83948AYI-147LFT [IDT]

Low Skew, 1-to-1 Differential to-;
83948AYI-147LFT
型号: 83948AYI-147LFT
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Low Skew, 1-to-1 Differential to-

PC 驱动 逻辑集成电路
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Low Skew, 1-to-1 Differential-  
83948I-147  
Data Sheet  
to-LVCMOS/ LVTTL Fanout Buffer  
General Description  
Features  
The 83948I-147 is a low skew, 1-to-12 Differential-to-LVCMOS/LVT-  
TL Fanout Buffer. The 83948I-147 has two selectable clock inputs.  
The CLK, nCLK pair can accept most standard differential input lev-  
els. The LVCMOS_CLK can accept LVCMOS or LVTTL input levels.  
The low impedance LVCMOS/LVTTL outputs are designed to drive  
50series or parallel terminated transmission lines. The effective fa-  
nout can be increased from 12 to 24 by utilizing the ability of the out-  
puts to drive two series terminated lines.  
Twelve LVCMOS/LVTTL outputs  
Selectable differential CLK/nCLK or LVCMOS/LVTTL clock input  
CLK/nCLK pair can accept the following differential  
input levels: LVPECL, LVDS, LVHSTL, SSTL, HCSL  
LVCMOS_CLK supports the following input types:  
LVCMOS, LVTTL  
Output frequency: 350MHz  
The 83948I-147 is characterized at full 3.3V, full 2.5V or mixed 3.3V  
core/2.5V output operating supply modes. Guaranteed output and  
part-to-part skew characteristics make the 83948I-147 ideal for those  
clock distribution applications demanding well defined performance  
and repeatability.  
Additive phase jitter, RMS: 0.14ps (typical)  
Output skew: 100ps (maximum), 3.3V 5%  
Part-to-part skew: 1ns (maximum), 3.3V 5%  
Operating supply modes:  
Core/Output  
3.3V/3.3V  
3.3V/2.5V  
2.5V/2.5V  
-40°C to 85°C ambient operating temperature  
Lead-free (RoHS 6) packaging  
Block Diagram  
Pin Assignment  
CLK_EN  
D
Q
32 31 30 29 28 27 26 25  
1
2
3
4
5
6
7
8
CLK_SEL  
GND  
24  
23  
22  
21  
20  
LVCMOS_CLK  
1
Q0  
LVCMOS_CLK  
CLK  
Q4  
CLK  
nCLK  
0
VDDO  
Q5  
Q1  
nCLK  
CLK_SEL  
Q2  
CLK_EN  
GND  
Q3  
Q4  
Q5  
Q6  
Q7  
Q8  
Q9  
Q10  
Q11  
OE  
VDD  
Q6  
19  
18  
17  
VDDO  
Q7  
GND  
9
10 11 12 13 14 15 16  
83948I-147  
32-Lead LQFP  
7mm x 7mm x 1.4mm package body  
Y Package  
Top View  
OE  
©2016 Integrated Device Technology, Inc  
1
Revision D March 30, 2016  
83948I-147 Data Sheet  
Pin Descriptions and Characteristics  
Table 1. Pin Descriptions  
Number  
Name  
Type  
Description  
Clock select input. When HIGH, selects LVCMOS_CLK input.  
When LOW, selects CLK/nCLK inputs. LVCMOS / LVTTL interface levels.  
1
CLK_SEL  
Input  
Input  
Pullup  
Pullup  
LVCMOS_CL  
K
2
Single-ended clock input. LVCMOS/LVTTL interface levels.  
3
4
5
CLK  
nCLK  
Input  
Input  
Input  
Pullup  
Pulldown  
Pullup  
Non-inverting differential clock input.  
Inverting differential clock input.  
CLK_EN  
Clock enable pin. LVCMOS/LVTTL interface levels.  
Output enable pin. When LOW, outputs are in an High-impedance state.  
when HIGH, outputs are active. LVCMOS/LVTTL interface levels.  
6
7
OE  
VDD  
GND  
Input  
Power  
Power  
Pullup  
Power supply pin.  
8, 12, 16,  
20, 24, 28, 32  
Power supply ground.  
Q11, Q10,  
Q9, Q8, Q7,  
Q6,  
Q5, Q4, Q3,  
Q2, Q1, Q0  
9, 11, 13,  
15, 17, 19,  
21, 23, 25,  
27, 29, 31  
Output  
Single-ended clock outputs. LVCMOS/LVTTL interface levels.  
10, 14, 18,  
22, 26, 30  
VDDO  
Power  
Output supply pins.  
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.  
Table 2. Pin Characteristics  
Symbol  
CIN  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
pF  
Input Capacitance  
Input Pullup Resistor  
Input Pulldown Resistor  
4
RPULLUP  
RPULLDOWN  
51  
51  
k  
k  
Power Dissipation Capacitance  
(per output)  
CPD  
12  
7
pF  
ROUT  
Output Impedance  
5
12  
Function Tables  
Table 3A. Clock Select Function Table  
Control  
Input  
Clock  
0
1
CLK/nCLK inputs selected  
LVCMOS_CLK input selected  
©2016 Integrated Device Technology, Inc  
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Revision D March 30, 2016  
83948I-147 Data Sheet  
Table 3B. Clock Input Function Table  
Inputs  
Outputs  
Q[0:11]  
LOW  
CLK_SEL  
LVCMOS_CLK  
CLK  
nCLK  
Input to Output Mode  
Polarity  
0
0
0
0
0
0
1
1
0
1
0
1
Differential to Single-Ended  
Differential to Single-Ended  
Non-Inverting  
Non-Inverting  
1
0
HIGH  
LOW  
0
Biased; NOTE 1  
Single-Ended to Single-Ended  
Single-Ended to Single-Ended  
Single-Ended to Single-Ended  
Single-Ended to Single-Ended  
Single-Ended to Single-Ended  
Single-Ended to Single-Ended  
Non-Inverting  
Non-Inverting  
Inverting  
1
Biased; NOTE 1  
HIGH  
HIGH  
LOW  
Biased; NOTE 1  
0
1
Biased; NOTE 1  
Inverting  
LOW  
Non-Inverting  
Non-Inverting  
HIGH  
NOTE 1: Please refer to the Application Information Section, Wiring the Differential Input to Accept Single-ended Levels.  
Absolute Maximum Ratings  
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress  
specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC  
Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.  
Item  
Rating  
Supply Voltage, VDD  
Inputs, VI  
4.6V  
-0.5V to VDD + 0.5V  
-0.5V to VDDO + 0.5V  
73.6C/W (0 mps)  
-65C to 150C  
Outputs, VO  
Package Thermal Impedance, JA  
Storage Temperature, TSTG  
DC Electrical Characteristics  
Table 4A. Power Supply DC Characteristics, V = V  
= 3.3V 5%, T = -40°C to 85°C  
A
DD  
DDO  
Symbol  
VDD  
Parameter  
Test Conditions  
Minimum  
3.135  
Typical  
3.3  
Maximum  
3.465  
3.465  
55  
Units  
V
Power Supply Voltage  
Output Supply Voltage  
Power Supply Current  
VDDO  
IDD  
3.135  
3.3  
V
mA  
Table 4B. Power Supply DC Characteristics, V = V  
= 2.5V 5%, T = -40°C to 85°C  
A
DD  
DDO  
Symbol  
VDD  
Parameter  
Test Conditions  
Minimum  
2.375  
Typical  
2.5  
Maximum  
2.625  
2.625  
52  
Units  
V
Positive Supply Voltage  
Output Supply Voltage  
Power Supply Current  
VDDO  
IDD  
2.375  
2.5  
V
mA  
©2016 Integrated Device Technology, Inc  
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Revision D March 30, 2016  
83948I-147 Data Sheet  
Table 4C. Power Supply DC Characteristics, V = 3.3V 5%, V  
= 2.5V 5%, T = -40°C to 85°C  
A
DD  
DDO  
Symbol  
VDD  
Parameter  
Test Conditions  
Minimum  
3.135  
Typical  
3.3  
Maximum  
3.465  
2.625  
55  
Units  
V
Power Supply Voltage  
Output Supply Voltage  
Power Supply Current  
VDDO  
IDD  
2.375  
2.5  
V
mA  
Table 4D. DC Characteristics, TA = -40°C to 85°C  
Symbol Parameter  
Test Conditions  
DD = 3.465V  
VDD = 2.625V  
Minimum  
Typical  
Maximum  
VDD + 0.3  
VDD + 0.3  
0.8  
Units  
V
LVCMOS  
V
2
VIH  
Input High Voltage  
LVCMOS  
LVCMOS  
LVCMOS  
1.7  
-0.3  
-0.3  
V
V
V
DD = 3.465V  
DD = 2.625V  
V
VIL  
IIN  
Input Low Voltage  
Input Current  
0.7  
V
VIN = VDD or VIN = 3.465V or 2.625V  
300  
µA  
V
DDO = 3.3V 5%  
IOH = -24mA  
2.4  
1.8  
V
V
V
V
V
V
VOH  
Output High Voltage; NOTE 1  
VDDO = 2.5V 5%  
IOH = -15mA  
VDDO = 3.3V 5%  
IOL = 24mA  
0.55  
0.30  
0.6  
VDDO = 3.3V 5%  
IOL = 12mA  
VOL  
Output Low Voltage; NOTE 1  
Peak-to-Peak Input  
VDDO = 2.5V 5%  
IOL = 15mA  
VPP  
CLK/nCLK  
VDD = 3.465V or 2.625V  
VDD = 3.465V or 2.625V  
0.15  
1.3  
Voltage; NOTE 2  
Common Mode  
Input Voltage;  
NOTE 2, 3  
CLK/nCLK  
VCMR  
GND + 0.5  
VDD – 0.85  
V
NOTE 1: Outputs capable of driving 50transmission lines terminated with 50to VDDO/2. See Parameter Measurement section, Output  
Load AC Test Circuit diagrams.  
NOTE 2: VIL should not be less than -0.3V.  
NOTE 3: Common mode voltage is defined as VIH.  
©2016 Integrated Device Technology, Inc  
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Revision D March 30, 2016  
83948I-147 Data Sheet  
AC Electrical Characteristics  
Table 5A. AC Characteristics, V = V  
= 3.3V 5%, T = -40°C to 85°C  
DD  
DDO  
A
Parameter Symbol  
Test Conditions  
Minimum  
Typical  
Maximum Units  
fMAX  
Output Frequency  
350  
4
MHz  
ns  
CLK/nCLK; NOTE 1  
ƒ 350MHz  
ƒ 350MHz  
2
2
Propagation  
Delay  
tPD  
LVCMOS_CLK;  
NOTE 2  
4
ns  
155.52MHz,  
Integration Range:  
12kHz – 20MHz  
Buffer Additive Phase Jitter, RMS; refer  
to Additive Phase Jitter Section  
tjit  
0.14  
1
ps  
Measured on the Rising Edge  
@ VDDO/2  
tsk(o)  
Output Skew; NOTE 3, 7  
100  
1
ps  
ns  
Measured on the Rising Edge  
@ VDDO/2  
tsk(pp)  
Part-to-Part Skew; NOTE 4, 7  
tR / tF  
odc  
Output Rise/Fall Time  
0.8V to 2V  
0.2  
45  
1.0  
55  
5
ns  
%
Output Duty Cycle  
ƒ 150MHz, Ref = CLK/nCLK  
50  
tPZL, PZH  
t
Output Enable Time; NOTE 5  
Output Disable Time; NOTE 5  
ns  
ns  
ns  
tPLZ, PHZ  
t
5
CLK_EN to CLK/nCLK  
1
0
0
1
Clock Enable  
Setup Time;  
NOTE 6  
tS  
CLK_EN to  
LVCMOS_CLK  
ns  
ns  
ns  
CLK/nCLK to CLK_EN  
Clock Enable  
Hold Time;  
NOTE 6  
tH  
LVCMOS_CLK to  
CLK_EN  
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is  
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium  
has been reached under these conditions.  
NOTE 1: Measured from the differential input crossing point to VDDO/2 of the output.  
NOTE 2: Measured from VDD/2 of the input to VDDO/2 of the output.  
NOTE 3: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
NOTE 4: Defined as skew between outputs on different devices operating at the same supply voltage and with equal load conditions. Using  
the same type of input on each device, the output is measured at VDDO/2.  
NOTE 5: These parameters are guaranteed by characterization. Not tested in production.  
NOTE 6: Setup and Hold times are relative to the rising edge of the input clock.  
NOTE 7: This parameter is defined in accordance with JEDEC Standard 65.  
©2016 Integrated Device Technology, Inc  
5
Revision D March 30, 2016  
83948I-147 Data Sheet  
Table 5B. AC Characteristics, V = V  
= 2.5V 5%, T = -40°C to 85°C  
DD  
DDO  
A
Parameter Symbol  
Test Conditions  
Minimum  
Typical  
Maximum Units  
fMAX  
Output Frequency  
350  
4.2  
MHz  
ns  
CLK/nCLK; NOTE 1  
ƒ 350MHz  
ƒ 350MHz  
1.5  
1.7  
Propagation  
Delay  
tPD  
LVCMOS_CLK;  
NOTE 2  
4.4  
ns  
155.52MHz,  
Integration Range:  
12kHz – 20MHz  
Buffer Additive Phase Jitter, RMS; refer  
to Additive Phase Jitter Section  
tjit  
0.14  
1
ps  
Measured on the Rising Edge  
@ VDDO/2  
tsk(o)  
Output Skew; NOTE 3, 7  
160  
2
ps  
ns  
Measured on the Rising Edge  
@ VDDO/2  
tsk(pp)  
Part-to-Part Skew; NOTE 4, 7  
tR / tF  
odc  
Output Rise/Fall Time  
0.6V to 1.8V  
0.1  
40  
1.0  
60  
5
ns  
%
Output Duty Cycle  
ƒ 150MHz, Ref = CLK/nCLK  
tPZL, PZH  
t
Output Enable Time; NOTE 5  
Output Disable Time; NOTE 5  
ns  
ns  
ns  
tPLZ, PHZ  
t
5
CLK_EN to CLK/nCLK  
1
0
0
1
Clock Enable  
Setup Time;  
NOTE 6  
tS  
CLK_EN to  
LVCMOS_CLK  
ns  
ns  
ns  
CLK/nCLK to CLK_EN  
Clock Enable  
Hold Time;  
NOTE 6  
tH  
LVCMOS_CLK to  
CLK_EN  
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is  
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium  
has been reached under these conditions.  
NOTE 1: Measured from the differential input crossing point to VDDO/2 of the output.  
NOTE 2: Measured from VDD/2 of the input to VDDO/2 of the output.  
NOTE 3: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
NOTE 4: Defined as skew between outputs on different devices operating at the same supply voltage and with equal load conditions. Using  
the same type of input on each device, the output is measured at VDDO/2.  
NOTE 5: These parameters are guaranteed by characterization. Not tested in production.  
NOTE 6: Setup and Hold times are relative to the rising edge of the input clock.  
NOTE 7: This parameter is defined in accordance with JEDEC Standard 65.  
©2016 Integrated Device Technology, Inc  
6
Revision D March 30, 2016  
83948I-147 Data Sheet  
Table 5C. AC Characteristics, V = 3.3V 5%, V  
= 2.5V 5%, T = -40°C to 85°C  
A
DD  
DDO  
Parameter Symbol  
Test Conditions  
Minimum  
Typical  
Maximum Units  
fMAX  
Output Frequency  
350  
4
MHz  
ns  
CLK/nCLK; NOTE 1  
ƒ 350MHz  
ƒ 350MHz  
2
2
Propagation  
Delay  
tPD  
LVCMOS_CLK;  
NOTE 2  
4
ns  
155.52MHz,  
Integration Range:  
12kHz – 20MHz  
Buffer Additive Phase Jitter, RMS; refer  
to Additive Phase Jitter Section  
tjit  
0.14  
1
ps  
Measured on the Rising Edge  
@ VDDO/2  
tsk(o)  
Output Skew; NOTE 3, 7  
100  
1
ps  
ns  
Measured on the Rising Edge  
@ VDDO/2  
tsk(pp)  
Part-to-Part Skew; NOTE 4, 7  
tR / tF  
odc  
Output Rise/Fall Time  
0.8V to 2V  
0.1  
45  
1.0  
55  
5
ns  
%
Output Duty Cycle  
ƒ 200MHz, Ref = CLK/nCLK  
tPZL, PZH  
t
Output Enable Time; NOTE 5  
Output Disable Time; NOTE 5  
ns  
ns  
ns  
tPLZ, PHZ  
t
5
CLK_EN to CLK/nCLK  
1
0
0
1
Clock Enable  
Setup Time;  
NOTE 6  
tS  
CLK_EN to  
LVCMOS_CLK  
ns  
ns  
ns  
CLK/nCLK to CLK_EN  
Clock Enable  
Hold Time;  
NOTE 6  
tH  
LVCMOS_CLK to  
CLK_EN  
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is  
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium  
has been reached under these conditions.  
NOTE 1: Measured from the differential input crossing point to VDDO/2 of the output.  
NOTE 2: Measured from VDD/2 of the input to VDDO/2 of the output.  
NOTE 3: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
NOTE 4: Defined as skew between outputs on different devices operating at the same supply voltage and with equal load conditions. Using  
the same type of input on each device, the output is measured at VDDO/2.  
NOTE 5: These parameters are guaranteed by characterization. Not tested in production.  
NOTE 6: Setup and Hold times are relative to the rising edge of the input clock.  
NOTE 7: This parameter is defined in accordance with JEDEC Standard 65.  
©2016 Integrated Device Technology, Inc  
7
Revision D March 30, 2016  
83948I-147 Data Sheet  
Additive Phase Jitter  
The spectral purity in a band at a specific offset from the  
fundamental. When the required offset is specified, the phase noise  
is called a dBc value, which simply means dBm at a specified offset  
from the fundamental. By investigating jitter in the frequency  
domain, we get a better understanding of its effects on the desired  
application over the entire time record of the signal. It is  
mathematically possible to calculate an expected bit error rate given  
a phase noise plot.  
fundamental compared to the power of the fundamental is called the  
dBc Phase Noise. This value is normally expressed using a Phase  
noise plot and is most often the specified plot in many applications.  
Phase noise is defined as the ratio of the noise power present in a  
1Hz band at a specified offset from the fundamental frequency to the  
power value of the fundamental. This ratio is expressed in decibels  
(dBm) or a ratio of the power in the 1Hz band to the power in the  
Additive Phase Jitter, RMS  
@ 155.52MHz (12kHz to 20MHz) =  
0.14ps (typical)  
Offset From Carrier Frequency (Hz)  
As with most timing specifications, phase noise measurements has  
issues relating to the limitations of the equipment. Often the noise  
floor of the equipment is higher than the noise floor of the device.  
This is illustrated above. The device meets the noise floor of what is  
shown, but can actually be lower. The phase noise is dependent on  
the input source and measurement equipment.  
©2016 Integrated Device Technology, Inc  
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Revision D March 30, 2016  
83948I-147 Data Sheet  
Parameter Measurement Information  
1.65V 5%  
1.25V 5%  
SCOPE  
SCOPE  
V
DD,  
V
V
DD,  
V
DDO  
DDO  
Qx  
Qx  
GND  
GND  
-1.65V 5%  
-1.25V 5%  
3.3V Core/3.3V LVCMOS Output Load AC Test Circuit  
2.5V Core/2.5V LVCMOS Output Load AC Test Circuit  
2.05V 5%  
1.25V 5%  
V
DD  
SCOPE  
V
DD  
nCLK  
CLK  
V
VPP  
VCMR  
DDO  
Cross Points  
Qx  
GND  
GND  
-1.25V 5%  
3.3V Core/2.5V LVCMOS Output Load AC Test Circuit  
Differential Input Level  
Part 1  
VDDO  
VDDO  
Qx  
Qy  
2
Qx  
Qy  
2
Part 2  
VDDO  
2
VDDO  
2
tsk(o)  
tsk(pp)  
Part-to-Part Skew  
Output Skew  
©2016 Integrated Device Technology, Inc  
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Revision D March 30, 2016  
83948I-147 Data Sheet  
Parameter Measurement Information, continued  
2V  
1.8V  
2V  
1.8V  
tR  
0.8V  
0.6V  
0.8V  
0.6V  
Q0:Q11  
Q0:Q11  
tR  
tF  
tF  
3.3V Output Rise/Fall Time  
2.5V Output Rise/Fall Time  
VDD  
2
CLK  
VDDO  
2
Q0:Q11  
nCLK  
CLK  
tPW  
tPERIOD  
tPW  
x 100%  
odc =  
VDDO  
2
tPERIOD  
Q0:Q11  
tPD  
Propagation Delay  
Output Duty Cycle/Pulse Width/Period  
©2016 Integrated Device Technology, Inc  
10  
Revision D March 30, 2016  
83948I-147 Data Sheet  
Application Information  
Wiring the Differential Input to Accept Single Ended Levels  
Figure 1 shows how the differential input can be wired to accept  
single ended levels. The reference voltage V_REF = VDD/2 is  
generated by the bias resistors R1, R2 and C1. This bias circuit  
should be located as close as possible to the input pin. The ratio of  
R1 and R2 might need to be adjusted to position the V_REF in the  
center of the input voltage swing. For example, if the input clock swing  
is only 2.5V and VDD = 3.3V, V_REF should be 1.25V and R2/R1 =  
VDD  
R1  
1K  
Single Ended Clock Input  
0.609.  
CLK  
V_REF  
nCLK  
C1  
0.1u  
R2  
1K  
Figure 1. Single-Ended Signal Driving Differential Input  
Recommendations for Unused Input and Output Pins  
Inputs:  
Outputs:  
CLK/nCLK Inputs  
LVCMOS Outputs  
For applications not requiring the use of the differential input, both  
CLK and nCLK can be left floating. Though not required, but for  
additional protection, a 1kresistor can be tied from CLK to ground.  
All unused LVCMOS output can be left floating. There should be no  
trace attached.  
CLK Input  
For applications not requiring the use of a clock input, it can be left  
floating. Though not required, but for additional protection, a 1k  
resistor can be tied from the CLK input to ground.  
LVCMOS Control Pins  
All control pins have internal pull-ups or pull-downs; additional  
resistance is not required but can be added for additional protection.  
A 1kresistor can be used.  
©2016 Integrated Device Technology, Inc  
11  
Revision D March 30, 2016  
83948I-147 Data Sheet  
Differential Clock Input Interface  
The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL and  
other differential signals. Both signals must meet the VPP and VCMR  
input requirements. Figures 2A to 2F show interface examples for the  
CLK/nCLK input driven by the most common driver types. The input  
interfaces suggested here are examples only. Please consult with the  
vendor of the driver component to confirm the driver termination  
requirements. For example, in Figure 2A, the input termination  
applies for IDT open emitter LVHSTL drivers. If you are using an  
LVHSTL driver from another vendor, use their termination  
recommendation.  
3.3V  
1.8V  
Zo = 50Ω  
CLK  
Zo = 50Ω  
nCLK  
Differential  
Input  
LVHSTL  
R1  
50Ω  
R2  
50Ω  
IDT  
LVHSTL Driver  
Figure 2A. CLK/nCLK Input Driven by an  
IDT Open Emitter LVHSTL Driver  
Figure 2B. CLK/nCLK Input Driven by a  
3.3V LVPECL Driver  
Figure 2C. CLK/nCLK Input Driven by a  
3.3V LVPECL Driver  
Figure 2D. CLK/nCLK Input Driven by a  
3.3V LVDS Driver  
2.5V  
3.3V  
3.3V  
3.3V  
2.5V  
R3  
R4  
120Ω  
120Ω  
*R3  
Zo = 60Ω  
Zo = 60Ω  
CLK  
CLK  
nCLK  
nCLK  
Differential  
Input  
Differential  
Input  
*R4  
SSTL  
HCSL  
R1  
R2  
120Ω  
120Ω  
Figure 2E. CLK/nCLK Input Driven by a  
3.3V HCSL Driver  
Figure 2F. CLK/nCLK Input Driven by a  
2.5V SSTL Driver  
©2016 Integrated Device Technology, Inc  
12  
Revision D March 30, 2016  
83948I-147 Data Sheet  
Reliability Information  
Table 6. vs. Air Flow Table for a 32-Lead LQFP  
JA  
JA vs. Air Flow  
Meters per Second  
0
1
2.5  
Multi-Layer PCB, JEDEC Standard Test Boards  
73.6°C/W  
63.9°C/W  
60.3°C/W  
Transistor Count  
The transistor count for 83948I-147 is: 1040  
Pin compatible with the MPC9448  
©2016 Integrated Device Technology, Inc  
13  
Revision D March 30, 2016  
83948I-147 Data Sheet  
Package Outline and Package Dimension  
Package Outline - Y Suffix for 32-Lead LQFP  
Table 7. Package Dimensions for 32-Lead LQFP  
JEDEC Variation: ABC - HD  
All Dimensions in Millimeters  
Symbol  
Minimum  
Nominal  
Maximum  
N
32  
A
1.60  
0.15  
1.45  
0.45  
0.20  
A1  
A2  
0.05  
1.35  
0.30  
0.09  
0.10  
1.40  
0.37  
b
c
D & E  
D1 & E1  
D2 & E2  
e
9.00 Basic  
7.00 Basic  
5.60 Ref.  
0.80 Basic  
0.60  
L
0.45  
0°  
0.75  
7°  
ccc  
0.10  
Reference Document: JEDEC Publication 95, MS-026  
©2016 Integrated Device Technology, Inc  
14  
Revision D March 30, 2016  
83948I-147 Data Sheet  
Ordering Information  
Table 8. Ordering Information  
Part/Order Number  
Marking  
Package  
Shipping Packaging  
Tray  
Temperature  
-40C to 85C  
-40C to 85C  
83948AYI-147LF  
83948AYI-147LFT  
ICS948AI147L  
ICS948AI147L  
“Lead-Free” 32-Lead LQFP  
“Lead-Free” 32-Lead LQFP  
Tape & Reel  
©2016 Integrated Device Technology, Inc  
15  
Revision D March 30, 2016  
83948I-147 Data Sheet  
Revision History Sheet  
Rev  
Table  
Page  
Description of Change  
Date  
1
2
Features Section - added Lead-Free bullet.  
Pin Characteristics Table - changed CIN from 4pF max. to 4pF typical; and  
T2  
added 5min. and 12max to ROUT  
Updated Single Ended Signal Driving Differential Input diagram.  
.
B
11/21/05  
7
Added Recommendations for Unused Input and Output Pins.  
T8  
10  
Ordering Information Table - added lead-free part number, marking, and note.  
1
5
6
Features Section - added Additive Phase Jitter bullet.  
3.3V AC Characteristics Table - added Additive Phase Jitter.  
3.3V AC Characteristics Table - added Additive Phase Jitter.  
Added Additive Phase Jitter section.  
T5A  
T5B  
C
D
7
1/15/08  
4/1/09  
11  
12  
Updated Differential Input Clock Interface section.  
Updated Reliability Information.  
Updated format throughout the datasheet.  
T6  
1
4
7
9
Features Section - added mix voltage to supply voltage bullet.  
Added Mix DC Characteristics Power Supply Table.  
Added Mix AC Characteristics Table.  
Parameter Measurement Information Section - added 3.3V/2.5V LVCMOS  
Output Load AC Test Circuit diagram.  
T4C  
T5C  
T8  
15  
Ordering Information Table - deleted ICS prefix from Part/Order Number  
column.  
D
D
T1  
T8  
T8  
2
Output supply pins, Changed VDD to VDDO  
11/1/12  
15  
15  
Removed leaded orderable parts from Ordering Information table  
11/14/12  
Fixed typo: removed extra “I” from orderable part number.  
Updated Headers and Footers.  
Updated Contact information.  
D
D
7/17/14  
3/30/16  
17  
Removed ICS from part number where needed.  
Updated data sheet header and footer.  
©2016 Integrated Device Technology, Inc  
16  
Revision D March 30, 2016  
83948I-147 Data Sheet  
Corporate Headquarters  
6024 Silver Creek Valley Road  
San Jose, CA 95138 USA  
www.IDT.com  
Sales  
Tech Support  
www.idt.com/go/support  
1-800-345-7015 or 408-284-8200  
Fax: 408-284-2775  
www.IDT.com/go/sales  
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance specifications  
and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein  
is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability,  
or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties.  
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably  
expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.  
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of  
IDT or their respective third party owners.  
For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary.  
Copyright ©2016 Integrated Device Technology, Inc. All rights reserved.  

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