IDT74FCT162H501ATPA8 [IDT]

Registered Bus Transceiver, FCT Series, 1-Func, 18-Bit, True Output, CMOS, PDSO56, TSSOP-56;
IDT74FCT162H501ATPA8
型号: IDT74FCT162H501ATPA8
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Registered Bus Transceiver, FCT Series, 1-Func, 18-Bit, True Output, CMOS, PDSO56, TSSOP-56

光电二极管 逻辑集成电路 触发器
文件: 总7页 (文件大小:64K)
中文:  中文翻译
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FAST CMOS  
IDT54/74FCT162H501AT/CT  
18-BIT REGISTERED  
TRANSCEIVER  
DESCRIPTION:  
FEATURES:  
TheFCT162H501T18-bitregisteredtransceiversarebuiltusingadvanced  
dualmetalCMOStechnology.Thesehigh-speed,low-power18-bitregistered  
bustransceiverscombineD-typelatchesandD-typeflip-flopstoallowdataflow  
in transparent, latched and clocked modes. Data flow in each direction is  
controlledbyoutput-enable(OEABandOEBA),latchenable(LEABandLEBA)  
andclock(CLKABandCLKBA)inputs.ForA-to-Bdataflow,thedeviceoperates  
intransparentmodewhenLEABishigh.WhenLEABislow,theAdataislatched  
if CLKAB is held at a high or low logic level. If LEAB is low, the A bus data is  
storedinthelatch/flip-floponthelow-to-hightransitionofCLKAB.OEABis the  
outputenablefortheBport.DataflowfromtheBporttotheAportissimilarbut  
requiresusing OEBA,LEBAandCLKBA.Flow-throughorganizationofsignal  
pinssimplifieslayout.Allinputsaredesignedwithhysteresisforimprovednoise  
margin.  
• 0.5 MICRON CMOS Technology  
• High-speed, low-power CMOS replacement for ABT functions  
• Typical tSK(o) (Output Skew) < 250ps  
• Low input and output leakage 1µA (max.)  
• ESD > 2000V per MIL-STD-883, Method 3015; > 200V using  
machine model (C = 200pF, R = 0)  
• Bus Hold retains last active bus state during 3-state  
• Eliminates the need for external pull up resistors  
• Available in SSOP and TSSOP packages  
The FCT162H501T has "Bus Hold" which retains the input's last state  
whenevertheinputgoestohighimpedance. Thisprevents"floating"inputsand  
eliminatestheneedforpull-up/downresistors.  
FUNCTIONALBLOCKDIAGRAM  
1
OEAB  
30  
CLKBA  
28  
LEBA  
27  
OEBA  
55  
CLKAB  
2
LEAB  
C
C
54  
B1  
3
A1  
D
D
C
D
C
D
TO 17 OTHER CHANNELS  
TheIDTlogoisaregisteredtrademarkofIntegratedDeviceTechnology,Inc.  
INDUSTRIAL TEMPERATURE RANGE  
NOVEMBER 2002  
1
© 2002 Integrated Device Technology, Inc.  
DSC-5434/1  
IDT74FCT162H501AT/CT  
FASTCMOS18-BITREGISTEREDTRANSCEIVER  
INDUSTRIALTEMPERATURERANGE  
PINCONFIGURATION  
ABSOLUTEMAXIMUMRATINGS(1)  
Symbol  
Description  
Max  
Unit  
V
OEAB  
LEAB  
A1  
1
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
GND  
CLKAB  
B1  
(2)  
VTERM  
Terminal Voltage with Respect to GND  
–0.5 to 7  
2
(3)  
VTERM  
Terminal Voltage with Respect to GND –0.5 to VCC+0.5  
V
3
TSTG  
IOUT  
Storage Temperature  
DC Output Current  
–65 to +150  
–60 to +120  
°C  
mA  
GND  
A2  
4
GND  
B2  
5
NOTES:  
A3  
6
B3  
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause  
permanent damage to the device. This is a stress rating only and functional operation  
of the device at these or any other conditions above those indicated in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect reliability.  
VCC  
A4  
7
VCC  
B4  
8
A5  
9
B5  
2. All device terminals except FCT162XXX Output and I/O terminals.  
3. Output and I/O terminals for FCT162XXX.  
A6  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
B6  
GND  
A7  
GND  
B7  
CAPACITANCE (TA = +25°C, f = 1.0MHz)  
A8  
B8  
Symbol  
Parameter(1)  
Conditions  
Typ.  
Max. Unit  
A9  
B9  
SO56-1  
SO56-2  
E56-1  
CIN  
Input Capacitance  
Output Capacitance  
VIN = 0V  
3.5  
6
8
pF  
pF  
A10  
A11  
A12  
GND  
A13  
A14  
A15  
VCC  
A16  
A17  
GND  
A18  
B10  
B11  
B12  
GND  
B13  
B14  
B15  
VCC  
B16  
B17  
GND  
B18  
CLKBA  
GND  
COUT  
VOUT = 0V  
3.5  
NOTE:  
1. This parameter is measured at characterization but not tested.  
FUNCTIONTABLE(1,4)  
Inputs  
Outputs  
OEAB  
LEAB  
CLKAB  
Ax  
X
L
Bx  
Z
L
H
H
H
H
H
H
X
H
H
L
X
X
X
L
L
OEBA  
LEBA  
H
L
H
L
L
H
X
X
H
SSOP/ TSSOP  
TOP VIEW  
L
B(2)  
B(3)  
L
H
NOTES:  
PINDESCRIPTION  
1. A-to-B data flow is shown. B-to-A data flow is similar but uses OEBA, LEBA, and  
CLKBA.  
2. Output level before the indicated steady-state input conditions were established.  
3. Output level before the indicated steady-state input conditions were established,  
provided that CLKAB was HIGH before LEAB went LOW.  
4. H = HIGH Voltage Level  
L = LOW Voltage Level  
X = Don't Care  
Z = High-Impedance  
= LOW-to-HIGH Transition  
Pin Names  
Description  
OEAB  
OEBA  
LEAB  
LEBA  
CLKAB  
CLKBA  
Ax  
A-to-BOutputEnableInput  
B-to-AOutputEnableInput(ActiveLOW)  
A-to-BLatchEnableInput  
B-to-ALatchEnableInput  
A-to-B Clock Input  
B-to-A Clock Input  
A-to-BDataInputsorB-to-A3-StateOutputs(1)  
B-to-ADataInputsorA-to-B3-StateOutputs(1)  
Bx  
NOTE:  
1. These pins have “Bus Hold”. All other pins are standard inputs, outputs or I/Os.  
2
IDT74FCT162H501AT/CT  
FASTCMOS18-BITREGISTEREDTRANSCEIVER  
INDUSTRIALTEMPERATURERANGE  
DCELECTRICALCHARACTERISTICSOVEROPERATINGRANGE(BUSHOLD)  
FollowingConditionsApplyUnlessOtherwiseSpecified:  
Industrial: TA = –40°C to +85°C, VCC = 5.0V ±10%  
Symbol  
VIH  
Parameter  
Input HIGH Level  
TestConditions(1)  
Guaranteed Logic HIGH Level  
GuaranteedLogicLOWLevel  
Min.  
2
Typ.(2)  
Max.  
Unit  
V
VIL  
InputLOWLevel  
Input  
–50  
50  
–80  
0.8  
V
IIH  
StandardInput(5) VCC = Max.  
VI = VCC  
±1  
µA  
HIGH  
Current(4)  
StandardI/O(5)  
Bus-holdInput  
Bus-hold I/O  
±1  
±100  
±100  
±1  
IIL  
Input  
StandardInput(5)  
StandardI/O(5)  
Bus-holdInput  
Bus-hold I/O  
VI = GND  
LOW  
Current(4)  
±1  
±100  
±100  
IBHH  
IBHL  
IOZH  
IOZL  
VIK  
Bus-holdSustain  
Current(4)  
Bus-holdInput  
VCC = Min.  
VCC = Max.  
VI = 2V  
µA  
µA  
VI = 0.8V  
VO = 2.7V  
VO = 0.5V  
HighImpedanceOutputCurrent  
(3-StateOutputpins)(5,6)  
ClampDiodeVoltage  
±1  
±1  
VCC = Min., IIN = –18mA  
VCC = Max., VO = GND(3)  
–0.7  
–140  
100  
5
–1.2  
–250  
V
IOS  
ShortCircuitCurrent  
mA  
mV  
µA  
VH  
InputHysteresis  
ICCL  
ICCH  
ICCZ  
Quiescent Power Supply Current  
VCC = Max.  
VIN = GND or VCC  
500  
OUTPUTDRIVECHARACTERISTICS  
Symbol  
Parameter  
OutputLOWCurrent  
Output HIGH Current  
Output HIGH Voltage  
Test Conditions(1)  
VCC = 5V, VIN = VIH or VIL, VO = 1.5V(3)  
VCC = 5V, VIN = VIH or VIL, VO = 1.5V(3)  
VCC = Min.  
Min.  
Typ.(2)  
115  
Max.  
200  
–200  
Unit  
mA  
mA  
V
IODL  
60  
–60  
2.4  
IODH  
–115  
3.3  
VOH  
IOH = –24mA  
IOH = 24mA  
VIN = VIH or VIL  
VOL  
OutputLOWVoltage  
VCC = Min.  
0.3  
0.55  
V
VIN = VIH or VIL  
NOTES:  
1. For conditions shown as Min. or Max., use appropriate value specified under Electrical Characteristics for the applicable device type.  
2. Typical values are at VCC = 5.0V, +25°C ambient.  
3. Not more than one output should be shorted at one time. Duration of the test should not exceed one second.  
4. Pins with Bus-hold are identified in the pin description.  
5. The test limit for this parameter is ±5µA at TA = –55°C.  
6. Does not include Bus-hold I/O pins.  
3
IDT74FCT162H501AT/CT  
FASTCMOS18-BITREGISTEREDTRANSCEIVER  
INDUSTRIALTEMPERATURERANGE  
POWERSUPPLYCHARACTERISTICS  
Symbol  
Parameter  
Test Conditions(1)  
Min.  
Typ.(2)  
Max.  
Unit  
ICC  
Quiescent Power Supply Current  
TTL Inputs HIGH  
VCC = Max.  
VIN = 3.4V(3)  
0.5  
1.5  
mA  
ICCD  
Dynamic Power Supply  
Current(4)  
VCC = Max.  
OutputsOpen  
VIN = VCC  
VIN = GND  
75  
120  
µA/  
MHz  
OEAB = OEBA = VCC or GND  
OneInputToggling  
50% Duty Cycle  
IC  
TotalPowerSupplyCurrent(6)  
VCC = Max.  
VIN = VCC  
0.8  
1.7  
mA  
OutputsOpen  
VIN = GND  
fCP = 10MHz (CLKAB)  
50% Duty Cycle  
OEAB = OEBA = VCC  
LEAB = GND  
OneBitToggling  
fi = 5MHz  
VIN = 3.4V  
VIN = GND  
1.3  
3.8  
3.2  
50% Duty Cycle  
VCC = Max.  
VIN = VCC  
6.5(5)  
OutputsOpen  
VIN = GND  
fCP = 10MHz (CLKAB)  
50% Duty Cycle  
OEAB = OEBA = VCC  
LEAB = GND  
Eighteen BitsToggling  
fi = 2.5MHz  
VIN = 3.4V  
VIN = GND  
8.5  
20.8(5)  
50% Duty Cycle  
NOTES:  
1. For conditions shown as Min. or Max., use appropriate value specified under Electrical Characteristics for the applicable device type.  
2. Typical values are at VCC = 5.0V, +25°C ambient.  
3. Per TTL driven input (VIN = 3.4V). All other inputs at VCC or GND.  
4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations.  
5. Values for these conditions are examples of the ICC formula. These limits are guaranteed but not tested.  
6. IC = IQUIESCENT + IINPUTS + IDYNAMIC  
IC = ICC + ICC DHNT + ICCD (fCPNCP/2 + fiNi)  
ICC = Quiescent Current (ICCL, ICCH and ICCZ)  
ICC = Power Supply Current for a TTL High Input (VIN = 3.4V)  
DH = Duty Cycle for TTL Inputs High  
NT = Number of TTL Inputs at DH  
ICCD = Dynamic Current caused by an Input Transition Pair (HLH or LHL)  
fCP = Clock Frequency for Register Devices (Zero for Non-Register Devices)  
NCP = Number of Clock Inputs at fCP  
fi = Input Frequency  
Ni = Number of Inputs at fi  
4
IDT74FCT162H501AT/CT  
FASTCMOS18-BITREGISTEREDTRANSCEIVER  
INDUSTRIALTEMPERATURERANGE  
SWITCHINGCHARACTERISTICSOVEROPERATINGRANGE  
FCT162H501AT  
FCT162H501CT  
Min.(2)  
Max.  
Symbol  
fMAX  
tPLH  
tPHL  
tPLH  
tPHL  
tPLH  
tPHL  
tPZH  
tPZL  
tPHZ  
tPLZ  
tSU  
Parameter  
CLKAB or CLKBA frequency(3)  
Condition(1)  
CL = 50pF  
RL = 500Ω  
Min.(2)  
Max.  
150  
5.1  
Unit  
MHz  
ns  
150  
4.3  
PropagationDelay  
1.5  
1.5  
Ax to Bx or Bx to Ax  
PropagationDelay  
1.5  
1.5  
1.5  
1.5  
3
5.6  
5.6  
6
1.5  
1.5  
1.5  
1.5  
2.4  
0
4.4  
4.4  
4.8  
5.2  
ns  
ns  
ns  
ns  
ns  
ns  
LEBA to Ax, LEAB to Bx  
PropagationDelay  
CLKBA to Ax, CLKAB to Bx  
OutputEnableTime  
OEBA to Ax, OEAB to Bx  
OutputDisableTime  
5.6  
OEBA to Ax, OEAB to Bx  
Set-up Time, HIGH or LOW  
Ax to CLKAB, Bx to CLKBA  
Hold Time HIGH or LOW  
Ax to CLKAB, Bx to CLKBA  
Set-up Time HIGH or LOW  
Ax to LEAB, Bx to LEBA  
Hold Time, HIGH or LOW  
Ax to LEAB, Bx to LEBA  
tH  
tSU  
tH  
0
Clock LOW  
Clock HIGH  
3
2
ns  
ns  
ns  
1.5  
1.5  
1.5  
0.5  
tW  
tW  
LEAB or LEBA Pulse Width HIGH(3)  
CLKAB or CLKBA Pulse Width HIGH or LOW(3)  
OutputSkew(4)  
3
3
3
3
ns  
ns  
ns  
tSK(o)  
0.5  
0.5  
NOTES:  
1. See test circuits and waveforms.  
2. Minimum limits are guaranteed but not tested on Propagation Delays.  
3. This parameter is guaranteed but not tested.  
4. Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.  
5
IDT74FCT162H501AT/CT  
FASTCMOS18-BITREGISTEREDTRANSCEIVER  
INDUSTRIALTEMPERATURERANGE  
TESTCIRCUITSANDWAVEFORMS  
V CC  
7.0V  
SWITCHPOSITION  
Test  
Switch  
Closed  
Open  
500  
Open Drain  
Disable Low  
Enable Low  
VOUT  
VIN  
Pulse  
Generator  
D.U.T.  
50pF  
CL  
All Other Tests  
500Ω  
RT  
DEFINITIONS:  
CL = Load capacitance: includes jig and probe capacitance.  
RT = Termination resistance: should be equal to ZOUT of the Pulse Generator.  
Test Circuits for All Outputs  
3V  
1.5V  
0V  
DATA  
INPUT  
LOW-HIGH-LOW  
tH  
tSU  
1.5V  
PULSE  
3V  
1.5V  
0V  
TIMING  
INPUT  
tW  
ASYNCHRONOUS CONTROL  
tREM  
PRESET  
CLEAR  
ETC.  
3V  
1.5V  
0V  
HIGH-LOW-HIGH  
PULSE  
1.5V  
SYNCHRONOUS CONTROL  
3V  
1.5V  
0V  
PRESET  
CLEAR  
CLOCK ENABLE  
ETC.  
Pulse Width  
tSU  
tH  
Set-up, Hold, and Release Times  
ENABLE  
DISABLE  
3V  
3V  
SAME PHASE  
INPUT TRANSITION  
1.5V  
0V  
CONTROL  
INPUT  
1.5V  
0V  
tPLH  
tPLH  
tPHL  
tPHL  
tPZL  
tPLZ  
VOH  
1.5V  
VOL  
OUTPUT  
3.5V  
1.5V  
3.5V  
VOL  
OUTPUT  
NORMALLY  
LOW  
SWITCH  
CLOSED  
0.3V  
0.3V  
3V  
tPZH  
tPHZ  
OPPOSITE PHASE  
INPUT TRANSITION  
1.5V  
0V  
VOH  
OUTPUT  
NORMALLY  
HIGH  
SWITCH  
OPEN  
1.5V  
0V  
0V  
Propagation Delay  
Enable and Disable Times  
NOTES:  
1. Diagram shown for input Control Enable-LOW and input Control Disable-HIGH.  
2. Pulse Generator for All Pulses: Rate 1.0MHz; tF 2.5ns; tR 2.5ns.  
6
IDT74FCT162H501AT/CT  
FASTCMOS18-BITREGISTEREDTRANSCEIVER  
INDUSTRIALTEMPERATURERANGE  
ORDERINGINFORMATION  
XX  
IDT  
FCT XXX  
X
XXXX  
X
Temperature  
Range  
Family Bus Hold Device Type Package  
PV  
PA  
Shrink Small Outline Package (SO56-1)  
Thin Shrink Small Outline Package (SO56-2)  
18-Bit Registered Transceiver  
501AT  
501CT  
H
Bus-Hold  
162  
Double-Density 5 Volt Balanced Drive  
74  
40°C to +85°C  
CORPORATE HEADQUARTERS  
2975StenderWay  
Santa Clara, CA 95054  
for SALES:  
800-345-7015 or 408-727-6116  
fax: 408-492-8674  
for Tech Support:  
logichelp@idt.com  
(408) 654-6459  
www.idt.com  
7

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