BXY44-T2ES [INFINEON]
Pin Diode, 200V V(BR), Silicon, HERMETIC SEALED PACKAGE-2;![BXY44-T2ES](http://pdffile.icpdf.com/pdf2/p00271/img/icpdf/BXY44-T2ES_1628502_icpdf.jpg)
型号: | BXY44-T2ES |
厂家: | ![]() |
描述: | Pin Diode, 200V V(BR), Silicon, HERMETIC SEALED PACKAGE-2 衰减器 开关 测试 二极管 |
文件: | 总5页 (文件大小:53K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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BXY44
HiRel Silicon PIN Diode
• HiRel Discrete and Microwave Semiconductor
• Current controlled RF resistor for RF
attenuators and switches
• High reverse voltage
• Hermetically sealed microwave package
• esa Space Qualified
ESA/SCC detail spec. N0.: 5513/030
type variant No. s 04 to 07
BXY44-T
BXY44-T1
BXY44-T2
BXY44-FP
1
1'
1
2
2
ESD (Electrostatic discharge) sensitive device, observe handling precaution!
Type
Package
Configuration
single
Marking
BXY44-FP
BXY44-T (ql)
BXY44-T1 (ql)
BXY44-T2 (ql)
FP
T
-
-
-
-
single
T1
T2
single
single
(ql) Testing level: P: Professional testing
H: High Rel quality
S: Space quality
ES: ESA qualified
2007-08-20
1
BXY44
Maximum Ratings
Parameter
Symbol
Value
200
Unit
V
Reverse voltage
Forward current
Total power dissipation
BXY44-T;-T2,-FP
BXY44-T1
V
R
400
mA
mW
I
F
1)
500
P
tot
150
°C
Junction temperature
T
T
T
T
j
Operating temperature range
-55 ... 150
235
op
sol
stg
2)
Soldering temperature
°C
°C
Storage temperature
175 ... -65
Thermal Resistance
Parameter
Symbol
Value
Unit
Thermal resistance junction-case
BXY44-FP
R
K/W
th(j-c)
110
110
140
110
BXY44-T
BXY44-T1
BXY44-T2
Electrical Characteristics at T = 25°C, unless otherwise specified
A
Parameter
Symbol
Values
Unit
min.
typ. max.
DC Characteristics
-
-
-
100
5
Reverse current
I
nA
R
V = 200 V
R
Reverse current 1
I
-
-
R1
V
= 100 V
R1
1
1.05 V
Forward voltage
V
F
I = 100 mA
F
1For BXY44-FP; -T; -T2: at T
= 95°C. For T
> 95°C derating is required.
CASE
CASE
For BXY44-T1: at T
= 80°C. For T
> 80°C derating is required.
CASE
CASE
2During 5 sec. maximum. The same terminal shall not be resoldered until 5 minutes have elapsed.
2007-08-20
2
BXY44
Electrical Characteristics at T = 25°C, unless otherwise specified
A
Parameter
Symbol
Values
typ. max.
Unit
min.
AC Characteristics
pF
Diode capacitance
C
R
R
R
T
BXY44-T, -T1, -T2, V = 50 V, f = 1 MHz
-
-
0.2
0.5
0.35
0.75
R
BXY44-FP, V = 50 V, f = 1 MHz
R
Forward resistance 1
Ω
F1
F2
F3
BXY44-T, -T1, -T2, I = 10 µA, f = 100 MHz
800
700
900
900
1300
1200
F1
BXY44-FP, I = 10 µA, f = 100 MHz
F1
Forward resistance 2
BXY44-T, -T1, -T2, I = 1 mA , f = 100 MHz
12
11
16
20
28
27
F2
BXY44-FP, I = 1 mA , f = 100 MHz
F2
Forward resistance 3
BXY44-T, -T1, -T2, I = 10 mA , f = 100 MHz
2
2
3
5
5
F3
BXY44-FP, I = 10 mA, f = 100 MHz
3.8
F3
Minority carrier lifetime
τ
300
800
-
ns
L
I = 10 mA, I = 6 mA, I = 3 mA
F
R
R
2007-08-20
3
BXY44
Package FP
Package T
Package T1
Package T2
2007-08-20
4
BXY44
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
2007-08-20
5
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