72201L10J8 [IDT]

PLCC-32, Reel;
72201L10J8
型号: 72201L10J8
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

PLCC-32, Reel

文件: 总14页 (文件大小:126K)
中文:  中文翻译
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CMOSSyncFIFO™  
64 x 9, 256 x 9, 512 x 9,  
1,024 x 9, 2,048 x 9,  
4,096 x 9 and 8,192 x 9  
IDT72421,IDT72201  
IDT72211,IDT72221  
IDT72231,IDT72241  
IDT72251  
FEATURES:  
DESCRIPTION:  
64 x 9-bit organization (IDT72421)  
The IDT72421/72201/72211/72221/72231/72241/72251 SyncFIFO™  
256 x 9-bit organization (IDT72201)  
512 x 9-bit organization (IDT72211)  
1,024 x 9-bit organization (IDT72221)  
2,048 x 9-bit organization (IDT72231)  
4,096 x 9-bit organization (IDT72241)  
8,192 x 9-bit organization (IDT72251)  
10 ns read/write cycle time  
Read and Write Clocks can be independent  
Dual-Ported zero fall-through time architecture  
Empty and Full Flags signal FIFO status  
Programmable Almost-Empty and Almost-Full flags can be set  
to any depth  
are very high-speed, low-power First-In, First-Out (FIFO) memories with  
clockedreadandwrite controls. These devices have a 64, 256, 512, 1,024,  
2,048,4,096,and8,192x9-bitmemoryarray,respectively. TheseFIFOsare  
applicableforawidevarietyofdatabufferingneedssuchasgraphics,localarea  
networksandinterprocessorcommunication.  
TheseFIFOshave9-bitinputandoutputports.Theinputportiscontrolled  
bya free-runningclock(WCLK), andtwowrite enable pins (WEN1, WEN2).  
DataiswrittenintotheSynchronousFIFOoneveryrisingclockedgewhenthe  
writeenablepinsareasserted.Theoutputportiscontrolledbyanotherclock  
pin (RCLK) and two read enable pins (REN1, REN2). The Read Clock can  
betiedtotheWriteClockforsingleclockoperationorthetwoclocks canrun  
asynchronous ofoneanotherfordual-clockoperation.Anoutputenablepin  
(OE)is providedonthe readportforthree-state controlofthe output.  
The Synchronous FIFOs have twofixedflags, Empty(EF)andFull(FF).  
Two programmable flags, Almost-Empty (PAE) and Almost-Full (PAF), are  
provided for improved system control. The programmable flags default to  
Empty+7andFull-7forPAE andPAF,respectively.Theprogrammableflag  
offsetloadingiscontrolledbyasimplestatemachineandisinitiatedbyasserting  
Programmable Almost-Empty and Almost-Full flags default to  
Empty+7, and Full-7, respectively  
Output enable puts output data bus in high-impedance state  
Advanced submicron CMOS technology  
Available in the 32-pin plastic leaded chip carrier (PLCC) and  
32-pin Thin Quad Flat Pack (TQFP)  
For through-hole product please see the IDT72420/72200/72210/ the load pin (LD).  
72220/72230/72240 data sheet  
These FIFOs are fabricated using IDTs high-speed submicron CMOS  
technology.  
Industrial temperature range (–40°C to +85°C) is available  
Green parts available, see ordering information  
FUNCTIONAL BLOCK DIAGRAM  
D0 - D8  
WCLK  
WEN1  
WEN2  
LD  
OFFSET REGISTER  
INPUT REGISTER  
EF  
FLAG  
LOGIC  
WRITE CONTROL  
LOGIC  
PAE  
PAF  
FF  
RAM ARRAY  
64 x 9, 256 x 9,  
512 x 9, 1,024 x 9,  
2,048 x 9, 4,096 x 9,  
8,192 x 9  
WRITE POINTER  
READ POINTER  
READ CONTROL  
LOGIC  
OUTPUT REGISTER  
RESET LOGIC  
RCLK  
REN1  
REN2  
RS  
2655 drw01  
OE  
Q0 - Q8  
CIDTOandMtheMIDTElogRoaCrerIegAisteLredtrAadeNmaDrksofIInNtegrDateUdDSeviTceTRecIhnAoloLgy,InTc.TEheMSynPcFEIFORisaAreTgistUereRdtraEdemaRrkoAfInNtegGrateEdDSeviceTechnology,Inc.  
OCTOBER 2008  
1
2008 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.  
DSC-2655/5  
©
IDT72421/72201/72211/72221/72231/72241/72251 CMOS SyncFIFO™  
64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALANDINDUSTRIAL  
TEMPERATURERANGES  
PINCONFIGURATION  
INDEX  
INDEX  
4
3
2
32 31 30  
1
29 28 27 26 25  
32 31 30  
D1  
29  
28  
27  
26  
25  
24  
23  
22  
21  
RS  
5
1
2
3
4
D
1
24  
23  
22  
21  
20  
19  
18  
17  
D
0
WEN1  
WEN1  
WCLK  
WEN2/LD  
6
D0  
WCLK  
PAF  
PAE  
7
PAF  
WEN2/LD  
8
PAE  
GND  
VCC  
9
VCC  
GND  
REN1  
RCLK  
REN2  
OE  
5
Q8  
Q8  
10  
11  
12  
13  
REN1  
Q7  
6
7
8
Q7  
RCLK  
Q6  
Q6  
REN2  
Q5  
Q5  
9
10 11 12 13 14 15 16  
14 15 16 17 18 19 20  
2655 drw 02  
2655 drw02a  
TQFP (PR32-1, order code: PF)  
TOP VIEW  
PLCC (J32-1, order code: J)  
TOP VIEW  
PINDESCRIPTIONS  
Symbol  
D0-D8  
RS  
Name  
I/O  
Description  
DataInputs  
I
I
Datainputs fora9-bitbus.  
Reset  
When RS is set LOW, internal read and write pointers are set to the first location of the RAM array,FF and PAF  
go HIGH, and PAE and EF go LOW. A reset is required before an initial WRITE after power-up.  
WCLK  
WriteClock  
I
I
DataiswrittenintotheFIFOonaLOW-to-HIGHtransitionofWCLKwhentheWriteEnable(s)areasserted.  
WEN1  
WriteEnable1  
Ifthe FIFOis configuredtohave programmable flags, WEN1 is the onlywrite enable pin. WhenWEN1 is LOW,  
data is writtenintothe FIFOoneveryLOW-to-HIGHtransitionWCLK. Ifthe FIFOis configuredtohave twowrite  
enables, WEN1 mustbeLOWandWEN2mustbeHIGHtowritedataintotheFIFO.Datawillnotbewritteninto  
the FIFOifthe FF is LOW.  
WEN2/ WriteEnable2/  
I
The FIFO is configured at reset to have either two write enables or programmable flags. If WEN2/LD is HIGH  
atreset,this pinoperates as asecondwriteenable. IfWEN2/LD is LOWatreset,this pinoperates as acontrol  
toloadandreadtheprogrammableflagoffsets.IftheFIFOis configuredtohavetwowriteenables,WEN1 must  
be LOWandWEN2mustbe HIGHtowrite data intothe FIFO. Data willnotbe writtenintothe FIFOifthe FF is  
LOW. Ifthe FIFOis configuredtohave programmable flags, WEN2/LD is heldLOWtowrite orreadthe  
programmableflagoffsets.  
LD  
Load  
Q0-Q8  
RCLK  
REN1  
DataOutputs  
ReadClock  
O Dataoutputsfora9-bitbus.  
I
I
Data is read from the FIFO on a LOW-to-HIGH transition of RCLK when REN1 and REN2 are asserted.  
When REN1 and REN2 are LOW, data is read from the FIFO on every LOW-to-HIGH transition of RCLK.  
Data will not be read from the FIFO if the EF is LOW.  
Read Enable 1  
REN2  
OE  
Read Enable 2  
OutputEnable  
EmptyFlag  
I
I
When REN1 and REN2 are LOW, data is read from the FIFO on every LOW-to-HIGH transition of RCLK.  
Data will not be read from the FIFO if the EF is LOW.  
WhenOE is LOW, the data outputbus is active. IfOE is HIGH, the outputdata bus willbe ina high-impedance  
state.  
EF  
O When EF is LOW, the FIFOis emptyandfurtherdata reads fromthe outputare inhibited. WhenEF is HIGH, the  
FIFO is not empty. EF is synchronized to RCLK.  
PAE  
PAF  
FF  
Programmable  
Almost-EmptyFlag  
O When PAE isLOW,theFIFOisalmost-emptybasedontheoffsetprogrammedintotheFIFO.Thedefault  
offsetatresetis Empty+7. PAE is synchronizedtoRCLK.  
O WhenPAFisLOW,theFIFOisalmost-fullbasedontheoffsetprogrammedintotheFIFO.Thedefaultoffset  
at reset is Full-7. PAF is synchronized to WCLK.  
O WhenFF is LOW, the FIFOis fullandfurtherdata writes intothe inputare inhibited. WhenFF is HIGH, the FIFO  
isnotfull.FF issynchronizedtoWCLK.  
Programmable  
Almost-FullFlag  
Full Flag  
VCC  
Power  
One +5 volt power supply pin.  
One 0 volt ground pin.  
GND  
Ground  
©
OCTOBER22,2008  
2
IDT72421/72201/72211/72221/72231/72241/72251 CMOS SyncFIFO™  
64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALANDINDUSTRIAL  
TEMPERATURERANGES  
ABSOLUTEMAXIMUMRATINGS  
RECOMMENDEDOPERATING  
CONDITIONS  
Symbol  
Rating  
Com'l & Ind'l  
Unit  
V
Symbol  
Parameter  
Min. Typ. Max.  
Unit  
VTERM  
TerminalVoltagewith  
RespecttoGND  
StorageTemperature  
–0.5to+7.0  
VCC  
SupplyVoltage  
4.5  
5.0  
5.5  
V
TSTG  
–55to +125  
–50 to +50  
°C  
Commercial/Industrial  
SupplyVoltage  
GND  
VIH  
0
2.0  
0
0
V
V
InputHighVoltage  
Commercial/Industrial  
InputLowVoltage  
Commercial/Industrial  
OperatingTemperature  
Commercial  
IOUT  
DCOutputCurrent  
mA  
NOTE:  
VIL  
TA  
TA  
0
0.8  
+70  
+85  
V
°C  
°C  
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause  
permanent damage to the device. This is a stress rating only and functional operation  
of the device at these or any other conditions above those indicated in the operational  
sections of the specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect reliability.  
OperatingTemperature  
Industrial  
–40  
DCELECTRICALCHARACTERISTICS  
(Commercial: VCC = 5V ± 10%, T  
A
= 0  
°
C to +70  
°
C; Industrial: VCC = 5V ± 10%, T  
A
= –40  
°
C to +85  
°
C)  
IDT72421  
IDT72201  
IDT72211  
IDT72221  
IDT72231  
IDT72241  
IDT72251  
Com'l and Ind'l(1)  
tCLK = 10, 15, 25 ns  
Com'l and Ind'l(1)  
tCLK = 10, 15, 25 ns  
Symbol  
Parameter  
Min.  
–1  
Typ.  
Max.  
1
Min.  
Typ.  
Max.  
(2)  
ILI  
Input Leakage Current (Any Input)  
OutputLeakageCurrent  
–1  
–10  
2.4  
1
10  
0.4  
50  
5
(3)  
ILO  
–10  
2.4  
10  
0.4  
35  
5
VOH  
VOL  
Output Logic 1Voltage, IOH = –2mA  
OutputLogic0Voltage,IOL=8mA  
Active Power Supply Current  
StandbyCurrent  
(4,5,6)  
ICC1  
(4,7)  
ICC2  
NOTES:  
1. Industrial temperature range product for the 15ns and 25ns speed grades are available as standard product.  
2. Measurements with 0.4 VIN VCC.  
3. OE VIH, 0.4 VOUT VCC.  
4. Tested with outputs open (IOUT = 0).  
5. RCLK and WCLK toggle at 20 MHz and data inputs switch at 10 MHz.  
6. Typical ICC1 = 1.7 + 0.7*fS + 0.02*CL*fS (in mA).  
These equations are valid under the following conditions:  
VCC = 5V, TA = 25°C, fS = WCLK frequency = RCLK frequency (in MHz, using TTL levels), data switching at fS/2, CL = capacitive load (in pF).  
7. All Inputs = VCC - 0.2V or GND + 0.2V, except RCLK and WCLK, which toggle at 20 MHz.  
©
OCTOBER22,2008  
3
IDT72421/72201/72211/72221/72231/72241/72251 CMOS SyncFIFO™  
64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALANDINDUSTRIAL  
TEMPERATURERANGES  
ACELECTRICALCHARACTERISTICS  
(Commercial: VCC = 5V ± 10%, TA = 0°C to +70°C; Industrial: VCC = 5V ± 10%, TA = –40°C to +85°C)  
Commercial  
IDT72421L10  
IDT72201L10  
IDT72211L10  
IDT72221L10  
IDT72231L10  
IDT72241L10  
IDT72251L10  
Com'l & Ind'l(1)  
Com'l & Ind'l(1)  
IDT72421L25  
IDT72201L25  
IDT72211L25  
IDT72221L25  
IDT72231L25  
IDT72241L25  
IDT72251L25  
IDT72421L15  
IDT72201L15  
IDT72211L15  
IDT72221L15  
IDT72231L15  
IDT72241L15  
IDT72251L15  
Symbol  
fS  
Parameter  
Clock Cycle Frequency  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
40  
Unit  
MHz  
100  
6.5  
10  
6
66.7  
10  
15  
8
tA  
DataAccessTime  
ClockCycleTime  
ClockHighTime  
2
10  
4.5  
4.5  
3
2
15  
6
2
25  
10  
10  
6
15  
25  
13  
13  
15  
15  
15  
15  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tCLK  
tCLKH  
tCLKL  
tDS  
ClockLowTime  
6
DataSetupTime  
4
tDH  
DataHoldTime  
0.5  
3
1
1
tENS  
tENH  
tRS  
EnableSetupTime  
EnableHoldTime  
ResetPulseWidth(2)  
ResetSetupTime  
Reset Recovery Time  
ResettoFlagandOutputTime  
4
6
0.5  
10  
8
1
1
15  
10  
10  
0
15  
15  
15  
0
tRSS  
tRSR  
tRSF  
tOLZ  
tOE  
8
0
(3)  
OutputEnabletoOutputinLow-Z  
OutputEnabletoOutputValid  
3
3
3
(3)  
tOHZ  
tWFF  
tREF  
tPAF  
tPAE  
tSKEW1  
OutputEnabletoOutputinHigh-Z  
WriteClocktoFullFlag  
3
6
3
8
3
5
6.5  
6.5  
6.5  
6.5  
6
10  
10  
10  
10  
10  
ReadClocktoEmptyFlag  
WriteClocktoProgrammableAlmost-FullFlag  
ReadClocktoProgrammableAlmost-EmptyFlag  
SkewtimebetweenReadClock& WriteClockfor  
Empty Flag & Full Flag  
tSKEW2  
SkewtimebetweenReadClock&WriteClockfor  
Almost-EmptyFlag&ProgrammableAlmost-FullFlag  
14  
15  
18  
ns  
NOTES:  
1. Industrial temperature range product for the 15ns and 25ns speed grades are available as standard product.  
2. Pulse widths less than minimum values are not allowed.  
3. Values guaranteed by design, not currently tested.  
5V  
ACTESTCONDITIONS  
In Pulse Levels  
GND to 3.0V  
3ns  
1.5V  
1.5V  
See Figure 1  
1.1K  
Input Rise/Fall Times  
Input Timing Reference Levels  
Output Reference Levels  
Output Load  
D.U.T.  
30pF*  
680Ω  
CAPACITANCE(Ta = +25°C, f = 1.0MHz)  
Symbol  
Parameter  
InputCapacitance  
OutputCapacitance  
Conditions  
VIN = 0V  
Max. Unit  
2655 drw 03  
(2)  
CIN  
10  
10  
pF  
pF  
(1,2)  
COUT  
NOTES:  
VOUT = 0V  
or equivalent circuit  
Figure 1. Output Load  
*includesjigandscopecapacitances  
1. With output deselected (OE VIH).  
2. Characterized values, not currently tested.  
©
OCTOBER22,2008  
4
IDT72421/72201/72211/72221/72231/72241/72251 CMOS SyncFIFO™  
64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALANDINDUSTRIAL  
TEMPERATURERANGES  
OUTPUTENABLE(OE)  
SIGNALDESCRIPTIONS  
WhenOutputEnable (OE)is enabled(LOW), the paralleloutputbuffers  
receivedatafromtheoutputregister. WhenOutputEnable(OE)is disabled  
(HIGH),theQoutputdatabusisinahigh-impedancestate.  
INPUTS:  
DATA IN (D0 - D8)  
Datainputsfor9-bitwidedata.  
WRITE ENABLE 2/LOAD (WEN2/LD)  
This is a dual-purpose pin. The FIFO is configured at Reset to have  
programmableflagsortohavetwowriteenables,whichallowsdepthexpansion.  
IfWriteEnable2/Load(WEN2/LD)issetHIGHatReset(RS=LOW),thispin  
operates as a second write enable pin.  
If the FIFO is configured to have two write enables, when Write Enable  
(WEN1)is LOWandWrite Enable 2/Load(WEN2/LD)is HIGH, data canbe  
loadedintotheinputregisterandRAMarrayontheLOW-to-HIGHtransition  
ofeveryWriteClock(WCLK). DataisstoredintheRAMarraysequentiallyand  
independentlyofanyongoingreadoperation.  
CONTROLS:  
RESET (RS)  
ResetisaccomplishedwhenevertheReset(RS)inputistakentoaLOW  
state. During reset, both internal read and write pointers are set to the first  
location. Aresetisrequiredafterpower-upbeforeawriteoperationcantake  
place. TheFullFlag(FF)andProgrammableAlmost-Fullflag(PAF)willbereset  
toHIGHaftertRSF. TheEmptyFlag(EF)andProgrammableAlmost-Empty  
flag(PAE)willberesettoLOWaftertRSF. Duringreset,theoutputregisteris  
initializedtoallzerosandtheoffsetregistersareinitializedtotheirdefaultvalues.  
In this configuration, when Write Enable (WEN1) is HIGH and/or Write  
Enable2/Load(WEN2/LD)isLOW,theinputregisterholdsthepreviousdata  
and no new data is allowed to be loaded into the register.  
WRITE CLOCK (WCLK)  
Topreventdataoverflow,theFullFlag(FF)willgoLOW,inhibitingfurther  
writeoperations. Uponthecompletionofavalidreadcycle,theFullFlag(FF)  
willgoHIGHaftertWFF,allowingavalidwritetobegin. WriteEnable1(WEN1)  
and Write Enable 2/Load (WEN2/LD) are ignored when the FIFO is full.  
TheFIFOisconfiguredtohaveprogrammableflagswhentheWriteEnable  
2/Load(WEN2/LD)is setLOWatReset(RS=LOW). TheIDT72421/72201/  
72211/72221/72231/72241/72251devicescontainfour8-bitoffsetregisters  
whichcanbeloadedwithdataontheinputs,orreadontheoutputs. SeeFigure  
3fordetailsofthesizeoftheregistersandthedefaultvalues.  
IftheFIFOisconfiguredtohaveprogrammableflagswhentheWriteEnable  
1(WEN1)andWriteEnable2/Load(WEN2/LD)aresetLOW,dataontheinputs  
DiswrittenintotheEmpty(LeastSignificantBit)OffsetregisteronthefirstLOW-  
to-HIGHtransitionoftheWriteClock(WCLK). DataiswrittenintotheEmpty(Most  
SignificantBit)OffsetregisteronthesecondLOW-to-HIGHtransitionoftheWrite  
Clock(WCLK),intotheFull(LeastSignificantBit)Offsetregisteronthethird  
transition,andintotheFull(MostSignificantBit)Offsetregisteronthefourth  
transition. ThefifthtransitionoftheWriteClock(WCLK)againwritestotheEmpty  
(LeastSignificantBit)Offsetregister.  
AwritecycleisinitiatedontheLOW-to-HIGHtransitionoftheWriteClock  
(WCLK). DatasetupandholdtimesmustbemetinrespecttotheLOW-to-HIGH  
transition of WCLK. The Full Flag (FF) and Programmable Almost-Full flag  
(PAF)aresynchronizedwithrespecttotheLOW-to-HIGHtransitionofWCLK.  
The Write andReadClocks canbe asynchronous orcoincident.  
WRITE ENABLE 1 (WEN1)  
IftheFIFOisconfiguredforprogrammableflags,WriteEnable1(WEN1)  
istheonlyenablecontrolpin. Inthisconfiguration,whenWriteEnable1(WEN1)  
isLOW,datacanbeloadedintotheinputregisterandRAMarrayontheLOW-  
to-HIGHtransitionofeveryWriteClock(WCLK). DataisstoredintheRAMarray  
sequentiallyandindependentlyofanyongoingreadoperation.  
Inthisconfiguration,whenWriteEnable1(WEN1)isHIGH,theinputregister  
holdsthepreviousdataandnonewdataisallowedtobeloadedintotheregister.  
IftheFIFOisconfiguredtohavetwowriteenables,whichallowsfordepth  
expansion,therearetwoenablecontrolpins. SeeWriteEnable2paragraph  
belowforoperationinthisconfiguration.  
Topreventdataoverflow,theFullFlag(FF)willgoLOW,inhibitingfurther  
writeoperations. Uponthecompletionofavalidreadcycle,theFullFlag(FF)  
willgoHIGHaftertWFF,allowingavalidwritetobegin. WriteEnable1(WEN1)  
is ignored when the FIFO is full.  
However,writingalloffsetregistersdoesnothavetooccuratonetime. One  
ortwooffsetregisterscanbewrittenandthenbybringingtheWriteEnable2/  
Load (WEN2/LD) pin HIGH, the FIFO is returned to normal read/write  
operation. WhentheWriteEnable2/Load(WEN2/LD)pinissetLOW,theWrite  
Enable1(WEN1)isLOW,thenextoffsetregisterinsequenceiswritten.  
READ CLOCK (RCLK)  
DatacanbereadontheoutputsontheLOW-to-HIGHtransitionoftheRead  
Clock(RCLK). TheEmptyFlag(EF)andProgrammableAlmost-Emptyflag  
(PAE)aresynchronizedwithrespecttotheLOW-to-HIGHtransitionofRCLK.  
The Write andReadClocks canbe asynchronous orcoincident.  
LD  
0
WEN1  
0
WCLK  
Selection  
EmptyOffset(LSB)  
Empty Offset (MSB)  
Full Offset (LSB)  
Full Offset (MSB)  
READ ENABLES (REN1, REN2)  
WhenbothReadEnables(REN1,REN2)areLOW,dataisreadfromthe  
RAMarraytotheoutputregisterontheLOW-to-HIGHtransitionoftheRead  
Clock (RCLK).  
WheneitherReadEnable(REN1,REN2)isHIGH,theoutputregisterholds  
the previous data and no new data is allowed to be loaded into the register.  
Whenallthe data has beenreadfromthe FIFO, the EmptyFlag(EF)will  
goLOW,inhibitingfurtherreadoperations. Onceavalidwriteoperationhas  
beenaccomplished, the EmptyFlag(EF)willgoHIGHaftertREF anda valid  
readcanbegin. TheReadEnables(REN1,REN2)areignoredwhentheFIFO  
isempty.  
0
1
1
0
1
No Operation  
Write Into FIFO  
No Operation  
1
NOTE:  
1. For the purposes of this table, WEN2 = VIH.  
2. The same selection sequence applies to reading from the registers. REN1 and REN2  
are enabled and read is performed on the LOW-to-HIGH transition of RCLK.  
Figure 2. Write Offset Register  
©
OCTOBER22,2008  
5
IDT72421/72201/72211/72221/72231/72241/72251 CMOS SyncFIFO™  
64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALANDINDUSTRIAL  
TEMPERATURERANGES  
Thecontentsoftheoffsetregisterscanbereadontheoutputlineswhenthe  
A read and write should not be performed simultaneously to the offset  
WriteEnable2/Load(WEN2/LD)pinissetLOWandbothReadEnables(REN1, registers.  
REN2)aresetLOW. DatacanbereadontheLOW-to-HIGHtransitionofthe  
Read Clock (RCLK).  
IDT72421 - 64 x 9-BIT  
IDT72201 - 256 x 9-BIT  
8
8
8
8
6 5  
0
0
0
0
8
8
8
8
7
0
0
0
0
Empty Offset (LSB) Reg.  
Empty Offset (LSB) Reg.  
Default Value 007H  
Default Value 007H  
6 5  
7
Full Offset (LSB) Reg.  
Default Value 007H  
Full Offset (LSB) Reg.  
Default Value 007H  
IDT72211 - 512 x 9-BIT  
IDT72221 - 1,024 x 9-BIT  
8
8
8
7
0
0
0
8
7
0
0
0
0
Empty Offset (LSB) Reg.  
Default Value 007H  
Empty Offset (LSB)  
Default Value 007H  
1
1
8
8
8
(MSB)  
(MSB)  
00  
0
7
7
Full Offset (LSB) Reg.  
Default Value 007H  
Full Offset (LSB)  
Default Value 007H  
8
1
0
1
(MSB)  
00  
(MSB)  
0
IDT72231 - 2,048 x 9-BIT  
IDT72241 - 4,096 x 9-BIT  
IDT72251 8,192 x 9-BIT  
8
8
8
8
7
0
8
8
8
8
7
0
0
0
0
8
8
8
8
7
0
0
0
0
Empty Offset (LSB) Reg.  
Default Value 007H  
Empty Offset (LSB)  
Empty Offset (LSB)  
Default Value 007H  
Default Value 007H  
2
0
0
0
3
4
(MSB)  
(MSB)  
(MSB)  
000  
0000  
00000  
7
7
7
Full Offset (LSB)  
Full Offset (LSB)  
Full Offset (LSB) Reg.  
Default Value 007H  
Default Value 007H  
Default Value 007H  
2
3
4
(MSB)  
(MSB)  
(MSB)  
000  
0000  
00000  
2655 drw 05  
Figure 3. Offset Register Location and Default Values  
©
OCTOBER22,2008  
6
IDT72421/72201/72211/72221/72231/72241/72251 CMOS SyncFIFO™  
64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALANDINDUSTRIAL  
TEMPERATURERANGES  
(1,024-m)writesfortheIDT72221,(2,048-m)writesfortheIDT72231,(4,096-  
m)writesfortheIDT72241,and(8,192-m)writesfortheIDT72251. Theoffset  
“m”isdefinedintheFulloffsetregisters.  
IfthereisnoFulloffsetspecified,theProgrammableAlmost-Fullflag(PAF)  
will go LOW at Full-7 words.  
OUTPUTS:  
FULL FLAG (FF)  
TheFullFlag(FF)willgoLOW,inhibitingfurtherwriteoperation,whenthe  
device is full. If no reads are performed after Reset (RS), the Full Flag (FF)  
willgoLOWafter64writesfortheIDT72421,256writesfortheIDT72201,512  
writes for the IDT72211, 1,024 writes for the IDT72221, 2,048 writes for the  
IDT72231,4,096writesfortheIDT72241,and8,192writesfortheIDT72251.  
The Full Flag (FF) is synchronized with respect to the LOW-to-HIGH  
transitionoftheWriteClock(WCLK).  
TheProgrammableAlmost-Fullflag(PAF)issynchronizedwithrespectto  
theLOW-to-HIGHtransitionoftheWriteClock(WCLK).  
PROGRAMMABLEALMOST-EMPTYFLAG(PAE)  
TheProgrammableAlmost-Emptyflag(PAE)willgoLOWwhentheread  
pointeris"n+1"locationslessthanthewritepointer. Theoffset"n"isdefined  
in the Empty Offset registers. If no reads are performed after Reset the  
Programmable Almost-Empty flag (PAE) will go HIGH after "n+1" for the  
IDT72421/72201/72211/72221/72231/72241/72251.  
IfthereisnoEmptyoffsetspecified,theProgrammableAlmost-Emptyflag  
(PAE)willgoLOWatEmpty+7words.  
EMPTY FLAG (EF)  
TheEmptyFlag(EF)willgoLOW,inhibitingfurtherreadoperations,when  
thereadpointerisequaltothewritepointer,indicatingthedeviceisempty.  
The Empty Flag (EF) is synchronized with respect to the LOW-to-HIGH  
transitionoftheReadClock(RCLK).  
TheProgrammableAlmost-Emptyflag(PAE)issynchronizedwithrespect  
totheLOW-to-HIGHtransitionoftheReadClock(RCLK).  
PROGRAMMABLE ALMOST-FULL FLAG (PAF)  
The Programmable Almost-Full flag (PAF) will go LOW when the FIFO  
reachesthealmost-fullcondition.IfnoreadsareperformedafterReset(RS),  
theProgrammableAlmost-Fullflag(PAF)willgoLOWafter(64-m)writesforthe  
IDT72421,(256-m)writesfortheIDT72201,(512-m)writesfortheIDT72211,  
DATA OUTPUTS (Q0 - Q8)  
Dataoutputsfora9-bitwidedata.  
TABLE 1 — STATUS FLAGS  
NUMBER OF WORDS IN FIFO  
IDT72421  
0
1 to n (1)  
IDT72201  
0
1 to n (1)  
IDT72211  
0
1 to n (1)  
FF  
H
H
H
H
L
PAF  
H
PAE  
L
EF  
L
H
L
H
H
H
H
(n+1)to(64-(m+1))  
(64-m)(2) to63  
64  
(n+1)to(256-(m+1))  
(n+1)to(512-(m+1))  
H
H
(2)  
(2)  
(256-m) to255  
(512-m) to511  
L
H
256  
512  
L
H
NUMBER OF WORDS IN FIFO  
IDT72221  
IDT72231  
IDT72241  
IDT72251  
FF  
PAF  
PAE  
EF  
0
0
0
0
H
H
L
L
1ton(1)  
1ton(1)  
1ton(1)  
1ton(1)  
H
H
H
H
L
H
H
(n+1)to(1,024-(m+1))  
(n+1)to(2,048-(m+1))  
(n+1)to(4,096-(m+1))  
(n+1)to(8,192-(m+1))  
H
(2)  
(2)  
(1,024-m) to1,023  
(2,048-m) to2,047  
(4,096-m)(2) to4,095  
4,096  
(8,192-m)(2) to8,191  
8,192  
H
L
L
L
H
H
H
H
1,024  
2,048  
NOTES:  
1. n = Empty Offset (n = 7 default value)  
2. m = Full Offset (m = 7 default value)  
©
OCTOBER22,2008  
7
IDT72421/72201/72211/72221/72231/72241/72251 CMOS SyncFIFO™  
64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALANDINDUSTRIAL  
TEMPERATURERANGES  
tRS  
RS  
REN1, REN2  
WEN1  
tRSS  
tRSS  
tRSS  
tRSR  
tRSR  
tRSR  
WEN2/LD(1)  
EF, PAE  
tRSF  
tRSF  
FF, PAF  
tRSF  
OE = 1(2)  
Q0 - Q8  
2655 drw 06  
OE = 0  
NOTES:  
1. Holding WEN2/LD HIGH during reset will make the pin act as a second write enable pin. Holding WEN2/LD LOW during reset will make the pin act as a load enable for the programmable  
flag offset registers.  
2. After reset, the outputs will be LOW if OE = 0 and tri-state if OE = 1.  
3. The clocks (RCLK, WCLK) can be free-running during reset.  
Figure 4. Reset Timing  
tCLK  
tCLKH  
tCLKL  
WCLK  
tDH  
tDS  
D0 - D8  
DATA IN VALID  
t
ENH  
ENH  
t
ENS  
NO OPERATION  
NO OPERATION  
WEN1  
t
tENS  
WEN2/  
(If Applicable)  
t
WFF  
tWFF  
FF  
(1)  
tSKEW1  
RCLK  
REN1,  
2655 drw 07  
REN2  
NOTE:  
1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge for FF to change during the current clock cycle. If the time between the rising edge of RCLK  
and the rising edge of WCLK is less than tSKEW1, then FF may not change state until the next WCLK edge.  
Figure 5. Write Cycle Timing  
©
OCTOBER22,2008  
8
IDT72421/72201/72211/72221/72231/72241/72251 CMOS SyncFIFO™  
64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALANDINDUSTRIAL  
TEMPERATURERANGES  
tCLK  
tCLKH  
tCLKL  
RCLK  
tENS  
tENH  
REN1,  
REN2  
NO OPERATION  
tREF  
tREF  
EF  
tA  
VALID DATA  
Q0 - Q8  
tOLZ  
tOHZ  
tOE  
OE  
(1)  
SKEW1  
t
WCLK  
WEN1  
2655 drw 08  
WEN2  
NOTE:  
1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge for EF to change during the current clock cycle. If the time between the rising edge of RCLK  
and the rising edge of WCLK is less than tSKEW1, then EF may not change state until the next RCLK edge.  
Figure 6. Read Cycle Timing  
WCLK  
tDS  
D0 - D8  
D1  
D2  
D3  
D0 (First Valid Write)  
tENS  
tENS  
WEN1  
WEN2  
(If Applicable)  
(1)  
tFRL  
tSKEW1  
RCLK  
tREF  
EF  
tENS  
REN1,  
REN2  
tA  
tA  
Q0 - Q8  
D0  
D1  
tOLZ  
tOE  
OE  
NOTE:  
2655 drw 09  
1. When tSKEW1 minimum specification, tFRL = tCLK + tSKEW1  
When tSKEW1 < minimum specification, tFRL = 2tCLK + tSKEW1 or tCLK + tSKEW1  
The Latency Timings apply only at the Empty Boundary (EF = LOW).  
Figure 7. First Data Word Latency Timing  
©
OCTOBER22,2008  
9
IDT72421/72201/72211/72221/72231/72241/72251 CMOS SyncFIFO™  
64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALANDINDUSTRIAL  
TEMPERATURERANGES  
NO WRITE  
NO WRITE  
NO WRITE  
WCLK  
tSKEW1  
tDS  
tSKEW1  
D0 - D8  
t
WFF  
t
WFF  
t
WFF  
FF  
(1)  
(1)  
t
ENH  
tENS  
t
ENS  
WEN1  
tENH  
t
ENS  
tENS  
WEN2  
(If Applicable)  
RCLK  
tENH  
tENH  
tENS  
tENS  
REN1,  
REN2  
tA  
OE  
LOW  
tA  
Q0  
- Q8  
DATA READ  
NEXT DATA READ  
DATA IN OUTPUT REGISTER  
2655 drw 10  
NOTE:  
1. Only one of the two write enable inputs, WEN1 or WEN2, needs to go inactive to inhibit writes to the FIFO.  
Figure 8. Full Flag Timing  
WCLK  
tDS  
tDS  
D0 - D8  
DATA WRITE 1  
DATA WRITE 2  
tENS  
tENS  
tENH  
tENH  
WEN1  
tENS  
tENS  
tENH  
tENH  
WEN2  
(If Applicable)  
(1)  
FRL  
(1)  
FFL  
t
t
tSKEW1  
tSKEW1  
RCLK  
tREF  
tREF  
tREF  
EF  
REN1,  
REN2  
OE LOW  
tA  
Q0  
- Q8  
DATA READ  
DATA IN OUTPUT REGISTER  
2655 drw 11  
NOTE:  
1. When tSKEW1 minimum specification, tFRL maximum = tCLK + tSKEW1  
When tSKEW1 < minimum specification, tFRL maximum = 2tCLK + tSKEW1 or tCLK+ tSKEW1  
The Latency Timings apply only at the Empty Boundary (EF = LOW).  
Figure 9. Empty Flag Timing  
©
OCTOBER22,2008  
10  
IDT72421/72201/72211/72221/72231/72241/72251 CMOS SyncFIFO™  
64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALANDINDUSTRIAL  
TEMPERATURERANGES  
tCLKH  
tCLKL  
(4)  
WCLK  
t
ENH  
ENH  
t
ENS  
WEN1  
t
ENS  
t
WEN2  
(If Applicable)  
t
PAF  
PAF  
Full - (m+1) words in FIFO(1)  
(2)  
Full - m words in FIFO  
(3)  
SKEW2  
t
t
PAF  
RCLK  
tENH  
tENS  
REN1,  
2655 drw 12  
REN2  
NOTES:  
1. m = PAF offset .  
2. 64-m words in FIFO for IDT72421, 256-m words for IDT72201, 512-m words for IDT72211, 1,024-m words for IDT72221, 2,048-m words for IDT72231, 4,096-m words for IDT72241,  
and 8,192-m words for IDT72251.  
3. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge for PAF to change during that clock cycle. If the time between the rising edge of RCLK and  
the rising edge of WCLK is less than tSKEW2, then PAF may not change state until the next WCLK rising edge.  
4. If a write is performed on this rising edge of the Write Clock, there will be Full - (m-1) words in the FIFO when PAF goes LOW.  
Figure 10. Programmable Full Flag Timing  
tCLKH  
tCLKL  
WCLK  
t
ENS  
ENS  
t
ENH  
ENH  
WEN1  
t
t
WEN2  
(If Applicable)  
n words in FIFO (1)  
n+1 words in FIFO  
PAE  
(2)  
tSKEW2  
t
PAE  
tPAE  
(3)  
RCLK  
tENS  
tENH  
REN1,  
2655 drw 13  
REN2  
NOTES:  
1. n = PAE offset.  
2. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge for PAE to change during that clock cycle. If the time between the rising edge of WCLK and  
the rising edge of RCLK is less than tSKEW2, then PAE may not change state until the next RCLK rising edge.  
3. If a read is performed on this rising edge of the Read Clock, there will be Empty + (n-1) words in the FIFO when PAE goes LOW.  
Figure 11. Programmable Empty Flag Timing  
©
OCTOBER22,2008  
11  
IDT72421/72201/72211/72221/72231/72241/72251 CMOS SyncFIFO™  
64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALANDINDUSTRIAL  
TEMPERATURERANGES  
tCLK  
tCLKH  
tCLKL  
WCLK  
tENH  
tENS  
LD  
tENS  
WEN1  
tDS  
tDH  
D0 - D7  
PAE OFFSET  
(LSB)  
PAE OFFSET  
(MSB)  
PAF OFFSET  
(LSB)  
PAF OFFSET  
(MSB)  
2655 drw 14  
Figure 12. Write Offset Registers Timing  
tCLK  
tCLKH  
tCLKL  
RCLK  
tENS  
tENH  
LD  
tENS  
REN1,  
REN2  
tA  
EMPTY OFFSET  
(LSB)  
EMPTY OFFSET  
(MSB)  
FULL OFFSET  
(LSB)  
DATA IN OUTPUT REGISTER  
Q0 - Q7  
FULL OFFSET  
(MSB)  
2655 drw15  
Figure 13. Read Offset Registers Timing  
©
OCTOBER22,2008  
12  
IDT72421/72201/72211/72221/72231/72241/72251 CMOS SyncFIFO™  
64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALANDINDUSTRIAL  
TEMPERATURERANGES  
configuration,theWriteEnable2/Load(WEN2/LD)pinissetLOWatResetso  
thatthepinoperatesasacontroltoloadandreadtheprogrammableflagoffsets.  
OPERATINGCONFIGURATIONS  
SINGLE DEVICE CONFIGURATION  
AsingleIDT72421/72201/72211/72221/72231/72241/72251maybeused  
when the application requirements are for 64/256/512/1,024/2,048/4,096/  
8,192wordsorless.WhentheseFIFOsareinaSingleDeviceConfiguration,  
theReadEnable2(REN2)controlinputcanbegrounded(seeFigure14). In  
thisconfiguration,theWriteEnable2/Load(WEN2/LD)pinissetLOWatReset  
sothatthe pinoperates as a controltoloadandreadthe programmable flag  
offsets.  
DEPTH EXPANSION - The IDT72421/72201/72211/72221/72231/72241/  
72251canbeadaptedtoapplicationswhentherequirementsareforgreater  
than 64/256/512/1,024/2,048/4,096/8,192 words. The existence of two  
enable pins on the read and write port allow depth expansion. The Write  
Enable 2/Load pin is used as a second write enable in a depth expansion  
configurationthustheProgrammableflagsaresettothedefaultvalues. Depth  
expansionis possiblebyusingoneenableinputforsystemcontrolwhilethe  
otherenableinputiscontrolledbyexpansionlogictodirecttheflowofdata. A  
typicalapplicationwouldhavetheexpansionlogicalternatedataaccessfrom  
onedevicetothenextinasequentialmanner. Thesedevices operateinthe  
DepthExpansionconfigurationwhenthefollowingconditionsaremet:  
1. The WEN2/ LD pin is held HIGH during Reset so that this pin operates a  
secondWriteEnable.  
WIDTH EXPANSION CONFIGURATION  
Wordwidthmaybeincreasedsimplybyconnectingthecorrespondinginput  
controlssignalsofmultipledevices. Acompositeflagshouldbecreatedforeach  
oftheendpointstatusflags(EFandFF). Thepartialstatusflags(AEandAF)  
canbedetectedfromanyonedevice. Figure15demonstratesa18-bitword  
width by using two IDT72421/72201/72211/72221/72231/72241/72251s.  
AnywordwidthcanbeattainedbyaddingadditionalIDT72421/72201/72211/  
72221/72231/72241/72251s.  
2. Externallogicis usedtocontrolthe flowofdata.  
Please see the Application Note "DEPTH EXPANSION OF IDT'S SYN-  
CHRONOUSFIFOsUSINGTHERINGCOUNTERAPPROACH"fordetails  
ofthisconfiguration.  
When these FIFOs are in a Width Expansion Configuration, the Read  
Enable 2 (REN2) control input can be grounded (see Figure 15). In this  
RESET (RS)  
WRITE CLOCK (WCLK)  
WRITE ENABLE 1 (WEN1)  
READ CLOCK (RCLK)  
IDT  
READ ENABLE 1 (REN1)  
OUTPUT ENABLE (OE)  
72421  
72201  
72211  
72221  
72231  
72241  
72251  
WRITE ENABLE 2/LOAD (WEN2/LD)  
DATA IN (D  
0
- D8)  
DATA OUT (Q  
EMPTY FLAG (EF)  
PROGRAMMABLE ALMOST-EMPTY (PAE)  
0 - Q8)  
FULL FLAG (FF)  
PROGRAMMABLE ALMOST-FULL (PAF)  
2655 drw 16  
READ ENABLE 2 (REN2)  
Figure 14. Block Diagram of Single 64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 Synchronous FIFO  
RESET (RS)  
RESET (RS)  
DATA IN (D)  
18  
9
9
READ CLOCK (RCLK)  
WRITE CLOCK (WCLK)  
READ ENABLE (REN)  
OUTPUT ENABLE (OE)  
PROGRAMMABLE (PAE)  
WRITE ENABLE1 (WEN1)  
IDT  
IDT  
72421  
72201  
72211  
72221  
72231  
72241  
72251  
72421  
72201  
72211  
72221  
72231  
72241  
72251  
WRITE ENABLE2/LOAD (WEN2/LD)  
FULL FLAG (FF) #1  
FULL FLAG (FF) #2  
EMPTY FLAG (EF) #1  
EMPTY FLAG (EF) #2  
9
PROGRAMMABLE (PAF)  
18  
9
DATA OUT (Q)  
2655 drw 17  
READ ENABLE 2 (REN2)  
READ ENABLE 2 (REN2)  
Figure 15. Block Diagram of 64 x 18, 256 x 18, 512 x 18, 1,024 x 18, 2,048 x 18, 4,096 x 18, 8,192 x 18  
Synchronous FIFO Used in a Width Expansion Configuration  
©
OCTOBER22,2008  
13  
ORDERING INFORMATION  
XXXXX  
X
XX  
X
X
X
Device Type Power Speed Package  
Process/  
Temperature  
Range  
BLANK Commercial (0°C to +70°C)  
I(1)  
Industrial (-40° to +85°C)  
G(2)  
Green  
J
PF  
Plastic Leaded Chip Carrier (PLCC, J32-1)  
Thin Quad Flat Pack (TQFP, PR32-1)  
Commercial Only  
Commercial & Industrial  
Commercial & Industrial  
10  
15  
25  
Clock Cycle Time (tCLK  
Speed in Nanoseconds  
)
Low Power  
L
64 x 9 SyncFIFO  
72421  
72201  
72211  
72221  
72231  
72241  
72251  
256 x 9 SyncFIFO  
512 x 9 SyncFIFO  
1,024 x 9 SyncFIFO  
2,048 x 9 SyncFIFO  
4,096 x 9 SyncFIFO  
8,192 x 9 SyncFIFO  
2655 drw18  
NOTES:  
1. Industrial temperature range product for the 15ns and 25ns speed grades are available as standard product.  
2. Green parts are available. For specific speeds and packages contact your sales office.  
DATASHEETDOCUMENTHISTORY  
10/03/2000  
05/01/2001  
02/08/2006  
10/22/2008  
pgs. 2, 3, 4 and 14.  
pgs. 1, 2, 3, 4 and 14.  
pgs. 1 and 14.  
pg. 14.  
CORPORATE HEADQUARTERS  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
for SALES:  
for Tech Support:  
408-360-1753  
email:FIFOhelp@idt.com  
800-345-7015 or 408-284-8200  
fax: 408-284-2775  
www.idt.com  
14  

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SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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VISHAY