BSPP100N06S2-05 [INFINEON]

Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET,;
BSPP100N06S2-05
型号: BSPP100N06S2-05
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET,

文件: 总8页 (文件大小:202K)
中文:  中文翻译
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SPP100N06S2-05  
SPB100N06S2-05  
OptiMOS Power-Transistor  
Product Summary  
Feature  
V
55  
4.7  
V
DS  
N-Channel  
R
max. SMD version  
mΩ  
A
DS(on)  
Enhancement mode  
175°C operating temperature  
Avalanche rated  
I
100  
D
P- TO263 -3-2  
P- TO220 -3-1  
dv/dt rated  
Type  
Package  
Ordering Code  
Marking  
PN0605  
PN0605  
SPP100N06S2-05 P- TO220 -3-1 Q67060-S6048  
SPB100N06S2-05 P- TO263 -3-2 Q67060-S6049  
Maximum Ratings, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Value  
Unit  
1)  
A
Continuous drain current  
I
D
T =25°C  
100  
100  
400  
C
Pulsed drain current  
I
D puls  
T =25°C  
C
810  
mJ  
Avalanche energy, single pulse  
E
AS  
I =80A, V =25V, R =25Ω  
D
DD  
GS  
2)  
E
30  
6
Repetitive avalanche energy, limited by T  
Reverse diode dv/dt  
AR  
jmax  
dv/dt  
kV/µs  
I =100A, V =44V, di/dt=200A/µs, T =175°C  
jmax  
S
DS  
Gate source voltage  
Power dissipation  
V
V
±20  
300  
GS  
P
W
tot  
T =25°C  
C
°C  
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
T , T  
-55... +175  
55/175/56  
j
stg  
Page 1  
2003-05-09  
SPP100N06S2-05  
SPB100N06S2-05  
Thermal Characteristics  
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Characteristics  
R
-
-
0.3  
-
0.5 K/W  
62  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient, leaded  
SMD version, device on PCB:  
@ min. footprint  
thJC  
R
thJA  
R
thJA  
-
-
-
-
62  
40  
2
3)  
@ 6 cm cooling area  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
Unit  
min.  
55  
typ. max.  
Static Characteristics  
V
-
-
V
Drain-source breakdown voltage  
(BR)DSS  
V
=0V, I =1mA  
D
GS  
2.1  
3
4
Gate threshold voltage, V = V  
V
GS(th)  
GS  
DS  
I
=250µA  
D
µA  
Zero gate voltage drain current  
I
DSS  
V
V
=55V, V =0V, T =25°C  
-
-
-
0.01  
1
1
DS  
DS  
GS  
j
=55V, V =0V, T =125°C  
100  
GS  
j
1
100 nA  
Gate-source leakage current  
I
GSS  
V
=20V, V =0V  
DS  
GS  
Drain-source on-state resistance  
R
mΩ  
DS(on)  
V
V
=10V, I =80A  
-
-
4
5
GS  
D
=10V, I =80A, SMD version  
3.7  
4.7  
GS  
D
1
Current limited by bondwire ; with an R  
= 0.5K/W the chip is able to carry I = 170A at 25°C, for detailed  
D
thJC  
information see app.-note ANPS071E available at www.infineon.com/optimos  
2
Defined by design. Not subject to production test.  
3
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Page 2  
2003-05-09  
SPP100N06S2-05  
SPB100N06S2-05  
Electrical Characteristics  
Parameter  
Symbol  
Conditions  
Values  
Unit  
min. typ. max.  
Dynamic Characteristics  
Transconductance  
g
V
2*I *R ,  
DS(on)max  
68  
135  
-
S
fs  
DS  
D
I =100A  
D
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
C
V
=0V, V =25V,  
-
-
-
-
-
-
-
5110 6800 pF  
1330 1760  
iss  
GS  
DS  
C
C
f=1MHz  
oss  
rss  
320  
21  
480  
32 ns  
47  
t
V
=30V, V =10V,  
d(on)  
DD GS  
I =100A,  
t
r
31  
D
R =2.2Ω  
G
Turn-off delay time  
Fall time  
t
59  
88  
d(off)  
t
30  
45  
f
Gate Charge Characteristics  
Gate to source charge  
Gate to drain charge  
Q
V
=44V, I =100A  
-
-
-
27  
53  
35 nC  
80  
gs  
DD  
D
Q
gd  
V
DD  
=44V, I =100A,  
130  
170  
Gate charge total  
Q
g
D
V
=0 to 10V  
GS  
V
=44V, I =100A  
-
-
5.4  
-
-
V
Gate plateau voltage  
V
I
DD  
D
(plateau)  
Reverse Diode  
T =25°C  
100 A  
400  
Inverse diode continuous  
forward current  
C
S
I
-
-
-
-
-
Inv. diode direct current, pulsed  
Inverse diode forward voltage  
Reverse recovery time  
SM  
V
=0V, I =80A  
0.9  
60  
1.3  
V
V
GS  
F
SD  
t
rr  
V =30V, I =l ,  
R
75 ns  
F S  
di /dt=100A/µs  
Reverse recovery charge  
Q
130  
160 nC  
F
rr  
Page 3  
2003-05-09  
SPP100N06S2-05  
SPB100N06S2-05  
1 Power dissipation  
= f (T )  
2 Drain current  
I = f (T )  
P
tot  
D
C
C
parameter: V 6 V  
parameter: V 10 V  
GS  
SPP100N06S2-05  
GS  
SPP100N06S2-05  
320  
110  
A
W
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
240  
200  
160  
120  
80  
40  
0
°C  
0
20 40 60 80 100 120 140 160  
190  
0
20 40 60 80 100 120 140 160 °C 190  
T
T
C
C
3 Safe operating area  
4 Max. transient thermal impedance  
Z = f (t )  
thJC  
I = f ( V  
)
D
DS  
p
parameter : D = 0 , T = 25 °C  
parameter : D = t /T  
p
C
3 SPP100N06S2-05  
SPP100N06S2-05  
1
10  
10  
K/W  
t
= 15.0µs  
p
A
0
10  
10  
10  
10  
10  
10  
2
-1  
-2  
-3  
-4  
-5  
10  
100 µs  
D = 0.50  
0.20  
1 ms  
1
10  
0.10  
0.05  
0.02  
single pulse  
0.01  
0
10  
10 -1  
10 0  
10 1  
10 2  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
V
s
t
V
p
DS  
Page 4  
2003-05-09  
SPP100N06S2-05  
SPB100N06S2-05  
5 Typ. output characteristic  
I = f (V ); T =25°C  
6 Typ. drain-source on resistance  
= f (I )  
R
D
DS(on)  
D
DS  
j
parameter: t = 80 µs  
parameter: V  
GS  
p
SPP100N06S2-05  
SPP100N06S2-05  
240  
16  
Ptot = 300W  
d
e
f
g
h
i
A
k
j
V
[V]  
GS  
200  
180  
160  
140  
120  
100  
80  
a
b
c
d
e
f
4.6  
4.8  
5.0  
5.2  
5.4  
5.6  
5.8  
6.0  
6.2  
6.4  
10.0  
i
12  
10  
8
h
g
h
i
g
e
j
f
j
6
k
k
60  
4
d
b
40  
V
[V] =  
e
2
c
a
GS  
d
f
g
h
i
j
k
20  
5.2 5.4 5.6  
5.8 6.0 6.2 6.4 10.0  
0
0
V
A
210  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
5
0
20 40 60 80 100 120 140 160 180  
I
V
DS  
D
7 Typ. transfer characteristics  
8 Typ. forward transconductance  
I = f ( V ); V 2 x I x R  
g = f(I ); T =25°C  
D
GS  
DS  
D
DS(on)max  
D
fs  
j
parameter: t = 80 µs  
parameter: g  
p
fs  
160  
160  
A
S
120  
100  
80  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
0
1
2
3
4
5
7
0
20 40 60 80 100 120 140 160  
A
200  
V
I
V
D
GS  
Page 5  
2003-05-09  
SPP100N06S2-05  
SPB100N06S2-05  
9 Drain-source on-state resistance  
= f (T )  
10 Typ. gate threshold voltage  
V = f (T )  
GS(th)  
R
DS(on)  
j
j
parameter : I = 80 A, V = 10 V  
parameter: V = V  
DS  
D
GS  
GS  
SPP100N06S2-05  
17  
4
V
14  
12  
10  
8
1.35 mA  
3
270 µA  
2.5  
2
1.5  
1
98%  
6
typ  
4
0.5  
2
0
-60  
0
-60  
°C  
-20  
20  
60  
100  
140  
200  
-20  
20  
60  
100  
°C  
180  
T
T
j
j
11 Typ. capacitances  
12 Forward character. of reverse diode  
I = f (V )  
C = f (V )  
F
SD  
DS  
parameter: V =0V, f=1 MHz  
parameter: T , tp = 80 µs  
GS  
j
5
3 SPP100N06S2-05  
10  
10  
pF  
A
4
2
10  
10  
C
C
iss  
oss  
3
1
10  
10  
Tj = 25 °C typ  
C
rss  
Tj = 175 °C typ  
Tj = 25 °C (98%)  
Tj = 175 °C (98%)  
2
0
10  
10  
V
0
5
10  
15  
20  
V
30  
DS  
0
0.4  
0.8  
1.2  
1.6  
2
2.4  
3
V
V
SD  
Page 6  
2003-05-09  
SPP100N06S2-05  
SPB100N06S2-05  
13 Typ. avalanche energy  
= f (T )  
14 Typ. gate charge  
= f (Q  
E
V
)
Gate  
AS  
j
GS  
par.: I = 80 A, V = 25 V, R = 25 Ω  
parameter: I = 100 A pulsed  
D
D
DD  
GS  
SPP100N06S2-05  
850  
16  
mJ  
V
700  
600  
500  
400  
300  
200  
100  
0
12  
0,2 VDS max  
10  
0,8 VDS max  
8
6
4
2
0
25  
45  
65  
85  
105 125 145 °C 185  
0
20 40 60 80 100 120 140 160  
200  
nC  
T
Q
Gate  
j
15 Drain-source breakdown voltage  
= f (T )  
V
(BR)DSS  
j
parameter: I =10 mA  
D
SPP100N06S2-05  
66  
V
62  
60  
58  
56  
54  
52  
50  
°C  
-60  
-20  
20  
60  
100  
140  
200  
T
j
Page 7  
2003-05-09  
SPP100N06S2-05  
SPB100N06S2-05  
Published by  
Infineon Technologies AG,  
Bereichs Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 1999  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device  
or system Life support devices or systems are intended to be implanted in the human body, or to support  
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health  
of the user or other persons may be endangered.  
Further information  
Please notice that the part number is BSPP100N06S2-05 and BSPB100N06S2-05, for simplicity the device is referred  
to by the term SPP100N06S2-05 and SPB100N06S2-05 throughout this documentation.  
Page 8  
2003-05-09  

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