7283L20PA8 [IDT]

TSSOP-56, Reel;
7283L20PA8
型号: 7283L20PA8
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

TSSOP-56, Reel

文件: 总12页 (文件大小:153K)
中文:  中文翻译
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IDT7280  
IDT7281  
IDT7282  
IDT7283  
IDT7284  
IDT7285  
CMOS DUAL ASYNCHRONOUS FIFO  
DUAL 256 x 9, DUAL 512 x 9,  
DUAL 1,024 x 9, DUAL 2,048 x 9,  
DUAL 4,096 x 9, DUAL 8,192 x 9  
FEATURES:  
DESCRIPTION:  
The IDT7280 is equivalent to two IDT7200 256 x 9 FIFOs  
The IDT7281 is equivalent to two IDT7201 512 x 9 FIFOs  
The IDT7282 is equivalent to two IDT7202 1,024 x 9 FIFOs  
The IDT7283 is equivalent to two IDT7203 2,048 x 9 FIFOs  
The IDT7284 is equivalent to two IDT7204 4,096 x 9 FIFOs  
The IDT7285 is equivalent to two IDT7205 8,192 x 9 FIFOs  
Low power consumption  
The IDT7280/7281/7282/7283/7284/7285 are dual-FIFO memories that  
loadandemptydataonafirst-in/first-outbasis.Thesedevicesarefunctional  
andcompatibletotwoIDT7200/7201/7202/7203/7204/7205FIFOsinasingle  
packagewithallassociatedcontrol,data,andflaglinesassignedtoseparate  
pins. The devices use Full and Empty flags to prevent data overflow and  
underflowandexpansionlogictoallowforunlimitedexpansioncapabilityinboth  
word size and depth.  
Active: 685 mW (max.)  
— Power-down: 83 mW (max.)  
Ultra high speed12 ns access time  
Asynchronous and simultaneous read and write  
Offers optimal combination of data capacity, small foot print  
and functional flexibility  
Ideal for bi-directional, width expansion, depth expansion,  
bus-matching, and data sorting applications  
Status Flags: Empty, Half-Full, Full  
Thereadsandwritesareinternallysequentialthroughtheuseofringpointers,  
withnoaddressinformationrequiredtoloadandunloaddata.Dataistoggled  
inandoutofthedevices throughtheuseoftheWrite(W)andRead(R)pins.  
Thedevicesutilizea9-bitwidedataarraytoallowforcontrolandparitybits  
attheusersoption.Thisfeatureis especiallyusefulindatacommunications  
applicationswhereitisnecessarytouseaparitybitfortransmission/reception  
errorchecking.ItalsofeaturesaRetransmit(RT)capabilitythatallowsforreset  
of the read pointer to its initial position when RT is pulsed LOW to allow for  
retransmissionfromthebeginningofdata.AHalf-FullFlagisavailableinthe  
singledevicemodeandwidthexpansionmodes.  
Auto-retransmit capability  
High-performance CMOS technology  
Space-saving TSSOP  
These FIFOs are fabricated using IDTs high-speed CMOS technology.  
Theyaredesignedforthoseapplicationsrequiringasynchronousandsimul-  
taneousread/writesinmultiprocessingandratebufferapplications.  
Industrial temperature range (–40  
Green parts available, see ordering information  
°C to +85°C) is available  
FUNCTIONAL BLOCK DIAGRAM  
DATA INPUTS  
DATA INPUTS  
(DA0-DA8)  
(DB0-DB8)  
RSA  
RSB  
WB  
WRITE  
CONTROL  
WRITE  
CONTROL  
RAM  
RAM  
WA  
ARRAY A  
256 x 9  
ARRAY B  
256 x 9  
512 x 9  
512 x 9  
1,024 x 9  
2,048 x 9  
4,096 x 9  
8,192 x 9  
1,024 x 9  
2,048 x 9  
4,096 x 9  
8,192 x 9  
WRITE  
POINTER  
WRITE  
POINTER  
READ  
POINTER  
READ  
POINTER  
THREE-  
STATE  
BUFFERS  
THREE-  
STATE  
BUFFERS  
READ  
CONTROL  
READ  
CONTROL  
RA  
RESET  
LOGIC  
RESET  
LOGIC  
FLAG  
LOGIC  
FLAG  
LOGIC  
EXPANSION  
LOGIC  
EXPANSION  
LOGIC  
XIA  
FFA EFA  
RB  
XIB  
XOA/HFA  
FLA/RTA  
FFB EFB  
FLB/RTB  
DATA  
OUTPUTS  
(QA0-QA8)  
XOB/HFB  
DATA  
OUTPUTS  
(QB0-QB8)  
3208 drw 01  
IDTandtheIDTlogoaretrademarksofIntegratedDeviceTechnology,Inc  
COMMERCIALANDINDUSTRIALTEMPERATURERANGES  
JULY 2006  
1
2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.  
DSC-3208/7  
IDT7280/7281/7282/7283/7284/72855VASYNCHRONOUSFIFO  
DUAL 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALTEMPERATURERANGE  
PINCONFIGURATION  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Rating  
Com'l & Ind'l  
Unit  
1
FFA  
QA  
QA  
QA  
QA  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
XIA  
DA  
DA  
DA  
VTERM  
TerminalVoltagewith  
Respect to GND  
StorageTemperature  
DCOutputCurrent  
–0.5 to +7.0  
V
2
0
1
2
3
0
1
2
3
TSTG  
IOUT  
–55to+125  
–50to+50  
°C  
mA  
4
5
DA3  
6
QA8  
DA8  
NOTE:  
7
WA  
GND  
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause  
permanent damage to the device. This is a stress rating only and functional operation  
of the device at these or any other conditions above those indicated in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect reliability.  
8
RA  
VCC  
9
QA  
4
DA  
DA  
DA  
DA  
4
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
QA  
QA  
QA  
5
5
6
7
6
7
XOA/HFA  
EFA  
FLA/RTA  
RSA  
RECOMMENDEDDCOPERATING  
CONDITIONS  
FFB  
XIB  
QB  
0
DB0  
QB  
QB  
QB  
1
DB  
DB  
DB  
DB  
WB  
1
Symbol  
VCC  
Parameter  
Min.  
4.5  
0
Typ.  
5.0  
0
Max. Unit  
2
3
2
3
SupplyVoltage  
5.5  
0
V
V
QB  
8
8
GND  
SupplyVoltage  
GND  
(1)  
RB  
VCC  
VIH  
InputHighVoltage  
InputLowVoltage  
2.0  
0
0.8  
70  
V
QB  
4
DB  
DB  
DB  
DB  
4
(2)  
VIL  
V
QB  
QB  
QB  
5
5
6
7
6
7
TA  
OperatingTemperature  
Commercial  
°C  
XOB/HFB  
FLB/RTB  
RSB  
EFB  
TA  
OperatingTemperature  
Industrial  
–40  
85  
°C  
3208 drw 02  
NOTES:  
TSSOP (SO56-2, order code: PA)  
TOP VIEW  
1. For RT/RS/XI input, VIH = 2.6V (commercial).  
2. 1.5V undershoots are allowed for 10ns once per cycle.  
DCELECTRICALCHARACTERISTICS  
(Commercial: VCC = 5V ± 10%, TA = 0°C to +70°C; Industrial: VCC = 5V ± 10%, TA = –40°C to +85°C)  
IDT7280L  
IDT7281L  
IDT7282L  
IDT7283L  
IDT7284L  
IDT7285lL  
Commercial & Industrial(1)  
tA = 12, 15 ns  
Commercial & Industrial(1)  
tA = 12, 15 ns  
Symbol  
Parameter  
InputLeakageCurrent(AnyInput)  
OutputLeakageCurrent  
Min.  
–1  
Max.  
1
Min.  
–1  
Max.  
Unit  
(2)  
ILI  
µA  
µA  
V
(3)  
ILO  
–10  
2.4  
10  
–10  
2.4  
10  
VOH  
VOL  
OutputLogic1Voltage  
OutputLogic0Voltage  
IOH = –2mA  
IOL = 8mA  
0.4  
0.4  
150  
15  
V
(4,5)  
(6)  
ICC1  
Active Power Supply Current (both FIFOs)  
125  
mA  
mA  
(4,7)  
ICC2  
Standby Current (R=W=RS=FL/RT=VIH)  
15  
NOTES:  
1. Industrial temperature range product for the 15ns speed grade is available as a standard  
ACTESTCONDITIONS  
InputPulseLevels  
InputRise/FallTimes  
InputTimingReferenceLevels  
OutputReferenceLevels  
OutputLoad  
device.  
GND to 3.0V  
5ns  
1.5V  
1.5V  
See Figure 1  
2. Measurements with 0.4 VIN VCC.  
3. R VIH, 0.4 VOUT VCC.  
4. Tested with outputs open (IOUT = 0).  
5. Tested at f = 20 MHz.  
6. Typical ICC1 = 2*[15 + 2*fS + 0.02*CL*fS] (in mA) with VCC = 5V, TA = 25oC, fS = WCLK  
frequency = RCLK frequency (in MHz, using TTL levels), data switching at fS/2,  
CL = capacitive load (in pF).  
7. All Inputs = VCC - 0.2V or GND + 0.2V.  
5V  
1.1K  
TO  
OUTPUT  
PIN  
CAPACITANCE(TA = +25oC, f = 1.0 MHz)  
30pF*  
Symbol  
CIN  
Parameter  
Condition  
VIN = 0V  
Max.  
Unit  
pF  
680  
InputCapacitance  
OutputCapacitance  
8
8
3208 drw 03  
COUT  
VOUT = 0V  
pF  
or equivalent circuit  
NOTE:  
1. Characterized values, not currently tested.  
Figure 1. Output Load  
* Includes scope and jig capacitances.  
2
JULY 17, 2006  
IDT7280/7281/7282/7283/7284/72855VASYNCHRONOUSFIFO  
DUAL 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALTEMPERATURERANGE  
ACELECTRICALCHARACTERISTICS(1)  
(Commercial: VCC = 5V ± 10%, TA = 0°C to +70°C; Industrial: VCC = 5V ± 10%, TA = –40°C to +85°C)  
Commercial  
Commercial & Industrial(2)  
IDT7280L12  
IDT7281L12  
IDT7282L12  
IDT7283L12  
IDT7284L12  
IDT7285L12  
IDT7280L15  
IDT7281L15  
IDT7282L15  
IDT7283L15  
IDT7284L15  
IDT7285L15  
Symbol  
tS  
Parameter  
Min.  
20  
8
Max.  
Min.  
25  
10  
15  
3
Max.  
Unit  
MHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ShiftFrequency  
ReadCycleTime  
AccessTime  
50  
12  
12  
12  
17  
20  
12  
14  
12  
14  
17  
17  
12  
12  
40  
15  
15  
25  
25  
25  
15  
15  
15  
15  
25  
25  
15  
15  
tRC  
tA  
tRR  
ReadRecoveryTime  
ReadPulseWidth(3)  
tRPW  
tRLZ  
tWLZ  
tDV  
12  
3
(4)  
ReadPulseLowtoDataBusatLowZ  
(4,5)  
WritePulseHightoDataBusatLowZ  
DataValidfromReadPulseHigh  
5
5
5
5
(4)  
tRHZ  
tWC  
ReadPulseHightoDataBusatHighZ  
20  
12  
8
25  
15  
10  
11  
0
WriteCycleTime  
tWPW  
tWR  
WritePulseWidth(3)  
WriteRecoveryTime  
DataSet-upTime  
tDS  
9
tDH  
DataHoldTime  
0
tRSC  
tRS  
ResetCycleTime  
20  
12  
12  
8
25  
15  
15  
10  
25  
15  
15  
10  
15  
15  
15  
10  
10  
(3)  
ResetPulseWidth  
tRSS  
tRSR  
tRTC  
tRT  
ResetSet-upTime(4)  
ResetRecoveryTime  
RetransmitCycleTime  
20  
12  
12  
8
(3)  
RetransmitPulseWidth  
tRTS  
tRTR  
tEFL  
RetransmitSet-upTime(4)  
RetransmitRecoveryTime  
ResettoEmptyFlagLow  
12  
12  
12  
8
tHFH,FFH ResettoHalf-FullandFullFlagHigh  
tRTF  
tREF  
tRFF  
tRPE  
tWEF  
tWFF  
tWHF  
tRHF  
tWPF  
tXOL  
tXOH  
tXI  
RetransmitLowtoFlagsValid  
Read Low to Empty Flag Low  
ReadHightoFullFlagHigh  
ReadPulseWidthafterEFHigh  
WriteHightoEmptyFlagHigh  
WriteLowtoFullFlagLow  
WriteLowtoHalf-FullFlagLow  
ReadHightoHalf-FullFlagHigh  
WritePulseWidthafterFFHigh  
Read/WritetoXOLow  
Read/WritetoXOHigh  
XIPulseWidth(3)  
tXIR  
XI Recovery Time  
tXIS  
XISet-upTime  
8
NOTES:  
1. Timings referenced as in AC Test Conditions.  
2. Industrial temperature range product for the 15ns speed grade is available as a standard device.  
3. Pulse widths less than minimum value are not allowed.  
4. Values guaranteed by design, not currently tested.  
5. Only applies to read data flow-through mode.  
3
JULY 17, 2006  
IDT7280/7281/7282/7283/7284/72855VASYNCHRONOUSFIFO  
DUAL 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALTEMPERATURERANGE  
DeviceMode,thispinactsastheretransmitinput.TheSingleDeviceModeis  
initiated by grounding the Expansion In (XI).  
SIGNALDESCRIPTIONS  
INPUTS:  
ThesedevicescanbemadetoretransmitdatawhentheRetransmitEnable  
control(RT)inputispulsedLOW. Aretransmitoperationwillsettheinternalread  
pointertothefirstlocationandwillnotaffectthewritepointer.ReadEnable(R)  
andWriteEnable(W)mustbeintheHIGHstateduringretransmit.Thisfeature  
is useful when less than 256/512/1,024/2,048/4,096/8,192 writes are per-  
formedbetweenresets.TheretransmitfeatureisnotcompatiblewiththeDepth  
Expansion Mode and will affect the Half-Full Flag (HF), depending on the  
relativelocationsofthereadandwritepointers.  
DATA IN (D0 D8)  
Data inputs for 9-bit wide data.  
CONTROLS:  
RESET (RS)  
ResetisaccomplishedwhenevertheReset(RS)inputistakentoaLOWstate.  
Duringreset,bothinternalreadandwritepointersaresettothefirstlocation.  
Aresetisrequiredafterpowerupbeforeawriteoperationcantakeplace.Both  
the Read Enable (R) and Write Enable (W) inputs must be in the HIGH  
state during the window shown in Figure 2, (i.e., tRSS before the rising  
edge of RS) and should not change until tRSR after the rising edge of  
RS. Half-Full Flag (HF) will be reset to HIGH after Reset (RS).  
EXPANSION IN (XI)  
Thisinputisadual-purposepin. ExpansionIn(XI)isgroundedtoindicate  
an operation in the single device mode. Expansion In (XI) is connected to  
ExpansionOut(XO)oftheprevious deviceintheDepthExpansionorDaisy  
Chain Mode.  
WRITE ENABLE (W)  
OUTPUTS:  
AwritecycleisinitiatedonthefallingedgeofthisinputiftheFullFlag(FF)  
isnotset.Dataset-upandholdtimesmustbeadheredtowithrespecttotherising  
edgeoftheWriteEnable(W).DataisstoredintheRAMarraysequentiallyand  
independently of any on-going read operation.  
After half of the memory is filled and at the falling edge of the next write  
operation,theHalf-FullFlag(HF)willbesettoLOWandwillremainsetuntilthe  
differencebetweenthewritepointerandreadpointeris less thanorequalto  
onehalfofthetotalmemoryofthedevice.TheHalf-FullFlag(HF)isthenreset  
by the rising edge of the read operation.  
Topreventdataoverflow,theFullFlag(FF)willgoLOW,inhibitingfurther  
writeoperations.Uponthecompletionofavalidreadoperation,theFullFlag  
(FF)willgoHIGHaftertRFF,allowingavalidwritetobegin.WhentheFIFOis  
full,theinternalwritepointerisblockedfromW,soexternalchangesinWwill  
notaffecttheFIFOwhenitisfull.  
FULL FLAG (FF)  
TheFullFlag(FF)willgoLOW,inhibitingfurtherwriteoperation,whenthe  
write pointer is one location less than the read pointer, indicating that the  
deviceisfull.IfthereadpointerisnotmovedafterReset(RS),theFull-Flag(FF)  
willgoLOWafter256writes forIDT7280,512writes fortheIDT7281, 1,024  
writes for the IDT7282, 2,048 writes for the IDT7283, 4,096 writes for the  
IDT7284 and 8,192 writes for the IDT7285.  
EMPTY FLAG (EF)  
TheEmptyFlag(EF)willgoLOW,inhibitingfurtherreadoperations,when  
the read pointer is equal to the write pointer, indicating that the device is  
empty.  
EXPANSION OUT/HALF-FULL FLAG (XO/HF)  
This is a dual-purpose output. In the single device mode, when Expan-  
sionIn(XI)isgrounded,thisoutputactsasanindicationofahalf-fullmemory.  
After half of the memory is filled and at the falling edge of the next write  
operation,theHalf-FullFlag(HF)willbesetLOWandwillremainsetuntilthe  
difference between the write pointer and read pointer is less than or equal  
toonehalfofthetotalmemoryofthedevice.TheHalf-FullFlag(HF)isthenreset  
by using rising edge of the read operation.  
IntheDepthExpansionMode,ExpansionIn(XI)isconnectedtoExpansion  
Out(XO)ofthepreviousdevice.Thisoutputactsasasignaltothenextdevice  
intheDaisyChainbyprovidingapulsetothenextdevicewhentheprevious  
devicereachesthelastlocationofmemory.  
READ ENABLE (R)  
AreadcycleisinitiatedonthefallingedgeoftheReadEnable(R)provided  
theEmptyFlag(EF)isnotset.ThedataisaccessedonaFirst-In/First-Outbasis,  
independent of any ongoing write operations. After Read Enable (R) goes  
HIGH,theDataOutputs(Q0Q8)willreturntoahighimpedanceconditionuntil  
thenextReadoperation.WhenalldatahasbeenreadfromtheFIFO,theEmpty  
Flag (EF) will go LOW, allowing the final” read cycle but inhibiting further read  
operations with the data outputs remaining in a high impedance state. Once a  
validwriteoperationhasbeenaccomplished,theEmptyFlag(EF)willgoHIGH  
aftertWEFandavalidReadcanthenbegin.WhentheFIFOisempty,theinternal  
readpointeris blockedfrom Rsoexternalchanges inRwillnotaffectthe FIFO  
when it is empty.  
DATA OUTPUTS (Q0 – Q8)  
Data outputs for 9-bit wide data. This data is in a high impedance  
condition whenever Read (R) is in a HIGH state.  
FIRST LOAD/RETRANSMIT (FL/RT)  
This is a dual-purpose input. In the Depth Expansion Mode, this pin is  
groundedtoindicatethatitisthefirstloaded(seeOperatingModes). IntheSingle  
4
JULY 17, 2006  
IDT7280/7281/7282/7283/7284/72855VASYNCHRONOUSFIFO  
DUAL 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALTEMPERATURERANGE  
RSC  
t
RS  
t
RS  
RSS  
t
RSR  
t
W
RSS  
t
R
EFL  
t
EF  
HFH FFH  
t
, t  
HF, FF  
3208 drw 04  
NOTES:  
1. EF, FF, HF may change status during Reset, but flags will be valid at tRSC.  
2. W and R = VIH around the rising edge of RS.  
Figure 2. Reset  
t
RC  
t
RPW  
t
RR  
t
A
t
A
R
t
DV  
t
RHZ  
t
RLZ  
Q0-Q8  
DATA OUT VALID  
DATA OUT VALID  
t
WC  
t
WR  
t
WPW  
W
t
DS  
t
DH  
D0-D8  
DATA IN VALID  
DATA IN VALID  
3208 drw 05  
Figure 3. Asynchronous Write and Read Operation  
LAST WRITE  
IGNORED  
WRITE  
FIRST READ  
ADDITIONAL  
READS  
FIRST  
WRITE  
R
W
t
WFF  
RFF  
t
3208 drw 06  
FF  
Figure 4. Full Flag From Last Write to First Read  
5
JULY 17, 2006  
IDT7280/7281/7282/7283/7284/72855VASYNCHRONOUSFIFO  
DUAL 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALTEMPERATURERANGE  
LAST READ  
IGNORED  
READ  
FIRST WRITE  
ADDITIONAL  
WRITES  
FIRST  
READ  
W
R
EF  
WEF  
t
REF  
t
A
t
DATA OUT  
VALID  
VALID  
3208 drw 07  
Figure 5. Empty Flag From Last Read to First Write  
t
RTC  
t
RT  
RT  
W,R  
RTS  
t
RTR  
t
t
RTF  
HF, EF, FF  
FLAG VALID  
3208 drw 08  
Figure 6. Retransmit  
W
EF  
R
WEF  
t
RPE  
t
3208 drw 09  
Figure 7. Minimum Timing for an Empty Flag Coincident Read Pulse  
R
FF  
W
RFF  
t
WPF  
t
3208 drw 10  
Figure 8. Minimum Timing for a Full Flag Coincident Write Pulse  
6
JULY 17, 2006  
IDT7280/7281/7282/7283/7284/72855VASYNCHRONOUSFIFO  
DUAL 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALTEMPERATURERANGE  
W
R
RHF  
t
WHF  
t
HALF-FULL OR LESS  
3208 drw 11  
HALF-FULL OR LESS  
MORE THAN HALF-FULL  
HF  
Figure 9. Half-Full Flag Timing  
WRITE TO  
LAST PHYSICAL  
LOCATION  
READ FROM  
LAST PHYSICAL  
LOCATION  
W
R
XOL  
t
XOH  
t
XOH  
t
XOL  
t
3208 drw 12  
XO  
Figure 10. Expansion Out  
XI  
XIR  
t
t
XI  
XIS  
t
WRITE TO  
FIRST PHYSICAL  
LOCATION  
W
R
XIS  
t
READ FROM  
FIRST PHYSICAL  
LOCATION  
3208 drw 13  
Figure 11. Expansion In  
14 demonstrates a four-FIFO Depth Expansion using two IDT7280/7281/  
7282/7283/7284/7285s. Any depth can be attained by adding additional  
IDT7280/7281/7282/7283/7284/7285s.TheseFIFOsoperateintheDepth  
Expansionmodewhenthefollowingconditionsaremet:  
OPERATINGMODES:  
Care must be taken to assure that the appropriate flag is monitored by  
eachsystem(i.e.FFismonitoredonthedevicewhereWisused;EFismonitored  
on the device where Ris used).  
1. ThefirstFIFOmustbedesignatedbygroundingtheFirstLoad(FL)control  
input.  
2. AllotherFIFOs musthave FLinthe HIGHstate.  
3. TheExpansionOut(XO)pinofeachdevicemustbetiedtotheExpansion  
In (XI) pin of the next device. See Figure 14.  
4. ExternallogicisneededtogenerateacompositeFullFlag(FF)andEmpty  
Flag(EF).ThisrequirestheORingofallEFsandORingofallFFs(i.e.all  
mustbesettogeneratethecorrectcompositeFForEF).SeeFigure14.  
5. TheRetransmit(RT)functionandHalf-FullFlag(HF)arenotavailablein  
theDepthExpansionMode.  
SINGLE DEVICE MODE  
A single IDT7280/7281/7282/7283/7284/7285 may be used when the  
applicationrequirementsarefor256/512/1,024/2,048/4,096/8,192wordsor  
less. TheseFIFOsareinaSingleDeviceConfigurationwhentheExpansion  
In (XI) control input is grounded (see Figure 12).  
DEPTHEXPANSION  
These devices can easily be adapted to applications when the require-  
mentsareforgreaterthan256/512/1,024/2,048/4,096/8,192words. Figure  
7
JULY 17, 2006  
IDT7280/7281/7282/7283/7284/72855VASYNCHRONOUSFIFO  
DUAL 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALTEMPERATURERANGE  
theFIFOpermitsareadingofasinglewordafterwritingonewordofdatainto  
anemptyFIFO.Thedataisenabledonthebusin(tWEF+tA)nsaftertherising  
edgeofW,calledthefirstwriteedge,anditremainsonthe busuntiltheRline  
is raisedfromLOW-to-HIGH,afterwhichthebus wouldgointoathree-state  
mode after tRHZ ns. The EF line would have a pulse showing temporary  
deassertionandthenwouldbeasserted.  
In the write flow-through mode (Figure 18), the FIFO permits the writing  
of a single word of data immediately after reading one word of data from a  
fullFIFO.TheRlinecausestheFFtobedeassertedbuttheWlinebeingLOW  
causesittobeassertedagaininanticipationofanewdataword.Ontherising  
edgeofW,thenewwordisloadedintheFIFO.TheWlinemustbetoggledwhen  
FFisnotassertedtowritenewdataintheFIFOandtoincrementthewritepointer.  
USAGEMODES:  
WIDTH EXPANSION  
Wordwidthmaybeincreasedsimplybyconnectingthecorrespondinginput  
controlsignalsofmultipleFIFOs.Statusflags(EF,FFandHF)canbedetected  
fromanyoneFIFO. Figure13demonstratesan18-bitwordwidthbyusingthe  
twoFIFOscontainedintheIDT7280/7281/7282/7283/7284/7285s.Anyword  
width can be attained by adding FIFOs (Figure 13).  
BIDIRECTIONAL OPERATION  
Applications which require data buffering between two systems (each  
system capable of Read and Write operations) can be achieved by pairing  
IDT7280/7281/7282/7283/7384/7285s as shown in Figure 16. Both Depth  
ExpansionandWidthExpansionmaybeusedinthis mode.  
COMPOUNDEXPANSION  
Thetwoexpansiontechniquesdescribedabovecanbeappliedtogether  
in a straightforward manner to achieve large FIFO arrays (see Figure 15).  
DATAFLOW-THROUGH  
Two types of flow-through modes are permitted, a read flow-through  
and write flow-through mode. For the read flow-through mode (Figure 17),  
(HALF-FULL FLAG)  
WRITE (W)  
(HF)  
FIFO  
A or B  
IDT  
READ (R)  
9
9
DATA IN (D)  
FULL FLAG (FF)  
RESET (RS)  
DATA OUT (Q)  
7280  
7281  
7282  
7283  
7284  
7285  
EMPTY FLAG (EF)  
RETRANSMIT (RT)  
3208 drw 14  
EXPANSION IN (XI)  
Figure 12. Block Diagram of One 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 FIFO Used in Single Device Mode  
9
HFA  
HFB  
18  
9
IN  
DATA  
(D)  
FIFO A  
FIFO B  
WRITE (W)  
FULL FLAG (FFA)  
RESET (RS)  
READ (R)  
EMPTY FLAG (EFB)  
RETRANSMIT (RT)  
9
7280/7281/7282/  
7283/7284/7285  
9
XIA  
XIB  
18  
OUT  
(Q)  
DATA  
3208 drw 15  
Figure 13. Block Diagram of 256 x 18, 512 x 18, 1,024 x 18, 2,048 x 18, 4,096 x 18, 8,192 x 18 FIFO Memory Used in Width Expansion Mode  
8
JULY 17, 2006  
IDT7280/7281/7282/7283/7284/72855VASYNCHRONOUSFIFO  
DUAL 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALTEMPERATURERANGE  
TABLE 1 — RESET AND RETRANSMIT  
Single Device Configuration/Width Expansion Mode  
Inputs  
InternalStatus  
Write Pointer  
Outputs  
Mode  
RS  
RT  
XI  
Read Pointer  
EF  
FF  
HF  
Reset  
0
1
1
X
0
0
0
0
LocationZero  
LocationZero  
Increment(1)  
LocationZero  
Unchanged  
Increment(1)  
0
1
1
Retransmit  
Read/Write  
NOTE:  
X
X
X
X
X
X
1
1. Pointer will increment if flag is High.  
TABLE 2 — RESET AND FIRST LOAD TRUTH TABLE  
Depth Expansion/Compound Expansion Mode  
Inputs  
InternalStatus  
Write Pointer  
Outputs  
Mode  
RS  
FL  
XI  
Read Pointer  
EF  
FF  
ResetFirstDevice  
Reset All Other Devices  
Read/Write  
0
0
1
0
1
(1)  
(1)  
(1)  
LocationZero  
LocationZero  
X
LocationZero  
LocationZero  
X
0
0
1
1
X
X
X
NOTE:  
10  
1. XI is connected to XO of previous device. See Figure 14. RS = Reset Input, FL/RT = First Load/Retransmit, EF = Empty Flag Output, FF = Full Flag Output,  
XI = Expansion Input, HF = Half-Full Flag Output  
XOA  
EFA  
FFA  
FIFO A  
FLA  
XIA  
7280/7281/  
7282/7283/  
7284/7285  
XOB  
W
R
EFB  
FFB  
FIFO B  
D
Q
9
9
9
FLB  
VCC  
XIB  
XOA  
FFA  
EFA  
FULL  
EMPTY  
FIFO A  
9
FLA  
XIA  
7280/7281/  
7282/7283/  
7284/7285  
XOB  
EFB  
FFB  
FIFO B  
9
RSA  
FLB  
XIB  
3208 drw 16  
Figure 14. Block Diagram of 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9 FIFO Memory (Depth Expansion)  
9
JULY 17, 2006  
IDT7280/7281/7282/7283/7284/72855VASYNCHRONOUSFIFO  
DUAL 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALTEMPERATURERANGE  
Q
0
-Q  
8
Q
(N-8)-Q  
N
N
Q
9
-Q17  
Q9  
-Q17  
Q0  
-Q  
8
Q(N-8)-Q  
IDT7280/7281/  
7282/7283/  
7284/7285  
DEPTH  
EXPANSION  
BLOCK  
IDT7280/7281/  
7282/7283/  
7284/7285  
DEPTH  
EXPANSION  
BLOCK  
IDT7280/7281/  
7282/7283/  
7284/7285  
DEPTH  
EXPANSION  
BLOCK  
R, W, RS  
D0-D8  
D(N-8)-DN  
D9-D17  
D0-DN  
D18-D  
N
D(N-8)-DN  
D9-DN  
3208 drw 17  
NOTES:  
1. For depth expansion block see section on Depth Expansion and Figure 14.  
2. For Flag detection see section on Width Expansion and Figure 13.  
Figure 15. Compound FIFO Expansion  
WA  
FF  
DA0-8  
RA  
EF  
HF  
A
A
FIFO A  
A
QA0-8  
IDT  
7280  
7281  
7282  
7283  
7284  
7285  
SIDE 1  
SIDE 2  
QB0-8  
DB0-8  
FIFO B  
R
HF  
B
B
WB  
EF  
B
FFB  
3208 drw 18  
Figure 16. Bidirectional FIFO Mode  
10  
JULY 17, 2006  
IDT7280/7281/7282/7283/7284/72855VASYNCHRONOUSFIFO  
DUAL 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9  
COMMERCIALTEMPERATURERANGE  
IN  
DATA  
W
R
RPE  
t
EF  
REF  
WEF  
t
t
WLZ  
t
A
t
DATA OUT  
OUT  
DATA  
VALID  
3208 drw 19  
Figure 17. Read Data Flow-Through Mode  
R
W
WPF  
t
RFF  
t
FF  
DH  
t
WFF  
t
IN  
DATA  
VALID  
IN  
DATA  
A
t
DS  
t
OUT  
DATA  
OUT  
DATA  
VALID  
3208 drw 20  
Figure 18. Write Data Flow-Through Mode  
11  
JULY 17, 2006  
ORDERING INFORMATION  
IDT  
XXXX  
X
XXX  
X
X
X
Device Type Power Speed Package  
Process/  
Temperature  
Range  
Blank  
I(1)  
Commercial (0°C to +70°C)  
Industrial (-40°C to +85°C)  
G(2)  
PA  
Green  
Thin Shrink SOIC (TSSOP, SO56-2)  
Commercial Only  
Commercial and Industrial  
12  
15  
Access Time (t  
Speed in Nanoseconds  
A)  
L
Low Power  
7280  
7281  
7282  
7283  
7284  
7285  
256 x 9 CMOS Dual Asynchronous FIFO  
512 x 9 CMOS Dual Asynchronous FIFO  
1,024 x 9 CMOS Dual Asynchronous FIFO  
2,048 x 9 CMOS Dual Asynchronous FIFO  
4,096 x 9 CMOS Dual Asynchronous FIFO  
8,192 x 9 CMOS Dual Asynchronous FIFO  
3208 drw 21  
NOTES:  
1. Industrial temperature range product for the 15ns speed grade is available as a standard device.  
2. Green parts are available. For specific speeds contact your local sales office.  
DATASHEETDOCUMENTHISTORY  
07/13/2001  
07/17/2006  
pgs. 2, 3 and 12.  
pgs. 1 and 12.  
CORPORATE HEADQUARTERS  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
for SALES:  
for Tech Support:  
408-360-1753  
email:FIFOhelp@idt.com  
800-345-7015 or 408-284-8200  
fax: 408-284-2775  
www.idt.com  
12  

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