I583-5Q8-26.000 [ILSI]

2.0 mm x 2.5 mm Ceramic Package SMD TCXO; 2.0毫米X 2.5毫米陶瓷封装SMD TCXO


型号：	I583-5Q8-26.000
厂家：	ILSI
描述：	2.0 mm x 2.5 mm Ceramic Package SMD TCXO 2.0毫米X 2.5毫米陶瓷封装SMD TCXO 石英晶振温度补偿晶振
文件：	总2页 (文件大小：53K)
中文：	中文翻译
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2.0 mm x 2.5 mm Ceramic Package SMD TCXO

I583/I783 Series

Product Features:

Low Current Consumption

Ultra Miniature Package

RoHS Compliant

Applications:

2.50+/- 0.2

Server & Storage

CDMA/WCDMA

802.11 / Wifi

2.0+/-0.2

Compatible with Leadfree Processing

T1/E1, T3/E3

Frequency

(Contact Sales Channel for other available frequencies)

0.8 V p-p Min.

Output Level

Clipped Sinewave

1.1 Max.

0.6

Output Load

Clipped Sinewave

0.10

10K Ohms / 10 pF

Frequency Stability

Vs Temperature

Vs Voltage

See Frequency Stability Table

 0.2 ppm Max.

.0.2 ppm Max.

Vs Load(5%)

0.5

0.10

2 .0 ppm (After 2^ndReflow)

Frequency Tolerance @ 25 C

Recommended Pad Layout

Aging

 1 ppm / Year Max.

2.80

Supply Voltage

See Supply Voltage Table , tolerance  5%

0.6

Current

2.0 mA Max.

2.3

Voltage Control (I783)

Operating

1.5 VDC  1.0 VDC,  5.0 ppm Min. (Custom Available)

1.4

No pattern area

See Operating Temperature Table

Pin Connection

Vcontrol / N.C.

GND

Output

Storage

-40 C to +85 C

-8.0 dBc Max.

Vcc

Harmonics

Phase Noise

Dimension Units: mm

-130 dBc/Hz @ 1KHz

Part Number Guide

Sample Part Number: I583-5P8-26.000 Mhz

Package

Operating Temperature

7 = 0 C to +50 C

FrequencyStability vs Temperature

P = 2.0 ppm

Supply Voltage

3 = 3.3 V

Frequency

7 = 3.0 V

1 = 0 C to +70 C

Q = 2.5 ppm

I583 (Clipped Sinewave TCXO)

I783 (Clipped Sinewave TCVCXO)

8 = 2.8 V

3 = -20 C to +70 C

5 = -30 C to +85 C

R = 3.0 ppm

- 26.000 MHz

2 = 2.7 V

J = 5.0 ppm

1 = 1.8 V

NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.

** Not available for all temperature ranges.

ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com

11/07/12_B

Specifications subject to change without notice

Page 1

2.0 mm x 2.5 mm Ceramic Package SMD TCXO

I583/I783 Series

Pb Free Solder Reflow Profile:

Typical Application:

*Units are backward compatible with 240C reflow processes

Package Information:

MSL = N.A. (package does not contain plastic, storage life is

unlimited under normal room conditions).

Termination = e4 (Au over Ni over W base metalization).

Tape and Reel Information:

Quantity per

3000

Reel

8 +/-.3

4 +/-.2

3.5 +/-.2

9 +/-1 or 12 +/-3

60 / 80

180

Environmental Specifications

Thermal Shock

MIL-STD-883, Method 1011, Condition A

MIL-STD-883, Method 1004

MIL-STD-883, Method 2002, Condition B

MIL-STD-883, Method 2007, Condition A

J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)

Pb-Free / RoHS / Green Compliant

JESD22-B102-D Method 2 (Preconditioning E)

MIL-STD-883, Method 2004, Test Condition D

MIL-STD-883, Method 1014, Condition C

Moisture Resistance

Mechanical Shock

Mechanical Vibration

Resistance to Soldering Heat

Hazardous Substance

Solderability

Terminal Strength

Gross Leak

Fine Leak

Solvent Resistance

MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s

MIL-STD-202, Method 215

Marking

Line 1: XXXX(Freq.Code,Production Code,Year, Month,Date) (Example=“GB17L”)

Line 2: XXXXX (Crystal Code)

ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com

11/07/12_B

Specifications subject to change without notice

Page 2

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