ZMD31020AC [IDT]
Analog Circuit, 1 Func, CMOS, DIE-14;
| 型号： | ZMD31020AC |
| 厂家： | 
INTEGRATED DEVICE TECHNOLOGY |
| 描述： | Analog Circuit, 1 Func, CMOS, DIE-14 |
| 文件： | 总21页 (文件大小：453K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ZMD31020
1.
General Description
ZMD31020 is a signal conditioner for sensors (sensor elements; transducers) with differential output signal, e.g.
for Wheatstone-bridge-type sensors. The device provides digital correction and compensation of sensor offset,
gain, temperature sensitivity and non-linearity through an on-chip RISC-Microcontroller running a correction
algorithm.
A bidirectional digital serial interface allows for a simple PC-controlled calibration procedure, encompassing
reading of non-corrected sensor signal and temperature values and writing and programming of a resulting
calculated set of calibration coefficients into an on-chip parameter EEPROM. Thus a specific sensor and a
ZMD31020 conditioner device are mated digitally: fast, precise and without cost overhead for trimming
components and equipment.
ZMD31020 has been designed in 0.8µm EEPROM-CMOS for a typical supply voltage of 5V and an operating
temperature range –40°C ... +125°C, covering commercial, industrial and automobile applications. The device is
available both unpackaged as tested die or as finished product in 5.3mm width SSOP14.
A demokit including samples, documentation and PC-compatible hardware and software for emulation and
calibration is available.
2.
Features
S
S
S
S
S
S
S
S
S
S
Optimized for ratiometric differential sensors
Cost-effective: a single 12-bit input ADC, 16-bit RISC-µC, 11-bit output DAC; no adjustment DACs needed
Minimum number of external components required: supply capacitor; sensor; analog output load capacitor
Temperature sensing optionally through off-chip or on-chip diode
Analog input multiplexer for differential sensor signal and temperature
Chopper-stabilized PGA, programmable to 3 differential gains (15.66, 24 and 42)
ADC resolves sensor signal with 12 bits, temperature with 10 bits
ADC’s output programmable to 4 zero-input bias values: 1/16, 1/8, ¼, ½ of conversion range
Analog input stage measures sensor signal ratiometrically, however temperature BG-related
Correction Processor: 16-bit ALU & (16 x 16 bit ) RAM; (1k x 16)-bit instruction ROM; (12 x 16)-bit
parameter EEPROM
S
Cancellation of chip-related offset in sensor and temperature signal through short-circuit input switch and
subtraction routine
S
S
Correction formula based on 7 calibration coefficients
Parameter EEPROM stores: configuration word, calibration coefficients, upper and lower output signal
limits, customer specific identifiers
S
Corrected sensor signal available both as 12-bit digital word at the I2C interface and as ratiometric analog
voltage from an 11-bit output DAC
S
S
Cycle time: 10ms. Response time: 11ms
Calibration of a sensor element / ZMD31020 combination to a desired output characteristic
through measurement of 7 uncorrected sensor and temperature value pairs
These values are read over the I2C interface and processed to calculate the 7 calibration coefficients.
Mating is completed by programming the calibration coefficients into the EEPROM over the I2C interface
PC-compatible hardware and software supporting the calibration procedure is available and included in the
demokit ZMD31020DK
S
S
Accuracy: ± 0.25% FSO typically
Datasheet, Rev. 1.4, March 27th, 2002
1/21
ZMD31020
3.
Application Circuit
220nF
+5V typ.
VDDA
VDD
VPP
VTN
Temperature
Sensing
Diode
VDDB1 (*)
VDDB2 (*)
SCL
Differential
Sensor
VBP
VOUT
10 to 25nF
VBN
VSSB
VSSA
VSS
0V
(*) either pin/pad may be chosen, whichever is more favourable layoutwise
Datasheet, Rev. 1.4, March 27th, 2002
2/21
ZMD31020
4.
Pin Description
PIN
Number
Name
Description
1
VOUT
analog conditioned sensor signal output
2
3
4
5
6
7
8
VDDA (*)
VDD
analog device functions positive supply
digital device functions positive supply
digital device functions negative supply
I²C clock input, on-chip pull-up resistor
I²C data input / output, on-chip pull-up resistor
positive EEPROM programming voltage
differential sensor signal negative input
VSS
SCL
SDA
VPP
VBN
9
VDDB2 (*) positive supply for sensor and temperature sensing diode
VTN input for temperature sensing diode
VDDB1 (*) positive supply for sensor and temperature sensing diode
VBP differential sensor signal positive input
VSSB (**) sensor negative supply
VSSA (**) analog device functions negative supply
10
11
12
13
14
(*)
VDDA, VDDB1 and VDDB2 tied to common on-chip positive supply rail
VSSA and VSSB tied to common on-chip negative supply rail
(**)
Datasheet, Rev. 1.4, March 27th, 2002
3/21
ZMD31020
5.
Block Schematic
Datasheet, Rev. 1.4, March 27th, 2002
4/21
ZMD31020
6.
Functional Description
6.1
Configuration Word
Many of the following sections, describing each block of ZMD31020 in detail, will refer to configuration bits, part
of the configuration word stored under address (9)hex of the parameter EEPROM, see section 6.6.
These bits are settings for a number of on-chip device functions and select specific functional or parametrical
behaviour.
As described earlier the contents of the parameter EEPROM are determined and calculated, written and stored
under PC-control during the calibration procedure. Hence the configuration bits are coded and non-volatilely
stored once calibration of a ZMD31020 device / sensor pair has taken place, and will remain unchanged during
regular sensing operation, unless re-calibration is performed.
15
-
14
-
13
-
12
-
11
-
10
-
9
-
8
-
7
-
6
5
4
3
2
1
0
CH
TS
BP
G1
G0
O1 O0
Configuration word, stored under address (9)hex of the parameter EEPROM
Only 7 bits of the configuration word are relevant settings as follows:
Bit 0, Bit 1
Bit 2, Bit 3
Bit 4
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
O0, O1: select ADC’s output bias @ input zero
G0, G1: select PGA’s gain
BP: cross-switches differential sensor inputs VBP and VBN
TS: selects on-chip vs. off-chip temperature sensor
CH: enables PGA’s chopper-stabilization
Bit 5
Bit 6
A truth table, listing the code options of the individual configuration bit(s), is included in the section describing
the specific function which it (they) is (are) relevant for.
6.2
Differential Sensor
ZMD31020 has been specifically designed to be a signal conditioner for ratiometric differential sensors, e.g.
Wheatstone bridge type sensors.
The sensor is supplied from VDDB1 or VDDB2 (whichever pin/pad is more favourable layoutwise) at the + side
and tied to VSSB at the – side. The sensor's differential output signal is routed to VBP and VBN.
A ratiometric sensor typically generates a differential output signal proportional to the supply voltage applied to
it.
Sensor and signal conditioner ZMD31020 have the same supply (see block schematic in section 5), hence the
differential input voltage seen by ZMD31020 is ratiometric to it’s supply voltage.
6.3
Temperature Sensing
The transducer characteristic of a sensor tends to change with temperature.
To compensate for this, ZMD31020 is equipped to measure temperature, be it through an off-chip diode,
typically in close thermal contact with the sensor, or alternatively through an on-chip diode.
Datasheet, Rev. 1.4, March 27th, 2002
5/21
ZMD31020
TS – configuration bit 5 – will select the desired sensor option as follows:
TS
Temperature sensing diode
0
1
off chip
on chip
6.4
Analog Input Signal Conditioning
ZMD31020’s block schematic in section 5 shows the analog input structure with some detail.
The signal path for the sensor signal as well as for temperature is fully differential up to the ADC.
A 2-to-1 analog multiplexer provides for cost-effective, sequential conversion by a common ADC.
Each signal path can be separated from the source at it‘s very input and be shortcircuited there for offset-
cancellation purposes; for more details see the ZMD31020 Application Note.
6.4.1 Sensor Signal Conditioning
In addition the sensor signal path features a cross-switch to reverse polarity of the sensor signal and a chopper-
stabilized PGA.
BP – configuration bit 4 – sets polarity as follows:
BP MPX differential output signal
0
1
VBP – VBN
VBN – VBP
The PGA‘s gain is set by G0 and G1 - configuration bits 2 and 3 - as follows:
G1
G0
Gain v
0
1
1
x
0
1
15.66
24
42
Chopper-stabilisation of the PGA is enabled by CH - configuration bit 6 - as follows:
CH Chopper-stabilisation
0
1
Disabled
Enabled
6.4.2 The Temperature Signal Path
The temperature sensing diode selected by TS is biased with a constant current of 40µA. It‘s forward drop
changes with –2.1mV/°K, and is passed on unamplified as differential temperature signal.
The 40µA current source is only on during temperature measurement, to prevent any interference with the
sensor signal's measurement.
Datasheet, Rev. 1.4, March 27th, 2002
6/21
ZMD31020
6.4.3 Analog-to-digital Converter ADC
ADC is a first order charge balancing analog-to-digital converter in full differential switched capacitor technology.
Resolution is 12 bits. It is inherently monotone and insensitive to clock frequency instability.
6.4.3.1 ADC’s Sensor Signal Measurement
The amplified sensor signal is measured by the ADC with full 12 bits resolution against a reference voltage of
0.96 (VDDA – VSSA).
As both the signal to be measured (see section 6.2) as well as the reference voltage, it is measured against, are
ratiometric to supply voltage VDDA - VSSA, the ADC’s conversion result is insensitive to supply-tolerance and -
instability.
ADC can be set by O0 and O1 - configuration bits 0 and 1 - to convert a zero differential input voltage to a
specific output bias as follows:
O1
O0
CRROB (*)
0
0
1
1
0
1
0
1
1/16
1/8
1/4
1/2
(*) conversion range referenced output bias @ zero differential input
Consequently ZMD31020 can cope with both positive and negative differential sensor voltages.
6.4.3.2 ADC’s Temperature Measurement
The differential temperature signal is resolved with 10 bits, against a differential reference voltage of 0.980V,
derived from an on-chip bandgap.
Whenever measuring temperature, the ADC is set to CRROB = 1/16.
6.5
Correction Microcontroller CMC
CMC is a RISC-microcontroller, driven by an on-chip clock generator with a nominal clock frequency of
1.5 MHz; overall clock frequency tolerance is better than ±25%.
It includes a 16-bit width ALU and a (16 x 16)-bit RAM. Furthermore it has a 12-bit input counter into which the
ADC will serially transmit conversion results; 4096 clock cycles are needed per result.
The CMC is connected to a (1k x 16)-bit instruction ROM and a (12 x 16)-bit parameter EEPROM.
At the output side the CMC is equipped with an I2C-interface as a digital series output for the corrected sensor
signal.
Initially, during calibration, the same interface is used bi-directionally: to write the configuration word into the
EEPROM, to read non-corrected sensor value as well as temperature, and again and finally to write the valid
calibration parameters into the EEPROM.
The CMC performs sensor signal correction in the digital domain, see chapter 6.7.
Datasheet, Rev. 1.4, March 27th, 2002
7/21
ZMD31020
6.6
Parameter EEPROM
The parameter EEPROM is a non-volatile store for 12 parameter values, each with 16 bits of width.
Address
Parameter
Default content
5234 Hex
0023 Hex
2044 Hex
3022 Hex
6356 Hex
1045 Hex
2073 Hex
03E8 Hex
0FA0 Hex
0040 Hex
1234 Hex
5678 Hex
calibration parameter a0 for sensor's non-linearity correction
0HEX
1HEX
2HEX
3HEX
4HEX
5HEX
6HEX
7HEX
8HEX
9HEX
AHEX
BHEX
calibration parameter a1 for sensor's offset correction
calibration parameter a2 for first order sensor offset drift correction
calibration parameter a3 for second order sensor offset drift correction
calibration parameter a4 for gain correction
calibration parameter a5 for first order gain drift correction
calibration parameter a6 for second order gain drift correction
low-side scale limit value for corrected sensor signal
high-side scale limit value for corrected sensor signal
configuration word
customer-specific identification word
customer-specific identification word
Contents of the parameter EEPROM
The configuration word and it's contents under address (9)hex have been described already in chapter 6.1.
The calibration parameters are stored under addresses (0)hex through (6)hex. Calculation of these parameters
will be described in the ZMD31020 Application Note.
Address locations (7)hex and (8)hex contain a low-side resp. high-side scale limit value for the corrected sensor
signal.
‚Would be‘-lower resp. -higher corrected signal values are clamped arithmetically to these limits by the CMC.
Both the low and high-side scale limits can be adjusted with a resolution of 12 bits. The 12 bit limit value must
be programmed into the least significant portion of either adress. The 4 most significant bit locations of either
adress are don't care bits and may be programmed freely.
Address locations (A)hex and (B)hex are available for customer-specific identification words, e.g. for traceability
purposes.
The contents of EEPROM addresses (0)hex through (9)hex are loaded into the RAM register block of the CMC
upon power-on.
The configuration bits are routed from the configuration register to the various device functions to be set up, see
chapter 6.1.
Erasing and programming of the various EEPROM address locations during calibration requires programming
pulses of about 12V amplitude and about 10ms pulse width.
As calibration is typically performed only once in a device's lifetime, no overhead chip-area for a charge-pump
has been spent. The programming pulse is to be generated off-chip, and applied at the VPP-pin / pad.
Datasheet, Rev. 1.4, March 27th, 2002
8/21
ZMD31020
Further programing details to be found in the parameter section of this datasheet as well as in the application
note.
During calibrated operation the VPP-pin / pad must be left open. (Note: An on-chip switch shortcircuits VPP to
VDD in non-programming mode; the switch is opened to release the VPP pin / pad for programming.)
6.7
Sensor Signal Correction Method and Sequence
In calibrated, regular sensing operation mode the CMC runs a cyclic program which will output a corrected
12-bit sensor value about every 10ms.
Within this cycle the CMC stages measurement of the ‚raw‘ sensor signal with 12 bits resolution, preceded by
measurement of temperature in 10 bits, and calculates a corrected sensor output value. Calculation is based on
a correction formula to which the 'raw' sensor signal and temperature as measured are applied in first and
second order terms - along with the 7 calibration parameters.
The measurement procedure of the 'raw' sensor signal and of temperature as well as the correction formula are
described in all details in the ZMD31020 Application Note.
6.8
Digital I2C Interface
The 2-wire I2C interface encompasses a clock line input SCL and a bidirectional data line SDA.
6.8.1 Digital Corrected Sensor Signal Output. I/O for Calibration and Device Test
During regular sensing operation the I2C interface will output the corrected sensor signal (12 bits) digitally and
serially.
During calibration the interface is input for the configuration word, output for the 'raw' non-corrected sensor
signal as well as for temperature, and finally again input for the calculated calibration parameters as well as the
scale limit values and possibly customer-specific identifiers.
As a third option, the interface is used to input digital vectors during device test, e.g. to exercise the output DAC,
see 6.9.
6.8.2 Data Communication Specifics
An I2C bus is controlled by a master device, which generates the clock, controls bus access, and generates
START and STOP conditions.
ZMD31020 is designed to work as a slave, hence will only respond to requests from a master device.
Obviously a typical master device during regular sensing operation is a connected electronic controller unit
requesting sensor data. (During calibration a connected PC or computer will be the master. During device test
the ATE system.)
ZMD31020 complies with the following protocol:
S
Bus not busy: During idle periods both data line (SDA) and clock line (SCL) remain HIGH.
START condition (S): HIGH to LOW transition of SDA line while clock (SCL) is HIGH is interpreted as
START condition. All commands must be preceded by START condition. Master can generate START
condition at any time. More than one command can be transmitted without generation of intermediate STOP
condition.
S
Datasheet, Rev. 1.4, March 27th, 2002
9/21
ZMD31020
S
S
STOP condition (P): LOW to HIGH transition of SDA line while clock (SCL) is HIGH determines STOP
condition. All command sequences must be ended with STOP condition.
Data valid (D): State of data line represents valid data when, after START condition, data line is stable for
duration of HIGH period of clock signal. Data on line must be changed during LOW period of clock signal.
There is one clock pulse per bit of data.
S
Acknowledge (A): Data is transferred in pieces of 8 bits (1 byte) on serial bus, MSB first. After each byte
receiving device – whether master or slave – is obliged to pull data line LOW as acknowledge for reception
of data. Master must generate an extra clock pulse for this purpose. When acknowledge is missed, slave
transmitter becomes inactive. It is on master either to send last command again or to generate STOP
condition in that case.
S
Slave address: Each device connected to bus has unique slave address. After generating START
condition, master transmits address consisting of 7-bit slave address and R/W - bit. Addressed slave
responds with acknowledge while other slaves on bus become inactive and ignore following data bytes.
R/W – bit determines direction of data transfer. If R/W is “0”, data is transmitted from master to slave (write
operation). If R/W is “1”, (read operation) data is transmitted from slave to master. Slave address of the IC is
hard coded to value 1111000xb.
S
Write operation: When writing to IC, slave address + R/W - bit (F0h) is followed by command byte and –
depending on command – optionally 2 data bytes. Calibration microcontroller reads command byte and
executes specific program for each command. Commands available are described below.
Read operation: When R/W – bit is set to “1” (F1h), IC sends 2 data bytes containing contents of output
register of serial interface. To read specific data, master must send special commands before reading which
instruct calibration microcontroller to place requested data in serial interface output register.
S
Data communication timing details are found in the parameter section of this datasheet.
Datasheet, Rev. 1.4, March 27th, 2002
10/21
ZMD31020
6.9
The Analog Output Stage
ZMD31020‘s analog output stage consists of an 11-bit resistor-string linear DAC, which converts the msb-
portion of the corrected sensor signal, followed by an output 1x buffer amplifier, designed for full supply voltage
range output swing and generating the output voltage VOUT
.
VOUT presents the actual corrected sensor signal as an analog voltage on a linear voltage scale with 11 bits
resolution. The output voltage is ratiometric to the supply voltage VDDA – VSSA
.
Furthermore it exhibits low- and high-side scale limits; either limit is programmable and clamping to these limit
values is performed digitally by the CMC, see section 6.6 and the ZMD31020 Application Note.
VOUT will change as corrected sensor signal values become available, hence with a refresh rate of about 10ms.
Datasheet, Rev. 1.4, March 27th, 2002
11/21
ZMD31020
7.
Electrical specification
7.1
Absolute maximum ratings
(all voltages referred to VSSA
)
PARAMETER
Analog supply voltage
Digital supply voltage
Voltage at all digital I/O
SYMBOL
CONDITIONS
MIN
-0.3
-0.3
-0.3
-0.3
TYP
MAX
6.5
6.5
VDD+0.3
VDDA+0.3
UNIT
VDDA
VDD
V
V
V
V
to VSS
to VSS
VIND, VOUTD
Voltage at all analog I/O V, V
Guaranteed
at all pins, HBM
at all pins
-2
2
kV
ESD-immunity
Guaranteed
-100
100
mA
latch-up immunity
Storage temperature
Ta_stg
-40
150
°C
7.2
Operating conditions
PARAMETER
SYMBOL
VDDA = VDD
Ta_oper
RSENSOR
CVDD
CONDITIONS
MIN
4.5
-40
1
TYP
MAX
5.5
125
10
UNIT
V
°C
kꢀ
nF
Supply voltage
to VSSA = VSS
5
Ambient temperature
Sensor's resistance
Capacitance
between VDD = VDDA
and VSS = VSSA
100
220
470
Datasheet, Rev. 1.4, March 27th, 2002
12/21
ZMD31020
7.3
Electrical parameters
(TA = -40°C ... +125°C; supply voltage: 4.5V ... 5.5V; all voltages referred to VSSA=VSS)
7.3.1 Power Supply
PARAMETER
Supply current
SYMBOL
IDD + IDDA
CONDITIONS
MIN
TYP
MAX
7.7
UNIT
mA
no sensor, no diode
connected;
VOUT open
7.3.2 Sensor Signal Measurement: PGA & 12-bit Input ADC
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNIT
Differential input voltage range options @ span = 52mV/V; v = 15.66
Diff. inp. volt. range 1
Diff. inp. volt. range 2
Diff. inp. volt. range 3
Diff. inp. volt. range 4
Sensitivity
Vp_1
Vp_2
Vp_3
Vp_4
Sp
CRROB = 1/16
CRROB = 1/8
CRROB = 1/4
CRROB = 1/2
VDDA = 5V
-3
-6
-13
-26
49
46
39
26
mV/V
mV/V
mV/V
mV/V
µV/LSB
73
Differential input voltage range options @ span = 36mV/V; v = 24
Diff. inp. volt. range 1
Diff. inp. volt. range 2
Diff. inp. volt. range 3
Diff. inp. volt. range 4
Sensitivity
Vp_1
Vp_2
Vp_2
Vp_2
Sp
CRROB = 1/16
CRROB = 1/8
CRROB = 1/4
CRROB = 1/2
VDDA=5V
-2
-4
-9
34
32
27
18
mV/V
mV/V
mV/V
mV/V
µV/LSB
-18
50
Differential input voltage range options @ span = 20mV/V; v = 42
Diff. inp. volt. range 1
Diff. inp. volt. range 2
Diff. inp. volt. range 3
Diff. inp. volt. range 4
Sensitivity
Vp_1
Vp_2
Vp_2
Vp_2
Sp
CRROB = 1/16
CRROB = 1/8
CRROB = 1/4
CRROB = 1/2
VDDA=5V
-1
-2
-5
19
18
15
10
mV/V
mV/V
mV/V
mV/V
µV/LSB
-10
29
Diff. Input leakage
IINL
-10
10
na
Datasheet, Rev. 1.4, March 27th, 2002
13/21
ZMD31020
7.3.3 Temperature Measurement: Current Sources & on-chip Diode & 12-bit ADC (10-bit
Conversion only)
PARAMETER
Current source
TC current source
Input voltage range
TC forward drop
Sensitivity
SYMBOL
ITN
TCITN
VTN
TCDROP
ST
CONDITIONS
pin / pad VTN
pin / pad VTN
MIN
34
-2000
-810
-1.9
TYP
MAX
46
2000
0
-2.3
1.1
UNIT
µA
ppm/K
mV
mV/K
mV/ LSB
40
rel. to VDDB1 = VDDB2
on-chip temp. sensor
pin / pad VTN
-2.1
0.97
0.84
7.3.4 12-bit ADC
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNIT
12-Bit sensor signal conversion
ADC diff. non-lin.
DNLp
INLp
-0.5
0.5
0.5
LSB
LSB
ADC integr. non-lin.
to best-fit straight line
-0.5
10-Bit temperature signal conversion
-0.5
ADC diff. non-lin.
ADC integr. non-lin.
DNLT
INLT
0.5
0.8
LSB
LSB
to best-fit straight line
-0.8
7.3.5 EEPROM programming
PARAMETER
SYM.
MIN. TYP. MAX.
Prog. voltage HIGH level
VPP,HIGH 11.75 12.25 12.75
V
Prog. voltage LOW level
(conn. to VDD on chip)
VPP,LOW
VDD
V
Prog. cycle duration
Rise time VPP
tVPP
tVPP,R
9
ms
ms
ms
ms
0.5
0.5
8
1
1
2
2
Fall time VPP
tVPP,F
Prog. pulse duration
TVPP,HIGH
7.3.6 Serial interface
PARAMETER
Input high level
Input low level
Output low level
Pull up current
SYMBOL
VIH
CONDITIONS
MIN
0.9
0
TYP
MAX
1
0.1
0.1
20
UNIT
VDD
VDD
VDD
µA
VIL
VOL
IOH
open drain, IOL = -4mA
pins SCL and SDA
5
Load capacitance SDA
CL_SDA
400
pF
Datasheet, Rev. 1.4, March 27th, 2002
14/21
ZMD31020
Timing Characteristics of the serial Interface
PARAMETER
SCL clock frequency
SYMBOL
fSCL
CONDITIONS
MIN
-
TYP
MAX
100
UNIT
kHz
µs
Bus free time betw. STOP
and START condition
tBUF
4.7
Hold Time (repeated)
START cond.
tHD,STA
to first clock pulse
4.0
µs
LOW period of SCL
HIGH period of SCL
tLOW
tHIGH
4.7
4.0
4.7
µs
µs
µs
Setup time repeated
START cond.
tSU,STA
Data hold time
Data setup time
tHD,DAT
tSU,DAT
tR
0
250
-
ns
ns
ns
Rise time of both SDA and
SCL
300
Fall time of both SDA and
SCL
tF
tSU,STO
tSP
-
300
ns
µs
ns
Setup time for STOP
condition
4
Input filter spike
suppression
spikes on SDA or
SCL of that length
are suppressed
50
Datasheet, Rev. 1.4, March 27th, 2002
15/21
ZMD31020
7.3.7 11-bit Output DAC & Output BUFFER
PARAMETER
Output current
Input current
SYMBOL
IOUTSOURCE
IOUTSINK
CONDITIONS
MIN
2
2
TYP
MAX
UNIT
mA
mA
BUFFER offset
VOUTOFF
TCOUTOFF
DNLOUT
INLOUT
VOUTMAX
VOUTMIN
-10
-10
-1
-4
0.975
10
10
1
mV
TC BUFFER offset
DAC diff. non-lin.
DAC integr. non-lin.
Max. output voltage
Min. output voltage
VOUT low scale limit
VOUT low scale limit
Load resistance
µV/K
LSB
LSB
VDDA
VDDA
VDDA
VDDA
kꢀ
to best-fit straight line
IOUTSOURCE = 2mA
IOUTSINK = 2mA
dig. ref.: pmin
4
0.025
0.25
1
0
0.75
dig. ref.: pmax
2.5
Load capacitance
CLVOUT
10
25
nF
7.3.8 Total System
PARAMETER
Startup time
Response time
Cycle time
SYMBOL
tSTUP
tR
CONDITIONS
power up to 1st result
MIN
TYP
MAX
40
11
UNIT
ms
ms
tC
10
ms
Non-linearity
TC sensor signal
TC temperature
NL
TCp
TCT
to best-fit straight line
-2500
+2500
20
100
ppm
ppm/K
ppm/K
Datasheet, Rev. 1.4, March 27th, 2002
16/21
ZMD31020
8.
Package Dimensions (in mm, reference: DIN EN 190000)
SSOP14 (209mil = 5.3mm)
weight:
≤ 0.3g
package body material: low stress epoxy
lead material:
lead finish:
lead form:
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
Dimensions of Sub-Group C1
Amin
1.73
A1min
A1max
A2min
A2max
cmin
0.05
0.21
1.68
1.78
0.09
0.20
6.07
6.33
5.20
5.38
0.25
Dimensions of Sub-Group B1
cmax
Dmin
Dmax
Amax
1.99
0.25
0.38
0.65
7.65
7.90
0.63
1.22
*
*
Bpmin
bpmax
enom
Emin
Emax
kmin
*
*
HEmin
HEmax
Lpmin
Zmax
θmin
0°
θmax
10°
* without mold-flesh
Datasheet, Rev. 1.4, March 27th, 2002
17/21
ZMD31020
9.
Die Dimensions
14 13 12
11 10 9
8
y
3 4 5 6 7
0
x
Die core with pads
Areas
Dimensions in µm
x
y
chip area
pad area
3500
90
3000
90
PIN
PIN
Pad coordinates µm (1)
number Name
x
y
1
2
3
4
5
6
7
8
9
10
11
12
13
14
VOUT
VDDA
VDD
VSS
SCL
SDA
VPP
VBN
VDDB2
VTN
VDDB1
VBP
VSSB
VSSA
45
45.00
45.00
45.00
45.00
45.00
45.00
45.00
2763.00
2763.00
2763.00
2763.00
2763.00
2763.00
2763.00
380.2
1403.30
1627.40
1868.8
2143.8
2385.3
2353.4
2091.6
1829.5
1426.7
864.1
478
48.1
Areas and pad coordinates
(1) for pad centres, related to the left bottom corner of pad 1
Datasheet, Rev. 1.4, March 27th, 2002
18/21
ZMD31020
10. Demokit ZMD31020DK
A Demokit is offered for evaluation and calibration purposes, see the illustration below. Apart from 10 sample
dice in waffle-pack and 5 finished parts the demokit contains:
S
S
S
a calibration PCB, equipped with a zero-insertion-force socket for ZMD31020, a PC-interface and a sensor
interface
a CD-ROM, containing this datasheet, the ZMD31020 Application Note, and evaluation and calibration
software
a sensor dummy including a temperature sensing diode, which fits to the calibration PCB’s sensor interface.
Demokit ZMD31020DK
The Demokit offers the following options:
S
Calibration of a sensor element / ZMD31020 combination
S
Verification, whether the desired output characteristic is being met over the sensor's stimuli and temperature
value spectrum
S
Reading of EEPROM contents, uncorrected sensor signal, temperature, corrected sensor signal, etc.
More details to be found in the ZMD31020 Application Note.
Datasheet, Rev. 1.4, March 27th, 2002
19/21
ZMD31020
11. Ordering Information
Order as follows
Operation
Package
Packing Unit
Temperature
ZMD31020AB
-40°C ... +125°C Die
5''-Wafer, electrically tested, unsawn
dice on tested unsawn wafer
ZMD31020AC
-40°C ... +125°C Die
5''-Wafer, electrically tested, on frame,
sawn
dice on tested sawn wafer
ZMD31020AF
-40°C ... +125°C SSOP14
-40°C ... +125°C SSOP14
Tube (77 parts / tube)(*)
finished parts in tube (*)
ZMD31020AF
Tape on reel (2000 parts / reel)(*)
finished parts in tape on reel (*)
ZMD31020DK
demokit
(*) The quantity ordered should be a multiple of the quantity / packing unit as specified
12. Related Documents
ZMD31020 Application Note
Datasheet, Rev. 1.4, March 27th, 2002
20/21
ZMD31020
13. Sales Contacts
Sales Office Dresden
Zentrum Mikroelektronik Dresden AG
Grenzstraße 28
D-01109 Dresden
Germany
Phone +49-351-8822-310
Fax +49-351-8822-337
sales@zmd.de
Sales Office Long Island
ZMD America Inc.
201 Old Country Road
Melville, NY 11747
USA
Phone +1-631-549-2666
Fax +1-631-549-2882
sensors@zmda.com
Life Support Policy
ZMD products are not designed, intended, or authorised for use as components in systems intended for surgical implant into the body, or
other applications intended to support or sustain life, or for any other application in which the failure of the ZMD product could create a
situation where personal injury or death may occur.
Components used in life-support devices or systems must be expressly authorised by ZMD for such purpose.
Limited Warranty
The information in this document has been carefully checked and is believed to be reliable. However Zentrum Mikroelektronik Dresden
(ZMD) makes no guarantee or warranty concerning the accuracy of said information and shall not be responsible for any loss or damage of
whatever nature resulting from the use of, or reliance upon it. The information in this document describes the type of component and shall
not be considered as assured characteristics.
ZMD does not guarantee that the use of any information contained herein will not infringe the patent, trademark, copyright, mask work right
or other rights of third parties, and no patent or licence is implied hereby. This document does not in any way extent ZMDs warranty on any
product beyond that set forth in its standard terms and conditions of sale.
ZMD reserves terms of delivery and reserves the right to make changes in the products or specifications, or both, presented in this
publication at any time and without notice.
© 2002 Zentrum Mikroelektronik Dresden AG. All rights reserved.
Datasheet, Rev. 1.4, March 27th, 2002
21/21
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