BUZ346 [INFINEON]
SIPMOS Power Transistor (N channel Enhancement mode Avalanche-rated); SIPMOS大功率晶体管(N沟道增强型雪崩额定)型号: | BUZ346 |
厂家: | Infineon |
描述: | SIPMOS Power Transistor (N channel Enhancement mode Avalanche-rated) |
文件: | 总9页 (文件大小:157K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BUZ 346
Not for new design
®
SIPMOS Power Transistor
• N channel
• Enhancement mode
• Avalanche-rated
Pin 1
Pin 2
Pin 3
G
D
S
Type
V
DS
I
R
)
DS(on
Package
Ordering Code
D
BUZ 346
50 V
58 A
0.018 Ω
TO-218 AA
C67078-S3120-A2
Maximum Ratings
Parameter
Symbol
Values
Unit
Continuous drain current
I
I
I
A
D
T = 73 °C
C
58
Pulsed drain current
Dpuls
AR
T = 25 °C
C
232
58
Avalanche current,limited by T
jmax
Avalanche energy,periodic limited by T
Avalanche energy, single pulse
E
4.5
mJ
jmax
AR
AS
E
I = 58 A, V = 25 V, R = 25 Ω
D
DD
GS
L = 21.4 µH, T = 25 °C
72
j
±
Gate source voltage
Power dissipation
V
P
20
V
GS
W
tot
T = 25 °C
C
170
Operating temperature
Storage temperature
T
T
-55 ... + 150 °C
-55 ... + 150
j
stg
Thermal resistance, chip case
R
≤ 0.74
K/W
thJC
thJA
≤
Thermal resistance, chip to ambient
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
R
75
C
55 / 150 / 56
Semiconductor Group
1
07/96
BUZ 346
Not for new design
Electrical Characteristics, at T = 25°C, unless otherwise specified
j
Parameter
Symbol
Values
Unit
min.
typ.
max.
Static Characteristics
Drain- source breakdown voltage
V
V
V
(BR)DSS
GS(th)
DSS
V
GS
= 0 V, I = 0.25 mA, T = 25 °C
50
-
-
D
j
Gate threshold voltage
=
V
V
I = 1 mA
2.1
3
4
GS DS, D
Zero gate voltage drain current
I
I
µA
V
DS
V
DS
= 50 V, V = 0 V, T = 25 °C
-
-
0.1
10
1
GS
j
= 50 V, V = 0 V, T = 125 °C
100
GS
j
Gate-source leakage current
= 20 V, V = 0 V
nA
GSS
V
GS
-
-
10
100
DS
Drain-Source on-resistance
= 10 V, I = 47 A
R
Ω
DS(on)
V
GS
0.012
0.018
D
Semiconductor Group
2
07/96
BUZ 346
Not for new design
Electrical Characteristics, at T = 25°C, unless otherwise specified
j
Parameter
Symbol
Values
Unit
min.
typ.
max.
Dynamic Characteristics
Transconductance
g
S
fs
≥
V
DS
2 I
R I = 47 A
30
42
-
* D * DS(on)max, D
Input capacitance
= 0 V, V = 25 V, f = 1 MHz
C
C
C
pF
iss
oss
V
GS
-
-
-
2900
1400
500
4300
2100
750
DS
Output capacitance
= 0 V, V = 25 V, f = 1 MHz
V
GS
DS
Reverse transfer capacitance
= 0 V, V = 25 V, f = 1 MHz
rss
V
GS
DS
Turn-on delay time
= 30 V, V = 10 V, I = 3 A
t
t
t
t
ns
d(on)
V
DD
GS
D
Ω
R
GS
= 50
-
-
-
-
55
80
Rise time
= 30 V, V = 10 V, I = 3 A
r
V
DD
GS
D
Ω
R
GS
= 50
140
420
250
210
560
330
Turn-off delay time
= 30 V, V = 10 V, I = 3 A
d(off)
V
DD
GS
D
Ω
= 50
R
GS
Fall time
= 30 V, V = 10 V, I = 3 A
f
V
DD
GS
D
Ω
= 50
R
GS
Semiconductor Group
3
07/96
BUZ 346
Not for new design
Electrical Characteristics, at T = 25°C, unless otherwise specified
j
Parameter
Symbol
Values
Unit
min.
typ.
max.
Reverse Diode
Inverse diode continuous forward current I
A
S
T = 25 °C
-
-
-
-
-
-
58
C
Inverse diode direct current,pulsed
I
SM
T = 25 °C
C
-
232
Inverse diode forward voltage
V
SD
V
V
GS
= 0 V, I = 116 A
1.6
100
0.3
2
-
F
Reverse recovery time
V = 30 V, I =l di /dt = 100 A/µs
t
ns
µC
rr
R
F S,
F
Reverse recovery charge
Q
rr
=
V = 30 V, I l di /dt = 100 A/µs
R
-
F S,
F
Semiconductor Group
4
07/96
BUZ 346
Not for new design
Drain current
Power dissipation
ƒ
I = (T )
ƒ
P
= (T )
D
C
tot
C
≥
parameter: V
10 V
GS
60
A
180
W
50
ID
Ptot
140
120
100
80
45
40
35
30
25
20
15
10
60
40
20
5
0
0
0
0
20
40
60
80 100 120
°C 160
TC
20
40
60
80 100 120
°C 160
TC
Safe operating area
Transient thermal impedance
ƒ
ƒ
I = (V
)
Z
= (t )
th JC
D
DS
p
parameter: D = 0.01, T = 25°C
parameter: D = t / T
C
p
10 3
10 0
A
K/W
t
= 28.0µs
I
p
ID
ZthJC
V
100 µs
10 2
10 -1
R
1 ms
10 ms
D = 0.50
0.20
0.10
0.05
0.02
0.01
10 1
10 -2
single pulse
DC
10 0
10 -3
10 0
10 1
V 10 2
VDS
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1s 10 0
tp
5
07/96
Semiconductor Group
BUZ 346
Not for new design
Typ. output characteristics
ƒ(
Typ. drain-source on-resistance
ƒ(
I =
V
)
R
=
I )
D
D
DS
DS (on)
parameter: t = 80 µs
parameter: V
p
GS
130
0.055
P
tot = 170W
a
b
c
d
e
f
k
j
h
l
g
i
A
110
100
90
Ω
f
V
[V]
GS
a
0.045
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
9.0
10.0
20.0
ID
RDS (on)
b
c
d
e
f
0.040
0.035
0.030
0.025
0.020
0.015
0.010
e
80
d
70
g
h
i
60
c
a
50
j
g
l
h
k
l
40
i
k
j
30
b
20
V
[V] =
b
GS
a
c
d
e
f
g
h
i
j
k
l
0.005
0.000
10
0
4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 10.0 20.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
V
5.0
0
20
40
60
80
100
A
130
VDS
ID
Typ. transfer characteristics I = f (V
)
Typ. forward transconductance g = f (I )
D
fs
D
GS
parameter: t = 80 µs
parameter: t = 80 µs,
p
p
≥
≥
V
DS
2 x I x R
V
DS
2 x I x R
D
DS(on)max
D
DS(on)max
50
S
70
A
60
55
50
45
40
35
30
25
20
15
10
40
35
30
25
20
15
10
ID
gfs
5
0
5
0
0
1
2
3
4
5
6
7
8
V
10
0
10
20
30
40
50
A
65
VGS
ID
Semiconductor Group
6
07/96
BUZ 346
Not for new design
Gate threshold voltage
Drain-source on-resistance
ƒ
= (T )
j
V
ƒ
= (T )
j
R
GS (th)
DS (on)
parameter: V = V , I = 1 mA
parameter: I = 47 A, V = 10 V
GS
DS
D
D
GS
0.045
4.6
V
98%
Ω
4.0
VGS(th)
RDS (on)
3.6
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.035
0.030
0.025
0.020
0.015
0.010
typ
2%
98%
typ
0.005
0.000
0.4
0.0
-60
-20
20
60
100
°C
Tj
160
-60
-20
20
60
100
°C
Tj
160
Typ. capacitances
Forward characteristics of reverse diode
C = f (V )
ƒ
I = (V
)
DS
F
SD
parameter:V = 0V, f = 1MHz
parameter: T , t = 80 µs
GS
j
p
10 1
10 3
nF
A
Ciss
IF
C
Coss
10 0
10 -1
10 -2
10 2
10 1
10 0
Crss
Tj = 25 °C typ
Tj = 150 °C typ
Tj = 25 °C (98%)
Tj = 150 °C (98%)
0
5
10
15
20
25
30
V
40
0.0
0.4
0.8
1.2
1.6
2.0
2.4
V
3.0
VDS
VSD
7
07/96
Semiconductor Group
BUZ 346
Not for new design
ƒ
Avalanche energy E = (T )
Typ. gate charge
AS
j
ƒ
parameter: I = 58 A, V = 25 V
V
= (Q
)
D
DD
GS
Gate
Ω
R
= 25 , L = 21.4 µH
parameter: I
= 87 A
D puls
GS
16
75
mJ
65
60
55
50
45
40
35
30
25
20
15
10
V
EAS
VGS
12
10
8
V
V
DS max
0,2
0,8
DS max
6
4
2
5
0
0
0
20
40
60
80
100
120
°C
Tj
160
20
40
60
80 100 120 nC 160
QGate
Drain-source breakdown voltage
ƒ
= (T )
j
V
(BR)DSS
60
V
58
V(BR)DSS 57
56
55
54
53
52
51
50
49
48
47
46
45
-60
-20
20
60
100
°C
Tj
160
Semiconductor Group
8
07/96
BUZ 346
Not for new design
Package Outlines
TO-218 AA
Dimension in mm
Semiconductor Group
9
07/96
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