ZMD31020BIF-T_技术文档

ZMD31020

Sensor Signal Conditioner

Datasheet

Features

Brief Description

ZMD31020 is a CMOS integrated circuit for highly-

accurate amplification and sensor-specific correction

of bridge sensor signals. The device provides digital

• Digital compensation of sensor offset, sensitivity,

temperature drift and non-linearity

• Adjustable to nearly all piezo-resistive bridge

sensor types

compensation

of

sensor

offset,

sensitivity,

temperature drift and non-linearity by a 16-bit RISC

micro controller running a correction algorithm.

ZMD31020 accommodates nearly all piezo-resistive

bridge sensor types.

• Digital one-shot calibration: quick and precise

• Selectable temperature compensation reference:

internal or external diode

• Output options: 0...5V analog ratiometric voltage

or 12 bit digital I²C interface

The bi-directional digital I²C interface can be used for

a

simple

PC-controlled

one-shot

calibration

• Product traceability by user-defined EEPROM

entries

procedure, in order to program a set of calibration

coefficients into an on-chip EEPROM. Thus a specific

sensor and a ZMD31020 are mated digitally: fast,

precise and without the cost overhead associated with

trimming by external devices or laser.

ZMD31020 has been designed for industrial and

consumer applications and is specifically suited for

most pressure sensors.

• Operation temperature range, depending on

product version, up to –40...+125°C

• Supply voltage +4.5...+5.5V

• Sampling rate ≥100Hz

• Available in SSOP14 or as die

Benefits

§ Demo kit available (incl. calibration PCB,

SSOP14 samples, software, technical

documentation)

§ Support for industrial calibration available

§ Quick circuit customization possible for large

production volumes

•

No external trimming components required

PC-controlled configuration and calibration via

digital bus interface - simple, low cost

High accuracy ( 0.1% FSO @ -25 to 85°C;

0.25% FSO @ -40 to 125°C)

•

Application Circuit Example

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ZMD31020

Sensor Signal Conditioner

Datasheet

CONTENT

1.

2.

PIN DESCRIPTION......................................................................................................................................3

CIRCUIT DESCRIPTION .............................................................................................................................4

2.1 Signal Flow ....................................................................................................................................................4

2.2 Configuration Word........................................................................................................................................5

2.3

2.4

2.5

Differential Sensor ....................................................................................................................................5

Temperature Sensing ...............................................................................................................................5

Analog Input Channel ...............................................................................................................................6

2.5.1

2.5.2

2.5.3

2.5.4

Bridge Polarity Setting .......................................................................................................................6

Programmable Gain Amplifier PGA...................................................................................................6

Analog-to-digital Converter ADC .......................................................................................................6

Temperature Measurement...............................................................................................................7

2.6

2.7

2.8

2.9

Correction Microcontroller CMC................................................................................................................7

Parameter EEPROM.................................................................................................................................7

Sensor Signal Correction Method and Sequence.....................................................................................8

Digital I²C Interface ...................................................................................................................................8

2.9.1

2.9.2

2.10

Digital Corrected Sensor Signal Output and I/O for Calibration and Device Test.............................8

Data Communication Specifics..........................................................................................................8

The Analog Output Stage....................................................................................................................10

ELECTRICAL SPECIFICATION.................................................................................................................10

Absolute maximum ratings......................................................................................................................10

Operating Conditions ..............................................................................................................................10

Electrical Parameters..............................................................................................................................11

3.

3.1

3.2

3.3

3.3.1

3.3.2

Power Supply...................................................................................................................................11

PGA & 12-bit Input ADC ..................................................................................................................11

Temperature Measurement: Current Sources, on-chip Diode & 12-bit ADC ⁽⁴⁾..............................11

12-bit ADC ⁽¹⁾...................................................................................................................................12

EEPROM programming...................................................................................................................12

Serial I²C Interface...........................................................................................................................12

11-bit Output DAC & Output BUFFER ⁽²⁾.........................................................................................14

Total System....................................................................................................................................14

3.3.3

3.3.4

3.3.5

3.3.6

3.3.7

3.3.8

4.

5.

PACKAGE DIMENSIONS ..........................................................................................................................15

DIE DIMENSIONS AND PAD COORDINATES .........................................................................................16

Die Dimensions.......................................................................................................................................16

Pad Coordinates .....................................................................................................................................17

EVALUATION KIT “ZMD31020KIT” ...........................................................................................................18

ORDERING INFORMATION......................................................................................................................19

RELATED DOCUMENTS...........................................................................................................................19

5.1

5.2

6.

7.

8.

2/19

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ZMD31020

Sensor Signal Conditioner

Datasheet

1. PIN DESCRIPTION

Name

Description

Number

1

VOUT

analog conditioned sensor signal output

2

3

VDDA (*)

VDD

analog device functions positive supply

digital device functions positive supply

digital device functions negative supply

I²C clock input, on-chip pull-up resistor

I²C data input / output, on-chip pull-up resistor

positive EEPROM programming voltage

differential sensor signal negative input

4

VSS

5

SCL

6

SDA

7

VPP

8

VBN

9

VDDB2 (*) positive supply for sensor and temperature sensing diode

VTN input for temperature sensing diode

VDDB1 (*) positive supply for sensor and temperature sensing diode

VBP differential sensor signal positive input

10

11

12

13

14

VSSB (**) sensor negative supply

VSSA (**) analog device functions negative supply

(*)

(**)

VDDA, VDDB1 and VDDB2 tied to common on-chip positive supply rail

VSSA and VSSB tied to common on-chip negative supply rail

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ZMD31020

Sensor Signal Conditioner

Datasheet

2. CIRCUIT DESCRIPTION

2.1 Signal Flow

Block diagram of ZMD31050

PGA

MUX

ADC

CMC

DAC

BAMP

TS

EEPROM

ROM

I²C

programmable gain amplifier

multiplexer

analog-to-digital converter

calibration microcontroller

digital-to-analog converter

buffer amplifier

on-chip temperature sensor (pn-junction)

for calibration parameters and configuration

for correction formula and –algorithm

serial interface: I²C data I/O, clock

The ZMD31020’s signal path is partly analog (blue) and partly digital (red). The differential signal from the

resistive bridge sensor is pre-amplified by the programmable gain amplifier (PGA). There are 3 different

adjustable gains.

The Multiplexer (MUX) transmits the differential signal or the temperature signal to the ADC in a certain

sequence. (The external temperature sensing diode or the internal temperature sensor can be used optionally.)

The ADC converts the differential signal with 12 bits resolution and the temperature signal with 10 bits resolution

into digital values.

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ZMD31020

Sensor Signal Conditioner

Datasheet

The digital signal correction takes place in the calibration micro-controller (CMC). It is based on a special

correction formula located in the ROM and on a set of sensor-specific calibration parameters stored in the

EEPROM. The resulting corrected sensor signal is output via the I²C-interface (with 12 bits resolution) , or, after

conversion by the DAC, as analog voltage (with 11 bits resolution) at the buffer amplifier (BAMP). The

programming of the configuration data and of the calibration parameters into the EEPROM (during the

calibration procedure) is also realized via the I²C interface.

2.2 Configuration Word

Many of the following sections, describing each block of ZMD31020 in detail, will refer to configuration bits, part

of the configuration word stored under address &H09 of the parameter EEPROM. These bits are settings for a

number of on-chip device functions and select specific functional or parametrical behaviour.

The contents of the parameter EEPROM are determined and calculated, written and stored under PC-control

during the calibration procedure. Hence the configuration bits are coded and non-volatile stored once calibration

of a ZMD31020 device / sensor pair has taken place, and will remain unchanged during regular sensing

operation, unless re-calibration is performed

15

-

14

-

13

-

12

-

11

-

10

-

9

-

8

-

7

-

6

CH

5

TS

4

BP

3

G1

2

G0

1

O1 O0

0

Configuration word, stored under address &H09 of the parameter EEPROM

Only 7 bits of the configuration word are relevant settings as follows:

Bit 0, Bit 1

Bit 2, Bit 3

Bit 4

Bit 5

Bit 6

O0, O1: select ADC’s offset compensation

G0, G1: select PGA’s gain

BP: cross-switches differential sensor inputs VBP and VBN

TS: selects on-chip vs. off-chip temperature sensor

CH: enables PGA’s chopper-stabilization

The possible options of these settings are shown in table form in the following paragraphs.

2.3 Differential Sensor

ZMD31020 has been specifically designed for ratiometric differential sensors, e.g. Wheatstone bridge type

sensors. A ratiometric sensor typically generates a differential output signal proportional to the supply voltage

applied to it. The sensor is supplied from VDDB1 or VDDB2 (whichever pin/pad is more favourable layoutwise)

at the + side and tied to VSSB at the – side. The sensor's differential output signal is routed to VBP and VBN.

Sensor and signal conditioner ZMD31020 have the same supply (see block schematic in section 2.1), hence the

differential input voltage seen by ZMD31020 is ratiometric to it’s supply voltage.

2.4 Temperature Sensing

The characteristic of a sensor element tends to change with temperature. To compensate for this, ZMD31020 is

equipped to measure temperature by an external diode or by an on-chip pn-junction. TS – configuration bit 5 –

will select the desired sensor option as follows:

TS

Temperature sensing diode

0

1

off chip

on chip

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ZMD31020

Sensor Signal Conditioner

Datasheet

2.5 Analog Input Channel

ZMD31020’s block schematic in section 2.1 shows the structure of the analog input channel. The signal path for

the sensor signal as well as for temperature is fully differential up to the ADC. The analog multiplexer provides a

cost-effective, sequential conversion by a common ADC. Each signal path can be separated from the source at

it‘s input and can be short-circuit there for offset-cancellation purposes; for more details see the ZMD31020

Functional Description.

2.5.1 Bridge Polarity Setting

The sensor signal path features a cross-switch to reverse the polarity of the bridge sensor signal.

BP – configuration bit 4 – sets the bridge polarity as follows:

BP Differential signal

0

1

V_{BR_P}– V_{BR_N}

V_{BR_N}– V_{BR_P}

2.5.2 Programmable Gain Amplifier PGA

The PGA realizes a coarse sensitivity adaptation of the bridge sensor signal in several amplification steps

(sensitivity fine-tuning takes place later in the CMC). Three different gains can be set by G0 and G1 -

configuration bits 2 and 3 - as follows:

G1 G0

Gain a_IN

0

1

x

0

1

15.66

24

42

The chopper-stabilisation of the PGA reduces the signal noise and is enabled by CH - configuration bit 6:

CH Chopper-stabilisation

0

1

Disabled

Enabled

2.5.3 Analog-to-digital Converter ADC

The ADC is a first order charge balancing analog-to-digital converter in full differential switched capacitor

technology. The amplified bridge sensor signal is converted by the ADC with full 12 bits resolution against a

reference voltage of 0.96 (V_DDA– V_SSA). As both the signal to be measured as well as the reference voltage, it is

measured against, are ratiometric to supply voltage (VDDA - VSSA), the ADC’s conversion result is insensitive

to supply-tolerances and -instabilities. In addition, the ADC realizes a coarse offset compensation (ADC-Range-

Shift RS_ADC) of the bridge sensor signal (offset fine-tuning takes place afterwards in the CMC).

RS_ADCcan be set as follows:

O1 O0

RS_ADC(*)

(*) ADC-Range-Shift, related to the maximum processable sensor

signal span (former name was “CRROB”)

0

1

0

1

0

1

15/16

7/8

3/4

1/2

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ZMD31020

Sensor Signal Conditioner

Datasheet

2.5.4 Temperature Measurement

The temperature sensing diode, selected by TS – configuration bit 5, is biased with a constant current of 40µA.

It‘s forward drop changes with –2.1mV/°K typically, and is passed as differential temperature signal. The 40µA

current source is only on during temperature measurement, to prevent any interference with the bridge sensor

signal's measurement. The differential temperature signal is resolved by the ADC with only 10 bits, against a

differential reference voltage of 0.980V, derived from an on-chip bandgap. Whenever measuring temperature,

the ADC is set to RS_ADC= 15/16.

2.6 Correction Microcontroller CMC

The CMC performs the sensor signal fine-tuning in the digital domain. It is a 16 bit RISC micro-controller, driven

by an on-chip clock generator with a nominal clock frequency of 1.5 MHz. The overall clock frequency tolerance

is smaller than 25%. The CMC includes a 16-bit width ALU and a (16 x 16)-bit RAM. Furthermore it has a 12-

bit input counter into which the ADC will serially transmit conversion results; 4096 clock cycles are needed per

result. The CMC is connected to a (1k x 16)-bit instruction ROM and a (12 x 16)-bit parameter EEPROM. At the

output side the CMC is equipped with an I²C-interface as a digital series output for the corrected sensor signal.

Initially, during calibration, the same interface is used bi-directionally: to write the configuration word into the

EEPROM, to read non-corrected sensor value as well as temperature, and again and finally to write the valid

calibration parameters into the EEPROM.

2.7 Parameter EEPROM

The parameter EEPROM is a non-volatile store for 12 parameter values, each with 16 bits of width.

Address

Parameter

Default content

5234 _Hex

0023 _Hex

2044 _Hex

3022 _Hex

6356 _Hex

1045 _Hex

2073 _Hex

03E8 _Hex

0FA0 _Hex

0040 _Hex

1234 _Hex

5678 _Hex

calibration parameter a0 for sensor's non-linearity correction

0_HEX

1_HEX

2_HEX

3_HEX

4_HEX

5_HEX

6_HEX

7_HEX

8_HEX

9_HEX

A_HEX

B_HEX

calibration parameter a1 for sensor's offset correction

calibration parameter a2 for first order sensor offset drift correction

calibration parameter a3 for second order sensor offset drift correction

calibration parameter a4 for gain correction

calibration parameter a5 for first order gain drift correction

calibration parameter a6 for second order gain drift correction

low-side scale limit value for corrected sensor signal

high-side scale limit value for corrected sensor signal

configuration word

customer-specific identification word

Contents of the parameter EEPROM

The configuration word and it's contents under address &H09 have been described already in chapter 2.5.

The calibration parameters are stored under addresses &H00 through &H06. The calculation of these

parameters is described in the ZMD31020 Functional Description.

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ZMD31020

Sensor Signal Conditioner

Datasheet

Address locations &H07 and &H08 contain a low-side resp. high-side scale limit value for the corrected sensor

signal. Lower resp. -higher corrected signal values are clamped arithmetically to these limits by the CMC. Both

the low and high-side scale limits can be adjusted with a resolution of 12 bits. The 12 bit limit value must be

programmed into the least significant portion of either address. The 4 most significant bit locations of either

address are don't care bits and may be programmed freely.

Address locations &H0A and &H0B are available for customer-specific identification words, e.g. for traceability

purposes.

The contents of EEPROM addresses &H00 through &H09 are loaded into the RAM register block of the CMC

upon power-on. The configuration bits are routed from the configuration register to the various device functions

to be set up, see chapter 6.1.

Erasing and programming of the various EEPROM address locations during calibration requires programming

pulses of about 12V amplitude and about 10ms pulse width (see section 3.3.5). Further programming details are

to find in the ZMD31020 Functional Description.

Since a calibration is typically performed only once in a sensor's lifetime, no overhead chip-area for a charge-

pump has been spent. Thus the programming pulse has to be generated off-chip, and applied at the VPP

pin/pad. During normal operation mode the VPP pin/pad must be left open.

Note: An on-chip switch short-circuits VPP to VDD in normal operation mode; the switch is opened to release

the VPP pin/pad for programming.)

2.8 Sensor Signal Correction Method and Sequence

In normal operation mode (regular sensing operation) the CMC runs a cyclic program which will output a

corrected 12-bit sensor value about every 10ms.

Within this cycle the CMC stages measurement of the ‚raw‘ sensor signal with 12 bits resolution, preceded by

measurement of temperature in 10 bits, and calculates a corrected sensor output value. Calculation is based on

a correction formula to which the 'raw' sensor signal and temperature as measured are applied in first and

second order terms - along with the 7 calibration parameters.

The measurement procedure of the 'raw' sensor signal and of temperature as well as the correction formula are

described in all details in the ZMD31020 Functional description

2.9 Digital I²C Interface

The 2-wire I²C interface encompasses a clock line input SCL and a bi-directional data line SDA.

2.9.1 Digital Corrected Sensor Signal Output and I/O for Calibration and Device Test

During normal operation mode (regular sensing operation) the I²C interface will output the corrected sensor

signal (12 bits) digitally and serially. During calibration the interface is input for the configuration word, output for

the 'raw' non-corrected sensor signal as well as for temperature, and finally again input for the calculated

calibration parameters as well as the scale limit values and possibly customer-specific identifiers. As a third

option, the interface is used to input digital vectors during device test, e.g. to exercise the output DAC, see

section 2.10.

2.9.2 Data Communication Specifics

An I²C bus is controlled by a master device, which generates the clock, controls the bus access, and generates

START and STOP conditions. ZMD31020 is designed to work as a slave - thus it will only respond to requests

from a master device. Obviously a typical master device during regular sensing operation is a connected

electronic controller unit requesting sensor data. (During calibration a connected PC or computer will be the

master. During device test the ATE system will be the master.)

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ZMD31020

Sensor Signal Conditioner

Datasheet

ZMD31020 complies with the following protocol (for data communication timing details see parameter section):

•

Bus not busy: During idle periods both data line (SDA) and clock line (SCL) remain HIGH.

START condition (S): HIGH to LOW transition of SDA line while clock (SCL) is HIGH is interpreted as

START condition. All commands must be preceded by START condition. Master can generate START

condition at any time. More than one command can be transmitted without generation of intermediate STOP

condition.

•

STOP condition (P): LOW to HIGH transition of SDA line while clock (SCL) is HIGH determines STOP

condition. All command sequences must be ended with STOP condition.

Data valid (D): State of data line represents valid data when, after START condition, data line is stable for

duration of HIGH period of clock signal. Data on line must be changed during LOW period of clock signal.

There is one clock pulse per bit of data.

•

Acknowledge (A): Data is transferred in pieces of 8 bits (1 byte) on serial bus, MSB first. After each byte

receiving device – whether master or slave – is obliged to pull data line LOW as acknowledge for reception

of data. Master must generate an extra clock pulse for this purpose. When acknowledge is missed, slave

transmitter becomes inactive. It is on master either to send last command again or to generate STOP

condition in that case.

Slave address: Each device connected to bus has unique slave address. After generating START

condition, master transmits address consisting of 7-bit slave address and R/W - bit. Addressed slave

responds with acknowledge while other slaves on bus become inactive and ignore following data bytes.

R/W – bit determines direction of data transfer. If R/W is “0”, data is transmitted from master to slave (write

operation). If R/W is “1”, (read operation) data is transmitted from slave to master. Slave address of the IC is

hard coded to value 1111000xb.

•

Write operation: When writing to IC, slave address + R/W - bit (F0h) is followed by command byte and –

depending on command – optionally 2 data bytes. Calibration microcontroller reads command byte and

executes specific program for each command. Commands available are described below.

Read operation: When R/W – bit is set to “1” (F1h), IC sends 2 data bytes containing contents of output

register of serial interface. To read specific data, master must send special commands before reading which

instruct calibration microcontroller to place requested data in serial interface output register.

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ZMD31020

Sensor Signal Conditioner

Datasheet

2.10 The Analog Output Stage

ZMD31020‘s analog output stage consists of an 11-bit resistor-string linear DAC, which converts the MSB-

portion of the corrected sensor signal, followed by an output buffer amplifier, designed for full supply voltage

range output swing and generating the output voltage V_OUT

.

V_OUTpresents the actual corrected sensor signal as an analog voltage on a linear voltage scale with 11 bits

resolution. The output voltage is ratiometric to the supply voltage (VDDA – VSSA).

Furthermore it exhibits low- and high-side scale limits; either limit is programmable and clamping to these limit

values is performed digitally by the CMC (see section 2.7 and the ZMD31020 Functional Description).

V_OUTwill change as corrected sensor signal values become available, hence with a refresh rate of about 10ms.

V_OUTcan source/sink a maximum load current of 2mA.

3. ELECTRICAL SPECIFICATION

(all voltages referred to VSSA)

3.1 Absolute maximum ratings

PARAMETER

SYMBOL

VDDA

VDD

CONDITIONS

MIN

-0.3

TYP

MAX

6.5

UNIT

Analog supply voltage

Digital supply voltage

Voltage at all digital I/O

Voltage at all analog I/O

V

to VSS

6.5

V_{D_I/O}

V_DD+0.3

V_DDA+0.3

V_{A_I/O}

Guaranteed

at all pins, HBM

at all pins

-2

2

kV

ESD-immunity

Guaranteed

latch-up immunity

-100

100

mA

Storage temperature

T_STG

-40

150

100

°C

Average storage- and

operation temperature for

15 years time of

operation

3.2 Operating Conditions

PARAMETER

Supply voltage

SYMBOL

CONDITIONS

MIN

TYP

MAX

5.5

UNIT

V

VDDA = VDD

T_AMB

to VSSA = VSS

4.5

-40

1

5

Ambient temperature

Bridge resistance

Capacitance

125

10

°C

R_BR

kΩ

C_VDD(A)

between VDD = VDDA

and VSS = VSSA

100

220

470

nF

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ZMD31020

Sensor Signal Conditioner

Datasheet

3.3 Electrical Parameters

(for T_AMB= -40°C ... +125°C; supply voltage: 4.5V ... 5.5V; all voltages referred to VSSA = VSS)

3.3.1 Power Supply

PARAMETER

Supply current

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNIT

I_DD+ I_DDA

no sensor, no diode

connected;

V_OUTopen

7.7

mA

3.3.2 PGA & 12-bit Input ADC

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNIT

Differential input voltage range options @ Input span V_{IN_SP}= 52 mV/V; a_IN= 15.66

Diff. inp. volt. range 1

Diff. inp. volt. range 2

Diff. inp. volt. range 3

Diff. inp. volt. range 4

Sensitivity

V_{IN_DIFF_1}

V_{IN_DIFF_2}

V_{IN_DIFF_3}

V_{IN_DIFF_4}

S_IN

RS_ADC= 15/16

RS_ADC= 7/8

RS_ADC= 3/4

RS_ADC= 1/2

VDDA = 5V

-3

-6

49

46

39

26

mV/V

-13

-26

mV/V

73

µV/LSB

Differential input voltage range options @ Input span V_{IN_SP}= 36 mV/V; a_IN= 24

Diff. inp. volt. range 1

Diff. inp. volt. range 2

Diff. inp. volt. range 3

Diff. inp. volt. range 4

Sensitivity

V_{IN_DIFF_1}

V_{IN_DIFF_2}

V_{IN_DIFF_3}

V_{IN_DIFF_4}

S_IN

RS_ADC= 15/16

RS_ADC= 7/8

RS_ADC= 3/4

RS_ADC= 1/2

VDDA=5V

-2

-4

34

32

27

18

mV/V

-9

mV/V

-18

mV/V

50

µV/LSB

Differential input voltage range options @ Input span V_{IN_SP}= 20 mV/V; a_IN= 42

Diff. inp. volt. range 1

Diff. inp. volt. range 2

Diff. inp. volt. range 3

Diff. inp. volt. range 4

Sensitivity

V_{IN_DIFF_1}

V_{IN_DIFF_2}

V_{IN_DIFF_3}

V_{IN_DIFF_4}

S_IN

RS_ADC= 15/16

RS_ADC= 7/8

RS_ADC= 3/4

RS_ADC= 1/2

VDDA=5V

-1

-2

19

18

15

10

mV/V

-5

mV/V

-10

mV/V

29

µV/LSB

Diff. input offset current

I_{IN_OFF}

-10

10

nA

Note, that the parameter “RS_ADC” is equal to the former “CRROB”.

3.3.3 Temperature Measurement: Current Sources, on-chip Diode & 12-bit ADC ⁽⁴⁾

PARAMETER

Current source

SYMBOL

I_TS

CONDITIONS

pin / pad VTN

MIN

20

TYP

MAX

55

UNIT

µA

40

TC current source ⁽¹⁾

Input voltage range

TC forward drop

Sensitivity

TC_{I_TS}

V_TN

pin / pad VTN

-2000

-810

-1.9

2000

-200

-2.3

1.1

ppm/K

mV

rel. to V_DDB1= V_DDB2

on-chip temp. sensor

pin / pad VTN

TC_DROP

S_T

-2.1

mV/K

mV/ LSB

0.84

0.97

11/19

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ZMD31020

Sensor Signal Conditioner

Datasheet

3.3.4 12-bit ADC ⁽¹⁾

PARAMETER

SYMBOL

CONDITIONS

12-Bit sensor signal conversion

-0.5

10-Bit temperature signal conversion

MIN

TYP

MAX

UNIT

ADC diff. non-lin.

ADC integr. non-lin.

DNL_p

INL_p

0.5

LSB

to best-fit straight line

ADC diff. non-lin.

DNL_T

INL_T

-0.5

-0.8

0.5

0.8

LSB

ADC integr. non-lin.

to best-fit straight line

3.3.5 EEPROM programming

t_{VPP_R}

t_{VPP_H}

t_{VPP_F}

PARAMETER

SYM.

MIN. TYP. MAX.

11.75 12.25 12.75

VDD

VPP_H

Prog. voltage HIGH level

VPP_H

VPP_L

V

Prog. voltage LOW level

(conn. to VDD on chip)

VPP_L

Prog. cycle duration

Rise time V_PP

t_VPP

9

ms

t_VPP

t_{VPP_R}

t_{VPP_F}

t_{VPP_H}

0.5

8

1

2

Fall time V_PP

Prog. pulse duration

Number of write/read cycles

Programming temperature

100

T_PP

-40

+85 °C

3.3.6 Serial I²C Interface

PARAMETER

Input high level

SYMBOL

V_{I2C_IN_H}

CONDITIONS

MIN

0.9

0

TYP

MAX

UNIT

V_DD

ꢀ

1

Input low level

V_{I2C_IN_L}

V_{I2C_OUT_L}

R_{I2C_SCL/SDA}

0.1

Output low level

Pull-up-resistance (at

SCL and SDA)

Pull up current

470

5

I_{I2C_OUT_H}

C_SDA

pins SCL and SDA

20

µA

pF

Load capacitance SDA

400

12/19

written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.

ZMD31020

Sensor Signal Conditioner

Datasheet

Timing Characteristics of the serial Interface

t_{I2C_F}

t_{I2C_SU_DAT}

t_{I2C_HD_DAT}

t_{I2C_SU_STA}t_{I2C_HD_STA}t_{I2C_R}

t_{I2C_H}t_{I2C_L}

t_{I2C_HD_STA}

t_{I2C_SU_STO}t_{I2C_BF}

PARAMETER

SYMBOL

f_SCL

CONDITIONS

MIN

-

TYP

MAX

UNIT

kHz

µs

SCL clock frequency

100

Bus free time betw. STOP

and START condition

t_{I2C_BF}

4.7

Hold Time (repeated)

START cond.

t_{I2C_HD_STA}to first clock pulse

4.0

µs

LOW period of SCL

HIGH period of SCL

t_{I2C_L}

t_{I2C_H}

4.7

4.0

4.7

µs

Setup time (repeated)

START cond.

t_{I2C_SU_STA}

Data hold time

Data setup time

t_{I2C_HD_DAT}

t_{I2C_SU_DAT}

t_{I2C_R}

0

250

-

ns

Rise time of both SDA and

SCL

300

Fall time of both SDA and

SCL

t_{I2C_F}

-

300

ns

µs

ns

Setup time for STOP

condition

t_{I2C_SU_STO}

4

Input filter spike

suppression / noise

interception

t_{I2C_NI}

spikes on SDA or

SCL of that length

are suppressed

50

13/19

written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.

ZMD31020

Sensor Signal Conditioner

Datasheet

3.3.7 11-bit Output DAC & Output BUFFER ⁽²⁾

PARAMETER

Output current

Analog output offset voltage

SYMBOL

I_OUT

CONDITIONS

MIN

2

TYP

MAX

UNIT

mA

current source & sink

V_{OUT_OFF}

-10

-1

10

1

mV

Temp.-coeff output offset voltage TC_{OUT_OFF}

µV/K

LSB

V_DDA

DAC differential nonlinearity

DAC integral nonlinearity

Maximal output voltage

Minimal output voltage

V_OUTlow scale limit

DNL_OUT

INL_OUT

to best-fit straight line

I_OUTSOURCE= 2mA

I_OUTSINK= -2mA

dig. ref.: p_min

-4

4

V_{OUT_MAX}

V_{OUT_MIN}

V_{OUT_LSL}

V_{OUT_HSL}

R_{L_OUT}

0.975

0.025

0.25

1

0

V_OUTlow scale limit

dig. ref.: p_max

0.75

2.5

10

Load resistance

kΩ

Load capacitance

C_{L_OUT}

25

nF

3.3.8 Total System

PARAMETER

Startup time

SYMBOL

CONDITIONS

power up to 1st result

MIN

TYP

MAX

UNIT

t_STA

t_RESP

t_CYC

NL

40

11

ms

Response time

Conversion cycle time

Non-linearity

10

ms

to best-fit straight line

-2500

+2500

20

ppm ⁽³⁾

ppm/K

TC sensor signal

TC temperature

TC_p

TC_T

100

Notes for the electrical parameters:

1)

2)

No measurement in mass production, parameter is guarantied by design.

During normal operation mode using the analog output the I²C interface allows to read out the output

digital value in parallel (= the digital input of the DAC).

3)

4)

Analog Signal Conditioning and Analog Digital Conversion for Measurement of the Pressure Sensor

Bridge

The A/D conversion of the temperature signal is done with 10 bit resolution only.

14/19

written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.

ZMD31020

Sensor Signal Conditioner

Datasheet

4. PACKAGE DIMENSIONS

SSOP14 (209mil = 5.3mm)

weight: ≤ 0.3g

package body material: low stress epoxy

lead material:

lead finish:

lead form:

FeNi-Alloy or Cu-Alloy

solder plating

Z-bends

Dimensions of Sub-Group C1

A_min

1.73

0.05

A_1min

A_1max

A_2min

A_2max

c_min

0.21

1.68

1.78

0.09

0.20

6.07

6.33

5.20

5.38

0.25

Dimensions of Sub-Group B1

c_max

A_max

1.99

0.25

0.38

0.65

7.65

7.90

0.63

1.22

D_min

*

Bp_min

bp_max

e_nom

D_max

*

E_min

E_max

k_min

*

H_Emin

H_Emax

Lp_min

Z_max

θ_min

0°

θ_max

10°

* without mold-flesh

All dimensions in mm, reference: DIN EN 190000

15/19

written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.

ZMD31020

Sensor Signal Conditioner

Datasheet

5. DIE DIMENSIONS AND PAD COORDINATES

5.1 Die Dimensions

•

Die size (incl. scribeline): 3500µm x 3000µm = 10.5sqmm

Core die size (without scribeline): 3310µm x 2810µm ≈ 9.3sqmm

Die thickness: 390µm

Scribeline (distance between two core dice on wafer): 190µm

Pads size: 90µm x 90µm

14

13

12

11

10

9

8

2810µm

Core Die

with Pads

ZMD31020

y

0

x

1

2

3

4

5

6

7

725µm

3310µm

16/19

written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.

ZMD31020

Sensor Signal Conditioner

Datasheet

5.2 Pad Coordinates

All pad coordinates refer to the pad centers and related to the left bottom corner of pad 1.

PIN Name

Pad coordinates µm

PIN-No.

X

Y

1

VOUT

VDDA

VDD

45

45.00

2

380.2

45.00

3

1403.30

1627.40

1868.8

2143.8

2385.3

2353.4

2091.6

1829.5

1426.7

864.1

45.00

4

VSS

45.00

5

SCL

45.00

6

SDA

45.00

7

VPP

45.00

8

VBN

2763.00

9

VDDB2

VTN

10

11

12

13

14

VDDB1

VBP

VSSB

VSSA

478

48.1

17/19

written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.

ZMD31020

Sensor Signal Conditioner

Datasheet

6. EVALUATION KIT “ZMD31020KIT”

An evaluation kit is offered, see the illustration below. The Kit provides easy evaluation and experimental

calibration of a sensor element / ZMD31020 combination. It contains a modular calibration board, a CD-ROM

(calibration program, USB port driver, technical documentation), an USB cable and some finished samples in

SSOP14 package. The evaluation kit is described in detail in its technical documentation.

Fig. 3: Evaluation Kit „ZMD31020KIT“ (Hardware)

Important Note:

The Evaluation Kit is not intended to be used for industrial sensor calibration in serial production. If components

of the Evaluation Kit are used for this purpose then an EEPROM programming pulse like specified in section

3.3.5 has to be assured. Otherwise the EEPROM data preservation may be affected.

For industrial sensor calibration ZMD and its partners offer a comprehensive support for the development of the

required hard- and software. Please contact the ZMD sales offices for detailed information.

18/19

written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.

ZMD31020

Sensor Signal Conditioner

Datasheet

7. ORDERING INFORMATION

Ordering Code

Description

Operation Temp.

Package

Marking

Shipping Form *

ZMD31020BCB

dice on tested

unsawn wafer

dice on tested

sawn wafer

dice

0...+70°C

die

6” wafer

ZMD31020BCC

ZMD31020BCD

0...+70°C

die

plastic frame

waffle tray

(100 dice / tray)

in waffle tray

ZMD31020BCF-T

ZMD31020BCF-R

ZMD31020BIB

ZMD31020BIC

ZMD31020BID

finished parts in

tube

0...+70°C

SSOP14

(5.3mm)

SSOP14

(5.3mm)

die

ZMD

tube

31020BCF (77 parts / tube)

ZMD tape on reel

31020BCF (2000 parts / reel)

6” wafer

finished parts in

tape on reel

dice on tested

unsawn wafer

dice on tested

sawn wafer

dice

0...+70°C

-40...+125°C*

die

plastic frame

waffle tray

(100 dice / tray)

in waffle tray

ZMD31020BIF-T

ZMD31020BIF-R

ZMD31020KIT

finished parts in

tube

-40...+125°C*

SSOP14

(5.3mm)

SSOP14

(5.3mm)

ZMD

31020BIF (77 parts / tube)

ZMD tape on reel

31020BIF (2000 parts / reel)

box, containing PCB,

CD, USB cable and

tube

finished parts in

tape on reel

evaluation kit

SSOP14 samples

Deviant from the regular industrial operation temperature range of –25 to +85°C the ZMD31020 industrial version is specified for –40 to

+125°C.

* The quantity ordered should be a multiple of the quantity / packing unit as specified

8. RELATED DOCUMENTS

•

ZMD31020 Software description

ZMD31020 Functional description

ZMD31020 Response time (application note)

The information furnished here by ZMD is believed to be correct and accurate. However, ZMD shall not be liable to any licensee or third

party for any damages, including, but not limited to, personal injury, property damage, loss of profits, loss of use, interruption of business or

indirect, special, incidental, or consequential damages of any kind in connection with or arising out of the furnishing, performance, or use of

this technical data. No obligation or liability to any licensee or third party shall result from ZMD’s rendering of technical or other services.

ZMD AG

Grenzstrasse 28

01109 Dresden, Germany

Phone +49 (351) 8822-306

Fax +49 (351) 8822-337

sales@zmd.de

ZMD America, Inc.

For further

information:

201 Old Country Road, Suite 204

Melville, NY 11747, USA

Phone +01 (631) 549-2666

Fax +01 (631) 549-2882

sales@zmda.com

15373 Innovation Drive, Suite 110

San Diego, CA 92128, USA

Phone +01 (858) 674-8070

Fax +01 (858) 674-8071

sales@zmda.com

www.zmd.biz

19/19

written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.


型号：	ZMD31020BIF-T
厂家：	Zentrum Mikroelektronik Dresden AG
描述：	Sensor Signal Conditioner 传感器信号调理器传感器光电二极管
文件：	总19页 (文件大小：997K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ZMD31020BIF-T [ZMD]

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