71V424L12YG [IDT]

3.3V CMOS Static RAM;
71V424L12YG
型号: 71V424L12YG
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

3.3V CMOS Static RAM

文件: 总9页 (文件大小:72K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IDT71V424S  
IDT71V424L  
3.3V CMOS Static RAM  
4 Meg (512K x 8-Bit)  
Features  
Description  
512K x 8 advanced high-speed CMOS Static RAM  
JEDEC Center Power / GND pinout for reduced noise  
Equal access and cycle times  
TheIDT71V424isa4,194,304-bithigh-speedStaticRAMorganized  
as512Kx8.Itisfabricatedusinghigh-perfomance,high-reliabilityCMOS  
technology.Thisstate-of-the-arttechnology,combinedwithinnovative  
circuitdesigntechniques,providesacost-effectivesolutionforhigh-speed  
memoryneeds.  
— CommercialandIndustrial:10/12/15ns  
Single 3.3V power supply  
One Chip Select plus one Output Enable pin  
Bidirectional data inputs and outputs directly  
TTL-compatible  
Low power consumption via chip deselect  
Available in 36-pin, 400 mil plastic SOJ package and  
44-pin, 400 mil TSOP.  
TheIDT71V424hasanoutputenablepinwhichoperatesasfastas  
5ns,withaddressaccesstimesasfastas10ns.Allbidirectionalinputsand  
outputs of the IDT71V424 are TTL-compatible and operation is from a  
single3.3Vsupply.Fullystaticasynchronouscircuitryisused,requiring  
no clocks or refresh for operation.  
TheIDT71V424ispackagedina36-pin,400milPlasticSOJand44-  
pin, 400milTSOP.  
FunctionalBlockDiagram  
A0  
4,194,304-BIT  
MEMORY ARRAY  
ADDRESS  
DECODER  
A18  
8
8
I/O0 - I/O7  
I/O CONTROL  
8
WE  
OE  
CS  
CONTROL  
LOGIC  
3622 drw 01  
SEPTEMBER 2013  
1
©2013IntegratedDeviceTechnology,Inc.  
DSC-3622/10  
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM  
4 Meg (512K x 8-bit)  
Commercial and Industrial Temperature Ranges  
PinConfiguration  
PinConfiguration  
NC  
NC  
NC  
NC  
A0  
A1  
1
2
44  
43  
A0  
A1  
A2  
A3  
A4  
CS  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
NC  
A18  
A17  
A16  
A15  
OE  
3
NC  
42  
41  
A18  
A17  
4
A2  
A3  
A4  
5
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A16  
A15  
6
I/O 7  
I/O 6  
I/O 0  
I/O 1  
7
8
CS  
OE  
SO36-1  
VDD  
V
V
SS  
DD  
I/00  
I/01  
9
I/07  
I/06  
VSS  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
I/O 2  
I/O 3  
WE  
I/O 5  
I/O 4  
A14  
A13  
A12  
A11  
A10  
NC  
SO44-2  
V
V
DD  
SS  
V
V
SS  
DD  
A5  
A6  
A7  
A8  
A9  
I/02  
I/03  
I/05  
I/04  
A14  
WE  
A5  
A6  
A13  
A12  
A7  
A8  
A9  
NC  
NC  
A11  
A10  
NC  
3622 drw 02  
SOJ  
Top View  
NC  
NC  
3622 drw 11  
TSOP  
Top View  
PinDescription  
Capacitance  
(TA = +25°C, f = 1.0MHz, SOJ package)  
A
0
– A18  
Address Inputs  
Input  
Symbol  
Parameter(1)  
Input Capacitance  
I/O Capacitance  
Conditions  
IN = 3dV  
OUT = 3dV  
Max. Unit  
Chip Select  
Input  
Input  
Input  
I/O  
CS  
C
IN  
V
7
8
pF  
Write Enable  
Output Enable  
Data Input/Output  
3.3V Power  
Ground  
WE  
OE  
C
I/O  
V
pF  
3622 tbl 03  
I/O0 - I/O7  
NOTE:  
1. This parameter is guaranteed by device characterization, but not production  
tested.  
V
V
DD  
SS  
Power  
Gnd  
3622 tbl 02  
Truth Table(1,2)  
CS  
OE  
WE  
I/O  
Function  
L
L
H
DATAOUT Read Data  
DATAIN Write Data  
High-Z Output Disabled  
L
X
L
L
H
X
H
H
X
High-Z Deselected - Standby (ISB  
)
(3)  
X
X
High-Z Deselected - Standby (ISB1)  
V
HC  
3622 tbl 01  
NOTES:  
1. H = VIH, L = VIL, x = Don't care.  
2. VLC = 0.2V, VHC = VDD -0.2V.  
3. Other inputs VHC or VLC.  
6.242  
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM  
4 Meg (512K x 8-bit)  
Commercial and Industrial Temperature Ranges  
AbsoluteMaximumRatings(1)  
RecommendedOperating  
TemperatureandSupplyVoltage  
Symbol  
Rating  
Value  
Unit  
Grade  
Commercial  
Industrial  
Temperature  
0°C to +70°C  
–40°C to +85°C  
V
SS  
VDD  
VDD  
Supply Voltage Relative to  
-0.5 to +4.6  
V
0V  
0V  
See Below  
See Below  
VSS  
Terminal Voltage Relative  
to VSS  
-0.5 to VDD+0.5  
V
VIN, VOUT  
3622 tbl 05  
T
T
P
BIAS  
STG  
T
Temperature Under Bias  
Storage Temperature  
Power Dissipation  
-55 to +125  
oC  
oC  
W
RecommendedDCOperating  
Conditions  
-55 to +125  
1
Symbol  
Parameter  
Min.  
Typ.  
Max.  
3.6  
Unit  
V
I
OUT  
DC Output Current  
50  
mA  
V
DD  
SS  
IH  
IL  
Supply Voltage  
3.0  
3.3  
3622 tbl 04  
NOTE:  
V
Ground  
0
0
0
V
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may  
cause permanent damage to the device. This is a stress rating only and  
functional operation of the device at these or any other conditions above those  
indicated in the operational sections of this specification is not implied. Exposure  
to absolute maximum rating conditions for extended periods may affect  
reliability.  
____  
V
Input High Voltage  
Input Low Voltage  
2.0  
V
DD+0.3(1)  
0.8  
V
-0.3(2)  
V
____  
V
3622 tbl 06  
NOTES:  
1. VIH (max.) = VDD+2V for pulse width less than 5ns, once per cycle.  
2. VIL (min.) = –2V for pulse width less than 5ns, once per cycle.  
DC Electrical Characteristics  
(VDD = Min. to Max., Commercial and Industrial Temperature Ranges)  
IDT71V424  
Symbol  
|ILI  
|ILO  
Parameter  
Input Leakage Current  
Test Condition  
DD = Max., VIN = VSS to VDD  
Min.  
Max. Unit  
___  
|
V
V
5
5
µA  
µA  
V
___  
___  
|
Output Leakage Current  
Output Low Voltage  
Output High Voltage  
DD = Max., CS = VIH, VOUT = VSS to VDD  
VOL  
I
I
OL = 8mA, VDD = Min.  
OH = -4mA, VDD = Min.  
0.4  
___  
VOH  
2.4  
V
3622 tbl 07  
DC Electrical Characteristics(1, 2, 3)  
(VDD = Min. to Max., VLC = 0.2V, VHC = VDD – 0.2V)  
71V424S/L 10  
Com'l. Ind.  
71V424S/L 12  
71V424S/L 15  
Unit  
Symbol  
Parameter  
Dynamic Operating Current  
Com'l.  
Ind.  
170  
155  
55  
Com'l.  
Ind.  
160  
145  
50  
S
L
S
L
S
L
180  
165  
60  
180  
165  
60  
170  
155  
55  
160  
145  
50  
mA  
mA  
mA  
mA  
mA  
ICC  
(4)  
CS < VLC, Outputs Open, VDD = Max., f = fMAX  
Dynamic Standby Power Supply Current  
ISB  
CS > VHC, Outputs Open, VDD = Max., f = fMAX(4)  
55  
55  
50  
50  
45  
45  
20  
20  
20  
20  
20  
20  
Full Standby Power Supply Current (static)  
ISB1  
CS > VHC, Outputs Open, VDD = Max., f = 0(4)  
10  
10  
10  
10  
10  
10  
mA  
3622 tbl 08  
NOTES:  
1. All values are maximum guaranteed values.  
2. All inputs switch between 0.2V (Low) and VDD - 0.2V (High).  
3. Power specifications are preliminary.  
4. fMAX = 1/tRC (all address inputs are cycling at fMAX); f = 0 means no address input lines are changing.  
6.42  
3
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM  
4 Meg (512K x 8-bit)  
Commercial and Industrial Temperature Ranges  
AC Test Conditions  
Input Pulse Levels  
GND to 3.0V  
Input Rise/Fall Times  
Input Timing Reference Levels  
Output Reference Levels  
AC Test Load  
1.5ns  
1.5V  
1.5V  
See Figure 1, 2 and 3  
3622 tbl 09  
AC Test Loads  
3.3V  
+1.5V  
50Ω  
320Ω  
I/O  
Z0 = 50Ω  
OUT  
DATA  
30pF  
5pF*  
350Ω  
3622 drw 03  
3622 drw 04  
*Including jig and scope capacitance.  
Figure 1. AC Test Load  
Figure 2. AC Test Load  
(for tCLZ, tOLZ, tCHZ, tOHZ, tOW, and tWHZ)  
7
6
ΔtAA,  
t
ACS  
5
4
3
(Typical, ns)  
2
1
180  
8 20 40 60 80 100 120 140 160  
CAPACITANCE (pF)  
200  
3622 drw 05  
Figure 3. Output Capacitive Derating  
6.42  
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM  
4 Meg (512K x 8-bit)  
Commercial and Industrial Temperature Ranges  
AC Electrical Characteristics  
(VCC = 3.3V ± 10%, Commercial and Industrial Temperature Ranges)  
71V424S/L10  
71V424S/L12  
71V424S/L15  
Symbol  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
READ CYCLE  
____  
____  
____  
t
RC  
AA  
ACS  
Read Cycle Time  
10  
12  
15  
ns  
ns  
ns  
ns  
____  
____  
____  
t
Address Access Time  
Chip Select Access Time  
Chip Select to Output in Low-Z  
10  
12  
15  
____  
____  
____  
t
10  
12  
15  
____  
____  
____  
(1)  
CLZ  
4
4
4
t
____  
____  
____  
(1)  
Chip Deselect to Output in High-Z  
Output Enable to Output Valid  
5
6
7
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
CHZ  
____  
____  
____  
tOE  
5
6
7
(1)  
(1)  
____  
____  
____  
Output Enable to Output in Low-Z  
Output Disable to Output in High-Z  
Output Hold from Address Change  
Chip Select to Power Up Time  
Chip Deselect to Power Down Time  
0
0
0
tOLZ  
____  
____  
____  
5
6
7
t
OHZ  
____  
____  
____  
tOH  
4
4
4
____  
____  
____  
(1)  
PU  
0
0
0
t
____  
____  
____  
(1)  
PD  
10  
12  
15  
t
WRITE CYCLE  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
WC  
AW  
CW  
AS  
WP  
WR  
DW  
DH  
Write Cycle Time  
10  
8
12  
8
15  
10  
10  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
Address Valid to End of Write  
Chip Select to End of Write  
Address Set-up Time  
Write Pulse Width  
t
8
8
t
0
0
t
8
8
10  
0
t
Write Recovery Time  
Data Valid to End of Write  
Data Hold Time  
0
0
t
6
6
7
t
0
0
0
____  
____  
____  
(1)  
OW  
Output Active from End of Write  
3
3
3
t
(1)  
WHZ  
____  
____  
____  
Write Enable to Output in High-Z  
6
7
7
ns  
t
3622 tbl 10  
NOTE:  
1. This parameter guaranteed with the AC load (Figure 2) by device characterization, but is not production tested.  
6.42  
5
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM  
4 Meg (512K x 8-bit)  
Commercial and Industrial Temperature Ranges  
Timing Waveform of Read Cycle No. 1(1)  
tRC  
ADDRESS  
OE  
t
AA  
tOE  
(5)  
tOLZ  
CS  
(3)  
tACS  
(5)  
(5)  
tOHZ  
tCLZ  
(5)  
tCHZ  
HIGH IMPEDANCE  
DATAOUT  
DATAOUT VALID  
t
PD  
t
PU  
I
I
CC  
SB  
V
CC SUPPLY  
CURRENT  
3622 drw 06  
Timing Waveform of Read Cycle No. 2(1, 2, 4)  
t
RC  
ADDRESS  
DATAOUT  
tAA  
t
OH  
tOH  
PREVIOUS DATAOUT VALID  
DATAOUT VALID  
3622 drw 07  
NOTES:  
1. WE is HIGH for Read Cycle.  
2. Device is continuously selected, CS is LOW.  
3. Address must be valid prior to or coincident with the later of CS transition LOW; otherwise tAA is the limiting parameter.  
4. OE is LOW.  
5. Transition is measured ±200mV from steady state.  
6.642  
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM  
4 Meg (512K x 8-bit)  
Commercial and Industrial Temperature Ranges  
Timing Waveform of Write Cycle No. 1 (WE Controlled Timing)(1, 2, 4)  
t
WC  
ADDRESS  
t
AW  
CS  
t
WR  
(2)  
tAS  
t
WP  
WE  
(5)  
tCHZ  
(5)  
(5)  
t
WHZ  
tOW  
HIGH IMPEDANCE  
DATAOUT  
DATAIN  
(3)  
(3)  
tDH  
t
DW  
DATAIN VALID  
3622 drw 08  
Timing Waveform of Write Cycle No. 2 (CS Controlled Timing)(1, 4)  
tWC  
ADDRESS  
tAW  
CS  
tAS  
tCW  
tWR  
WE  
tDW  
tDH  
DATAIN  
DATAIN VALID  
3622 drw 09  
NOTES:  
1. A write occurs during the overlap of a LOW CS and a LOW WE.  
2. OE is continuously HIGH. During a WE controlled write cycle with OE LOW, tWP must be greater than or equal to tWHZ + tDW to allow the I/O drivers to turn off and  
data to be placed on the bus for the required tDW. If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the minimum write pulse  
is the specified tWP.  
3. During this period, I/O pins are in the output state, and input signals must not be applied.  
4. If the CS LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high impedance state. CS must be active during the tCW  
write period.  
5. Transition is measured ±200mV from steady state.  
6.42  
7
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM  
4 Meg (512K x 8-bit)  
Commercial and Industrial Temperature Ranges  
OrderingInformation  
71V424  
X
XX  
XXX  
X
X
X
Device  
Type  
Power Speed Package  
Process/  
Temperature  
Range  
Blank Tube or Tray  
8
Tape and Reel  
Commercial (0°C to +70°C)  
Industrial (–40°C to +85°C)  
Blank  
I
G
Green  
Y
PH  
36-pin 400 mil SOJ (SO36-1)  
44-pin TSOP Type II (SO44-2)  
10  
12  
15  
Speed in nanoseconds  
S
L
Standard Power  
Low Power  
3622 drw 10  
6.842  
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM  
4 Meg (512K x 8-bit)  
Commercial and Industrial Temperature Ranges  
DatasheetDocumentHistory  
8/13/99  
Updatedtonewformat  
Pg. 2  
Pg. 7  
RemovedSO44-1fromTSOPpinout  
RevisedfootnotesonWriteCycleNo. 1diagram  
RemovedfootnotefortWR onWriteCycleNo. 2diagram  
Pg. 9  
Pg. 1–9  
Pg. 8  
Pg. 8  
Pg. 3  
AddedDatasheetDocumentHistory  
AddedIndustrialtemperaturerangeofferings  
Addeddierevisionoptiontoorderinginformation  
Updatednote, L10speedgradecommercialtemperatureonlyandupdateddiesteppingfromYFtoY.  
Increased ISB for all "L" and S15 speeds by 10mA and increased for S12 speed by 5mA (refer to  
PCN# SR-0402-02).  
8/31/99  
11/22/02  
07/31/03  
07/28/04  
Pg. 8  
Pg. 1, 8  
Added"Restrictedhazardoussubstancedevice"totheorderinginformation.  
Added Y and V step part numbers to front page and ordering information. Updated the ordering  
informationbyremovingtheIDTnotation.  
09/20/08  
05/12/09  
06/11/09  
09/26/13:  
Pg. 3,5,8  
Pg.1,8  
Pg.1-9  
Pg.1  
Add Industrial grade for 10ns Low Power.  
RemovedVS,VLfromdatasheetandorderinginformation.  
Removedthe/YS&/YLfromthedevicenamefortheentiredatasheet.  
RemovedIDT'sreferencetofabrication.  
Pg.8  
UpdatedorderinginformationbyaddingT&R,updatedRestrictedHazardousSubstanceDevice  
wording to Green and removed the Die Stepping Revision, the”Y” designator.  
for Tech Support:  
sramhelp@idt.com  
408-284-4532  
CORPORATE HEADQUARTERS  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
for SALES:  
800-345-7015 or  
408-284-8200  
fax: 408-284-2775  
www.idt.com  
The IDT logo is a registered trademark of Integrated Device Technology, Inc.  
6.42  
9

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