2ED2109S06F [INFINEON]
650 V half bridge gate driver with integrated bootstrap diode;型号: | 2ED2109S06F |
厂家: | Infineon |
描述: | 650 V half bridge gate driver with integrated bootstrap diode |
文件: | 总25页 (文件大小:1709K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
2ED2108 (4) S06F (J)
2ED2108 (4) S06F (J)
650 V half bridge gate driver with integrated bootstrap diode
Features
Product summary
•
•
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•
•
•
•
•
•
•
•
•
•
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Unique Infineon Thin-Film-Silicon On Insulator (SOI)-technology
Negative VS transient immunity of 100 V
VS_OFFSET = 650 V max.
Io+pk / Io-pk (typ.) = + 0.29 A/ - 0.7 A
VCC = 10 V to 20 V
Delay Matching = 35 ns max.
Internal deadtime = 540 ns typ.
tON / tOFF (typ.) = 200 ns/ 200 ns
Floating channel designed for bootstrap operation
Operating voltages (VS node) upto + 650 V
Maximum bootstrap voltage (VB node) of + 675 V
Integrated ultra-fast, low resistance bootstrap diode
Logic operational up to –11 V on VS Pin
Negative voltage tolerance on inputs of –5 V
Independent under voltage lockout for both channels
Schmitt trigger inputs with hysteresis
3.3 V, 5 V and 15 V input logic compatible
Maximum supply voltage of 25 V
Dual package options of DSO-8 and DSO-14
High and low voltage pins separated for maximum creepage and
clearance (2ED21084S06J version)
Packages
•
•
Separate logic and power ground with the 2ED21084S06J version
Internal 540 ns dead time and programmable up to 5 us with
external resistor (2ED21084S06J only)
DSO-14
DSO-8
•
RoHS compliant
Potential applications
Driving IGBTs, enhancement mode N-Channel MOSFETs in various power electronic applications.
Typical Infineon recommendations are as below:
•
•
•
•
Motor drives, general purpose inverters having TRENCHSTOP™ IGBT6 or 600 V EasyPACK™ modules or its
equivalent power stages
Refrigeration compressors, induction cookers, other major home appliances having RCD series IGBTs or
TRENCHSTOP™ family IGBTs or their equivalent power stages
Battery operated small home appliances such as power tools, vaccum cleaners using low voltage OptiMOS™
MOSFETs or their equivalent power stages
Totem pole, half-bridge and full-bridge converters in offline AC-DC power supplies for industrial SMPS having
high voltage CoolMOS™ super junction MOSFETs or TRENCHSTOP™ H3 and WR5 IGBT series or their equivalent
High power LED and HID lighting having CoolMOS™ super junction MOSFETs
Electric vehicle (EV) charging stations and battery management systems
Driving 650 V SiC MOSFETs in above applications
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Product validation
Qualified for industrial applications according to the relevant tests of JEDEC47/20/22
Ordering information
Standard pack
Base part number Package type
Orderable part number
Form
Quantity
2500
2ED2108S06F
2ED21084S06J
DSO - 8
DSO - 14
Tape and Reel
Tape and Reel
2ED2108S06FXUMA1
2ED21084S06JXUMA1
2500
Datasheet
www.infineon.com/soi
Please read the Important Notice and Warnings at the end of this document
Page 1 of 25
V 2.22
2020-07-02
2ED2108 (4) S06F (J)
650 V half bridge gate driver with integrated bootstrap diode
Description
The 2ED2108 (4) S06F (J) is a high voltage, high speed power MOSFET and IGBT driver with dependent high and
low side referenced output channels. Based on Infineon’s SOI-technology there is an excellent ruggedness and
noise immunity with capability to maintain operational logic at negative voltages of up to - 11 V on VS pin (VCC
=
15 V) on transient voltages. There are not any parasitic thyristor structures present in the device, hence no
parasitic latch up may occur at all temperature and voltage conditions. The logic input is compatible with
standard CMOS or LSTTL output, down to 3.3 V logic. The output drivers feature a high pulse current buffer stage
designed for minimum driver cross-conduction. The floating channel can be used to drive an N-channel power
MOSFET, SiC MOSFET or IGBT in the high side configuration, which operate up to 650 V.
Up to 650V
Integrated
RBS DBS
Integrated
RBS DBS
Up to 650V
VCC
HIN
LIN
14
1
2
3
4
5
6
7
VCC
HIN
1
2
3
4
8
7
6
5
VCC
HIN
LIN
VCC
VB
HO
VS
LO
VB
HO
13
12
LIN
DT
HIN
LIN
TO LOAD
RDT
VS 11
TO LOAD
10
9
VSS
VSS
COM
LO
COM
8
2ED2108S06F
2ED21084S06J
* Bootstrap diode is monolithically integrated
* Please refer to our application notes and design tips for proper circuit board layout.
Figure 1
Typical application block diagram
Summary of feature comparison of the 2ED210x family:
Table 1
Cross
Input
logic
conduction
prevention
logic
Part No.
Deadtime
Ground pins tON / tOFF Package
2ED2106S06F
2ED21064S06J
2ED2108S06F
COM
DSO - 8
DSO - 14
DSO - 8
HIN, LIN
No
None
VSS / COM
COM
200 ns /
200 ns
Internal 540 ns
Yes
HIN, LIN
Programmable
540 ns - 5000 ns
2ED21084S06J
2ED2109S06F
2ED21094S06J
VSS / COM
COM
DSO - 14
DSO - 8
Internal 540 ns
IN, SD
Yes
Programmable
540 ns - 5000 ns
VSS / COM
740 ns / DSO - 14
200 ns
Programmable
540 ns - 2700 ns
2ED21091S06F IN, DT/SD Yes
COM
DSO – 8
Datasheet
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2ED2108(4)S06F(J)
650 V half bridge gate driver with integrated bootstrap diode
1
Table of contents
Features
Product summary ........................................................................................................................1
Potential applications .................................................................................................................................................1
Product validation .......................................................................................................................................................1
Ordering information...................................................................................................................................................1
Description…… ...........................................................................................................................................................2
Summary of feature comparison of the 2ED210x family:...........................................................................................2
1
2
Table of contents ................................................................................................................... 3
Block diagram........................................................................................................................ 4
3
3.1
3.2
Pin configuration and functionality.......................................................................................... 5
Pin configuration.....................................................................................................................................5
Pin functionality ......................................................................................................................................5
4
Electrical parameters ............................................................................................................. 6
Absolute maximum ratings.....................................................................................................................6
Recommended operating conditions.....................................................................................................6
Static electrical characteristics...............................................................................................................7
Dynamic electrical characteristics..........................................................................................................8
4.1
4.2
4.3
4.4
5
Application information and additional details.......................................................................... 9
IGBT / MOSFET gate drive .......................................................................................................................9
Switching and timing relationships........................................................................................................9
Deadtime ...............................................................................................................................................10
Matched propagation delays ................................................................................................................11
Input logic compatibility.......................................................................................................................12
Undervoltage lockout ...........................................................................................................................12
Bootstrap diode.....................................................................................................................................13
Calculating the bootstrap capacitance CBS ..........................................................................................13
Tolerant to negative tranisents on input pins......................................................................................15
Negative voltage transient tolerance of VS pin....................................................................................15
NTSOA – Negative Transient Safe Operating Area...............................................................................16
Higher headroom for input to output signal transmission with logic operation upto -11 V..............17
Maximum switching frequency.............................................................................................................18
PCB layout tips ......................................................................................................................................19
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
6
7
8
9
Qualification information.......................................................................................................20
Related products...................................................................................................................20
Package details.....................................................................................................................21
Part marking information ......................................................................................................22
10
10.1
Additional documentation and resources.................................................................................23
Infineon online forum resources ..........................................................................................................23
11
Revision history ....................................................................................................................24
Datasheet
www.infineon.com/soi
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2ED2108 (4) S06F (J)
650 V half bridge gate driver with integrated bootstrap diode
2
Block diagram
8
VB
UV
DETECT
R
R
S
7
6
HO
VS
Q
Pulse
Filter
2ED2108S06F
VSS/COM
2
HIN
LEVEL
SHIFT
Pulse
Generator
BS diode
1
VCC
DT
Deadtime
UV
DETECT
+5V
VSS/COM
LEVEL
SHIFT
5
4
LO
Delay
Match
3
LIN
COM
13
VB
UV
DETECT
R
R
S
2ED21084S06J
12
11
HO
VS
Q
Pulse
Filter
VSS/COM
LEVEL
SHIFT
2
4
HIN
DT
Pulse
Generator
BS diode
1
VCC
DT
Deadtime
UV
DETECT
+5V
VSS/COM
LEVEL
SHIFT
7
6
LO
Delay
Match
3
5
LIN
COM
VSS
Figure 2
Block diagrams
Datasheet
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2ED2108 (4) S06F (J)
650 V half bridge gate driver with integrated bootstrap diode
3
Pin configuration and functionality
3.1
Pin configuration
14
1
2
3
4
5
6
7
VCC
HIN
LIN
VB
HO
VS
13
12
11
10
8
VB
HO
VS
LO
1
2
3
4
VCC
HIN
7
6
5
DT
LIN
VSS
COM
COM
9
8
LO
8 - Lead DSO - 8 (150 mil)
2ED2108S06F
14 - Lead DSO - 14 (150 mil)
2ED21084S06J
Figure 3
2ED2108 (4) S06 F(J) pin assignments (top view)
3.2
Pin functionality
Table 2
Symbol
Description
VCC
Low-side and logic supply voltage
Logic input for high-side gate driver output (HO), in phase. Schmitt trigger inputs
with hysteresis and pull down
HIN
Logic input for low-side gate driver output (LO), out of phase. Schmitt trigger
inputs with hysteresis and pull up
/LIN
DT
VSS
COM
LO
Programmable dead time pin, referenced to Vss (2ED21084S06J only)
Logic ground ( 2ED21084S06J only)
Low-side gate drive return
Low-side driver output
VS
High voltage floating supply return
High-side driver output
HO
VB
High-side gate drive floating supply
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2ED2108 (4) S06F (J)
650 V half bridge gate driver with integrated bootstrap diode
4
Electrical parameters
4.1
Absolute maximum ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM unless otherwise stated in the table. The thermal resistance
and power dissipation ratings are measured under board mounted and still air conditions.
Table 3
Absolute maximum ratings
Definition
High-side floating well supply voltage Note 1
High-side floating well supply return voltage
Floating gate drive output voltage
Floating gate drive voltage supply voltage
Low side supply voltage
Symbol
VB
Min.
VCC – 5
Max.
675
Units
VS
VHO
VBS
VCC – VBS – 5
650
VS – 0.5
VB + 0.5
25
-1
VCC
-1
25
V
VLO
VIN
DT
VSS
Low-side output voltage
Logic input voltage
Programmable dead time pin voltage (2ED21084S06J only)
Logic ground (2ED21084S06J only)
- 0.5
- 5/ (VSS – 5)
VSS - 0.5
VCC – 25
—
VCC + 0.5
VCC + 0.5
VCC + 0.5
VCC + 0.5
50
dVS/dt Allowable VS offset supply transient relative to COM
V/ns
W
—
—
—
—
—
- 55
—
0.625
1
200
120
150
8 - Lead DSO - 8
14 - Lead DSO -14
8 - Lead DSO - 8
14 - Lead DSO -14
PD
Package power dissipation @ TA ≤+25ºC
RthJA
Thermal resistance, junction to ambient
ºC/W
ºC
TJ
TS
TL
Junction temperature
Storage temperature
Lead temperature (soldering, 10 seconds)
150
300
Note 1:
activated bootstrap diode.
In case VCC > VB there is an additional power dissipation in the internal bootstrap diode between pins VCC and VB in case of
4.2
Recommended operating conditions
For proper operation, the device should be used within the recommended conditions. All voltage parameters
are absolute voltages referenced to COM unless otherwise stated in the table. The offset rating is tested with
supplies of (VCC – COM) = (VB – VS) = 15 V.
Table 4
Recommended operating conditions
Symbol
VB
Definition
Bootstrap voltage
High-side floating well supply voltage
Min
VS + 10
10
Max
VS + 20
20
Units
VBS
VS
VHO
VCC
VLO
VIN
DT
VSS
TA
High-side floating well supply offset voltage Note 2
Floating gate drive output voltage
Low-side supply voltage
Low-side output voltage
Logic input voltage
Programmable dead time pin voltage (2ED21084S06J only)
Logic ground (2ED21084S06J only) with respect to COM
Ambient temperature
VCC – VBS – 1
650
VB
20
VS
10
COM
V
VCC
- 4 / (VSS – 4) 5 / (VSS + 5)
VSS
- 5
- 40
+ 5
+ 5
125
ºC
Note 2: Logic operation for VS of – 11 V to +650 V.
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2ED2108 (4) S06F (J)
650 V half bridge gate driver with integrated bootstrap diode
4.3
Static electrical characteristics
(VCC – COM) = (VB – VS) = 15 V, VSS = COM and TA = 25 °C unless otherwise specified. The VIL, VIH and IIN parameters are
referenced to Vss / COM and are applicable to the respective input leads: HIN and /LIN. The VO and IO parameters
are referenced to VS / COM and are applicable to the respective output leads HO or LO. The VCCUV parameters are
referenced to COM. The VBSUV parameters are referenced to VS.
Table 5
Symbol
Static electrical characteristics
Definition
VBS supply undervoltage positive going
threshold
Min.
Typ.
Max.
Units Test Conditions
VBSUV
7.6
8.2
8.9
+
VBS supply undervoltage negative going
threshold
VBS supply undervoltage hysteresis
VCC supply undervoltage positive going
threshold
VBSUV
6.7
—
7.2
1.0
9.1
8.1
—
-
V
VBSUVHY
VCCUV
8.4
9.8
+
VCC supply undervoltage negative going
threshold
VCCUV
7.5
8.2
8.9
-
VCCUVHY
ILK
IQBS
VCC supply undervoltage hysteresis
High-side floating well offset supply leakage
Quiescent VBS supply current
—
—
—
0.9
1
170
—
12.5
—
VB = VS = 650 V
VIN = 0 V or 5 V
VIN = 0 V or 5 V
(2ED2108S06F)
VIN = 0 V or 5 V
uA
—
—
450
750
—
—
IQCC
Quiescent VCC supply current
(2ED21084S06J)
VOH High level output voltage drop, Vcc - VLO , VB - VHO
VOL Low level output voltage drop, VO
—
—
180
—
450
—
1.7
0.7
1.7
0.7
0.05
0.02
230
290
650
700
2.1
0.9
2.1
0.9
0.2
0.1
—
—
—
V
IO = 2 mA
Io+mean Mean output current from 3 V to 6 V
CL = 22 nF
VO = 0 V
CL = 22 nF
VO = 15 V
Io+
Peak output current turn-on1
mA
Io-mean Mean output current from 12 V to 9 V
Io-
VIH
Peak output current turn-off1
Logic “1” input voltage
—
2.4
1.1
2.4
1.1
VIL
Logic “0” input voltage
V
Vcc = 10 V to 20 V
VSD,TH+
VSD,TH-
/SD input positive going threshold
/SD input negative going threshold
HIN = 5 V,
/LIN = 0 V
HIN = 0 V,
/LIN = 5 V
IIN+ Input bias current (Output = High)
—
—
—
25
—
1
50
10
µA
V
IIN-
Input bias current (Output = Low)
Bootstrap diode forward voltage between Vcc
and VB
Bootstrap diode forward current between Vcc
and VB
VFBSD
IFBSD
1.2
IF = 0.3 mA
45
20
—
85
30
125
45
mA
Ω
VCC - VB = 4 V
VF1 = 4 V,VF2 = 5 V
Vcc = 15 V
RBSD Bootstrap diode resistance
Allowable Negative VS pin voltage for IN Signal
propagation to HO
VS
-11
-10
V
1 Not subjected to production test, verified by characterization.
Datasheet
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2ED2108 (4) S06F (J)
650 V half bridge gate driver with integrated bootstrap diode
4.4
Dynamic electrical characteristics
VCC = VBS = 15 V, VSS = COM, TA = 25 oC and CL = 1000 pF unless otherwise specified.
Table 6 Dynamic electrical characteristics
Symbol Definition
Min.
Typ.
200
200
100
35
—
540
5
Max. Units Test Conditions
300
tON Turn-on propagation delay
tOFF Turn-off propagation delay
—
—
—
—
—
350
4
300
VIN = 0 V or 5 V
150
tR
Turn-on rise time
VS = 0 V
ns
tF
Turn-off fall time
80
35
730
6
70
600
MT
Delay matching time (HS & LS turn-on/off)
RDT = 0 Ω
RDT = 200 kΩ
RDT = 0
DT
Dead time
us
ns
—
—
0
0
MDT
Matching Dead time
RDT = 200 kΩ
Datasheet
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2ED2108 (4) S06F (J)
650 V half bridge gate driver with integrated bootstrap diode
5
Application information and additional details
5.1
IGBT / MOSFET gate drive
The 2ED2108 (4) S06F (J) HVIC is designed to drive MOSFET or IGBT power devices. Figure 4 and Figure 5 illustrate
several parameters associated with the gate drive functionality of the HVIC. The output current of the HVIC, used
to drive the gate of the power switch, is defined as IO. The voltage that drives the gate of the external power switch
is defined as VHO for the high-side power switch and VLO for the low-side power switch; this parameter is
sometimes generically called VOUT and in this case does not differentiate between the high-side or low-side output
voltage.
Figure 4
HVIC Sourcing current
Figure 5
HVIC Sinking current
5.2
Switching and timing relationships
The relationships between the input and output signals of the 2ED2108 (4) S06F (J) are illustrated below in
Figure 6 and Figure 7. From these figures, we can see the definitions of several timing parameters (i.e. tON, tOFF
tR, and tF) associated with this device.
,
Figure 6
Switching timing diagram
Figure 7
Input/output logic diagram
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2ED2108 (4) S06F (J)
650 V half bridge gate driver with integrated bootstrap diode
5.3
Deadtime
This family of HVICs features integrated deadtime protection circuitry. The deadtime is fixed for 2ED2108S06F; is
programmable for 2ED21084S06J, it is greater design flexibility. The deadtime feature inserts a time period (a
minimum deadtime) in which both the high- and low-side power switches are held off; this is done to ensure that
the power switch being turned off has fully turned off before the second power switch is turned on. This minimum
deadtime is automatically inserted whenever the external deadtime is shorter than interal deadtime; external
deadtimes larger than internal deadtime are not modified by the gate driver.
The deadtime circuitry of 2ED2108 (4) S06F (J) is matched with respect to the high- and low-side outputs. Figure
8 defines the two deadtime parameters (i.e., DTLO-HO and DTHO-LO); the deadtime matching parameter (MDT)
associated with the 2ED2108 (4) S06F (J) specifies the maximum difference between DTLO-HO and DTHO-LO
.
Figure 8
Deadtime matching waveform definition
The 14-pin variant (2ED21084S06J) provides greater design flexibility with a programmable dead-time feature
using an external resistor (RDT) connected between the DT pin and VSS pin as shown in Figure 9.
Up to 650V
Integrated
RBS DBS
VCC
HIN
LIN
14
1
2
3
4
5
6
7
VCC
HIN
VB
HO
VS
13
12
11
10
LIN
DT
TO LOAD
RDT
VSS
VSS
COM
LO
9
8
2ED21084S06J
Figure 9
14-pin half-bridge variants having adjustable dead-time feature settable with a resistor
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2ED2108 (4) S06F (J)
650 V half bridge gate driver with integrated bootstrap diode
Figure 10 shows the linear relationship between the resistor (RDT) and dead time. Based on the end application,
designers can choose to add the external resistor to increase the dead time. In case the DT pin is left open, the
gate driver enters protection mode switching off the output stages. Hence this pin has to be connected to VSS
pin with a 0 Ω to 200 kΩ resistor based on application requirements. A 0 Ω (or shorted) provides a minimum
deadtime of 540 ns and 200 kΩ provides a maximum deadtime of 5 us.
Programmable dead time in 2ED21084S06J
6
5
4
3
2
1
0
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200
RDT (kΩ)
Figure 10
Variation of dead time vs. external resistor (RDT)
5.4
Matched propagation delays
The 2ED2108 (4) S06F (J) is designed with propagation delay matching circuitry. With this feature, the IC’s
response at the output to a signal at the input requires approximately the same time duration (i.e., tON, tOFF) for
both the low-side channels and the high-side channels; the maximum difference is specified by the delay
matching parameter (MT). The propagation turn-on delay (tON) of the 2ED2108 (4) S06F (J) is matched to the
propagation turn-off delay (tOFF).
Figure 11 Delay matching waveform definition
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2ED2108 (4) S06F (J)
650 V half bridge gate driver with integrated bootstrap diode
5.5
Input logic compatibility
The input pins are based on a TTL and CMOS compatible input-threshold logic that is independent of the Vcc
supply voltage. Figure 12 illustrates an input signal to the 2ED2108 (4) S06F (J), its input threshold values, and
the logic state of the IC as a result of the input signal. The typical high threshold (VIH) of 2.1 V and typical low
threshold (VIL) of 0.9 V. The input pins are conveniently driven with logic level PWM control signals derived from
3.3 V and 5 V digital power-controller devices. Wider hysteresis (typically 0.9 V) offers enhanced noise immunity
compared to traditional TTL logic implementations, where the hysteresis is typically less than 0.5 V. 2ED2108 (4)
S06F (J) also features tight control of the input pin threshold voltage levels which eases system design
considerations and ensures stable operation across temperature. The 2ED2108 (4) S06F (J) has input pins that
are capable of sustaining voltages higher than the bias voltage applied on the Vcc pin of the device.
Figure 12 HIN & /LIN input thresholds
5.6
Undervoltage lockout
This IC provides undervoltage lockout protection on both the VCC (logic and low-side circuitry) power supply and
the VBS (high-side circuitry) power supply. Figure 13 is used to illustrate this concept; VCC (or VBS) is plotted over
time and as the waveform crosses the UVLO threshold (VCCUV+/- or VBSUV+/-) the undervoltage protection is enabled
or disabled.
Upon power-up, should the VCC voltage fail to reach the VCCUV+ threshold, the IC won’t turn-on. Additionally, if the
VCC voltage decreases below the VCCUV- threshold during operation, the undervoltage lockout circuitry will
recognize a fault condition and shutdown the high and low-side gate drive outputs.
Upon power-up, should the VBS voltage fail to reach the VBSUV+ threshold, the IC won’t turn-on. Additionally, if the
VBS voltage decreases below the VBSUV- threshold during operation, the undervoltage lockout circuitry will
recognize a fault condition, and shutdown the high-side gate drive outputs of the IC.
The UVLO protection ensures that the IC drives the external power devices only when the gate supply voltage is
sufficient to fully enhance the power devices. Without this feature, the gates of the external power switch could
be driven with a low voltage, resulting in the power switch conducting current while the channel impedance is
high; this could result in high conduction losses within the power device and could lead to power device failure.
Figure 13 UVLO protection
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2ED2108 (4) S06F (J)
650 V half bridge gate driver with integrated bootstrap diode
5.7
Bootstrap diode
An ultra-fast bootstrap diode is monolithically integrated for establishing the high side supply. The differential
resistor of the diode helps to avoid extremely high inrush currents when initially charging the bootstrap
capacitor. The integrated diode with its resistrance helps save cost and improve reliability by reducing external
components as shown below Figure 14 and Figure 15.
Figure 14 2ED210x with integrated components
Figure 15 Standard bootstrap gate driver
The low ohmic current limiting resistor provides essential advantages over other competitor devices with high
ohmic bootstrap structures. A low ohmic resistor such as in the 2ED210x family allows faster recharging of the
bootstrap capacitor during periods of small duty cycles on the low side transistor. The bootstrap diode is a real
pn-diode which works with all control algorithms of modern power electronics, such as trapezoidal or sinusoidal
motor drives control.
5.8
Calculating the bootstrap capacitance CBS
Bootstrapping is a common method of pumping charges from a low potential to a higher one. With this technique
a supply voltage for the floating high side sections of the gate drive can be easily established according to Figure
16. This method has the advantage of being simple and low cost but may force some limitations on duty-cycle
and on-time since they are limited by the requirement to refresh the charge in the bootstrap capacitor. Proper
capacitor choice can reduce drastically these limitations.
1
Figure 16 Half bridge bootstrap circuit in 2ED210x
When the low side MOSFET turns on, it will force the potential of pin VS to GND. The existing difference between
the voltage of the bootstrap capacitor VCBS and VCC results in a charging current IBS into the capacitor CBS. The
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current IBS is a pulse current and therefore the ESR of the capacitor CBS must be very small in order to avoid losses
in the capacitor that result in lower lifetime of the capacitor. This pin is on high potential again after low side is
turned off and high side is conducting current. But now the bootstrap diode DBS blocks a reverse current, so that
the charges on the capacitor cannot flow back to the capacitor CVCC. The bootstrap diode DBS also takes over the
blocking voltage between pin VB and VCC. The voltage of the bootstrap capacitor can now supply the high side
gate drive sections. It is a general design rule for the location of bootstrap capacitors CBS, that they must be placed
as close as possible to the IC. Otherwise, parasitic resistors and inductances may lead to voltage spikes, which
may trigger the undervoltage lockout threshold of the individual high side driver section. However, all parts of
the 2ED210x family, which have the UVLO also contain a filter at each supply section in order to actively avoid
such undesired UVLO triggers.
The current limiting resistor RBS according to Figure 16 reduces the peak of the pulse current during the low side
MOSFET turn-on. The pulse current will occur at each turn-on of the low side MOSFET, so that with increasing
switching frequency the capacitor CBS is charged more frequently. Therefore a smaller capacitor is suitable at
higher switching frequencies. The bootstrap capacitor is mainly discharged by two effects: The high side
quiescent current and the gate charge of the high side MOSFET to be turned on.
The minimum size of the bootstrap capacitor is given by
ꢃꢄꢅꢆꢅ
ꢀꢁꢂ
=
∆ꢇꢁꢂ
∆VBS is the maximum allowable voltage drop at the bootstrap capacitor within a switching period, typically 1 V.
It is recommended to keep the voltage drop below the undervoltage lockout (UVLO) of the high side and limit
∆VBS ≤ (VCC – VF– VGSmin– VDSon
)
VGSmin > VBSUV- , VGSmin is the minimum gate source voltage we want to maintain and VBSUV- is the high-side supply
undervoltage negative threshold.
VCC is the IC voltage supply, VF is bootstrapdiode forward voltage and VDSon is drain-source voltage of low side
MOSFET.
Please note, that the value QGTOT may vary to a maximum value based on different factors as explained below and
the capacitor shows voltage dependent derating behavior of its capacitance.
The influencing factors contributing VBS to decrease are:
- MOSFET turn on required Gate charge (QG)
- MOSFET gate-source leakage current (ILK_GS
)
- Floating section quiescent current (IQBS
- Floating section leakage current (ILK)
)
- Bootstrap diode leakage current (ILK_DIODE
- Charge required by the internal level shifters (ꢃꢈꢂ): typical 1nC
- Bootstrap capacitor leakage current (ILK_CAP
)
)
- High side on time (THON
)
Considering the above,
ꢃꢄꢅꢆꢅ = ꢃꢄ + ꢃꢈꢂ + ꢉꢊꢋꢁꢂ + ꢊꢈꢌ + ꢊꢈꢌ + ꢊꢈꢌ
+ ꢊꢈꢌ ꢖ ∗ ꢗꢘꢆꢙ
ꢓꢔꢕ
ꢍꢎ
ꢏꢐꢑꢏꢒ
ILK_CAP is only relevant when using an electrolytic capacitor and can be ignored if other types of capacitors are
used. It is strongly recommend using at least one low ESR ceramic capacitor (paralleling electrolytic capacitor
and low ESR ceramic capacitor may result in an efficient solution).
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The above CBS equation is valid for pulse by pulse considerations. It is easy to see, that higher capacitance values
are needed, when operating continuously at small duty cycles of low side. The recommended bootstrap
capacitance is therefore in the range up to 4.7 μF for most switching frequencies. The performance of the
integrated bootstrap diode supports the requirement for small bootstrap capacitances.
5.9
Tolerant to negative tranisents on input pins
Typically the driver's ground pin is connected close to the source pin of the MOSFET or IGBT. The microcontroller
which sends the HIN and /LIN PWM signals refers to the same ground and in most cases there will be an offset
voltage between the microcontroller ground pin and driver ground because of ground bounce. The 2ED210x
family can handle negative voltage spikes up to 5 V. The recommended operating level is at negative 4 V with
absolute maximum of negative 5 V. Standard half bridge or high-side/low-side gate drivers only allow negative
voltage levels down to -0.3 V. The 2ED210x family has much better noise immunity capability on the input pins.
Figure 17 Negative voltage tolerance on inputs of upto –5 V
5.10
Negative voltage transient tolerance of VS pin
A common problem in today’s high-power switching converters is the transient response of the switch node’s
voltage as the power switches transition on and off quickly while carrying a large current. A typical 3-phase
inverter circuit is shown in Figure 18, here we define the power switches and diodes of the inverter.
If the high-side switch (e.g., the IGBT Q1 in Figure 19) switches from on to off, while the U phase current is flowing
to an inductive load, a current commutation occurs from high-side switch (Q1) to the diode (D2) in parallel with
the low-side switch of the same inverter leg. At the same instance, the voltage node VS1, swings from the positive
DC bus voltage to the negative DC bus voltage.
Figure 18 Three phase inverter
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Also when the V phase current flows from the inductive load back to the inverter (see Figure 19 C) and D)), and
Q4 IGBT switches on, the current commutation occurs from D3 to Q4. At the same instance, the voltage node, VS2,
swings from the positive DC bus voltage to the negative DC bus voltage.
However, in a real inverter circuit, the VS voltage swing does not stop at the level of the negative DC bus, rather
it swings below the level of the negative DC bus. This undershoot voltage is called “negative VS transient”
A)
D)
B)
C)
Figure 19 A) Q1 conducting
B) D2 conducting
C) D3 conducting
D) Q4 conducting
The circuit shown in Figure 20-A depicts one leg of the three phase inverter; Figure 20-B and 19-C show a
simplified illustration of the commutation of the current between Q1 and D2. The parasitic inductances in the
power circuit from the die bonding to the PCB tracks are lumped together in LC and LE for each IGBT. When the
high-side switch is on, VS1 is below the DC+ voltage by the voltage drops associated with the power switch and
the parasitic elements of the circuit. When the high-side power switch turns off, the load current momentarily
flows in the low-side freewheeling diode due to the inductive load connected to VS1 (the load is not shown in
these figures). This current flows from the DC- BUS (which is connected to the COM pin of the HVIC) to the load
and a negative voltage between VS1 and the DC- BUS is induced (i.e., the COM pin of the HVIC is at a higher
potential than the VS pin).
A
C
B
Figure 20 Figure A shows the parasitic elements. Figure B shows the generation of VS positive. Figure C
shows the generation of VS negative
5.11
NTSOA – Negative Transient Safe Operating Area
In a typical motor drive system, dV/dt is typically designed to be in the range of 3 – 5 V / ns. The negative VS
transient voltage can exceed this range during some events such as short circuit and over-current shutdown,
when di/dt is greater than in normal operation.
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Infineon’s HVICs have been designed for the robustness required in many of today’s demanding applications. An
indication of the 2ED2108 (4) S06F (J)’s robustness can be seen in Figure 21, where the 2ED2108 (4) S06F (J)’s Safe
Operating Area is shown at VBS=15 V based on repetitive negative VS spikes. A negative VS transient voltage falling
in the grey area (outside SOA) may lead to IC permanent damage; viceversa unwanted functional anomalies or
permanent damage to the IC do not appear if negative Vs transients fall inside the SOA.
Figure 21 Negative VS transient SOA for 2ED2108 (4) S06F (J) @ VBS=15 V
Even though the 2ED2108 (4) S06F(J) has been shown able to handle these large negative VS transient conditions,
it is highly recommended that the circuit designer always limit the negative VS transients as much as possible by
careful PCB layout and component use.
5.12
Higher headroom for input to output signal transmission with logic
operation upto -11 V
If there is not enough voltage for the level shifter to transmit a valid signal to the high side. High side driver
doesn’t turn on. The level shifter circuit is with respect to COM (refer to Block Diagram on page 4), the voltage
from VB to COM is the supply voltage of level shifter. Under the condition of VS is negative voltage with respect to
COM, the voltage of VS - COM is decreased, as shown in Figure 22. There is a minimum operational supply voltage
of level shifter, if the supply voltage of level shifter is too low, the level shifter cannot pass through IN signal to
HO. The specification of VS is –11 V as the internal structure allows a voltage difference of 15 V between Vcc and
COM pins. If VB – VS voltage is different, the minimum VS voltage changes accordingly.
VS
COM
- 11 V
Figure 22 Headroom for HV level shifter data transmission
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5.13
Maximum switching frequency
The 2ED210x family is capable of switching at higher frequencies as compared to standard half-bridge or high
side / low side gate drivers. They are available in two packages, the PG-DSO-8 and the PG-DSO-14. It is essential
to ensure that the component is not thermally overloaded when operating at higher frequencies. This can be
checked by means of the thermal resistance junction to ambient and the calculation or measurement of the
dissipated power. The thermal resistance is given in the datasheet (section 4) and refers to a specific layout.
Changes of this layout may lead to an increased thermal resistance, which will reduce the total dissipated power
of the driver IC. One should therefore do temperature measurements in order to avoid thermal overload under
application relevant conditions of ambient temperature and housing.
The maximum chip temperature TJ can be calculated with
ꢗ = Pd ∙ ꢛꢜℎꢚꢝ + ꢗ
, where TA_max is the maximum ambient temperature.
ꢚ
ꢝ_ꢞꢟꢠ
The dissipated power Pd by the driver IC is a combination of several sources. These are explained in detail in the
application note “2ED2108 (4) S06F (J) (HVICs)”
Here is the example of the figures which estimates the gate driver IC junction temperature when switching a given
MOSFET at different switching frequencies.
150
125
100
75
150
125
100
75
Vbus = 400 V
Vbus = 200 V
Vbus = 400 V
Vbus = 200 V
50
50
25
25
25
125
225
325
425
525
25
125
225
325
425
525
Frequency (kHz)
Frequency (kHz)
*Assumptions for above curves: LLC topology, Power switch = IPP60R600P6, Ta = 25 °C, VBUS = 400 V, VCC = 12 V,
Rgon = 3.9 Ω, Rgoff = 1 Ω
Figure 23 Estimated TJ vs. Frequencies (Left: DSO-8, Right: DSO-14)
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5.14
PCB layout tips
Distance between high and low voltage components: It’s strongly recommended to place the components tied
to the floating voltage pins (VB and VS) near the respective high voltage portions of the device. Please see the
Case Outline information in this datasheet for the details.
Ground Plane: In order to minimize noise coulping, the ground plane should not be placed under or near the high
voltage floating side.
Gate Drive Loops: Current loops behave like antennas and are able to receive and transmit EM noise (see Figure
24). In order to reduce the EM coulping and improve the power switch turn on/off performance, the gate drive
loops must be reduced as much as possible. Moreover, current can be injected inside the gate drive loop via the
IGBT collector-to-gate parasitic capacitance. The parasitic auto-inductance of the gate loop contributes to
developing a voltage across the gate-emitter, thus increasing the possibility of a self turn-on effect.
Figure 24 Avoid antenna loops
Supply Capacitor: It is recommended to place a bypass capacitor (CIN) between the VCC and COM pins. A ceramic
1μF ceramic capacitor is suitable for most applications. This component should be placed as close as possible
to the pins in order to reduce parasitic elements.
Routing and Placement: Power stage PCB parasitic elements can contribute to large negative voltage transients
at the switch node; it is recommended to limit the phase voltage negative transients. In order to avoid such
conditions, it is recommended to 1) minimize the high-side emitter to low-side collector distance, and 2)
minimize the low-side emitter to negative bus rail stray inductance. However, where negative VS spikes remain
excessive, further steps may be taken to reduce the spike. This includes placing a resistor (5 Ω or less) between
the VS pin and the switch node (see Figure 25 - A), and in some cases using a clamping diode between COM and
VS (see Figure 25 - B). See DT04-4 at www.infineon.com for more detailed explanations.
B
A
Figure 25 Resistor between the VS pin and the switch node and clamping diode between COM and VS
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6
Qualification information1
Table 7
Qualification information
Industrial2
Note: This family of ICs has passed JEDEC’s Industrial
qualification. Consumer qualification level is granted by
extension of the higher Industrial level.
Qualification level
MSL2, 260°C
DSO-8
(per IPC/JEDEC J-STD-020)
Moisture sensitivity level
ESD
MSL33, 260°C
DSO-14
(per IPC/JEDEC J-STD-020)
Class C3 (1.0 kV)
(per JEDEC standard JS-002)
Class 1C (1.5 kV)
(per JEDEC standard JS-001)
Class II Level A
(per JESD78)
Yes
Charged device model
Human body model
IC latch-up test
RoHS compliant
7
Related products
Table 8
Product
Description
Gate Driver ICs
6EDL04I06 /
6EDL04N06
600 V, 3 phase level shift thin-film SOI gate driver with integrated high speed, low RBSD bootstrap
diodes with over-current protection (OCP), 240/420 mA source/sink current drive, Fault reporting,
and Enable for MOSFET or IGBT switches.
2EDL23I06 /
2EDL23N06
600 V, Half-bridge thin-film SOI level shift gate driver with integrated high speed, low
R
BSD bootstrap diode, with over-current protection (OCP), 2.3/2.8 A source/sink current driver, and
one pin Enable/Fault function for MOSFET or IGBT switches.
Power Switches
IKD04N60R / RF
IKD06N65ET6
IPD65R950CFD
IPN50R950CE
600 V TRENCHSTOP™ IGBT with integrated diode in PG-TO252-3 package
650 V TRENCHSTOP™ IGBT with integrated diode in DPAK
650 V CoolMOS CFD2 with integrated fast body diode in DPAK
500 V CoolMOS CE Superjunction MOSFET in PG-SOT223 package
iMOTION™ Controllers
IRMCK099
iMOTION™ Motor control IC for variable speed drives utilizing sensor-less Field Oriented Control
(FOC) for Permanent Magnet Synchronous Motors (PMSM).
IMC101T
High performance Motor Control IC for variable speed drives based on field oriented control (FOC)
of permanent magnet synchronous motors (PMSM).
1 Qualification standards can be found at Infineon’s web site www.infineon.com
2 Higher qualification ratings may be available should the user have such requirements. Please contact your Infineon sales
representative for further information.
3 Higher MSL ratings may be available for the specific package types listed here. Please contact your Infineon sales representative for
further information.
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8
Package details
Figure 26 8 - Lead DSO (2ED2108S06F)
Figure 27 14 - Lead DSO (2ED21084S06J)
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9
Part marking information
Front Side
Back Side
Part number
2ED2108
XXX
Infineon logo
Lot code
XXXX
Assembly
site code
Date code
H YYWW
XXXX X
Pin 1
identifier
(may vary)
Figure 28 Marking information PG-DSO-8
Front Side
Infineon logo
Date code
2D21084S06J
H YYWW XXX
Part number
Assembly
site code
Pin 1
identifier
XXXXXXXXXXX
Lot code
Figure 29 Marking information PG-DSO-14
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10
Additional documentation and resources
Several technical documents related to the use of HVICs are available at www.infineon.com; use the Site Search
function and the document number to quickly locate them. Below is a short list of some of these documents.
Application Notes:
Understanding HVIC Datasheet Specifications
HV Floating MOS-Gate Driver ICs
Use Gate Charge to Design the Gate Drive Circuit for Power MOSFETs and IGBTs
Bootstrap Network Analysis: Focusing on the Integrated Bootstrap Functionality
Design Tips:
Using Monolithic High Voltage Gate Drivers
Alleviating High Side Latch on Problem at Power Up
Keeping the Bootstrap Capacitor Charged in Buck Converters
Managing Transients in Control IC Driven Power Stages
Simple High Side Drive Provides Fast Switching and Continuous On-Time
10.1
Infineon online forum resources
The Gate Driver Forum is live at Infineon Forums (www.infineonforums.com). This online forum is where the
Infineon gate driver IC community comes to the assistance of our customers to provide technical guidance – how
to use gate drivers ICs, existing and new gate driver information, application information, availability of demo
boards, online training materials for over 500 gate driver ICs. The Gate Driver Forum also serves as a repository
of FAQs where the user can review solutions to common or specific issues faced in similar applications.
Register online at the Gate Driver Forum and learn the nuances of efficiently driving a power switch in any given
power electronic application.
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11
Revision history
Document
version
2.00
2.10
2.20
Date of release
Description of changes
Aug. 08, 2019
Sep. 12, 2019
Jan. 14, 2020
Final Datasheet
Revised parameter values in Table 7 to match the test conditions.
Revised parameter values in Table 7 to match the test conditions. Added
deadtime settings section in page 10-11. Updated the laser marking for
DSO14
2.21
2.22
April 07, 2020
July 02, 2020
Changed the ESD HBM from Class 2 to Class 1C
IC latch-up test per JESD78
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Trademarks
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IMPORTANT NOTICE
Edition 2020-07-02
The information given in this document shall in no For further information on the product, technology,
event be regarded as a guarantee of conditions or delivery terms and conditions and prices please
Published by
characteristics (“Beschaffenheitsgarantie”) .
contact your nearest Infineon Technologies office
(www.infineon.com).
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81726 Munich, Germany
With respect to any examples, hints or any typical
values stated herein and/or any information
regarding the application of the product, Infineon
Technologies hereby disclaims any and all
warranties and liabilities of any kind, including
without limitation warranties of non-infringement of
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in question please contact your nearest Infineon
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