IDT7052S25PFI [IDT]

Four-Port SRAM, 2KX8, 25ns, CMOS, PQFP120, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-120;
IDT7052S25PFI
型号: IDT7052S25PFI
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Four-Port SRAM, 2KX8, 25ns, CMOS, PQFP120, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-120

静态存储器 内存集成电路
文件: 总11页 (文件大小:112K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IDT7052S/L  
HIGH-SPEED  
2K x 8 FourPortTM  
STATIC RAM  
Features  
Battery backup operation2V data retention  
TTL-compatible; single 5V (±10%) power supply  
High-speed access  
– Commercial:20/25/35ns (max.)  
Industrial:25ns (max.)  
Available in 120 pin and 132 pin Thin Quad Flatpacks and  
108 pin PGA  
Military product compliant to MIL-PRF-38535 QML  
Industrial temperature range (–40°C to +85°C) is available  
for selected speeds  
Military:25/35ns(max.)  
Low-power operation  
IDT7052S  
Active:750mW(typ.)  
Standby: 7.5mW (typ.)  
IDT7052L  
Green parts available, see ordering information  
Active:750mW(typ.)  
Standby: 1.5mW (typ.)  
True FourPort memory cells which allow simultaneous  
access of the same memory locations  
Fully asynchronous operation from each of the four ports:  
Description  
TheIDT7052isahigh-speed2Kx8FourPort™StaticRAMdesigned  
to be used in systems where multiple access into a common RAM is  
required.ThisFourPortStaticRAMoffersincreasedsystemperformance  
inmultiprocessorsystemsthathaveaneedtocommunicateinrealtimeand  
alsooffersaddedbenefitforhigh-speedsystemsinwhichmultipleaccess  
is requiredinthe same cycle.  
P1, P2, P3, P4  
Versatile control for write-inhibit: separate BUSY input to  
control write-inhibit for each of the four ports  
FunctionalBlockDiagram  
R/WP1  
CEP1  
R/WP4  
CEP4  
OEP1  
OEP4  
COLUMN  
I/O  
COLUMN  
I/O0P1-I/O7P1  
BUSYP1  
I/O0P4-I/O7P4  
I/O  
BUSYP4  
PORT 1  
PORT 4  
ADDRESS  
DECODE  
LOGIC  
ADDRESS  
A0P1 - A10P1  
A0P4 - A10P4  
DECODE  
LOGIC  
MEMORY  
ARRAY  
PORT 2  
ADDRESS  
DECODE  
LOGIC  
PORT 3  
ADDRESS  
DECODE  
LOGIC  
A0P2 - A10P2  
A0P3 - A10P3  
BUSYP2  
BUSYP3  
COLUMN  
I/O  
COLUMN  
I/O  
I/O0P2-I/O7P2  
I/O0P3-I/O7P3  
OEP2  
OEP3  
CEP2  
R/WP2  
CEP3  
R/WP3  
2674 drw 01  
JULY 2006  
1
DSC 2674/12  
©2006IntegratedDeviceTechnology,Inc.  
IDT7052S/L  
High-Speed 2K x 8 FourPort™ Static RAM  
Military, Industrial and Commercial Temperature Ranges  
TheIDT7052is alsodesignedtobeusedinsystems whereon-chip  
Fabricated using IDTs CMOS high-performance technology, this  
hardware port arbitration is not needed. This part lends itself to those FourPortSRAMtypicallyoperatesononly750mWofpower.Low-power  
systems whichcannottoleratewaitstates oraredesignedtobeableto (L)versionsofferbatterybackupdataretentioncapability,witheachport  
externallyarbitrateorwithstandcontentionwhenallportssimultaneously typicallyconsuming50µWfroma2Vbattery.  
accessthesameFourPortRAMlocation.  
TheIDT7052ispackagedinaceramic108-pinPinGridArray(PGA),  
TheIDT7052providesfourindependentportswithseparatecontrol, 120-pinThinQuadFlatpack(TQFP)and132-pinPlasticQuadFlatpack  
address,andI/Opinsthatpermitindependent, asynchronousaccessfor (PQF).Militarygradeproductismanufacturedincompliancewiththelatest  
readsorwritestoanylocationinmemory.Itistheusersresponsibilityto revision of MIL-PRF-38535 QML, making it ideally suited to military  
ensuredataintegritywhensimultaneouslyaccessingthesamememory temperatureapplicationsdemandingthehighestlevelofperformanceand  
locationfromallports.Anautomaticpowerdownfeature,controlledbyCE, reliability.  
permitstheon-chipcircuitryofeachporttoenteraverylowpowerstandby  
powermode.  
PinConfigurations(1,2,3)  
11/07/01  
81  
80  
83  
86  
88  
91  
94  
97  
77  
78  
82  
85  
89  
93  
98  
74  
76  
79  
72  
73  
75  
69  
70  
71  
68  
67  
66  
65  
64  
62  
63  
61  
58  
60  
59  
55  
52  
48  
44  
57  
56  
51  
49  
46  
43  
40  
37  
34  
32  
29  
54  
R/W  
P2  
NC  
A
P2  
7
A
P2  
5
A
P2  
3
A
P2  
0
A
P3  
3
A
P3  
5
A
P3  
7
R/W  
P3  
NC  
A
P3  
0
12  
11  
84  
53  
BUSY  
OE  
P2  
OE  
P3  
BUSY  
A
P2  
8
A10  
A4  
A
1
A1  
A
P3  
4
A10  
A
P3  
8
P2  
P3  
P2  
P2  
P2  
P3  
P3  
87  
90  
92  
95  
96  
99  
50  
47  
45  
42  
41  
38  
CE  
A2  
A
1
A
9
A
6
A2  
A2  
A
6
A
P3  
9
A1  
A2  
10  
09  
08  
07  
06  
05  
04  
03  
02  
01  
CE  
P3  
P1  
P1  
P2  
P2  
P2  
P3  
P3  
P4  
P4  
A5  
A3  
A0  
P1  
A
P4  
0
A3  
A5  
P4  
P1  
P1  
P4  
A
6
A
P1  
4
A
P4  
4
A6  
A10  
P4  
A
10  
P1  
P1  
P4  
8
GND  
A
A7  
P4  
A8  
A7  
P1  
VCC  
IDT7052G  
G108-1(4)  
P4  
P1  
39  
CE  
P4  
A9  
P4  
NC  
CE  
P1  
A9  
NC  
108-Pin PGA  
Top View(5)  
P1  
100  
102  
35  
OE  
P4  
OE  
P1  
GND  
R/W  
R/W  
I/O  
0
P4  
P1  
P1  
101  
103  
106  
31  
36  
BUSY  
7
BUSY  
GND  
GND  
I/O  
I/O  
1
P1  
P1  
P4  
P4  
104  
105  
1
5
6
4
7
8
12  
17  
21  
25  
22  
20  
28  
24  
23  
33  
I/O  
5
I/O  
2
P1  
I/O  
3
P1  
I/O  
6
I/O  
2
I/O  
6
GND  
V
CC  
V
CC  
GND  
VCC  
VCC  
P4  
P1  
P4  
P4  
107  
2
3
10  
13  
16  
19  
30  
I/O  
4
P1  
I/O  
7
P1  
I/O  
0
I/O  
2
I/O  
4
I/O  
6
I/O  
3
I/O  
5
I/O  
P3  
7
I/O  
3
P4  
I/O  
P4  
4
I/O  
P3  
1
P2  
P2  
P2  
P2  
P3  
P3  
108  
9
11  
14  
15  
18  
26  
27  
I/O  
P2  
1
I/O  
P2  
5
I/O  
P3  
4
I/O  
P1  
5
NC  
B
I/O  
P2  
3
I/O  
P2  
7
I/O  
P3  
0
I/O  
P3  
2
I/O  
P3  
6
I/O  
P4  
0
I/O1  
P4  
A
C
D
E
F
G
H
J
K
L
M
2674 drw 02  
INDEX  
NOTES:  
1. All VCC pins must be connected to the power supply.  
2. All GND pins must be connected to the ground supply.  
3. Package body is approximately 1.21 in x 1.21 in x .16 in.  
4. This package code is used to reference the package diagram.  
5. This text does not indicate orientation of the actual part-marking.  
2
6.42  
IDT7052S/L  
High-Speed 2K x 8 FourPort™ Static RAM  
Military, Industrial and Commercial Temperature Ranges  
Pin Configurations(1,2,3) (con't.)  
11/07/01  
1
17  
117  
116  
N/C  
OEP2  
18  
N/C  
BUSYP3  
BUSYP2  
N/C  
N/C  
A
A
A
A
A
A
A
0P4  
1P4  
2P4  
3P4  
4P4  
5P4  
6P4  
A0P1  
A1P1  
A2P1  
A3P1  
A4P1  
A5P1  
A6P1  
N/C  
N/C  
10P1  
A
GND  
A
A
A
10P4  
A
VCC  
7P4  
8P4  
9P4  
A
A
A
7P1  
8P1  
9P1  
IDT7052PQF  
PQ132-1(4)  
N/C  
132-Pin Plastic Quad Flatpack  
Top View(5,6)  
N/C  
CEP1  
R/WP1  
OEP1  
BUSYP1  
N/C  
CEP4  
R/WP4  
OEP4  
BUSYP4  
N/C  
GND  
I/O0P1  
I/O1P1  
I/O2P1  
I/O3P1  
GND  
N/C  
I/O7P4  
I/O6P4  
I/O5P4  
GND  
I/O4P4  
I/O3P4  
I/O2P4  
N/C  
N/C  
I/O4P1  
I/O5P1  
N/C  
50  
51  
84  
N/C  
N/C  
83  
2674 drw 03  
11/07/01  
1
2
3
4
5
6
7
8
N/C  
N/C  
BUSYP3  
N/C  
N/C  
OEP2  
BUSYP2  
90  
89  
88  
87  
86  
85  
84  
83  
82  
81  
80  
79  
78  
77  
76  
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
A0P4  
A1P4  
A2P4  
A3P4  
A4P4  
A5P4  
A6P4  
A10P4  
A0P1  
A1P1  
A2P1  
A3P1  
A4P1  
A5P1  
A6P1  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
GND  
A
10P1  
A7P4  
A8PR  
A9P4  
VCC  
IDT7052PF  
PN120-1(4)  
A
A
A
7P1  
8P1  
9P1  
N/C  
120-Pin Thin Quad Flatpack  
Top View(5)  
CEP4  
R/WP4  
OEP4  
BUSYP4  
GND  
I/O7P4  
I/O6P4  
I/O5P4  
GND  
I/O4P4  
I/O3P4  
I/O2PR  
N/C  
N/C  
CEP1  
R/WP1  
OEP1  
BUSYP1  
I/O0P1  
I/O1P1  
I/O2P1  
I/O3P1  
GND  
I/O4P1  
I/O5P1  
N/C  
NOTES:  
1. All VCC pins must be connected to the power supply.  
2. All GND pins must be connected to the ground supply.  
3. PQ132-1 package body is approximately  
.95 in x .95 in x .14 in.  
N/C  
N/C  
PN120-1 package body is approximately  
14mm x 14mm x 1.4mm.  
2674 drw 04  
4. This package code is used to reference the package diagram.  
5. This text does not indicate orientation of the actual part-marking  
6. The side of the package containing pin1 may have a bevelled edge in place of the indicator dot..  
3
6.42  
IDT7052S/L  
High-Speed 2K x 8 FourPort™ Static RAM  
Military, Industrial and Commercial Temperature Ranges  
PinConfigurations(1,2)  
AbsoluteMaximumRatings(1)  
Symbol  
Pin Name  
Symbol  
Rating  
Commercial  
& Industrial  
Military  
Unit  
A
0
P1 - A10 P1  
Address Lines - Port 1  
Address Lines - Port 2  
Address Lines - Port 3  
Address Lines - Port 4  
Data I/O - Port 1  
(2)  
V
TERM  
Terminal Voltage  
with Respect to  
GND  
-0.5 to +7.0  
-0.5 to +7.0  
V
A0  
P2 - A10P2  
P3 - A10 P3  
P4 - A10 P4  
A0  
Temperature  
Under Bias  
-55 to +125  
-65 to +150  
50  
-65 to +135  
-65 to +150  
50  
oC  
oC  
T
BIAS  
A0  
I/O  
I/O  
I/O  
0
P1 - I/O  
P2 - I/O  
P3 - I/O  
7
P1  
P2  
P3  
P4  
Storage  
Temperature  
TSTG  
0
7
Data I/O - Port 2  
mA  
IOUT  
DC Output Current  
0
7
Data I/O - Port 3  
2674 tbl 02  
I/O0  
P4 - I/O  
7
Data I/O - Port 4  
NOTES:  
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may  
cause permanent damage to the device. This is a stress rating only and  
functional operation of the device at these or any other conditions above those  
indicated in the operational sections of this specification is not implied. Exposure  
to absolute maximum rating conditions for extended periods may affect  
reliability.  
R/W P1  
R/W P2  
R/W P3  
R/W P4  
GND  
Read/Write - Port 1  
Read/Write - Port 2  
Read/Write - Port 3  
Read/Write - Port 4  
Ground  
2. VTERM must not exceed Vcc + 10% for more than 25% of the cycle time or 10ns  
maximum, and is limited to < 20mA for the period of VTERM > VCC + 10%.  
CE P1  
Chip Enable - Port 1  
Chip Enable - Port 2  
Chip Enable - Port 3  
Chip Enable - Port 4  
Output Enable - Port 1  
Output Enable - Port 2  
Output Enable - Port 3  
Output Enable - Port 4  
Write Disable - Port 1  
Write Disable - Port 2  
Write Disable - Port 3  
Write Disable - Port 4  
Power  
CE P2  
MaximumOperating  
CE P3  
Temperature and Supply Voltage(1)  
CE P4  
Ambient  
OE P1  
Grade  
Temperature  
-55OC to+125OC  
0OC to +70OC  
-40OC to +85OC  
GND  
0V  
Vcc  
OE P2  
Military  
5.0V  
+
+
+
10%  
OE P3  
Commercial  
Industrial  
0V  
5.0V  
5.0V  
10%  
10%  
OE P4  
0V  
BUSY P1  
BUSY P2  
BUSY P3  
BUSY P4  
2674 tbl 04  
NOTES:  
1. This is the parameter TA. This is the "instant on" case temperature.  
VCC  
RecommendedDCOperating  
Conditions  
2674 tbl 01  
NOTES:  
1. All VCC pins must be connected to the power supply.  
2. All GND pins must be connected to the ground supply  
Symbol  
Parameter  
Supply Voltage  
GND Ground  
Min.  
Typ.  
Max. Unit  
VCC  
4.5  
5.0  
5.5  
0
V
V
V
Capacitance(1)  
0
0
V
IH  
Input High Voltage  
Input Low Voltage  
2.2  
6.0(2)  
0.8  
(TA = +25°C, f = 1.0MHz) TQFP only  
____  
-0.5(1)  
V
Symbol  
Parameter  
Input Capacitance  
Output Capacitance  
Conditions(2)  
IN = 0V  
OUT = 0V  
Max. Unit  
____  
VIL  
2674 tbl 05  
CIN  
V
9
pF  
NOTES:  
1. VIL > -1.5V for pulse width less than 10ns.  
2. VTERM must not exceed Vcc + 10%.  
COUT  
V
10  
pF  
2674 tbl 03  
NOTES:  
1. This parameter is determined by device characterization but is not  
production tested.  
2. 3dV references the interpolated capacitance when the input and  
the output signals switch from 0V to 3V or from 3V to 0V.  
4
6.42  
IDT7052S/L  
High-Speed 2K x 8 FourPort™ Static RAM  
Military, Industrial and Commercial Temperature Ranges  
DC Electrical Characteristics Over the Operating  
Temperature and Supply Voltage Range(1,5) (VCC = 5.0V ± 10%)  
7052X20  
7052X25  
Com'l, Ind  
& Military  
7052X35  
Com'l &  
Military  
Com'l Only  
Symbol  
Parameter  
Condition  
Version  
Typ.(2)  
Max.  
Typ.(2)  
Max.  
Typ.(2)  
Max.  
Unit  
ICC1  
Operating Power  
Supply Current  
(All Ports Active)  
COM'L.  
S
150  
150  
300  
250  
150  
150  
300  
250  
150  
150  
300  
250  
CE = VIL  
mA  
L
Outputs Disabled  
(3)  
f = 0  
____  
____  
____  
____  
MIL. &  
IND.  
S
L
150  
150  
360  
300  
150  
150  
360  
300  
I
CC2  
Dynamic Operating  
Current  
COM'L.  
S
L
240  
210  
370  
325  
225  
195  
350  
305  
210  
180  
335  
290  
CE = VIL  
mA  
mA  
Outputs Disabled  
(4)  
(All Ports Active)  
f = fMAX  
____  
____  
____  
____  
MIL. &  
IND.  
S
L
225  
195  
400  
340  
210  
180  
395  
330  
I
SB  
Standby Current  
(All Ports - TTL Level  
Inputs)  
COM'L.  
S
L
70  
60  
95  
80  
45  
40  
85  
70  
40  
35  
75  
60  
CE = VIH  
(4)  
f = fMAX  
____  
____  
____  
____  
MIL. &  
IND.  
S
L
45  
40  
115  
85  
40  
35  
110  
80  
ISB1  
Full Standby Current  
(All Ports - All CMOS  
Level Inputs)  
All Ports  
COM'L.  
S
L
1.5  
0.3  
15  
1.5  
1.5  
0.3  
15  
1.5  
1.5  
0.3  
15  
1.5  
mA  
CE > VCC - 0.2V  
V
IN > VCC - 0.2V or  
____  
____  
____  
____  
IN < 0.2V, f = 0(3)  
MIL. &  
IND.  
S
L
1.5  
0.3  
30  
4.5  
1.5  
0.3  
30  
4.5  
V
2674 tbl 06  
NOTES:  
1. 'X' in part number indicates power rating (S or L).  
2. VCC = 5V, TA = +25°C and are not production tested.  
3. f = 0 means no address or control lines change.  
4. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/tRC, and using AC Test Conditions” of input  
levels of GND to 3V.  
5. For the case of one port, divide the appropriate current above by four.  
DC Electrical Characteristics Over the Operating  
Temperature and Supply Voltage Range (VCC = 5.0V ± 10%)  
7052S  
7052L  
Symbol  
|ILI  
|ILO  
Parameter  
Test Conditions  
Min.  
Max.  
10  
Min.  
Max.  
5
Unit  
µA  
µA  
V
(1)  
___  
___  
|
Input Leakage Current  
V
CC = 5.5V, VIN = 0V to VCC  
___  
___  
___  
___  
|
Output Leakage Current  
Output Low Voltage  
Output High Voltage  
10  
5
CE = VIH, VOUT = 0V to VCC  
VOL  
IOL = 4mA  
0.4  
0.4  
___  
___  
VOH  
IOH = -4mA  
2.4  
2.4  
V
2674 tbl 07  
NOTE:  
1. At Vcc < 2.0V input leakages are undefined.  
5
6.42  
IDT7052S/L  
High-Speed 2K x 8 FourPort™ Static RAM  
Military, Industrial and Commercial Temperature Ranges  
Data Retention Characteristics Over All Temperature Ranges(4)  
(L Version Only) VLC = 0.2V, VHC = VCC - 0.2V  
Symbol  
Parameter  
CC for Data Retention  
Test Condition  
Min.  
Typ.(1)  
Max.  
Unit  
V
___  
___  
V
DR  
V
VCC = 2  
V
2.0  
___  
ICCDR  
Data Retention Current  
µA  
CE > VHC  
IN > VHC or < VLC  
Com'l.  
Mil. & Ind.  
25  
600  
___  
V
25  
1800  
(3)  
CDR  
___  
___  
t
Chip Deselect to Data Retention Time  
Operation Recovery Time  
0
ns  
(3)  
(2)  
___  
___  
t
R
t
RC  
ns  
2674 tbl 08a  
NOTES:  
1. VCC = 2V, TA = +25°C  
2. tRC = Read Cycle Time  
3. This parameter is guaranteed but not production tested.  
4. Industrial temperature: For other speeds, packages and powers contact your sales office.  
Low VCCData Retention Waveform  
DATA RETENTION MODE  
VCC  
4.5V  
VDR  
4.5V  
2V  
t
CDR  
tR  
VDR  
VIH  
CE  
VIH  
2674 drw 05  
AC Test Conditions  
Input Pulse Levels  
GND to 3.0V  
5ns Max.  
1.5V  
5V  
5V  
Input Rise/Fall Times  
893  
893Ω  
Input Timing Reference Levels  
Output Reference Levels  
Output Load  
DATAOUT  
347Ω  
DATAOUT  
347Ω  
1.5V  
5pF*  
Figures 1 and 2  
30pF  
2674 tbl 08b  
,
2674 drw 06  
Figure 1. AC Output Test Load  
Figure 2. Output Test Load  
(for tLZ, tHZ, tWZ, tOW)  
*Including scope and jig  
6
6.42  
IDT7052S/L  
High-Speed 2K x 8 FourPort™ Static RAM  
Military, Industrial and Commercial Temperature Ranges  
AC Electrical Characteristics Over the  
OperatingTemperatureandSupplyVoltage(3)  
7052X20  
Com'l Only  
7052X25  
Com'l, Ind  
& Military  
7052X35  
Com'l &  
Military  
Symbol  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
READ CYCLE  
____  
____  
____  
t
RC  
AA  
ACE  
AOE  
OH  
LZ  
HZ  
PU  
PD  
Read Cycle Time  
20  
25  
35  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
____  
____  
____  
t
Address Access Time  
Chip Enable Access Time  
Output Enable Access Time  
20  
20  
25  
25  
35  
35  
____  
____  
____  
____  
____  
____  
t
t
10  
15  
25  
____  
____  
____  
t
Output Hold from Address Change  
Output Low-Z Time(1,2)  
0
0
0
____  
____  
____  
t
5
5
5
Output High-Z Time(1,2)  
12  
15  
15  
____  
____  
.____  
t
t
Chip Enable to Power Up Time(2)  
Chip Disable to Power Down Time(2)  
0
0
0
____  
____  
____  
____  
____  
____  
t
20  
25  
35  
ns  
2674 tbl 09  
NOTES:  
1. Transition is measured 0mV from Low or High-Impedance voltage with the Output Test Load (Figure 2)  
2. This parameter is guaranteed by device characterization but is not production tested.  
3. 'X' in part number indicates power rating (S or L)  
Timing Waveform of Read Cycle No. 1, Any Port(1)  
tRC  
ADDRESS  
tAA  
tOH  
t
OH  
DATAOUT  
PREVIOUS DATA VALID  
DATA VALID  
2674 drw 07  
NOTES:  
1. R/W = VIH, OE = VIL and CE = VIL.  
Timing Waveform of Read Cycle No. 2, Any Port(1,2)  
tACE  
CE  
tAOE  
tHZ  
OE  
tLZ  
tHZ  
DATAOUT  
VALID DATA  
tLZ  
tPU  
tPD  
I
CC  
CURRENT  
50%  
50%  
I
SB  
2674 drw 08  
NOTES:  
1. R/W = VIH for Read Cycles.  
2. Addresses valid prior to or coincident with CE transition LOW.  
7
6.42  
IDT7052S/L  
High-Speed 2K x 8 FourPort™ Static RAM  
Military, Industrial and Commercial Temperature Ranges  
AC Electrical Characteristics Over the  
OperatingTemperatureandSupplyVoltage(7)  
7052X20  
Com'l Only  
7052X25  
Com'l &  
Military  
7052X35  
Com'l &  
Military  
Symbol  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
WRITE CYCLE  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
WC  
EW  
AW  
AS  
WP  
WR  
DW  
HZ  
DH  
WZ  
OW  
WDD  
WDD  
Write Cycle Time  
20  
15  
15  
0
25  
20  
20  
0
35  
30  
30  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
Chip Enable to End-of-Write(3)  
Address Valid to End-of-Write  
Address Set-up Time  
t
t
(3)  
t
Write Pulse Width  
15  
0
20  
0
30  
0
t
Write Recovery Time  
Data Valid to End-of-Write  
Output High-Z Time(1,2)  
Data Hold Time  
t
15  
15  
20  
____  
____  
____  
t
15  
15  
15  
____  
____  
____  
t
0
0
0
(1,2)  
____  
____  
____  
t
Write Enable to Output in High-Z  
Output Active from End-of-Write(1,2)  
Write Pulse to Data Delay(4)  
12  
15  
15  
____  
____  
____  
t
0
0
0
____  
____  
____  
t
35  
30  
45  
35  
55  
45  
Write Data Valid to Read Data Delay(4)  
____  
____  
____  
t
BUSY INPUT TIMING  
Write to BUSY  
Write Hold After BUSY  
(5)  
____  
____  
____  
____  
____  
____  
t
WB  
0
0
0
ns  
(6)  
tWH  
15  
15  
20  
ns  
2674 tbl 10  
NOTES:  
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).  
2. This parameter is guaranteed by device characterization but is not production tested.  
3. If OE = VIL during a R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers  
to turn off data to be placed on the bus for the required tDW. If OE = VIH during an R/W controlled write cycle, this requirement  
does not apply and the write pulse can be as short as the specified tWP. Specified for OE = VIH (refer to Timing Waveform of Write Cycle, Note 8).  
4. Port-to-port delay through RAM cells from writing port to reading port, refer to Timing Waveform of Write with Port-to-Port Read.  
5. To ensure that the write cycle is inhibited on port "A" during contention from Port "B". Port "A" may be any of the four ports and Port "B" is any other port.  
6. To ensure that a write cycle is completed on port "A" after contention from Port "B". Port "A" may be any of the four ports and Port "B" is any other port.  
7. 'X' in part number indicates power rating.  
8
6.42  
IDT7052S/L  
High-Speed 2K x 8 FourPort™ Static RAM  
Military, Industrial and Commercial Temperature Ranges  
Timing Waveform of Write Cycle No. 1, R/W Controlled Timing(5,8)  
tWC  
ADDRESS  
(6)  
AS  
t
OE  
(3)  
tAW  
tWR  
(9)  
CE  
(7)  
(2)  
tHZ  
tWP  
R/W  
(7)  
(7)  
tWZ  
tHZ  
tLZ  
tOW  
(4)  
(4)  
DATAOUT  
DATAIN  
tDW  
tDH  
2674 drw 09  
Timing Waveform of Write Cycle No. 2, CE Controlled Timing(1, 5)  
tWC  
ADDRESS  
tAW  
CE(9)  
(3)  
(6)  
AS  
(2)  
t
tEW  
tWR  
R/W  
tDW  
tDH  
DATAIN  
2674 drw 10  
NOTES:  
1. R/W or CE = VIH during all address transitions.  
2. A write occurs during the overlap (tEW or tWP) of a CE = VIL and a R/W = VIL.  
3. tWR is measured from the earlier of CE or R/W = VIH to the end of write cycle.  
4. During this period, the I/O pins are in the output state, and input signals must not be applied.  
5. If the CE = VIL transition occurs simultaneously with or after the R/W = VIL transition, the outputs remain in the High-impedance state.  
6. Timing depends on which enable signal is asserted last, CE or R/W.  
7. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). This parameter is guaranteed but is not production  
tested.  
8. If OE = VIL during a R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers to turn off data to be placed  
on the bus for the required tDW. If OE = VIH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the  
specified tWP.  
9
6.42  
IDT7052S/L  
High-Speed 2K x 8 FourPort™ Static RAM  
Military, Industrial and Commercial Temperature Ranges  
Timing Waveform of Write with Port-to-Port Read(1,2,3)  
tWC  
MATCH  
ADDR"A"  
tWP  
R/W"A"  
tDW  
tDH  
DATAIN"A"  
ADDR"B"  
VALID  
MATCH  
tWDD  
VALID  
DATA"B"  
tDDD  
NOTES:  
2674 drw 11  
1. Assume BUSY input = VIH and CE = VIL for the writing port.  
2. OE = VIL for the reading ports.  
3. All timing is the same for left and right ports. Port "A" may be either of the four ports and Port "B" is any other port.  
Timing Waveform of Write with BUSY Input  
t
WP  
R/W"A"  
BUSY"B"  
R/W"B"  
tWH  
t
WB  
(1)  
,
2674 drw 12  
NOTES:  
1. BUSY is asserted on Port "B" blocking R/W"B" until BUSY"B" goes HIGH.  
Truth Table I – Read/Write Control(3)  
FunctionalDescription  
TheIDT7052providesfourportswithseparatecontrol,address,and  
I/Opinsthatpermitindependentaccessforreadsorwritestoanylocation  
in memory. These devices have an automatic power down feature  
controlled by CE. The CE controls on-chip power down circuitry that  
permitstherespectiveporttogointostandbymodewhennotselected(CE  
= VIH). When a port is enabled, access to the entire memory array is  
permitted.EachporthasitsownOutputEnablecontrol(OE).Intheread  
mode, the ports OE turns on the output drivers when set LOW. READ/  
WRITEconditionsareillustratedinthetablebelow.  
Any Port(1)  
R/W  
D0-7  
Function  
CE  
OE  
X
H
X
Z
Z
Port Deselected: Power-Down  
CEP1=CEP2=CEP3=CEP4=VIH  
X
H
X
Power Down Mode ISB or ISB1  
L
H
X
L
L
X
X
L
DATAIN  
Data on port written into memory(2)  
DATAOUT Data in memory output on port  
Outputs Disabled  
H
Z
2674 tbl 11  
NOTES:  
1. "H" = VIH, "L" = VIL, "X" = Dont Care, "Z "= High Impedance  
2. If BUSY = VIL, write is blocked.  
3. For valid write operation, no more than one port can write to the same address  
location at the same time.  
10  
6.42  
IDT7052S/L  
High-Speed 2K x 8 FourPort™ Static RAM  
Military, Industrial and Commercial Temperature Ranges  
OrderingInformation  
A
IDT  
XXXX  
A
999  
A
A
Device  
Type  
Power Speed  
Package  
Process/  
Temperature  
Range  
Blank  
Commercial (0°C to +70°C)  
Industrial (-40°C to +85°C  
Military (-55°C to +125°C)  
I(1)  
B
Compliant to MIL-PRF-38535 QML  
G(2)  
Green  
G
PQF  
PF  
108-Pin Pin Grid Array (G108-1)  
132-Pin Plastic Quad Flatpack (PQ132-1)  
120-Pin Thin Quad Plastic Flatpack (PN120-1)  
,
20  
25  
35  
Commercial Only  
Commercial, Industrial & Military  
Commercial & Military  
Speed in nanoseconds  
L
S
Low Power  
Standard Power  
16K (2K x 8) FourPort RAM  
7052  
2674 drw 13  
NOTE:  
1. Industrial temperature range is available. For specific speeds, packages and powers contact your sales office.  
2. Green parts available. For specific speeds, packages and powers contact your local sales office.  
DatasheetDocumentHistory  
1/18/99:  
Initiateddatasheetdocumenthistory  
Convertedtonewformat  
Cosmetictypographicalcorrections  
Addedadditionalnotestopinconfigurations  
Changeddrawingformat  
6/4/99:  
Page1 CorrectedDSCnumber  
11/10/99:  
11/18/99:  
5/23/00:  
Replaced IDT logo  
Page 10 FixedtypoincaptionforBUSY Inputwaveform  
Page 4 Increasedstoragetemperatureparameter  
ClarifiedTAparameter  
Page 5 DCElectricalparameters–changedwordingfrom"open"to"disabled"  
Changed±200mVto0mVinnotes  
10/22/01:  
07/24/06:  
Pages 2 & 3 Added date revision for pin configurations  
Page 5, 7& 8 AddedIndustrialtemptocolumnheadingfor25ns speedtoDC&ACElectricalCharacteristics  
Page 11 AddedIndustrialtempofferingto25nsorderinginformation  
Page 4, 5, 7& 8 RemovedIndustrialtempfootnote fromalltables  
Page 1 & 11 Replace TM logo with ® logo  
Page 1 Addedgreenavailabilitytofeatures  
Page 11 Addedgreenindicatortoorderinginformation  
CORPORATE HEADQUARTERS  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
for SALES:  
for Tech Support:  
408-284-2794  
DualPortHelp@idt.com  
800-345-7015 or 408-284-8200  
fax: 408-284-2775  
www.idt.com  
The IDT logo is a registered trademark of Integrated Device Technology, Inc.  
11  
6.42  

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