AUIRFR4292TR [INFINEON]

Advanced Process Technology; 先进的工艺技术
AUIRFR4292TR
型号: AUIRFR4292TR
厂家: Infineon    Infineon
描述:

Advanced Process Technology
先进的工艺技术

文件: 总14页 (文件大小:262K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD - 97792  
AUTOMOTIVE GRADE  
AUIRFR4292  
AUIRFU4292  
Features  
HEXFET® Power MOSFET  
Advanced Process Technology  
D
LowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
V(BR)DSS  
RDS(on) typ.  
max.  
250V  
275m  
345m  
G
S
ID  
9.3A  
Automotive Qualified *  
Description  
D
SpecificallydesignedforAutomotiveapplications,  
this HEXFET® Power MOSFET utilizes the latest  
processing techniques to achieve extremely low  
on-resistancepersiliconarea. Additionalfeatures  
of this design are a 175°C junction operating  
temperature, fast switching speed and improved  
repetitiveavalancherating. Thesefeaturescom-  
bine to make this design an extremely efficient  
andreliabledeviceforuseinAutomotiveapplica-  
tions and a wide variety of other applications.  
S
S
D
G
G
I-Pak  
AUIRFU4292  
D-Pak  
AUIRFR4292  
G
Gate  
D
Drain  
S
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Max.  
9.3  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
6.6  
A
40  
PD @TC = 25°C  
Power Dissipation  
100  
0.67  
± 20  
W
W/°C  
V
Linear Derating Factor  
VGS  
EAS  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy (Thermally Limited)  
130  
mJ  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
E
AS (tested )  
97  
IAR  
See Fig.12a, 12b, 15, 16  
A
Repetitive Avalanche Energy  
EAR  
TJ  
mJ  
Operating Junction and  
-55 to + 175  
300  
TSTG  
Storage Temperature Range  
°C  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.5  
Units  
R  
R  
R  
Junction-to-Case  
Junction-to-Ambient (PCB Mount)  
Junction-to-Ambient  
°C/W  
JC  
JA  
JA  
50  
110  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
06/18/12  
AUIRFR/U4292  
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Drain-to-Source Breakdown Voltage  
Min. Typ. Max. Units  
Conditions  
VGS = 0V, ID = 250μA  
V/°C Reference to 25°C, ID = 1.0mA  
V(BR)DSS  
250  
–––  
–––  
0.31  
275  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
345  
5.0  
V
V(BR)DSS/ TJ Breakdown Voltage Temp. Coefficient  
m
RDS(on)  
VGS(th)  
gfs  
Static Drain-to-Source On-Resistance –––  
VGS = 10V, ID = 5.6A  
VDS = VGS, ID = 50μA  
VDS = 50V, ID = 5.6A  
Gate Threshold Voltage  
3.0  
6.2  
V
Forward Transconductance  
Drain-to-Source Leakage Current  
–––  
20  
V
IDSS  
–––  
–––  
–––  
–––  
μA VDS = 250V, VGS = 0V  
VDS = 250V, VGS = 0V, TJ = 125°C  
nA VGS = 20V  
250  
100  
-100  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
VGS = -20V  
Dynamic Electrical @ TJ = 25°C (unless otherwise specified)  
Parameter Min. Typ. Max. Units  
Total Gate Charge  
Conditions  
Qg  
Qgs  
Qgd  
td(on)  
tr  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
13  
4.7  
4.8  
11  
20  
ID = 5.6A  
nC VDS = 125V  
VGS = 10V  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
VDD = 250V  
15  
ID = 5.6A  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
16  
ns RG = 15  
VGS = 10V  
8.4  
4.5  
D
S
LD  
Internal Drain Inductance  
Between lead,  
nH 6mm (0.25in.)  
from package  
G
LS  
Internal Source Inductance  
–––  
7.5  
–––  
and center of die contact  
Ciss  
Input Capacitance  
–––  
–––  
–––  
–––  
–––  
–––  
705  
71  
–––  
–––  
–––  
–––  
–––  
–––  
VGS = 0V  
Coss  
Output Capacitance  
VDS = 25V  
Crs s  
Reverse Transfer Capacitance  
Output Capacitance  
20  
pF ƒ = 1.0MHz  
Coss  
600  
26  
VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz  
VGS = 0V, VDS = 200V, ƒ = 1.0MHz  
VGS = 0V, VDS = 0V to 200V  
Coss  
Output Capacitance  
Coss eff.  
Effective Output Capacitance  
65  
Diode Characteristics  
Parameter  
Min. Typ. Max. Units  
Conditions  
MOSFET symbol  
D
I
S
Continuous Source Current  
–––  
–––  
9.3  
(Body Diode)  
Pulsed Source Current  
A
showing the  
integral reverse  
G
I
–––  
–––  
40  
SM  
S
(Body Diode)  
p-n junction diode.  
V
Diode Forward Voltage  
–––  
–––  
–––  
–––  
110  
390  
1.3  
165  
585  
V
T = 25°C, I = 5.6A, V = 0V  
J S GS  
SD  
t
rr  
Reverse Recovery Time  
Reverse Recovery Charge  
Forward Turn-On Time  
ns  
nC  
T = 25°C, I = 5.6A, VDD = 125V  
J F  
di/dt = 100A/μs  
Q
t
rr  
Intrinsicturn-ontimeis negligible(turn-onis dominatedbyLS+LD)  
on  
Notes:  
‡ When mounted on 1" square PCB (FR-4 or G-10 Material ).  
For recommended footprint and soldering techniques refer to  
application note #AN-994.  
 Repetitive rating; pulse width limited by  
max. junction temperature. (See fig. 11).  
‚ Limited by TJmax, starting TJ = 25°C, L = 8.1mH  
ˆ Ris measured at TJ approximately 90°C.  
RG = 50, IAS = 5.6A, VGS =10V. Part not  
recommended for use above this value.  
ƒ Pulse width 1.0ms; duty cycle 2%.  
„ Coss eff. is a fixed capacitance that gives the  
same charging time as Coss while VDS is rising  
from 0 to 80% VDSS  
.
Limited by TJmax , see Fig.12a, 12b, 15, 16 for  
typical repetitive avalanche performance.  
† This value is determined from sample failure  
population, starting TJ = 25°C, L = 8.1mH,  
RG = 50, IAS = 5.6A, VGS =10V.  
2
www.irf.com  
AUIRFR/U4292  
Qualification Information†  
Automotive  
(per AEC-Q101)  
Qualification Level  
Comments: This part number(s) passed Automotive  
qualification. IR’s Industrial and Consumer qualification level  
is granted by extension of the higher Automotive level.  
D-PAK  
I-PAK  
MSL1  
N/A  
Moisture Sensitivity Level  
Class M1B (+/- 100V)††  
Machine Model  
AEC-Q101-002  
Class H1A (+/- 500V)††  
AEC-Q101-001  
Human Body Model  
ESD  
Class C5 (+/- 2000V)††  
AEC-Q101-005  
Charged Device Model  
Yes  
RoHS Compliant  
†
Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/  
†† Highest passing voltage.  
www.irf.com  
3
AUIRFR/U4292  
100  
100  
10  
1
VGS  
15V  
10V  
8.0V  
7.5V  
7.0V  
6.5V  
6.0V  
5.5V  
VGS  
15V  
TOP  
TOP  
10V  
8.0V  
7.5V  
7.0V  
6.5V  
6.0V  
5.5V  
10  
1
BOTTOM  
BOTTOM  
5.5V  
0.1  
0.01  
5.5V  
60μs PULSE WIDTH  
Tj = 175°C  
60μs PULSE WIDTH  
Tj = 25°C  
0.1  
0.1  
1
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
100  
16  
14  
T
= 25°C  
J
12  
10  
8
T
= 175°C  
J
10  
T = 25°C  
J
6
T = 175°C  
J
4
V
= 10V  
DS  
380μs PULSE WIDTH  
V
= 50V  
DS  
2
60μs PULSE WIDTH  
1.0  
0
4
5
6
7
8
9
10  
0
1
2
3
4
5
6
I ,Drain-to-Source Current (A)  
D
V
, Gate-to-Source Voltage (V)  
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Typical Forward Transconductance  
vs. Drain Current  
4
www.irf.com  
AUIRFR/U4292  
100000  
10000  
1000  
100  
14.0  
12.0  
10.0  
8.0  
V
= 0V,  
= C  
f = 1 MHZ  
GS  
I = 5.6A  
D
C
C
C
+ C , C  
SHORTED  
iss  
gs  
gd  
ds  
V
V
V
= 200V  
= 125V  
= 50V  
= C  
DS  
DS  
DS  
rss  
oss  
gd  
= C + C  
ds  
gd  
C
iss  
C
oss  
6.0  
C
rss  
4.0  
10  
2.0  
0.0  
1
0
2
4
6
8
10 12 14 16 18  
1
10  
100  
1000  
V
DS  
, Drain-to-Source Voltage (V)  
Q , Total Gate Charge (nC)  
G
Fig 5. Typical Capacitance vs.  
Fig 6. Typical Gate Charge vs.  
Drain-to-SourceVoltage  
Gate-to-SourceVoltage  
100  
100  
10  
1
OPERATION IN THIS AREA  
LIMITED BY R (on)  
100μsec  
DS  
1msec  
T
= 175°C  
J
10  
10msec  
DC  
T
= 25°C  
J
Tc = 25°C  
Tj = 175°C  
Single Pulse  
V
= 0V  
GS  
1.0  
0.1  
0.4  
0.5  
V
0.6  
0.7  
0.8  
0.9  
1.0  
1.1  
1
10  
, Drain-to-Source Voltage (V)  
100  
V
, Source-to-Drain Voltage (V)  
SD  
DS  
Fig 7. Typical Source-Drain Diode  
Fig 8. Maximum Safe Operating Area  
Forward Voltage  
www.irf.com  
5
AUIRFR/U4292  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
10  
8
I
= 9.3A  
D
V
= 10V  
GS  
6
4
2
0
-60 -40 -20 0 20 40 60 80 100120140160180  
, Junction Temperature (°C)  
25  
50  
75  
100  
125  
150  
175  
T
T
, Case Temperature (°C)  
J
C
Fig 9. Maximum Drain Current vs.  
Fig 10. Normalized On-Resistance  
CaseTemperature  
vs.Temperature  
10  
1
0.1  
D = 0.50  
0.20  
0.10  
0.05  
0.02  
0.01  
0.01  
Notes:  
SINGLE PULSE  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
( THERMAL RESPONSE )  
0.001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
t
, Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
6
www.irf.com  
AUIRFR/U4292  
600  
500  
400  
300  
200  
100  
0
15V  
I
D
TOP  
1.0A  
2.2A  
BOTTOM 5.6A  
DRIVER  
+
L
V
DS  
D.U.T  
AS  
R
G
V
DD  
-
I
A
2
V0GVS  
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR)DSS  
t
p
25  
50  
75  
100  
125  
150  
175  
Starting T , Junction Temperature (°C)  
J
I
AS  
Fig 12c. Maximum Avalanche Energy  
vs. Drain Current  
Fig 12b. Unclamped Inductive Waveforms  
Q
G
10 V  
Q
Q
GD  
GS  
V
G
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
Charge  
Fig 13a. Basic Gate Charge Waveform  
Current Regulator  
I
I
I
I
= 50μA  
= 250μA  
= 1.0mA  
= 1.0A  
D
D
D
D
Same Type as D.U.T.  
50K  
.2F  
12V  
.3F  
+
V
DS  
D.U.T.  
-
V
GS  
-75 -50 -25  
0
25 50 75 100 125 150 175  
3mA  
T , Temperature ( °C )  
J
I
I
D
G
Current Sampling Resistors  
Fig 14. Threshold Voltage vs. Temperature  
Fig 13b. Gate Charge Test Circuit  
www.irf.com  
7
AUIRFR/U4292  
100  
Allowed avalanche Current vs avalanche  
Duty Cycle = Single Pulse  
pulsewidth, tav, assuming Tj = 150°C and  
Tstart =25°C (Single Pulse)  
10  
1
0.01  
0.05  
0.10  
Allowed avalanche Current vs avalanche  
  
pulsewidth, tav, assuming  
Tstart = 150°C.  
j = 25°C and  
0.1  
1.0E-06  
1.0E-05  
1.0E-04  
1.0E-03  
1.0E-02  
1.0E-01  
tav (sec)  
Fig 15. Typical Avalanche Current vs.Pulsewidth  
140  
120  
100  
80  
Notes on Repetitive Avalanche Curves , Figures 15, 16:  
(For further info, see AN-1005 at www.irf.com)  
1. Avalanche failures assumption:  
Purely a thermal phenomenon and failure occurs at a  
temperature far in excess of Tjmax. This is validated for  
every part type.  
TOP  
BOTTOM 1.0% Duty Cycle  
= 5.6A  
Single Pulse  
I
D
2. Safe operation in Avalanche is allowed as long asTjmax is  
not exceeded.  
3. Equation below based on circuit and waveforms shown in  
Figures 12a, 12b.  
60  
4. PD (ave) = Average power dissipation per single  
avalanche pulse.  
5. BV = Rated breakdown voltage (1.3 factor accounts for  
voltage increase during avalanche).  
40  
20  
6. Iav = Allowable avalanche current.  
7. T = Allowable rise in junction temperature, not to exceed  
Tjmax (assumed as 25°C in Figure 15, 16).  
tav = Average time in avalanche.  
D = Duty cycle in avalanche = tav ·f  
ZthJC(D, tav) = Transient thermal resistance, see figure 11)  
0
25  
50  
75  
100  
125  
150  
175  
Starting T , Junction Temperature (°C)  
J
P
D (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC  
Iav = 2DT/ [1.3·BV·Zth]  
EAS (AR) = PD (ave)·tav  
Fig 16. Maximum Avalanche Energy  
vs.Temperature  
8
www.irf.com  
AUIRFR/U4292  
Driver Gate Drive  
P.W.  
P.W.  
Period  
Period  
D =  
D.U.T  
+
*
=10V  
V
GS  
ƒ
CircuitLayoutConsiderations  
 Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
-
D.U.T. I Waveform  
SD  
+
‚
-
Reverse  
Recovery  
Current  
Body Diode Forward  
„
Current  
di/dt  
-
+
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  

V
DD  
VDD  
Re-Applied  
Voltage  
dv/dtcontrolledbyRG  
RG  
+
-
Body Diode  
Forward Drop  
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
Inductor Curent  
I
SD  
Ripple 5%  
* VGS = 5V for Logic Level Devices  
Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel  
HEXFET® Power MOSFETs  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
10V  
PulseWidth µs  
Duty Factor  
Fig 18a. Switching Time Test Circuit  
V
DS  
90%  
10%  
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 18b. Switching Time Waveforms  
www.irf.com  
9
AUIRFR/U4292  
D-Pak (TO-252AA) Package Outline  
Dimensions are shown in millimeters (inches)  
D-Pak (TO-252AA) Part Marking Information  
PartNumber  
AUFR4292  
DateCode  
Y= Year  
WW= Work Week  
A= Automotive, Lead Free  
IRLogo  
YWWA  
XX or XX  
LotCode  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
10  
www.irf.com  
AUIRFR/U4292  
I-Pak (TO-251AA) Package Outline  
Dimensions are shown in millimeters (inches)  
I-Pak (TO-251AA) Part Marking Information  
PartNumber  
AUFU4292  
DateCode  
Y= Year  
WW= Work Week  
A= Automotive, Lead Free  
IRLogo  
YWWA  
XX or XX  
LotCode  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
www.irf.com  
11  
AUIRFR/U4292  
D-Pak (TO-252AA) Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
TR  
TRL  
TRR  
16.3 ( .641 )  
15.7 ( .619 )  
16.3 ( .641 )  
15.7 ( .619 )  
12.1 ( .476 )  
11.9 ( .469 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
FEED DIRECTION  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
13 INCH  
16 mm  
NOTES :  
1. OUTLINE CONFORMS TO EIA-481.  
12  
www.irf.com  
AUIRFR/U4292  
Ordering Information  
Base part  
number  
Package Type  
Standard Pack  
Complete Part Number  
Form  
Tube  
Tape and Reel  
Tape and Reel Left  
Tape and Reel Right  
Tube  
Quantity  
75  
2000  
3000  
3000  
75  
AUIRFR4292  
AUIRFU4292  
DPak  
IPak  
AUIRFR4292  
AUIRFR4292TR  
AUIRFR4292TRL  
AUIRFR4292TRR  
AUIRFU4292  
www.irf.com  
13  
AUIRFR/U4292  
IMPORTANTNOTICE  
Unless specifically designated for the automotive market, International Rectifier Corporation and its  
subsidiaries (IR) reserve the right to make corrections, modifications, enhancements, improvements, and  
other changes to its products and services at any time and to discontinue any product or services without  
notice. Part numbers designated with the “AU” prefix follow automotive industry and / or customer specific  
requirements with regards to product discontinuance and process change notification. All products are sold  
subject to IR’s terms and conditions of sale supplied at the time of order acknowledgment.  
IR warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with IR’s standard warranty. Testing and other quality control techniques are used to the extent  
IR deems necessary to support this warranty. Except where mandated by government requirements, testing  
of all parameters of each product is not necessarily performed.  
IR assumes no liability for applications assistance or customer product design. Customers are responsible  
for their products and applications using IR components. To minimize the risks with customer products and  
applications, customers should provide adequate design and operating safeguards.  
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tion of this information with alterations is an unfair and deceptive business practice. IR is not responsible  
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Resale of IR products or serviced with statements different from or beyond the parameters stated by IR for  
that product or service voids all express and any implied warranties for the associated IR product or service  
and is an unfair and deceptive business practice. IR is not responsible or liable for any such statements.  
IR products are not designed, intended, or authorized for use as components in systems intended for surgical  
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in which the failure of the IR product could create a situation where personal injury or death may occur. Should  
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indemnify and hold International Rectifier and its officers, employees, subsidiaries, affiliates, and distribu-  
tors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out  
of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized  
use, even if such claim alleges that IR was negligent regarding the design or manufacture of the product.  
Only products certified as military grade by the Defense Logistics Agency (DLA) of the US Department of  
Defense, are designed and manufactured to meet DLA military specifications required by certain military,  
aerospace or other applications. Buyers acknowledge and agree that any use of IR products not certified  
by DLA as military-grade, in applications requiring military grade products, is solely at the Buyer’s own risk  
and that they are solely responsible for compliance with all legal and regulatory requirements in connection  
with such use.  
IR products are neither designed nor intended for use in automotive applications or environments unless  
the specific IR products are designated by IR as compliant with ISO/TS 16949 requirements and bear a part  
number including the designation “AU”. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, IR will not be responsible for any failure to meet such requirements.  
For technical support, please contact IR’s Technical Assistance Center  
http://www.irf.com/technical-info/  
WORLDHEADQUARTERS:  
101 N. Sepulveda Blvd., El Segundo, California 90245  
Tel: (310) 252-7105  
14  
www.irf.com  

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