BAS21E6327XT [INFINEON]

Rectifier Diode, 1 Element, 0.25A, 200V V(RRM), Silicon,;


型号：	BAS21E6327XT
厂家：	Infineon
描述：	Rectifier Diode, 1 Element, 0.25A, 200V V(RRM), Silicon, 光电二极管
文件：	总9页 (文件大小：117K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BAS21...

Silicon Switching Diode

• For high-speed switching applications

• High breakdown voltage

• Pb-free (RoHS compliant) package

• Qualified according AEC Q101

BAS21

BAS21-03W

BAS21U

Type

Package

SOT23

SOD323

SC74

Configuration

single

Marking

JSs

BAS21

BAS21-03W

BAS21U

single

parallel triple

JSs

Maximum Ratings at T = 25°C, unless otherwise specified

Parameter

Symbol

Value

200

Unit

Diode reverse voltage

Peak reverse voltage

Forward current

250

625

Peak forward current

625

Surge forward current, t = 10 µs

Non-repetitive peak surge forward current

Total power dissipation

FSM

tot

BAS21, T ≤ 70°C

350

250

BAS21-03W, T ≤ 124°C

BAS21U, T ≤ 122°C

150

°C

Junction temperature

Storage temperature

-65 ... 150

stg

¹Pb-containing package may be available upon special request

2007-04-19

BAS21...

Thermal Resistance

Parameter

Symbol

Value

Unit

K/W

Junction - soldering point

BAS21

thJS

≤ 230

≤ 105

≤ 110

BAS21-03W

BAS21U

Electrical Characteristics at T = 25°C, unless otherwise specified

Parameter

Symbol

Values

Unit

min.

typ. max.

DC Characteristics

250

Breakdown voltage

(BR)

= 100 µA

(BR)

Reverse current

V = 200 V

µA

0.1

V = 200 V, T = 150 °C

100

Forward voltage

I = 100 mA

I = 200 mA

1.25

AC Characteristics

Diode capacitance

V = 0 V, f = 1 MHz

Reverse recovery time

I = 30 mA, I = 30 mA, measured at I = 3mA,

R = 100 Ω

Test circuit for reverse recovery time

D.U.T.

Puls generator: t = 1µs, D = 0.05

t = 0.6ns, R = 50Ω

Oscillograph

Ι _F

Oscillograph: R = 50Ω , t = 0.35ns, C ≤ 1pF

EHN00018

¹For calculation of R_thJAplease refer to Application Note Thermal Resistance

2007-04-19

BAS21...

Reverse current I = ƒ (T )

Forward Voltage V = ƒ (T )

F A

V = 200V

I = Parameter

BAS 19...21

EHB00029

BAS 19...21

EHB00027

10²

1.5

Ι _F= 625 mA

V_F

Ι _R

max

10¹

250 mA

100 mA

1.0

0.5

typ.

10⁰

10 mA

10^-1

10^-2

0.0

100

150

100

˚C 150

˚C

T_A

Forward current I = ƒ (V )

Forward current I = ƒ (T )

F S

BAS21-03W

BAS 19...21

EHB00028

800

700

300

Ι_F

600

500

400

300

200

100

200

150

100

°C

15 30 45 60 75 90 105 120

150

0.0

0.5

1.0

1.5

V_F

2007-04-19

BAS21...

Forward current I = ƒ (T )

Permissible Puls Load R

= ƒ (t )

thJS

BAS21U

BAS21

10 ³

10 ²

10 ¹

10 ⁰

10 ^-1

250

150

100

D = 0.5

0.2

0.1

0.05

0.02

0.01

0.005

10 ^-6

10 ^-5

10 ^-4

10 ^-3

10 ^-2

10 ⁰

°C

15 30 45 60 75 90 105 120

150

Permissible Pulse Load

Permissible Puls Load R

= ƒ (t )

thJS p

/ I

= ƒ (t )

BAS21-03W

Fmax FDC

BAS21

10 ²

10 ³

K/W

10 ²

10 ¹

10 ⁰

10 ^-1

D = 0

0.005

0.01

0.02

0.05

0.1

D=0.5

0.2

0.1

0.05

0.02

0.01

0.005

10 ¹

0.2

0.5

10 ⁰

10 ^-6

10 ^-5

10 ^-4

10 ^-3

10 ^-2

10 ⁰

10 ^-6

10 ^-5

10 ^-4

10 ^-3

10 ^-2

10 ⁰

2007-04-19

BAS21...

Permissible Pulse Load

/ I = ƒ (t )

Permissible Puls Load R

= ƒ (t )

thJS p

BAS21U

Fmax FDC

BAS21-03W

10 ²

10 ³

K/W

D=0

0.005

0.01

0.02

0.05

0.1

10 ²

0.2

0.5

10 ¹

D=0.5

0.2

0.1

0.05

0.02

0.01

0.005

10 ⁰

10 ^-6

10 ^-1

10 ^-5

10 ^-4

10 ^-3

10 ^-2

10 ⁰

10 ^-6

10 ^-5

10 ^-4

10 ^-3

10 ^-2

10 ⁰

Permissible Pulse Load

/ I

= ƒ (t )

Fmax FDC

BAS21U

10 ²

D=0

0.005

0.01

0.02

0.05

0.1

10 ¹

0.2

0.5

10 ⁰

10 ^-6

10 ^-5

10 ^-4

10 ^-3

10 ^-2

10 ⁰

2007-04-19

Package SC74

BAS21...

Package Outline

±0.2

2.9

1.1 MAX.

(2.25)

+0.1

-0.06

0.15

(0.35)

+0.1

-0.05

0.35

0.95

0.2

B 6x

Pin 1

marking

0.1 MAX.

0.2

1.9

Foot Print

0.5

0.95

Marking Layout (Example)

Small variations in positioning of

Date code, Type code and Manufacture are possible.

Manufacturer

2005, June

Date code (Year/Month)

Pin 1 marking

Laser marking

BCW66H

Type code

Standard Packing

Reel ø180 mm = 3.000 Pieces/Reel

Reel ø330 mm = 10.000 Pieces/Reel

For symmetric types no defined Pin 1 orientation in reel.

0.2

3.15

1.15

Pin 1

marking

2007-04-19

Package SOD323

BAS21...

Package Outline

+0.2

-0.1

0.9

+0.2

-0.1

1.25

±0.05

Cathode

marking

+0.1

-0.05

+0.05

0.3

-0.2

0.3

+0.1

-0.06

0.15

0.25

Foot Print

0.6

Marking Layout (Example)

BAR63-03W

Type code

Cathode marking

Laser marking

Standard Packing

Reel ø180 mm = 3.000 Pieces/Reel

Reel ø330 mm = 10.000 Pieces/Reel

0.2

0.65

1.35

Cathode

marking

2007-04-19

Package SOT23

BAS21...

Package Outline

±0.1

0.1 MAX.

±0.1

2.9

+0.1

-0.05

0.4

0.08...0.15

0.95

0...8˚

1.9

0.25 B C

1) Lead width can be 0.6 max. in dambar area

0.2

Foot Print

0.8

1.2

Marking Layout (Example)

Manufacturer

2005, June

Date code (YM)

Pin 1

BCW66

Type code

Standard Packing

Reel ø180 mm = 3.000 Pieces/Reel

Reel ø330 mm = 10.000 Pieces/Reel

0.2

0.9

1.15

3.15

Pin 1

2007-04-19

BAS21...

Edition 2006-02-01

Published by

Infineon Technologies AG

81726 München, Germany

Attention please!

The information given in this dokument shall in no event be regarded as a guarantee

of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any

examples or hints given herein, any typical values stated herein and/or any information

regarding the application of the device, Infineon Technologies hereby disclaims any

and all warranties and liabilities of any kind, including without limitation warranties of

non-infringement of intellectual property rights of any third party.

Information

For further information on technology, delivery terms and conditions and prices

please contact your nearest Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements components may contain dangerous substances.

For information on the types in question please contact your nearest

Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or

systems with the express written approval of Infineon Technologies, if a failure of

such components can reasonably be expected to cause the failure of that

life-support device or system, or to affect the safety or effectiveness of that

device or system.

Life support devices or systems are intended to be implanted in the human body,

or to support and/or maintain and sustain and/or protect human life. If they fail,

it is reasonable to assume that the health of the user or other persons

may be endangered.

2007-04-19

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