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FXO-HC335R-8.448 [IDT]

HCMOS Output Clock Oscillator;
FXO-HC335R-8.448
型号： FXO-HC335R-8.448
厂家： INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述：

HCMOS Output Clock Oscillator
文件： 总24页 (文件大小：1258K)
中文：  中文翻译
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Model: FXO-HC33 SERIES  
HCMOS 3.2 x 2.5mm 3.3V Oscillator  
Freq: 0.75 MHz to 250MHz  
Rev.3/27/2012  
Features  
XTREMELY Low Jitter  
Low Cost  
XPRESS Delivery  
Frequency Resolution to six decimal places  
Stabilities to ± 25 PPM  
-20 to +70°C or -40 to +85°C operating temperatures  
Tri-State Enable / Disable Feature  
Industry Standard Package, Footprint & Pin-Out  
Fully RoHS and REACH compliant  
Gold over Nickel Termination Finish  
Serial ID with Comprehensive Traceability  
Applications  
ANY application requiring an oscillator  
SONET  
Ethernet  
Storage Area Network  
Broadband Access  
V
DD  
Enable / Disable  
Microprocessors / DSP / FPGA  
Industrial Controllers  
Test and Measurement Equipment  
Fiber Channel  
FOX  
OUTPUT  
XPRESSO  
ASICs  
GND  
For more information -- Click on the drawing  
Contents  
page  
Description  
Model Selection & Part Number Guide  
Electrical Characteristics  
Absolute Maximums  
Output Wave Characteristics  
Phase Noise  
2
3
4
4
5
5
6
6
6
7
8
8
9
The Fox XPRESSO Crystal Oscillator is a  
breakthrough in configurable Frequency Control  
Solutions. XPRESSO utilizes a family of  
proprietary ASICs, designed and developed by  
Fox, with a key focus on noise reduction  
technologies.  
Jitter  
Pin Assignment  
Recommended Circuit  
Reflow  
Mechanical Drawing and Pad Layout  
Tape and Reel Specification  
Label  
Traceability – LOT Number & Serial Identification  
SGS Report  
REACH Report  
Mechanical Test  
The 3rd order Delta Sigma Modulator reduces  
noise to the levels that are comparable to  
traditional Bulk Quartz and SAW oscillators.  
The ASICs family has ability to select the output  
type, input voltages, and temperature  
performance features.  
10~13  
14~21  
22  
Burn-In Test  
22  
23  
24  
24  
MTTF / FITS calculations  
Other XPRESSO Links  
Fox Contact Information  
With the XPRESS lead-time, low cost, low noise,  
wide frequency range, excellent ambient  
performance, XpressO is an excellent choice  
over the conventional technologies.  
Finished XPRESSO parts are 100% final tested.  
Page 1 of 24  
FOXElectronics 5570 Enterprise Parkway Fort Myers, Florida 33905 USA +1.239.693.0099 FAX +1.239.693.1554 http://www.foxonline.com  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Model Selection Guide & Fox Part Number  
STEP #1: Customer selects the Model Description and provides to Fox Customer Service  
Model Description  
F X O – H C 3 3 5 R – 1 0 6 . 2 5 Frequency (in MHz)  
Resolutions to 6 places  
past the decimal point  
3 = 3.2 x 2.5mm  
C = Ceramic  
Q = Quartz  
3 = 3.3 V  
2 = 2.5 V  
0 = ± 100 PPM  
5 = ± 50 PPM  
blank = -20°C to +70°C  
R = -40°C to +85°C  
H = HCMOS  
L = LVDS  
P = LVPECL  
5 = 5 x 3.2mm  
7 = 7 x 5mm  
6 = ± 25 PPM (-20 ~ +70°C)  
M = LVDS (pin 2 E/D)  
Q = LVPECL (pin 2 E/D)  
X = HCMOS (comp 2nd Output)  
STEP #2: The Fox Customer Service team provides a customer specific Part Number  
for use on their Bill Of Materials (BOM).  
Fox Part Number (The assigned Fox Part Number must be on the BOM – not the above Model Description)  
(This will ensure receipt of the proper part)  
The 1st Field  
Product Code #  
766 – 1 0 6 . 2 5 – 8  
The 3rd Field  
Fox Internally Generated Number  
(If any specification changes,  
the last digits change)  
(The same specs for a different customer  
also changes the last digits)  
766 = FXO–HC33  
767 = FXO–HC53  
768 = FXO–HC73  
The 2nd Field  
The Customer’s Frequency  
This example, FXO-HC335R-106.25 = HCMOS Output, Ceramic 3.2 x 2.5mm Package, 3.3V,  
±50 PPM Stability, -40 to +85°C Temperature Range, at 106.25 MHz  
Page 2 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Electrical Characteristics  
Maximum Value  
(unless otherwise noted)  
0.750 to 250.000 MHz  
Parameters  
Frequency Range  
Symbol  
Condition  
FO  
-20 ~ +70°C  
-40 to +85°C  
100, 50, 25* PPM  
100, 50 PPM  
Frequency Stability 1  
TO  
Standard operating  
Optional operating  
Storage  
-20°C to +70°C  
-40°C to +85°C  
-55°C to +125°C  
Temperature Range  
Supply Voltage  
TSTG  
VDD  
Standard  
3.3 V ± 5%  
0.75 ~ 20 MHz  
20+ ~ 50 MHz  
50+ ~ 130 MHz  
130+ ~ 200 MHz  
200+ ~ 250 MHz  
Standard  
32 mA  
35 mA  
47 mA  
55 mA  
60 mA  
15 pF  
30 pF  
Input Current (@ 15pF LOAD)  
Output Load  
IDD  
HCMOS  
TS  
Operational To 125MHz  
Start-Up Time  
10 mS  
100 nS  
1
Output Enable / Disable Time  
Moisture Sensitivity Level  
Termination Finish  
MSL  
JEDEC J-STD-20  
Au  
1Inclusive of 25°C tolerance, operating temperature range, input voltage change, load change, aging, shock and vibration. *Excludes aging.  
Absolute Maximum Ratings (Useful life may be impaired. For user guidelines only, not tested)  
Maximum Value  
Parameters  
Input Voltage  
Symbol  
VDD  
Condition  
(unless otherwise noted)  
–0.5V to +5.0V  
–55°C to +105°C  
–55°C to +125°C  
150°C  
Operating Temperature  
Storage Temperature  
Junction Temperature  
ESD Sensitivity  
TAMAX  
TSTG  
HBM  
>1 kV  
Human Body Model  
Page 3 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Output Wave Characteristics  
Maximum Value  
(unless otherwise noted)  
Parameters  
Symbol  
Condition  
0.75 to 150 MHz  
150+ to 250 MHz  
0.75 to 150 MHz  
150+ to 250 MHz  
10% VDD  
20% VDD  
90% VDD MIN  
80% VDD MIN  
Output LOW Voltage  
VOL  
Output HIGH Voltage  
VOH  
Output Symmetry (See Drawing Below)  
Output Enable (PIN # 1) Voltage  
Output Disable (PIN # 1) Voltage  
@ 50% VDD Level  
45% ~ 55%  
≥70% VDD  
≤ 30% VDD  
VIH  
VIL  
0.75 to 150 MHz  
150+ to 250 MHz  
0.75 to 150 MHz  
150+ to 250 MHz  
3 nS  
3 nS  
3 nS  
3 nS  
(10%~90%)  
Cycle Rise Time (See Drawing Below)  
TR  
TF  
(20%~80%)  
(90%~10%)  
Cycle Fall Time (See Drawing Below)  
(80%~20%)  
If 30% to 70% times are used, Rise and Fall times change to 1.5 nS from 0.75 to 250MHz  
If 20% to 80% times are used, Rise and Fall times change to 2 nS from 0.75 to 150MHz  
Rise Time / Fall Time Measurements  
10% to 90%  
0V to VDD  
30% to 70%  
20% to 80%  
70 - 30  
Times  
90% - 10%  
10% - 90%  
80 - 20  
Times  
Fall Time  
Rise Time  
Oscillator Symmetry  
Off Time  
On Time  
1/2 Period  
1/2 Period  
50% VDD  
Period  
Ideally, Symmetry should be 50/50 -- Other expressions are 45/55 or 55/45  
Page 4 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Phase Noise  
0
3.3V Phase Noise Graphs  
-20  
(dBc/Hz vs. offset frequency  
-40  
Data Collected using HP3048A  
Four Frequencies from Jitter Tables  
62.5MHz only to 2MHz offset due to Equipment Limitation  
156.25MHz  
-60  
125MHz  
-80  
-100  
106.25MHz  
-120  
-140  
-160  
-180  
62.5MHz  
10  
100  
1000  
10000  
100000  
1000000  
10000000  
100000000  
Jitter is frequency dependent. Below are typical values at select frequencies.  
Phase Jitter & Time Interval Error (TIE)  
Phase Jitter  
T I E  
Frequency  
62.5 MHz  
Units  
(12kHz to 20MHz)  
(Sigma of Jitter Distribution)  
0.8  
0.8  
0.8  
1.0  
2.9  
3.2  
2.3  
3.0  
pS RMS  
pS RMS  
pS RMS  
pS RMS  
106.25 MHz  
125 MHz  
156.25 MHz  
Phase Jitter is integrated from HP3048 Phase Noise Measurement System; measured directly into 50 ohm input; VDD = 3.3V.  
TIE was measured on LeCroy LC684 Digital Storage Scope, directly into 50 ohm input, with Amherst M1 software; VDD = 3.3V.  
Per MJSQ spec (Methodologies for Jitter and Signal Quality specifications)  
Random & Deterministic Jitter Composition  
Total Jitter (Tj)  
Random (Rj) Deterministic (Dj)  
Frequency  
62.5 MHz  
(14 x Rj) + Dj  
(pS RMS)  
1.2  
(pS P-P)  
9.2  
25.6 pS  
27.2 pS  
26.5 pS  
30.0 pS  
106.25 MHz  
125 MHz  
1.3  
9.0  
1.2  
8.7  
1.2  
156.25 MHz  
12.7  
Rj and Dj, measured on LeCroy LC684 Digital Storage Scope, directly into 50 ohm input, with Amherst M1 software.  
Per MJSQ spec (Methodologies for Jitter and Signal Quality specifications)  
Page 5 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Pin Description and Recommended Circuit  
Pin #  
Name  
Type  
Logic  
Function  
E / D 1  
GND  
1
2
3
4
Enable / Disable Control of Output (0 = Disabled)  
Ground  
Output  
Power  
Hi Z  
Electrical Ground for VDD  
Output  
HCMOS Oscillator Output  
2
Power Supply Source Voltage  
No Connection (Factory Use ONLY)  
VDD  
Test  
Points  
N. C.  
NOTES:  
1
2
Includes pull-up resistor to VDD to provide output when the pin (1) is No Connect.  
Installation should include a 0.01µF bypass capacitor placed between VDD  
(Pin 4) and GND (Pin 2) to minimize power supply line noise.  
E / D  
VDD  
4
1
0.01 F  
E/D  
VDD  
# 1  
# 2  
# 4  
# 3  
N. C.  
TP  
TP  
N. C.  
N C  
N C  
GND  
OUT  
GND  
Output  
2
3
HCMOS LOAD  
(15 pF)  
Terminations as viewed from the Top  
NOTE: XPRESSO HCMOS XOs are designed to  
fit on Industry Standard, 4 pad layouts  
Enable / Disable Control  
Pin # 1 (state)  
OPEN (No Connection)  
Output (Pin # 3)  
ACTIVE Output  
ACTIVE Output  
High Impedance  
“1” Level VIH ≥ 70% VDD  
“0” Level VIL ≤ 30% VDD  
Soldering Reflow Profile (2 times Maximum at 260°C for 10 seconds MAX)  
10 Seconds Max  
within 5°C of 260°C peak  
t
p
260°C  
Ramp-Up  
3°C/s Max  
Ramp Down  
Not to exceed 6°C/s  
225°C  
180°C  
50±10 Seconds  
Above 225°C Reflow Area  
120 ± 20 Seconds  
In Pre-heating Area  
160°C  
25°C  
400 Seconds MAX from +25°C to 260°C peak  
Page 6 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Mechanical Dimensional Drawing & Pad Layout  
3.2 x 2.5 XpressO  
HCMOS  
Actual part marking  
3.3 Max  
is depicted.  
1.0 Max  
4
3
See Traceability (pg. 8)  
for more information  
XPRESSO  
2.6 Max  
1
2
End View  
1.0 Max  
Side View  
0.35  
0.90  
NC  
0.70  
1
4
TP  
2
Bottom View  
NC  
TP  
0.90  
3
0.50  
Recommended  
Solder Pad Layout  
1.40  
NC  
TP  
1.20  
0.50  
NC  
TP  
1
1.00  
Note: XpressO HCMOS XO's are designed  
to fit on industry standard, 4 pad layouts.  
Pin Connections  
# 1 E / D  
# 3 Output  
# 2 GND  
# 4 VDD  
Drawing is for reference to critical specifications defined by size measurements.  
Certain non-critical visual attributes, such as side castellations, reference pin shape, etc. may vary  
Page 7 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Tape and Reel Dimensions  
4.0mm  
Ø1.5mm  
3.5mm  
8.0mm  
1.4mm  
4.0mm  
1.75  
Ø22.0  
Ø13.0  
178.0  
60.2  
2.5  
Standard Reel Qty. = 2K  
9.0  
Labeling (Reels and smaller packaging are labeled with the below)  
Fox Part Number: 766-106.25-8  
766-106.25-8  
Quantity:  
2000 pieces  
2000  
Description: FXO-HC335R-106.25  
FXO-HC335R-106.25  
Date Code  
LOT #  
0745  
(YYWW 2007 45th wk)  
24435  
If traceability should become necessary  
An additional identification code is contained internally if tracking should ever be necessary  
Page 8 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Traceability – LOT Number & Serial Identification  
LOT Number  
The LOT Number has direct ties to the customer purchase order. The LOT Number is marked on the  
“Reel” label, and also stored internally on non-volatile memory inside the XPRESSO part. XPRESSO parts  
that are shipped Tape and Reel, are also placed in an Electro Static Discharge (ESD) bag and will have the  
LOT Number labeled on the exterior of the ESD bag.  
It is recommended that the XPRESSO parts remain in this ESD bag during storage for protection and  
identification.  
If the parts become separated from the label showing the LOT Number, it can be retrieved from inside one  
of the parts, and the information that can be obtained is listed below:  
Customer Purchase Order Number  
Internal Fox Sales Order Number  
Dates that the XPRESSO part was shipped from the factory  
The assigned customer part number  
The specification that the part was designed for  
Serial Identification  
The Serial ID is the individualized information about the configuration of that particular XPRESSO part. The  
Serial ID is unique for each and every XPRESSO part, and can be read by special Fox equipment.  
With the Serial ID, the below information can be obtained about that individual, XPRESSO part:  
Equipment that the XPRESSO part was configured on  
Raw material used to configure the XPRESSO part  
Traceability of the raw material back to the foundries manufacturing lot  
Date and Time that the part was configured  
Any optimized electrical parameters based on customer specifications  
Electrical testing of the actual completed part  
Human resource that was monitoring the configuration of the part  
Fox has equipment placed at key Fox locations World Wide to read the Lot Identification and Serial  
Number of any XPRESSO part produced and can then obtain the information from above within 24 hours  
Page 9 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
3rd Party (SGS) Material Report  
Page 10 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
3rd Party (SGS) Material Report (continued)  
Page 11 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
3rd Party (SGS) Material Report (continued)  
Z
Page 12 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
3rd Party (SGS) Material Report (continued)  
Page 13 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Page 14 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Page 15 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Page 16 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Page 17 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Page 18 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Page 19 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Page 20 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Page 21 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Mechanical Testing  
Parameter  
Test Method  
Mechanical Shock  
Drop from 75cm to hardwood surface – 3 times  
10~55Hz, 1.5mm amplitude, 1 Minute Sweep  
2 Hours each in 3 Directions (X, Y, Z)  
Mechanical Vibration  
High Temperature Burn-in  
Hermetic Seal  
Under Power @ 125°C for 2000 Hours (results below)  
He pressure: 4 ±1 kgf / cm2 2 Hour soak  
2,000 Hour Burn-In  
Burn-In Testing – under power 2000 Hours, 125°C  
Page 22 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
MTTF / FITS Calculations  
Products are grouped together by process for MTTF calculations.  
(All XpressO output and package types are manufactured with the same process)  
Number of Parts Tested:  
Number of Failures: 0  
360 (120 of each output type: HCMOS, LVDS, LVPECL)  
Test Temperature: 125°C  
Number of Hours:  
2000  
MTTF was calculated using the following formulas:  
[1.] Device Hours (devhrs) = (number of devices) x (hours at elevated temperature in °K)  
devhrsaf 2  
[2.] MTTF   
2  
1
[3.] FITS =  
* 109  
MTTF  
Where:  
Label  
Name  
Formula/Value  
eV  
k
1 1  
)(   
t1 t2  
)
e(  
af  
Acceleration Factor  
eV  
k
Activation Energy  
0.40 V  
8.62 X 10-5 eV/°K  
Bolzman’s Constant  
t1  
t2  
Θ
r
Operating Temperature (°K)  
Accelerated Temperature (°K)  
Confidence Level (60% industry standard)  
Number of failed devices  
Theta  
Failures  
DEVICE-HOURS = 360 x 2000 HOURS = 720,000  
0.40  
1
1
(
)(  
)
8.625  
298 398  
ACCELERATION FACTOR =  
= 49.91009  
e
720,00049.910092  
MTTF =  
= 39,209,238 Hours  
1.833  
1.833  
Failure Rate =  
= 2.55E-8  
720,00049.910092  
FITS = Failure Rate *1E9 = 26  
Page 23 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  
FXO-HC33 Series  
Notes :  
Other XPRESSO Links  
XPRESSO Brochure  
Crystal Oscillators  
HCMOS 5 x 3.2mm 3.3V XO 0.75 to 250MHz  
HCMOS 7 x 5mm 3.3V XO 0.75 to 250MHz  
LVPECL 5 x 3.2mm 3.3V XO 0.75 to 1.35GHz  
LVPECL 7 x 5mm 3.3V XO 0.75 to 1.35GHz  
LVDS 5 x 3.2mm 3.3V XO 0.75 to 1.35GHz  
LVDS 7 x 5mm 3.3V XO 0.75 to 1.35GHz  
Voltage Controlled Crystal Oscillators  
HCMOS 5 x 3.2mm 3.3V VCXO 0.75 to 250MHz  
HCMOS 7 x 5mm 3.3V VCXO 0.75 to 250MHz  
LVPECL 5 x 3.2mm 3.3V VCXO 0.75 to 1.35GHz  
LVPECL 7 x 5mm 3.3V VCXO 0.75 to 1.35GHz  
LVDS 5 x 3.2mm 3.3V VCXO 0.75 to 1.35GHz  
LVDS 7 x 5mm 3.3V VCXO 0.75 to 1.35GHz  
Main Website www.foxonline.com  
Patent Numbers:  
US 6,664,860, US 5,960,403, US 5,952,890; US 5,960,405; US 6,188,290;  
Foreign Patents: R.S.A. 98/0866, R.O.C. 120851; Singapore 67081, 67082; EP 0958652  
China ZL 98802217.6, Malaysia MY-118540-A, Philippines 1-1998-000245, Hong Kong #HK1026079, Mexico #232179  
US and Foreign Patents Pending  
XpressO™ Fox Electronics  
Contact Information  
Fox Japan  
Tel:+81.3.3374.2079,  
Fax: +81.3.3377.5221  
Email: www.foxonline.com/email.htm  
(USA)-Worldwide Headquarters  
Tel: 888-GET-2-FOX  
Outside US: +1.239.693.0099,  
Fax:+1.239.693.1554  
Fox EMEA  
Email: www.foxonline.com/email.htm  
Tel/Fax: +44 1283 568153  
Email: www.foxonline.com/email.htm  
The above specifications, having been carefully prepared and checked, is believed to be accurate at the time of publication; however, no  
responsibility is assumed by Fox Electronics for inaccuracies.  
Page 24 of 24  
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified  
DWG-5052  

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