BFR705L3RH [INFINEON]

RF Small Signal Bipolar Transistor, 0.01A I(C), 1-Element, X Band, Silicon Germanium, NPN, 0.32 MM HEIGHT, ROHS COMPLIANT, FLAT LEADLESS, TSLP-3-9, 3 PIN;
BFR705L3RH
型号: BFR705L3RH
厂家: Infineon    Infineon
描述:

RF Small Signal Bipolar Transistor, 0.01A I(C), 1-Element, X Band, Silicon Germanium, NPN, 0.32 MM HEIGHT, ROHS COMPLIANT, FLAT LEADLESS, TSLP-3-9, 3 PIN

放大器 晶体管
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BFR705L3RH  
NPN Silicon Germanium RF Transistor*  
High gain ultra low noise RF transistor  
for low current operation  
3
1
Ideal for low power consumption LNA design  
Provides outstanding performance for  
a wide range of wireless applications  
up to 10 GHz and more  
2
Outstanding noise figure F = 0.5 dB at 1.8 GHz  
Outstanding noise figure F = 0.8 dB at 6 GHz  
High maximum stable and available gain at only 7mA  
G
= 25 dB at 1.8 GHz, G = 18 dB at 6 GHz  
ma  
ms  
150 GHz f -Silicon Germanium technology  
T
Extremely small and flat leadless package,  
height 0.32 mm max.  
1)  
Pb-free (RoHS compliant) package  
Qualified according AEC Q101  
* Short term description  
ESD (Electrostatic discharge) sensitive device, observe handling precaution!  
Type  
Marking  
Pin Configuration  
2=C 3=E  
Package  
BFR705L3RH  
R1  
TSLP-3-9  
1=B  
1Pb-containing package may be available upon special request  
2007-03-30  
1
BFR705L3RH  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
V
Collector-emitter voltage  
V
CEO  
T > 0°C  
4
A
T 0°C  
3.5  
A
13  
Collector-emitter voltage  
Collector-base voltage  
Emitter-base voltage  
Collector current  
V
V
V
CES  
CBO  
EBO  
13  
1.2  
10  
1
mA  
I
I
C
Base current  
B
1)  
40  
mW  
°C  
Total power dissipation , T 123 °C  
P
T
T
T
S
tot  
j
150  
Junction temperature  
Ambient temperature  
Storage temperature  
-65 ... 150  
-65 ... 150  
A
stg  
Thermal Resistance  
Parameter  
Symbol  
Value  
Unit  
2)  
K/W  
Junction - soldering point  
R
665  
thJS  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
DC Characteristics  
4
4.7  
-
V
Collector-emitter breakdown voltage  
V
(BR)CEO  
I = 1 mA, I = 0  
C
B
-
-
30  
µA  
Collector-emitter cutoff current  
= 13 V, V = 0  
I
CES  
V
CE  
BE  
-
-
-
-
100 nA  
Collector-base cutoff current  
= 5 V, I = 0  
I
CBO  
V
CB  
E
1
µA  
-
Emitter-base cutoff current  
= 0.5 V, I = 0  
I
EBO  
V
EB  
C
160  
250  
400  
DC current gain  
I = 7 mA, V = 3 V, pulse measured  
h
FE  
C
CE  
1T is measured on the collector lead at the soldering point to the pcb  
S
2For calculation of R  
please refer to Application Note Thermal Resistance  
thJA  
2007-03-30  
2
BFR705L3RH  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
AC Characteristics (verified by random sampling)  
-
39  
-
GHz  
Transition frequency  
f
T
I = 7 mA, V = 3 V, f = 1 GHz  
C
CE  
-
-
-
0.04  
0.08 pF  
Collector-base capacitance  
= 3 V, f = 1 MHz, V = 0 ,  
C
C
C
F
cb  
ce  
eb  
V
CB  
BE  
emitter grounded  
0.15  
0.18  
-
-
Collector emitter capacitance  
V
= 3 V, f = 1 MHz, V = 0 ,  
BE  
CE  
base grounded  
Emitter-base capacitance  
V
= 0.5 V, f = 1 MHz, V = 0 ,  
CB  
EB  
collector grounded  
Noise figure  
dB  
I = 3 mA, V = 3 V, f = 1.8 GHz, Z = Z  
Sopt  
-
-
0.5  
0.8  
-
-
C
CE  
S
I = 3 mA, V = 3 V, f = 6 GHz, Z = Z  
Sopt  
C
CE  
S
1)  
Power gain, maximum stable  
G
G
-
25  
-
dB  
dB  
ms  
ma  
I = 7 mA, V = 3 V, Z = Z  
,
C
CE  
S
Sopt  
Z = Z  
L
, f = 1.8 GHz  
Lopt  
1)  
-
18  
-
Power gain, maximum available  
I = 7 mA, V = 3 V, Z = Z ,  
Sopt  
C
CE  
S
Z = Z  
, f = 6 GHz  
Lopt  
L
2
Transducer gain  
|S  
|
dB  
21e  
I = 7 mA, V = 3 V, Z = Z = 50 ,  
C
CE  
S
L
f = 1.8 GHz  
-
-
21  
14  
-
-
f = 6 GHz  
1/2  
| (k-(k²-1) ), G  
ms  
1G  
ma  
= |S  
/ S  
= |S  
/ S  
|
21e 12e  
21e 12e  
2007-03-30  
3
BFR705L3RH  
Total power dissipation P = ƒ(T )  
Permissible Puls Load R  
= ƒ (t )  
tot  
S
thJS  
p
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
D = 0.5  
D = 0.2  
D = 0.1  
D = 0.05  
D = 0.02  
D = 0.01  
D = 0.005  
D = 0  
2
10  
tp  
D=tp /T  
T
1
0
10  
0
15  
30  
45  
60  
75  
90  
105  
120  
135  
150  
−8  
10  
−6  
10  
−4  
10  
−2  
10  
0
10  
TS [°C]  
tp [s]  
Permissible Pulse Load  
Collector-base capacitance C = ƒ (V )  
cb CB  
P
/P  
= ƒ(t )  
f = 1 MHz  
totmax totDC  
p
2
10  
0.1  
0.09  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
tp  
D=tp /T  
T
D = 0  
D = 0.005  
D = 0.01  
D = 0.02  
D = 0.05  
D = 0.1  
1
10  
D = 0.2  
D = 0.5  
0
10  
0
0
−8  
−6  
10  
−4  
10  
−2  
10  
0
10  
2
4
6
8
10  
12  
10  
VCB [V]  
tp [s]  
2007-03-30  
4
BFR705L3RH  
Transition frequency f = ƒ(I )  
Power gain G , G = ƒ (f)  
ma ms  
T
C
V
= parameter, f = 1 GHz  
V
= 2 V, I = 7 mA  
CE C  
CE  
45  
45  
2V to 4V  
40  
35  
30  
25  
20  
15  
10  
5
40  
35  
30  
25  
20  
15  
10  
5
1.00V  
Gms  
2
|S21|  
0.75V  
0.50V  
0
0
2
4
6
8
10  
12  
0
1
2
3
4
5
6
IC [mA]  
f [GHz]  
Power gain G , G = ƒ (I )  
Power gain G , G = ƒ (V )  
ma ms CE  
ma  
ms  
C
V
= 3 V  
I = 7 mA  
CE  
C
f = parameter  
f = parameter  
32  
32  
29  
26  
23  
20  
17  
14  
11  
8
0.90GHz  
1.80GHz  
0.90GHz  
1.80GHz  
28  
24  
20  
16  
12  
8
2.40GHz  
3.00GHz  
2.40GHz  
3.00GHz  
4.00GHz  
5.00GHz  
6.00GHz  
4.00GHz  
5.00GHz  
6.00GHz  
5
0
2
4
6
8
10  
12  
0
0.5  
1
1.5  
2
2.5  
VCE [V]  
3
3.5  
4
4.5  
5
IC [mA]  
2007-03-30  
5
Package TSLP-3-9  
BFR705L3RH  
Package Outline  
Top view  
Bottom view  
±0.05  
0.6  
+0.01  
-0.02  
1)  
0.31  
±0.035  
0.5  
3
2
3
1
1
2
±0.05  
0.35  
Pin 1  
marking  
1)  
±0.035  
2x0.15  
1) Dimension applies to plated terminal  
Foot Print  
For board assembly information please refer to Infineon website "Packages"  
0.6  
0.5  
R0.19  
R0.1  
0.2  
0.2  
0.17  
0.225  
0.225  
0.15  
Copper  
Solder mask  
Stencil apertures  
Marking Layout (Example)  
BFR705L3RH  
Type code  
Pin 1 marking  
Laser marking  
Standard Packing  
Reel ø180 mm = 15.000 Pieces/Reel  
0.35  
4
0.8  
Pin 1  
marking  
2007-03-30  
6
BFR705L3RH  
Edition 2006-02-01  
Published by  
Infineon Technologies AG  
81726 München, Germany  
© Infineon Technologies AG 2007.  
All Rights Reserved.  
Attention please!  
The information given in this dokument shall in no event be regarded as a guarantee  
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any  
examples or hints given herein, any typical values stated herein and/or any information  
regarding the application of the device, Infineon Technologies hereby disclaims any  
and all warranties and liabilities of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices  
please contact your nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest  
Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or  
systems with the express written approval of Infineon Technologies, if a failure of  
such components can reasonably be expected to cause the failure of that  
life-support device or system, or to affect the safety or effectiveness of that  
device or system.  
Life support devices or systems are intended to be implanted in the human body,  
or to support and/or maintain and sustain and/or protect human life. If they fail,  
it is reasonable to assume that the health of the user or other persons  
may be endangered.  
2007-03-30  
7

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