ICS9169CM-232LF [IDT]

Processor Specific Clock Generator, 83.3MHz, PDSO28, SOIC-28;
ICS9169CM-232LF
型号: ICS9169CM-232LF
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Processor Specific Clock Generator, 83.3MHz, PDSO28, SOIC-28

时钟 光电二极管 外围集成电路 晶体
文件: 总8页 (文件大小:336K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Integrated  
Circuit  
Systems, Inc.  
ICS9169C-232  
Frequency Generator for Pentium™ Based Systems  
General Description  
Features  
Strong output drive.  
The ICS9169C-232 is a low-cost frequency generator  
designed specifically for Pentium and Pentium-Pro based  
chip set systems. The integrated buffer minimizes skew  
and provides all the clocks required. A 14.318 MHz XTAL  
oscillator provides the reference clock to generate standard  
Pentium frequencies. The CPU clock makes gradual  
frequency transitions without violating the PLL timing of  
internal microprocessor clock multipliers. A raised  
frequency setting of 68.5 MHz is available for Turbo-mode  
of the 66.8 MHz CPU. The ICS9169C-232 contains 8 CPU  
clocks, 6 PCI clocks, 1 REF at 48MHz and 1 at 24MHz.  
Eight selectable CPU clocks operate up to 83.3 MHz  
Frequency selections include Turbo-mode speed of 68.5  
MHz  
Maximum CPU jitter of ±200ps  
Six BUS clocks support sync or async bus operation  
250ps skew window for CPU outputs, 500ps skew window for  
BUS outputs  
CPU clocks to BUS clocks skew 1-4 ns (CPU early)  
48 MHz clock for USB support & 24 MHz clock for FD.  
Logic inputs latched at Power-On for frequency selection  
saving pins as Input/Output  
Integrated buffer outputs drive up to 30pF loads  
3.0V - 3.7V supply range, CPU (1:6) outputs 2.5V  
(2.375 - 2.6V) VDD option  
Either synchronous (CPU/2) or asynchronous (32 MHz)  
PCI bus operation can be selected by latching data on  
BSEL input.  
28-pin SOIC or SSOP package  
Block Diagram  
Pin Configuration  
28-Pin SOIC or SSOP  
Functionality  
3.3V±10%, 0-70°C  
Crystal (X1, X2) = 14.31818 MHz  
ADDRESS  
SELECT  
CPU(1:8)  
(MHz)  
BUS (1:6)MHz  
48MHz 24MHz REF  
FS2 FS1 FS0  
BSEL=1 BSEL=0  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
50  
60  
25  
30  
32  
32  
32  
32  
32  
32  
32  
32  
48  
48  
48  
48  
48  
48  
48  
48  
24  
24  
24  
24  
24  
24  
24  
24  
REF  
REF  
REF  
REF  
REF  
REF  
REF  
REF  
VDD Groups:  
Latched Inputs:  
L1 = BSEL  
L2 = FS0  
VDD1 = X1, X2, REF/BSEL  
VDD2 = CPU1-6  
66.8  
75.9  
55  
33.4  
32  
VDD3 = CPU7-8 & PLL Core  
VDD4 = BUS1-6  
VDD5 = 48/24 MHz  
L3 = FS1  
27.5  
37.5  
41.7  
34.25  
L4 = FS2  
75.9  
83.3  
68.5  
Pentium is a trademark of Intel Corporation.  
9169C-232RevB031897  
ICS reserves the right to make changes in the device data identified in this  
publication without further notice. ICS advises its customers to obtain the latest  
version of all device data to verify that any information being relied upon by the  
customer is current and accurate.  
ICS169C-232  
Pin Descriptions  
PIN NUMBER  
PIN NAME  
TYPE  
DESCRIPTION  
Power for control logic and crystal oscillator circuit and  
14.318 MHz output  
1
VDD1  
X1  
PWR  
XTAL or external reference frequency input. This input includes XTAL  
load capacitance and feedback bias for a 12-16MHz crystal, nominally  
14.31818MHz. External crystal load of 30pF to GND recommended for  
VDD power on faster than 2.0ms.  
2
IN  
XTAL output which includes XTAL load capacitance. External crystal  
load of 10pF to GND recommended for VDD power on faster than 2.0ms.  
3
X2  
OUT  
PWR  
OUT  
4,11,16,22  
6,7,9,10,15  
GND  
Ground for control logic.  
Processor clock outputs which are a multiple of the input reference clock  
as shown in the preceding table.  
CPU(2,3,4,5,8)  
CPU1, CPU6,  
CPU7  
Processor clock outputs which are a multiple of the input reference clock  
as shown in the preceding table.  
5,12,13  
OUT  
IN  
Frequency multiplier select pins. See shared pin programming description  
later in this data sheet for further explanation. 350K* internal pull up.  
5,12,13  
FS (0:2)  
VDD2  
Power for CPU (1:6) clock buffers only. This VDD supply can be reduced  
to 2.5V for CPU (1:6) outputs.  
8
14  
PWR  
PWR  
OUT  
Power for CPU (7:8) clock buffers and internal PLL and Core logic. Must  
be nominal 3.3V (3.0 to 3.7V)  
VDD3  
BUS clock outputs which are a multiple of the input reference clock as  
shown in the preceding table.  
17,18,20,21,23, 24  
BUS(1:6)  
19  
25  
26  
27  
VDD4  
PWR  
PWR  
OUT  
OUT  
Power for BUS clock buffers BUS (1;6)  
VDD5  
Power for fixed clock buffer (48 MHz, 24 MHz)  
24 MHz  
48 MHz  
Fixed 24 MHz clock (assuming a 14.31818 MHz REF frequency).  
Fixed 48 MHz clock (assuming a 14.31818 MHz REF frequency).  
REF  
OUT  
Fixed 14.31818 MHz clock (assuming a 14.31818 MHz REF frequency).  
28  
Selection for synchronous or asynchronous bus clock operation. 350K*  
internal pull up.  
BSEL  
IN  
* The internal pull up will vary from 350K to 500K based on temperature  
2
ICS169C-232  
Shared Pin Operation -  
Input/Output Pins  
Test Mode Operation  
The ICS9169C-232 includes a production test verification  
mode of operation. This requires that the FS0 and FS1 pins  
be programmed to a logic high and the FS2 pin be  
programmed to a logic low(see Shared Pin Operation  
section). In this mode the device will output the following  
frequencies.  
Shared Pin Operation - Input/Output, Pins 5, 28, 12 and  
13 on the ICS9169C-232 serve as dual signal functions to  
the device. During initial power-up, they act as input pins.  
The logic level (voltage) that is present on these pins at  
this time is read and stored into a 4-bit internal data latch.  
At the end of Power-On reset, (see AC characteristics for  
timing values), the device changes the mode of operations  
for these pins to an output function. In this mode the pins  
produce the specified buffered clocks to external loads.  
Pin  
Frequency  
REF  
REF/2  
REF/4  
REF2  
REF/4  
REF/3  
REF  
48MHz  
24MHz  
CPU (1:8)  
To program (load) the internal configuration register for  
these pins, a resistor is connected to either the VDD (logic  
1) power supply or the GND (logic 0) voltage potential. A  
10 Kilohm(10K) resistor is used to provide both the solid  
CMOS programming voltage needed during the power-up  
programming period and to provide an insignificant load  
on the output clock during the subsequent operating  
period.  
BSEL=1  
BESEL = 0  
BUS (1:6)  
Note: REF is the frequency of either the crystal connected  
between the devices X1and X2 or, in the case of a device  
being driven by an external reference clock, the frequency  
of the reference (or test) clock on the device’s X1 pin.  
Figs. 1 and 2 show the recommended means of  
implementing this function. In Fig. 1 either one of the  
resistors is loaded onto the board (selective stuffing) to  
configure the devices internal logic. Figs. 2a and b provide  
a single resistor loading option where either solder spot  
tabs or a physical jumper header may be used.  
These figures illustrate the optimal PCB physical layout  
options. These configuration resistors are of such a large  
ohmic value that they do not effect the low impedance  
clock signals. The layouts have been optimized to provide  
as little impedance transition to the clock signal as possible,  
as it passes through the programming resistor pad(s).  
Fig. 1  
3
ICS169C-232  
Fig. 2b  
Fig. 2a  
Fig. 3  
4
ICS169C-232  
Technical Pin Function Descriptions  
VDD1  
BUS (1:6)  
This is the power supply to the internal logic of the device  
as well as the following clock output buffers:  
This pin is the clock output that is intended to drive the  
systems plug-in card bus. The voltage swing of these  
clocks is controlled by the supply that is applied to the  
VDD pin of the device. See the Functionality table at the  
beginning of this data sheet for a list of the specific  
frequencies that this clock operates at and the selection  
codes that are necessary to produce these frequencies.  
A. REF clock output buffers  
B. BUS clock output buffers  
C. Fixed clock output buffers  
This pin may be operated at any voltage between 3.0 and  
5.5 volts. Clocks from the listed buffers that it supplies  
will have a voltage swing from ground to this level. For the  
actual guaranteed high and low voltage levels of these  
clocks, please consult the AC parameter table in this data  
sheet.  
FS0, FS1, FS2  
These pins control the frequency of the clocks at the CPU,  
CPUL, BUS, SDRAM, AGP and IOAPIC pins. See the Fun-  
tionality table at the beginning of this data sheet for a list  
of the specific frequencies that this clock operates at and  
the selection codes that are necessary to produce these  
frequencies. The device reads these pins at power-up and  
stores the programmed selection code in an internal data  
latch. (See programming section of this data sheet for  
configuration circuitry recommendations.  
GND  
This is the power supply ground return pin for the internal  
logic of the device as well as the following clock output  
buffers:  
A. REF clock output buffers  
B. BUS clock output buffers  
C. CPU clock output buffers  
BSEL  
When this pin is a logic 1, it will place the CPU clocks in  
the synchronous mode (running at half the frequency of  
the Ref). If this pin is a logic 0, it will be in the asynchronous  
mode for the CPU clocks and will operate at the  
preprogrammed fixed frequency rate. It is a shared pin  
and is programed the same way as the Frequency Select  
pins.  
X1  
This pin serves one of two functions. When the device is  
used with a crystal, X1 acts as the input pin for the  
reference signal that comes from the discrete crystal.  
When the device is driven by an external clock signal, X1  
is the device’ input pin for that reference clock. This pin  
also implements an internal crystal loading capacitor that  
is connected to ground. See the data tables for the value of  
the capacitor.  
VDD 2, 3  
These are the power supply pins for the CPU clock buffers.  
By separating the clock power pins, each group can receive  
the appropriate power decoupling and bypassing necessary  
tominimizeEMIandcrosstalkbetweentheindividualsignals.  
VDD2 can be reduced to 2.5V VDD for advanced processor  
clocks, which will bring CPU (1:6) outputs at 0 to 2.5V output  
swings.  
X2  
This pin is used only when the device uses a Crystal as the  
reference frequency source. In this mode of operation, X2  
is an output signal that drives (or excites) the discrete  
crystal. This pin also implements an internal crystal loading  
capacitor that is connected to ground. See the data tables  
for the value of the capacitor.  
48 MHz  
This is a fixed frequency clock that is typically used to  
drive Super I/O peripheral device needs.  
CPU (1:8)  
24 MHz  
This pin is the clock output that drives processor and other  
CPU related circuitry that require clocks which are in tight  
skew tolerance with the CPU clock. The voltage swing of  
these clocks is controlled by that which is applied to the  
VDD pin of the device. See the Functionality table at the  
beginning of this data sheet for a list of the specific  
frequencies this clock operates at and the selection codes  
that are necessary to produce these frequencies.  
This is a fixed frequency clock that is typically used to  
drive Keyboard controller clock needs.  
VDD4  
This power pin supplies the BUS clock buffers.  
REF  
This is a fixed frequency clock that runs at the same  
frequency as the input reference clock (typically 14.31818  
MHz) is and typically used to drive Video and ISA BUS  
requirements.  
VDD5  
This power pin supplies the 48/24 MHz clocks.  
5
ICS169C-232  
Absolute Maximum Ratings  
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0 V  
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND –0.5 V to VDD +0.5 V  
Ambient Operating Temperature . . . . . . . . . . 0°C to +70°C  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C  
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings  
are stress specifications only and functional operation of the device at these or any other conditions above those listed  
in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for  
extended periods may affect product reliability.  
Electrical Characteristics at 3.3V  
VDD = 3.0 – 3.7V, TA = 0 70°C unless otherwise stated  
DC Characteristics  
PARAMETER  
SYMBOL TEST CONDITIONS  
MIN  
-
TYP  
-
MAX  
UNITS  
V
IL  
V
DD  
0.2V  
Input Low Voltage  
Input High Voltage  
Input Low Current  
Input High Current  
Output Low Current1  
Output High Current1  
Output Low Current1  
Output High Current1  
Output Low Voltage1  
Output High Voltage1  
Output Low Voltage1  
Output High Voltage1  
Supply Current  
IH  
DD  
V
0.7V  
-28.0  
-5.0  
19.0  
-
-
-
-
V
IL  
IN  
= 0V  
I
V
-10.5  
-
µA  
µA  
mA  
mA  
mA  
mA  
V
IH  
IN  
V
DD  
= V  
I
5.0  
-
OL  
OL  
I
V
= 0.8V; for CPU, BUS, REF CLKs  
= 2.0V; for CPU, BUS, REF CLKs  
= 0.8V; for fixed CLKs  
OL  
= 2.0V; for fixed CLKs  
30.0  
-38.0  
25.0  
-30.0  
0.3  
2.8  
0.3  
2.8  
70  
OH  
OL  
OL  
V
I
-16.0  
-
OL  
V
I
16.0  
-
OH  
I
V
-14.0  
0.4  
-
OL  
OL  
V
I
I
= 10mA; for CPU, BUS, REF CLKs  
OH  
= -15mA; for CPU, BUS, REF CLKs  
-
OH  
V
2.4  
-
V
OL  
V
IOL = 8mA; for fixed CLKs  
0.4  
-
V
OH  
OH  
V
I
= -8mA; for fixed CLKs  
2.4  
-
V
DD  
I
@66.6 MHz; all outputs unloaded  
140  
mA  
Note 1: Parameter is guaranteed by design and characterization. Not 100% tested in production.  
6
ICS169C-232  
Electrical Characteristics at 3.3V  
VDD = 3.0 – 3.7 V, TA = 0 – 70°C unless otherwise stated  
AC Characteristics  
PARAMETER  
Rise Time1  
SYMBOL TEST CONDITIONS  
MIN  
TYP  
0.9  
0.8  
1.5  
1.4  
50  
MAX  
1.5  
UNITS  
ns  
20pF load, 0.8 to 2.0V  
CPU & BUS  
20pF load, 2.0 to 0.8V  
CPU & BUS  
20pF load, 20% to 80%  
CPU & BUS  
20pF load, 80% to 20%  
CPU & BUS  
Tr1  
Tf1  
Tr2  
Tf2  
Dt  
-
-
Fall Time1  
1.4  
ns  
Rise Time1  
-
2.5  
ns  
Fall Time1  
-
2.4  
ns  
Duty Cycle1  
Jitter, One Sigma1  
20pF load @ VOUT=1.4V  
45  
-
60  
%
CPU & BUS Clocks; Load=20pF,  
BSEL=1  
Tj1s1  
50  
150  
ps  
CPU & BUS Clocks; Load=20pF,  
BSEL=1  
Jitter, Absolute1  
Tjab1  
Tj1s2  
Tjab2  
Fi  
-250  
-
250  
ps  
%
Jitter, One Sigma1  
Jitter, Absolute1  
REF & Fixed CLKs; Load=20pF  
-
1
2
3
5
REF & Fixed CLKs; Load=20pF  
-5  
%
Input Frequency1  
12.0  
14.318  
5
16.0  
-
MHz  
pF  
Logic Input Capacitance1  
Crystal Oscillator Capacitance1  
Power-on Time1  
CIN  
CINX  
ton  
Logic input pins  
X1, X2 pins  
-
-
-
18  
-
pF  
From VDD=1.6V to 1st crossing of  
66.6 MHz VDD supply ramp < 40ms  
From 1st crossing of acquisition to <  
1% settling  
2.5  
4.5  
ms  
Frequency Settling Time1  
Clock Skew1  
ts  
-
-
2.0  
150  
160  
2.6  
4.0  
250  
500  
4
ms  
ps  
ps  
ns  
Tsk1  
Tsk2  
Tsk3  
CPU to CPU; Load=20pF; @1.4V  
BUS & BUS; Load=20pF; @1.4V  
Clock Skew1  
-
CPU to BUS; Load=20pF; @1.4V  
(CPU is early)  
Clock Skew1  
1
Note 1: Parameter is guaranteed by design and characterization. Not 100% tested in production.  
7
ICS169C-232  
SSOP Package  
SOIC Package  
COMMON  
D
SSOP  
DIMENSIONS  
SSOP  
SYMBOL  
VARIATIONS  
MIN.  
0.068  
0.002  
NOM.  
MAX.  
0.078  
MIN.  
NOM.  
0.244  
MAX.  
0.249  
A
A1  
A2  
B
C
D
E
0.073  
0.005  
0.068  
0.012  
0.006  
14  
16  
20  
24  
28  
30  
0.239  
0.239  
0.278  
0.318  
0.397  
0.397  
0.008  
0.070  
0.015  
0.008  
0.244  
0.284  
0.323  
0.402  
0.402  
0.249  
0.289  
0.328  
0.407  
0.407  
0.066  
0.010  
0.004  
See Variations  
0.209  
0.205  
0.212  
e
H
L
0.0256 BSC  
0.307  
0.301  
0.025  
0.311  
0.037  
0.030  
N
See Variations  
4°  
0°  
8°  
Ordering Information  
ICS9169CF-232  
SOIC Package (wide body)  
e = 0.05 BSC  
ICS9169CM-232  
LEAD COUNT  
DIMENSION L  
14L  
16L  
18L  
20L  
0.504  
24L  
28L  
0.704  
32L  
Example:  
0.354  
0.404  
0.454  
0.604  
0.804  
ICS XXXX F- PPP  
ICS reserves the right to make changes in the device data identified in this  
publication without further notice. ICS advises its customers to obtain the latest  
version of all device data to verify that any information being relied upon by the  
customer is current and accurate.  
8

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