844441AMI-100LFT [IDT]
Clock Generator, 300MHz, PDSO8, 3.90 X 4.90 MM, 1.375 HEIGHT, ROHS COMPLIANT, MS-102, SOIC-8;型号: | 844441AMI-100LFT |
厂家: | INTEGRATED DEVICE TECHNOLOGY |
描述: | Clock Generator, 300MHz, PDSO8, 3.90 X 4.90 MM, 1.375 HEIGHT, ROHS COMPLIANT, MS-102, SOIC-8 时钟 光电二极管 外围集成电路 晶体 |
文件: | 总14页 (文件大小:889K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
FemtoClock™ SAS/SATA Clock Generator
ICS844441I
PRELIMINARY DATA SHEET
General Description
Features
The ICS844441I is a low jitter, high performance clock
• Designed for use in SAS, SAS-2, and SATA systems
• Center ( 0.25%) Spread Spectrum Clocking (SSC)
• Down (-0.23% or -0.5%) SSC
S
IC
generator and a member of the FemtoClock™ family
of silicon timing products. The ICS844441I is designed
for use in applications using the SAS and SATA
interconnect. The ICS844441I uses an external,
HiPerClockS™
• Better frequency stability than SAW oscillators
• One differential 2.5V LVDS output
25MHz, parallel resonant crystal to generate four selectable output
frequencies: 75MHz, 100MHz, 150MHz, and 300MHz. This silicon
based approach provides excellent frequency stability and reliability.
The ICS844441I features down and center spread spectrum (SSC)
clocking techniques.
• Crystal oscillator interface designed for 25MHz
(CL = 18pF) frequency
• External fundamental crystal frequency ensures high reliability
and low aging
• Selectable output frequencies: 75MHz, 100MHz, 150MHz,
Applications
300MHz
• SAS/SATA Host Bus Adapters
• Output frequency is tunable with external capacitors
• SATA Port Multipliers
• RMS phase jitter @ 100MHz, using a 25MHz crystal
• SAS I/O Controllers
(12kHz – 20MHz): 1.1936ps (typical)
• TapeDrive and HDD Array Controllers
• SAS Edge and Fanout Expanders
• HDDs and TapeDrives
• 2.5V operating supply
• -40°C to 85°C ambient operating temperature
• Available in lead-free (RoHS 6) packages
• Disk Storage Enterprise
Pin Assignment
Block Diagrams
1
2
3
4
8
7
6
5
XTAL_OUT
XTAL_IN
SSC_SEL0
SSC_SEL1
GND
nQ
Q
XTAL_IN
VDD
25MHz
XTAL
00 = SSC Off
FemtoClock™
OSC
01 = 0.5% Down-spread
10 = 0.23% Down-spread
11 = 0.5% Center-spread
Q
ICS844441I
PLL
nQ
XTAL_OUT
8-Lead SOIC, 150 mil
3.90mm x 4.90mm x 1.375mm package body
M Package
SSC Output
Control Logic
Pulldown:Pulldown
SSC_SEL(1:0)
nPLL_SEL
8-Lead SOIC
Top View
Pulldown
GND
16
15
14
13
12
11
10
9
F_SEL1
GND
nPLL_SEL
nQ
Q
VDD
1
2
3
4
5
6
7
8
XTAL_IN
XTAL_OUT
XTAL_IN
FemtoClock™
PLL
25MHz
XTAL
OSC
0
1
00 = 75MHz
SSC_SEL0
01 = 100MHz
Q
nc
nc
nc
XTAL_OUT
10 = 150MHz (default)
11 = 300MHz
nQ
Pullup:Pulldown
F_SEL(1:0)
F_SEL0
VDD
SSC_SEL1
Clock Output
Control Logic
Pulldown:Pulldown
SSC_SEL(1:0)
16-Lead TSSOP
ICS844441I
16-Lead TSSOP
4.4mm x 5.0mm x 0.925mm package body
G Package
Top View
The Preliminary Information presented herein represents a product in pre-production. The noted characteristics are based on initial product characterization
and/or qualification. Integrated Device Technology, Incorporated (IDT) reserves the right to change any circuitry or specifications without notice.
ICS844441DGI REVISION B OCTOBER 13, 2009
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©2009 Integrated Device Technology, Inc.
ICS844441I Preliminary Data Sheet
FEMTOCLOCK™ SAS/SATA CLOCK GENERATOR
Table 1. Pin Descriptions
Name
Type
Description
XTAL_OUT,
XTAL_IN
Input
Input
Crystal oscillator interface. XTAL_IN is the input, XTAL_OUT is the output.
SSC select pins. See Table 3A. LVCMOS/LVTTL interface levels.
SSC_SEL0,
SSC_SEL1
Pulldown
F_SEL0
F_SEL1
nPLL_SEL
Q, nQ
GND
Input
Input
Pulldown
Pullup
Output frequency select pin. See Table 3B. LVCMOS/LVTTL interface levels.
Output frequency select pin. See Table 3B. LVCMOS/LVTTL interface levels.
PLL Bypass pin. LVCMOS/LVTTL interface levels.
Differential clock outputs. LVDS interface levels.
Power supply ground.
Input
Pulldown
Output
Power
Power
Unused
VDD
Power supply pin.
nc
No connect.
NOTE: Pullup/Pulldown refers to internal input resistors. See Table 2, Pin Characteristics, for typical values.
Table 2. Pin Characteristics
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
pF
CIN
Input Capacitance
4
RPULLDOWN Input Pulldown Resistor
RPULLUP Input Pullup Resistor
51
51
kΩ
kΩ
Function Tables
Table 3A. SSC_SEL[1:0] Function Table
Inputs
Table 3B. F_SEL[1:0] Function Table
Inputs
Output Frequency
(MHz)
SSC_SEL1
SSC_SEL0
Mode
F_SEL1
F_SEL0
0 (default)
0 (default)
SSC Off
0
0
75
0
1
1
1
0
1
0.5% Down-spread
0.23% Down-spread
0.5% Center-spread
0
1 (default)
1
1
0 (default)
1
100
150
300
ICS844441DGI REVISION B OCTOBER 13, 2009
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©2009 Integrated Device Technology, Inc.
ICS844441I Preliminary Data Sheet
FEMTOCLOCK™ SAS/SATA CLOCK GENERATOR
Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect product reliability.
Item
Rating
Supply Voltage, VDD
Inputs, VI
4.6V
-0.5V to VDD + 0.5V
Outputs, IO
Continuous Current
Surge Current
10mA
15mA
Package Thermal Impedance, θJA
16 Lead TSSOP
8 Lead SOIC
92.4°C/W (0 mps)
96.0°C/W (0 lfpm)
Storage Temperature, TSTG
-65°C to 150°C
DC Electrical Characteristics
Table 4A. Power Supply DC Characteristics, VDD = 2.5V 5%, TA = -40°C to 85°C
Symbol
VDD
Parameter
Test Conditions
Minimum
Typical
2.5
Maximum
Units
V
Power Supply Voltage
Power Supply Current
2.375
2.625
IDD
45
mA
Table 4B. LVCMOS/LVTTL DC Characteristics,VDD = 2.5V 5%, TA = -40°C to 85°C
Symbol Parameter
Test Conditions
Minimum
1.7
Typical
Maximum
Units
V
VIH
VIL
Input High Voltage
Input Low Voltage
VDD + 0.3
-0.3
0.7
5
V
F_SEL1
VDD = VIN = 2.5V
µA
Input
High Current
IIH
SSC_SEL[0:1],
F_SEL0, nPLL_SEL
VDD = VIN = 2.5V
150
µA
µA
µA
F_SEL1
V
DD = 2.5V, VIN = 0V
-150
-5
Input
Low Current
IIL
SSC_SEL[0:1],
F_SEL0, nPLL_SEL
VDD = 2.5V, VIN = 0V
Table 4C. LVDS DC Characteristics, VDD = 2.5V 5%, TA = -40°C to 85°C
Symbol
VOD
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
mV
mV
V
Differential Output Voltage
VOD Magnitude Change
Offset Voltage
350
∆VOD
VOS
50
50
1.25
∆VOS
VOS Magnitude Change
mV
ICS844441DGI REVISION B OCTOBER 13, 2009
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©2009 Integrated Device Technology, Inc.
ICS844441I Preliminary Data Sheet
FEMTOCLOCK™ SAS/SATA CLOCK GENERATOR
Table 4D. Crystal Characteristics
Parameter
Test Conditions
Minimum
Typical
Fundamental
25
Maximum
Units
Mode of Oscillation
Frequency
MHz
Ohm
pF
Equivalent Series Resistance (ESR)
Shunt Capacitance
50
7
AC Electrical Characteristics
Table 5. AC Characteristics, VDD = 2.5V 5%, TA = -40°C to 85°C
Symbol
Parameter
Test Conditions
F_SEL(1:0) = 00
F_SEL(1:0) = 01
F_SEL(1:0) = 10
F_SEL(1:0) = 11
Minimum
Typical
75
Maximum
Units
MHz
MHz
MHz
MHz
100
fOUT
Output Frequency
150
300
75MHz,
1.19602
1.1936
ps
ps
ps
ps
Integration Range: 12kHz – 20MHz
100MHz,
Integration Range: 12kHz – 20MHz
RMS Phase Jitter
(Random); NOTE 1
tjit(Ø)
150MHz,
Integration Range: 12kHz – 20MHz
1.22743
1.15011
300MHz,
Integration Range: 12kHz – 20MHz
tR / tF
odc
Output Rise/Fall Time
Output Duty Cycle
20% to 80%
400
50
ps
%
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium
has been reached under these conditions.
NOTE: Using a 25MHz, 18pF quartz crystal.
NOTE 1: Please refer to the Phase Noise plot.
ICS844441DGI REVISION B OCTOBER 13, 2009
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©2009 Integrated Device Technology, Inc.
ICS844441I Preliminary Data Sheet
FEMTOCLOCK™ SAS/SATA CLOCK GENERATOR
Typical Phase Noise at 100MHz
Offset Frequency (Hz)
ICS844441DGI REVISION B OCTOBER 13, 2009
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©2009 Integrated Device Technology, Inc.
ICS844441I Preliminary Data Sheet
FEMTOCLOCK™ SAS/SATA CLOCK GENERATOR
Parameter Measurement Information
Phase Noise Plot
SCOPE
Qx
V
DD
2.5V 5%
POWER SUPPLY
Phase Noise Mask
+
Float GND –
LVDS
nQx
Offset Frequency
f1
f2
RMS Jitter = Area Under the Masked Phase Noise Plot
2.5V LVDS Output Load AC Test Circuit
RMS Phase Jitter
nQ
Q
nQ
80%
tF
80%
tR
tPW
VOD
20%
tPERIOD
20%
Q
tPW
odc =
x 100%
tPERIOD
Output Rise/Fall Time
Output Duty Cycle/Pulse Width/Period
VDD
VDD
out
➤
out
out
➤
DC Input
LVDS
LVDS
V
OD/∆ VOD
DC Input
100
out
➤
VOS/∆ VOS
➤
Offset Voltage Setup
Differential Output Voltage Setup
ICS844441DGI REVISION B OCTOBER 13, 2009
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©2009 Integrated Device Technology, Inc.
ICS844441I Preliminary Data Sheet
FEMTOCLOCK™ SAS/SATA CLOCK GENERATOR
Application Information
Crystal Input Interface
The ICS844441I has been characterized with 18pF parallel resonant
crystals. The capacitor values, C1 and C2, shown in Figure 1 below
were determined using a 25MHz, 18pF parallel resonant crystal and
were chosen to minimize the ppm error. The optimum C1 and C2
values can be slightly adjusted for different board layouts.
XTAL_IN
C1
27p
X1
18pF Parallel Crystal
XTAL_OUT
C2
27p
Figure 1. Crystal Input Interface
LVCMOS to XTAL Interface
The XTAL_IN input can accept a single-ended LVCMOS signal
through an AC coupling capacitor. A general interface diagram is
shown in Figure 2. The XTAL_OUT pin can be left floating. The input
edge rate can be as slow as 10ns. For LVCMOS inputs, it is
recommended that the amplitude be reduced from full swing to half
swing in order to prevent signal interference with the power rail and
to reduce noise. This configuration requires that the output
impedance of the driver (Ro) plus the series resistance (Rs) equals
the transmission line impedance. In addition, matched termination at
the crystal input will attenuate the signal in half. This can be done in
one of two ways. First, R1 and R2 in parallel should equal the
transmission line impedance. For most 50Ω applications, R1 and R2
can be 100Ω. This can also be accomplished by removing R1 and
making R2 50Ω. By overdriving the crystal oscillator, the device will
be functional, but note, the device performance is guaranteed by
using a quartz crystal.
VCC
VCC
R1
0.1µf
50Ω
Ro
Rs
XTAL_IN
R2
Zo = Ro + Rs
XTAL_OUT
Figure 2. General Diagram for LVCMOS Driver to XTAL Input Interface
ICS844441DGI REVISION B OCTOBER 13, 2009
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©2009 Integrated Device Technology, Inc.
ICS844441I Preliminary Data Sheet
FEMTOCLOCK™ SAS/SATA CLOCK GENERATOR
Recommendations for Unused Input Pins
Inputs:
LVCMOS Control Pins
All control pins have internal pull-ups; additional resistance is not
required but can be added for additional protection. A 1kΩ resistor
can be used.
2.5V LVDS Driver Termination
Figure 3 shows a typical termination for LVDS driver in
characteristic impedance of 100Ω differential (50Ω single)
transmission line environment. For buffer with multiple LVDS driver, it
is recommended to terminate the unused outputs.
2.5V
50Ω
2.5V
LVDS Driver
+
–
R1
100Ω
50Ω
100Ω Differential Transmission Line
Figure 3. Typical LVDS Driver Termination
ICS844441DGI REVISION B OCTOBER 13, 2009
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©2009 Integrated Device Technology, Inc.
ICS844441I Preliminary Data Sheet
FEMTOCLOCK™ SAS/SATA CLOCK GENERATOR
Schematic Example
Figure 4 shows an example of the ICS844441I application schematic.
In this ecample, the device is operated at VDD = 2.5V. The 18pF
parallel resonant 25MHz crystal is used. The C1 = 27pF and C2 =
27pF are recommended for frequency accuracy. for different board
layouts, the C1 and C2 may be slightly adjusted for optimizing
frequency accuracy. Two examples of LVDS for receiver without
built-in termination are shown in this schematic.
25 MHz
18pF
U1
Zo = 50 Ohm
Q
C2
X1
XTAL_OUT
XTAL_IN
27pF
1
8
7
6
5
XTAL_OU T
XTAL_I N
GND
nQ
2
3
4
+
SSC_SEL0
SSC_SEL1
R1
SSC_SEL0
SSC_SEL1
Q
100
VDD
C1
27pF
VDD
-
Zo = 50 Ohm
nQ
C3
0.01u
Logic Input Pin Examples
Set Logic
VDD=2.5V
Set Logic
Input to
'0'
VDD
VDD
Input to
'1'
RU1
1K
RU2
Not Install
Zo = 50 Ohm
Q
To Logic
Input
To Logic
Input
pins
R3
pins
50
+
RD1
RD2
1K
Not Install
C9
-
0.1uF
R4
Zo = 50 Ohm
50
nQ
Alternate
LVDS
Termination
Figure 4. ICS844441I Schematic Example
ICS844441DGI REVISION B OCTOBER 13, 2009
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©2009 Integrated Device Technology, Inc.
ICS844441I Preliminary Data Sheet
FEMTOCLOCK™ SAS/SATA CLOCK GENERATOR
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS844441I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS844441I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 2.5V + 5% = 2.625V, which gives worst case results.
Total Power MAX = VDD_MAX * IDD_MAX = 2.625V * 45mA = 118.125mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad, and directly affects the reliability of the device. The
maximum recommended junction temperature for HiPerClockS devices is 125°C. Limiting the internal transistor junction temperature, Tj, to
125°C ensures that the bond wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 96°C/W per Table 6B below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.118W * 96°C/W = 96.3°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the supply voltage, air flow and the type of board (multi-layer).
Table 6A. Thermal Resistance θJA for 16 Lead TSSOP, Forced Convection
θJA vs. Air Flow
Meters per Second
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
92.4°C/W
88.0°C/W
85.9°C/W
Table 6B. Thermal Resistance θJA for 8 Lead SOIC, Forced Convection
θJA vs. Air Flow
Linear Feet per Second
0
200
500
Multi-Layer PCB, JEDEC Standard Test Boards
96°C/W
87°C/W
82°C/W
ICS844441DGI REVISION B OCTOBER 13, 2009
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©2009 Integrated Device Technology, Inc.
ICS844441I Preliminary Data Sheet
FEMTOCLOCK™ SAS/SATA CLOCK GENERATOR
Reliability Information
Table 7A. θJA vs. Air Flow Table for a 16 Lead TSSOP
θJA vs. Air Flow
Meters per Second
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
92.4°C/W
88.0°C/W
85.9°C/W
Table 7B. θJA vs. Air Flow Table for a 8 Lead SOIC
θJA vs. Air Flow
Linear Feet per Second
0
200
500
Multi-Layer PCB, JEDEC Standard Test Boards
96°C/W
87°C/W
82°C/W
Transistor Count
The transistor count for ICS844441I is: 6431
ICS844441DGI REVISION B OCTOBER 13, 2009
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©2009 Integrated Device Technology, Inc.
ICS844441I Preliminary Data Sheet
FEMTOCLOCK™ SAS/SATA CLOCK GENERATOR
Package Outline and Package Dimensions
Package Outline - G Suffix for 16-Lead TSSOP
Package Outline - M Suffix for 8 Lead SOIC
Table 8B. Package Dimensions for 8 Lead SOIC
All Dimensions in Millimeters
Table 8A. Package Dimensions for 16 Lead TSSOP
All Dimensions in Millimeters
Symbol
Minimum
Maximum
Symbol
Minimum
Maximum
N
A
A1
B
C
D
E
8
N
A
16
1.35
0.10
0.33
0.19
4.80
3.80
1.75
0.25
0.51
0.25
5.00
4.00
1.20
0.15
1.05
0.30
0.20
5.10
A1
A2
b
0.05
0.80
0.19
0.09
4.90
c
D
e
1.27 Basic
E
6.40 Basic
H
h
5.80
0.25
0.40
0°
6.20
0.50
1.27
8°
E1
e
4.30
4.50
0.65 Basic
L
L
0.45
0°
0.75
8°
α
α
aaa
0.10
Reference Document: JEDEC Publication 95, MS-012
Reference Document: JEDEC Publication 95, MO-153
ICS844441DGI REVISION B OCTOBER 13, 2009
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©2009 Integrated Device Technology, Inc.
ICS844441I Preliminary Data Sheet
FEMTOCLOCK™ SAS/SATA CLOCK GENERATOR
Ordering Information
Table 9. Ordering Information
Part/Order Number
844441DGILF
844441DGILFT
Marking
Package
Shipping Packaging
Tube
2500 Tape & Reel
Tube
2500 Tape & Reel
Tube
2500 Tape & Reel
Tube
Temperature
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
44441DIL
44441DIL
TBD
16 Lead “Lead-Free” TSSOP
16 Lead “Lead-Free” TSSOP
8 Lead “Lead-Free” SOIC
8 Lead “Lead-Free” SOIC
8 Lead “Lead-Free” SOIC
8 Lead “Lead-Free” SOIC
8 Lead “Lead-Free” SOIC
8 Lead “Lead-Free” SOIC
8 Lead “Lead-Free” SOIC
8 Lead “Lead-Free” SOIC
844441DMI-75LF
844441DMI-75LFT
844441DMI-100LF
844441DMI-100LFT
844441DMI-150LF
844441DMI-150LFT
844441DMI-300LF
844441DMI-300LFT
TBD
TBD
TBD
41DI150L
41DI150L
41DI300L
41DI300L
2500 Tape & Reel
Tube
2500 Tape & Reel
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
Table 10. Additional Ordering Information
Part/Order Number
844441DGI
844441DMI-75
844441DMI-100
844441DMI-150
844441DMI-300
Package
16 TSSOP
8 SOIC
8 SOIC
8 SOIC
Output Frequency (MHz)
75, 100, 150, 300
75
100
150
300
8 SOIC
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the
infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal
commercial and industrial applications. Any other applications, such as those requiring high reliability or other extraordinary environmental requirements are not recommended without
additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support
devices or critical medical instruments.
ICS844441DGI REVISION B OCTOBER 13, 2009
13
©2009 Integrated Device Technology, Inc.
ICS844441I Preliminary Data Sheet
FEMTOCLOCK™ SAS/SATA CLOCK GENERATOR
6024 Silver Creek Valley Road Sales
Technical Support
800-345-7015 (inside USA)
netcom@idt.com
+408-284-8200 (outside USA) +480-763-2056
Fax: 408-284-2775
San Jose, California 95138
www.IDT.com/go/contactIDT
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document,
including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not
guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the
suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any
license under intellectual property rights of IDT or any third parties.
IDT’s products are not intended for use in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT
product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third
party owners.
Copyright 2009. All rights reserved.
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