ICS83940BYLF [IDT]

Low Skew Clock Driver, 83940 Series, 18 True Output(s), 0 Inverted Output(s), PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MS-026BBA, LQFP-32;
ICS83940BYLF
型号: ICS83940BYLF
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Low Skew Clock Driver, 83940 Series, 18 True Output(s), 0 Inverted Output(s), PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MS-026BBA, LQFP-32

文件: 总13页 (文件大小:333K)
中文:  中文翻译
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DATA SHEET  
ICS83940  
LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL  
FANOUT BUFFER  
GENERAL DESCRIPTION  
FEATURES  
The ICS83940 is a low skew, 1-to-18 LVPECL-  
18 LVCMOS/LVTTL outputs, 16typical output impedance  
Selectable LVCMOS_CLK or LVPECL clock inputs  
ICS  
to-LVCMOS/LVTTL Fanout Buffer and a member  
of the HiPerClockS™ family of High Performance  
Clock Solutions from ICS.The ICS83940 has two  
selectable clock inputs. The PCLK, nPCLK pair  
HiPerClockS™  
PCLK, nPCLK supports the following input types:  
LVPECL, CML, SSTL  
can accept LVPECL, CML, or SSTL input levels. The  
LVCMOS_CLK can accept LVCMOS or LVTTL input levels.  
The low impedance LVCMOS/LVTTL outputs are designed to  
drive 50series or parallel terminated transmission lines.  
LVCMOS_CLK accepts the following input levels:  
LVCMOS or LVTTL  
Maximum output frequency: 250MHz  
Output skew: 150ps (maximum)  
The ICS83940 is characterized at full 3.3V, full 2.5V and mixed  
3.3V input and 2.5V output operating supply modes. Guaran-  
teed output and part-to-part skew characteristics make the  
ICS83940 ideal for those clock distribution applications de-  
manding well defined performance and repeatability.  
Part to part skew: 750ps (maximum)  
Full 3.3V or 2.5V supply modes  
0°C to 70°C ambient operating temperature  
Industrial temperature information available upon request  
Lead-Free package fully RoHS compliant  
Pin compatible with the MPC940L  
BLOCK DIAGRAM  
PIN ASSIGNMENT  
CLK_SEL  
32 31 30 29 28 27 26 25  
PCLK  
0
Q6  
1
2
3
4
5
6
7
8
24  
23  
22  
21  
20  
19  
18  
17  
GND  
GND  
nPCLK  
18  
Q7  
Q0:Q17  
1
Q8  
LVCMOS_CLK  
LVCMOS_CLK  
CLK_SEL  
PCLK  
VDD  
Q9  
ICS83940  
10 11 12 13 14 15 16  
32-Lead LQFP  
Q10  
Q11  
GND  
nPCLK  
VDD  
VDDO  
9
7mm x 7mm x 1.4mm package body  
Y Pacakge  
TopView  
IDT™ / ICS™ LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
ICS83940  
1
ICS83940  
TSD  
LOW SKEW, 1-TO-18LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
TABLE 1. PIN DESCRIPTIONS  
Number  
1, 2, 12, 17, 25  
3
Name  
GND  
Type  
Description  
Power  
Power supply ground.  
LVCMOS_CLK  
Input Pulldown Clock input. LVCMOS / LVTTL interface levels.  
Clock select input. Selects LVCMOS / LVTTL clock  
Input Pulldown input when HIGH. Selects PCLK, nPCLK inputs  
when LOW. LVCMOS / LVTTL interface levels.  
4
CLK_SEL  
5
6
PCLK  
nPCLK  
VDD  
Input Pulldown Non-inverting differential LVPECL clock input.  
Input  
Power  
Power  
Pullup Inverting differential LVPECL clock input.  
Core supply pins.  
7, 21  
8, 16, 29  
VDDO  
Output supply pins.  
9, 10, 11, 13, 14, Q17, Q16, Q15, Q14, Q13,  
15, 18, 19, 20, 22,  
23, 24, 26, 27, 28,  
30, 31, 32  
Q12, Q11, Q10, Q9, Q8,  
Q7, Q6, Q5, Q4, Q3,  
Q2, Q1, Q0  
Clock outputs. 16typical output impedance.  
LVCMOS / LVTTL interface levels.  
Output  
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.  
TABLE 2. PIN CHARACTERISTICS  
Symbol  
Parameter  
Test Conditions  
Minimum Typical Maximum Units  
CIN  
Input Capacitance  
4
pF  
pF  
pF  
K  
KΩ  
VDD, VDDO = 3.47  
VDD, VDDO = 2.625  
13  
11  
51  
51  
16  
Power Dissipation Capacitance  
(per output)  
CPD  
RPULLUP  
Input Pullup Resistor  
RPULLDOWN Input Pulldown Resistor  
ROUT Output Impedance  
11  
21  
TABLE 3A. CLOCK SELECT FUNCTION TABLE  
Control Input  
Clock  
CLK_SEL  
PCLK, nPCLK  
LVCMOS_CLK  
De-selected  
Selected  
0
1
Selected  
De-selected  
TABLE 3B. CLOCK INPUT FUNCTION TABLE  
Inputs  
Outputs  
Input to Output Mode  
Polarity  
CLK_SEL LVCMOS_CLK  
PCLK  
nPCLK  
Q0:Q17  
LOW  
0
0
0
1
1
0
Differential to Single Ended  
Differential to Single Ended  
Non Inverting  
Non Inverting  
HIGH  
Biased;  
NOTE 1  
Biased;  
NOTE 1  
0
0
0
1
LOW  
Single Ended to Single Ended Non Inverting  
Single Ended to Single Ended Non Inverting  
HIGH  
0
0
1
1
0
Biased; NOTE 1  
0
1
HIGH  
LOW  
LOW  
HIGH  
Single Ended to Single Ended  
Single Ended to Single Ended  
Inverting  
Inverting  
Biased; NOTE 1  
Single Ended to Single Ended Non Inverting  
Single Ended to Single Ended Non Inverting  
1
NOTE 1: Please refer to the Application Information section. "Wiring the Differential Input to Accept Single Ended Levels".  
IDT™ / ICS™ LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
ICS83940  
2
ICS83940  
TSD  
LOW SKEW, 1-TO-18LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
ABSOLUTE MAXIMUM RATINGS  
SupplyVoltage, V  
4.6V  
NOTE: Stresses beyond those listed under Absolute  
Maximum Ratings may cause permanent damage to the  
device.These ratings are stress specifications only.Functional  
operation of product at these conditions or any conditions be-  
yond those listed in the DC Characteristics or AC Character-  
istics is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect product reliability.  
DD  
Inputs, V  
-0.5V to VDD + 0.5 V  
-0.5V to VDDO + 0.5V  
47.9°C/W (0 lfpm)  
-65°C to 150°C  
I
Outputs, VO  
PackageThermal Impedance, θ  
JA  
StorageTemperature, T  
STG  
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDO = 3.3V 5ꢀ, TA = 0° TO 70°  
Symbol Parameter Test Conditions Minimum Typical Maximum Units  
VDD  
VDDO  
IDD  
Core Supply Voltage  
3.135  
3.135  
3.3  
3.3  
3.465  
3.465  
25  
V
Output Supply Voltage  
Power Supply Current  
Output Supply Current  
V
mA  
mA  
IDDO  
25  
TABLE 4B. DC CHARACTERISTICS, VDD = VDDO = 3.3V 5ꢀ, TA = 0° TO 70°  
Symbol Parameter  
Test Conditions  
Minimum Typical Maximum Units  
VIH  
VIL  
Input High Voltage  
LVCMOS_CLK  
LVCMOS_CLK  
2.4  
VDD  
0.8  
V
V
Input Low Voltage  
Peak-to-Peak  
Input Voltage  
Input Common Mode  
Voltage; NOTE 1, 2  
VPP  
PCLK, nPCLK  
PCLK, nPCLK  
300  
mV  
V
VCMR  
GND + 1.5  
VDD  
IIN  
Input Current  
200  
µA  
V
VOH  
VOL  
Output High Voltage  
Output Low Voltage  
IOH = -20mA  
IOL = 20mA  
2.4  
0.5  
V
NOTE 1: For single ended applications, the maximum input voltage for PCLK, nPCLK is VDD + 0.3V.  
NOTE 2: Common mode voltage is defined as VIH.  
IDT™ / ICS™ LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
ICS83940  
3
ICS83940  
TSD  
LOW SKEW, 1-TO-18LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
TABLE 5A. AC CHARACTERISTICS, VDD = VDDO = 3.3V 5ꢀ, TA = 0° TO 70°  
Symbol Parameter  
fMAX Output Frequency  
Test Conditions  
Minimum Typical Maximum Units  
250  
MHz  
PCLK, nPCLK;  
NOTE 1, 5  
LVCMOS_CLK;  
NOTE 2, 5  
PCLK, nPCLK;  
NOTE 1, 5  
LVCMOS_CLK;  
NOTE 2, 5  
f 150MHz  
f 150MHz  
f > 150MHz  
f > 150MHz  
2
3.4  
ns  
Propagation Delay;  
tpLH  
2.6  
2
3.8  
3.7  
4
ns  
ns  
ns  
Propagation Delay;  
tpLH  
2.6  
PCLK, nPCLK  
LVCMOS_CLK  
PCLK, nPCLK  
LVCMOS_CLK  
PCLK, nPCLK  
LVCMOS_CLK  
PCLK, nPCLK  
LVCMOS_CLK  
150  
150  
1.4  
1.2  
1.7  
1.4  
850  
750  
1.2  
1.2  
55  
ps  
ps  
ns  
ns  
ns  
ns  
ps  
ps  
ns  
ns  
Output Skew;  
NOTE 3, 5  
Measured on rising edge  
@VDDO/2  
tsk(o)  
f < 150MHz  
f < 150MHz  
f > 150MHz  
f > 150MHz  
Part-to-Part Skew;  
NOTE 6  
tsk(pp)  
tsk(pp)  
tsk(pp)  
Part-to-Part Skew;  
NOTE 6  
Part-to-Part Skew;  
NOTE 4, 5  
Measured on rising edge  
@VDDO/2  
tR  
Output Rise Time  
Output Fall Time  
Output Duty Cycle  
0.5 to 2.4V  
0.5 to 2.4V  
f < 134MHz  
0.3  
0.3  
45  
tF  
odc  
50  
All parameters measured at 200MHz unless noted otherwise.  
NOTE 1: Measured from the differential input crossing point to the output VDDO/2.  
NOTE 2: Measured from VDD/2 to VDDO/2.  
NOTE 3: Defined as skew between outputs at the same supply voltage and with equal load conditions.  
Measured at VDDO/2.  
NOTE 4: Defined as skew between outputs on different devices operating at the same supply voltages,  
same temperature, and with equal load conditions. Using the same type of inputs on each device, the  
outputs are measured at VDDO/2.  
NOTE 5: This parameter is defined in accordance with JEDEC Standard 65.  
NOTE 6: Defined as skew between outputs on different devices, across temperature and voltage ranges,  
and with equal load conditions. Using the same type of inputs on each device, the outputs are measured  
at VDDO/2.  
TABLE 4C. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDO = 2.5V 5ꢀ, TA = 0° TO 70°  
Symbol Parameter  
Test Conditions  
Minimum Typical Maximum Units  
VDD  
VDDO  
IDD  
Core Supply Voltage  
2.375  
2.375  
2.5  
2.5  
2.625  
2.625  
25  
V
Output Supply Voltage  
Power Supply Current  
Output Supply Current  
V
mA  
mA  
IDDO  
25  
IDT™ / ICS™ LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
ICS83940  
4
ICS83940  
TSD  
LOW SKEW, 1-TO-18LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
TABLE 4D. DC CHARACTERISTICS, VDD = VDDO = 2.5V 5ꢀ, TA = 0° TO 70°  
Symbol Parameter  
Test Conditions  
Minimum Typical Maximum Units  
VIH  
VIL  
Input High Voltage  
LVCMOS_CLK  
LVCMOS_CLK  
2
VDD  
0.8  
V
V
Input Low Voltage  
Peak-to-Peak  
Input Voltage  
Input Common Mode  
Voltage; NOTE 1, 2  
VPP  
PCLK, nPCLK  
PCLK, nPCLK  
300  
mV  
V
VCMR  
GND + 1.5  
VDD  
IIN  
Input Current  
200  
µA  
V
VOH  
VOL  
Output High Voltage  
Output Low Voltage  
IOH = -12mA  
IOL = 12mA  
1.8  
0.5  
V
NOTE 1: For single ended applications, the maximum input voltage for PCLK, nPCLK is VDD + 0.3V.  
NOTE 2: Common mode voltage is defined as VIH.  
TABLE 5B. AC CHARACTERISTICS, VDD = VDDO = 2.5V 5ꢀ, TA = 0° TO 70°  
Symbol Parameter  
fMAX Output Frequency  
Test Conditions  
Minimum Typical Maximum Units  
200  
MHz  
PCLK, nPCLK;  
NOTE 1, 5  
LVCMOS_CLK;  
NOTE 2, 5  
PCLK, nPCLK;  
NOTE 1, 5  
LVCMOS_CLK;  
NOTE 2, 5  
f 150MHz  
f 150MHz  
f > 150MHz  
f > 150MHz  
2
4.6  
ns  
Propagation Delay;  
tpLH  
2.7  
2.2  
2.7  
4.4  
4.4  
4.4  
ns  
ns  
ns  
Propagation Delay;  
tpLH  
PCLK, nPCLK  
LVCMOS_CLK  
PCLK, nPCLK  
LVCMOS_CLK  
PCLK, nPCLK  
LVCMOS_CLK  
PCLK, nPCLK  
LVCMOS_CLK  
200  
200  
2.6  
1.7  
2.2  
1.7  
1.2  
1.0  
1.2  
1.2  
55  
ps  
ps  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Output Skew;  
NOTE 3, 5  
Measured on rising edge  
@VDDO/2  
tsk(o)  
f < 150MHz  
f < 150MHz  
f > 150MHz  
f > 150MHz  
Part-to-Part Skew;  
NOTE 6  
tsk(pp)  
tsk(pp)  
tsk(pp)  
Part-to-Part Skew;  
NOTE 6  
Part-to-Part Skew;  
NOTE 4, 5  
Measured on rising edge  
@VDDO/2  
tR  
Output Rise Time  
Output Fall Time  
Output Duty Cycle  
0.5 to 1.8V  
0.5 to 1.8V  
f < 134MHz  
0.3  
0.3  
45  
tF  
odc  
All parameters measured at 200MHz unless noted otherwise.  
NOTE 1: Measured from the differential input crossing point to the output VDDO/2.  
NOTE 2: Measured from VDD/2 to VDDO/2.  
NOTE 3: Defined as skew between outputs at the same supply voltage and with equal load conditions.  
Measured at VDDO/2.  
NOTE 4: Defined as skew between outputs on different devices operating at the same supply voltages,  
same temperature, and with equal load conditions. Using the same type of inputs on each device, the  
outputs are measured at VDDO/2.  
NOTE 5: This parameter is defined in accordance with JEDEC Standard 65.  
NOTE 6: Defined as skew between outputs on different devices, across temperature and voltage ranges,  
and with equal load conditions. Using the same type of inputs on each device, the outputs are measured  
at VDDO/2.  
IDT™ / ICS™ LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
ICS83940  
5
ICS83940  
TSD  
LOW SKEW, 1-TO-18LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
PARAMETER MEASUREMENT INFORMATION  
1.25V 5ꢀ  
1.65V 5ꢀ  
SCOPE  
SCOPE  
VDD  
VDDx  
,
VDD,  
VDDx  
Qx  
Qx  
LVCMOS  
GND  
LVCMOS  
GND  
-1.65V 5ꢀ  
-1.25V 5ꢀ  
3.3V OUTPUT LOAD AC TEST CIRCUIT  
2.5V OUTPUT LOAD AC TEST CIRCUIT  
VDD  
VDDx  
Qx  
2
nPCLK  
VPP  
VCMR  
Cross Points  
VDDx  
PCLK  
Qy  
2
tsk(o)  
GND  
DIFFERENTIAL INPUT LEVEL  
OUTPUT SKEW  
PART 1  
VDDx  
2.4V  
tF  
2.4V  
Qx  
2
0.5V  
0.5V  
Clock  
Outputs  
PART 2  
Qy  
VDDx  
2
tR  
tsk(pp)  
PART-TO-PART SKEW  
3.3V OUTPUT RISE/FALL TIME  
VDD  
2
LVCMOS_CLK  
nPCLK  
PCLK  
1.8V  
tF  
1.8V  
0.5V  
0.5V  
Clock  
tR  
Outputs  
VDDx  
2
Q0:Q17  
tPD  
2.5V OUTPUT RISE/FALL TIME  
PROPAGATION DELAY  
IDT™ / ICS™ LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
ICS83940  
6
ICS83940  
TSD  
LOW SKEW, 1-TO-18LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
APPLICATION INFORMATION  
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS  
of R1 and R2 might need to be adjusted to position theV_REF in  
the center of the input voltage swing. For example, if the input  
clock swing is only 2.5V andVDD = 3.3V, V_REF should be 1.25V  
and R2/R1 = 0.609.  
Figure 1 shows how the differential input can be wired to accept  
single ended levels. The reference voltage V_REF = VDD/2 is  
generated by the bias resistors R1, R2 and C1.This bias circuit  
should be located as close as possible to the input pin.The ratio  
VDD  
R1  
1K  
Single Ended Clock Input  
V_REF  
PCLK  
nPCLK  
C1  
0.1u  
R2  
1K  
FIGURE 1. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT  
IDT™ / ICS™ LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
ICS83940  
7
ICS83940  
TSD  
LOW SKEW, 1-TO-18LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
LVPECL CLOCK INPUT INTERFACE  
The PCLK /nPCLK accepts LVPECL, CML, SSTL and other here are examples only. If the driver is from another vendor,  
differential signals. Both VSWING and VOH must meet the VPP use their termination recommendation. Please consult with  
and VCMR input requirements. Figures 2A to 2E show interface the vendor of the driver component to confirm the driver ter-  
examples for the HiPerClockS PCLK/nPCLK input driven by mination requirements.  
the most common driver types.The input interfaces suggested  
2.5V  
3.3V  
3.3V  
3.3V  
2.5V  
3.3V  
R3  
120  
R4  
120  
R1  
50  
R2  
50  
SSTL  
Zo = 60 Ohm  
Zo = 60 Ohm  
CML  
Zo = 50 Ohm  
Zo = 50 Ohm  
PCLK  
PCLK  
nPCLK  
HiPerClockS  
PCLK/nPCLK  
nPCLK  
HiPerClockS  
R1  
120  
R2  
120  
PCLK/nPCLK  
FIGURE 2A. HIPERCLOCKS PCLK/NPCLK INPUT DRIVEN  
BY A CML DRIVER  
FIGURE 2B. HIPERCLOCKS PCLK/NPCLK INPUT DRIVEN  
BY AN SSTL DRIVER  
3.3V  
3.3V  
3.3V  
3.3V  
3.3V  
3.3V  
R3  
125  
R4  
125  
Zo = 50 Ohm  
R3  
1K  
R4  
1K  
C1  
C2  
Zo = 50 Ohm  
Zo = 50 Ohm  
LVDS  
PCLK  
PCLK  
R5  
100  
nPCLK  
Zo = 50 Ohm  
HiPerClockS  
PCLK/nPCLK  
nPCLK  
HiPerClockS  
Input  
LVPECL  
R1  
1K  
R2  
1K  
R1  
84  
R2  
84  
FIGURE 2C. HIPERCLOCKS PCLK/NPCLK INPUT DRIVEN  
BY A 3.3V LVPECL DRIVER  
FIGURE 2D. HIPERCLOCKS PCLK/NPCLK INPUT DRIVEN  
BY A 3.3V LVDS DRIVER  
3.3V  
3.3V  
3.3V  
R3  
84  
R4  
84  
C1  
C2  
3.3V LVPECL  
Zo = 50 Ohm  
Zo = 50 Ohm  
PCLK  
nPCLK  
HiPerClockS  
PCLK/nPCLK  
R5  
100 - 200  
R6  
100 - 200  
R1  
125  
R2  
125  
FIGURE 2E. HIPERCLOCKS PCLK/NPCLK INPUT DRIVEN  
BY A 3.3V LVPECL DRIVER WITH AC COUPLE  
IDT™ / ICS™ LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
ICS83940  
8
ICS83940  
TSD  
LOW SKEW, 1-TO-18LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
RELIABILITY INFORMATION  
TABLE 6. θJAVS. AIR FLOW TABLE FOR 32 LEAD LQFP  
θJA byVelocity (Linear Feet per Minute)  
0
200  
55.9°C/W  
42.1°C/W  
500  
50.1°C/W  
39.4°C/W  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
67.8°C/W  
47.9°C/W  
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.  
TRANSISTOR COUNT  
The transistor count for ICS83940 is: 820  
IDT™ / ICS™ LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
ICS83940  
9
ICS83940  
TSD  
LOW SKEW, 1-TO-18LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
PACKAGE OUTLINE - Y SUFFIX FOR 32 LEAD LQFP  
TABLE 7. PACKAGE DIMENSIONS  
JEDEC VARIATION  
ALL DIMENSIONS IN MILLIMETERS  
BBA  
SYMBOL  
MINIMUM  
NOMINAL  
MAXIMUM  
N
A
32  
--  
--  
--  
1.60  
0.15  
1.45  
0.45  
0.20  
A1  
A2  
b
0.05  
1.35  
0.30  
0.09  
1.40  
0.37  
c
--  
D
9.00 BASIC  
7.00 BASIC  
5.60 Ref.  
9.00 BASIC  
7.00 BASIC  
5.60 Ref.  
0.80 BASIC  
0.60  
D1  
D2  
E
E1  
E2  
e
L
0.45  
0.75  
θ
--  
0°  
7°  
ccc  
--  
--  
0.10  
REFERENCE DOCUMENT:JEDEC PUBLICATION 95, MS-026  
IDT™ / ICS™ LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
ICS83940  
10  
ICS83940  
TSD  
LOW SKEW, 1-TO-18LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
TABLE 8. ORDERING INFORMATION  
Part/Order Number  
ICS83940BY  
Marking  
Package  
Count  
250 per tray  
1000  
Temperature  
0°C to 70°C  
0°C to 70°C  
0°C to 70°C  
ICS83940BY  
ICS83940BY  
ICS83940BYLF  
32 Lead LQFP  
ICS83940BYT  
ICS83940BYLF  
32 Lead LQFP on Tape and Reel  
32 Lead "Lead-Free" LQFP  
250 per tray  
32 Lead "Lead-Free" LQFP on  
Tape and Reel  
ICS83940BYLFT  
ICS83940BYLF  
1000  
0°C to 70°C  
The aforementioned trademark, HiPerClockS™ is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.  
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use  
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use  
in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements  
are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS  
product for use in life support devices or critical medical instruments.  
IDT™ / ICS™ LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
ICS83940  
11  
ICS83940  
TSD  
LOW SKEW, 1-TO-18LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
REVISION HISTORY SHEET  
Rev  
Table  
Page  
Description of Change  
Date  
A
T2  
2
1
2
CPD Value changed from 10pF to 13pF for 3.47V and added 11pF for 2.625V  
In Features section, first bullet changed Output Impedance from 23to 16Ω.  
T1 Pin Description, changed Q outputs description from 23to 16output  
impedanace.  
4/25/02  
A
A
5/23/02  
Updated format.  
12/12/02  
T5A  
T8  
4
7
3V AC Characteristics - corrected Part-to-Part Skew (f<150MHz) unit from  
ps to ns.  
A
A
3/17/04  
Updated Single Ended Signal Driving Differential Input diagram.  
8
1
11  
Added LVPECL Input Interface section.  
Features Section - added Lead-Free bullet.  
Ordering Information Table - added Lead-Free part number.  
12/14/04  
IDT™ / ICS™ LOW SKEW, 1-TO-18 LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
ICS83940  
12  
83940
LOWSKEW,1-TO-18LVPECL-TO-LVCMOS/LVTTL FANOUT BUFFER  
Innovate with IDT and accelerate your future networks. Contact:  
www.IDT.com  
For Sales  
800-345-7015  
408-284-8200  
Fax: 408-284-2775  
For Tech Support  
clockhelp@idt.com  
408-284-8200  
Corporate Headquarters  
Integrated Device Technology, Inc.  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
United States  
800 345 7015  
Asia Pacific and Japan  
Integrated Device Technology  
Singapore (1997) Pte. Ltd.  
Reg. No. 199707558G  
435 Orchard Road  
#20-03 Wisma Atria  
Singapore 238877  
Europe  
IDT Europe, Limited  
Prime House  
Barnett Wood Lane  
Leatherhead, Surrey  
United Kingdom KT22 7DE  
+44 1372 363 339  
+408 284 8200 (outside U.S.)  
+65 6 887 5505  
© 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device  
Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered  
trademarks used to identify products or services of their respective owners.  
Printed in USA  
XX-XXXX-XXXXX  

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