ZMD31020BCG1-T [IDT]
Sensor/Transducer,;型号: | ZMD31020BCG1-T |
厂家: | INTEGRATED DEVICE TECHNOLOGY |
描述: | Sensor/Transducer, |
文件: | 总22页 (文件大小:597K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ZMD31020
Sensor Signal Conditioner
Datasheet
Features
Brief Description
ZMD31020 is a CMOS integrated circuit for highly-
accurate amplification and sensor-specific correction
of bridge sensor signals. The device provides digital
• Digital compensation of sensor offset, sensitivity,
temperature drift and non-linearity
• Adjustable to nearly all piezo-resistive bridge
sensor types
compensation
of
sensor
offset,
sensitivity,
temperature drift and non-linearity by a 16-bit RISC
micro controller running a correction algorithm.
ZMD31020 accommodates nearly all piezo-resistive
bridge sensor types.
• Digital one-shot calibration: quick and precise
• Selectable temperature compensation reference:
internal or external diode
• Output options: 0...5V analog ratiometric voltage
The bi-directional digital I2C interface can be used for
or 12 bit digital I2C interface
a
simple
PC-controlled
one-shot
calibration
• Product traceability by user-defined EEPROM
entries
procedure, in order to program a set of calibration
coefficients into an on-chip EEPROM. Thus a specific
sensor and a ZMD31020 are mated digitally: fast,
precise and without the cost overhead associated with
trimming by external devices or laser.
• Operation temperature range, depending on
product version, up to –40...+125°C
• Supply voltage +4.5...+5.5V
• Sampling rate ≥100Hz
ZMD31020 has been designed for industrial and
consumer applications and is specifically suited for
most pressure sensors.
• Available in SSOP14 or as die
Benefits
• Evaluation Kit available
•
•
No external trimming components required
PC-controlled configuration and calibration via
digital bus interface - simple, low cost
High accuracy (±0.1% FSO @ -25 to 85°C;
±0.25% FSO @ -40 to 125°C)
ꢀ Support for industrial mass calibration
available
ꢀ Quick circuit customization possible for large
production volumes
•
Application Circuit Example
Copyright © 2005, ZMD AG, Rev. 1.6, 2005-04-22
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
Content
1.
2.
Pin Description ............................................................................................................................................. 2
Circuit Description ........................................................................................................................................ 3
Signal Flow ............................................................................................................................................... 3
Configuration Word................................................................................................................................... 4
Differential Sensor.................................................................................................................................... 4
Temperature Sensing............................................................................................................................... 4
Analog Input Channel............................................................................................................................... 5
2.1
2.2
2.3
2.4
2.5
2.5.1
Bridge Polarity Setting....................................................................................................................... 5
Programmable Gain Amplifier PGA................................................................................................... 5
Analog-to-digital Converter ADC....................................................................................................... 5
Temperature Measurement............................................................................................................... 6
2.5.2
2.5.3
2.5.4
2.6
2.7
2.8
2.9
Correction Microcontroller CMC ............................................................................................................... 6
Parameter EEPROM ................................................................................................................................ 7
Sensor Signal Correction Method and Sequence .................................................................................... 8
Digital I2C Interface................................................................................................................................... 8
2.9.1
Digital Corrected Sensor Signal Output and I/O for Calibration and Device Test............................. 8
Data Communication Specifics ......................................................................................................... 8
The Analog Output Stage ................................................................................................................... 10
Electrical Specification ............................................................................................................................... 11
Absolute Maximum Ratings.................................................................................................................... 11
Operating Conditions.............................................................................................................................. 11
Electrical Parameters ............................................................................................................................. 12
2.9.2
2.10
3.
3.1
3.2
3.3
3.3.1
3.3.2
Power Supply .................................................................................................................................. 12
PGA & 12-bit Input ADC.................................................................................................................. 12
Temperature Measurement: Current Sources, on-chip Diode & 12-bit ADC (4) .............................. 13
12-bit ADC (1) ................................................................................................................................... 13
EEPROM Programming .................................................................................................................. 13
Serial I2C Interface .......................................................................................................................... 13
11-bit Output DAC & Output BUFFER (2) ........................................................................................ 15
Total System.................................................................................................................................... 15
3.3.3
3.3.4
3.3.5
3.3.6
3.3.7
3.3.8
4.
5.
Package Dimensions.................................................................................................................................. 16
Die Dimensions and Pad Coordinates....................................................................................................... 17
Die Dimensions....................................................................................................................................... 17
Pad Coordinates..................................................................................................................................... 18
Evaluation Kit “ZMD31020KIT” .................................................................................................................. 19
Ordering Information .................................................................................................................................. 20
Related Documents.................................................................................................................................... 20
5.1
5.2
6.
7.
8.
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written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
1. Pin Description
PIN
Name
Description
Number
1
VOUT
analog conditioned sensor signal output
2
3
4
5
6
7
8
VDDA (*) analog device functions positive supply
VDD
VSS
SCL
SDA
VPP
VBN
digital device functions positive supply
digital device functions negative supply
I²C clock input, on-chip pull-up resistor
I²C data input / output, on-chip pull-up resistor
positive EEPROM programming voltage
differential sensor signal negative input
9
VDDB2 (*) positive supply for sensor and temperature sensing diode
VTN input for temperature sensing diode
VDDB1 (*) positive supply for sensor and temperature sensing diode
VBP differential sensor signal positive input
VSSB (**) sensor negative supply
VSSA (**) analog device functions negative supply
10
11
12
13
14
(*)
VDDA, VDDB1 and VDDB2 tied to common on-chip positive supply rail
VSSA and VSSB tied to common on-chip negative supply rail
(**)
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written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
2. Circuit Description
2.1 Signal Flow
Block diagram of ZMD31050
PGA
MUX
ADC
CMC
DAC
BAMP
TS
programmable gain amplifier
multiplexer
analog-to-digital converter
calibration microcontroller
digital-to-analog converter
buffer amplifier
on-chip temperature sensor (pn-junction)
for calibration parameters and configuration
for correction formula and –algorithm
serial interface: I2C data I/O, clock
EEPROM
ROM
I2C
The ZMD31020’s signal path is partly analog (blue) and partly digital (red). The differential signal from the
resistive bridge sensor is pre-amplified by the programmable gain amplifier (PGA). There are 3 different
adjustable gains.
The Multiplexer (MUX) transmits the differential signal or the temperature signal to the ADC in a certain
sequence. (The external temperature sensing diode or the internal temperature sensor can be used optionally.)
The ADC converts the differential signal with 12 bits resolution and the temperature signal with 10 bits resolution
into digital values.
The digital signal correction takes place in the calibration micro-controller (CMC). It is based on a special
correction formula located in the ROM and on a set of sensor-specific calibration parameters stored in the
EEPROM. The resulting corrected sensor signal is output via the I2C-interface (with 12 bits resolution) , or, after
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written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
conversion by the DAC, as analog voltage (with 11 bits resolution) at the buffer amplifier (BAMP). The
programming of the configuration data and of the calibration parameters into the EEPROM (during the
calibration procedure) is also realized via the I2C interface.
2.2 Configuration Word
Many of the following sections, describing each block of ZMD31020 in detail, will refer to configuration bits, part
of the configuration word stored under address &H09 of the parameter EEPROM. These bits are settings for a
number of on-chip device functions and select specific functional or parametrical behaviour.
The contents of the parameter EEPROM are determined and calculated, written and stored under PC-control
during the calibration procedure. Hence the configuration bits are coded and non-volatile stored once calibration
of a ZMD31020 device / sensor pair has taken place, and will remain unchanged during regular sensing
operation, unless re-calibration is performed.
15
-
14
-
13
-
12
-
11
-
10
-
9
-
8
-
7
-
6
5
4
3
2
1
0
CH
TS
BP
G1
G0
O1 O0
Configuration word, stored under address &H09 of the parameter EEPROM
Only 7 bits of the configuration word are relevant settings as follows:
Bit 0, Bit 1
Bit 2, Bit 3
Bit 4
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
O0, O1: select ADC’s offset compensation
G0, G1: select PGA’s gain
BP: cross-switches differential sensor inputs VBP and VBN
TS: selects on-chip vs. off-chip temperature sensor
CH: enables PGA’s chopper-stabilization
Bit 5
Bit 6
The possible options of these settings are shown in table form in the following paragraphs.
2.3 Differential Sensor
ZMD31020 has been specifically designed for ratiometric differential sensors, e.g. Wheatstone bridge type
sensors. A ratiometric sensor typically generates a differential output signal proportional to the supply voltage
applied to it. The sensor is supplied from VDDB1 or VDDB2 (whichever pin/pad is more favourable layoutwise)
at the + side and tied to VSSB at the – side. The sensor's differential output signal is routed to VBP and VBN.
Sensor and signal conditioner ZMD31020 have the same supply (see block schematic in section 2.1), hence the
differential input voltage seen by ZMD31020 is ratiometric to it’s supply voltage.
2.4 Temperature Sensing
The characteristic of a sensor element tends to change with temperature. To compensate for this, ZMD31020 is
equipped to measure temperature by an external diode or by an on-chip pn-junction. TS – configuration bit 5 –
will select the desired sensor option as follows:
TS
Temperature sensing diode
0
1
off chip
on chip
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written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
2.5 Analog Input Channel
ZMD31020’s block schematic in section 2.1 shows the structure of the analog input channel. The signal path for
the sensor signal as well as for temperature is fully differential up to the ADC. The analog multiplexer provides a
cost-effective, sequential conversion by a common ADC. Each signal path can be separated from the source at
it‘s input and can be short-circuit there for offset-cancellation purposes; for more details see the ZMD31020
Functional Description.
2.5.1 Bridge Polarity Setting
The sensor signal path features a cross-switch to reverse the polarity of the bridge sensor signal.
BP – configuration bit 4 – sets the bridge polarity as follows:
BP Differential signal
0
1
VBR_P – VBR_N
VBR_N – VBR_P
2.5.2 Programmable Gain Amplifier PGA
The PGA realizes a coarse sensitivity adaptation of the bridge sensor signal in several amplification steps
(sensitivity fine-tuning takes place later in the CMC).
Three different gains can be set by G0 and G1 - configuration bits 2 and 3 - as follows:
G1 G0 Gain aIN
0
1
1
x
0
1
15.66
24
42
The chopper-stabilisation of the PGA reduces the signal noise and is enabled by CH - configuration bit 6:
CH Chopper-stabilisation
0
1
Disabled
Enabled
2.5.3 Analog-to-digital Converter ADC
The ADC is a first order charge balancing analog-to-digital converter in full differential switched capacitor
technology. The amplified bridge sensor signal is converted by the ADC with full 12 bits resolution against a
reference voltage of 0.96 (VDDA – VSSA).
As both the signal to be measured as well as the reference voltage, it is measured against, are ratiometric to
supply voltage (VDDA - VSSA), the ADC’s conversion result is insensitive to supply-tolerances and -instabilities.
In addition, the ADC realizes a coarse offset compensation (ADC-Range-Shift RSADC)) of the bridge sensor
signal (offset fine-tuning takes place afterwards in the CMC).
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written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
RSADC can be set as follows:
O1 O0 RSADC (*)
0
0
1
1
0
1
0
1
15/16
7/8
3/4
1/2
(*) ADC-Range-Shift, related to the maximum processable sensor signal span
2.5.4 Temperature Measurement
The temperature sensing diode, selected by TS – configuration bit 5, is biased with a constant current of 40µA.
It‘s forward drop changes with –2.1mV/°K typically, and is passed as differential temperature signal.
The 40µA current source is only on during temperature measurement, to prevent any interference with the
bridge sensor signal's measurement.
The differential temperature signal is resolved by the ADC with only 10 bits, against a differential reference
voltage of 0.980V, derived from an on-chip bandgap. Whenever measuring temperature, the ADC is set to
RSADC = 15/16.
2.6 Correction Microcontroller CMC
The CMC performs the sensor signal fine-tuning in the digital domain. It is a 16 bit RISC micro-controller, driven
by an on-chip clock generator with a nominal clock frequency of 1.5 MHz. The overall clock frequency tolerance
is smaller than ±25%.
The CMC includes a 16-bit width ALU and a (16 x 16)-bit RAM. Furthermore it has a 12-bit input counter into
which the ADC will serially transmit conversion results; 4096 clock cycles are needed per result.
The CMC is connected to a (1k x 16)-bit instruction ROM and a (12 x 16)-bit parameter EEPROM.
At the output side the CMC is equipped with an I2C-interface as a digital series output for the corrected sensor
signal.
Initially, during calibration, the same interface is used bi-directionally: to write the configuration word into the
EEPROM, to read non-corrected sensor value as well as temperature, and again and finally to write the valid
calibration parameters into the EEPROM.
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written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
2.7 Parameter EEPROM
The parameter EEPROM is a non-volatile store for 12 parameter values, each with 16 bits of width.
Address
Parameter
Default content
5234 Hex
0023 Hex
2044 Hex
3022 Hex
6356 Hex
1045 Hex
2073 Hex
03E8 Hex
0FA0 Hex
0040 Hex
1234 Hex
5678 Hex
calibration parameter a0 for sensor's non-linearity correction
0HEX
1HEX
2HEX
3HEX
4HEX
5HEX
6HEX
7HEX
8HEX
9HEX
AHEX
BHEX
calibration parameter a1 for sensor's offset correction
calibration parameter a2 for first order sensor offset drift correction
calibration parameter a3 for second order sensor offset drift correction
calibration parameter a4 for gain correction
calibration parameter a5 for first order gain drift correction
calibration parameter a6 for second order gain drift correction
low-side scale limit value for corrected sensor signal
high-side scale limit value for corrected sensor signal
configuration word
customer-specific identification word
customer-specific identification word
Contents of the parameter EEPROM
The configuration word and it's contents under address &H09 have been described already in chapter 2.5.
The calibration parameters are stored under addresses &H00 through &H06. The calculation of these
parameters is described in the ZMD31020 Functional Description.
Address locations &H07 and &H08 contain a low-side resp. high-side scale limit value for the corrected sensor
signal. Lower resp. -higher corrected signal values are clamped arithmetically to these limits by the CMC. Both
the low and high-side scale limits can be adjusted with a resolution of 12 bits. The 12 bit limit value must be
programmed into the least significant portion of either address. The 4 most significant bit locations of either
address are don't care bits and may be programmed freely.
Address locations &H0A and &H0B are available for customer-specific identification words, e.g. for traceability
purposes.
The contents of EEPROM addresses &H00 through &H09 are loaded into the RAM register block of the CMC
upon power-on.
The configuration bits are routed from the configuration register to the various device functions to be set up, see
chapter 6.1.
Erasing and programming of the various EEPROM address locations during calibration requires programming
pulses of about 12V amplitude and about 10ms pulse width (see section 3.3.5). Further programming details are
to find in the ZMD31020 Functional Description.
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written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
Since a calibration is typically performed only once in a sensor's lifetime, no overhead chip-area for a charge-
pump has been spent. Thus the programming pulse has to be generated off-chip, and applied at the VPP
pin/pad.
During normal operation mode the VPP pin/pad must be left open.
Note: An on-chip switch short-circuits VPP to VDD in normal operation mode; the switch is opened to release
the VPP pin/pad for programming.)
2.8 Sensor Signal Correction Method and Sequence
In normal operation mode (regular sensing operation) the CMC runs a cyclic program which will output a
corrected 12-bit sensor value about every 10ms.
Within this cycle the CMC stages measurement of the ‚raw‘ sensor signal with 12 bits resolution, preceded by
measurement of temperature in 10 bits, and calculates a corrected sensor output value. Calculation is based on
a correction formula to which the 'raw' sensor signal and temperature as measured are applied in first and
second order terms - along with the 7 calibration parameters.
The measurement procedure of the 'raw' sensor signal and of temperature as well as the correction formula are
described in all details in the ZMD31020 Functional Description.
2.9 Digital I2C Interface
The 2-wire I2C interface encompasses a clock line input SCL and a bi-directional data line SDA.
2.9.1 Digital Corrected Sensor Signal Output and I/O for Calibration and Device Test
During normal operation mode (regular sensing operation) the I2C interface will output the corrected sensor
signal (12 bits) digitally and serially.
During calibration the interface is input for the configuration word, output for the 'raw' non-corrected sensor
signal as well as for temperature, and finally again input for the calculated calibration parameters as well as the
scale limit values and possibly customer-specific identifiers.
As a third option, the interface is used to input digital vectors during device test, e.g. to exercise the output DAC,
see section 2.10.
2.9.2 Data Communication Specifics
An I2C bus is controlled by a master device, which generates the clock, controls the bus access, and generates
START and STOP conditions. ZMD31020 is designed to work as a slave - thus it will only respond to requests
from a master device.
Obviously a typical master device during regular sensing operation is a connected electronic controller unit
requesting sensor data. (During calibration a connected PC or computer will be the master. During device test
the ATE system will be the master.)
ZMD31020 complies with the following protocol:
•
•
Bus not busy: During idle periods both data line (SDA) and clock line (SCL) remain HIGH.
START condition (S): HIGH to LOW transition of SDA line while clock (SCL) is HIGH is interpreted as
START condition. All commands must be preceded by START condition. Master can generate START
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ZMD31020
Sensor Signal Conditioner
Datasheet
condition at any time. More than one command can be transmitted without generation of intermediate STOP
condition.
•
STOP condition (P): LOW to HIGH transition of SDA line while clock (SCL) is HIGH determines STOP
condition. All command sequences must be ended with STOP condition.
•
•
Data valid (D): State of data line represents valid data when, after START condition, data line is stable for
duration of HIGH period of clock signal. Data on line must be changed during LOW period of clock signal.
There is one clock pulse per bit of data.
Acknowledge (A): Data is transferred in pieces of 8 bits (1 byte) on serial bus, MSB first. After each byte
receiving device – whether master or slave – is obliged to pull data line LOW as acknowledge for reception
of data. Master must generate an extra clock pulse for this purpose. When acknowledge is missed, slave
transmitter becomes inactive. It is on master either to send last command again or to generate STOP
condition in that case.
•
Slave address: Each device connected to bus has unique slave address. After generating START
condition, master transmits address consisting of 7-bit slave address and R/W - bit. Addressed slave
responds with acknowledge while other slaves on bus become inactive and ignore following data bytes.
R/W – bit determines direction of data transfer. If R/W is “0”, data is transmitted from master to slave (write
operation). If R/W is “1”, (read operation) data is transmitted from slave to master. Slave address of the IC is
hard coded to value 1111000xb.
•
•
Write operation: When writing to IC, slave address + R/W - bit (F0h) is followed by command byte and –
depending on command – optionally 2 data bytes. Calibration microcontroller reads command byte and
executes specific program for each command. Commands available are described below.
Read operation: When R/W – bit is set to “1” (F1h), IC sends 2 data bytes containing contents of output
register of serial interface. To read specific data, master must send special commands before reading which
instruct calibration microcontroller to place requested data in serial interface output register.
Data communication timing details are found in the parameter section of this datasheet.
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written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
2.10 The Analog Output Stage
ZMD31020‘s analog output stage consists of an 11-bit resistor-string linear DAC, which converts the MSB-
portion of the corrected sensor signal, followed by an output buffer amplifier, designed for full supply voltage
range output swing and generating the output voltage VOUT
.
VOUT presents the actual corrected sensor signal as an analog voltage on a linear voltage scale with 11 bits
resolution. The output voltage is ratiometric to the supply voltage (VDDA – VSSA).
Furthermore it exhibits low- and high-side scale limits; either limit is programmable and clamping to these limit
values is performed digitally by the CMC (see section 2.7 and the ZMD31020 Functional Description).
VOUT will change as corrected sensor signal values become available, hence with a refresh rate of about 10ms.
VOUT can source/sink a maximum load current of 2mA.
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ZMD31020
Sensor Signal Conditioner
Datasheet
3. Electrical Specification
(all voltages referred to VSSA)
3.1 Absolute Maximum Ratings
PARAMETER
SYMBOL
VDDA
VDD
VD_I/O
VA_I/O
CONDITIONS
MIN
-0.3
-0.3
-0.3
-0.3
TYP
MAX
6.5
6.5
VDD+0.3
VDDA+0.3
UNIT
Analog supply voltage
Digital supply voltage
Voltage at all digital I/O
Voltage at all analog I/O
V
V
V
V
to VSS
to VSS
Guaranteed
at all pins, HBM
at all pins
-2
2
kV
ESD-immunity
Guaranteed
-100
100
mA
latch-up immunity
Storage temperature
TSTG
-40
150
100
°C
°C
Average storage- and
operation temperature for
15 years time of
operation
3.2 Operating Conditions
PARAMETER
Supply voltage
Ambient temperature
Bridge resistance
Capacitance
SYMBOL
VDDA = VDD
TAMB
CONDITIONS
MIN
TYP
MAX
5.5
125
10
UNIT
V
°C
kΩ
nF
to VSSA = VSS
4.5
-40
1
5
RBR
CVDD(A)
between VDD = VDDA
and VSS = VSSA
100
220
470
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written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
3.3 Electrical Parameters
(for TAMB = -40°C ... +125°C; supply voltage: 4.5V ... 5.5V; all voltages referred to VSSA = VSS)
3.3.1 Power Supply
PARAMETER
Supply current
SYMBOL
IDD + IDDA
CONDITIONS
MIN
TYP
MAX
7.7
UNIT
mA
no sensor, no diode
connected;
VOUT open
3.3.2 PGA & 12-bit Input ADC
PARAMETER SYMBOL
CONDITIONS
MIN
TYP
MAX
UNIT
Differential input voltage range options @ Input span VIN_SP = 52mV/V; aIN = 15.66
Diff. inp. volt. range 1
Diff. inp. volt. range 2
Diff. inp. volt. range 3
Diff. inp. volt. range 4
Sensitivity
VIN_DIFF_1
VIN_DIFF_2
VIN_DIFF_3
VIN_DIFF_4
SIN
RSADC = 15/16
RSADC = 7/8
RSADC = 3/4
RSADC = 1/2
VDDA = 5V
-3
-6
-13
-26
49
46
39
26
mV/V
mV/V
mV/V
mV/V
µV/LSB
73
Differential input voltage range options @ Input span VIN_SP = 52mV/V; aIN = 24
Diff. inp. volt. range 1
Diff. inp. volt. range 2
Diff. inp. volt. range 3
Diff. inp. volt. range 4
Sensitivity
VIN_DIFF_1
VIN_DIFF_2
VIN_DIFF_3
VIN_DIFF_4
SIN
RSADC = 15/16
RSADC = 7/8
RSADC = 3/4
RSADC = 1/2
VDDA=5V
-2
-4
-9
34
32
27
18
mV/V
mV/V
mV/V
mV/V
µV/LSB
-18
50
Differential input voltage range options @ Input span VIN_SP = 52mV/V; aIN = 42
Diff. inp. volt. range 1
Diff. inp. volt. range 2
Diff. inp. volt. range 3
Diff. inp. volt. range 4
Sensitivity
VIN_DIFF_1
VIN_DIFF_2
VIN_DIFF_3
VIN_DIFF_4
SIN
RSADC = 15/16
RSADC = 7/8
RSADC = 3/4
RSADC = 1/2
VDDA=5V
-1
-2
-5
19
18
15
10
mV/V
mV/V
mV/V
mV/V
µV/LSB
-10
29
Diff. input offset current
IIN_OFF
-10
10
nA
Copyright © 2005, ZMD AG, Rev. 1.6, 2005-04-22
12/22
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
3.3.3 Temperature Measurement: Current Sources, on-chip Diode & 12-bit ADC (4)
PARAMETER
SYMBOL
ITS
TCI_TS
VTN
TCDROP
ST
CONDITIONS
pin / pad VTN
pin / pad VTN
MIN
20
-2000
-810
-1.9
TYP
MAX
55
2000
-200
-2.3
1.1
UNIT
µA
ppm/K
mV
mV/K
mV/ LSB
Current source
40
TC current source (1)
Input voltage range
TC forward drop
Sensitivity
rel. to VDDB1 = VDDB2
on-chip temp. sensor
pin / pad VTN
-2.1
0.97
0.84
3.3.4 12-bit ADC (1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNIT
12-Bit sensor signal conversion
ADC diff. non-lin.
DNLp
-0.5
-0.5
10-Bit temperature signal conversion
0.5
0.5
LSB
LSB
ADC integr. non-lin.
INLp
to best-fit straight line
ADC diff. non-lin.
ADC integr. non-lin.
DNLT
INLT
-0.5
-0.8
0.5
0.8
LSB
LSB
to best-fit straight line
3.3.5 EEPROM Programming
tVPP_R
tVPP_H
VPPH
tVPP_F
PARAMETER
Prog. voltage HIGH level
SYM.
VPPH
VPPL
MIN. TYP. MAX.
11.75 12.25 12.75
VDD
V
V
Prog. voltage LOW level
(conn. to VDD on chip)
VPPL
Prog. cycle duration
Rise time VPP
tVPP
9
ms
ms
ms
ms
tVPP
tVPP_R
tVPP_F
tVPP_H
0.5
0.5
8
1
1
2
2
Fall time VPP
Prog. pulse duration
Number of write/read cycles
Programming temperature
100
TPP
-40
+85 °C
3.3.6 Serial I2C Interface
PARAMETER
Input high level
Input low level
SYMBOL
VI2C_IN_H
VI2C_IN_L
VI2C_OUT_L
RI2C_SCL/SDA
CONDITIONS
MIN
0.9
0
TYP
MAX
UNIT
VDD
VDD
VDD
Ω
1
0.1
0.1
Output low level
Pull-up-resistance (at
470
5
SCL and SDA)
Pull up current
II2C_OUT_H
CSDA
pins SCL and SDA
20
400
µA
pF
Load capacitance SDA
Copyright © 2005, ZMD AG, Rev. 1.6, 2005-04-22
13/22
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
Timing Characteristics of the serial Interface
tI2C_F
tI2C_SU_DAT
tI2C_HD_DAT
tI2C_SU_STA tI2C_HD_STA tI2C_R
tI2C_H tI2C_L
tI2C_HD_STA
tI2C_SU_STO tI2C_BF
PARAMETER
SCL clock frequency
SYMBOL
fSCL
CONDITIONS
MIN
-
TYP
MAX
100
UNIT
kHz
µs
Bus free time betw. STOP
and START condition
tI2C_BF
4.7
Hold Time (repeated)
START cond.
tI2C_HD_STA to first clock pulse
4.0
µs
LOW period of SCL
HIGH period of SCL
tI2C_L
tI2C_H
4.7
4.0
4.7
µs
µs
µs
Setup time (repeated)
START cond.
tI2C_SU_STA
Data hold time
Data setup time
tI2C_HD_DAT
tI2C_SU_DAT
tI2C_R
0
250
-
ns
ns
ns
Rise time of both SDA and
SCL
300
Fall time of both SDA and
SCL
tI2C_F
-
300
ns
µs
ns
Setup time for STOP
condition
tI2C_SU_STO
4
Input filter spike
suppression / noise
interception
tI2C_NI
spikes on SDA or
SCL of that length
are suppressed
50
Copyright © 2005, ZMD AG, Rev. 1.6, 2005-04-22
14/22
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
3.3.7 11-bit Output DAC & Output BUFFER (2)
PARAMETER
Output current
Analog output offset voltage
SYMBOL
IOUT
VOUT_OFF
CONDITIONS
MIN
±2
-10
-10
-1
-4
0.975
TYP
MAX
UNIT
mA
mV
µV/K
LSB
LSB
VDDA
VDDA
VDDA
VDDA
current source & sink
10
10
1
Temp.-coeff output offset voltage TCOUT_OFF
DAC differential nonlinearity
DAC integral nonlinearity
Maximal output voltage
Minimal output voltage
VOUT low scale limit
VOUT low scale limit
Load resistance
DNLOUT
INLOUT
VOUT_MAX
VOUT_MIN
VOUT_LSL
VOUT_HSL
RL_OUT
to best-fit straight line
IOUTSOURCE = 2mA
IOUTSINK = -2mA
dig. ref.: pmin
4
0.025
0.25
1
0
dig. ref.: pmax
0.75
2.5
10
kΩ
nF
Load capacitance
CL_OUT
25
3.3.8 Total System
PARAMETER
Startup time
Response time
Conversion cycle time
Non-linearity
TC sensor signal
TC temperature
SYMBOL
CONDITIONS
power up to 1st result
MIN
TYP
MAX
40
11
10
+2500
20
UNIT
ms
ms
tSTA
tRESP
tCYC
NL
TCp
TCT
ms
to best-fit straight line
-2500
ppm (3)
ppm/K
ppm/K
100
Notes for the electrical parameters:
1)
2)
No measurement in mass production, parameter is guarantied by design.
During normal operation mode using the analog output the I2C interface allows to read out the output
digital value in parallel (= the digital input of the DAC).
3)
4)
Analog signal conditioning and analog digital conversion for measurement of the bridge sensor
The A/D conversion of the temperature signal is done with 10 bit resolution only.
Copyright © 2005, ZMD AG, Rev. 1.6, 2005-04-22
15/22
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
4. Package Dimensions
SSOP14 (209mil = 5.3mm)
weight:
≤ 0.3g
package body material: low stress epoxy
lead material:
lead finish:
lead form:
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
Dimensions of Sub-Group C1
Amin
1.73
A1min
A1max
A2min
A2max
cmin
0.05
0.21
1.68
1.78
0.09
0.20
6.07
6.33
5.20
5.38
0.25
Dimensions of Sub-Group B1
cmax
Dmin
Dmax
Amax
1.99
0.25
0.38
0.65
7.65
7.90
0.63
1.22
*
*
Bpmin
bpmax
enom
Emin
Emax
kmin
*
*
HEmin
HEmax
Lpmin
Zmax
θmin
0°
θmax
10°
* without mold-flesh
All dimensions in mm, reference: DIN EN 190000
Copyright © 2005, ZMD AG, Rev. 1.6, 2005-04-22
16/22
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
5. Die Dimensions and Pad Coordinates
5.1 Die Dimensions
•
•
•
•
•
Die size (incl. scribeline): 3500µm x 3000µm = 10.5sqmm
Core die size (without scribeline): 3310µm x 2810µm ≈ 9.3sqmm
Die thickness: 390µm
Scribeline (distance between two core dice on wafer): 190µm
Pads size: 90µm x 90µm
14
13
12
11
10
9
8
2810µm
Core Die
ZMD31020
with Pads
y
0
x
1
2
3
4
5
6
7
725µm
3310µm
Copyright © 2005, ZMD AG, Rev. 1.6, 2005-04-22
17/22
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
5.2 Pad Coordinates
All pad coordinates refer to the pad centers and related to the left bottom corner of pad 1.
PIN Name
Pad coordinates µm
PIN-No.
X
45
Y
45.00
1
2
VOUT
VDDA
380.2
45.00
3
VDD
1403.30
1627.40
1868.8
2143.8
2385.3
2353.4
2091.6
1829.5
1426.7
864.1
45.00
4
VSS
45.00
5
SCL
45.00
6
SDA
45.00
7
VPP
45.00
8
VBN
2763.00
2763.00
2763.00
2763.00
2763.00
2763.00
2763.00
9
VDDB2
VTN
10
11
12
13
14
VDDB1
VBP
VSSB
VSSA
478
48.1
Copyright © 2005, ZMD AG, Rev. 1.6, 2005-04-22
18/22
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
6. Evaluation Kit “ZMD31020KIT”
An Evaluation Kit is offered, see the illustration below. The kit provides easy evaluation and experimental
calibration of a sensor element / ZMD31020 combination. It contains 3 PCBs, a CD-ROM (calibration program,
USB port driver, technical documentation) and an USB cable. For ordering codes and pricing please refer to the
document “ZMD SSC Kits Feature Sheet”.
Fig. 3: Evaluation Kit „ZMD31020KIT“
Important Note:
The Evaluation Kit is not intended to be used for industrial sensor calibration in serial production. If components
of the kit are used for this purpose then an EEPROM programming pulse like specified in section 3.3.5 has to be
assured. Otherwise the EEPROM data preservation may be affected.
For industrial sensor calibration ZMD and its partners offer a comprehensive support for the development of the
required hard- and software. Please contact the ZMD sales offices for detailed information.
Copyright © 2005, ZMD AG, Rev. 1.6, 2005-04-22
19/22
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
7. Ordering Information
Ordering Code
Description
Operat. Temp. Package
Marking
Shipping Form *
ZMD31020BCB
dice on tested
unsawn wafer
0...+70°C
die
die
die
6” wafer
ZMD31020BCC
ZMD31020BCD
dice on tested sawn 0...+70°C
wafer
plastic frame
dice
0...+70°C
waffle tray
in waffle tray
(100 dice / tray)
ZMD31020BCF-T
ZMD31020BCF-R
finished parts in
0...+70°C
0...+70°C
0...+70°C
SSOP14
(5.3mm)
SSOP14
(5.3mm)
SSOP14
(5.3mm)
ZMD
tube
tube
31020BCF (77 parts / tube)
finished parts in
tape on reel
ZMD
31020BCF (2000 parts / reel)
ZMD tube
31020BCF (77 parts / tube)
tape on reel
ZMD31020BCG1-T finished parts in
tube, “green”
package, lead-free
ZMD31020BCG1-R finished parts in
tube, “green”
0...+70°C
SSOP14
(5.3mm)
ZMD
tape on reel
31020BCF (2000 parts / reel)
package, lead-free
ZMD31020BIB
ZMD31020BIC
ZMD31020BID
dice on tested
unsawn wafer
-40...+125°C** die
6” wafer
dice on tested sawn -40...+125°C** die
wafer
plastic frame
dice
-40...+125°C** die
waffle tray
in waffle tray
(100 dice / tray)
ZMD31020BIF-T
ZMD31020BIF-R
ZMD31020BIG1-T
finished parts in
-40...+125°C** SSOP14
(5.3mm)
ZMD
tube
tube
31020BIF (77 parts / tube)
ZMD tape on reel
31020BIF (2000 parts / reel)
ZMD tube
31020BIF (77 parts / tube)
finished parts in
tape on reel
-40...+125°C** SSOP14
(5.3mm)
finished parts in
tube, “green”
package, lead-free
finished parts in
tube, “green”
package, lead-free
evaluation kit
-40...+125°C** SSOP14
(5.3mm)
ZMD31020BIG1-R
ZMD31020KIT
-40...+125°C** SSOP14
(5.3mm)
ZMD
tape on reel
31020BIF (2000 parts / reel)
box, containing PCBs,
CD-ROM, USB cable
* The quantity ordered should be a multiple of the quantity / packing unit as specified
** Deviant from the regular industrial operation temperature range of –25 to +85°C the ZMD31020 industrial
version is specified for –40 to +125°C.
8. Related Documents
•
•
•
ZMD31020 Datasheet
ZMD31020 Functional Description
ZMD SSC Kits Feature Sheet
For the current revision of this document please go to www.zmd.biz.
Copyright © 2005, ZMD AG, Rev. 1.6, 2005-04-22
20/22
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
The information furnished here by ZMD is believed to be correct and accurate. However, ZMD shall not be liable to any licensee or third
party for any damages, including, but not limited to, personal injury, property damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental, or consequential damages of any kind in connection with or arising out of the furnishing, performance, or use of
this technical data. No obligation or liability to any licensee or third party shall result from ZMD’s rendering of technical or other services.
ZMD AG
ZMD America, Inc.
For further
Grenzstrasse 28
201 Old Country Road, Suite 204
Melville, NY 11747, USA
Phone +01 (631) 549-2666
Fax +01 (631) 549-2882
sales@zmda.com
information:
01109 Dresden, Germany
Phone +49 (351) 8822-306
Fax +49 (351) 8822-337
sales@zmd.de
www.zmd.biz
www.zmd.biz
Copyright © 2005, ZMD AG, Rev. 1.6, 2005-04-22
21/22
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
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