IDT7164S25PGI [IDT]

Standard SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28;
IDT7164S25PGI
型号: IDT7164S25PGI
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Standard SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28

静态存储器 光电二极管 内存集成电路
文件: 总11页 (文件大小:108K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IDT7164S/LS  
IDT7164L/LL  
CMOS Static RAM  
64K (8K x 8-Bit)  
Features  
Description  
High-speed address/chip select access time  
TheIDT7164isa65,536bithigh-speedstaticRAMorganizedas8K  
x8.ItisfabricatedusingIDT’shigh-performance,high-reliabilityCMOS  
technology.  
Military:20/25/35/45/55/70/85/100ns(max.)  
Industrial:25/35ns (max.)  
– Commercial:15/20/25/35ns(max.)  
Low power consumption  
Battery backup operation – 2V data retention voltage  
(L Version only)  
Produced with advanced CMOS high-performance  
technology  
Inputs and outputs directly TTL-compatible  
Three-state outputs  
Address access times as fast as 15ns are available and the circuit  
offers a reduced power standby mode. When CS1 goes HIGH or CS2  
goes LOW, the circuit will automatically go to, and remain in, a low-  
power stand by mode. The low-power (L) version also offers a battery  
backup data retention capability at power supply levels as low as 2V.  
All inputs and outputs of the IDT7164 are TTL-compatible and  
operation is from a single 5V supply, simplifying system designs. Fully  
static asynchronous circuitry is used, requiring no clocks or refreshing  
for operation.  
Available in 28-pin DIP, CERDIP and SOJ  
Military product compliant to MIL-STD-883, Class B  
TheIDT7164ispackagedina28-pin300milDIPandSOJ anda28-  
pin600milCERDIP.  
Militarygradeproductismanufacturedincompliancewiththelatest  
revision of MIL-STD-883, Class B, making it ideally suited to military  
temperature applications demandingthe highestlevelofperformance  
and reliability.  
Functional Block Diagram  
A0  
VCC  
GND  
65,536 BIT  
MEMORY ARRAY  
ADDRESS  
DECODER  
A
12  
7
0
I/O  
0
7
I/O CONTROL  
I/O  
CS1  
CS2  
OE  
CONTROL  
LOGIC  
2967 drw 01  
WE  
FEBRUARY 2007  
1
DSC-2967/14  
©2007 IntegratedDeviceTechnology,Inc.  
IDT7164S/L  
CMOS Static RAM 64K (8K x 8-Bit)  
Military, Commercial, and Industrial Temperature Ranges  
Absolute Maximum Ratings(1)  
Pin Configurations  
Symbol  
Rating  
Com'l.  
Mil.  
Unit  
V
WE  
CS  
CC  
NC  
1
28  
27  
(2)  
V
TERM  
Terminal Voltage  
with Respect  
to GND  
-0.5 to +7.0  
-0.5 to +7.0  
V
A12  
2
2
A
A
A
A
A
A
A
A
7
6
5
4
3
2
1
0
0
1
2
3
26  
25  
24  
A
A
A
8
4
Operating  
Te m p e rature  
0 to +70  
-55 to +125  
-65 to +135  
oC  
oC  
D28-1  
D28-3  
P28-1  
P28-2  
SO28-5  
T
A
9
5
11  
6
23  
22  
Te m p e rature  
Under Bias  
-55 to +125  
TBIAS  
OE  
7
A10  
8
21  
20  
CS  
1
TSTG  
Storage Temperature -55 to +125  
-65 to +150  
oC  
W
9
I/O  
I/O  
I/O  
I/O  
I/O  
7
6
5
4
3
10  
11  
12  
13  
14  
19  
18  
17  
16  
P
T
Power Dissipation  
DC Output Current  
1.0  
50  
1.0  
50  
I/O  
I/O  
I/O  
IOUT  
mA  
2967 tbl 02  
NOTES:  
15  
GND  
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may  
cause permanent damage to the device. This is a stress rating only and functional  
operationofthe device atthese oranyotherconditions above those indicatedinthe  
operational sections of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect reliability.  
2. VTERM must not exceed VCC + 0.5V.  
,
DIP/SOJ2967 drw 02  
Top View  
Pin Descriptions  
Truth Table(1,2,3)  
WE  
CS1  
CS  
2
OE  
I/O  
Function  
Deselected - Standby (ISB  
Deselected - Standby (ISB  
Deselected - Standby (ISB1)  
Name  
Description  
Address  
X
H
X
X
X
High-Z  
High-Z  
High-Z  
)
A0 - A12  
X
L
X
)
I/O  
CS  
CS  
0
- I/O  
7
Data Input/Output  
Chip Select  
Chip Select  
Write Enable  
Output Enable  
Ground  
X
V
HC or  
VLC  
X
VHC  
1
2
X
H
H
L
X
L
L
L
V
LC  
X
H
L
High-Z  
High-Z  
Deselected - Standby (ISB1  
Output Disabled  
Read Data  
)
WE  
OE  
H
H
H
DATAOUT  
DATAIN  
GND  
X
Write Data  
VCC  
Power  
2967 tbl 03  
NOTES:  
2967 tbl 01  
1. CS2 will power-down CS1, but CS1 will not power-down CS2.  
2. H = VIH, L = VIL, X = don't care.  
3. VLC = 0.2V, VHC = VCC - 0.2V  
Recommended DC Operating  
Conditions  
Recommended Operating  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
5.5  
0
Unit  
V
Temperature and Supply Voltage  
V
CC  
Supply Voltage  
4.5  
5.0  
Grade  
Temperature  
-55OC to +125OC  
-40OC to +85OC  
0OC to +70OC  
GND  
Vcc  
GND Ground  
0
0
V
Military  
0V  
5V ± 10%  
5V ± 10%  
5V ± 10%  
____  
V
IH  
Input HIGH Voltage  
Input LOW Voltage  
2.2  
V
CC + 0.5  
V
Industrial  
0V  
-0.5(1)  
0.8  
V
____  
VIL  
Commercial  
0V  
2967 tbl 05  
NOTE:  
1. VIL (min.) = –1.5V for pulse width less than 10ns, once per cycle.  
2967 tbl 04  
2
IDT7164S/L  
CMOS Static RAM 64K (8K x 8-Bit)  
Military, Commercial, and Industrial Temperature Ranges  
Capacitance (TA = +25°C, f = 1.0MHz)  
Symbol  
Parameter(1)  
Input Capacitance  
I/O Capacitance  
Conditions  
IN = 0V  
OUT = 0V  
Max.  
Unit  
CIN  
V
8
pF  
CI/O  
V
8
pF  
2967 tbl 06  
NOTE:  
1. This parameter is determined by device characterization, but is not production  
tested.  
DC Electrical Characteristics(1) (VCC = 5.0V ± 10%, VLC = 0.2V, VHC = VCC - 0.2V)  
7164S15  
7164L15  
7164S20  
7164L20  
7164S25  
7164L25  
Com'l.  
110  
100  
180  
150  
20  
Com'l.  
100  
90  
Ind.  
110  
100  
170  
150  
20  
Mil.  
110  
100  
180  
160  
20  
Com'l.  
90  
Ind.  
110  
100  
170  
150  
20  
Symbol  
Parameter  
Power  
Mil.  
110  
100  
180  
160  
20  
Unit  
ICC1  
Operating Power Supply Current  
S
L
S
L
S
L
mA  
CS  
1
= VIL, CS  
2
= VIH, Outputs Open  
V
CC = Max., f  
=
0(2)  
90  
ICC2  
Dynamic Operating Current  
CS = VIL, CS = VIH, Outputs Open  
CC = Max., f = fMAX  
mA  
mA  
mA  
170  
150  
20  
170  
150  
20  
1
2
(2)  
V
ISB  
Standby Power Supply Current  
(TTL Level), CS1 > VIH, CS2 < VIL,  
(2)  
Outputs Open, VCC = Max., f = fMAX  
3
3
3
5
3
3
5
ISB1  
Full Standby Power Supply Current  
(CMOS Level), f = 0(2), VCC = Max.  
S
L
15  
15  
15  
20  
1
15  
15  
20  
1
1. CS  
1
> VHC and CS  
< VLC  
2 > VHC, or  
0.2  
0.2  
0.2  
0.2  
0.2  
2. CS  
2
2967 tbl 07  
7164S35  
7164L35  
7164S45  
7164L45  
7164S55  
7164L55  
7164S70  
7164S85/100  
7164L85/100  
7164L70  
Mil.  
100  
90  
Com'l. Ind.  
Mil.  
100  
90  
Mil.  
100  
90  
Mil.  
100  
90  
Symbol  
Parameter  
Power  
Mil.  
100  
90  
Unit  
I
CC1 Operating Power Supply Current  
S
L
S
L
S
L
90  
90  
110  
100  
150  
130  
20  
mA  
CS  
1
= VIL, CS  
2
= VIH, Outputs Open  
VCC = Max., f  
=
0(2)  
ICC2  
Dynamic Operating Current  
CS = VIL, CS = VIH, Outputs Open  
CC = Max., f = fMAX  
mA  
mA  
mA  
150  
130  
20  
160  
140  
20  
160  
130  
20  
160  
125  
20  
160  
120  
20  
160  
120  
20  
1
2
(2)  
V
ISB  
Standby Power Supply Current  
(TTL Level), CS > VIH, CS  
Outputs Open, VCC = Max., f = fMAX  
1
2 < VIL,  
(2)  
3
3
5
5
5
5
5
ISB1 Full Standby Power Supply Current  
S
L
15  
15  
20  
1
20  
1
20  
1
20  
1
20  
1
(CMOS Level), f = 0(2), VCC = Max.  
1. CS  
1
> VHC and CS  
< VLC  
2 > VHC, or  
0.2  
0.2  
2. CS  
2
2967 tbl 08  
NOTES:  
1. All values are maximum guaranteed values.  
2. fMAX = 1/tRC (all address inputs are cycling at fMAX); f = 0 means no address input lines are changing.  
6.42  
3
IDT7164S/L  
CMOS Static RAM 64K (8K x 8-Bit)  
Military, Commercial, and Industrial Temperature Ranges  
DC Electrical Characteristics (VCC = 5.0V ± 10%)  
IDT7164S  
IDT7164L  
Symbol  
Parameter  
Test Conditions  
MIL.  
Min.  
Max.  
Min.  
Max.  
Unit  
____  
____  
____  
____  
Input Leakage Current  
|ILI|  
V
CC = Max.,  
10  
5
5
2
V
IN = GND to VCC  
COM'L. & IND  
µA  
____  
____  
____  
____  
|ILO  
|
Output Leakage Current  
Output Low Voltage  
V
CC = Max., CS  
1
= VIH  
,
MIL.  
COM'L. & IND  
10  
5
5
2
VOUT = GND to VCC  
µA  
V
____  
____  
____  
____  
IOL = 8mA, VCC = Min.  
0.4  
0.4  
VOL  
IOL = 10mA, VCC = Min.  
0.5  
0.5  
____  
____  
VOH  
Output High Voltage  
IOH = -4mA, VCC = Min.  
2.4  
2.4  
V
2967 tbl 09  
Data Retention Characteristics Over All Temperature Ranges  
(L Version Only) (VLC = 0.2V, VHC = VCC - 0.2V)  
Typ.(1)  
Max.  
VCC @  
VCC @  
Symbol  
Parameter  
Test Condition  
Min.  
2.0V  
3.0V  
2.0V  
3.0V  
Unit  
V
____  
____  
____  
____  
____  
V
DR  
V
CC for Data Retention  
2.0  
____  
____  
Data Retention Current  
MIL.  
COM'L. & IND  
10  
10  
15  
15  
200  
60  
300  
90  
µA  
ICCDR  
(3)  
CDR  
____  
____  
____  
____  
t
Chip Deselect to Data  
Retention Time  
0
ns  
1. CS  
CS  
2. CS  
1
> VHC  
> VHC, or  
< VLC  
2
2
____  
____  
____  
____  
____  
____  
(3)  
(2)  
Operation Recovery Time  
Input Leakage Current  
ns  
t
R
t
RC  
(3)  
____  
2
2
µA  
IILII  
2967 tbl 10  
NOTES:  
1. TA = +25°C.  
2. tRC = Read Cycle Time.  
3. This parameter is guaranteed by device characterization, but is not production tested.  
AC Test Conditions  
Input Pulse Levels  
GND to 3.0V  
Input Rise/Fall Times  
Input Timing Reference Levels  
Output Reference Levels  
AC Test Load  
5ns  
1.5V  
1.5V  
See Figures 1 and 2  
2967 tbl 11  
5V  
5V  
480  
480  
DATAOUT  
255Ω  
DATAOUT  
5pF*  
255Ω  
30pF*  
,
,
2967 drw 04  
2967 drw 03  
Figure 2. AC Test Load  
Figure 1. AC Test Load  
(for tCLZ1, tCLZ2, tOLZ, tCHZ1, tCHZ2, tOHZ, tOW, and tWHZ)  
*Includes scope and jig capacitances  
4
IDT7164S/L  
CMOS Static RAM 64K (8K x 8-Bit)  
Military, Commercial, and Industrial Temperature Ranges  
AC Electrical Characteristics (VCC = 5.0V ± 10%, All Temperature Ranges)  
7164S15(1)  
7164L15(1)  
7164S20(2)  
7164L20(2)  
7164S25  
7164S35  
7164L35  
7164L25  
Symbol  
Parameter  
Unit  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Read Cycle  
____  
____  
____  
____  
t
RC  
Read Cycle Time  
15  
20  
25  
35  
ns  
ns  
ns  
____  
____  
____  
____  
tAA  
Address Access Time  
15  
15  
19  
20  
25  
25  
35  
35  
____  
____  
____  
____  
____  
____  
____  
____  
(3)  
ACS1  
Chip Select-1 Access Time  
t
(3)  
ACS2  
Chip Select-2 Access Time  
20  
25  
30  
40  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
(4)  
CLZ1,2  
____  
____  
____  
____  
Chip Select-1, 2 to Output in Low-Z  
Output Enable to Output Valid  
Output Enable to Output in Low-Z  
Chip Select-1,2 to Output in High-Z  
Output Disable to Output in High-Z  
Output Hold from Address Change  
Chip Select to Power Up Time  
Chip Deselect to Power Down Time  
5
5
5
5
t
____  
____  
____  
____  
tOE  
7
8
12  
18  
____  
____  
____  
____  
(4)  
OLZ  
0
0
0
0
t
____  
____  
____  
____  
(4)  
CHZ1,2  
8
9
13  
15  
t
____  
____  
____  
____  
(4)  
OHZ  
7
8
10  
15  
t
____  
____  
____  
____  
tOH  
5
5
5
5
____  
____  
____  
____  
(4)  
PU  
0
0
0
0
t
____  
____  
____  
____  
(4)  
PD  
15  
20  
25  
35  
t
Write Cycle  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
WC  
CW1,2  
AW  
AS  
WP  
WR1  
WR2  
Write Cycle Time  
15  
14  
14  
0
20  
15  
15  
0
25  
18  
18  
0
35  
25  
25  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
Chip Select to End-of-Write  
Address Valid to End-of-Write  
Address Set-up Time  
Write Pulse Width  
t
t
t
14  
0
15  
0
21  
0
25  
0
t
Write Recovery Time (CS  
1
, WE)  
t
Write Recovery Time (CS  
2)  
5
5
5
5
____  
____  
____  
____  
(4)  
WHZ  
Write Enable to Output in High-Z  
Data to Write Time Overlap  
6
8
10  
14  
t
____  
____  
____  
____  
t
DW  
DH1  
DH2  
8
0
5
4
10  
0
13  
0
15  
0
____  
____  
____  
____  
____  
____  
____  
____  
t
Data Hold from Write Time (CS , WE)  
1
t
Data Hold from Write Time (CS  
2)  
5
5
5
____  
____  
____  
____  
(4)  
OW  
Output Active from End-of-Write  
4
4
4
ns  
t
2967 tbl 12  
NOTES:  
1. 0° to +70°C temperature range only.  
2. 0° to +70°C and –55°C to +125°C temperature ranges only.  
3. Both chip selects must be active for the device to be selected.  
4. This parameter is guaranteed by device characterization, but is not production tested.  
6.42  
5
IDT7164S/L  
CMOS Static RAM 64K (8K x 8-Bit)  
Military, Commercial, and Industrial Temperature Ranges  
AC Electrical Characteristics (con't.) (VCC = 5.0V ± 10%, Military Temperature Ranges)  
7164S45  
7164L45  
7164S55  
7164L55  
7164S70  
7164L70  
7164S85/100  
7164L85/100  
Symbol  
Parameter  
Unit  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Read Cycle  
____  
____  
____  
____  
t
RC  
Read Cycle Time  
45  
55  
70  
85/100  
ns  
ns  
ns  
____  
____  
____  
____  
tAA  
Address Access Time  
45  
45  
55  
55  
70  
70  
85/100  
85/100  
____  
____  
____  
____  
____  
____  
____  
____  
(1)  
ACS1  
Chip Select-1 Access Time  
t
(1)  
ACS2  
Chip Select-2 Access Time  
45  
55  
70  
85/100  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
____  
____  
____  
____  
(2)  
CLZ1,2  
Chip Select-1, 2 to Output in Low-Z  
Output Enable to Output Valid  
Output Enable to Output in Low-Z  
Chip Select-1,2 to Output in High-Z  
Output Disable to Output in High-Z  
Output Hold from Address Change  
Chip Select to Power Up Time  
Chip Deselect to Power Down Time  
5
5
5
5
t
____  
____  
____  
____  
tOE  
25  
30  
35  
40  
____  
____  
____  
____  
(2)  
OLZ  
0
0
0
0
t
____  
____  
____  
____  
(2)  
CHZ1,2  
20  
25  
30  
35  
t
____  
____  
____  
____  
(2)  
OHZ  
20  
25  
30  
35  
t
____  
____  
____  
____  
tOH  
5
5
5
5
____  
____  
____  
____  
(2)  
PU  
0
0
0
0
t
____  
____  
____  
____  
(2)  
PD  
45  
55  
70  
85/100  
t
Write Cycle  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
WC  
CW1,2  
AW  
AS  
WP  
WR1  
WR2  
Write Cycle Time  
45  
33  
33  
0
55  
50  
50  
0
70  
60  
60  
0
85/100  
75  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
Chip Select to End-of-Write  
Address Valid to End-of-Write  
Address Set-up Time  
Write Pulse Width  
t
75  
t
0
t
25  
0
50  
0
60  
0
75  
t
Write Recovery Time (CS  
1
, WE)  
0
t
Write Recovery Time (CS  
2)  
5
5
5
5
____  
____  
____  
____  
(2)  
WHZ  
Write Enable to Output in High-Z  
Data to Write Time Overlap  
18  
25  
30  
35  
t
____  
____  
____  
____  
t
DW  
DH1  
DH2  
20  
0
25  
0
30  
0
35  
0
____  
____  
____  
____  
____  
____  
____  
____  
t
Data Hold from Write Time (CS , WE)  
1
t
Data Hold from Write Time (CS  
2)  
5
5
5
5
____  
____  
____  
____  
(2)  
OW  
Output Active from End-of-Write  
4
4
4
4
ns  
t
2967 tbl 13  
NOTES:  
1. Both chip selects must be active for the device to be selected.  
2. This parameter is guaranteed by device characterization, but is not production tested.  
6
IDT7164S/L  
CMOS Static RAM 64K (8K x 8-Bit)  
Military, Commercial, and Industrial Temperature Ranges  
Timing Waveform of Read Cycle No. 1(1)  
t
RC  
ADDRESS  
t
OH  
tAA  
OE  
tOE  
(5)  
t
OLZ  
CS2  
t
(5)  
ACS2  
(5)  
tCHZ2  
tCLZ2  
CS1  
(5)  
OHZ  
tACS1  
t
(5)  
(5)  
CLZ1  
t
tCHZ1  
DATAOUT  
DATA VALID  
2967 drw 05  
Timing Waveform of Read Cycle No. 2(1,2,4)  
t
RC  
ADDRESS  
t
AA  
t
OH  
t
OH  
DATAOUT  
DATA VALID  
2967 drw 06  
Timing Waveform of Read Cycle No. 3(1,3,4)  
CS1  
CS2  
t
ACS2  
(5)  
(5)  
(5)  
(5)  
t
CHZ2  
t
CLZ2  
ACS1  
CLZ1  
t
t
CHZ1  
t
DATAOUT  
DATA VALID  
tPU  
I
CC  
POWER  
SUPPLY  
CURRENT  
I
SB  
t
PD  
NOTES:  
1. WE is HIGH for Read cycle.  
2. Device is continuously selected, CS1 is LOW, CS2 is HIGH.  
2967 drw 07  
3. Address valid prior to or coincident with CS1 transition LOW and CS2 transition HIGH.  
4. OE is LOW.  
5. Transition is measured ±200mV from steady state.  
6.42  
7
IDT7164S/L  
CMOS Static RAM 64K (8K x 8-Bit)  
Military, Commercial, and Industrial Temperature Ranges  
Timing Waveform of Write Cycle No. 1 (WE Controlled Timing)(1,5)  
t
WC  
ADDRESS  
CS2  
CS1  
(2)  
WR1  
t
t
AW  
tAS  
WE  
(3)  
(5)  
(6)  
OW  
tWP  
t
DATAOUT  
DATAIN  
t
DH1,2  
t
DW  
(6)  
t
WHZ  
DATA VALID  
2967 drw 08  
Timing Waveform of Write Cycle No. 2 (CS Controlled Timing)(1)  
t
WC  
ADDRESS  
(2)  
WR2  
tAS  
t
t
CS2  
(2)  
WR1  
t
CW  
(4)  
CS1  
tAW  
WE  
t
DW  
tDH1,2  
DATAIN  
DATA VALID  
2967 drw 09  
NOTES:  
1. A write occurs during the overlap of a LOW WE, a LOW CS1 and a HIGH CS2.  
2. tWR1, 2 is measured from the earlier of CS1 or WE going HIGH or CS2 going LOW to the end of the write cycle.  
3. During this period, I/O pins are in the output state so that the input signals must not be applied.  
4. If the CS1 LOW transition or CS2 HIGH transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high-impedance state.  
5. OE is continuously HIGH. If OE is LOW during a WE controlled write cycle, the write pulse width must be the larger of tWP or (tWHZ +tDW) to allow the I/O drivers to  
turn off and data to be placed on the bus for the required tDW. If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the minimum  
write pulse width is as short as the specified tWP.  
6. Transition is measured ±200mV from steady state.  
8
IDT7164S/L  
CMOS Static RAM 64K (8K x 8-Bit)  
Military, Commercial, and Industrial Temperature Ranges  
Low VCC Data Retention Waveform  
DATA  
RETENTION  
MODE  
VCC  
4.5V  
4.5V  
VDR 2V  
t
CDR  
tR  
CS  
VIH  
VIH  
VDR  
2967 drw 10  
Ordering Information — Commercial  
IDT  
X
7164  
X
XX  
XXX  
L
X
Device  
Type  
Power Speed  
Package  
Process/  
Temperature  
Range  
Blank  
G
Commercial (0°C to +70°C)  
Restricted hazardous substancwe device  
Y*  
P**  
TP*  
300 mil SOJ (SO28-5)  
600 mil Plastic DIP (P28-1)  
300 mil Plastic DIP (P28-2)  
15  
20  
25  
35  
Speed in nanoseconds  
,
S
L
Standard Power  
Low Power  
First generation or current die step  
Current generation die step optional  
Blank  
L
* Available for 15ns and 20ns speed grades only.  
** Available for 25ns and 35ns speed grades only.  
2967 drw 11  
6.42  
9
IDT7164S/L  
CMOS Static RAM 64K (8K x 8-Bit)  
Military, Commercial, and Industrial Temperature Ranges  
Ordering Information — Industrial  
IDT  
L
X
7164  
X
XX  
XXX  
X
Device  
Type  
Power Speed  
Package  
Process/  
Temperature  
Range  
I
Industrial (–40°C to +85°C)  
G
Restricted hazardous substance device  
P
Y
600 mil Plastic DIP (P28-1)  
300 mil Plastic SOJ (PJ28)  
20  
25  
35  
Speed in nanoseconds  
Standard Power  
S
L
,
Low Power  
Blank First generation or current die step  
Current generation die step optional  
L
2967 drw 12  
Ordering Information — Military  
IDT  
7164  
X
XX  
XXX  
X
Device  
Type  
Power  
Speed  
Package  
Process/  
Temperature  
Range  
B
Military (–55°C to +125°C)  
Compliant with MIL-STD-883, Class B  
D
TD  
600 mil CERDIP (D28-1)  
300 mil CERDIP (D28-3)  
20*  
25  
35  
45  
55  
70  
85  
Speed in nanoseconds  
100**  
S
L
Standard Power  
Low Power  
*
Available only in 600mil CERDIP (D28-1) and 300mil CERDIP  
(D28-1) and 300mil CERDIP (D28-3) packaging for a low power.  
** Available only in 600 mil CERDIP (D28-1) packaging.  
2967 drw 13  
10  
IDT7164S/L  
CMOS Static RAM 64K (8K x 8-Bit)  
Military, Commercial, and Industrial Temperature Ranges  
DatasheetDocumentHistory  
1/13/2000  
Updatedtonewformat  
AddedIndustrialTemperaturerangeofferings  
Removedcommercial70nsspeedgradeoffering  
Added100nsspeedgradespecificationdetails  
RevisednotesandfootnotesinDCElectricaltables  
Pp. 1, 2, 3, 5, 10  
Pp. 1, 3, 9  
Pp. 1, 3, 6, 10  
Pg. 3  
Pp. 5, 6  
RevisednotesandfootnotesinACElectricaltables  
Pg. 8  
Pp. 9, 10  
Pg. 11  
RemovedNote 1fromWrite Cycle No. 1andNo. 2diagrams;renumberednotes andfootnotes  
SeparatedOrderingInformationintocommercial,industrial,andmilitaryofferings  
AddedDatasheetDocumentHistory  
08/09/00  
02/01/01  
12/07/01  
09/30/04  
11/16/06  
Notrecommendedfornewdesigns  
Removed"Notrecommendedfornewdesigns"  
AddPJ28toIndustrialtemperature.  
Added"restrictedhazardoussubstancedevice"toorderinginformation.  
Addedinustrialtemppowerlimitsfor20nspart.Changedpowerlimitsfor25nspartforcommercial  
andindustrial. Changedpowerlimitsforcommercialandindustrialfor35nspart.  
Added 20ns part to ordering information. Refer to PCN SR-0602-01  
AddedLgenerationdiesteptodatasheetorderinginformatiom.  
Pg. 10  
Pg. 9,10  
Pg.3  
Pg.10  
Pg. 9, 10  
02/20/07  
CORPORATE HEADQUARTERS  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
for SALES:  
for Tech Support:  
ipchelp@idt.com  
800-345-7015  
800-345-7015 or  
408-284-8200  
fax: 408-284-2775  
www.idt.com  
The IDT logo is a registered trademark of Integrated Device Technology, Inc.  
6.42  
11  

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