BAS40-06B5003 [INFINEON]

Rectifier Diode, Schottky, 2 Element, 0.12A, 40V V(RRM), Silicon, SOT-23, 3-PIN;
BAS40-06B5003
型号: BAS40-06B5003
厂家: Infineon    Infineon
描述:

Rectifier Diode, Schottky, 2 Element, 0.12A, 40V V(RRM), Silicon, SOT-23, 3-PIN

文件: 总8页 (文件大小:219K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BAS40...B5000 / B5003  
Silicon Schottky Diode  
General-purpose diode for high-speed switchhing  
Circuit protected  
Voltage clamping  
High-level detecting and mixing  
Improved operating temperature range  
due to extra-low thermal resistance  
(see attached Forward current curves)  
High volume packing size:  
B5000: 9 x 10k reels, B5003: 10 x 3k reels  
Not for automotive applications*  
BAS40  
BAS40-04  
BAS40-05  
BAS40-06  
3
3
3
3
D
2
D
2
D
1
D
1
D
1
D
2
1
2
1
2
1
2
1
2
Type  
Package  
SOT23  
SOT23  
SOT23  
SOT23  
Configuration  
single  
series  
common cathode  
common anode  
L (nH) Marking  
S
BAS40  
1.8  
1.8  
1.8  
1.8  
43s  
44s  
45s  
46s  
BAS40-04  
BAS40-05  
BAS40-06  
* Automotive qualification ongoing  
2006-08-04  
1
BAS40...B5000 / B5003  
Maximum Ratings at T = 25°C, unless otherwise specified  
A
Parameter  
Diode reverse voltage  
Forward current  
Non-repetitive peak surge forward current  
(t ≤ 10 µσ)  
Symbol  
V
R
Value  
40  
120  
200  
Unit  
V
mA  
I
F
I
FSM  
mW  
°C  
Total power dissipation  
P
tot  
BAS40, T ≤ 118 °C  
250  
250  
250  
s
BAS40-04, BAS40-06, T ≤ 110° C  
s
BAS40-05, T ≤ 104°C  
s
150  
Junction temperature  
T
j
Operating temperature range  
Storage temperature  
T
-55 ... 125  
-55 ... 150  
op  
T
stg  
Thermal Resistance  
Parameter  
Junction - soldering point  
Symbol  
R
thJS  
Value  
Unit  
K/W  
1)  
BAS40  
BAS40-04, BAS40-06  
BAS40-05  
130  
160  
185  
1For calculation of R  
please refer to Application Note Thermal Resistance  
thJA  
2006-08-04  
2
BAS40...B5000 / B5003  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
Unit  
min.  
40  
-
typ. max.  
DC Characteristics  
Breakdown voltage  
-
-
-
V
V
(BR)  
F
I
= 10 µA  
(BR)  
1
Reverse current  
I
µA  
R
V = 30 V  
R
mV  
Forward voltage  
V
I = 1 mA  
250  
350  
600  
310  
450  
720  
380  
500  
1000  
F
I = 10 mA  
F
I = 40 mA  
F
1)  
-
-
20  
Forward voltage matching  
V  
F
I = 10 mA  
F
AC Characteristics  
Diode capacitance  
-
3
5
-
pF  
C
R
T
F
rr  
V = 0 , f = 1 MHz  
R
Differential forward resistance  
-
-
10  
-
I = 10 mA, f = 10 kHz  
F
100 ps  
Charge carrier life time  
τ
I = 25 mA  
F
1V is the difference between lowest and highestV in a multiple diode component.  
F
F
2006-08-04  
3
BAS40...B5000 / B5003  
Diode capacitance C = ƒ (V )  
Forward resistance r = ƒ (I )  
f F  
T
R
f = 1MHz  
f = 1MHz  
BAS 40...  
EHB00040  
BAS 40...  
EHB00041  
10 3  
5
pF  
4
CT  
rf  
10 2  
10 1  
10 3  
3
2
1
0
1
10  
mA 100  
0.1  
0
10  
20  
V
30  
VR  
Ι F  
Reverse current I = ƒ (T )  
Reverse current I = ƒ(V )  
R R  
R
A
V = Parameter  
T = Parameter  
R
A
10 -4  
A
BAS 40...  
EHB00039  
103  
Ι R  
µ A  
TA = 150 C  
102  
101  
100  
10-1  
10 -5  
10 -6  
10 -7  
10 -8  
85 C  
VR = 40V  
30V  
20V  
10V  
25 C  
10-2  
0
°C  
0
25  
50  
75  
100  
150  
10  
20  
30  
V
40  
T
A
VR  
2006-08-04  
4
BAS40...B5000 / B5003  
Forward Voltage V = ƒ (T )  
Forward current I = ƒ (V )  
F F  
F
A
I = Parameter  
F
BAS 40...  
EHB00038  
10 2  
mA  
0.8  
V
ΙF  
10 1  
10 0  
10-1  
10-2  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
IF = 40 mA  
10 mA  
1 mA  
0.1 mA  
10 µA  
TA = -40 ˚C  
25 ˚C  
1 µA  
85 ˚C  
150 ˚C  
0
°C  
-50 -25  
0
25  
50  
75  
100  
150  
0.0  
0.5  
1.0  
V
1.5  
T
A
VF  
Forward current I = ƒ (T )  
Forward current I = ƒ (T )  
F
S
F
S
BAS40B500X  
BAS40-04 / -06B500X  
BAS40Exxxx (e.g. E6327)  
BAS40-04/-06Exxxx (e.g. E6327)  
140  
140  
mA  
mA  
100  
100  
BAS40B500x  
80  
80  
BAS40Exxxx  
BAS40-04/-06B500x  
BAS40-04/-06Exxxx  
60  
40  
20  
0
60  
40  
20  
0
°C  
°C  
0
15 30 45 60 75 90 105 120  
150  
0
15 30 45 60 75 90 105 120  
150  
TS  
TS  
2006-08-04  
5
BAS40...B5000 / B5003  
Forward current I = ƒ (T )  
F
S
BAS40-05B500X  
BAS40-05Exxxx (e.g. E6327)  
140  
mA  
100  
80  
BAS40-05B500x  
BAS40-05Exxxx  
60  
40  
20  
0
°C  
0
15 30 45 60 75 90 105 120  
150  
TS  
2006-08-04  
6
Package SOT23  
BAS40...B5000 / B5003  
Package Outline  
±0.1  
1
0.1 MAX.  
±0.1  
2.9  
B
3
1
2
1)  
+0.1  
-0.05  
0.4  
A
0.08...0.15  
C
0.95  
0...8˚  
1.9  
0.25 B C  
1) Lead width can be 0.6 max. in dambar area  
M
M
0.2  
A
Foot Print  
0.8  
0.8  
1.2  
Marking Layout (Example)  
Manufacturer  
2005, June  
Date code (YM)  
EH  
s
Pin 1  
BCW66  
Type code  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
4
0.2  
0.9  
1.15  
3.15  
Pin 1  
2006-08-04  
7
BAS40...B5000 / B5003  
Edition 2006-02-01  
Published by  
Infineon Technologies AG  
81726 München, Germany  
© Infineon Technologies AG 2006.  
All Rights Reserved.  
Attention please!  
The information given in this dokument shall in no event be regarded as a guarantee  
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any  
examples or hints given herein, any typical values stated herein and/or any information  
regarding the application of the device, Infineon Technologies hereby disclaims any  
and all warranties and liabilities of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices  
please contact your nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest  
Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or  
systems with the express written approval of Infineon Technologies, if a failure of  
such components can reasonably be expected to cause the failure of that  
life-support device or system, or to affect the safety or effectiveness of that  
device or system.  
Life support devices or systems are intended to be implanted in the human body,  
or to support and/or maintain and sustain and/or protect human life. If they fail,  
it is reasonable to assume that the health of the user or other persons  
may be endangered.  
2006-08-04  
8

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