ILCX03-BF2318-20.000 [ILSI]
2 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm; 2垫陶瓷封装石英晶体,3.2 x 5毫米型号: | ILCX03-BF2318-20.000 |
厂家: | ILSI |
描述: | 2 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm |
文件: | 总2页 (文件大小:58K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
2 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm
ILCX03 Series
Product Features:
Low Cost SMD Package
Low ESR
Applications:
5.0
Fibre Channel
Server & Storage
Sonet /SDH
Compatible with Leadfree Processing
3.2
802.11 / Wifi
T1/E1, T3/E3
Frequency
10 MHz to 100 MHz
1.3 Max.
1.3
ESR (Equivalent Series Resistance)
10.0 MHz – 13.9 MHz
14.0 MHz – 19.9 MHz
20.0 MHz – 39.9 MHz
40.0 MHz – 66.0 MHz
30.0 MHz – 100.0 MHz (3rd O.T.)
100 Ω Max.
80 Ω Max.
60 Ω Max.
40 Ω Max.
100 Ω Max.
2.00
Shunt Capacitance (C0)
7 pF Max.
Connection Diagram
±30 ppm Standard (see Part Number Guide for more
options)
Frequency Tolerance @ 25° C
Frequency Stability over
Temperature
±50 ppm Standard (see Part Number Guide for more
options)
Crystal Cut
AT Cut
Load Capacitance
Drive Level
18 pF Standard (see Part Number Guide for more options)
500 uW Max.
Recommended pad layout
1.5
Aging
±5 ppm Max. / Year Standard
Temperature
Operating
2.4
0° C to +70° C Standard (see Part Number Guide for more
options)
3.5
Storage
-40° C to +85° C Standard
Dimension Units: mm
Part Number Guide
Sample Part Number:
ILCX03 - FB1F18 - 20.000
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
Operating
Mode
(overtone)
Load Capacitance
(pF)
Frequency
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
F = Fundamental
3 = 3rd overtone
F = ±30 ppm
G = ±25 ppm
18 pF Standard.
Or Specify
ILCX03 -
- 20.000 MHz
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm*
J = ±10 ppm**
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
02/09
Specifications subject to change without notice
Page 1
2 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm
ILCX03 Series
Pb Free Solder Reflow Profile:
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
1000
Reel
A
B
12 +/-.3
8 +/-.2
C
5.5 +/-.2
13.5 +/-1 or
12 +/-3
D
E
F
60 / 80
180 / 250
Environmental Specifications
Thermal Shock
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Date Code (yww)
Line 2: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
02/09
Specifications subject to change without notice
Page 2
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