IDT74SSTVN16859 [IDT]

13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O; 13位到26位寄存缓冲器与SSTL I / O


型号：	IDT74SSTVN16859
厂家：	INTEGRATED DEVICE TECHNOLOGY
描述：	13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O 13位到26位寄存缓冲器与SSTL I / O
文件：	总7页 (文件大小：65K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

IDT74SSTVN16859

COMMERCIALTEMPERATURERANGE

13-BITTO26-BITREGISTEREDBUFFERWITHSSTLI/O

13-BIT TO 26-BIT REGISTERED IDT74SSTVN16859

BUFFER WITH SSTL I/O

FEATURES:

DESCRIPTION:

• 1:2 registered output buffer

The SSTVN16859 is a 13-bit to 26-bit registered buffer designed for

• 2.3V to 2.7V operation for PC1600, PC2100, and PC2700

• 2.5V to 2.7V operation for PC3200

• Single bit propagation delay, TSSOP : 2.2ns, VFQFPN : 1.8ns

• SSTL_2 Class I style data inputs/outputs

• Differential CLK input

• RESET control compatible with LVCMOS levels

• Latch-up performance exceeds 100mA

• ESD >2000V per MIL-STD-883, Method 3015; >200V using

machine model (C = 200pF, R = 0)

2.3V-2.7VVDD forPC1600-PC2700and2.5V-2.7VVDD forPC3200, and

supports low standby operation. All data inputs and outputs are SSTL_2

level compatible with JEDEC standard for SSTL_2.

RESETisanLVCMOSinputsinceitmustoperatepredictablyduringthe

power-upphase.RESET,whichcanbeoperatedindependentofCLKand

CLK, must be held in the low state during power-up in order to ensure

predictable outputs (low state) before a stable clock has been applied.

RESET, when in the low state, will disable all input receivers, reset all

registers,andforcealloutputstoalowstate,beforeastableclockhasbeen

applied. Withinputsheldlowandastableclockapplied,outputswillremain

low during the Low-to-High transition of RESET.

• Available in 56 pin VFQFPN and 64 pin TSSOP packages

APPLICATIONS:

• Ideally suited for stacked DIMM DDR registered applications

• Along with CSPT857C/D, Zero Delay PLL Clock buffer, provides

complete solution for DDR1 DIMMs

FUNCTIONALBLOCKDIAGRAM

RESET

CLK

VREF

Q^1A

Q1B

TO 12 OTHER CHANNELS

TheIDTlogoisaregisteredtrademarkofIntegratedDeviceTechnology,Inc.

COMMERCIAL TEMPERATURE RANGE

JANUARY 2004

2004 Integrated Device Technology, Inc.

DSC-6836/13

IDT74SSTVN16859

COMMERCIALTEMPERATURERANGE

13-BITTO26-BITREGISTEREDBUFFERWITHSSTLI/O

PINCONFIGURATIONS

Q13A

Q12A

Q11A

Q10A

VDDQ

GND

D13

D12

VDD

Q9A

Q7A

D10

VDDQ

Q6A

Q5A

GND

Q8A

Q7A

GND

D11

Q4A

Q3A

Q2A

D10

RESET

GND

Q6A

Q5A

GND

Q1A

CLK

GND

Q4A

Q3A

Q13B

VDDQ

CLK

VDDQ

VDD

VREF

RESET

GND

CLK

VDDQ

VDD

Q2A

GND

Q1A

Q12B

Q11B

Q10B

Q13B

Q9B

VDDQ

29 D4

Q8B

Q12B

Q11B

Q10B

VREF

GND

Q9B

Q8B

Q7B

VFQFPN

TOP VIEW

Q6B

GND

VDDQ

VDD

VDDQ

Q5B

Q4B

Q3B

ABSOLUTE MAXIMUM RATINGS ⁽¹⁾

Symbol

Description

Max.

–0.5to3.6

–0.5 to VDD +0.5

–0.5toVDDQ +0.5

–50

Unit

GND

Q2B

Q1B

VDD orVDDQ SupplyVoltageRange

VDDQ

(2)

InputVoltageRange

(3)

OutputVoltageRange

Input Clamp Current, VI < 0

OutputClampCurrent,

VO < 0 or VO > VDDQ

ContinuousOutputCurrent,

VO = 0 to VDDQ

TSSOP

TOP VIEW

IIK

IOK

±50

±100

°C

FUNCTION TABLE ⁽¹⁾

VDD

ContinuousCurrentthrougheach

VDD, VDDQ or GND

Input

RESET

CLK

↑

CLK

↓

Q Outputs

TSTG

StorageTemperatureRange

–65to+150

Qo⁽²⁾

NOTES:

1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause

permanent damage to the device. This is a stress rating only and functional operation

of the device at these or any other conditions above those indicated in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect reliability.

2. The input and output negative voltage ratings may be exceeded if the ratings of the

I/P and O/P clamp current are observed.

3. The output current will flow if the following conditions are observed:

a) Output in HIGH state

L or H

NOTES:

1. H = HIGH Voltage Level

L = LOW Voltage Level

X = Don’t Care

↑ = LOW to HIGH

↓ = HIGH to LOW

b) VO = VDDQ

2. Qo = Output level before the indicated steady-state conditions were established.

IDT74SSTVN16859

COMMERCIALTEMPERATURERANGE

13-BITTO26-BITREGISTEREDBUFFERWITHSSTLI/O

PINDESCRIPTION

Pin Names

Description

Q1 - Q13

DataOutput

GND

Ground

VDDQ

Output-stagedrainpowervoltage

Logicpowervoltage

VDD

RESET

VREF

Asynchronousresetinput-resetsregistersanddisablesdataandclockdifferentialinputrecievers

Inputreferencevoltage

CLK

Positivemasterclockinput

CLK

Negativemasterclockinput

D1 - D13

Center PAD

Data Input - clocked in on the crossing of the rising edge of CLK and the falling edge of CLK

Ground(MLFpackageonly)

DCELECTRICALCHARACTERISTICSOVEROPERATINGRANGEFORPC1600-

PC2700

FollowingConditionsApplyUnlessOtherwiseSpecified:

Operating Condition: TA = 0°C to +70°C, VDD = 2.5V ±0.2V, VDDQ = 2.5V ±0.2V

Symbol

VIK

Parameter

Test Conditions

Min.

Typ.

—

Max.

–1.2

—

Unit

ControlInputs

VDD = 2.3V, II= −18mA

VDD = 2.3V to 2.7V, IOH = -100µA

VDD = 2.3V, IOH = -8mA

—

VDD – 0.2

1.95

—

VOH

—

VOL

VDD = 2.3V to 2.7V, IOL = 100µA

VDD = 2.3V, IOL = 8mA

0.2

0.35

±5

0.01

—

AllInputs

VDD = 2.7V,VI = VDD or GND

—

µA

IDD

StaticStandby

IO = 0, VDD = 2.7V, RESET = GND

IO = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC)

IO = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC),

CLK and CLK Switching 50% Duty Cycle.

IO = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC),

CLK and CLK Switching 50% Duty Cycle. One Data Input

Switching at Half Clock Frequency, 50% Duty Cycle.

VDD = 2.5V, VI = VREF ± 310mV

—

StaticOperating

—

Dynamic Operating (Clock Only)

—

µA/Clock

MHz

IDDD

DynamicOperating

(PerEachDataInput)⁽¹⁾

—

µA/Clock

MHz/Data

Input

DataInputs

CLK and CLK

RESET

—

VICR = 1.25V, VI (PP) = 360mV

VI = VDD or GND

NOTE:

1. Power dissipation levels will allow operation at DDR333 speeds without excessive die temperature.

IDT74SSTVN16859

COMMERCIALTEMPERATURERANGE

13-BITTO26-BITREGISTEREDBUFFERWITHSSTLI/O

DCELECTRICALCHARACTERISTICSOVEROPERATINGRANGEFORPC3200

FollowingConditionsApplyUnlessOtherwiseSpecified:

Operating Condition: TA = 0°C to +70°C, VDD = 2.6V ±0.1V, VDDQ = 2.6V ±0.1V

Symbol

VIK

Parameter

Test Conditions

Min.

Typ.

—

Max.

–1.2

—

Unit

ControlInputs

VDD = 2.5V, II= −18mA

VDD = 2.5V to 2.7V, IOH = -100µA

VDD = 2.5V, IOH = -8mA

—

VDD – 0.2

1.95

—

VOH

—

VOL

VDD = 2.5V to 2.7V, IOL = 100µA

VDD = 2.5V, IOL = 8mA

0.2

0.35

±5

—

AllInputs

VDD = 2.7V,VI = VDD or GND

—

µA

IDD

StaticStandby

IO = 0, VDD = 2.7V, RESET = GND

IO = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC)

IO = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC),

CLK and CLK Switching 50% Duty Cycle.

IO = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC),

CLK and CLK Switching 50% Duty Cycle. One Data Input

Switching at Half Clock Frequency, 50% Duty Cycle.

VDD = 2.6V, VI = VREF ± 310mV

—

0.01

StaticOperating

—

Dynamic Operating (Clock Only)

—

µA/Clock

MHz

IDDD

DynamicOperating

(PerEachDataInput)⁽¹⁾

—

µA/Clock

MHz/Data

Input

DataInputs

CLK and CLK

RESET

—

VICR = 1.3V, VI (PP) = 360mV

VI = VDD or GND

NOTE:

1. Power dissipation levels will allow operation at DDR400 speeds without excessive die temperature.

OPERATING CHARACTERISTICS, TA = 25ºC ⁽¹⁾

Symbol

VDD

Parameter

Min.

Typ.⁽¹⁾

—

Max.

Unit

SupplyVoltage

OutputSupplyVoltage

VDDQ

2.7

VDDQ

PC1600 - PC12700

PC3200

2.3

2.5

2.6

1.25

1.3

VREF

—

2.7

2.5

2.7

VREF

ReferenceVoltage(VREF=VDDQ/2) PC1600 - PC2700

1.15

1.35

PC3200

TerminationVoltage

1.25

1.35

VTT

VREF– 40mV

VREF+ 40mV

InputVoltage

VDD

VIH

VIL

AC High-Level Input Voltage

AC Low-Level Input Voltage

DCHigh-LevelInputVoltage

DCLow-LevelInputVoltage

High-LevelInputVoltage

DataInputs

RESET

VREF+ 310mV

—

VREF–310mV

VIH

VIL

VREF+ 150mV

—

1.7

—

VREF–150mV

VIH

VIL

—

0.7

1.53

—

Low-LevelInputVoltage

RESET

—

VICR

VI(PP)

IOH

IOL

Common-ModeInputRange

Peak-to-PeakInputVoltage

High-LevelOutputCurrent

Low-LevelOutputCurrent

OperatingFree-AirTemperature

CLK, CLK

0.97

360

—

–16

—

+70

°C

NOTE:

1. The RESET input of the device must be held at VDD or GND to ensure proper device operation.

IDT74SSTVN16859

COMMERCIALTEMPERATURERANGE

13-BITTO26-BITREGISTEREDBUFFERWITHSSTLI/O

TIMINGREQUIREMENTSOVERRECOMMENDEDOPERATINGFREE-AIR

TEMPERATURERANGE

PC1600-PC2700

Max.

PC3200

Symbol

CLOCK

Parameter

Min.

—

Min.

—

Max.

220

—

Unit

MHz

Clock Frequency

200

—

Pulse Duration, CLK, CLK HIGH or LOW

DifferentialInputsActiveTime⁽¹⁾

DifferentialInputsInactiveTime⁽²⁾

Setup Time, Fast Slew Rate^{(3, 5)}Data Before CLK↑, CLK↓

Setup Time, Slow Slew Rate^{(4, 5)}

Hold Time, Fast Slew Rate^(3,5)

Hold Time, Slow Slew Rate^(2,5)

2.5

tACT

—

tINACT

tSU

—

0.65

0.75

0.9

0.65

0.75

0.65

0.8

—

Data Before CLK↑, CLK ↓

—

NOTES:

1. Data inputs must be low a minimum time of t^ACTmax., after RESET is taken HIGH.

2. Data and clock inputs must be held at valid levels (not floating) a minimum time of tINACT max., after RESET is taken LOW.

3. For data signal input slew rate is ≥1V/ns.

4. For data signal input slew rate is ≥0.5V/ns and <1V/ns.

5. CLK, CLK signal input slew rates are ≥1V/ns.

SWITCHINGCHARACTERISTICSOVERRECOMMENDEDFREE-AIROPERATING

RANGE(UNLESSOTHERWISENOTED)

PC1600-PC2700

PC3200

Symbol

fMAX

Parameter

Package

Min.

200

1.1

—

Max.

—

Min.

Max.

—

Unit

MHz

TSSOP, VFQFPN

TSSOP

220

1.1

—

tPDM

CLK and CLK to Q

2.4

2.2

2.7

2.5

2.2

VFQFPN

1.8

tPDMSS

tPHL

CLK and CLK to Q (simultaneous switching)

RESET to Q

TSSOP

2.5

VFQFPN

—

((TBD))

TSSOP, VFQFPN

—

IDT74SSTVN16859

COMMERCIALTEMPERATURERANGE

13-BITTO26-BITREGISTEREDBUFFERWITHSSTLI/O

TEST CIRCUITS AND WAVEFORMS

FOR PC1600 - PC2700, VDD = 2.5V ± 0.2V

FOR PC3200, VDD = 2.6V ± 0.1V

VTT

RL = 50Ω

Test Point

CL = 30 pF

(see note 1)

Load Circuit

LVCMOS

RESET

Input

VDD

Timing

Input

VI(PP)

VDD/2

VICR

tINACT

tACT

tPLH

tPHL

VTT

VOH

VOL

90%

VTT

IDD

10%

Output

(see note 2)

Voltage and Current Waveforms

Inputs Active and Inactive Times

Voltage Waveforms - Propagation Delay Times

LVCMOS

RESET

Input

VIH

VIL

VDD/2

tPHL

VTT

VOH

VOL

VIH

VIL

Output

Input

VREF

Voltage Waveforms - Propagation Delay Times

Voltage Waveforms - Pulse Duration

Timing

Input

VICR

VI(PP)

tSU

VIH

VIL

Input

VREF

Voltage Waveforms - Setup and Hold Times

NOTES:

1. CL includes probe and jig capacitance.

2. IDD tested with clock and data inputs held at VDD or GND, and IO = 0mA.

3. All input pulses are supplied by generators having the following characteristics: PRR ≤10MHz, ZO = 50Ω, input slew rate = 1 V/ns ±20% (unless otherwise specified).

4. The outputs are measured one at a time with one transition per measurement.

5. VTT = VREF = VDDQ/2

6. VIH = VREF + 310mV (AC voltage levels) for differential inputs. VIH = VDD for LVCMOS input.

7. VIL = VREF - 310mV (AC voltage levels) for differential inputs. VIL = GND for LVCMOS input.

8. tPDM is tPD with one output switching. tPDMSS is tPD with all outputs switching.

IDT74SSTVN16859

COMMERCIALTEMPERATURERANGE

13-BITTO26-BITREGISTEREDBUFFERWITHSSTLI/O

ORDERINGINFORMATION

XXX

IDT74SSTVN

Family Device Type Package Process

0°C to +70°C (Commercial)

Blank

PAG

Thin Shrink Small Outline Package

TSSOP - Green

Thermally Enhanced Plastic Very Fine Pitch

Quad Flat No Lead Package

VFQFPN - Green

NLG

859

13-Bit to 26-Bit Registered Buffer with SSTL I/O

Double-Density

CORPORATE HEADQUARTERS

2975StenderWay

Santa Clara, CA 95054

for SALES:

800-345-7015 or 408-727-6116

fax: 408-492-8674

for Tech Support:

logichelp@idt.com

(408) 654-6459

www.idt.com

IDT74SSTVN16859 [IDT]

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