.8  
VIH  
VIL  
Input High Voltage  
Input Low Voltage  
2.0  
V
(2)  
____  
-0.3  
V
6442 tbl 06  
NOTES:  
1. VIH (max.) = VDD+2V for pulse width less than 5ns, once per cycle.  
2. VIL (min.) = –2V for pulse width less than 5ns, once per cycle.  
Truth Table(1)  
I/O0-I/O7  
High-Z  
I/O8-I/O15  
High-Z  
CS  
H
L
OE  
X
L
WE  
X
H
H
H
L
BLE  
X
L
BHE  
X
H
L
Function  
Deselected - Standby  
Low Byte Read  
High Byte Read  
Word Read  
DATAOUT  
High-Z  
High-Z  
L
L
H
L
DATAOUT  
DATAOUT  
DATAIN  
High-Z  
L
L
L
DATAOUT  
DATAIN  
DATAIN  
High-Z  
L
X
X
X
H
X
L
L
Word Write  
L
L
L
H
L
Low Byte Write  
High Byte Write  
Outputs Disabled  
Outputs Disabled  
L
L
H
X
H
DATAIN  
High-Z  
L
H
X
X
H
High-Z  
L
High-Z  
High-Z  
6442 tbl 03  
NOTE:  
1. H = VIH, L = VIL, X = Don't care.  
6.42  
3
IDT71V416YS, IDT71V416YL 3.3V CMOS Static RAM  
4 Meg (256K x 16-Bit)  
Commercial and Industrial Temperature Ranges  
DC Electrical Characteristics  
(VDD = Min. to Max., Commercial and Industrial Temperature Ranges)  
IDT71V416  
Symbol  
|ILI|  
Parameter  
Input Leakage Current  
Test Conditions  
VCC = Max., VIN = VSS to VDD  
Min.  
Max.  
5
Unit  
µA  
µA  
V
___  
___  
___  
|ILO|  
Output Leakage Current  
Output Low Voltage  
Output High Voltage  
VDD = Max., CS = VIH, VOUT = VSS to VDD  
IOL = 8mA, VDD = Min.  
5
VOL  
0.4  
___  
VOH  
IOH = -4mA, VDD = Min.  
2.4  
V
6442 tbl 07  
DC Electrical Characteristics(1, 2, 3)  
(VDD = Min. to Max., VLC = 0.2V, VHC = VDD – 0.2V)  
71V416S/L12  
71V416S/L15  
71V416S/L10  
Com'l.  
Ind.(5 )  
200 200  
Symbol  
Parameter  
Dynamic Operating Current  
CS < VLC, Outputs Open, VDD = Max., f = fMAX  
Unit  
Com'l.  
Ind.  
180  
170  
60  
Com'l.  
170  
160  
50  
Ind.  
170  
160  
50  
ICC  
S
L
S
L
S
L
180  
170  
60  
mA  
(4 )  
180  
70  
50  
20  
10  
70  
20  
ISB  
Dynamic Standby Power Supply Current  
CS > VHC, Outputs Open, VDD = Max., f = fMAX  
mA  
(4 )  
45  
45  
40  
40  
ISB1  
Full Standby Power Supply Current (static)  
20  
20  
20  
20  
mA  
CS > VHC, Outputs Open, VDD = Max., f = 0(4 )  
10  
10  
10  
10  
6442 tbl 08  
NOTES:  
IDT71V416S/71V416L  
1. All values are maximum guaranteed values.  
2. All inputs switch between 0.2V (Low) and VDD -0.2V (High).  
3. Power specifications are preliminary.  
4. fMAX = 1/tRC (all address inputs are cycling at fMAX); f = 0 means no address input lines are changing.  
5. Standard power 10ns (S10) speed grade only.  
3.3V  
320  
AC Test Loads  
+1.5V  
50  
OUT  
DATA  
I/O  
Z0 = 50  
5pF*  
350  
30pF  
6442 drw 03  
6442 drw 04  
Figure 1. AC Test Load  
*Including jig and scope capacitance.  
Figure 2. AC Test Load  
(for tCLZ, tOLZ, tCHZ, tOHZ, tOW, and tWHZ)  
7
6
AC Test Conditions  
tAA, tACS  
(Typical, ns)  
5
4
3
Input Pulse Levels  
GND to 3.0V  
2
1
Input Rise/Fall Times  
Input Timing Reference Levels  
Output Reference Levels  
AC Test Load  
1.5ns  
1.5V  
1.5V  
180  
8 20 40 60 80 100 120 140 160  
CAPACITANCE (pF)  
200  
6442 drw 05  
Figures 1,2 and 3  
6442 tbl 09  
Figure 3. Output Capacitive Derating  
6.442  
IDT71V416YS, IDT71V416YL 3.3V CMOS Static RAM  
4 Meg (256K x 16-Bit)  
Commercial and Industrial Temperature Ranges  
AC Electrical Characteristics  
(VDD = Min. to Max., Commercial and Industrial Temperature Ranges)  
71V416S/L10(2)  
71V416S/L12  
71V416S/L15  
Symbol  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
READ CYCLE  
____  
____  
____  
tRC  
tAA  
tACS  
Read Cycle Time  
10  
12  
15  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
____  
____  
____  
Address Access Time  
Chip Select Access Time  
10  
12  
15  
____  
____  
____  
10  
12  
15  
(1)  
____  
____  
____  
tCL Z  
Chip Select Low to Output in Low-Z  
Chip Select High to Output in High-Z  
Output Enable Low to Output Valid  
Output Enable Low to Output in Low-Z  
Output Enable High to Output in High-Z  
Output Hold from Address Change  
Byte Enable Low to Output Valid  
4
4
4
(1)  
____  
____  
____  
tCHZ  
5
6
7
____  
____  
____  
tOE  
5
6
7
(1)  
____  
____  
____  
tOLZ  
0
0
0
(1)  
____  
____  
____  
tOHZ  
5
6
7
____  
____  
____  
tOH  
tBE  
4
4
4
____  
____  
____  
5
6
7
(1)  
____  
____  
____  
tBLZ  
Byte Enable Low to Output in Low-Z  
Byte Enable High to Output in High-Z  
0
0
0
(1)  
____  
____  
____  
tBHZ  
5
6
7
WRITE CYCLE  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
tWC  
tAW  
tCW  
tBW  
tAS  
Write Cycle Time  
10  
8
8
8
0
0
8
5
0
12  
8
8
8
0
0
8
6
0
15  
10  
10  
10  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address Valid to End of Write  
Chip Select Low to End of Write  
Byte Enable Low to End of Write  
Address Set-up Time  
tWR  
tWP  
tDW  
tDH  
Address Hold from End of Write  
Write Pulse Width  
0
10  
7
Data Valid to End of Write  
Data Hold Time  
0
(1)  
tOW  
Write Enable High to Output in Low-Z  
Write Enable Low to Output in High-Z  
3
3
3
(1)  
____  
____  
____  
tWHZ  
6
7
7
ns  
6442 tbl 10  
NOTE:  
1. This parameter is guaranteed with the AC Load (Figure 2) by device characterization, but is not production tested.  
2. Low power 10ns (L10) speed 0ºC to +70ºC temperature range only.  
Timing Waveform of Read Cycle No. 1(1,2,3)  
tRC  
ADDRESS  
tAA  
tOH  
tOH  
PREVIOUS DATAOUT VALID  
DATAOUT VALID  
DATAOUT  
NOTES:  
6442d06  
1. WE is HIGH for Read Cycle.  
2. Device is continuously selected, CS is LOW.  
3. OE, BHE, and BLE are LOW.  
6.42  
5
IDT71V416YS, IDT71V416YL 3.3V CMOS Static RAM  
4 Meg (256K x 16-Bit)  
Commercial and Industrial Temperature Ranges  
Timing Waveform of Read Cycle No. 2(1)  
t
RC  
ADDRESS  
t
OH  
t
AA  
OE  
CS  
(3)  
t
OHZ  
(3)  
t
OE  
(3)  
t
OLZ  
(2)  
t
ACS  
(3)  
t
CHZ  
t
CLZ  
BLE  
BHE  
,
(2)  
t
BE  
(3)  
(3)  
BHZ  
t
t
BLZ  
DATAOUT  
DATAOUT VALID  
6442 drw 07  
NOTES:  
1. WE is HIGH for Read Cycle.  
2. Address must be valid prior to or coincident with the later of CS, BHE, or BLE transition LOW; otherwise tAA is the limiting parameter.  
3. Transition is measured ±200mV from steady state.  
Timing Waveform of Write Cycle No. 1 (WE Controlled Timing)(1,2,4)  
tWC  
ADDRESS  
tAW  
CS  
(2)  
(5)  
(5)  
tCW  
tCHZ  
tBHZ  
tBW  
BHE, BLE  
tWR  
tOW  
tWP  
WE  
tAS  
(5)  
tWHZ  
(5)  
PREVIOUS DATA VALID (3)  
DATA VALID  
DATAOUT  
DATAIN  
tDH  
tDW  
DATAIN VALID  
6442 drw 0  
NOTES:  
1. A write occurs during the overlap of a LOW CS, LOW BHE or BLE, and a LOW WE.  
2. OE is continuously HIGH. If during a WE controlled write cycle OE is LOW, tWP must be greater than or equal to tWHZ + tDW to allow the I/O drivers to turn off and data  
to be placed on the bus for the required tDW. If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the minimum write pulse is as  
short as the specified tWP.  
3. During this period, I/O pins are in the output state, and input signals must not be applied.  
4. If the CS LOW or BHE and BLE LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high-impedance state.  
5. Transition is measured ±200mV from steady state.  
6.462  
IDT71V416YS, IDT71V416YL 3.3V CMOS Static RAM  
4 Meg (256K x 16-Bit)  
Commercial and Industrial Temperature Ranges  
Timing Waveform of Write Cycle No. 2 (CS Controlled Timing)(1,3)  
tWC  
ADDRESS  
tAW  
CS  
(2)  
tAS  
tCW  
tBW  
BHE, BLE  
WE  
tWP  
tWR  
DATAOUT  
DATAIN  
tDH  
tDW  
DATAIN VALID  
6442 drw 0  
Timing Waveform of Write Cycle No. 3  
(BHE, BLE Controlled Timing)(1,3)  
tWC  
ADDRESS  
tAW  
CS  
(2)  
tCW  
tAS  
tBW  
BHE, BLE  
tWP  
tWR  
WE  
DATAOUT  
DATAIN  
tDH  
tDW  
DATAIN VALID  
6442 drw 1  
NOTES:  
1. A write occurs during the overlap of a LOW CS, LOW BHE or BLE, and a LOW WE.  
2. During this period, I/O pins are in the output state, and input signals must not be applied.  
3. If the CS LOW or BHE and BLE LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high-impedance state.  
6.42  
7
IDT71V416YS, IDT71V416YL 3.3V CMOS Static RAM  
4 Meg (256K x 16-Bit)  
Commercial and Industrial Temperature Ranges  
OrderingInformation  
IDT  
71V416  
X
X
XX  
XXX  
X
Device  
Type  
Power  
Speed  
Package  
Process/  
Temperature  
Range  
Blank  
I
Commercial (0°C to +70°C)  
Industrial (-40°C to +85°C)  
Y
PH  
BE  
44-pin, 400-mil SOJ (SO44-1)  
44-pin TSOP Type II (SO44-2)  
48 Ball Grid Array  
10*  
12  
Speed in nanoseconds  
15  
S
L
Standard Power  
Low Power  
Y
Y die stepping  
* Commercial only for low power 10ns (L10) speed grade.  
6442 drw 11a  
6.482  
IDT71V416YS, IDT71V416YL 3.3V CMOS Static RAM  
4 Meg (256K x 16-Bit)  
Commercial and Industrial Temperature Ranges  
DatasheetDocumentHistory  
10/13/03  
Releaseddatasheet  
CORPORATE HEADQUARTERS  
2975StenderWay  
Santa Clara, CA 95054  
for SALES:  
800-345-7015 or 408-727-6116  
fax: 408-492-8674  
for Tech Support:  
sramhelp@idt.com  
800-544-7726, x4033  
www.idt.com  
The IDT logo is a registered trademark of Integrated Device Technology, Inc.  
6.42  
9

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SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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VISHAY