AUIRLR3114ZTRL [INFINEON]

Advanced Process Technology; 先进的工艺技术
AUIRLR3114ZTRL
型号: AUIRLR3114ZTRL
厂家: Infineon    Infineon
描述:

Advanced Process Technology
先进的工艺技术

文件: 总14页 (文件大小:225K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD - 96381  
AUTOMOTIVE GRADE  
AUIRLR3114Z  
AUIRLU3114Z  
HEXFET® Power MOSFET  
Features  
Advanced Process Technology  
D
VDSS  
40V  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Logic Level  
RDS(on) max @ 10V  
max @ 4.5V  
4.9m  
6.5m  
130A  
Ω
Ω
G
ID (Silicon Limited)  
S
l
l
Lead-Free,RoHSCompliant  
Automotive Qualified *  
ID (Package Limited)  
42A  
Description  
D
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniques to achieve extremely low on-resistance per  
silicon area. Additional features of this design are a 175°C  
junction operating temperature, fast switching speed and  
improvedrepetitiveavalancherating.Thesefeaturescom-  
bine to make this design an extremely efficient and reliable  
deviceforuseinAutomotiveapplicationsandawidevariety  
of other applications.  
S
S
D
G
G
I-Pak  
AUIRLU3114Z  
D-Pak  
AUIRLR3114Z  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stressesbeyondthoselistedunder“AbsoluteMaximumRatings”maycausepermanentdamagetothedevice.Thesearestress  
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications  
is not implied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. Thethermal  
resistanceandpowerdissipationratingsaremeasuredunderboardmountedandstillairconditions.Ambienttemperature(TA)  
is 25°C, unless otherwise specified.  
Parameter  
Max.  
Units  
130  
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
89  
A
42  
500  
140  
Pulsed Drain Current  
PD @TC = 25°C  
W
Power Dissipation  
Linear Derating Factor  
0.95  
±16  
W/°C  
V
VGS  
Gate-to-Source Voltage  
EAS (Thermally limited)  
130  
260  
mJ  
Single Pulse Avalanche Energy  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
E
AS (Tested )  
IAR  
See Fig.12a, 12b, 15, 16  
A
EAR  
TJ  
mJ  
Repetitive Avalanche Energy  
Operating Junction and  
-55 to + 175  
TSTG  
°C  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
300(1.6mm from case)  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.05  
40  
Units  
RθJC  
Junction-to-Case  
Rθ  
°C/W  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
JA  
RθJA  
110  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
06/22/11  
AUIRLR/U3114Z  
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
40 ––– –––  
––– 0.032 –––  
Conditions  
VGS = 0V, ID = 250μA  
V/°C Reference to 25°C, ID = 1mA  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
Breakdown Voltage Temp. Coefficient  
Static Drain-to-Source On-Resistance  
V
ΔV(BR)DSS/ΔTJ  
RDS(on)  
–––  
–––  
1.0  
3.9  
5.2  
4.9  
6.5  
V
V
V
V
GS = 10V, ID = 42A  
GS = 4.5V, ID = 42A  
DS = VGS, ID = 100μA  
DS = 10V, ID = 42A  
mΩ  
VGS(th)  
gfs  
Gate Threshold Voltage  
–––  
–––  
–––  
–––  
–––  
–––  
2.5  
V
S
Forward Transconductance  
Drain-to-Source Leakage Current  
98  
–––  
20  
IDSS  
–––  
–––  
–––  
–––  
VDS = 40V, VGS = 0V  
DS = 40V, VGS = 0V, TJ = 125°C  
VGS = 16V  
GS = -16V  
μA  
250  
100  
-100  
V
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
nA  
V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Qg  
Qgs  
Qgd  
td(on)  
tr  
Total Gate Charge  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
40  
12  
56  
ID = 42A  
nC VDS = 20V  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
18  
V
V
GS = 4.5V  
DD = 20V  
25  
140  
33  
ID = 42A  
ns RG = 3.7Ω  
VGS = 4.5V  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
50  
D
S
LD  
Internal Drain Inductance  
4.5  
Between lead,  
nH 6mm (0.25in.)  
from package  
G
LS  
Internal Source Inductance  
–––  
7.5  
–––  
and center of die contact  
Ciss  
Input Capacitance  
––– 3810 –––  
VGS = 0V  
VDS = 25V  
Coss  
Output Capacitance  
–––  
–––  
650  
350  
–––  
–––  
Crss  
Reverse Transfer Capacitance  
Output Capacitance  
pF ƒ = 1.0MHz  
Coss  
––– 2390 –––  
V
V
GS = 0V, VDS = 1.0V, ƒ = 1.0MHz  
GS = 0V, VDS = 32V, ƒ = 1.0MHz  
Coss  
Output Capacitance  
–––  
–––  
580  
820  
–––  
–––  
Coss eff.  
Effective Output Capacitance  
VGS = 0V, VDS = 0V to 32V  
Diode Characteristics  
Parameter  
Min. Typ. Max. Units  
Conditions  
IS  
Continuous Source Current  
MOSFET symbol  
D
S
–––  
–––  
––– 42  
(Body Diode)  
Pulsed Source Current  
A
showing the  
integral reverse  
G
ISM  
–––  
500  
(Body Diode)  
p-n junction diode.  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
Forward Turn-On Time  
–––  
–––  
–––  
–––  
30  
1.3  
45  
41  
V
TJ = 25°C, IS = 42A, VGS = 0V  
ns TJ = 25°C, IF = 42A, VDD = 20V  
di/dt = 100A/μs  
Qrr  
ton  
27  
nC  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
Notes:  
 Repetitive rating; pulse width limited by  
max. junction temperature. (See fig. 11).  
‚ Limited by TJmax, starting TJ = 25°C, L = 0.15mH  
Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical repetitive  
avalanche performance.  
RG = 25Ω, IAS = 42A, VGS =10V. Part not  
recommended for use above this value.  
ƒ Pulse width 1.0ms; duty cycle 2%.  
„ Coss eff. is a fixed capacitance that gives the  
same charging time as Coss while VDS is rising  
† This value determined from sample failure population. 100%  
tested to this value in production.  
‡ When mounted on 1" square PCB (FR-4 or G-10 Material).  
ˆ Rθ is measured at TJ approximately 90°C.  
‰ Calculated continuous current based on maximum allowable  
junction temperature. Package limitation is 42A.  
from 0 to 80% VDSS  
.
2
www.irf.com  
AUIRLR/U3114Z  
Qualification Information†  
Automotive  
††  
(per AEC-Q101)  
Qualification Level  
Comments: This part number(s) passed Automotive  
qualification. IR’s Industrial and Consumer qualification  
level is granted by extension of the higher Automotive level.  
Moisture Sensitivity Level  
MSL1  
N/A  
3L-D PAK  
3L-I-PAK  
Class M4(+/- 425V )†††  
Machine Model  
(per AEC-Q101-002)  
Class H1C(+/- 2000V )†††  
(per AEC-Q101-001)  
Human Body Model  
ESD  
Class C5(+/- 1125V )†††  
(per AEC-Q101-005)  
Charged Device  
Model  
Yes  
RoHS Compliant  
Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/  
†† Exceptions to AEC-Q101 requirements are noted in the qualification report.  
††† Highest passing voltage  
www.irf.com  
3
AUIRLR/U3114Z  
1000  
1000  
100  
10  
VGS  
15V  
10V  
8.0V  
4.5V  
3.5V  
3.0V  
2.7V  
2.5V  
VGS  
15V  
TOP  
TOP  
10V  
8.0V  
4.5V  
3.5V  
3.0V  
2.7V  
2.5V  
100  
10  
1
BOTTOM  
BOTTOM  
2.5V  
60μs PULSE WIDTH  
Tj = 175°C  
2.5V  
60μs PULSE WIDTH  
Tj = 25°C  
0.1  
1
0.1  
1
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
1000  
100  
200  
150  
100  
50  
T
= 25°C  
J
T
= 175°C  
J
T
= 25°C  
J
10  
1
T
= 175°C  
J
V
= 10V  
DS  
380μs PULSE WIDTH  
V
= 15V  
DS  
60μs PULSE WIDTH  
0.1  
0
1
2
3
4
5
6
7
0
20  
40  
60  
80  
100  
I ,Drain-to-Source Current (A)  
D
V
, Gate-to-Source Voltage (V)  
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Typical Forward Transconductance  
vs. Drain Current  
4
www.irf.com  
AUIRLR/U3114Z  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
100000  
10000  
1000  
V
= 0V,  
= C  
f = 1 MHZ  
GS  
I = 42A  
D
C
C
C
+ C , C  
SHORTED  
iss  
gs  
gd  
ds  
= C  
rss  
oss  
gd  
V
= 32V  
= 20V  
= 8.0V  
DS  
= C + C  
ds  
gd  
V
V
DS  
DS  
C
iss  
C
oss  
C
rss  
100  
0
10  
20  
30  
40  
50  
1
10  
, Drain-to-Source Voltage (V)  
100  
Q , Total Gate Charge (nC)  
G
V
DS  
Fig 6. Typical Gate Charge vs.  
Fig 5. Typical Capacitance vs.  
Gate-to-SourceVoltage  
Drain-to-SourceVoltage  
1000  
100  
10  
10000  
1000  
100  
10  
OPERATION IN THIS AREA  
LIMITED BY R  
(on)  
DS  
T
= 175°C  
J
100μsec  
1msec  
10msec  
Tc = 25°C  
T
= 25°C  
J
Tj = 175°C  
Single Pulse  
V
= 0V  
GS  
DC  
1.0  
1
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
1
10  
, Drain-to-Source Voltage (V)  
100  
V
, Source-to-Drain Voltage (V)  
V
SD  
DS  
Fig 7. Typical Source-Drain Diode  
Fig 8. Maximum Safe Operating Area  
Forward Voltage  
www.irf.com  
5
AUIRLR/U3114Z  
2.0  
1.5  
1.0  
0.5  
140  
I
= 42A  
D
V
= 10V  
GS  
120  
100  
80  
60  
40  
20  
0
Limited By Package  
-60 -40 -20 0 20 40 60 80 100120140160180  
, Junction Temperature (°C)  
25  
50  
75  
100  
125  
150  
175  
T
J
T
, Case Temperature (°C)  
C
Fig 10. Normalized On-Resistance  
Fig 9. Maximum Drain Current vs.  
vs.Temperature  
CaseTemperature  
10  
1
D = 0.50  
0.20  
R1  
R1  
R2  
R2  
R3  
R4  
Ri (°C/W) τi (sec)  
R3  
R4  
0.10  
0.05  
0.1  
0.01  
0.0350  
0.2433  
0.4851  
0.2867  
0.000013  
0.000077  
0.001043  
0.004658  
τ
τ
J τJ  
τ
Cτ  
1τ1  
Ci= τi/Ri  
τ
τ
τ
2 τ2  
3τ3  
4τ4  
0.02  
0.01  
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
SINGLE PULSE  
( THERMAL RESPONSE )  
0.001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
t
, Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
6
www.irf.com  
AUIRLR/U3114Z  
600  
500  
400  
300  
200  
100  
0
I
D
15V  
TOP  
9.7A  
17A  
BOTTOM 42A  
DRIVER  
+
L
V
DS  
D.U.T  
AS  
R
G
V
DD  
-
I
A
V
GS  
Ω
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
25  
50  
75  
100  
125  
150  
175  
V
(BR)DSS  
Starting T , Junction Temperature (°C)  
J
t
p
Fig 12c. Maximum Avalanche Energy  
vs. Drain Current  
I
AS  
Fig 12b. Unclamped Inductive Waveforms  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
Q
Q
G
10 V  
Q
GS  
GD  
I
I
I
I
= 150μA  
= 250μA  
= 1.0mA  
= 1.0A  
D
D
D
D
V
G
Charge  
Fig 13a. Basic Gate Charge Waveform  
-75 -50 -25  
0
25 50 75 100 125 150175 200  
T , Temperature ( °C )  
J
L
VCC  
Fig 14. Threshold Voltage vs. Temperature  
DUT  
0
1K  
Fig 13b. Gate Charge Test Circuit  
www.irf.com  
7
AUIRLR/U3114Z  
1000  
Duty Cycle = Single Pulse  
Allowed avalanche Current vs avalanche  
pulsewidth, tav, assuming Δ Tj = 150°C and  
Tstart =25°C (Single Pulse)  
100  
0.01  
0.05  
10  
1
0.10  
Allowed avalanche Current vs avalanche  
pulsewidth, tav, assuming ΔΤ j = 25°C and  
Tstart = 150°C.  
0.1  
1.0E-06  
1.0E-05  
1.0E-04  
1.0E-03  
1.0E-02  
1.0E-01  
tav (sec)  
Fig 15. Typical Avalanche Current vs.Pulsewidth  
150  
100  
50  
Notes on Repetitive Avalanche Curves , Figures 15, 16:  
(For further info, see AN-1005 at www.irf.com)  
1. Avalanche failures assumption:  
Purely a thermal phenomenon and failure occurs at a  
temperature far in excess of Tjmax. This is validated for  
every part type.  
2. Safe operation in Avalanche is allowed as long as  
neither Tjmax nor Iav (max) is exceeded.  
3. Equation below based on circuit and waveforms shown in  
Figures 12a, 12b.  
4. PD (ave) = Average power dissipation per single  
avalanche pulse.  
TOP  
BOTTOM 1.0% Duty Cycle  
= 42A  
Single Pulse  
I
D
5. BV = Rated breakdown voltage (1.3 factor accounts for  
voltage increase during avalanche).  
6. Iav = Allowable avalanche current.  
7. ΔT = Allowable rise in junction temperature, not to exceed  
T
jmax (assumed as 25°C in Figure 15, 16).  
0
tav = Average time in avalanche.  
D = Duty cycle in avalanche = tav ·f  
25  
50  
75  
100  
125  
150  
175  
ZthJC(D, tav) = Transient thermal resistance, see figure 11)  
Starting T , Junction Temperature (°C)  
J
PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC  
Iav = 2DT/ [1.3·BV·Zth]  
EAS (AR) = PD (ave)·tav  
Fig 16. Maximum Avalanche Energy  
vs.Temperature  
8
www.irf.com  
AUIRLR/U3114Z  
Driver Gate Drive  
P.W.  
P.W.  
D =  
D.U.T  
Period  
Period  
+
*
=10V  
V
GS  
ƒ
CircuitLayoutConsiderations  
LowStrayInductance  
Ground Plane  
LowLeakageInductance  
Current Transformer  
-
D.U.T. I Waveform  
SD  
+
Reverse  
Recovery  
Current  
‚
Body Diode Forward  
„
Current  
di/dt  
-
+
-
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  

V
DD  
VDD  
dv/dtcontrolledbyRG  
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
Re-Applied  
Voltage  
RG  
+
-
Body Diode  
Forward Drop  
Inductor Curent  
I
SD  
Ripple 5%  
* VGS = 5V for Logic Level Devices  
Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel  
HEXFET® Power MOSFETs  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
10V  
PulseWidth ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 18a. Switching Time Test Circuit  
V
DS  
90%  
10%  
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 18b. Switching Time Waveforms  
www.irf.com  
9
AUIRLR/U3114Z  
D-Pak (TO-252AA) Package Outline  
Dimensions are shown in millimeters (inches)  
D-Pak (TO-252AA) Part Marking Information  
PartNumber  
AULR3114Z  
DateCode  
Y= Year  
WW= Work Week  
A= Automotive, Lead Free  
IRLogo  
YWWA  
XX or XX  
LotCode  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
10  
www.irf.com  
AUIRLR/U3114Z  
I-Pak (TO-251AA) Package Outline ( Dimensions are shown in millimeters (inches)  
I-Pak (TO-251AA) Part Marking Information  
PartNumber  
AULU3114Z  
DateCode  
Y= Year  
WW= Work Week  
A= Automotive, Lead Free  
IRLogo  
YWWA  
XX or XX  
LotCode  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
www.irf.com  
11  
AUIRLR/U3114Z  
D-Pak (TO-252AA) Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
TR  
TRL  
TRR  
16.3 ( .641 )  
15.7 ( .619 )  
16.3 ( .641 )  
15.7 ( .619 )  
12.1 ( .476 )  
11.9 ( .469 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
FEED DIRECTION  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
13 INCH  
16 mm  
NOTES :  
1. OUTLINE CONFORMS TO EIA-481.  
12  
www.irf.com  
AUIRLR/U3114Z  
Ordering Information  
Base part  
Package Type  
Standard Pack  
Complete Part Number  
Form  
Quantity  
AUIRLR3114Z  
DPak  
IPak  
Tube  
Tape and Reel  
Tape and Reel Left  
Tape and Reel Right  
Tube  
75  
AUIRLR3114Z  
AUIRLR3114ZTR  
AUIRLR3114ZTRL  
AUIRLR3114ZTRR  
AUIRLU3114Z  
2000  
3000  
3000  
75  
AUIRLU3114Z  
www.irf.com  
13  
AUIRLR/U3114Z  
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IR products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the  
body, or in other applications intended to support or sustain life, or in any other application in which the failure of the IR product  
could create a situation where personal injury or death may occur. Should Buyer purchase or use IR products for any such  
unintended or unauthorized application, Buyer shall indemnify and hold International Rectifier and its officers, employees,  
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney  
fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized  
use, even if such claim alleges that IR was negligent regarding the design or manufacture of the product.  
OnlyproductscertifiedasmilitarygradebytheDefenseLogisticsAgency(DLA)oftheUSDepartmentofDefense,aredesigned  
and manufactured to meet DLA military specifications required by certain military, aerospace or other applications. Buyers  
acknowledgeandagreethatanyuseofIRproductsnotcertifiedbyDLAasmilitary-grade,inapplicationsrequiringmilitarygrade  
products, is solely at the Buyer’s own risk and that they are solely responsible for compliance with all legal and regulatory  
requirements in connection with such use.  
IRproductsareneitherdesignednorintendedforuseinautomotiveapplicationsorenvironmentsunlessthespecificIRproducts  
are designated by IR as compliant with ISO/TS 16949 requirements and bear a part number including the designation “AU”.  
Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, IR will not be  
responsible for any failure to meet such requirements.  
For technical support, please contact IR’s Technical Assistance Center  
http://www.irf.com/technical-info/  
WORLDHEADQUARTERS:  
101 N. Sepulveda Blvd., El Segundo, California 90245  
Tel:(310)252-7105  
14  
www.irf.com  

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