HXT5112A-BNT [IDT]

12 Channel 14Gb/s VCSEL Driver;
HXT5112A-BNT
型号: HXT5112A-BNT
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

12 Channel 14Gb/s VCSEL Driver

文件: 总2页 (文件大小:121K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HXT5112A  
Short Form Datasheet  
12 Channel 14Gb/s VCSEL Driver  
Description  
Features  
The HXT5112A VCSEL driver array is a key  
component for compact, robust and low-power  
optical transmitter modules. In conjunction with  
the VCSEL array, the chip handles the complete  
digital-to-optical conversion, including CML  
input, laser driver, drive control and supervision.  
Standard silicon technology and a small number  
of additional components allow for cost-  
effective and compact assemblies.  
Low-power consumption of 46mW per  
channel while delivering 5mA average and  
5mA modulation current  
Compatible with common cathode and  
isolated VCSEL arrays  
2-wire interface control and symmetric pad  
design maximize module design flexibility  
10mA average and 10mA modulation current  
maximum  
15mA burn-in current maximum  
InfiniBand QDR/FDR compliant  
100G Base-SR10 compliant  
Typical Applications  
IEEE 802.3ba Ethernet transceivers  
Infiniband QDR & FDR active cables  
Proprietary multi-channel optical modules  
Solder bump version available  
Ordering Information  
Part  
Temp. Range  
Pin-Package  
HXT5112A  
-DNT  
0°C to +85°C  
Bare Die 2.05mm x 3.65mm  
HXT5112A  
-BNT  
0°C to +85°C  
Bare Die with solder bumps  
for flip chip assembly  
For price, delivery schedules, and to place orders,  
contact IDT at www.IDT.com/go/sales  
Block Diagram  
X=12  
...  
X=2  
X=1  
Signal  
Detect  
VCSEL  
Supervisor  
Control  
VCSEL  
Bias  
LPx  
AxP  
AxN  
PRE  
EMPHASIS  
FAULT  
Vee  
Laser  
Disable  
SDA SCL  
IMON VTHERM NOTINT  
CONF1 CONF2  
Figure 1. Block Diagram  
© 2018 Integrated Device Technology, Inc.  
1
January 22, 2018  
HXT5112A Short Form Datasheet  
Revision History  
Date  
Notes  
April 12, 2011  
Initial release.  
Lot of updates and fixes.  
July 4, 2011  
September 1, 2011  
October 12, 2011  
Remove bump related spec and add some minor modifications.  
Add pad sizes and die layout details.  
November 23, 2011  
January 25, 2012  
February 27, 2012  
Correct types for bits 0 & 1 in register 0X05.  
Add solder bump specification.  
Add typical values for Icc1 and Icc2. Revised solder bump specification.  
March 12, 2013  
January 22, 2018  
Administrative error fix.  
Changed to IDT Branding.  
Corporate Headquarters  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
Sales  
1-800-345-7015 or  
408-284-8200  
Tech Support  
www.IDT.com/go/support  
www.IDT.com  
Fax: 408-284-2775  
www.IDT.com/go/sales  
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at  
any time, without notice, at IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not  
guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or  
implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of  
others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties.  
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product  
can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement  
by IDT.  
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein  
are the property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are  
copyright of Integrated Device Technology, Inc. All rights reserved.  
© 2018 Integrated Device Technology, Inc.  
2
January 22, 2018  

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