BUP311D [INFINEON]

IGBT With Antiparallel Diode Preliminary data sheet; IGBT随着反并联二极管的初步数据表
BUP311D
型号: BUP311D
厂家: Infineon    Infineon
描述:

IGBT With Antiparallel Diode Preliminary data sheet
IGBT随着反并联二极管的初步数据表

晶体 二极管 晶体管 电动机控制 双极性晶体管 栅 局域网
文件: 总9页 (文件大小:73K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BUP 311D  
Infineon  
IGBT With Antiparallel Diode  
Preliminary data sheet  
• Low forward voltage drop  
• High switching speed  
• Low tail current  
• Latch-up free  
• Including fast free-wheel diode  
Former Development ID: BUP 3JKD  
Pin 1  
Pin 2  
Pin 3  
G
C
E
Type  
V
I
Package  
Ordering Code  
C67078-A4102  
CE  
C
BUP 311D  
1200V A  
TO-218 AB  
Maximum Ratings  
Parameter  
Symbol  
Values  
Unit  
Collector-emitter voltage  
Collector-gate voltage  
1200  
V
V
V
CE  
CGR  
= 20 kΩ  
1200  
± 20  
R
GE  
Gate-emitter voltage  
DC collector current  
V
GE  
A
I
C
= 25 °C  
20  
12  
T
T
C
C
= 100 °C  
Pulsed collector current, = 1 ms  
t
I
I
I
p
Cpuls  
F
= 25 °C  
40  
tbd  
tbd  
125  
T
C
Diode forward current  
= 100 °C  
T
C
Pulsed diode current, = 1 ms  
t
p
Fpuls  
= 25 °C  
T
C
Power dissipation  
= 25 °C  
W
P
tot  
T
C
Chip or operating temperature  
Storage temperature  
-55 ... + 150  
-55 ... + 150  
°C  
T
T
j
stg  
Semiconductor Group  
1
May-06-1999  
BUP 311D  
Infineon  
Maximum Ratings  
Parameter  
Symbol  
Values  
Unit  
Chip or operating temperature  
Storage temperature  
-55 ... + 150  
-55 ... + 150  
55 / 150 / 56  
°C  
T
T
-
j
stg  
IEC climatic category, DIN IEC 68-1  
-
Thermal Resistance  
Thermal resistance, junction - case  
Diode thermal resistance, chip case  
1  
K/W  
R
R
thJC  
2.5  
thJCD  
, at T = 25 °C, unless otherwise specified  
Electrical Characteristics  
j
Parameter  
Symbol  
Values  
Unit  
min.  
typ.  
max.  
Static Characteristics  
Gate threshold voltage  
V
V
V
GE(th)  
=
= 0.3 mA, = 25 °C  
4.5  
5.5  
6.5  
V
V
I
T
GE  
CE, C  
j
Collector-emitter saturation voltage  
CE(sat)  
= 15 V, = 8 A, = 25 °C  
-
-
-
-
2.5  
3.1  
3.4  
4.3  
3
3.7  
-
V
V
V
V
I
T
GE  
GE  
GE  
GE  
C
j
= 15 V, = 8 A, = 125 °C  
I
T
C
j
= 15 V, = 16 A, = 25 °C  
I
T
C
j
= 15 V, = 16 A, = 125 °C  
-
I
T
C
j
Zero gate voltage collector current  
= 1200 V, = 0 V, = 25 °C  
mA  
nA  
I
I
CES  
GES  
-
-
-
-
0.4  
V
V
T
j
CE  
GE  
Gate-emitter leakage current  
= 25 V, = 0 V  
120  
V
V
CE  
GE  
Semiconductor Group  
2
May-06-1999  
BUP 311D  
Infineon  
AC Characteristics  
Transconductance  
S
g
fs  
= 20 V, = 8 A  
4
-
-
V
I
CE  
C
Input capacitance  
= 25 V, = 0 V, = 1 MHz  
pF  
C
C
C
iss  
-
600  
tbd  
tbd  
tbd  
V
V
f
CE  
GE  
Output capacitance  
= 25 V, = 0 V, = 1 MHz  
oss  
rss  
-
-
60  
38  
V
V
f
CE  
GE  
Reverse transfer capacitance  
= 25 V, = 0 V, = 1 MHz  
V
V
f
CE  
GE  
, at T = 25 °C, unless otherwise specified  
Electrical Characteristics  
j
Parameter  
Symbol  
Values  
Unit  
min.  
typ.  
max.  
Switching Characteristics, Inductive Load at T = 125 °C  
j
Turn-on delay time  
ns  
t
t
t
t
d(on)  
= 600 V,  
= 15 V, = 8 A  
I
C
V
V
CC  
GE  
= 150  
-
-
-
-
55  
tbd  
tbd  
tbd  
tbd  
R
Gon  
Rise time  
= 600 V,  
r
= 15 V, = 8 A  
V
V
I
CC  
GE  
C
= 150 Ω  
50  
R
Gon  
Turn-off delay time  
d(off)  
= 600 V,  
= -15 V, = 8 A  
I
C
V
V
CC  
GE  
= 150 Ω  
380  
80  
R
Goff  
Fall time  
= 600 V,  
f
= -15 V, = 8 A  
V
V
I
CC  
GE  
C
= 150 Ω  
R
Goff  
Semiconductor Group  
3
May-06-1999  
BUP 311D  
Infineon  
Free-Wheel Diode  
Diode forward voltage  
V
V
F
= 8 A,  
= 8 A,  
= 0 V, = 25 °C  
-
-
tbd  
tbd  
tbd  
-
I
I
V
V
T
F
F
GE  
GE  
j
= 0 V, = 125 °C  
T
j
Reverse recovery time  
= 8 A, = -600 V,  
V
GE  
ns  
µC  
t
rr  
= 0 V  
I
V
F
R
i / t = -400 A/µs, = 25 °C  
d d  
-
tbd  
tbd  
T
F
j
Reverse recovery charge  
= 15 A, = -600 V,  
Q
rr  
= 0 V  
I
V
V
GE  
F
R
i / t = -400 A/µs  
d d  
F
= 25 °C  
-
-
tbd  
tbd  
tbd  
tbd  
T
T
j
j
= 125 °C  
Semiconductor Group  
4
May-06-1999  
BUP 311D  
Infineon  
Power dissipation  
Collector current  
ƒ
= (  
ƒ
T
P
T
I
)
= (  
)
C
tot  
C
C
T
150 °C  
j
T
V
parameter:  
150 °C  
parameter:  
15 V ,  
j
GE  
130  
W
22  
A
110  
18  
Ptot  
100  
IC  
16  
14  
12  
10  
8
90  
80  
70  
60  
50  
40  
30  
20  
6
4
2
10  
0
0
0
0
20  
40  
60  
80 100 120 °C 160  
TC  
20  
40  
60  
80 100 120 °C 160  
TC  
Safe operating area  
Transient thermal impedance IGBT  
ƒ
= (  
ƒ
t
p
I
V
Z
)
= ( )  
th JC  
C
CE  
D
, T  
T
D = t  
T
/
p
parameter: = 0  
= 25°C ,  
150 °C  
parameter:  
C
j
10 1  
10 2  
t
= 15.0µs  
p
K/W  
A
IC  
ZthJC  
10 0  
10 1  
100 µs  
10 -1  
D = 0.50  
0.20  
10 0  
0.10  
1 ms  
0.05  
10 -2  
0.02  
0.01  
single pulse  
10 -4  
10 ms  
3
10 -1  
10 0  
10 -3  
10 -5  
10 1  
10 2  
V
10 -3  
10 -2  
10 -1 s 10 0  
tp  
DC  
10  
VCE  
Semiconductor Group  
5
May-06-1999  
BUP 311D  
Infineon  
Typ. output characteristics  
Typ. output characteristics  
I = f (V  
I = f (V  
)
)
CE  
C
CE  
C
parameter: t = 80 µs, T = 25 °C  
parameter: t = 80 µs, T = 125 °C  
p
j
p
j
20  
A
20  
A
17V  
15V  
13V  
11V  
9V  
17V  
15V  
13V  
11V  
9V  
16  
14  
12  
10  
8
16  
14  
12  
10  
8
IC  
IC  
7V  
7V  
6
6
4
4
2
0
2
0
0
1
2
3
V
5
0
1
2
3
V
5
VCE  
VCE  
Typ. transfer characteristics  
I = f (V  
)
GE  
C
parameter: t = 80 µs, V = 20 V  
p
CE  
25  
A
22  
IC  
20  
18  
16  
14  
12  
10  
8
6
4
2
0
0
2
4
6
8
10  
V
VGE  
14  
Semiconductor Group  
6
May-06-1999  
BUP 311D  
Infineon  
Typ. switching time  
Typ. switching time  
t = f (R ) , inductive load , = 125°C  
Tj  
t = f (I ) , inductive load , T = 125°C  
G
C
j
par.:V =600V, V = ±15V, I =8 A  
par.:V =600V, V = ±15V, R =153  
CE  
GE  
C
CE  
GE  
G
10 3  
10 3  
tdoff  
t
t
tdoff  
ns  
ns  
tf  
tdon  
tr  
10 2  
tr  
10 2  
tf  
tdon  
10 1  
10 1  
0
50 100 150 200 250 300 350 400  
500  
0
4
8
12  
16  
20  
24  
A
IC  
30  
RG  
Typ. switching losses  
E = f (I ) , inductive load , T = 125°C  
Typ. switching losses  
E = f (R ) , inductive load , T = 125°C  
C
j
G
j
par.:V =600V, V = ±15V, R =153Ω  
par.:V =600V, V = ±15V, I =8 A  
CE  
GE  
G
CE  
GE  
C
10  
10  
mWs  
mWs  
8
7
6
5
4
3
2
E
8
7
6
5
4
3
2
E
Eon  
Eoff  
Eon  
Eon  
1
0
1
0
0
4
8
12  
16  
20  
24  
A
IC  
30  
0
50 100 150 200 250 300 350 400  
500  
RG  
Semiconductor Group  
7
May-06-1999  
BUP 311D  
Infineon  
Typ. capacitances  
f V  
Typ. gate charge  
C
= (  
)
ƒ
V
Q
= (  
)
CE  
GE  
Gate  
I
parameter:  
= 15 A  
C puls  
10 4  
pF  
20  
V
16  
C
VGE  
14  
12  
10  
8
10 3  
10 2  
10 1  
Ciss  
6
Coss  
Crss  
4
2
0
0
-4  
-8  
-12  
-16  
-20  
-28  
0
5
10  
15  
20  
25  
30  
V
40  
VCE  
QGate  
Short circuit safe operating area  
f V  
Reverse biased safe operating area  
I
T
I
f
T
= (V ) , = 150°C  
j
= (  
) , = 150°C  
Csc  
CE  
j
Cpuls  
CE  
parameter: VGE = ± 15 V, tsc 10 µs, L < 25 nH  
parameter: VGE = 15 V  
10  
2.5  
I
Csc/IC(90°C)  
I
Cpuls/IC  
6
4
1.5  
1.0  
2
0
0.5  
0.0  
0
200 400 600 800 1000 1200  
V
1600  
0
200 400 600 800 1000 1200  
V
1600  
VCE  
VCE  
Semiconductor Group  
8
May-06-1999  
BUP 311D  
Infineon  
Typ. forward characteristics  
I = f (V )  
Transient thermal impedance Diode  
ƒ
Z
t
= ( )  
F
F
th JC  
p
D = t T  
/
p
parameter: T  
parameter:  
j
10 1  
30  
A
26  
K/W  
IF  
24  
22  
20  
18  
16  
14  
12  
10  
8
ZthJC  
10 0  
Tj=125°C  
Tj=25°C  
D = 0.50  
0.20  
10 -1  
0.10  
0.05  
0.02  
6
single pulse  
0.01  
4
2
0
10 -2  
10 -5  
0.0  
0.5  
1.0  
1.5  
2.0  
V
3.0  
10 -4  
10 -3  
10 -2  
10 -1 s 10 0  
tp  
VF  
Semiconductor Group  
9
May-06-1999  

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