BCP5616H6327XTSA1 [INFINEON]

Small Signal Bipolar Transistor, 1A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon, GREEN, PLASTIC PACKAGE-4;
BCP5616H6327XTSA1
型号: BCP5616H6327XTSA1
厂家: Infineon    Infineon
描述:

Small Signal Bipolar Transistor, 1A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon, GREEN, PLASTIC PACKAGE-4

文件: 总7页 (文件大小:821K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BCP54...-BCP56...  
NPN Silicon AF Transistors  
For AF driver and output stages  
High collector current  
Low collector-emitter saturation voltage  
Complementary types: BCP51...BCP53 (PNP)  
Pb-free (RoHS compliant) package  
Qualified according AEC Q101  
Type  
Marking  
Pin Configuration  
Package  
BCP54  
BCP54-16  
BCP55  
BCP55-16  
BCP56-10  
BCP56-16  
*
*
*
*
*
*
1=B 2=C 3=E 4=C  
-
-
-
-
-
-
-
-
-
-
-
-
SOT223  
SOT223  
SOT223  
SOT223  
SOT223  
SOT223  
1=B 2=C 3=E 4=C  
1=B 2=C 3=E 4=C  
1=B 2=C 3=E 4=C  
1=B 2=C 3=E 4=C  
1=B 2=C 3=E 4=C  
* Marking is the same as the type-name  
2011-10-13  
1
BCP54...-BCP56...  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
V
Collector-emitter voltage  
BCP54  
BCP55  
V
V
V
CEO  
CBO  
EBO  
45  
60  
80  
BCP56  
Collector-base voltage  
BCP54  
BCP55  
45  
60  
100  
BCP56  
5
1
Emitter-base voltage  
Collector current  
A
I
C
1.5  
100  
200  
2
Peak collector current, t 10 ms  
Base current  
Peak base current  
Total power dissipation-  
I
I
B
I
BM  
P
p
CM  
mA  
W
tot  
T 120°C  
S
150  
°C  
Junction temperature  
Storage temperature  
T
j
T
-65 ... 150  
stg  
Thermal Resistance  
Parameter  
Symbol  
Value  
15  
Unit  
K/W  
1)  
Junction - soldering point  
1
R
thJS  
For calculation of R  
please refer to Application Note AN077 (Thermal Resistance Calculation)  
thJA  
2011-10-13  
2
BCP54...-BCP56...  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
DC Characteristics  
Collector-emitter breakdown voltage  
V
V
V
V
(BR)CEO  
(BR)CBO  
(BR)EBO  
I = 10 mA, I = 0 , BCP54...  
45  
60  
80  
-
-
-
-
-
-
C
B
I = 10 mA, I = 0 , BCP55...  
C
B
I = 10 mA, I = 0 , BCP56-10, -16  
C
B
Collector-base breakdown voltage  
I = 100 µA, I = 0 , BCP54...  
45  
60  
100  
-
-
-
-
-
-
C
E
I = 100 µA, I = 0 , BCP55...  
C
E
I = 100 µA, I = 0 , BCP56-10, -16  
C
E
Emitter-base breakdown voltage  
I = 10 µA, I = 0  
5
-
-
E
C
Collector-base cutoff current  
I
µA  
-
CBO  
V
V
= 30 V, I = 0  
-
-
-
-
0.1  
20  
CB  
CB  
E
= 30 V, I = 0 , T = 150 °C  
E
A
1)  
DC current gain  
I = 5 mA, V = 2 V  
h
FE  
25  
40  
63  
100  
25  
-
-
-
C
CE  
I = 150 mA, V = 2 V, BCP54/BCP55  
250  
160  
250  
-
C
CE  
I = 150 mA, V = 2 V, BCP56-10  
100  
160  
-
C
CE  
I = 150 mA, V = 2 V, BCP54-16...BCP56-16  
C
CE  
I = 500 mA, V = 2 V  
C
CE  
1)  
Collector-emitter saturation voltage  
I = 500 mA, I = 50 mA  
V
-
-
0.5  
V
CEsat  
C
B
1)  
Base-emitter voltage  
I = 500 mA, V = 2 V  
V
BE(ON)  
-
-
1
C
CE  
AC Characteristics  
Transition frequency  
-
100  
-
MHz  
f
T
I = 50 mA, V = 10 V, f = 100 MHz  
C
CE  
1
Pulse test: t < 300µs; D < 2%  
2011-10-13  
3
BCP54...-BCP56...  
DC current gain h = ƒ(I )  
Collector-emitter saturation voltage  
FE  
C
V
= 2 V  
I = ƒ(V  
), h = 10  
CE  
C
CEsat FE  
BCP 54...56  
EHP00268  
103  
BCP 54...56  
EHP00271  
104  
5
h FE  
mA  
Ι C  
103  
102  
101  
100  
100  
25  
C
C
102  
5
-50  
C
100 C  
25 C  
-50 C  
101  
5
100  
0
0.2  
0.4  
0.6  
V
0.8  
100  
101  
102  
103 mA 104  
Ι C  
VCEsat  
Base-emitter saturation voltage  
Collector cutoff current I  
= ƒ(T )  
CBO A  
I = ƒ(V  
), h = 10  
V
= 30 V  
C
BEsat  
FE  
CBO  
BCP 54...56  
EHP00270  
BCP 54...56  
EHP00269  
104  
104  
nA  
Ι C  
mA  
103  
Ι CBO  
max  
103  
100  
25  
-50  
C
C
C
102  
101  
102  
101  
100  
typ  
100  
10-1  
0
0.2  
0.4  
0.6  
0.8  
V
1.2  
0
50  
100  
C
150  
VBEsat  
TA  
2011-10-13  
4
BCP54...-BCP56...  
Transition frequency f = ƒ(I )  
Total power dissipation P = ƒ(T )  
tot S  
T
C
V
= 10 V  
CE  
BCP 54...56  
EHP00267  
103  
2.4  
W
MHz  
5
f T  
1.6  
1.2  
0.8  
0.4  
0
102  
5
101  
100  
5 101  
5 102  
mA  
ΙC  
103  
°C  
0
15 30 45 60 75 90 105 120  
150  
T
S
Permissible Pulse Load R  
= ƒ(t )  
Permissible Pulse Load  
thJS  
p
P
/P  
= ƒ(t )  
totmax totDC  
p
10 2  
10 3  
-
D = 0  
0.005  
0.01  
0.02  
0.05  
0.1  
10 1  
10 0  
10 -1  
10 2  
10 1  
10 0  
D = 0,5  
0,2  
0.2  
0.5  
0,1  
0,05  
0,02  
0,01  
0,005  
0
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
s
s
t
t
p
p
2011-10-13  
5
Package SOT223  
BCP54...-BCP56...  
Package Outline  
0.1  
1.6  
0.2  
6.5  
A
0.1  
0.1 MAX.  
3
B
4
3
1
2
2.3  
0.1  
0.7  
0.28  
0.0  
4
4.6  
0...10˚  
M
0.25  
A
M
0.25  
B
Foot Print  
3.5  
1.2 1.1  
Marking Layout (Example)  
Manufacturer  
2005, 24 CW  
Date code (YYWW)  
BCP52-16  
Type code  
Pin 1  
Packing  
Reel ø180 mm = 1.000 Pieces/Reel  
Reel ø330 mm = 4.000 Pieces/Reel  
0.3 MAX.  
8
1.75  
6.8  
Pin 1  
2011-10-13  
6
BCP54...-BCP56...  
Edition 2009-11-16  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
2009 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee  
of conditions or characteristics. With respect to any examples or hints given herein,  
any typical values stated herein and/or any information regarding the application of  
the device, Infineon Technologies hereby disclaims any and all warranties and  
liabilities of any kind, including without limitation, warranties of non-infringement of  
intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices,  
please contact the nearest Infineon Technologies Office (<www.infineon.com>).  
Warnings  
Due to technical requirements, components may contain dangerous substances.  
For information on the types in question, please contact the nearest Infineon  
Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems  
only with the express written approval of Infineon Technologies, if a failure of such  
components can reasonably be expected to cause the failure of that life-support  
device or system or to affect the safety or effectiveness of that device or system.  
Life support devices or systems are intended to be implanted in the human body or  
to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be  
endangered.  
2011-10-13  
7

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