840002AGI-01LFT [IDT]

FemtoClock, Crystal-to-LVCMOS/LVTTL Frequency Synthesizer;
840002AGI-01LFT
型号: 840002AGI-01LFT
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

FemtoClock, Crystal-to-LVCMOS/LVTTL Frequency Synthesizer

时钟 光电二极管 外围集成电路 晶体
文件: 总15页 (文件大小:279K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
FemtoClock®, Crystal-to-LVCMOS/LVTTL  
Frequency Synthesizer  
840002I-01  
DATA SHEET  
General Description  
Features  
The 840002I-01 is a two output LVCMOS/LVTTL Synthesizer  
optimized to generate Ethernet reference clock frequencies. Using a  
25MHz 18pF parallel resonant crystal, the following frequencies can  
be generated based on the two frequency select pins (F_SEL[1:0]):  
156.25MHz, 125MHz, and 62.5MHz. The 840002I-01 uses IDT’s 3RD  
generation low phase noise VCO technology and can achieve 1ps or  
lower typical random rms phase jitter, easily meeting Ethernet jitter  
requirements. The 840002I-01 is packaged in a small 16-pin TSSOP  
package.  
Two LVCMOS/LVTTL outputs@ 3.3V,  
17typical output impedance  
Selectable crystal oscillator interface or LVCMOS/LVTTL  
single-ended TEST_CLK  
Supports the following output frequencies: 156.25MHz, 125MHz  
and 62.5MHz  
Output frequency range: 56MHz to 175MHz  
VCO range: 560MHz to 700MHz  
Output skew: 12ps (maximum)  
RMS phase jitter at 156.25MHz, (1.875MHz to 20MHz):  
0.47ps (typical)  
Phase Noise:  
Offset  
Noise Power  
100Hz................ -97.4 dBc/Hz  
1kHz .................. -120.2 dBc/Hz  
10kHz ................ -127.6 dBc/Hz  
100kHz .............. -126.1 dBc/Hz  
Frequency Select Function Table  
Inputs  
Output  
M Divider N Divider  
Frequency  
(25MHz Ref.)  
Power Supply Modes:  
Core / Output  
3.3V / 3.3V  
F_SEL1  
F_SEL0  
Value  
Value  
0
0
1
1
0
1
0
1
25  
4
5
156.25  
125  
3.3V / 2.5V  
2.5V / 2.5V  
25  
-40°C to 85°C ambient operating temperature  
Available in lead-free (RoHS 6) package  
25  
10  
5
62.5  
125  
25  
Pin Assignment  
Block Diagram  
F_SEL1  
F_SEL0  
nXTAL_SEL  
TEST_CLK  
OE  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
Pullup  
OE  
GND  
GND  
Q0  
2
Pullup:Pullup  
F_SEL1:0  
Pulldown  
nPLL_SEL  
MR  
nPLL_SEL  
VDDA  
Q1  
VDDO  
10 XTAL_IN  
XTAL_OUT  
Pulldown  
nXTAL_SEL  
9
VDD  
XTAL_IN  
F_SEL1:0  
N
0
Q0  
Q1  
OSC  
840002I-01  
1
0
XTAL_OUT  
TEST_CLK  
0 0  
4
16-Lead TSSOP  
4.4mm x 5.0mm x 0.925mm  
package body  
0 1  
5
Phase  
Detector  
Pulldown  
1
VCO  
1 0 10  
1 1  
5
G Package  
Top View  
M = 25 (fixed)  
Pulldown  
MR  
840002I-01 Rev B 8/5/15  
1
©2015 Integrated Device Technology, Inc.  
840002I-01 DATA SHEET  
Table 1. Pin Descriptions  
Number  
Name  
Type  
Description  
1
F_SEL0  
Input  
Input  
Pullup  
Frequency select pin. LVCMOS/LVTTL interface levels.  
Selects between crystal or TEST_CLK inputs as the PLL reference  
source. When HIGH, selects TEST_CLK. When LOW, selects XTAL  
inputs. LVCMOS/LVTTL interface levels.  
2
nXTAL_SEL  
Pulldown  
3
4
TEST_CLK  
OE  
Input  
Input  
Pulldown  
Pullup  
Single-ended test clock input. LVCMOS/LVTTL interface levels.  
Output enable. When logic HIGH, the outputs are active. When LOW, the  
outputs are in high-impedance state. LVCMOS/LVTTL interface levels.  
Active High Master Reset. When logic HIGH, the internal dividers are  
reset causing the active outputs to go low. When Logic LOW, the internal  
dividers and the outputs are enabled. LVCMOS/LVTTL interface levels.  
5
6
MR  
Input  
Input  
Pulldown  
Pulldown  
PLL Bypass. When LOW, the output is driven from the VCO output. When  
HIGH, the PLL is bypassed and the output frequency = reference clock  
frequency/N output divider. LVCMOS/LVTTL interface levels.  
nPLL_SEL  
7
8
VDDA  
VDD  
Power  
Power  
Analog supply pin.  
Core supply pin.  
9,  
10  
XTAL_OUT  
XTAL_IN  
Crystal oscillator interface. XTAL_IN is the input, XTAL_OUT is the  
output.  
Input  
11  
VDDO  
Power  
Output  
Power  
Input  
Output supply pin.  
12, 13  
14, 15  
16  
Single-ended clock outputs. LVCMOS/LVTTL interface levels.  
Power supply ground.  
Q1, Q0  
GND  
F_SEL1  
Pullup  
Frequency select pin. LVCMOS/LVTTL interface levels.  
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.  
Table 2. Pin Characteristics  
Symbol  
CIN  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
pF  
Input Capacitance  
4
CPD  
Power Dissipation Capacitance  
Input Pullup Resistor  
8
pF  
RPULLUP  
51  
51  
17  
21  
k  
k  
RPULLDOWN Input Pulldown Resistor  
VDDO = 3.3V 5%  
VDDO = 2.5V 5%  
14  
16  
21  
25  
ROUT Output Impedance  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY  
SYNTHESIZER  
2
Rev B 8/5/15  
840002I-01 DATA SHEET  
Absolute Maximum Ratings  
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.  
These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond  
those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for  
extended periods may affect product reliability.  
Item  
Rating  
Supply Voltage, VDD  
4.6V  
Inputs, VI  
XTAL_IN  
0V to VDD  
Other Inputs  
-0.5V to VDD + 0.5V  
Outputs, VO  
-0.5V to VDDO + 0.5V  
89C/W (0 lfpm)  
-65C to 150C  
Package Thermal Impedance, JA  
Storage Temperature, TSTG  
DC Electrical Characteristics  
Table 3A. Power Supply DC Characteristics, VDD = VDDA = 3.3V 5%, VDDO = 3.3V 5% or 2.5V 5%, TA = -40°C to 85°C  
Symbol  
VDD  
Parameter  
Test Conditions  
Minimum  
3.135  
Typical  
3.3  
Maximum  
3.465  
3.465  
3.465  
2.625  
100  
Units  
V
Core Supply Voltage  
Analog Supply Voltage  
VDDA  
3.135  
3.3  
V
3.135  
3.3  
V
VDDO  
Output Supply Voltage  
2.375  
2.5  
V
IDD  
Power Supply Current  
Analog Supply Current  
Output Supply Current  
mA  
mA  
mA  
IDDA  
IDDO  
12  
5
Table 3B. Power Supply DC Characteristics, VDD = VDDA = VDDO = 2.5V 5%, TA = -40°C to 85°C  
Symbol  
VDD  
Parameter  
Test Conditions  
Minimum  
2.375  
Typical  
2.5  
Maximum  
2.625  
2.625  
2.625  
95  
Units  
V
Core Supply Voltage  
Analog Supply Voltage  
Output Supply Voltage  
Power Supply Current  
Analog Supply Current  
Output Supply Current  
VDDA  
VDDO  
IDD  
2.375  
2.5  
V
2.375  
2.5  
V
mA  
mA  
mA  
IDDA  
12  
IDDO  
5
Rev B 8/5/15  
3
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY  
SYNTHESIZER  
840002I-01 DATA SHEET  
Table 3C. LVCMOS/LVTTL DC Characteristics, VDD = VDDA = VDDO = 3.3V 5% or 2.5V 5%ꢀ or  
VDD = VDDA = 3.3V 5%, VDDO = 2.5V 5%, TA = -40°C to 85°C  
Symbol Parameter  
Test Conditions  
DD = 3.3V  
Minimum  
Typical  
Maximum  
VDD + 0.3  
VDD + 0.3  
0.8  
Units  
V
V
2
VIH  
VIL  
Input High Voltage  
VDD = 2.5V  
VDD = 3.3V  
1.7  
-0.3  
-0.3  
V
V
Input Low Voltage  
VDD = 2.5V  
0.7  
V
OE, F_SEL0, F_SEL1  
V
DD = VIN = 3.465V or 2.625V  
5
µA  
Input  
High Current  
IIH  
MR, TEST_CLK,  
nXTAL_SEL, nPLL_SEL  
VDD = VIN =3.465V or 2.625V  
150  
µA  
µA  
µA  
VDD = 3.465V or 2.625V,  
OE, F_SEL0, F_SEL1  
-150  
-5  
V
IN = 0V  
Input  
Low Current  
IIL  
MR, TEST_CLK,  
nXTAL_SEL, nPLL_SEL  
VDD = 3.465V or 2.625V,  
IN = 0V  
V
VDDO = 3.3V 5%  
VDDO = 2.5V 5%  
2.6  
1.8  
V
V
V
VOH  
VOL  
Output High Voltageꢀ NOTE 1  
Output Low Voltageꢀ NOTE 1  
VDDO = 3.3V 5% or 2.5V 5%  
0.5  
NOTE 1: Outputs terminated with 50to VDDO/2. See Parameter Measurement Information section, Output Load Test Circuit diagrams.  
Table 4. Crystal Characteristics  
Parameter  
Test Conditions  
Minimum  
Typical  
Fundamental  
25  
Maximum  
Units  
Mode of Oscillation  
Frequency  
MHz  
Equivalent Series Resistance (ESR)  
Shunt Capacitance (CO)  
50  
7
pF  
NOTE: Characterized using an 18pF parallel resonant crystal.  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY  
SYNTHESIZER  
4
Rev B 8/5/15  
840002I-01 DATA SHEET  
AC Electrical Characteristics  
Table 5A. AC Characteristics, VDD = VDDA = VDDO = 3.3V 5%, TA = -40°C to 85°C  
Symbol  
Parameter  
Test Conditions  
F_SEL[1:0] = 00  
Minimum  
140  
Typical  
Maximum  
175  
Units  
MHz  
MHz  
MHz  
ps  
fOUT  
Output Frequency  
F_SEL[1:0] = 01 or 11  
F_SEL[1:0] = 10  
112  
140  
56  
70  
tsk(o)  
tjit(Ø)  
Output Skewꢀ NOTE 1, 2  
RMS Phase Jitter, Randomꢀ NOTE 3  
12  
156.25MHz, (1.875MHz - 20MHz)  
125MHz, (1.875MHz - 20MHz)  
62.5MHz, (1.875MHz - 20MHz)  
20% to 80%  
0.47  
0.57  
0.51  
ps  
ps  
ps  
tR / tF  
odc  
Output Rise/Fall Time  
Output Duty Cycle  
200  
46  
700  
54  
ps  
%
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is  
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium  
has been reached under these conditions.  
NOTE 1: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
NOTE 2: This parameter is defined in accordance with JEDEC Standard 65.  
NOTE 3: Refer to Phase Noise Plots.  
Table 5B. AC Characteristics, VDD = VDDA = 3.3V 5%, VDDO = 2.5V 5%, TA = -40°C to 85°C  
Symbol  
Parameter  
Test Conditions  
F_SEL[1:0] = 00  
Minimum  
140  
Typical  
Maximum  
175  
Units  
MHz  
MHz  
MHz  
ps  
fOUT  
Output Frequency  
F_SEL[1:0] = 01 or 11  
F_SEL[1:0] = 10  
112  
140  
56  
70  
tsk(o)  
tjit(Ø)  
Output Skewꢀ NOTE 1, 2  
RMS Phase Jitter, Randomꢀ NOTE 3  
12  
156.25MHz, (1.875MHz - 20MHz)  
125MHz, (1.875MHz - 20MHz)  
62.5MHz, (1.875MHz - 20MHz)  
20% to 80%  
0.47  
0.55  
0.49  
ps  
ps  
ps  
tR / tF  
odc  
Output Rise/Fall Time  
Output Duty Cycle  
200  
46  
700  
54  
ps  
%
For NOTES, see Table 5A above.  
Table 5C. AC Characteristics, VDD = VDDA = VDDO = 2.5V 5%, TA = -40°C to 85°C  
Symbol  
Parameter  
Test Conditions  
F_SEL[1:0] = 00  
Minimum  
140  
Typical  
Maximum  
175  
Units  
MHz  
MHz  
MHz  
ps  
fOUT  
Output Frequency  
F_SEL[1:0] = 01 or 11  
F_SEL[1:0] = 10  
112  
140  
56  
70  
tsk(o)  
tjit(Ø)  
Output Skewꢀ NOTE 1, 2  
RMS Phase Jitter, Randomꢀ NOTE 3  
12  
156.25MHz, (1.875MHz - 20MHz)  
125MHz, (1.875MHz - 20MHz)  
62.5MHz, (1.875MHz - 20MHz)  
20% to 80%  
0.49  
0.56  
0.52  
ps  
ps  
ps  
tR / tF  
odc  
Output Rise/Fall Time  
Output Duty Cycle  
200  
46  
700  
54  
ps  
%
fOUT = 125MHz  
47  
53  
%
For NOTES, see Table 5A above.  
Rev B 8/5/15  
5
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY  
SYNTHESIZER  
840002I-01 DATA SHEET  
Typical Phase Noise at 62.5MHz (3.3V)  
1Gb Ethernet Filter  
62.5MHz  
RMS Phase Jitter (Random)  
1.875MHz to 20MHz = 0.51ps (typical)  
Raw Phase Noise Data  
Phase Noise Result by adding a  
1Gb Ethernet filter to raw data  
Offset Frequency (Hz)  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY  
SYNTHESIZER  
6
Rev B 8/5/15  
840002I-01 DATA SHEET  
Typical Phase Noise at 156.25MHz (3.3V)  
10Gb Ethernet Filter  
156.25MHz  
RMS Phase Jitter (Random)  
1.875MHz to 20MHz = 0.47ps (typical)  
Raw Phase Noise Data  
Phase Noise Result by adding a  
10Gb Ethernet filter to raw data  
Offset Frequency (Hz)  
Rev B 8/5/15  
7
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY  
SYNTHESIZER  
840002I-01 DATA SHEET  
Parameter Measurement Information  
1.65V 5%  
2.05V 5%  
1.25V 5%  
SCOPE  
SCOPE  
VDD,  
VDD,  
VDDA,  
VDDA  
VDDO  
Qx  
VDDO  
GND  
Qx  
LVCMOS  
GND  
VDDO  
2
-1.65V 5%  
-1.25V 5%  
3.3V Core/3.3V Output Load AC Test Circuit  
3.3V Core/2.5V Output Load AC Test Circuit  
1.25V 5%  
Phase Noise Plot  
SCOPE  
VDD,  
VDDA,  
Phase Noise Mask  
VDDO  
Qx  
GND  
Offset Frequency  
f1  
f2  
RMS Jitter = Area Under the Masked Phase Noise Plot  
-1.25V 5%  
2.5V Core/2.5V Output Load AC Test Circuit  
RMS Phase Jitter  
VDDO  
2
VDDO  
Qx  
Q[0:1]  
2
tPW  
tPERIOD  
VDDO  
Qy  
2
tPW  
tsk(o)  
x 100%  
odc =  
tPERIOD  
Output Skew  
Output Duty Cycle/Pulse Width/Period  
80%  
80%  
tR  
20%  
20%  
Q[0:1]  
tF  
Output Rise/Fall Time  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY  
SYNTHESIZER  
8
Rev B 8/5/15  
840002I-01 DATA SHEET  
Applications Information  
Recommendations for Unused Input and Output Pins  
Inputs:  
Outputs:  
Crystal Inputs  
LVCMOS Outputs  
For applications not requiring the use of the crystal oscillator input,  
both XTAL_IN and XTAL_OUT can be left floating. Though not  
required, but for additional protection, a 1kresistor can be tied from  
XTAL_IN to ground.  
All unused LVCMOS outputs can be left floating. We recommend that  
there is no trace attached.  
TEST_CLK Input  
For applications not requiring the use of the test clock, it can be left  
floating. Though not required, but for additional protection, a 1k  
resistor can be tied from the TEST_CLK to ground.  
LVCMOS Control Pins  
All control pins have internal pullups or pulldownsꢀ additional  
resistance is not required but can be added for additional protection.  
A 1kresistor can be used.  
Rev B 8/5/15  
9
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY  
SYNTHESIZER  
840002I-01 DATA SHEET  
Overdriving the XTAL Interface  
The XTAL_IN input can accept a single-ended LVCMOS signal  
through an AC coupling capacitor. A general interface diagram is  
shown in Figure 1A. The XTAL_OUT pin can be left floating. The  
maximum amplitude of the input signal should not exceed 2V and the  
input edge rate can be as slow as 10ns. This configuration requires  
that the output impedance of the driver (Ro) plus the series  
resistance (Rs) equals the transmission line impedance. In addition,  
matched termination at the crystal input will attenuate the signal in  
half. This can be done in one of two ways. First, R1 and R2 in parallel  
should equal the transmission line impedance. For most 50  
applications, R1 and R2 can be 100. This can also be  
accomplished by removing R1 and making R2 50. By overdriving  
the crystal oscillator, the device will be functional, but note, the device  
performance is guaranteed by using a quartz crystal.  
Figure 1A. General Diagram for LVCMOS Driver to XTAL Input Interface  
Figure 1B. General Diagram for LVPECL Driver to XTAL Input Interface  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY  
SYNTHESIZER  
10  
Rev B 8/5/15  
840002I-01 DATA SHEET  
Layout Guideline  
Figure 2 shows a schematic example of the 840002I-01 application  
0.1uF capacitor in each power pin filter should be placed on the  
device side of the PCB and the other components can be placed on  
the opposite side.  
schematic. In this example, the device is operated at VDD = VDDA  
=
VDDO = 3.3V. The 18pF parallel resonant 25MHz crystal is used. The  
load capacitance C1 = 22pF and C2 = 22pF are recommended for  
frequency accuracy. Depending on the parasitic of the printed circuit  
board layout, these values might require a slight adjustment to  
optimize the frequency accuracy. Crystals with other load  
capacitance specifications can be used. This will required adjusting  
C1 and C2.  
Power supply filter recommendations are a general guideline to be  
used for reducing external noise from coupling into the devices. The  
filter performance is designed for wide range of noise frequencies.  
This low-pass filter starts to attenuate noise at approximately 10kHz.  
If a specific frequency noise component is known, such as switching  
power supply frequencies, it is recommended that component values  
be adjusted and if required, additional filtering be added. Additionally,  
good general design practices for power plane voltage stability  
suggests adding bulk capacitances in the local area of all devices.  
As with any high speed analog circuitry, the power supply pins are  
vulnerable to noise. To achieve optimum jitter performance, power  
supply isolation is required. The 840002I-01 provides separate power  
supplies to isolate from coupling into the internal PLL.  
The schematic example focuses on functional connections and is not  
configuration specific. Refer to the pin description and functional  
tables in the datasheet to ensure the logic control inputs are properly  
set.  
In order to achieve the best possible filtering, it is recommended that  
the placement of the filter components be on the device side of the  
PCB as close to the power pins as possible. If space is limited, the  
Figure 2. 840002I-01 Application Schematic Example  
Rev B 8/5/15  
11  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY  
SYNTHESIZER  
840002I-01 DATA SHEET  
Reliability Information  
Table 6. JA vs. Air Flow Table for a 16 Lead TSSOP  
JA by Velocity  
0
Linear Feet per Minute  
200  
500  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
137.1°C/W  
89.0°C/W  
118.2°C/W  
81.8°C/W  
106.8°C/W  
78.1°C/W  
Transistor Count  
The transistor count for 840002I-01 is: 3356  
Package Outline and Package Dimensions  
Package Outline - G Suffix for 16 Lead TSSOP  
Table 7. Package Dimensions for 16 Lead TSSOP  
All Dimensions in Millimeters  
Symbol  
Minimum  
Maximum  
N
A
16  
1.20  
0.15  
1.05  
0.30  
0.20  
5.10  
A1  
A2  
b
0.5  
0.80  
0.19  
0.09  
4.90  
c
D
E
6.40 Basic  
E1  
e
4.30  
4.50  
0.65 Basic  
L
0.45  
0°  
0.75  
8°  
aaa  
0.10  
Reference Document: JEDEC Publication 95, MO-153  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY  
SYNTHESIZER  
12  
Rev B 8/5/15  
840002I-01 DATA SHEET  
Ordering Information  
Table 8. Ordering Information  
Part/Order Number  
840002AGI-01LF  
840002AGI-01LFT  
Marking  
002AI01L  
002AI01L  
Package  
“Lead-Free”, 16 Lead LQFP  
“Lead-Free”, 16 Lead LQFP  
Shipping Packaging  
Tube  
Temperature  
-40°C to 85°C  
-40°C to 85°C  
Tape & Reel  
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.  
Rev B 8/5/15  
13  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY  
SYNTHESIZER  
840002I-01 DATA SHEET  
Revision History Sheet  
Rev  
Table  
Page  
Description of Change  
Date  
T8  
12  
Ordering Information Table - corrected standard marking and added Lead-Free part  
number, marking and note.  
A
10/18/07  
Updated datasheet's header/footer with IDT from ICS.  
Removed ICS prefix from Part/Order Number column.  
Added Contact Page.  
A
A
T8  
12  
14  
11/18/10  
12/6/10  
T5A - T5C  
4 - 5  
8
AC Characteristics Tables - added thermal note.  
Power Supply Filtering Techniques - corrected figure 1.  
Added Overdriving the Crystal Interface section.  
9
10  
Added Recommendations for Unused Input & Output Pins section.  
T5B  
T5C  
5
3.3V/2.5V AC Characteristics Table -corrected FOUT from 56MHz min - 68MHz max to  
56MHz min - 70MHz max.  
5
2.5V AC Characteristics Table - added 2nd odc spec and added thermal note.  
Corrected FOUT from 56MHz min - 68MHz max to 56MHz min - 70MHz max.  
8
8
Deleted Power Supply Filtering Techniques section, added to schematic layout.  
Deleted Crystal Input Interface section.  
B
2/3/11  
9
Added Overdriving the XTAL Interface section.  
Updated Layout Guideline and diagram.  
10  
Converted datasheet format.  
B
B
5A, 5B, 5C  
5
AC Tableꢀ fOUT = F_SEL[1:0] = 01 or 11, F_SEL[1:0] = 10  
Deleted Quantity from Tape and Reel  
9/28/12  
8/5/15  
8
13  
13  
T8  
Ordering Information - removed leaded devices.  
Updated data sheet format.  
B
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY  
SYNTHESIZER  
14  
Rev B 8/5/15  
Corporate Headquarters  
6024 Silver Creek Valley Road  
San Jose, CA 95138 USA  
Sales  
Tech Support  
email: clocks@idt.com  
1-800-345-7015 or 408-284-8200  
Fax: 408-284-2775  
www.IDT.com  
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in  
this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined  
in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether  
express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This  
document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties.  
IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably  
expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.  
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or  
other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications, such as  
those requiring extended temperature ranges, high reliability or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any  
circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.  
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Product specification subject to change without notice. Other trademarks and service marks used herein, including protected  
names, logos and designs, are the property of IDT or their respective third party owners.  
Copyright ©2015 Integrated Device Technology, Inc.. All rights reserved.  

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