72401L35DBG [IDT]

FIFO, 64X4, 20ns, Asynchronous, CMOS, CDIP16, 0.300 INCH, CERDIP-16;
72401L35DBG
型号: 72401L35DBG
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

FIFO, 64X4, 20ns, Asynchronous, CMOS, CDIP16, 0.300 INCH, CERDIP-16

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IDT72401  
IDT72403  
CMOSPARALLELFIFO  
64 x 4 and 64 x 5  
hasanOutputEnable(OE)pin.TheFlFOsaccept4-bit dataatthedatainput  
(D0-D3). The storeddata stackupona first-in/first-outbasis.  
AShiftOut(SO)signalcausesthedataatthenexttolastwordtobeshifted  
totheoutputwhileallotherdatashiftsdownonelocationinthestack.TheInput  
Ready(IR)signalacts like a flagtoindicate whenthe inputis readyfornew  
data(IR=HIGH)or tosignalwhentheFIFOisfull(IR=LOW). TheIRsignal  
canalsobeusedtocascademultipledevicestogether.TheOutputReady(OR)  
signalis a flagtoindicate thatthe outputremains validdata (OR=HIGH)or  
toindicate thatthe FIFOis empty(OR=LOW).The ORcanalsobe usedto  
cascademultipledevicestogether.  
FEATURES:  
First-ln/First-Out Dual-Port memory  
64 x 4 organization (IDT72401/72403)  
RAM-based FIFO with low falI-through time  
Low-power consumption  
Active: 175mW (typ.)  
Maximum shift rate — 45MHz  
High data output drive capability  
Asynchronous and simultaneous read and write  
Fully expandable by bit width  
WidthexpansionisaccomplishedbylogicallyANDingtheIRandORsignals  
toformcompositesignals.  
Fully expandable by word depth  
IDT72403 have Output Enable pin to enable output data  
High-speed data communications applications  
High-performance CMOS technology  
Available in CERDIP, plastic DIP and SOIC  
Military product compliant to MlL-STD-883, Class B  
Standard Military Drawing #5962-86846 and  
5962-89523 is listed on this function.  
Industrial temperature range (–40°C to +85°C) is available  
(plastic packages only)  
Depthexpansionisaccomplishedbytyingthedatainputsofonedeviceto  
thedataoutputs oftheprevious device.TheIRpinofthereceivingdeviceis  
connectedtotheSOpinofthesendingdeviceandtheORpinofthesending  
device is connectedtothe ShiftIn(SI)pinofthe receivingdevice.  
Readingandwritingoperationsarecompletelyasynchronousallowingthe  
FIFOtobe usedas a bufferbetweentwodigitalmachines ofwidelyvarying  
operatingfrequencies.The45MHzspeedmakestheseFlFOsidealforhigh-  
speed communicationandcontrollerapplications.  
Militarygradeproductismanufacturedincompliancewiththelatestrevision  
of MIL-STD-883, Class B.  
DESCRIPTION:  
The IDT72401 and IDT72403 are asynchronous high-performance  
First-ln/First-Outmemoriesorganized64wordsby4bits. TheIDT72403 also  
FUNCTIONALBLOCKDIAGRAM  
INPUT  
CONTROL  
LOGIC  
WRITE POINTER  
SI  
IR  
OUTPUT  
ENABLE  
OE  
WRITE MULTIPLEXER  
(IDT72403 only)  
MEMORY  
ARRAY  
D0-3  
DATA IN  
DATA IN  
Q0-3  
MASTER  
RESET  
READ MULTIPLEXER  
READ POINTER  
SO  
OR  
MR  
MASTER  
RESET  
2747 drw01  
IDTandtheIDTlogoaretrademarksofIntegratedDeviceTechnology,Inc.  
FASTisatrademarkofNationalSemiconductor,Inc.  
MILITARY AND COMMERCIAL TEMPERATURE RANGES  
OCTOBER 2005  
1
© 2005 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.  
DSC-2747/10  
IDT72401/72403  
CMOS PARALLEL FIFO 64 x 4, 64 x 5  
MILITARY AND COMMERCIAL  
TEMPERATURE RANGES  
PINCONFIGURATIONS  
IDT72401/IDT72403  
NC/OE(1)  
1
2
3
4
5
6
7
8
16  
Vcc  
15 SO  
IR  
SI  
D0  
D1  
D2  
OR  
Q0  
Q1  
Q2  
Q3  
MR  
14  
13  
12  
11  
10  
9
D3  
GND  
2747 drw 02  
PLASTIC DIP (P16-1, ORDER CODE: P)  
CERDIP (D16-1, ORDER CODE: D)  
SOIC (SO16-1, ORDER CODE: SO)  
TOP VIEW  
NOTE:  
1. Pin 1: NC - No Connection IDT72401, OE - IDT72403  
RECOMMENDEDOPERATING  
CONDITIONS  
ABSOLUTEMAXIMUMRATINGS(1)  
Symbol  
Parameter  
Min. Typ. Max. Unit  
Symbol  
Rating  
Commercial  
Military  
Unit  
VCC  
Supply Voltage Commercial/Military 4.5  
5.0  
0
5.5  
0
V
V
V
V
VTERM  
TerminalVoltagewith  
Respect to GND  
–0.5 to +7.0  
–0.5 to +7.0  
V
GND SupplyVoltage  
0
VIH  
InputHighVoltage  
InputHighVoltage  
2.0  
0.8  
TSTG  
IOUT  
StorageTemp.  
–55 to +125  
–50 to +50  
–65 to +150  
–50 to +50  
° C  
(1)  
VIL  
DCOutputCurrent  
mA  
TA  
TA  
OperatingTemperatureCommercial  
OperatingTemperatureMilitary  
0
70 ° C  
125 ° C  
NOTE:  
–55  
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may  
cause permanent damage to the device. This is a stress rating only and functional  
operation of the device at these or any other conditions above those indicated in the  
operational sections of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect reliability.  
NOTE:  
1. 1.5V undershoots are allowed for 10ns once per cycle.  
DCELECTRICALCHARACTERISTICS  
(Commercial: VCC = 5.0V ± 10%, TA = 0°C to +70°C; Military: VCC = 5.0V  
± 10%, TA = –55°C to +125°C)  
IDT72401  
IDT72403  
IDT72401  
IDT72403(5)  
Commercial  
Military  
fIN = 45, 35, 25, 15, 10 MHz  
fIN = 35, 25, 15, 10 MHz  
Symbol  
IIL  
Parameter  
Low-LevelInputCurrent  
Test Conditions  
VCC = Max., GND VI VCC  
VCC= Max., GND VI VCC  
VCC= Min., IOL = 8mA  
Min.  
–10  
Max.  
Min.  
–10  
Max.  
Unit  
µ A  
µA  
V
IIH  
High-LevelInputCurrent  
Low-LevelOutputVoltage  
High-LevelOutputVoltage  
OutputShort-CircuitCurrent  
HIGHImpedance OutputCurrent  
LOWImpedanceOutputCurrent  
Active Supply Current  
10  
10  
VOL  
VOH  
IOS(1)  
0.4  
0.4  
VCC= Min., IOH = –4mA  
VCC= Max., VO = GND  
VCC= Max., VO = 2.4V  
VCC= Max., VO = 0.4V  
VCC= Max., f = 10MHz  
2.4  
–20  
2.4  
–20  
V
–110  
20  
–110  
20  
mA  
µ A  
µ A  
mA  
(2)  
IHZ  
(2)  
ILZ  
–20  
–20  
(3,4)  
ICC  
35  
45  
NOTES:  
1. Not more than one output should be shorted at a time and duration of the short-circuit should not exceed one second. Guaranteed but not tested.  
2. IDT72403 only.  
3. Tested with outputs open (IOUT = 0). OE is HIGH for IDT72403.  
4. For frequencies greater than 10MHz, ICC = 35mA + (1.5mA x [f –10MHz]) commercial, and ICC = 45mA + (1.5mA x [f –10MHz]) military.  
5. Military availability for IDT72403 is 10MHz, 35MHz. IDT72401 is available for all MHz.  
2
IDT72401/72403  
CMOS PARALLEL FIFO 64 x 4, 64 x 5  
MILITARY AND COMMERCIAL  
TEMPERATURE RANGES  
OPERATINGCONDITIONS  
(Commercial: VCC = 5.0V ± 10%, TA = 0°C to +70°C; Military: VCC = 5.0V ± 10%, TA = –55°C to +125°C)  
Commercial  
Commercial and Military(5)  
IDT72401L45  
IDT72403L45  
IDT72401L35  
IDT72403L35  
IDT72401L25  
IDT72403L25  
IDT72401L15  
IDT72403L15  
IDT72401L10  
IDT72403L10  
Symbol  
Parameter  
Shift in HIGH Time  
Figure Min.  
Max.  
Min.  
9
Max.  
Min.  
11  
24  
0
Max.  
Min.  
11  
25  
0
Max.  
Min.  
11  
30  
0
Max. Unit  
(1)  
tSIH  
2
2
2
2
5
5
8
8
4
4
7
9
11  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tSIL  
tIDS  
tIDH  
Shift in LOW TIme  
17  
0
InputDataSet-up  
InputDataHoldTime  
Shift Out HIGH Time  
ShiftOutLOWTime  
MasterResetPulse  
Master Reset Pulse to SI  
Data Set-uptoIR  
13  
9
15  
9
20  
11  
24  
25  
10  
5
30  
11  
25  
25  
25  
5
40  
11  
25  
30  
35  
5
(1)  
tSOH  
tSOL  
tMRW  
tMRS  
tSIR  
11  
20  
10  
3
17  
25  
10  
3
tHIR  
tSOR(4)  
Data Hold from IR  
13  
0
15  
0
20  
0
30  
0
30  
0
Data Set-up to OR HIGH  
ACELECTRICALCHARACTERISTICS  
(Commercial: VCC = 5.0V ± 10%, TA = 0°C to +70°C; Military: VCC = 5.0V ± 10%, TA = –55°C to +125°C)  
Commercial  
Commercial and Military(5)  
IDT72401L45  
IDT72403L45  
IDT72401L35  
IDT72403L35  
IDT72401L25  
IDT72403L25  
IDT72401L15  
IDT72403L15  
IDT72401L10  
IDT72403L10  
Symbol  
Parameter  
Figure Min.  
Max.  
45  
18  
18  
45  
18  
19  
19  
30  
25  
25  
Min.  
5
Max.  
35  
18  
20  
35  
18  
20  
20  
34  
28  
28  
Min.  
5
Max.  
25  
21  
28  
25  
19  
34  
34  
40  
35  
35  
Min.  
5
Max.  
15  
35  
40  
15  
35  
40  
40  
65  
35  
35  
Min.  
5
Max. Unit  
fIN  
ShiftInRate  
2
2
5
10  
40  
45  
10  
40  
55  
55  
65  
40  
40  
40  
35  
30  
MHz  
ns  
(1)  
tIRL  
Shift In to Input Ready LOW  
Shift In to Input Ready HIGH  
ShiftOutRate  
(1)  
tIRH  
2
ns  
fOUT  
5
MHz  
ns  
(1)  
tORL  
ShiftOuttoOutputReadyLOW  
Shift Out to Output Ready HIGH  
OutputDataHold(PreviousWord)  
OutputDataShift(NextWord)  
DataThroughputor"Fall-Through"  
Master Reset to OR LOW  
5
(1)  
tORH  
5
ns  
tODH  
5
ns  
tODS  
5
9
ns  
tPT  
4, 7  
8
ns  
tMRORL  
tMRIRH  
tMRQ  
ns  
Master Reset to IR HIGH  
8
ns  
MasterResettoDataOutputLOW  
8
20  
12  
12  
9
20  
15  
12  
11  
11  
25  
20  
15  
11  
11  
35  
30  
25  
11  
11  
ns  
tOOE(3)  
Output Valid from OE LOW  
9
ns  
tHZOE(3,4) Output High-Z from OE HIGH  
9
ns  
(2,4)  
tIPH  
Input Ready Pulse HIGH  
Output Ready Pulse HIGH  
4
ns  
(2,4)  
tOPH  
7
9
9
ns  
NOTES:  
1. Since the FIFO is a very high-speed device, care must be excercised in the design of the hardware and timing utilized within the design. Device grounding and decoupling  
are crucial to correct operation as the FIFO will respond to very small glitches due to long reflective lines, high capacitances and/or poor supply decoupling and grounding.  
A monolithic ceramic capacitor of 0.1µF directly between VCC and GND with very short lead length is recommended.  
2. This parameter applies to FIFOs communicating with each other in a cascaded mode. IDT FIFOs are guaranteed to cascade with other IDT FIFOs of like speed grades.  
3. IDT72403 only.  
4. Guaranteed by design but not currently tested.  
5. Military availability for IDT72403 is 10MHz, 35MHz. IDT72401 is available for all MHz.  
3
IDT72401/72403  
CMOS PARALLEL FIFO 64 x 4, 64 x 5  
MILITARY AND COMMERCIAL  
TEMPERATURE RANGES  
ALLINPUTPULSES:  
ACTESTCONDITIONS  
InputPulseLevels  
GND to 3.0V  
3ns  
3.0V  
90%  
90%  
10%  
InputRise/FallTimes  
InputTimingReferenceLevels  
OutputReferenceLevels  
OutputLoad  
10%  
1.5V  
GND  
1.5V  
<3ns  
<3ns  
2747 drw 04  
SeeFigure1  
5V  
1.1KΩ  
CAPACITANCE  
OUTPUT  
30pF*  
(TA = +25°C, f = 1.0MHz)  
560Ω  
Symbol  
CIN  
Parameter  
Conditions  
VIN = 0V  
Max.  
5
Unit  
pF  
InputCapacitance  
OutputCapacitance  
2747 drw 05  
COUT  
VOUT = 0V  
7
pF  
NOTE:  
1. Characterized values, not currently tested.  
orequivalentcircuit  
Figure 1. AC Test Load  
*Includingscopeandjig  
INPUT READY (IR)  
SIGNALDESCRIPTIONS  
WhenInputReadyisHIGH,theFIFOisreadyfornewinputdatatobewritten  
toit.WhenIRisLOWtheFIFOisunavailablefornewinputdata. IRisalsoused  
to cascade many FlFOs together, as shown in Figures 10 and 11.  
INPUTS:  
DATA INPUT (D0-3)  
Data input lines. The IDT72401 and IDT72403 have a 4-bit data input.  
OUTPUTREADY(OR)  
WhenOutputReadyisHIGH,theoutput(Q0-3)containsvaliddata. When  
OR is LOW, the FIFO is unavailable for new output data. OR is also used to  
cascade many FlFOs together, as shown in Figures 10 and 11.  
CONTROLS:  
SHIFT IN (SI)  
ShiftIncontrolstheinputofthedataintotheFIFO. WhenSIisHIGH,data  
can be written to the FIFO via the D0-3 lines.  
OUTPUT ENABLE (OE) (IDT72403 ONLY)  
Output enable is used to read FIFO data onto a bus. OE is active LOW.  
SHIFT OUT (SO)  
ShiftOutcontrolstheoutputofdataoftheFIFO. WhenSOisHIGH,datacan  
be read from the FIFO via the Data Output (Q0-3) lines.  
OUTPUTS:  
DATAOUTPUT(Q0-3)  
DataOutputlines.TheIDT72401andIDT72403havea4-bitdataoutput.  
MASTER RESET (MR)  
MasterResetclearstheFIFOofanydatastoredwithin. Uponpowerup,the  
FIFO should be cleared with a MR. MR is active LOW.  
4
IDT72401/72403  
CMOS PARALLEL FIFO 64 x 4, 64 x 5  
MILITARY AND COMMERCIAL  
TEMPERATURE RANGES  
DATAOUTPUT  
FUNCTIONALDESCRIPTION  
DataisshiftedoutontheHlGH-to-LOWtransitionofShiftOut(SO). Thiscauses  
the internal read pointer to be advanced to the next word location. If data is  
present,validdatawillappearontheoutputsandOutputReady(OR)will go  
HIGH. Ifdataisnotpresent,ORwillstayLOWindicatingtheFIFOisempty. The  
lastvalidwordreadfromtheFIFOwillremainattheFlFOsoutputwhenitisempty.  
WhentheFIFOisnotempty,ORgoesLOWontheLOW-to-HIGHtransitionof  
SO. PreviousdataremainsontheoutputuntiltheHIGH-to-LOWtransitionof  
SO).  
The 64x4FIFOisdesigned usinga dual port RAMarchitecture asopposed  
to the traditional shift register approach. This FIFO architecture has a write  
pointer, a readpointerandcontrollogic, whichallowsimultaneous readand  
writeoperations. ThewritepointerisincrementedbythefallingedgeoftheShift  
In(Sl)control;thereadpointerisincrementedbythefallingedgeoftheShiftOut  
(SO).TheInputReady(IR)signalswhentheFIFOhasanavailablememory  
location; Output Ready (OR) signals when there is valid data on the output.  
OutputEnable(OE)providesthecapabilityofthree-statingtheFIFOoutputs.  
FALL THROUGH MODE  
TheFIFOoperatesinafall-throughmodewhendatagetsshiftedintoanempty  
FIFO. Afterafall-throughdelaythedatapropagatestotheoutput. Whenthe  
datareachestheoutput,theOutputReady(OR)goesHIGH. Fall-throughmode  
alsooccurswhentheFIFOiscompletelyfull. Whendataisshiftedoutofthefull  
FIFO,alocationisavailablefornewdata. Afterafall-throughdelay,theInput  
Ready (IR) goes HIGH. If Shift In (SI) is HIGH, the new data can be written  
totheFIFO.  
SincetheseFlFOsarebasedonaninternaldual-portRAMarchitecturewith  
separatereadandwritepointers,thefall-throughtime(tPT)isonecyclelong.  
AwordmaybewrittenintotheFIFOonaclockcycleandcanbeaccessedon  
thenextclockcycle.  
FIFO RESET  
TheFIFOmustberesetuponpowerupusingtheMasterReset(MR)signal.  
ThiscausestheFlFOtoenteranemptystate,signifiedbyOutputReady(OR)  
beingLOWandInputReady(IR)beingHIGH. Inthis state,thedataoutputs  
(Q0-3) will be LOW.  
DATAINPUT  
DataisshiftedinontheLOW-to-HlGHtransitionofShiftIn(Sl).Thisloads  
inputdataintothefirstwordlocationoftheFIFOandcausesInputReady(IR)  
togoLOW.OntheHlGH-to-LOWtransitionofSI,thewritepointerismovedto  
thenextwordpositionandIRgoesHIGH,indicatingthereadinesstoacceptnew  
data. Ifthe FIFOis full, IRwillremainLOWuntila wordofdata is shiftedout.  
1/fIN  
1/fIN  
tSIH  
tSIL  
SI  
IR  
tIRH  
tIDS  
tIRL  
tIDH  
INPUT DATA  
2747 drw 06  
Figure 2. Input Timing  
SI(7)  
(2)  
(4)  
(1)  
(5)  
(3)  
IR  
(6)  
INPUT DATA  
STABLE DATA  
2747 drw 07  
NOTES:  
1. IR HIGH indicates space is available and a SI pulse may be applied.  
2. Input Data is loaded into the first word.  
3. IR goes LOW indicating the first word is full.  
4. The write pointer is incremented.  
5. The FIFO is ready for the next word.  
6. If the FIFO is full then the IR remains LOW.  
7. SI pulses applied while IR is LOW will be ignored (see Figure 4).  
Figure 3. The Mechanism of Shifting Data Into the FIFO  
5
IDT72401/72403  
CMOS PARALLEL FIFO 64 x 4, 64 x 5  
MILITARY AND COMMERCIAL  
TEMPERATURE RANGES  
(2)  
SO  
(3)  
(5)  
SI  
tIPH  
tPT  
(4)  
(1)  
IR  
tSIR  
tHIR  
INPUT DATA  
STABLE DATA  
2747 drw 08  
NOTES:  
1. FIFO is initially full.  
2. SO pulse is applied.  
3. SI is held HIGH.  
4. As soon as IR becomes HIGH the Input Data is loaded into the FIFO.  
5. The write pointer is incremented. SI should not go LOW until (tPT + tIPH).  
Figure 4. Data is Shifted In Whenever Shift In and Input Ready are Both HIGH  
1/fOUT  
1/fOUT  
tSOH  
tSOL  
(2)  
SO  
OR  
tORH  
tORL  
tODS  
tODH  
(1)  
A-DATA  
B-DATA  
C-DATA  
OUTPUT DATA  
2747 drw 09  
NOTES:  
1. This data is loaded consecutively A, B, C.  
2. Data is shifted out when SO makes a HIGH to LOW transition.  
Figure 5. Output TIming  
SO(7)  
(2)  
(4)  
(1)  
(5)  
(3)  
OR  
(6)  
A or B  
OUTPUT DATA  
A- DATA  
B- DATA  
2747 drw 10  
NOTES:  
1. OR HIGH indicates that data is available and a SO pulse may be applied.  
2. SO goes HIGH causing the next step.  
3. OR goes LOW.  
4. The read pointer is incremented.  
5. OR goes HIGH indicating that new data (B) is now available at the FIFO outputs.  
6. If the FIFO has only one word loaded (A DATA) then OR stays LOW and the A DATA remains unchanged at the outputs.  
7. SO pulses applied when OR is LOW will be ignored.  
Figure 6. The Mechanism of Shifting Data Out of the FIFO  
6
IDT72401/72403  
CMOS PARALLEL FIFO 64 x 4, 64 x 5  
MILITARY AND COMMERCIAL  
TEMPERATURE RANGES  
SI  
SO  
tOPH  
tPT  
(1)  
OR  
tSOR  
DATA VALID  
DATA OUTPUT  
2747 drw 11  
NOTE:  
1. FIFO initially empty.  
Figure 7. tPT and tOPH Specification  
tMRW  
MR  
IR  
t
MRIRH  
(1)  
(1)  
t
MRORL  
OR  
SI  
tMRS  
tMRQ  
DATA OUTPUT  
NOTE:  
2747 drw 12  
1. Worst case, FIFO initially full.  
Figure 8. Master Reset Timing  
OE  
HZOE  
t
tOOE  
DATA OUT  
2747 drw 13  
NOTE:  
1. High-Z transitions are referenced to the steady-state VOH –500mV and VOL +500mV levels on the output. tHZOE is tested with 5pF load capacitance instead of 30pF as  
shown in Figure 1.  
Figure 9. Output Enable Timing, IDT72403 Only  
OR  
SO  
OUTPUT READY  
SHIFT OUT  
SHIFT IN  
INPUT READY  
SI  
IR  
SI  
IR  
OR  
SO  
0
Q
1
Q
2
Q
D0  
D1  
D2  
D3  
Q0  
Q1  
Q2  
Q3  
0
D
D
D
D
1
2
3
DATA OUT  
DATA IN  
3
Q
MR  
MR  
2747 drw 14  
MR  
NOTE:  
1. FIFOs can be easily cascaded to any desired path. The handshaking and associated timing between the FIFOs are handled by the inherent timing of the devices.  
Figure 10. 128 x 4 Depth Expansion  
7
IDT72401/72403  
CMOS PARALLEL FIFO 64 x 4, 64 x 5  
MILITARY AND COMMERCIAL  
TEMPERATURE RANGES  
SHIFT OUT  
IR  
SI  
D0  
SO  
OR  
Q0  
IR  
SI  
SO  
OR  
IR  
SI  
D0  
SO  
OR  
Q0  
D
0
Q
0
D1  
Q1  
D1  
Q1  
D1  
Q1  
D2  
Q2  
D2  
Q2  
D2  
Q2  
D
3
Q
3
D
3
Q
3
D
3
Q3  
MR  
MR  
MR  
MR  
MR  
MR  
MR  
MR  
MR  
IR  
SI  
D0  
D1  
D2  
SO  
OR  
Q0  
Q1  
Q2  
IR  
SI  
D0  
D1  
D2  
SO  
OR  
Q0  
Q1  
Q2  
IR  
SI  
D0  
D1  
D2  
SO  
OR  
Q0  
Q1  
Q2  
Q3  
COMPOSITE  
INPUT  
COMPOSITE  
OUTPUT  
READY  
READY  
D3  
Q3  
D3  
Q3  
D3  
IR  
SI  
D0  
D1  
D2  
SO  
OR  
Q0  
Q1  
Q2  
IR  
SI  
D0  
D1  
D2  
SO  
OR  
Q0  
Q1  
Q2  
IR  
SI  
D0  
D1  
D2  
SO  
OR  
Q0  
Q1  
Q2  
SHIFT IN  
D3  
Q3  
D3  
Q3  
D3  
Q3  
MR  
2747 drw 15  
NOTES:  
1. When the memory is empty, the last word will remain on the outputs until the MR is strobed or a new data word falls through to the output. However, OR will remain LOW,  
indicating data at the output is not valid.  
2. When the output data changes as a result of a pulse on SO, the OR signal always goes LOW before there is any change in output data and stays LOW until the new data  
has appeared on the outputs. Anytime OR is HIGH, there is valid stable data on the outputs.  
3. If SO is held HIGH while the memory is empty and a word is written into the input, that word will appear at the output after a fall-through time. OR will go HIGH for one  
internal cycle (at least tORL) and then go back LOW again. The stored word will remain on the outputs. If more words are written into the FIFO, they will line up behind the  
first word and will not appear on the outputs until SO has been brought LOW.  
4. When the MR is brought LOW, the outputs are cleared to LOW, IR goes HIGH and OR goes LOW. If SI is HIGH when the MR goes HIGH, the data on the inputs will be  
written into the memory and IR will return to the LOW state until SI is brought LOW. If SI is LOW when the MR is ended, IR will go HIGH, but the data in the inputs will not  
enter the memory until SI goes HIGH.  
5. FIFOs are expandable on depth and width. However, in forming wider words, two external gates are required to generate composite Input and OR flags. This is due to the  
variation of delays of the FIFOs.  
Figure 11. 192 x 12 Depth and Width Expansion  
8
ORDERINGINFORMATION  
IDT XXXXX  
X
X
X
X
Device Type Power Speed Package  
Process/  
Temperature  
Range  
Blank  
B
Commercial (0°C to+70°C)  
Military (-55°C to+125°C)  
Compliant to MIL-STD-883, Class B  
Plastic DIP  
CERDIP  
Small Outline IC  
P
300 mil, P16-1  
300 mil, D16-1  
SOIC, SO16-1  
D
SO  
Commercial Only  
45  
35  
25  
15  
10  
Commercial and Military  
Commercial and Military>72401 only  
Commercial and Military>72401 only  
Commercial and Military  
Shift Frequency (fs)  
Speed in MHz  
L
Low Power  
72401 64 x 4 FIFO  
72403 64 x 4 FIFO  
NOTE:  
1. Industrial temperature range is available by special order.  
2747 drw 16  
DATASHEETDOCUMENTHISTORY  
07/10/2003 pgs. 2, 3, and 9.  
10/27/2005 pgs. 1- 9.  
CORPORATE HEADQUARTERS  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
for SALES:  
for Tech Support:  
408-360-1753  
email:FIFOhelp@idt.com  
800-345-7015 or 408-284-8200  
fax: 408-284-2775  
www.idt.com  
9

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