IDT72V15320L10BBGI [IDT]

FIFO, 2KX32, 6.5ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144;
IDT72V15320L10BBGI
型号: IDT72V15320L10BBGI
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

FIFO, 2KX32, 6.5ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144

先进先出芯片
文件: 总26页 (文件大小:238K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IDT72V15160  
IDT72V16160  
IDT72V17160  
IDT72V18160  
IDT72V19160  
IDT72V14320  
IDT72V15320  
IDT72V16320  
IDT72V17320  
IDT72V18320  
IDT72V19320  
3.3V MULTIMEDIA FIFO  
16 BIT V-III, 32 BIT Vx-III FAMILY  
UP TO 1 Mb DENSITY  
Master Reset clears entire FIFO  
FEATURES:  
Partial Reset clears data, but retains programmable settings  
Empty, Full and Half-Full flags signal FIFO status  
Programmable Almost-Empty and Almost-Full flags, each flag can  
default to one of eight preselected offsets  
Program programmable flags through serial input  
Output enable puts data outputs into high impedance state  
JTAG port, provided for Boundary Scan function (PBGA Only)  
Available in a 80-pin (V-III) Thin Quad Flat Pack, 128-pin(Vx-III)  
Thin Quad Flat Pack (TQFP) or a 144-pin (Vx-III) Plastic Ball Grid  
Array (PBGA) (with additional features)  
Choose among the following memory organizations: Commercial  
V-III  
Vx-III  
IDT72V15160 - 4,096 x 16  
IDT72V16160 - 8,192 x 16  
IDT72V17160 - 16,384 x 16  
IDT72V18160 - 32,768 x 16  
IDT72V19160 - 65,536 x 16  
IDT72V14320 - 1,024 x 32  
IDT72V15320 - 2,048 x 32  
IDT72V16320 - 4,096 x 32  
IDT72V17320 - 8,192 x 32  
IDT72V18320 - 16,384 x 32  
IDT72V19320 - 32,768 x 32  
Industrial temperature range (–40°C to +85°C)  
High-performance submicron CMOS technology  
Up to 100 MHz Operation of the Clocks  
5V input tolerant  
Auto power down minimizes standby power consumption  
FUNCTIONALBLOCKDIAGRAM  
*Available on the Vx-III PBGA package only.  
MRS  
PRS  
WCLK  
RCLK  
READ  
CONTROL  
WRITE  
CONTROL  
RESET LOGIC  
FIFO ARRAY  
WEN  
REN  
OE  
D0 - Dn  
Data In  
x16, x32  
Q0 - Qn  
Data Out  
x16, x32  
TCK  
*
FLAG LOGIC  
*
TRST  
*
JTAG CONTROL  
(BOUNDARY  
SCAN)  
TMS  
*
TDI  
TDO  
*
*
LD  
SI  
FSEL1 EF  
HF  
PAE  
FF  
PAF  
SEN PFM FSEL0  
6163 drw01  
IDTandtheIDTlogoaretrademarksofIntegratedDeviceTechnology,Inc.  
NOVEMBER 2003  
INDUSTRIALTEMPERATURERANGE  
1
2003 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.  
DSC-6163/3  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
PAEandPAFcanbeprogrammedindependentlytoswitchatanypointin  
memory. Programmableoffsetsdeterminetheflagswitchingthresholdandcan  
beloadedwiththeserialinterfacetoanyuserdesiredvalueorbydefaultvalues.  
Eightdefaultoffsetsettingsareprovided,sothatPAEcanbesettoswitchata  
predefinednumberoflocationsfromtheemptyboundaryandthePAFthreshold  
canalsobesetatsimilarpredefinedvaluesfromthefullboundary. Thedefault  
offsetvaluesaresetduringMasterResetbythestateoftheFSEL0,FSEL1,and  
LD pins.  
For serial programming, SEN together with LD on each rising edge of  
WCLK,areusedtoloadtheoffsetregisters viatheSerialInput(SI).  
DuringMasterReset(MRS)thereadandwritepointersaresettothefirst  
locationoftheFIFO.  
DESCRIPTION:  
The IDT V-III and Vx-III Multimedia FIFOs are exceptionally deep, high  
speed,CMOSFirst-In-First-Out(FIFO)memorieswithindependent clocked  
readandwrite controls andhighdensityofferings upto1Mbit.  
Each FIFO has a data input port (Dn) and a data output port (Qn). The  
frequencies ofboththe RCLK (read port clock) and the WCLK (write port  
clock) signals may vary from 0 to fS(MAX) with complete independence.  
There are norestrictions onthe frequencyoftheoneclockinputwithrespect  
totheother.  
TheseFIFOshavefiveflagpins,EF(EmptyFlag),FF(FullFlag),HF(Half-  
fullFlag),PAE(ProgrammableAlmost-Emptyflag)andPAF(Programmable  
Almost-Fullflag).  
PIN CONFIGURATIONS (16-BIT V-III FAMILY)  
INDEX  
V
CC  
1
2
3
4
5
6
7
8
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
WEN  
SEN  
OE  
DNC(1)  
VCC  
VCC  
Q0  
DNC(1)  
GND  
GND  
D0  
Q1  
GND  
GND  
DNC(1)  
VCC  
9
Q2  
D1  
GND  
D2  
D3  
GND  
D4  
D5  
D6  
D7  
D8  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
VCC  
Q3  
Q4  
GND  
Q5  
GND  
Q6  
V
Q7  
Q8  
Q9  
CC  
VCC  
6163 drw02  
NOTE:  
1. DNC = Do Not Connect.  
TQFP (PN80-1, order code: PF)  
TOP VIEW  
2
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
The Partial Reset (PRS) also sets the read and write pointers to the first  
IfsynchronousPAE/PAFconfigurationisselected,thePAEisassertedand  
locationofthememory.However,theprogrammableflagsettingsexistingbefore updated on the rising edge of RCLK only and not WCLK. Similarly, PAF is  
PartialResetremainunchanged.PRS isusefulforresettingadeviceinmid- assertedandupdatedontherisingedgeofWCLKonlyandnotRCLK.Themode  
operation,whenreprogrammingprogrammableflagswouldbeundesirable. desiredisconfiguredduringMasterResetbythestateoftheProgrammableFlag  
ItisalsopossibletoselectthetimingmodeofthePAE(ProgrammableAlmost- Mode (PFM) pin.  
Empty flag) and PAF (Programmable Almost-Full flag) outputs. The timing  
modescanbesettobeeitherasynchronousorsynchronousforthePAEand automaticallypowerdown.Onceinthepowerdownstate,thestandbysupply  
PAFflags. currentconsumptionisminimized. Initiatinganyoperation(byactivatingcontrol  
IfasynchronousPAE/PAFconfigurationisselected, thePAEisasserted inputs)willimmediatelytakethedeviceoutofthepowerdownstate.  
LOWontheLOW-to-HIGHtransitionofRCLK.PAEisresettoHIGHontheLOW- The IDT V-III and Vx-III family of FIFOs are fabricated using IDTs high  
If,atanytime,theFIFOisnotactivelyperforminganoperation,thechipwill  
to-HIGHtransitionofWCLK.Similarly,thePAFisassertedLOWontheLOW- speedsubmicronCMOStechnology.  
to-HIGHtransitionofWCLKandPAF is resettoHIGHonthe LOW-to-HIGH  
transitionofRCLK.  
PIN CONFIGURATIONS (32-BIT Vx-III FAMILY)  
INDEX  
WEN  
OE  
1
2
3
4
102  
101  
100  
99  
98  
97  
96  
95  
94  
93  
92  
91  
90  
89  
88  
87  
86  
85  
84  
83  
82  
81  
80  
79  
78  
77  
76  
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
VCC  
SEN  
DNC(1)  
VCC  
Q0  
Q1  
Q2  
Q3  
GND  
VCC  
DNC(1)  
GND  
D0  
5
6
7
8
9
D1  
D2  
D3  
GND  
Q4  
Q5  
Q6  
Q7  
Q8  
DNC(1)  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
VCC  
D4  
D5  
GND  
D6  
VCC  
D7  
Q9  
D8  
GND  
D9  
D10  
GND  
GND  
D11  
Q10  
GND  
GND  
DNC(1)  
Q11  
Q12  
Q13  
Q14  
Q15  
GND  
Q16  
Q17  
VCC  
D12  
D13  
D14  
D15  
GND  
D16  
D17  
GND  
D18  
D19  
VCC  
VCC  
DNC(1)  
Q18  
Q19  
Q20  
VCC  
GND  
Q21  
Q22  
D20  
GND  
D21  
6163 drw03  
NOTE:  
1. DNC - Do Not Connect.  
TQFP: (PK128-1, order code: PF)  
TOP VIEW  
3
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
PIN CONFIGURATIONS-CONTINUED (32-BIT VX-III FAMILY)  
A1 BALL PAD CORNER  
A
WEN  
PAF  
LD  
FF  
HF  
EF  
REN  
OE  
V
CC  
WCLK  
GND  
FS1  
RCLK  
GND  
PAE  
Q0  
B
C
SEN  
PRS  
MRS  
GND  
FS0  
VCC  
PFM  
VCC  
Q1  
D0  
D3  
D6  
D1  
D4  
D7  
D2  
D5  
D8  
SI  
GND  
VCC  
VCC  
GND  
GND  
Q6  
Q3  
Q2  
Q4  
Q7  
D
E
VCC  
VCC  
GND  
GND  
GND  
GND  
VCC  
VCC  
Q5  
Q8  
VCC  
GND  
GND  
VCC  
Q9  
F
Q12  
Q13  
Q16  
Q19  
Q22  
D9  
D10  
D13  
D16  
D19  
D22  
D11  
D12  
D15  
D18  
D21  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
Q11  
Q14  
Q17  
Q20  
Q23  
Q10  
Q15  
Q18  
Q21  
DNC  
V
CC  
VCC  
G
D14  
D17  
D20  
D23  
VCC  
VCC  
H
J
VCC  
VCC  
V
CC  
VCC  
VCC  
VCC  
K
L
D28  
D31  
D30  
VCC  
VCC  
TDO  
Q29  
TCK  
GND  
GND  
1
GND  
GND  
2
D25  
D24  
3
D27  
D26  
4
TMS  
TRST  
6
Q31  
Q30  
8
Q28  
Q27  
9
Q26  
Q25  
10  
DNC  
Q24  
11  
DNC  
DNC  
M
D29  
TDI  
5
7
12  
6163 drw03b  
NOTE:  
1. DNC - Do Not Connect.  
PBGA: 1mm pitch, 13mm x 13mm (BB144-1, order code: BB)  
TOP VIEW  
4
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
PINDESCRIPTION  
Symbol  
D0–Dn  
EF  
Name  
DataInputs  
EmptyFlag  
Full Flag  
I/O  
I
Description  
Data inputs for a 16 or 32-bit bus  
O
O
I
EF indicates the FIFOmemoryis empty. See Table 2.  
FF indicates the FIFOmemoryis full. See Table 2.  
DuringMasterReset,thisinputalongwithFSEL1andtheLD pin,willselectthedefaultoffsetvaluesforthe  
programmableflags PAEandPAF.Thereareuptoeightpossiblesettings available.  
DuringMasterReset,thisinputalongwithFSEL0andtheLDpinwillselectthedefaultoffsetvaluesforthe  
programmableflags PAEandPAF.Thereareuptoeightpossiblesettings available.  
HFindicatestheFIFOmemoryismorethanhalf-full.HFisassertedwhenthenumberofwordswrittenintotheFIFO  
reaches N÷2+1, where N is the total depth of the FIFO. See Table 2.  
DuringMasterReset,thestateoftheLD inputalongwithFSEL0andFSEL1,determinesoneofeightdefaultoffset  
values forthePAEandPAF flags andserialprogrammingmode.AfterMasterReset, LDmustbehighandshould  
onlytoggleLOWtogetherwithSENtostartserialloadingoftheflagoffsets.  
FF  
FSEL0(1) FlagSelectBit0  
FSEL1(1) FlagSelectBit1  
I
O
I
HF  
LD  
Half-FullFlag  
Load  
MRS  
MasterReset  
OutputEnable  
I
MRSinitializesthereadandwritepointerstozeroandsetstheoutputregistertoall zeroes.DuringMasterReset,  
theFIFOisconfiguredforoneofeightprogrammableflagdefaultsettings,serialprogrammingoftheoffsetsettingsand  
synchronousversusasynchronousprogrammableflagtimingmodes.  
OE  
I
OEcontrolstheoutputlinedrivers.  
PAE  
Programmable  
Almost-EmptyFlag  
O
PAEgoesLOWifthenumberofwordsintheFIFOmemoryislessthanoffsetn,whichisstoredintheEmptyOffset  
register. PAE goes HIGH if the number of words in the FIFO memory is greater than or equal to offset n.  
PAF  
Programmable  
Almost-FullFlag  
O
I
PAF goes HIGHifthenumberoffreelocations intheFIFOmemoryis morethanoffsetm,whichis storedinthe  
FullOffsetregister. PAF goes LOWifthe numberoffree locations inthe FIFOmemoryis less thanorequaltom.  
DuringMasterReset,aLOWonPFMwillselectAsynchronous Programmableflagtimingmode.AHIGHonPFM  
willselectSynchronousProgrammableflagtimingmode.  
(1)  
PFM  
Programmable  
Flag Mode  
PRS  
PartialReset  
I
PRSinitializesthereadandwritepointerstozeroandsetstheoutputregistertoallzeroes.DuringPartialReset,  
theserialprogrammingmethodorprogrammableflagsettingsareallretained.  
Q0–Qn  
RCLK  
REN  
DataOutputs  
ReadClock  
ReadEnable  
SerialEnable  
O
I
Dataoutputs foran16or32-bitbus.Outputs arenot5Vtolerantregardless ofthestateofOE.  
When enabled by REN, the rising edge of RCLK reads data from the FIFO memory.  
REN enables RCLK for reading data from the FIFO memory.  
SENenablesserialloadingofprogrammableflagoffsets. SENmustbehighduringMasterResetandshouldonly  
toggleLOWtogetherwithLDtostartserialloadingoftheflagoffsets.  
I
SEN  
I
SI  
SerialIn  
I
I
I
I
I
AtMaserResetthispinisLOW.AfterMasterReset,thispinfunctionsasaserialinputforloadingoffsetregisters.  
Enabled by WEN, the risingedge ofWCLKwrites data intothe FIFO.  
WENenables WCLKforwritingdataintotheFIFOmemory.  
WCLK  
WEN  
VCC  
WriteClock  
WriteEnable  
+3.3VSupply  
Ground  
These are VCC supply inputs and must be connected to the 3.3V supply rail.  
GND  
GroundPins.  
NOTE:  
1. Inputs should not change state after Master Reset.  
**Please continue to next page for more Pin descriptions for PBGA package.  
5
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
PIN DESCRIPTION (32-BIT VX-III PBGA PACKAGE ONLY)  
Symbol  
Name  
I/O  
Description  
(1)  
TCK  
JTAGClock  
I
ClockinputforJTAGfunction.OneoffourterminalsrequiredbyIEEEStandard1149.1-1990.Testoperationsofthe  
devicearesynchronoustoTCK.DatafromTMSandTDIaresampledontherisingedgeofTCKandoutputschange  
onthefallingedgeofTCK.IftheJTAGfunctionis notusedthis signalneeds tobetiedtoGND.  
(1)  
TDI  
JTAGTestData  
Input  
I
OneoffourterminalsrequiredbyIEEEStandard1149.1-1990.DuringtheJTAGboundaryscanoperation,testdata  
seriallyloadedviatheTDIontherisingedgeofTCKtoeithertheInstructionRegister,IDRegisterandBypassRegister.  
Aninternalpull-upresistorforcesTDIHIGHifleftunconnected.  
(1)  
TDO  
JTAGTestData  
Output  
O
OneoffourterminalsrequiredbyIEEEStandard1149.1-1990.DuringtheJTAGboundaryscanoperation,testdata  
seriallyloadedoutputviatheTDOonthefallingedgeofTCKfromeithertheInstructionRegister,IDRegisterandBypass  
Register.This outputis highimpedanceexceptwhenshifting,whileinSHIFT-DRandSHIFT-IRcontrollerstates.  
TMS(1)  
JTAGModeSelect  
JTAGReset  
I
I
TMSisaserialinputpin.OneoffourterminalsrequiredbyIEEEStandard1149.1-1990.TMSdirectsthedevicethrough  
itsTAPcontrollerstates.Aninternalpull-upresistorforcesTMSHIGHifleftunconnected.  
(1)  
TRST  
TRSTisanasynchronousresetpinfortheJTAGcontroller.TheJTAGTAPcontrollerdoesnotautomaticallyreset  
upon power-up, thus it must be reset by either this signal or by setting TMS= HIGH for five TCK cycles. If the TAP  
controllerisnotproperlyresetthentheFIFOoutputswillalwaysbeinhigh-impedance.IftheJTAGfunctionisused  
butthe userdoes notwanttouse TRST, thenTRST canbe tiedwithMRS toensure properFIFOoperation. Ifthe  
JTAGfunctionisnotusedthenthissignalneedstobetiedtoGND.Aninternalpull-upresistorforcesTRSTHIGHif  
leftunconnected.  
NOTE:  
1. These pins are for the JTAG port. Please refer to pages 15-19 and Figures 2-4.  
6
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
ABSOLUTE MAXIMUM RATINGS  
RECOMMENDEDDCOPERATING  
CONDITIONS  
Symbol  
Rating  
Industrial  
Unit  
(2)  
Symbol  
Parameter  
SupplyVoltageIndustrial  
Min. Typ.  
Max. Unit  
VTERM  
TerminalVoltage  
with respect to GND  
–0.5to+4.5  
V
(1)  
VCC  
3.15  
0
3.3  
0
3.45  
0
V
V
TSTG  
IOUT  
Storage  
Temperature  
–55to+125  
–50to+50  
°C  
GND SupplyVoltageIndustrial  
(2)  
VIH  
InputHighVoltageIndustrial  
InputLowVoltageIndustrial  
OperatingTemperatureIndustrial  
2.0  
-40  
5.5  
0.8  
85  
V
DCOutputCurrent  
mA  
(3)  
VIL  
TA  
V
NOTES:  
°C  
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause  
permanent damage to the device. This is a stress rating only and functional operation of  
the device at these or any other conditions above those indicated in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect reliability.  
NOTES:  
1. VCC = 3.3V ± 0.15V, JEDEC JESD8-A compliant.  
2. Outputs are not 5V tolerant.  
3. 1.5V undershoots are allowed for 10ns once per cycle.  
2. VCC terminal only.  
DCELECTRICALCHARACTERISTICS  
(Industrial: VCC = 3.3V ± 0.15V, TA = -40°C to +85°C; JEDEC JESD8-A compliant)  
IDT72V15160, IDT72V14320  
IDT72V16160, IDT72V15320  
IDT72V17160, IDT72V16320  
IDT72V18160, IDT72V17320  
IDT72V19160, IDT72V18320  
IDT72V19320  
Industrial  
tCLK = 10ns  
Symbol  
Parameter  
Min.  
Max.  
Unit  
(1)  
ILI  
InputLeakageCurrent  
OutputLeakageCurrent  
–1  
–10  
2.4  
1
µ A  
µA  
V
(2)  
ILO  
10  
0.4  
40  
15  
VOH  
Output Logic 1Voltage, IOH = –2 mA  
Output Logic 0Voltage, IOL = 8 mA  
Active Power Supply Current  
StandbyCurrent  
VOL  
V
ICC1(3,4,5)  
ICC2(3,6)  
mA  
mA  
NOTES:  
1. Measurements with 0.4 VIN VCC.  
2. OE VIH, 0.4 VOUT VCC.  
3. Tested with outputs open (IOUT = 0).  
4. RCLK and WCLK toggle at 20 MHz and data inputs switch at 10 MHz.  
5. Typical ICC1 = 4.2 + 1.4*fS + 0.02*CL*fS (in mA) with VCC = 3.3V, tA = 25°C, fS = WCLK frequency = RCLK frequency (in MHz, using TTL levels), data switching at fS/2,  
CL = capacitive load (in pF).  
6. All Inputs = VCC - 0.2V or GND + 0.2V, except RCLK and WCLK, which toggle at 20 MHz.  
CAPACITANCE(TA = +25°C, f = 1.0MHz)  
Symbol  
Parameter(1)  
Conditions  
Max.  
Unit  
(2)  
CIN  
Input  
VIN = 0V  
10  
pF  
Capacitance  
(1,2)  
COUT  
Output  
VOUT = 0V  
10  
pF  
Capacitance  
NOTES:  
1. With output deselected, (OE VIH).  
2. Characterized values, not currently tested.  
7
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
ACELECTRICALCHARACTERISTICS  
(Industrial: VCC = 3.3V ± 0.15V, TA = -40°C to +85°C; JEDEC JESD8-A compliant)  
Industrial  
IDT72V15160L10  
IDT72V16160L10  
IDT72V17160L10  
IDT72V18160L10  
IDT72V19160L10  
IDT72V14320L10  
IDT72V15320L10  
IDT72V16320L10  
IDT72V17320L10  
IDT72V18320L10  
IDT72V19320L10  
Symbol Parameter  
Min.  
2
Max  
100  
6.5  
15  
Unit  
Mhz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
fS  
Clock Cycle Frequency  
tA  
DataAccessTime  
Clock Cycle Time  
Clock High Time  
tCLK  
tCLKH  
tCLKL  
tDS  
10  
4.5  
4.5  
3.5  
0.5  
3.5  
0.5  
3.5  
0.5  
10  
15  
10  
0
Clock Low Time  
DataSetupTime  
tDH  
DataHoldTime  
tENS  
tENH  
tLDS  
EnableSetupTime  
EnableHoldTime  
LoadSetupTime  
tLDH  
tRS  
LoadHoldTime  
ResetPulseWidth(1)  
ResetSetupTime  
ResetRecoveryTime  
ResettoFlagandOutputTime  
tRSS  
tRSR  
tRSF  
tOLZ  
tOE  
(2)  
OutputEnabletoOutputinLowZ  
OutputEnabletoOutputValid  
6
2
(2)  
tOHZ  
tWFF  
tREF  
tPAFA  
tPAFS  
tPAEA  
tPAES  
tHF  
OutputEnabletoOutputinHigh-Z  
2
6
Write Clock to FF  
Read Clock to EF  
7
6.5  
6.5  
16  
ClocktoAsynchronousProgrammableAlmost-FullFlag  
WriteClocktoSynchronousProgrammableAlmost-FullFlag  
ClocktoAsynchronousProgrammableAlmost-EmptyFlag  
ReadClocktoSynchronousProgrammableAlmost-EmptyFlag  
Clock to HF  
6.5  
16  
6.5  
16  
tSKEW1  
tSKEW2  
Skew time between RCLK and WCLK for EF and FF  
Skew time between RCLK and WCLK for PAE and PAF  
10  
NOTES:  
1. Pulse widths less than minimum values are not allowed.  
2. Values guaranteed by design, not currently tested.  
8
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
AC TEST LOADS  
ACTESTCONDITIONS  
InputPulseLevels  
GND to 3.0V  
3ns(1)  
3.3V  
InputRise/FallTimes  
InputTimingReferenceLevels  
OutputReferenceLevels  
OutputLoadfortCLK=10ns  
1.5V  
330Ω  
1.5V  
SeeFigure1  
D.U.T.  
510Ω  
30pF*  
6163 drw04  
Figure 1. Output Load  
* Includes jig and scope capacitances.  
OUTPUT ENABLE & DISABLE TIMING  
Output  
Enable  
Output  
Disable  
VIH  
OE  
VIL  
tOE &  
tOLZ  
tOHZ  
Output  
Normally  
LOW  
VCC  
2
V
2
CC  
100mV  
100mV  
100mV  
VOL  
VOH  
Output  
Normally  
HIGH  
VCC  
100mV  
VCC  
2
2
6163 drw04a  
NOTE:  
1. REN is HIGH.  
9
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
FUNCTIONALDESCRIPTION  
TABLE 1 — DEFAULT PROGRAMMABLE  
FLAG OFFSETS  
To write data into to the FIFO, Write Enable (WEN) must be LOW. Data  
presentedtothe DATAINlines willbe clockedintothe FIFOonsubsequent  
transitionsoftheWriteClock(WCLK).Afterthefirstwriteisperformed,theEmpty  
Flag(EF)willgoHIGH.SubsequentwriteswillcontinuetofilluptheFIFO.The  
ProgrammableAlmost-Emptyflag(PAE)willgoHIGHaftern + 1wordshave  
beenloadedintotheFIFO,wheren”istheemptyoffsetvalue.Thedefaultsetting  
forthesevaluesarestatedinthefootnoteofTable1.Thisparameterisalsouser  
programmable.  
If one continued to write data into the FIFO, and we assumed no read  
operationsweretakingplace,theHalf-Fullflag(HF)wouldtoggletoLOWonce  
D/2+1(D=totalnumberof words)waswrittenintotheFIFO. Continuingtowrite  
dataintotheFIFOwillcausetheProgrammableAlmost-Fullflag(PAF)togo  
LOW.Again,ifnoreadsareperformed, thePAFwillgoLOWafter(D-m).The  
offsetm”isthefulloffsetvalue.Thedefaultsettingforthesevaluesarestated  
inthefootnoteofTable1.Thisparameterisalsouserprogrammable.  
WhentheFIFOisfull,theFullFlag(FF)willgoLOW,inhibitingfurtherwrite  
operations. Ifnoreadsareperformedafterareset,FFwillgoLOWafterDwrites  
totheFIFO.  
IDT72V14320, 72V15360  
LD  
L
L
L
L
H
H
H
H
FSEL1  
FSEL0  
Offsets n,m  
H
L
L
H
L
H
L
H
L
H
L
H
L
L
H
H
511  
255  
127  
63  
31  
15  
7
3
IDT72V16320, 72V17320, 72V18320, 72V19320  
IDT72V15160, 72V16160, 72V17160, 72V18160  
LD  
H
L
L
L
FSEL1  
FSEL0  
Offsets n,m  
L
H
L
L
L
H
L
H
L
H
H
1,023  
511  
255  
127  
63  
31  
15  
7
If the FIFO is full, the first read operation will cause FF to go HIGH.  
SubsequentreadoperationswillcausePAFandHFtogoHIGH.If furtherread  
operationsoccur,withoutwriteoperations,PAEwillgoLOWwhenthereare  
n words in the FIFO, where n is the empty offset value. Continuing read  
operationswillcausetheFIFOtobecomeempty.Whenthelastwordhasbeen  
readfromtheFIFO,theEFwillgoLOWinhibitingfurtherreadoperations.REN  
is ignored when the FIFO is empty.  
L
L
H
H
L
H
H
H
H
The EFand FF outputs are double register-bufferedoutputs.  
IDT72V19160  
LD  
H
L
L
L
FSEL1  
FSEL0  
Offsets n,m  
1,023  
8,191  
16,383  
127  
PROGRAMMING FLAG OFFSETS  
Full andEmptyFlagoffsetvalues are userprogrammable. The IDTV-III  
andVx-IIIFIFOs haveinternalregisters fortheseoffsets.  
Therearetwowaystoprogramtheflagoffsetvalues.Selectingoneofthe  
eightpre-setvaluesduringmasterresetorserialprogramming.  
L
H
L
L
L
H
L
L
L
H
H
L
H
L
H
H
4,095  
511  
2,047  
255  
DEFAULT FLAG OFFSETS  
ThereareeightdefaultoffsetvaluesselectableduringMasterReset. These  
offset values are shown in Table 1.  
Programming offsets with default values (LD, SEN pins): With the  
LDpintogetherwiththeFSEL0andFSEL1theuserhastheoptiontochoose  
oneofeightpresetvaluesforbothoffsetregisters.DuringmasterresettheLD  
pincanbeeitherHIGHorLOWdependingontheselectedvalue.AfterMaster  
Reset,LDmust be high andshouldnotchangestate.SENshouldbehighduring  
andafterMasterResetandshouldnotchangestate.  
H
H
H
H
All Devices  
LD  
FSEL1  
FSEL0  
Program Mode  
(3)  
H
X
X
Serial  
NOTES:  
1. n = empty offset for PAE.  
2. m = full offset for PAF.  
3. As well as selecting serial programming mode, one of the default values will also  
be loaded depending on the state of FSEL0 & FSEL1.  
SERIAL PROGRAMMING MODE  
Offset values can also be programmed into the FIFO by serial loading  
method.Theoffsetregistersmaybeprogrammed(andreprogrammed)any  
timeafterMasterReset.Validprogrammingrangesarefrom0toD-1.  
Serialprogrammingofoffsetvalues (LD,SENpins):Inordertoselect  
serialprogrammingthe LD pinhas tobe HIGHduringmaster. Both,LD and  
SEN pinhave totoggle toLOWinordertoinitialthe serialprogramming. LD  
should be high during normal FIFO operation.  
Atotalof  
20 bits for the IDT72V14320  
22 bits for the IDT72V15320  
24 bits for the IDT72V15160, IDT72V16320  
26 bits for the IDT72V16160, IDT72V17320  
28 bits for the IDT72V17160, IDT72V18320  
30 bits for the IDT72V18160, IDT72V19320  
32 bits for the IDT72V19160  
IfSerialProgrammingmodehasbeenselectedthenprogrammingofPAE  
andPAFvaluescanbeachievedbyusingacombinationoftheLD,SEN,WCLK  
andSIinputpins.ProgrammingPAEandPAFproceedsasfollows: whenLD  
andSENaresetLOW,dataontheSIinputarewritten,onebitforeachWCLK  
risingedge,startingwiththeEmptyOffsetLSBandendingwiththeFullOffset  
MSB.  
has to be loaded serial for the two (PAF, PAE) registers.  
10  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
TABLE 2 STATUS FLAGS FOR IDT STANDARD MODE  
IDT72V15160  
IDT72V14320  
IDT72V15320  
IDT72V16320  
FF PAF HF PAE EF  
L
0
H
H
H
H
H
L
H
H
H
H
L
H
H
H
L
L
L
0
0
1 to n(1)  
1 to n(1)  
1 to n(1)  
Number of  
Words in  
FIFO  
H
H
H
H
H
(n+1) to 512  
H
H
H
H
(n+1) to 1,024  
(n+1) to 2,048  
513 to (1,024-(m+1))  
(1,024-m) to 1,023  
1,024  
1,025 to (2,048-(m+1))  
(2,048-m) to 2,047  
2,048  
2,049 to (4,096-(m+1))  
(4,096m) to 4,095  
4,096  
L
L
L
IDT72V18160  
IDT72V19320  
IDT72V16160  
IDT72V19160  
IDT72V17160  
IDT72V18320  
IDT72V17320  
FF PAF HF PAE EF  
L
0
H
H
H
H
H
L
H
H
H
H
L
H
H
H
L
L
L
0
0
0
1 to n(1)  
1 to n(1)  
1 to n(1)  
1 to n(1)  
Number of  
Words in  
FIFO  
H
H
H
H
H
(n+1) to 4,096  
H
H
H
H
(n+1) to 8,192  
(n+1) to 16,384  
(n+1) to 32,768  
4,097 to (8,192-(m+1))  
(8,192-m) to 8,191  
8,192  
8,193 to (16,384-(m+1))  
(16,384-m) to 16,383  
16,384  
16,385 to (32,768-(m+1)) 32,769 to (65,536-(m+1))  
L
(32,768-m) to 32,767  
32,768  
(65,536-m) to 65,535  
65,536  
L
L
6163 drw05  
NOTE:  
1. See Table 1 for values for n, m.  
11  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
TABLE 3 — FLAG OFFSET PROGRAMMING, STATE OF LD AND  
SEN AFTER MASTER RESET  
Operation  
LD  
WEN  
REN  
SEN  
WCLK RCLK  
Serial Flag Programming  
0
1
1
0
X
1 bit for each rising WCLK edge  
Starting with Empty Offset (LSB)  
Ending with Full Offset (MSB)  
X
Write Memory  
Read Memory  
1
1
0
X
0
X
X
X
X
X
X
X
X
1
1
1
No Operation  
X
X
1
0
1
0
1
1
X
1
No Operation  
Invalid Operation  
X
0
1
0
1
Invalid Operation  
6163 drw06  
Using the serial method, individual registers cannot be programmed  
selectively. PAEandPAFcanshowavalidstatusonlyafterthecompleteset  
of bits (for all offset registers) has been entered. The registers can be  
reprogrammedaslongasthecompletesetofnewoffsetbitsisentered. When  
LD is LOW and SEN is HIGH, no serial write to the registers can occur.  
Write operations to the FIFO are allowed before and during the serial  
programmingsequence. Inthiscase,theprogrammingofalloffsetbitsdoesnot  
havetooccuratonce. AselectnumberofbitscanbewrittentotheSIinputand  
then,bybringingLDandSENHIGH,datacanbewrittentoFIFOmemoryvia  
DnbytogglingWEN. WhenWENisbroughtHIGHwithLDandSENrestored  
toaLOW,thenextoffsetbitinsequenceiswrittentotheregistersviaSI. Ifan  
interruptionofserialprogrammingisdesired,itissufficienteithertosetLDLOW  
anddeactivateSENortosetSENLOWanddeactivateLD. OnceLDandSEN  
arebothrestoredtoaLOWlevel,serialoffsetprogrammingcontinues.  
Fromthetimeserialprogramminghasbegun,neitherprogrammableflag  
willbevaliduntilthefullsetofbitsrequiredtofillalltheoffsetregistershasbeen  
written. MeasuringfromtherisingWCLKedgethatachievestheabovecriteria;  
PAFwillbevalidaftertwomorerisingWCLKedgesplustPAF,PAEwillbevalid  
afterthe nexttworisingRCLKedges plus tPAE plus tSKEW2.  
Refer also to LD Signal description for more information on flag offset  
programmingandstaterequirementsforLD andSENpins  
SYNCHRONOUS vs ASYNCHRONOUS PROGRAMMABLE FLAG  
TIMING SELECTION  
TheIDTV-IIIandVx-III canbeconfiguredduringtheMasterResetcycle  
witheither synchronousorasynchronoustimingforPAFandPAEflagsbyuse  
ofthe PFMpin.  
If synchronous PAF/PAE configuration is selected (PFM, HIGH during  
MRS),thePAFisassertedandupdatedontherisingedgeofWCLKonlyand  
notRCLK. Similarly,PAEisassertedandupdatedontherisingedgeofRCLK  
onlyandnotWCLK.  
If asynchronous PAF/PAE configuration is selected (PFM, LOW during  
MRS),thePAFisassertedLOWontheLOW-to-HIGHtransitionofWCLKand  
PAFisresettoHIGHontheLOW-to-HIGHtransitionofRCLK. Similarly,PAE  
isassertedLOWontheLOW-to-HIGHtransitionofRCLK.PAEisresettoHIGH  
ontheLOW-to-HIGHtransitionofWCLK.  
12  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
TheOEinputisusedtoprovideAsynchronouscontrolofthethree-stateQn  
outputs.  
SIGNALDESCRIPTION  
INPUTS:  
DATA IN (D0 - Dn)  
READ ENABLE ( REN )  
Data inputs for16or32-bitwide data.  
When Read Enable is LOW, data is loaded from the FIFO array into the  
outputregisterontherisingedgeofeveryRCLKcycleifthedeviceisnotempty.  
WhentheRENinputisHIGH,theoutputregisterholdsthepreviousdata  
andnonewdata is loadedintothe outputregister. The data outputs Q0-Qn  
maintainthepreviousdatavalue.  
EverywordaccessedatQn,includingthefirstwordwrittentoanemptyFIFO,  
mustberequestedusingREN. WhenthelastwordhasbeenreadfromtheFIFO,  
the Empty Flag (EF) will go LOW, inhibiting further read operations. RENis  
ignoredwhentheFIFOisempty.Onceawriteisperformed,EFwillgoHIGH  
allowingareadtooccur. TheEFflagisupdatedbytwoRCLKcycles+tSKEW  
afterthevalidWCLKcycle.  
CONTROLS:  
MASTER RESET ( MRS )  
AMasterResetisaccomplishedwhenevertheMRSinputistakentoaLOW  
state.Thisoperationsetstheinternalreadandwritepointerstothefirstlocation  
ofthe RAMarray. PAEwill goLOW, PAF willgoHIGH,HF willgoHIGH,EF  
will go LOW and FF will go HIGH.  
SIis supposedtobeLOWduringmasterreset.  
PFMcontrolsettingsaredefinedduringtheMasterResetcycle.  
DuringaMasterReset,theoutputregisterisinitializedtoallzeroes.AMaster  
Resetisrequiredafterpowerup,beforeawriteoperationcantakeplace.MRS  
isasynchronous.  
SERIAL ENABLE ( SEN )  
TheSENinput isanenableusedonlyforserialprogrammingoftheoffset  
registers. The serial programming method must be selected during Master  
Reset. SENisalwaysusedinconjunctionwithLD. Whentheselinesareboth  
LOW,dataattheSIinputcanbeloadedintotheprogramregisteronebitforeach  
LOW-to-HIGHtransitionofWCLK.  
When SEN is HIGH, the programmable registers retains the previous  
settingsandnooffsetsareloaded. SENfunctionsthesamewayinbothIDT.  
RefertoLOAD(LD)pinandsectionProgrammingFlagOffsets”formore  
informationonoffsetprogramming.  
PARTIAL RESET ( PRS )  
APartialResetisaccomplishedwheneverthePRS inputistakentoaLOW  
state.AsinthecaseoftheMasterReset,theinternalreadandwritepointers  
aresettothefirstlocationoftheRAMarray,PAEgoesLOW, PAFgoesHIGH,  
HF goes HIGH, FF willgoHIGHandEF willgoLOW. The outputregisteris  
initializedtoallzeroes. PRSisasynchronous.  
A Partial Reset is useful for resetting the device during the course of  
operation,whenreprogrammingprogrammableflagoffsetsettingsmaynotbe  
convenient.  
OUTPUT ENABLE (OE)  
WhenOutputEnableisenabled(LOW),theparalleloutputbuffersreceive  
datafromtheoutputregister. WhenOEisHIGH,theoutputdatabus(Qn)goes  
intoahighimpedancestate.  
SERIAL IN (SI)  
AtthetimeofMasterReset,SImustbeLOW.  
AfterMasterReset,SIactsasaserialinputforloadingPAEandPAFoffsets  
intotheprogrammableregisters.  
LOAD ( LD )  
Thisisadualpurposepin. DuringMasterReset,thestateoftheLDinput,  
alongwithFSEL0andFSEL1,determinesoneofeightdefaultoffsetvaluesfor  
thePAEandPAFflags,alongwiththeserialprogrammingoptionfortheseoffset  
registers (see Table 3).  
AfterMasterReset, the LD pinis usedinconjunctionwiththe SEN pinto  
activatetheprogrammingprocessoftheflagoffsetvaluesPAEandPAF.Pulling  
LDLOWwillbeginaserialloadingoftheseoffsetvalues.  
WRITE CLOCK (WCLK)  
AwritecycleisinitiatedontherisingedgeoftheWCLKinput.Datasetup  
andholdtimesmustbemetwithrespecttotheLOW-to-HIGHtransitionofthe  
WCLK.ItispermissibletostoptheWCLK. NotethatwhileWCLKisidle,theFF,  
PAF and HF flags will not be updated. (Note that WCLK is only capable of  
updating HF flag to LOW). The Write and Read Clocks can either be  
independentorcoincident.  
DependingonthedefaultorserialprogrammingoptionthestateofLDand  
SENhavetobeconsideredbeforeandaftermasterreset.Referalsotosection  
ProgrammingFlagOffsets”formoreinformationonoffsetprogramming.  
Programmingoffsets withdefaultvalues:WiththeLDpintogetherwith  
the FSEL0andFSEL1the userhas the optiontochoose one ofeightpreset  
values forbothoffsetregisters.DuringmasterresettheLD pincanbeeither  
HIGHorLOWdependingontheselectedvalue.AfterMasterReset,LDmust  
be high and should not change state. SEN should be high during and after  
MasterResetandshouldnotchangestate.  
Serialprogrammingofoffsetvalues:Inordertoselectserialprogram-  
ming the LD pin has to be HIGH during master. Both, LD and SEN pin have  
totoggletoLOWinordertoinitialtheserialprogramming.LDshouldbehigh  
duringnormalFIFOoperation.  
WRITE ENABLE ( WEN )  
WhentheWENinput isLOW,datamaybeloadedintotheFIFOarrayon  
the risingedge ofeveryWCLKcycle ifthe device is notfull. Data is storedin  
theFIFOarraysequentiallyandindependentlyofanyongoingreadoperation.  
WhenWENisHIGH,nonewdataiswrittenintheFIFO arrayoneachWCLK  
cycle.  
Topreventdataoverflow,FFwillgoLOW,inhibitingfurtherwriteoperations.  
Uponthecompletionofavalidreadcycle,FF willgoHIGHallowingawriteto  
occur. TheFFisupdatedbytwoWCLKcycles+tSKEW aftertheRCLKcycle.  
WEN is ignored when the FIFO is full.  
READ CLOCK (RCLK)  
A readcycleisinitiatedontherisingedgeoftheRCLKinput. Datacanbe  
readontheoutputs,ontherisingedgeoftheRCLKinput. Itispermissibleto  
stoptheRCLK. NotethatwhileRCLKisidle,theEF,PAEandHFflagswillnot  
beupdated.(NotethatRCLKisonlycapableofupdatingtheHF flagtoHIGH).  
The Write andReadClocks canbe independentorcoincident.  
PROGRAMMABLEFLAGMODE(PFM)  
DuringMasterReset,aLOWonPFMwillselectAsynchronousProgram-  
mableflagtimingmode.AHIGHonPFMwillselectSynchronousProgrammable  
flagtimingmode.IfasynchronousPAF/PAEconfigurationisselected(PFM,  
13  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
ofwords,m=fulloffsetvalue).Thedefaultsettingforthisvalueisstatedinthe  
footnoteofTable1.  
IfasynchronousPAFconfigurationisselected,thePAFisassertedLOW  
ontheLOW-to-HIGHtransitionoftheWriteClock(WCLK). PAFisresettoHIGH  
ontheLOW-to-HIGHtransitionoftheReadClock(RCLK). IfsynchronousPAF  
configurationisselected,thePAFisupdatedontherisingedgeofWCLK.  
LOWduringMRS),thePAEisassertedLOWontheLOW-to-HIGHtransition  
of RCLK. PAE is reset to HIGH on the LOW-to-HIGH transition of WCLK.  
Similarly,thePAFisassertedLOWontheLOW-to-HIGHtransitionofWCLKand  
PAFis resettoHIGHontheLOW-to-HIGHtransitionofRCLK.  
If synchronous PAE/PAF configuration is selected (PFM, HIGH during  
MRS),thePAEisassertedandupdatedontherisingedgeofRCLKonlyand  
notWCLK.Similarly,PAFisassertedandupdatedontherisingedgeofWCLK  
onlyandnotRCLK.Themodedesiredisconfiguredduringmasterresetbythe  
stateoftheProgrammableFlagMode(PFM)pin.  
PROGRAMMABLEALMOST-EMPTYFLAG(PAE)  
TheProgrammableAlmost-Emptyflag(PAE)willgoLOWwhentheFIFO  
reachesthealmost-emptycondition.PAEwillgoLOWwhentherearenwords  
orlessintheFIFO.Theoffsetn”istheemptyoffsetvalue.Thedefaultsetting  
forthisvalueisstatedinthefootnoteofTable 1.  
OUTPUTS:  
IfasynchronousPAEconfigurationisselected,thePAEisassertedLOW  
ontheLOW-to-HIGHtransitionoftheReadClock(RCLK). PAEisresettoHIGH  
ontheLOW-to-HIGHtransitionoftheWriteClock(WCLK). IfsynchronousPAE  
configurationisselected,thePAEisupdatedontherisingedgeofRCLK.  
FULL FLAG ( FF )  
WhentheFIFOisfull,FF willgoLOW,inhibitingfurtherwriteoperations.  
WhenFF isHIGH,theFIFOisnotfull. Ifnoreadsareperformedafterareset  
(eitherMRSorPRS),FFwillgoLOWafterDwritestotheFIFO(D = totalnumber  
ofwords).  
FFissynchronousandupdatedontherisingedgeofWCLK.FFisadouble  
register-bufferedoutput.  
HALF-FULL FLAG ( HF )  
Thisoutputindicatesahalf-fullFIFO.TherisingWCLKedgethatfillstheFIFO  
beyondhalf-fullsetsHFLOW.TheflagremainsLOWuntilthedifferencebetween  
thewriteandreadpointersbecomeslessthanorequaltohalfofthetotaldepth  
ofthedevice;therisingRCLKedgethataccomplishesthisconditionsetsHF  
HIGH.  
Ifnoreadsareperformedafterreset(MRSorPRS),HFwillgoLOWafter  
(D/2 + 1)writestotheFIFO,whereD=totalnumberofwordsavailableinthe  
FIFO.  
EMPTY FLAG ( EF )  
WhentheFIFOisempty,EFwillgoLOW,inhibitingfurtherreadoperations.  
When EF is HIGH, the FIFOis notempty.  
EFissynchronousandupdatedontherisingedgeofRCLK.EFisadouble  
register-bufferedoutput.  
Because HF is updated by both RCLK and WCLK, it is considered  
asynchronous.  
PROGRAMMABLE ALMOST-FULL FLAG (PAF )  
The Programmable Almost-Full flag (PAF) will go LOW when the FIFO  
reachesthealmost-fullcondition.Ifnoreadsareperformedafterreset(MRS),  
PAFwillgoLOWafter(D - m)wordsarewrittentotheFIFO.(D=totalnumber  
DATAOUTPUTS(Q0-Qn)  
(Q0-Qn)are data outputs for16-bitor32-bitwide data.  
14  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
tTCK  
t4  
t1  
t2  
TCK  
t3  
TDI/  
TMS  
tDS  
tDH  
TDO  
TDO  
tDO  
t6  
TRST  
6163 drw07  
Notes to diagram:  
t1 = tTCKLOW  
t2 = tTCKHIGH  
t5  
t3 = tTCKFALL  
t4 = tTCKRISE  
t5 = tRST (reset pulse width)  
t6 = tRSR (reset recovery)  
Figure 2. Standard JTAG Timing  
JTAG  
ACELECTRICALCHARACTERISTICS  
(VCC = 3.3V ± 5%; Tcase = 0°C to +85°C)  
SYSTEMINTERFACEPARAMETERS  
Parameter  
Symbol  
Test  
Conditions  
IDT72V14320  
IDT72V15320  
IDT72V16320  
IDT72V17320  
IDT72V18320  
IDT72V19320  
Min. Max. Units  
JTAGClockInputPeriod tTCK  
-
-
-
-
-
-
-
100  
40  
40  
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
JTAGClockHIGH  
JTAGClockLow  
tTCKHIGH  
tTCKLOW  
tTCKRISE  
tTCKFALL  
tRST  
-
Parameter  
Symbol Test Conditions Min. Max. Units  
JTAGClockRiseTime  
JTAGClockFallTime  
JTAGReset  
5(1)  
5(1)  
-
(1)  
DataOutput  
tDO  
-
20  
-
ns  
ns  
ns  
-
(1)  
DataOutputHold tDOH  
0
50  
50  
DataInput  
tDS  
tDH  
trise=3ns  
tfall=3ns  
10  
10  
-
-
JTAG Reset Recovery  
tRSR  
-
NOTE:  
1. 50pf loading on external output signals.  
NOTE:  
1. Guaranteed by design.  
15  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
TheStandardJTAGinterfaceconsistsoffourbasicelements:  
JTAGINTERFACE  
Test Access Port (TAP)  
TAPcontroller  
Instruction Register (IR)  
Data Register Port (DR)  
Five additional pins (TDI, TDO, TMS, TCK and TRST) are provided to  
support the JTAG boundary scan interface. The IDT72V14320/72V15320/  
72V16320/72V17320/72V18320/72V19320incorporatesthenecessarytap  
controllerandmodifiedpadcellstoimplementtheJTAG facility.  
NotethatIDTprovidesappropriateBoundaryScanDescriptionLanguage  
programfilesforthesedevices.  
Thefollowingsectionsprovideabriefdescriptionofeachelement. Fora  
completedescriptionrefertotheIEEEStandardTestAccessPortSpecification  
(IEEEStd. 1149.1-1990).  
The Figure belowshows the standardBoundary-ScanArchitecture  
Mux  
DeviceID Reg.  
Boundary Scan Reg.  
Bypass Reg.  
TDO  
TDI  
T
A
clkDR, ShiftDR  
UpdateDR  
P
TMS  
TAP  
TCLK  
Cont-  
roller  
TRST  
Instruction Decode  
clklR, ShiftlR  
UpdatelR  
Instruction Register  
Control Signals  
6163 drw08  
Figure 3. Boundary Scan Architecture  
THETAPCONTROLLER  
TEST ACCESS PORT (TAP)  
TheTapcontrollerisasynchronousfinitestatemachinethatrespondsto  
TMSandTCLKsignalstogenerateclockandcontrolsignalstotheInstruction  
andDataRegisters forcaptureandupdateofdata.  
The Tap interface is a general-purpose port that provides access to the  
internaloftheprocessor. Itconsistsoffourinputports(TCLK,TMS,TDI,TRST)  
and one output port (TDO).  
16  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
1
Test-Logic  
Reset  
0
1
0
1
1
Run-Test/  
Idle  
Select-  
DR-Scan  
Select-  
IR-Scan  
0
0
1
1
Capture-DR  
Capture-IR  
0
0
0
0
Shift-IR  
Shift-DR  
1
1
1
1
Exit1-IR  
EXit1-DR  
Input = TMS  
0
0
0
0
Pause-IR  
Pause-DR  
1
1
Exit2-IR  
Exit2-DR  
0
0
1
1
Update-IR  
Update-DR  
1
0
1
0
6163 drw09  
NOTES:  
1. Five consecutive TCK cycles with TMS = 1 will reset the TAP.  
2. TAP controller does not automatically reset upon power-up. The user must provide a reset to the TAP controller (either by TRST or TMS).  
3. TAP controller must be reset before normal FIFO operations can begin.  
Figure 4. TAP Controller State Diagram  
Refer to the IEEE Standard Test Access Port Specification (IEEE Std.  
1149.1)forthefullstatediagram  
Capture-IRInthiscontrollerstate,theshiftregisterbankintheInstruction  
RegisterparallelloadsapatternoffixedvaluesontherisingedgeofTCK.The  
AllstatetransitionswithintheTAPcontrolleroccurattherisingedgeofthe lasttwosignificantbits arealways requiredtobe01.  
TCLKpulse. The TMSsignallevel(0or1)determines the state progression  
Shift-IR In this controller state, the instruction register gets connected  
thatoccursoneachTCLKrisingedge.TheTAPcontrollertakesprecedence betweenTDIandTDO,andthecapturedpatterngetsshiftedoneachrisingedge  
over the FIFO memory and must be reset after power up of the device. See ofTCK.TheinstructionavailableontheTDIpinisalsoshiftedintotheinstruction  
TRSTdescriptionformoredetailsonTAPcontrollerreset.  
Test-Logic-ResetAlltestlogicisdisabledinthiscontrollerstateenablingthe  
register.  
Exit1-IRThisisacontrollerstatewhereadecisiontoentereitherthePause-  
normaloperationoftheIC.TheTAPcontrollerstatemachineisdesignedinsuch IRstateorUpdate-IRstateismade.  
awaythat,nomatterwhattheinitialstateofthecontrolleris,theTest-Logic-Reset  
Pause-IRThis state is providedinordertoallowthe shiftingofinstruction  
statecanbeenteredbyholdingTMSathighandpulsingTCKfivetimes.This registertobetemporarilyhalted.  
is the reason why the Test Reset (TRST) pin is optional.  
Exit2-DRThisisacontrollerstatewhereadecisiontoentereithertheShift-  
Run-Test-IdleInthiscontrollerstate,thetestlogicintheICisactiveonlyif IRstateorUpdate-IRstateismade.  
certaininstructionsarepresent.Forexample,ifaninstructionactivatestheself  
Update-IRInthiscontrollerstate,theinstructionintheinstructionregisteris  
test,thenitwillbeexecutedwhenthecontrollerentersthisstate.Thetestlogic latchedintothelatchbankoftheInstructionRegisteroneveryfallingedgeof  
intheICis idles otherwise.  
Select-DR-ScanThis is a controllerstate where the decisiontoenterthe  
DataPathortheSelect-IR-Scanstateismade.  
TCK.Thisinstructionalsobecomesthecurrentinstructiononceitislatched.  
Capture-DRInthiscontrollerstate,thedataisparallelloadedintothedata  
registersselectedbythecurrentinstructionontherisingedgeofTCK.  
Shift-DR, Exit1-DR, Pause-DR, Exit2-DR and Update-DR These  
Select-IR-Scan This is a controller state where the decision to enter the  
InstructionPathismade.TheControllercanreturntotheTest-Logic-Resetstate controllerstates are similartothe Shift-IR, Exit1-IR, Pause-IR, Exit2-IRand  
otherwise. Update-IRstatesintheInstructionpath.  
17  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
THE INSTRUCTION REGISTER  
31(MSB)  
28 27  
12 11  
1 0(LSB)  
Version (4 bits) Part Number (16-bit) Manufacturer ID (11-bit)  
0X0 0X33  
TheInstructionregisterallowsaninstructiontobeshiftedinseriallyintothe  
processor at the rising edge of TCLK.  
1
TheInstructionis usedtoselectthetesttobeperformed,orthetestdata  
registertobeaccessed,orboth. Theinstructionshiftedintotheregisterislatched  
atthecompletionoftheshiftingprocesswhentheTAPcontrollerisatUpdate-  
IRstate.  
Theinstructionregistermustcontain4bitinstructionregister-basedcells  
whichcanholdinstructiondata. Thesemandatorycellsarelocatednearestthe  
serialoutputstheyaretheleastsignificantbits.  
IDT72V14320/15320/16320/17320/18320/19320 JTAG Device Identification Register  
JTAG INSTRUCTION REGISTER  
TheInstructionregisterallowsinstructiontobeseriallyinputintothedevice  
whentheTAPcontrollerisintheShift-IRstate. Theinstructionisdecodedto  
performthefollowing:  
Selecttestdataregistersthatmayoperatewhiletheinstructionis  
current. Theothertestdataregistersshouldnotinterferewithchip  
operationandtheselecteddataregister.  
Definetheserialtestdataregisterpaththatisusedtoshiftdatabetween  
TDI and TDO during data register scanning.  
TESTDATAREGISTER  
TheTestDataregistercontainsthreetestdataregisters:theBypass,the  
Boundary Scan register and Device ID register.  
Theseregistersareconnectedinparallelbetweenacommonserialinput  
andacommonserialdataoutput.  
Thefollowingsectionsprovideabriefdescriptionofeachelement. Fora  
completedescription,refertotheIEEEStandardTestAccessPortSpecification  
(IEEEStd. 1149.1-1990).  
The Instruction Register is a 4 bit field (i.e. IR3, IR2, IR1, IR0) to decode  
16differentpossibleinstructions. Instructionsaredecodedasfollows.  
Hex  
Instruction  
Function  
Value  
0x00  
0x02  
0x01  
0x03  
0x0F  
EXTEST  
IDCODE  
SelectBoundaryScanRegister  
SelectChipIdentificationdataregister  
SAMPLE/PRELOAD SelectBoundaryScanRegister  
HIGH-IMPEDANCE JTAG  
BYPASS  
TEST BYPASS REGISTER  
TheregisterisusedtoallowtestdatatoflowthroughthedevicefromTDI  
toTDO. Itcontainsasinglestageshiftregisterforaminimumlengthinserialpath.  
Whenthebypassregisterisselectedbyaninstruction,theshiftregisterstage  
is settoa logiczeroonthe risingedge ofTCLKwhenthe TAPcontrolleris in  
theCapture-DRstate.  
SelectBypassRegister  
JTAG Instruction Register Decoding  
Thefollowingsectionsprovideabriefdescriptionofeachinstruction. For  
acompletedescriptionrefertotheIEEEStandardTestAccessPortSpecification  
(IEEEStd. 1149.1-1990).  
The operation of the bypass register should not have any effect on the  
operationofthedeviceinresponsetotheBYPASSinstruction.  
EXTEST  
TherequiredEXTESTinstructionplacestheICintoanexternalboundary-  
testmodeandselectstheboundary-scanregistertobeconnectedbetweenTDI  
andTDO. Duringthis instruction, theboundary-scanregisteris accessedto  
drivetestdataoff-chipviatheboundaryoutputsandreceivetestdataoff-chip  
viatheboundaryinputs.Assuch,theEXTESTinstructionistheworkhorseof  
IEEE.Std1149.1,providingforprobe-lesstestingofsolder-jointopens/shorts  
andoflogicclusterfunction.  
THE BOUNDARY-SCAN REGISTER  
TheBoundaryScanRegisterallowsserialdataTDIbeloadedintoorread  
outoftheprocessorinput/outputports. TheBoundaryScanRegisterisapart  
oftheIEEE1149.1-1990StandardJTAGImplementation.  
THE DEVICE IDENTIFICATION REGISTER  
The Device IdentificationRegisteris a ReadOnly32-bitregisterusedto  
specify the manufacturer, part number and version of the processor to be  
determinedthroughtheTAPinresponsetotheIDCODEinstruction.  
IDT JEDEC ID number is 0xB3. This translates to 0x33 when the parity  
is droppedinthe11-bitManufacturerIDfield.  
IIDCODE  
TheoptionalIDCODEinstructionallowstheICtoremaininitsfunctionalmode  
andselectstheoptionaldeviceidentificationregistertobeconnectedbetween  
TDIandTDO.Thedeviceidentificationregisterisa32-bitshiftregistercontaining  
information regarding the IC manufacturer, device type, and version code.  
Accessingthedeviceidentificationregisterdoesnotinterferewiththeoperation  
oftheIC.Also,accesstothedeviceidentificationregistershouldbeimmediately  
available,viaaTAPdata-scanoperation,afterpower-upoftheICorafterthe  
TAPhasbeenresetusingtheoptionalTRSTpinorbyotherwisemovingtothe  
Test-Logic-Resetstate.  
For the IDT72V14320/72V15320/72V16320/72V17320/72V18320/  
72V19320,thePartNumberfieldcontainsthefollowingvalues:  
Device  
Part# Field  
04E5  
04E4  
04E3  
04E2  
IDT72V14320  
IDT72V15320  
IDT72V16320  
IDT72V17320  
IDT72V18320  
IDT72V19320  
SAMPLE/PRELOAD  
TherequiredSAMPLE/PRELOADinstructionallows theICtoremainina  
normalfunctionalmodeandselectstheboundary-scanregistertobeconnected  
betweenTDIandTDO.Duringthisinstruction,theboundary-scanregistercan  
beaccessedviaadatescanoperation,totakeasampleofthefunctionaldata  
enteringandleavingtheIC.Thisinstructionisalsousedtopreloadtestdatainto  
theboundary-scanregisterbeforeloadinganEXTESTinstruction.  
04E1  
04E0  
18  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
HIGH-IMPEDANCE  
TheoptionalHigh-Impedanceinstructionsetsalloutputs(includingtwo-state  
BYPASS  
The required BYPASS instruction allows the IC to remain in a normal  
aswellasthree-statetypes)ofanICtoadisabled(high-impedance)stateand functional mode and selects the one-bit bypass register to be connected  
selects the one-bit bypass register to be connected between TDI and TDO. between TDI and TDO. The BYPASS instruction allows serial data to be  
Duringthisinstruction,datacanbeshiftedthroughthebypassregisterfromTDI transferredthroughtheICfromTDItoTDOwithoutaffectingtheoperationof  
toTDOwithoutaffectingtheconditionoftheICoutputs.  
theIC.  
19  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
tRS  
MRS  
tRSR  
tRSS  
tRSS  
tRSS  
REN  
WEN  
SI  
tRSR  
tRSR  
tRSS  
tRSS  
tRSR  
LD  
FSEL0,  
FSEL1  
tRSS  
tRSS  
PFM  
SEN  
tRSF  
tRSF  
tRSF  
tRSF  
tRSF  
EF  
FF  
PAE  
PAF, HF  
Q0 - Qn  
OE = HIGH  
OE = LOW  
6163 drw10  
Figure 5. Master Reset Timing  
20  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
tRS  
PRS  
REN  
tRSS  
tRSR  
tRSS  
tRSR  
WEN  
tRSS  
SEN  
EF  
tRSF  
tRSF  
FF  
tRSF  
PAE  
tRSF  
PAF,  
HF  
tRSF  
OE = HIGH  
Q0 - Qn  
6163 drw11  
OE = LOW  
Figure 6. Partial Reset Timing  
21  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
tCLK  
tCLKH  
NO WRITE  
NO WRITE  
tCLKL  
2
1
WCLK  
1
2
(1)  
SKEW1  
t
SKEW1(1)  
t
tDS  
tDH  
tDS  
tDH  
DX  
DX+1  
D0 - Dn  
tWFF  
tWFF  
tWFF  
tWFF  
FF  
WEN  
RCLK  
tENS  
tENH  
tENS  
tENH  
REN  
tA  
tA  
Q0  
- Q  
n
DATA READ  
DATA IN OUTPUT REGISTER  
NEXT DATA READ  
6163 drw12  
NOTES:  
1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go HIGH (after one WCLK cycle pus tWFF). If the time between  
the rising edge of the RCLK and the rising edge of the WCLK is less than tSKEW1, then the FF deassertion may be delayed one extra WCLK cycle.  
2. LD = HIGH, OE = LOW, EF = HIGH  
Figure 7. Write Cycle and Full Flag Timing  
tCLK  
tCLKH  
tCLKL  
1
2
RCLK  
REN  
tENH  
tENS  
tENS  
tENH  
tENH  
tENS  
NO OPERATION  
NO OPERATION  
tREF  
tREF  
tREF  
EF  
t
A
tA  
tA  
D0  
LAST WORD  
D1  
LAST WORD  
Q0 - Qn  
tOLZ  
tOLZ  
tOHZ  
tOE  
OE  
WCLK  
WEN  
(1)  
SKEW1  
t
tENH  
tENH  
tENS  
tENS  
tDS  
tDH  
tDH  
tDS  
D0  
D1  
D0 -  
Dn  
6163 drw13  
NOTES:  
1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the rising edge  
of WCLK and the rising edge of RCLK is less than tSKEW1, then EF deassertion may be delayed one extra RCLK cycle.  
2. LD = HIGH.  
3. First data word latency = tSKEW1 + 1*TRCLK + tREF.  
Figure 8. Read Cycle, Empty Flag and First Data Word Latency Timing  
22  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
WCLK  
tENH  
tENS  
tENH  
SEN  
LD  
tLDH  
tLDH  
tLDS  
tDH  
tDS  
(1)  
(1)  
BIT 0  
BIT 0  
BIT X  
BIT X  
SI  
6163 drw20  
EMPTY OFFSET  
FULL OFFSET  
NOTE:  
1. X = 9 for the IDT72V14320 (total of 20 bits), X = 10 for the IDT72V15320 (total of 22 bits), X = 11 for the IDT72V15160 and IDT72V16320 (total of 24 bits), X = 12 for the IDT72V16160,  
and IDT72V17320 (total of 26 bits), X = 13 for the IDT72V17160 and IDT72V18320 (total of 28 bits), X = 14 for the IDT72V18160 and IDT72V19320 (total of 30 bits), X = 15 for the  
IDT72V19160 (total of 32 bits).  
Figure 9. Serial Loading of Programmable Flag Registers  
tCLKL  
tCLKL  
1
2
WCLK  
WEN  
PAF  
2
1
tENS  
tENH  
tPAFS  
tPAFS  
D - (m+1) words in FIFO(2)  
D - m words in FIFO(2)  
D-(m+1) words  
2)  
in FIFO(  
(3)  
tSKEW2  
RCLK  
tENS  
tENH  
6163 drw23  
REN  
NOTES:  
1. m = PAF offset.  
2. D = maximum FIFO depth.  
V-III: D = 4,096 for the IDT72V15160 and 8,192 for the IDT72V16160, 16,384 for the IDT72V17160 and 32,768 for the IDT72V18160, 65,526 for the IDT72V19160.  
Vx-III: D = 1,024 for the IDT72V14320, 2,048 for the IDT72V15320, 4,096 for the IDT72V16320 and 8,192 for the IDT72V17320, 16,384 for the IDT72V18320 and 32,768 for the  
IDT72V19320.  
3. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH (after one WCLK cycle plus tPAFS). If the time between the  
rising edge of RCLK and the rising edge of WCLK is less than tSKEW2, then the PAF deassertion time may be delayed one extra WCLK cycle.  
4. PAF is asserted and updated on the rising edge of WCLK only.  
5. Select this mode by setting PFM HIGH during Master Reset.  
Figure 10. Synchronous Programmable Almost-Full Flag Timing  
23  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
tCLKH  
tCLKL  
WCLK  
tENS  
tENH  
WEN  
PAE  
n words in FIFO  
n words in FIFO  
,
n+1 words in FIFO  
(2)  
tPAES  
tPAES  
t
SKEW2  
1
2
1
2
RCLK  
tENS  
tENH  
6163 drw24  
REN  
NOTES:  
1. n = PAE offset.  
2. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that PAE will go HIGH (after one RCLK cycle plus tPAES). If the time between  
the rising edge of WCLK and the rising edge of RCLK is less than tSKEW2, then the PAE deassertion may be delayed one extra RCLK cycle.  
3. PAE is asserted and updated on the rising edge of WCLK only.  
4. Select this mode by setting PFM HIGH during Master Reset.  
Figure 11. Synchronous Programmable Almost-Empty Flag Timing  
tCLKH  
tCLKL  
WCLK  
tENS  
tENH  
WEN  
PAF  
tPAFA  
D - m words  
in FIFO  
D - (m + 1)  
words in FIFO  
D - (m + 1) words in FIFO  
tPAFA  
RCLK  
tENS  
REN  
6163 drw25  
NOTES:  
1. m = PAF offset.  
2. D = maximum FIFO depth.  
V-III: D = 4,096 for the IDT72V15160 and 8,192 for the IDT72V16160, 16,384 for the IDT72V17160 and 32,768 for the IDT72V18160, 65,526 for the IDT72V19160.  
Vx-III: D = 1,024 for the IDT72V14320, 2,048 for the IDT72V15320, 4,096 for the IDT72V16320 and 8,192 for the IDT72V17320, 16,384 for the IDT72V18320 and 32,768 for the  
IDT72V19320.  
3. PAF is asserted to LOW on WCLK transition and reset to HIGH on RCLK transition.  
4. Select this mode by setting PFM LOW during Master Reset.  
Figure 12. Asynchronous Programmable Almost-Full Flag Timing  
24  
IDT72V15160/16160/17160/18160/19160  
- 3.3V 16-BIT V-III MULTIMEDIA FIFO  
INDUSTRIAL  
IDT72V14320/15320/16320/17320/18320/19320 - 3.3V 32-BIT VX-III MULTIMEDIA FIFO  
TEMPERATURE RANGE  
tCLKH  
tCLKL  
WCLK  
tENS  
tENH  
WEN  
tPAEA  
n + 1 words in FIFO  
n words in FIFO  
PAE  
RCLK  
REN  
n words in FIFO  
tPAEA  
tENS  
6163 drw26  
NOTES:  
1. n = PAE offset.  
2. PAE is asserted LOW on RCLK transition and reset to HIGH on WCLK transition.  
3. Select this mode by setting PFM LOW during Master Reset.  
Figure 13. Asynchronous Programmable Almost-Empty Flag Timing  
tCLKH  
tCLKL  
WCLK  
tENH  
tENS  
WEN  
HF  
tHF  
D/2 words in FIFO  
D/2 words in FIFO  
D/2 + 1 words in FIFO  
HF  
t
RCLK  
tENS  
REN  
6163 drw27  
NOTES:  
1. D = maximum FIFO depth.  
V-III: D = 4,096 for the IDT72V15160 and 8,192 for the IDT72V16160, 16,384 for the IDT72V17160 and 32,768 for the IDT72V18160, 65,526 for the IDT72V19160.  
Vx-III: D = 1,024 for the IDT72V14320, 2,048 for the IDT72V15320, 4,096 for the IDT72V16320 and 8,192 for the IDT72V17320, 16,384 for the IDT72V18320 and 32,768 for the  
IDT72V19320.  
Figure 14. Half-Full Flag Timing  
25  
ORDERINGINFORMATION  
IDT  
XXXXX  
X
XX  
X
X
Process /  
Temperature  
Range  
Device Type  
Power  
Speed  
Package  
Industrial (-40°C to +85°C)  
I
PF  
BB  
Thin Plastic Quad Flatpack (TQFP, PN80-1, PK128-1)  
Plastic Ball Grid Array (PBGA, BB144-1, Vx-III only)  
Clock Cycle Time (tCLK  
Speed in Nanoseconds  
)
Industrial  
10  
L
Low Power  
4,096 x 16 3.3V Multimedia FIFO, V-III  
8,192 x 16 3.3V Multimedia FIFO, V-III  
16,384 x 16 3.3V Multimedia FIFO, V-III  
32,768 x 16 3.3V Multimedia FIFO, V-III  
65,526 x 16 3.3V Multimedia FIFO, V-III  
72V15160  
72V16160  
72V17160  
72V18160  
72V19160  
1,024 x 32 3.3V Multimedia FIFO, Vx-III  
2,048 x 32 3.3V Multimedia FIFO, Vx-III  
4,096 x 32 3.3V Multimedia FIFO, Vx-III  
8,192 x 32 3.3V Multimedia FIFO, Vx-III  
16,384 x 32 3.3V Multimedia FIFO, Vx-III  
32,768 x 32 3.3V Multimedia FIFO, Vx-III  
72V14320  
72V15320  
72V16320  
72V17320  
72V18320  
72V19320  
6163 drw05  
DATASHEETDOCUMENTHISTORY  
11/17/2003  
pg. 1.  
CORPORATE HEADQUARTERS  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
for SALES:  
800-345-7015 or 408-284-8200  
fax: 408-284-2775  
for Tech Support:  
408-360-1753  
email:FIFOhelp@idt.com  
www.idt.com  
26  

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