C515-LN [INFINEON]
8-Bit CMOS Microcontroller; 8位CMOS微控制器
| 型号： | C515-LN |
| 厂家： | 
Infineon |
| 描述： | 8-Bit CMOS Microcontroller |
| 文件： | 总160页 (文件大小：909K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
C515
8-Bit CMOS Microcontroller
User’s Manual 04.98
Edition 04.98
Published by Siemens AG,
Bereich Halbleiter, Marketing-
Kommunikation, Balanstraße 73,
81541 München
© Siemens AG 1998
All Rights Reserved.
Attention please!
As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for
applications, processes and circuits implemented within components or assemblies.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved.
For questions on technology, delivery and prices please contact the Semiconductor Group Offices in Germany or
the Siemens Companies and Representatives worldwide (see address list).
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Siemens Office, Semiconductor Group.
Siemens AG is an approved CECC manufacturer.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales
office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport.
For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice
you for any costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components1 of the Semiconductor Group of Siemens AG, may only be used in life-support devices or
systems2 with the express written approval of the Semiconductor Group of Siemens AG.
1 A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that
device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be en-
dangered.
C515 User’s Manual
Revision History :
04.98
08.97
Previous Releases:
Page (new Page (prev. Subjects (changes since last revision)
version)
version)
1-2
1-3
1-4, 1-5
1-5
1-2
1-3
1-4
1-4
P-LCC-68 package is inlcuded in the features list
PE pin is corrected as PE/SWD
Pin configuration of P-LCC-68 package is included.
PE pin is corrected as PE/SWD
1-6 to 1-10 1-5 to 1-10 The Pin Definitions and Functions are added for P-LCC-68 package.
The pin description is modified in ascending order starting from first pin
of P-LCC-68 package
1-6
2-1
3-4
3-6
4-4
1-9
2-1
3-4
3-6
4-4
The pin name and description is corrected for PE/SWD
PE pin is corrected as PE/SWD in Figure 2.1
SYSCON register description is updated
PCON and SYSCON register descriptions are updated
A note is added describing the non availability of ALE switch off feature
in C515-LN/1RN versions
6-65
8-1
6-65
8-1
The voltage specifications of VAREF and VAGND are changed
The description on starting of watchdog timer is modified to include the
automatic start by strapping the pin PE/SWD to VCC. The content is
modified with detailed subheadings.
8-2
9-1
8-2
9-1
In Figure 8-1 PE/SWD is added to include the option for the automatic
start of watchdog timer
A detailed description is added for “Hardware Enable for the Use of
Power Saving Modes” and “Application Example for Switching Pin
PE/SWD”
9-2
9-1
The description of Slow down mode bit (SD) is modified to indicate the
availability of this feature for C515-LM/1RM versions only
10-2, 10-5, 10-2, 10-5, The device specifications are valid for ROMless versions also. So
10-6 & 10-8 10-6 & 10-8 C515-1RM is modified to C515 in all these pages.
10-6
10-6
CLKOUT timing table for 16 MHz is included
CLKOUT timing table for 24 MHz is included
Timing diagram for CLKOUT timing is included
10-8
10-8
10-13
10-14
10-12
10-13
The title “ROM Verification Characteristics for the C515-1RM” is
modified to “ROM Verification Characteristics for the C515-1R”
10-17
10-16
The package information is added for P-LCC-68 (SMD)
General Information
C515
Table of Contents
Page
1
1.1
1.2
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1
Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-4
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-6
2
2.1
2.2
Fundamental Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-1
CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-2
CPU Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-4
3
Memory Organization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1
Program Memory, "Code Space" . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-2
Data Memory, "Data Space" . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-2
General Purpose Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-2
Special Function Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-3
3.1
3.2
3.3
3.4
4
4.1
4.1.1
4.1.2
4.1.3
4.2
4.3
4.4
4.5
4.6
External Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1
Accessing External Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1
Role of P0 and P2 as Data/Address Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-3
External Program Memory Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-3
PSEN, Program Store Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-3
Overlapping External Data and Program Memory Spaces . . . . . . . . . . . . . . . . . . .4-3
ALE, Address Latch Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-4
Enhanced Hooks Emulation Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-5
ROM Protection for the C515 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-6
Unprotected ROM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-6
Protected ROM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-7
4.6.1
4.6.2
5
Reset and System Clock Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1
Hardware Reset Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1
Hardware Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-3
Oscillator and Clock Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-4
System Clock Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-6
5.1
5.2
5.3
5.4
6
6.1
On-Chip Peripheral Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1
Parallel I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1
Port Structures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1
Standard I/O Port Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-3
Port 0 Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-5
Port 1, Port 3 to Port 5 Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-6
Port 2 Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-7
Detailed Output Driver Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-9
Port Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-11
Port Loading and Interfacing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-12
Read-Modify-Write Feature of Ports 0 to 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-13
Timers/Counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-14
Timer/Counter 0 and 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-14
Timer/Counter 0 and 1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-15
Mode 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-18
Mode 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-19
6.1.1
6.1.2
6.1.2.1
6.1.2.2
6.1.2.3
6.1.2.4
6.1.3
6.1.4
6.1.5
6.2
6.2.1
6.2.1.1
6.2.1.2
6.2.1.3
Semiconductor Group
5
General Information
C515
Table of Contents
Page
6.2.1.4
6.2.1.5
6.2.2
Mode 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-20
Mode 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-21
Timer/Counter 2 with Additional Compare/Capture/Reload . . . . . . . . . . . . . . . . .6-22
Timer 2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-24
Timer 2 Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-29
Compare Function of Registers CRC, CC1 to CC3 . . . . . . . . . . . . . . . . . . . . . . . .6-31
Compare Mode 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-31
Modulation Range in Compare Mode 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-33
Compare Mode 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-35
Using Interrupts in Combination with the Compare Function . . . . . . . . . . . . . . . .6-37
Capture Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-39
Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-41
Multiprocessor Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-42
Serial Port Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-42
Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-44
Baud Rate in Mode 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-45
Baud Rate in Mode 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-45
Baud Rate in Mode 1 and 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-46
Using the Baud Rate Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-46
Using Timer 1 to Generate Baud Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-46
Details about Mode 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-48
Details about Mode 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-51
Details about Modes 2 and 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-54
A/D Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-57
A/D Converter Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-57
A/D Converter Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-59
A/D Converter Control Register ADCON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-59
A/D Converter Data Register ADDAT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-60
A/D Converter Interrupt Control Bits in IEN1 and IRCON . . . . . . . . . . . . . . . . . . .6-61
Programmable Reference Voltages of the A/D Converter (DAPR Register) . . . . .6-62
A/D Conversion Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-66
6.2.2.1
6.2.2.2
6.2.2.3
6.2.2.3.1
6.2.2.3.2
6.2.2.3.3
6.2.2.4
6.2.2.5
6.3
6.3.1
6.3.2
6.3.3
6.3.3.1
6.3.3.2
6.3.3.3
6.3.3.3.1
6.3.3.3.2
6.3.4
6.3.5
6.3.6
6.4
6.4.1
6.4.2
6.4.2.1
6.4.2.2
6.4.2.3
6.4.2.4
6.4.3
7
7.1
7.1.1
7.1.2
7.1.3
7.2
7.3
7.4
7.5
Interrupt System. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-1
Interrupt Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-4
Interrupt Enable Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-4
Interrupt Request / Control Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-6
Interrupt Priority Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-11
Interrupt Priority Level Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-12
How Interrupts are Handled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-13
External Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-15
Interrupt Response Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-17
8
8.1
8.1.1
8.1.2
8.1.2.1
Fail Safe Mechanisms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-1
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-1
General Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-1
Starting the Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-1
The First Possibility of Starting the Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . .8-1
Semiconductor Group
6
General Information
C515
Table of Contents
Page
8.1.2.2
8.1.3
8.1.4
8.1.5
The Second Possibility of Starting the Watchdog Timer . . . . . . . . . . . . . . . . . . . . .8-1
Refreshing the Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-2
Watchdog Reset and Watchdog Status Flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-2
WDT Control and Status Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-3
9
Power Saving Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-1
Hardware Enable for the Use of the Power Saving Modes . . . . . . . . . . . . . . . . . . .9-1
Power Saving Mode Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-2
Idle Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-3
Slow Down Mode Operation (C515-LM/1RM only) . . . . . . . . . . . . . . . . . . . . . . . . .9-5
Power Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-6
Invoking Power Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-6
Exit from Power Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-6
State of Pins in the Power Saving Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-7
9.1
9.2
9.3
9.4
9.5
9.5.1
9.5.2
9.6
10
Device Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-1
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-1
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-2
A/D Converter Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-5
AC Characteristics (16 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-6
AC Characteristics (24 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-8
ROM Verification Characteristics for the C515-1R . . . . . . . . . . . . . . . . . . . . . . .10-14
Package Information (P-LCC-68) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-17
Package Information (P-MQFP-80) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-18
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
11
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11-1
Semiconductor Group
7
Introduction
C515
1
Introduction
The C515 is a member of the Siemens C500 family of 8-bit microcontrollers. lt is functionally fully
upward compatible with the SAB-80C515/80C535 microcontrollers.
The C515 basically operates with internal and/or external program memory. The C515-L is identical
to the C515-1R, except that it lacks the on-chip porgram memory. Therefore, in this documentation
the term C515 refers to all versions within this specification unless otherwise noted.
Figure 1-1 shows the different functional units of the C515 and figure 1-2 shows the simplified logic
symbol of the C515.
Power
Saving
Modes
Watchdog
Timer
RAM
256 x 8
Port 0
Port 1
Port 2
Port 3
I/O
I/O
I/O
I/O
T0
T1
8-Bit
A/D
Converter
USART
T2
CPU
ROM
8 K x 8
Port 6
Port 5
I/O
Port 4
I/O
Analog/
Digital
Input
MCA03198
Figure 1-1
C515 Functional Units
Semiconductor Group
1-1
Introduction
C515
Listed below is a summary of the main features of the C515:
¥ Full upward compatibility with SAB 80C515
¥ Up to 24 MHz external operating frequency
– 500 ns instruction cycle at 24 MHz operation
¥ 8K byte on-chip ROM (with optional ROM protection)
– alternatively up to 64K byte external program memory
¥ Up to 64K byte external data memory
¥ 256 byte on-chip RAM
¥ On-chip emulation support logic (Enhanced Hooks Technology TM
¥ Six 8-bit parallel I/O ports
)
¥ One input port for analog/digital input
¥ Full duplex serial interface (USART)
– 4 operating modes, fixed or variabie baud rates
¥ Three 16-bit timer/counters
– Timer 0 / 1 (C501 compatible)
– Timer 2 for 16-bit reload, compare, or capture functions
¥ 8-bit A/D converter
– 8 multiplexed analog inputs
– programmable reference voltages
¥ 16-bit watchdog timer
¥ Power saving modes
– Idle mode
– Slow down mode (can be combined with idle mode)
– Software power-down mode
¥ 12 interrupt sources (7 external, 5 internal) selectable at four priority levels
¥ ALE switch-off capability (C515-LM/1RM only)
¥ P-LCC-68 and P-MQFP-80 packages
¥ Temperature Ranges: SAB-C515
SAF-C515
TA = 0 to 70 °C
TA = -40 to 85 °C
SAH-C515
TA = -40 to 110 °C (max. operating frequency: 16 MHz)
Semiconductor Group
1-2
Introduction
C515
VCC
VSS
Port 0
8 Bit Digital I/O
XTAL1
XTAL2
Port 1
8 Bit Digital I/O
ALE
PSEN
EA
Port 2
8 Bit Digital I/O
Port 3
8 Bit Digital I/O
C515
RESET
PE/SWD
Port 4
8 Bit Digital I/O
Port 5
8 Bit Digital I/O
VAREF
VAGND
Port 6
8 Bit Analog/
Digital Input
MCL03199
Figure 1-2
Logic Symbol
Semiconductor Group
1-3
Introduction
C515
1.1 Pin Configurations
This section describes the pin configuration of the C515.
V
9
1 68
61
60
RESET
VAREF
VAGND
10
P5.7
P0.7
P0.6
P0.5
P0.4
P0.3
P0.2
P0.1
P0.0
EA
P6.7
P6.6
P6.5
P6.4
P6.3
P6.2
P6.1
C515-LN/1RN
P6.0
ALE
PSEN
P2.7
P2.6
P2.5
P2.4
P2.3
RxD/P3.0
TxD/P3.1
INT0/P3.2
INT1/P3.3
T0/P3.4
T1/P3.5
26
44
43
27
MCP00092
V
V
Figure 1-3
Pin Configuration of P-LCC-68 Package (top view)
Semiconductor Group
1-4
Introduction
C515
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
P5.6
P5.5
P5.4
P5.3
P5.2
P5.1
P5.0
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
P2.2/A10
P2.1/A9
P2.0/A8
XTAL1
XTAL2
N.C.
VSS
VCC
N.C.
VCC
N.C.
N.C.
N.C.
P4.0
P4.1
P4.2
P1.0/INT3/CC0
P1.1/INT4/CC1
P1.2/INT5/CC2
P1.3/INT6/CC3
P1.4/INT2
P1.5/T2EX
P1.6/CLKOUT
P1.7/T2
C515
PE/SWD
P4.3
P4.4
P4.5
P4.6
P4.7
N.C.
P3.7/RD
P3.6/WR
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20
V
V
MCP03200
N.C. pins must not be connected
Figure 1-4
Pin Configuration of P-MQFP-80-1 Package (top view)
Semiconductor Group
1-5
Introduction
C515
1.2 Pin Definitions and Functions
This section describes all external signals of the C515 with its function.
Table 1-1
Pin Definitions and Functions
Symbol
Pin
Number
P-LCC-
68
Pin
Number
P-MQFP-
80
I/O*) Function
P4.0-P4.7
1-3, 5-9
72-74,
76-80
I/O
Port 4
is an 8-bit quasi-bidirectional I/O port with internal
pull-up resistors. Port 4 pins that have 1’s written to
them are pulled high by the internal pull-up resistors,
and in that state can be used as inputs. As inputs,
port 4 pins being externally pulled low will source
current (I IL, in the DC characteristics) because of the
internal pull-up resistors.
PE/SWD
4
75
I
Power saving mode enable/Start watchdog timer
A low level at this pin allows the software to enter the
power saving modes(idle mode, slow down mode
and power down mode). It is impossible to enter the
software controlled power saving modes if this pin is
held at high level.
A high level during the reset performs an automatic
start of watchdog timer immidiately after reset.
When left unconnected this pin is pulled high by a
weak internal pull-up resistor.
RESET
10
1
I
RESET
A low level on this pin for the duration of two machine
cycles while the oscillator is running resets the
C515. A small internal pullup resistor permits power-
on reset using only a capacitor connected to V
Reference voltage for the A/D converter
Reference ground for the A/D converter
.
SS
VAREF
11
3
–
–
I
VAGND
P6.0-P6.7
12
4
13-20
5-12
Port 6
is an 8-bit unidirectional input port to the A/D
converter. Port pins can be used for digital input, if
voltage levels simultaneously meet the
specifications for high/low input voltages and for the
eight multiplexed analog inputs.
*) I = Input
O = Output
Semiconductor Group
1-6
Introduction
C515
Table 1-1
Pin Definitions and Functions (cont’d)
Symbol
Pin
Number
P-LCC-
68
Pin
Number
P-MQFP-
80
I/O*) Function
P3.0-P3.7
21-28
15-22
I/O
Port 3
is an 8-bit quasi-bidirectional I/O port with internal
pullup resistors. Port 3 pins that have 1's written to
them are pulled high by the internal pullup resistors,
and in that state can be used as inputs. As inputs,
port 3 pins being externally pulled low will source
current (I IL, in the DC characteristics) because of the
internal pullup resistors. Port 3 also contains the
interrupt, timer, serial port and external memory
strobe pins that are used by various options. The
output latch corresponding to a secondary function
must be programmed to a one (1) for that function to
operate. The secondary functions are assigned to
the pins of port 3 as follows:
21
22
23
24
15
16
17
18
P3.0 / RxD
data
Receiver data input (asynch.) or
input/output (synch.) of serial
interface
P3.1 / TxD
Transmitter data output (asynch.) or
clock output (synch.) of serial
interface
25
26
27
19
20
21
P3.2 / INT0
External interrupt 0 input /
timer 0 gate control input
External interrupt 1 input /
timer 1 gate control input
Timer 0 counter input
P3.3 / INT1
P3.4 / T0
P3.5 / T1
P3.6 / WR
byte
28
22
Timer 1 counter input
WR control output; latches the data
from port 0 into the external data
memory
P3.7 / RD
RD control output; enables the
external data memory
*) I = Input
O = Output
Semiconductor Group
1-7
Introduction
C515
Table 1-1
Pin Definitions and Functions (cont’d)
Symbol
Pin
Number
P-LCC-
68
Pin
Number
P-MQFP-
80
I/O*) Function
P1.0 - P1.7 36-29
31-24
I/O
Port 1
is an 8-bit quasi-bidirectional I/O port with internal
pullup resistors. Port 1 pins that have 1's written to
them are pulled high by the internal pullup resistors,
and in that state can be used as inputs. As inputs,
port 1 pins being externally pulled low will source
current (I IL, in the DC characteristics) because of the
internal pullup resistors. The port is used for the low-
order address byte during program verification. Port
1 also contains the interrupt, timer, clock, capture
and compare pins that are used by various options.
The output latch corresponding to a secondary
function must be programmed to a one (1) for that
function to operate (except when used for the
compare functions). The secondary functions are
assigned to the port 1 pins as follows :
36
35
34
33
31
30
29
28
P1.0 / INT3 /CC0
P1.1 / INT4 /CC1
P1.2 / INT5 /CC2
P1.3 / INT6 /CC3
Interrupt 3 input /
compare 0 output /
capture 0 input
Interrupt 4 input /
compare 1 output /
capture 1 input
Interrupt 5 input /
compare 2 output /
capture 2 input
Interrupt 6 input /
compare 3 output /
capture 3 input
32
31
27
26
P1.4 / INT2
P1.5 / T2EX
Interrupt 2 input
Timer 2 external reload /
trigger input
30
29
25
24
P1.6 / CLKOUT
P1.7 / T2
System clock output
Counter 2 input
V
V
38
34
–
–
Ground (0 V)
SS
37, 68
33, 69
Supply voltage
CC
during normal, idle, and power-down operation.
*) I = Input
O = Output
Semiconductor Group
1-8
Introduction
C515
Table 1-1
Pin Definitions and Functions (cont’d)
Symbol
Pin
Number
P-LCC-
68
Pin
Number
P-MQFP-
80
I/O*) Function
XTAL2
39
36
–
XTAL2
Input to the inverting oscillator amplifier and input to
the internal clock generator circuits.
To drive the device from an external clock source,
XTAL2 should be driven, while XTAL1 is left
unconnected. Minimum and maximum high and low
times as well as rise/fall times specified in the AC
characteristics must be observed.
XTAL1
40
37
–
XTAL1
Output of the inverting oscillator amplifier.
P2.0-P2.7
41-48
38-45
I/O
Port 2
is an 8-bit quasi-bidirectional I/O port with internal
pullup resistors. Port 2 pins that have 1's written to
them are pulled high by the internal pullup resistors,
and in that state can be used as inputs. As inputs,
port 2 pins being externally pulled low will source
current (I IL, in the DC characteristics) because of the
internal pullup resistors.
Port 2 emits the high-order address byte during
fetches from external program memory and during
accesses to external data memory that use 16-bit
addresses (MOVX @DPTR). In this application it
uses strong internal pullup resistors when issuing
1's. During accesses to external data memory that
use 8-bit addresses (MOVX @Ri), port 2 issues the
contents of the P2 special function register.
PSEN
49
47
O
The Program Store Enable
output is a control signal that enables the external
program memory to the bus during external fetch
operations. It is activated every six oscillator periods,
except during external data memory accesses. The
signal remains high during internal program
execution.
*) I = Input
O = Output
Semiconductor Group
1-9
Introduction
C515
Table 1-1
Pin Definitions and Functions (cont’d)
Symbol
Pin
Number
P-LCC-
68
Pin
Number
P-MQFP-
80
I/O*) Function
ALE
50
48
O
The Address Latch enable
output is used for latching the address into external
memory during normal operation. It is activated
every six oscillator periods, except during an
external data memory access.
EA
51
49
I
External Access Enable
When held high, the C515 executes instructions
from the internal ROM (C515-1R) as long as the
program counter is less than 2000 . When held low,
H
the C515 fetches all instructions from ext. program
memory. For the C515-L this pin must be tied low.
P0.0-P0.7
52-59
52-59
I/O
Port 0
is an 8-bit open-drain bidirectional I/O port. Port 0
pins that have 1's written to them float, and in that
state can be used as high-impedance inputs. Port 0
is also the multiplexed low-order address and data
bus during accesses to external program and data
memory. In this application it uses strong internal
pullup resistors when issuing 1's. Port 0 also outputs
the code bytes during program verification in the
C515-1R. External pullup resistors are required
during program verification.
P5.ß-P5.7
67-60
67-60
I/O
Port 5
is an 8-bit quasi-bidirectional I/O port with internal
pullup resistors. Port 5 pins that have 1's written to
them are pulled high by the internal pullup resistors,
and in that state can be used as inputs. As inputs,
port 5 pins being externally pulled low will source
current (I IL, in the DC characteristics) because of the
internal pullup resistors.
N.C.
–
2, 13, 14,
23, 32, 35,
46, 50, 51,
68, 70, 71
–
Not connected
These pins of the P-MQFP-80 package must not be
connected.
*) I = Input
O = Output
Semiconductor Group
1-10
Fundamental Structure
C515
2
Fundamental Structure
The C515 is fully compatible to the architecture of the standard 8051/C501 microcontroller family.
While maintaining all architectural and operational characteristics of the C501, the C515
incorporates a 8-bit A/D converter, a timer 2 with capture/compare functions, as well as some
enhancements in the Fail Save Mechanism unit. Figure 2-1 shows a block diagram of the C515.
C515
RAM
256 x 8
ROM
8K x 8
XTAL1
XTAL2
OSC & Timing
CPU
ALE
PSEN
EA
Emulation
Support
Logic
Programmable
Watchdog Timer
PE/SWD
RESET
Timer 0
Timer 1
Timer 2
Port 0
8 Bit Digital I/O
Port 0
Port 1
Port 2
Port 3
Port 4
Port 5
Port 6
Port 1
8 Bit Digital I/O
Port 2
8 Bit Digital I/O
USART
Baud Rate Generator
Port 3
8 Bit Digital I/O
Interrupt Unit
Port 4
8 Bit Digital I/O
VAREF
VAGND
Programmable
Reference Voltages
Port 5
8 Bit Digital I/O
8-Bit
A/D Converter
Port 6
8 Bit Digital I/O
Digital Input
Analog
S & H
MUX
MCB03201
Figure 2-1
Block Diagram of the C515
Semiconductor Group
2-1
Fundamental Structure
C515
2.1 CPU
The C515 is efficient both as a controller and as an arithmetic processor. It has extensive facilities
for binary and BCD arithmetic and excels in its bit-handling capabilities. Efficient use of program
memory results from an instruction set consisting of 44% one-byte, 41% two-byte, and 15% three-
byte instructions. With a 12 MHz external clock, 58% of the instructions execute in 1.0 ms (24 MHz
500 ns).
The CPU (Central Processing Unit) of the C515 consists of the instruction decoder, the arithmetic
section and the program control section. Each program instruction is decoded by the instruction
decoder. This unit generates the internal signals controlling the functions of the individual units
within the CPU. They have an effect on the source and destination of data transfers and control the
ALU processing.
The arithmetic section of the processor performs extensive data manipulation and is comprised of
the arithmetic/logic unit (ALU), an A register, B register and PSW register.
The ALU accepts 8-bit data words from one or two sources and generates an 8-bit result under the
control of the instruction decoder. The ALU performs the arithmetic operations add, substract,
multiply, divide, increment, decrement, BDC-decimal-add-adjust and compare, and the logic
operations AND, OR, Exclusive OR, complement and rotate (right, left or swap nibble (left four)).
Also included is a Boolean processor performing the bit operations as set, clear, complement, jump-
if-not-set, jump-if-set-and-clear and move to/from carry. Between any addressable bit (or its
complement) and the carry flag, it can perform the bit operations of logical AND or logical OR with
the result returned to the carry flag.
The program control section controls the sequence in which the instructions stored in program
memory are executed. The 16-bit program counter (PC) holds the address of the next instruction to
be executed. The conditional branch logic enables internal and external events to the processor to
cause a change in the program execution sequence.
Accumulator
ACC is the symbol for the accumulator register. The mnemonics for accumulator-specific
instructions, however, refer to the accumulator simply as A.
Program Status Word
The Program Status Word (PSW) contains several status bits that reflect the current state of the
CPU.
Semiconductor Group
2-2
Fundamental Structure
C515
Special Function Register PSW (Address D0 )
H
Reset Value : 00
H
Bit No. MSB
LSB
D7
D6
D5
D4
D3
D2
D1
D0
H
H
H
H
H
H
H
H
D0
CY
AC
F0
RS1
RS0
OV
F1
P
PSW
H
Bit
Function
CY
Carry Flag
Used by arithmetic instruction.
AC
F0
Auxiliary Carry Flag
Used by instructions which execute BCD operations.
General Purpose Flag
RS1
RS0
Register Bank select control bits
These bits are used to select one of the four register banks.
RS1
RS0
Function
Bank 0 selected, data address 00 -07
0
0
1
1
0
1
0
1
H
H
Bank 1 selected, data address 08 -0F
H
H
Bank 2 selected, data address 10 -17
H
H
Bank 3 selected, data address 18 -1F
H
H
OV
Overflow Flag
Used by arithmetic instruction.
General Purpose Flag
Parity Flag
F1
P
Set/cleared by hardware after each instruction to indicate an odd/even
number of "one" bits in the accumulator, i.e. even parity.
B Register
The B register is used during multiply and divide and serves as both source and destination. For
other instructions it can be treated as another scratch pad register.
Stack Pointer
The stack pointer (SP) register is 8 bits wide. It is incremented before data is stored during PUSH
and CALL executions and decremented after data is popped during a POP and RET (RETI)
execution, i.e. it always points to the last valid stack byte. While the stack may reside anywhere in
the on-chip RAM, the stack pointer is initialized to 07 after a reset. This causes the stack to begin
H
a location = 08 above register bank zero. The SP can be read or written under software control.
H
Semiconductor Group
2-3
Fundamental Structure
C515
2.2 CPU Timing
A machine cycle of the C515 consists of 6 states (12 oscillator periods). Each state is devided into
a phase 1 half and a phase 2 half. Thus, a machine cycle consists of 12 oscillator periods,
numbererd S1P1 (state 1, phase 1) through S6P2 (state 6, phase 2). Each state lasts for two
oscillator periods. Typically, arithmetic and logic operations take place during phase 1 and internal
register-to-register transfers take place during phase 2.
The diagrams in figure 2-2 show the fetch/execute timing related to the internal states and phases.
Since these internal clock signals are not user-accessible, the XTAL1 oscillator signals and the ALE
(address latch enable) signal are shown for external reference. ALE is normally activated twice
during each machine cycle: once during S1P2 and S2P1, and again during S4P2 and S5P1.
Executing of a one-cycle instruction begins at S1P2, when the op-code is latched into the instruction
register. If it is a two-byte instruction, the second reading takes place during S4 of the same
machine cycle. If it is a one-byte instruction, there is still a fetch at S4, but the byte read (which would
be the next op-code) is ignored (discarded fetch), and the program counter is not incremented. In
any case, execution is completed at the end of S6P2. Figures 2-2 (a) and (b) show the timing of a
1-byte, 1-cycle instruction and for a 2-byte, 1-cycle instruction.
Most C515 instructions are executed in one cycle. MUL (multiply) and DIV (divide) are the only
instructions that take more than two cycles to complete; they take four cycles. Normally two code
bytes are fetched from the program memory during every machine cycle. The only exception to this
is when a MOVX instruction is executed. MOVX is a one-byte, 2-cycle instruction that accesses
external data memory. During a MOVX, the two fetches in the second cycle are skipped while the
external data memory is being addressed and strobed. Figure 2-2 (c) and (d) show the timing for
a normal 1-byte, 2-cycle instruction and for a MOVX instruction.
Semiconductor Group
2-4
Fundamental Structure
C515
S1
S2
S3
S4
S5
S6
S1
S2
S3
S4
S5
S6
P1 P2 P1 P2 P1 P2 P1 P2 P1 P2 P1 P2 P1 P2 P1 P2 P1 P2 P1 P2 P1 P2 P1 P2
OSC
(XTAL1)
ALE
Read
Read next
Opcode
Opcode (Discard)
Read next
Opcode again
S1
S2
S3
S4
S5
S6
a) 1-Byte,
b) 2-Byte,
1-Cycle Instruction, e.g. INC A
Read
Opcode
Read 2nd
Byte
Read next
Opcode
S1
S2
S3
S4
S5
S6
1-Cycle Instruction, e.g. ADD A,
# Data
Read next Opcode again
Read
Opcode
Read next Opcode (Discard)
S1
S2
S3
S4
S5
S6
S1
S2
S3
S4
S5
S6
c) 1-Byte,
2-Cycle Instruction, e.g. INC DPTR
Read next Opcode again
Read
Opcode
(MOVX)
Read next
Opcode
(Discard)
No Fetch
No ALE
No Fetch
S1
S2
S3
S4
S5
S6
S1
S2
S3
S4
S5
S6
ADDR
DATA
d) MOVX (1-Byte, 2-Cycle)
MCD03218
Access External Memory
Figure 2-2
Fetch Execute Sequence
Semiconductor Group
2-5
Memory Organization
C515
3
Memory Organization
The C515 CPU manipulates operands in the following four address spaces:
– up to 64 Kbyte of program memory (8K on-chip program memory for C515-1R)
– up to 64 Kbyte of external data memory
– 256 bytes of internal data memory
– a 128 byte special function register area
Figure 3-1 illustrates the memory address spaces of the C515.
FFFF
FFFF
H
H
External
External
Indirect
Address
Direct
Address
FF
80
FF
80
H
H
H
H
Special
Function
Register
Internal
RAM
2000
H
7F
H
1FFF
H
H
Internal
(EA = 1)
External
(EA = 0)
Internal
RAM
0000
0000
00
H
H
"Code Space"
"Data Space"
"Internal Data Space"
MCD03202
Figure 3-1
C515 Memory Map
Semiconductor Group
3-1
Memory Organization
C515
3.1 Program Memory, "Code Space"
The C515-1R has 8 Kbytes of read-only program memory which can be externally expanded up to
64 Kbytes. If the EA pin is held high, the C515-1R executes program code out of the internal ROM
unless the program counter address exceeds 1FFF . Address locations 2000 through FFFF are
H
H
H
then fetched from the external program memory. If the EA pin is held low, the C515 fetches all
instructions from the external 64K byte program memory.
3.2 Data Memory, "Data Space"
The data memory address space consists of an internal and an external memory space. The
internal data memory is divided into three physically separate and distinct blocks : the lower 128
bytes of RAM, the upper 128 bytes of RAM, and the 128 byte special function register (SFR) area.
While the upper 128 bytes of data memory and the SFR area share the same address locations,
they are accessed through different addressing modes. The lower 128 bytes of data memory can be
accessed through direct or register indirect addressing; the upper 128 bytes of RAM can be
accessed through register indirect addressing; the special function registers are accessible through
direct addressing. Four 8-register banks, each bank consisting of eight 8-bit general-purpose
registers, occupy locations 0 through 1F in the lower RAM area. The next 16 bytes, locations 20
H
H
through 2F , contain 128 directly addressable bit locations. The stack can be located anywhere in
H
the internal RAM area, and the stack depth can be expanded up to 256 bytes.
The external data memory can be expanded up to 64 Kbyte and can be accessed by instructions
that use a 16-bit or an 8-bit address.
3.3 General Purpose Registers
The lower 32 locations of the internal RAM are assigned to four banks with eight general purpose
registers (GPRs) each. Only one of these banks may be enabled at a time. Two bits in the program
status word, RS0 (PSW.3) and RS1 (PSW.4), select the active register bank (see description of the
PSW in chapter 2). This allows fast context switching, which is useful when entering subroutines or
interrupt service routines.
The 8 general purpose registers of the selected register bank may be accessed by register
addressing. With register addressing the instruction op code indicates which register is to be used.
For indirect addressing R0 and R1 are used as pointer or index register to address internal or
external memory (e.g. MOV @R0).
Reset initializes the stack pointer to location 07 and increments it once to start from location 08
H
H
which is also the first register (R0) of register bank 1. Thus, if one is going to use more than one
register bank, the SP should be initialized to a different location of the RAM which is not used for
data storage.
Semiconductor Group
3-2
Memory Organization
C515
3.5 Special Function Registers
The registers, except the program counter and the four general purpose register banks, reside in
the special function register area.
The 43 special function registers (SFRs) include pointers and registers that provide an interface
between the CPU and the other on-chip peripherals. All SFRs with addresses where address bits
0-2 are 0 (e.g. 80 , 88 , 90 , 98 , ..., F8 , FF ) are bitaddressable.
H
H
H
H
H
H
The SFRs of the C515 are listed in table 3-1 and table 3-2. In table 3-1 they are organized in groups
which refer to the functional blocks of the C515. Table 3-2 illustrates the contents of the SFRs in
numeric order of their addresses.
Semiconductor Group
3-3
Memory Organization
C515
Table 3-1
Special Function Registers - Functional Blocks
Block
Symbol
Name
Address Contents after
Reset
1)
CPU
ACC
B
DPH
DPL
PSW
SP
Accumulator
B-Register
Data Pointer, High Byte
Data Pointer, Low Byte
Program Status Word Register
Stack Pointer
E0
F0
83
82
00
00
00
00
00
07
H
H
H
H
H
H
H
1)
H
H
H
1)
D0
H
81
B1
B1
H
H
H
3)
3)
SYSCON System Control Register
SYSCON System Control Register
XX1X XXXX
XXXX XXXX
B
B
4)
1)
3)
A/D-
ADCON 2) A/D Converter Control Register
D8
D9
DA
00X0 0000
B
00
H
00
H
H
H
H
Converter ADDAT
DAPR
A/D Converter Data Register
A/D Converter Program Register
1)
Interrupt
System
IEN0 2)
IEN1 2)
P0 2)
IP1
IRCON
TCON
Interrupt Enable Register 0
Interrupt Enable Register 1
Interrupt Priority Register 0
Interrupt Priority Register 1
Interrupt Request Control Register
Timer Control Register
A8
B8
00
H
H
H
1)
00
H
A9
B9
00
H
H
H
3)
3)
X000 0000
B
1)
C0
88
XX00 0000
B
H
2)
1)
00
H
H
2)
1)
T2CON
SCON
Timer 2 Control Register
Serial Channel Control Register
C8
00
H
H
H
2)
1)
1)
98
00
H
Timer 0/
Timer 1
TCON 2)
TH0
TH1
TL0
TL1
Timer 0/1 Control Register
Timer 0, High Byte
Timer 1, High Byte
Timer 0, Low Byte
Timer 1, Low Byte
Timer Mode Register
88
00
H
H
8C
8D
8A
00
H
H
H
00
H
00
H
H
H
H
8B
89
00
H
TMOD
00
H
Compare/ CCEN
Comp./Capture Enable Reg.
Comp./Capture Reg. 1, High Byte
Comp./Capture Reg. 2, High Byte
Comp./Capture Reg. 3, High Byte
Comp./Capture Reg. 1, Low Byte
Comp./Capture Reg. 2, Low Byte
Comp./Capture Reg. 3, Low Byte
Com./Rel./Capt. Reg. High Byte
Com./Rel./Capt. Reg. Low Byte
Timer 2, High Byte
C1
00
H
H
H
H
H
H
H
H
H
H
H
Capture
Unit /
CCH1
CCH2
CCH3
CCL1
CCL2
CCL3
CRCH
CRCL
TH2
C3
C5
C7
C2
C4
C6
CB
CA
CD
00
H
00
H
Timer 2
00
H
00
H
00
H
00
H
00
H
00
H
00
H
1) Bit-addressable special function registers
2) This special function register is listed repeatedly since some bits of it also belong to other functional blocks.
3) “X“ means that the value is undefined and the location is reserved
4) For C515-LN/1RN only
Semiconductor Group
3-4
Memory Organization
C515
Table 3-1
Special Function Registers - Functional Blocks (cont’d)
Block
Symbol
Name
Address Contents after
Reset
TL2
Timer 2, Low Byte
CC
00
00
H
H
H
1)
T2CON 2) Timer 2 Control Register
C8
H
H
H
1)
1)
1)
Ports
P0
P1
P2
P3
P4
P5
P6
Port 0
Port 1
Port 2
Port 3
Port 4
Port 5
80
90
FF
FF
FF
FF
FF
FF
–
H
H
H
H
H
H
A0
B0
E8
F8
DB
H
H
H
H
1
1)
1)
Port 6, Analog/Digital Input
H
1
3)
Serial
Channel
ADCON2) A/D Converter Control Register
D8
00X0 0000
H
B
PCON2)
SBUF
SCON 2)
Power Control Register
Serial Channel Buffer Register
Serial Channel Control Register
87
99
98
00
H
H
H
H
3)
XX
H
1)
1)
00
H
Watchdog IEN0 2)
IEN1 2)
Interrupt Enable Register 0
Interrupt Enable Register 1
Interrupt Priority Register 0
A8
B8
A9
00
H
H
H
H
1)
00
H
IP0 2)
X000 0000
3)
B
Power
Saving
Modes
PCON2)
Power Control Register
87
00
H
H
1) Bit-addressable special function registers
2) This special function register is listed repeatedly since some bits of it also belong to other functional blocks.
3) “X“ means that the value is undefined and the location is reserved
Semiconductor Group
3-5
Memory Organization
C515
Table 3-2
Contents of the SFRs, SFRs in Numeric Order of their Addresses
Addr Register Content Bit 7
after
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
1)
Reset
2)
80
81
82
83
87
87
88
89
P0
FF
07
.7
.7
.7
.7
.6
.6
.6
.6
.5
.4
.3
.2
.1
.0
H
H
H
H
H
H
H
H
H
SP
.5
.4
.3
.2
.1
.0
H
H
H
H
H
H
H
H
H
H
H
DPL
DPH
PCON
PCON3)
TCON
TMOD
TL0
00
00
00
00
00
00
00
00
00
00
.5
.4
.3
.2
.1
.0
.5
.4
.3
.2
.1
.0
SMOD PDS
SMOD PDS
IDLS
IDLS
TF0
M1
.5
SD
_
GF1
GF1
IE1
GF0
GF0
IT1
PDE
PDE
IE0
M1
.1
IDLE
IDLE
IT0
M0
.0
2)
TF1
TR1
TR0
M0
.4
GATE C/T
GATE C/T
8A
.7
.7
.7
.7
T2
.6
.6
.6
.6
.3
.2
H
H
8B
TL1
.5
.4
.3
.2
.1
.0
8C
8D
90
TH0
.5
.4
.3
.2
.1
.0
H
H
TH1
.5
.4
.3
.2
.1
.0
2)
2)
P1
FF
CLK-
OUT
T2EX INT2
INT6
INT5
INT4
INT3
H
H
98
99
SCON
SBUF
P2
00
SM0
.7
SM1
.6
SM2
.5
REN
.4
TB8
.3
RB8
.2
TI
RI
.0
H
H
H
XX
.1
H
H
2)
2)
A0
A8
A9
FF
00
.7
.6
.5
.4
.3
.2
.1
.0
H
H
H
IEN0
IP0
EAL
–
WDT
ET2
ES
.4
ET1
.3
EX1
.2
ET0
.1
EX0
.0
H
X000-
0000
WDTS .5
B
2)
B0
B1
P3
FF
RD
_
WR
_
T1
T0
_
INT1
_
INT0
_
TxD
_
RxD
_
H
H
SYSCON X1XX
XXXX
EALE
H
B
B1
SYSCON XXXX
XXXX
_
_
_
_
_
_
_
_
H
4)
B
2)
B8
B9
IEN1
IP1
00
EXEN2 SWDT EX6
.5
EX5
.4
EX4
.3
EX3
.2
EX2
.1
EADC
.0
H
H
XX00-
–
–
H
0000
B
1) X means that the value is undefined and the location is reserved
2) Bit-addressable special function registers
3) For C515-LN/1RN only
4) This register is available without function in C515-LN/1RN
Semiconductor Group
3-6
Memory Organization
C515
Table 3-2
Contents of the SFRs, SFRs in Numeric Order of their Addresses (cont’d)
Addr Register Content Bit 7
after
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
1)
Reset
2)
C0
C1
IRCON
CCEN
00
00
EXF2 TF2
IEX6
IEX5
IEX4
IEX3
IEX2
IADC
H
H
H
COCA COCAL COCA COCAL COCA COCAL COCA COCAL
H
H3
.7
.7
.7
.7
.7
.7
3
H2
2
H1
.3
.3
.3
.3
.3
.3
1
H0
.1
.1
.1
.1
.1
.1
0
C2
C3
C4
C5
C6
C7
C8
CCL1
CCH1
CCL2
CCH2
CCL3
CCH3
T2CON
CRCL
CRCH
TL2
00
00
00
00
00
00
00
00
00
00
00
00
.6
.6
.6
.6
.6
.6
.5
.4
.4
.4
.4
.4
.4
.2
.2
.2
.2
.2
.2
.0
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
.5
.0
.5
.0
.5
.0
.5
.0
.5
.0
2)
T2PS I3FR
I2FR
.5
T2R1 T2R0 T2CM T2I1
T2I0
.0
CA
.7
.6
.4
.3
.2
.1
H
CB
.7
.6
.5
.4
.3
.2
.1
.0
H
CC
CD
D0
.7
.6
.5
.4
.3
.2
.1
.0
H
TH2
.7
.6
.5
.4
.3
.2
.1
.0
H
2)
PSW
CY
BD
AC
CLK
F0
–
RS1
BSY
RS0
ADM
OV
MX2
F1
MX1
P
H
2)
H
D8
ADCON 00X0-
0000
MX0
B
D9
ADDAT
DAPR
P6
00
00
–
.7
.7
.7
.7
.7
.7
.7
.6
.6
.6
.6
.6
.6
.6
.5
.5
.5
.5
.5
.5
.5
.4
.4
.4
.4
.4
.4
.4
.3
.3
.3
.3
.3
.3
.3
.2
.2
.2
.2
.2
.2
.2
.1
.1
.1
.1
.1
.1
.1
.0
.0
.0
.0
.0
.0
.0
H
H
H
DA
DB
E0
H
H
2)
ACC
P4
00
H
H
2)
E8
F0
FF
H
H
2)
2)
B
00
H
H
F8
P5
FF
H
H
1) X means that the value is undefined and the location is reserved
2) Bit-addressable special function registers
Semiconductor Group
3-7
External Bus Interface
C515
4
External Bus Interface
The C515 allows for external memory expansion. The functionality and implementation of the
external bus interface is identical to the common interface for the 8051 architecture with one
exception : if the C515 is used in systems with no external memory the generation of the ALE signal
can be suppressed. Resetting bit EALE in SFR SYSCON register, the ALE signal will be gated off.
This feature reduces RFI emissions of the system.
4.1 Accessing External Memory
It is possible to distinguish between accesses to external program memory and external data
memory or other peripheral components respectively. This distinction is made by hardware:
accesses to external program memory use the signal PSEN (program store enable) as a read
strobe. Accesses to external data memory use RD and WR to strobe the memory (alternate
functions of P3.7 and P3.6). Port 0 and port 2 (with exceptions) are used to provide data and
address signals. In this section only the port 0 and port 2 functions relevant to external memory
accesses are described.
Fetches from external program memory always use a 16-bit address. Accesses to external data
memory can use either a 16-bit address (MOVX @DPTR) or an 8-bit address (MOVX @Ri).
4.1.1 Role of P0 and P2 as Data/Address Bus
When used for accessing external memory, port 0 provides the data byte time-multiplexed with the
low byte of the address. In this state, port 0 is disconnected from its own port latch, and the address/
data signal drives both FETs in the port 0 output buffers. Thus, in this application, the port 0 pins are
not open-drain outputs and do not require external pullup resistors.
During any access to external memory, the CPU writes FF to the port 0 latch (the special function
H
register), thus obliterating whatever information the port 0 SFR may have been holding.
Whenever a 16-bit address is used, the high byte of the address comes out on port 2, where it is
held for the duration of the read or write cycle. During this time, the port 2 lines are disconnected
from the port 2 latch (the special function register).
Thus the port 2 latch does not have to contain 1s, and the contents of the port 2 SFR are not
modified.
If an 8-bit address is used (MOVX @Ri), the contents of the port 2 SFR remain at the port 2 pins
throughout the external memory cycle. This will facilitate paging. It should be noted that, if a port 2
pin outputs an address bit that is a 1, strong pullups will be used for the entire read/write cycle and
not only for two oscillator periods.
Semiconductor Group
4-1
External Bus Interface
C515
a)
One Machine Cycle
One Machine Cycle
S1
S2
S3
S4
S5
S6
S1
S2
S3
S4
S5
S6
ALE
PSEN
RD
(A)
without
MOVX
PCH
OUT
PCH
OUT
PCH
OUT
PCH
OUT
P2
P0
INST.
IN
PCL
OUT
INST.
IN
PCL
OUT
INST.
IN
PCL
OUT
INST.
IN
PCL
OUT
INST.
IN
PCL OUT
valid
PCL OUT
valid
PCL OUT
valid
PCL OUT
valid
b)
One Machine Cycle
One Machine Cycle
S1
S2
S3
S4
S5
S6
S1
S2
S3
S4
S5
S6
ALE
PSEN
(B)
with
MOVX
RD
P2
PCH
OUT
DPH OUT OR
P2 OUT
PCH
OUT
INST.
IN
PCL
OUT
INST.
IN
DATA
IN
PCL
OUT
INST.
IN
P0
MCT03220
PCL OUT
valid
DPL or Ri
valid
PCL OUT
valid
Figure 4-1
External Program Memory Execution
Semiconductor Group
4-2
External Bus Interface
C515
4.1.2 Timing
The timing of the external bus interface, in particular the relationship between the control signals
ALE, PSEN, RD, WR and information on port 0 and port 2, is illustated in figure 4-1 a) and b).
Data memory:
in a write cycle, the data byte to be written appears on port 0 just before WR is
activated and remains there until after WR is deactivated. In a read cycle, the
incoming byte is accepted at port 0 before the read strobe is deactivated.
Program memory: Signal PSEN functions as a read strobe.
4.1.3 External Program Memory Access
The external program memory is accessed under two conditions:
- whenever signal EA is active (low); or
- whenever the program counter (PC) content is greater than 1FFF
H
When the CPU is executing out of external program memory, all 8 bits of port 2 are dedicated to an
output function and must not be used for general-purpose I/O. The content of the port 2 SFR
however is not affected. During external program memory fetches port 2 lines output the high byte
of the PC, and during accesses to external data memory they output either DPH or the port 2 SFR
(depending on whether the external data memory access is a MOVX @DPTR or a MOVX @Ri).
Since the C515-L has no internal program memory, accesses to program memory are always
external, and port 2 is at all times dedicated to output the high-order address byte. This means that
port 0 and port 2 of the C515-L can never be used as general-purpose I/O. This also applies to the
C515-1R when it operates with only an external program memory.
4.2 PSEN, Program Store Enable
The read strobe for external program memory fetches is PSEN. It is not activated for internal
program memory fetches. When the CPU is accessing external program memory, PSEN is
activated twice every instruction cycle (except during a MOVX instruction) no matter whether or not
the byte fetched is actually needed for the current instruction. When PSEN is activated its timing is
not the same as for RD. A complete RD cycle, including activation and deactivation of ALE and RD,
takes 6 oscillator periods. A complete PSEN cycle, including activation and deactivation of ALE and
PSEN, takes 3 oscillator periods. The execution sequence for these two types of read cycles is
shown in figure 4-1 a) and b).
4.3 Overlapping External Data and Program Memory Spaces
In some applications it is desirable to execute a program from the same physical memory that is
used for storing data. In the C515 the external program and data memory spaces can be combined
by the logical-AND of PSEN and RD. A positive result from this AND operation produces a low
active read strobe that can be used for the combined physical memory. Since the PSEN cycle is
faster than the RD cycle, the external memory needs to be fast enough to adapt to the PSEN cycle.
Semiconductor Group
4-3
External Bus Interface
C515
4.4 ALE, Address Latch Enable
The C515 allows to switch off the ALE output signal. If the internal ROM is used (EA=1 and
PC £ 1FFF ) and ALE is switched off by EALE=0, then, ALE will only go active during external data
H
memory accesses (MOVX instructions). If EA=0, the ALE generation is always enabled and the bit
EALE has no effect.
After a hardware reset the ALE generation is enabled.
Special Function Register SYSCON (Address B1 )
H
Reset Value : XX1XXXXX
B
Bit No. MSB
LSB
7
6
–
5
4
–
3
–
2
–
1
0
–
B1
SYSCON
EALE
–
–
H
Bit
Function
EALE
Enable ALE output
EALE = 0 : ALE generation is disabled; disables ALE signal generation
during internal code memory accesses (EA=1). With EA=1,
ALE is automatically generated at MOVX instructions.
EALE = 1 : ALE generation is enabled
If EA=0, the ALE generation is always enabled and the bit EALE has no
effect on the ALE generation.
–
Reserved bits for future use, read by CPU returns undefined values.
Note: The ALE swicth-off feature is available in C515-LM/1RM versions only. In case of the
C515-LN/1RN versions, the SYSCON register is present without function.
Semiconductor Group
4-4
External Bus Interface
C515
4.5 Enhanced Hooks Emulation Concept
The Enhanced Hooks Emulation Concept of the C500 microcontroller family is a new, innovative
way to control the execution of C500 MCUs and to gain extensive information on the internal
operation of the controllers. Emulation of on-chip ROM based programs is possible, too.
Each C500 production chip has built-in logic for the support of the Enhanced Hooks Emulation
Concept. Therefore, no costly bond-out chips are necessary for emulation. This also ensure that
emulation and production chips are identical.
1)
The Enhanced Hooks TechnologyTM , which requires embedded logic in the C500 allows the C500
together with an EH-IC to function similar to a bond-out chip. This simplifies the design and reduces
costs of an ICE-system. ICE-systems using an EH-IC and a compatible C500 are able to emulate
all operating modes of the different versions of the C500 microcontrollers. This includes emulation
of ROM, ROM with code rollover and ROMless modes of operation. It is also able to operate in
single step mode and to read the SFRs after a break.
ICE-System Interface
to Emulation Hardware
RESET
SYSCON
PCON
RSYSCON
RPCON
EA
ALE
EH-IC
TCON
RTCON
PSEN
C500
MCU
Enhanced Hooks
Interface Circuit
Port 0
Port 2
Optional
I/O Ports
Port 3 Port 1
RPort 2 RPort 0
TEA TALE TPSEN
MCS02647
Target System Interface
Figure 4-2
Basic C500 MCU Enhanced Hooks Concept Configuration
Port 0, port 2 and some of the control lines of the C500 based MCU are used by Enhanced Hooks
Emulation Concept to control the operation of the device during emulation and to transfer
informations about the program execution and data transfer between the external emulation
hardware (ICE-system) and the C500 MCU.
1 “Enhanced Hooks Technology“ is a trademark and patent of Metalink Corporation licensed to Siemens.
Semiconductor Group
4-5
External Bus Interface
C515
4.6 ROM Protection for the C515
The C515-1R allows to protect the contents of the internal ROM against unauthorized read out. The
type of ROM protection (protected or unprotected) is fixed with the ROM mask. Therefore, the
customer of a C515-1R version has to define whether ROM protection has to be selected or not.
The C515-1R devices, which operate from internal ROM, are always checked for correct ROM
contents during production test. Therefore, unprotected as well as protected ROMs must provide a
procedure to verify the ROM contents. In ROM verification mode 1, which is used to verify
unprotected ROMs, a ROM address is applied externally to the C515-1R and the ROM data byte is
output at port 0. ROM verification mode 2, which is used to verify ROM protected devices, operates
different : ROM addresses are generated internally and the expected data bytes must be applied
externally to the device (by the manufacturer or by the customer) and are compared internally with
the data bytes from the ROM. After 16 byte verify operations the state of the P3.5 pin shows whether
the last 16 bytes have been verified correctly.
This mechanism provides a very high security of ROM protection. Only the owner of the ROM code
and the manufacturer who know the contents of the ROM can read out and verify it with less effort.
The behaviour of the move code instruction, when the code is executed from the external ROM, is
in such a way that accessing a code byte from a protected on-chip ROM address is not possible. In
this case the state of the EA pin is always latched with the rising edge of RESET and the byte
accessed will be invalid.
4.6.1 Unprotected ROM Mode
If the ROM is unprotected, the ROM verification mode 1 as shown in figure 4-3 is used to read out
the contents of the ROM. The AC timing characteristics of the ROM verification mode is shown in
the AC specifications (chapter 10).
P1.0 - P1.7
P2.0 - P2.4
Address 1
Address 2
Port 0
Data 1 Out
Data 2 Out
Inputs: PSEN = VSS
ALE, EA = VIH /VIH2
RESET = VIL2
MCT03221
Figure 4-3
ROM Verification Mode 1
ROM verification mode 1 is selected if the inputs PSEN, ALE, EA, and RESET are put to the
specified logic level. Then the 14-bit address of the internal ROM byte to be read is applied to the
port 1 and port 2 lines. After a delay time, port 0 outputs the content of the addressed ROM cell. In
ROM verification mode 1, the C515 must be provided with a system clock at the XTAL pins and
pullup resistors on the port 0 lines.
Semiconductor Group
4-6
External Bus Interface
C515
4.6.2 Protected ROM Mode
If the ROM is protected, the ROM verification mode 2 as shown in figure 4-4 is used to verify the
contents of the ROM. The detailed timing characteristics of the ROM verification mode is shown in
the AC specifications (chapter 10).
RESET
12 tCLCL
6 tCLCL
1. ALE Pulse
after Reset
ALE
Latch
Data for
Latch
Latch
Data for
Latch
Data for
Addr. 1
Data for
Data for
Port 0
P3.5
Addr. 0
Addr. X-16-1
Addr. X-16
Addr. x-16+1
Low : Error
High : OK
Inputs : ALE =VSS
PSEN, EA =VIH
RESET =
MCT03222
Figure 4-4
ROM Verification Mode 2
ROM verification mode 2 is selected if the inputs PSEN, EA, and ALE are put to the specified logic
levels. With RESET going inactive, the ROM verification mode 2 sequence is started. The C515
outputs an ALE signal with a period of 3 CLP and expects data bytes at port 0. The data bytes at port
0 are assigned to the ROM addresses in the following way :
1. Data Byte = content of internal ROM address 0000
H
2. Data Byte = content of internal ROM address 0001
H
3. Data Byte = content of internal ROM address 0002
H
:
16. Data Byte= content of internal ROM address 000F
:
H
The C515-1R does not output any address information during the ROM verification mode 2. The
first data byte to be verified is always the byte which is assigned to the internal ROM address 0000
H
and is put onto the data bus with the first rising edge of ALE. With each following ALE pulse the
ROM address pointer is internally incremented and the expected data byte for the next ROM
address must be delivered externally.
Between two ALE pulses the data at port 0 is latched (at 3 CLP after ALE rising edge) and compared
internally with the ROM content of the actual address. If an verify error is detected, the error
Semiconductor Group
4-7
External Bus Interface
C515
condition is stored internally. After each 16th data byte the cumulated verify result (pass or fail) of
the last 16 verify operations is output at P3.5. This means that P3.5 stays at static level (low for fail
and high for pass) during the 16 bytes are checked. In ROM verification mode 2, the C515 must be
provided with a system clock at the XTAL pins.
Figure 4-5 shows an application example of an external circuitry which allows to verify a protected
ROM inside the C515-1R in ROM verification mode 2. With RESET going inactive, the C515-1R
starts the ROM verify sequence. Its ALE is clocking a 13-bit address counter. This counter
generates the addresses for an external EPROM which is programmed with the contents of the
internal (protected) ROM. The verify detect logic typically displays the pass/fail information of the
verify operation. P3.5 can be latched with the falling edge of ALE.
When the last byte of the internal ROM has been handled, the C515-1R starts generating a PSEN
signal. This signal or the CY signal of the address counter indicate to the verify detect logic the end
of the internal ROM verification.
P3.5
Verify
Detect
Logic
Carry
CLK
ALE
13-Bit
Address
Counter
2 k
W
A0 - A12
S
C515-1R
&
RESET
Compare
Code
ROM
VCC
&
Port 0
EA
D0 - D7
VCC
PSEN
CS
OE
MCS03223
Figure 4-5
ROM Verification Mode 2 - External Circuitry Example
Semiconductor Group
4-8
Reset / System Clock
C515
5
Reset and System Clock Operation
5.1 Hardware Reset Operation
The hardware reset function incorporated in the C515 allows for an easy automatic start-up at a
minimum of additional hardware and forces the controller to a predefined default state. The
hardware reset function can also be used during normal operation in order to restart the device. This
is particularly done when the power-down mode is to be terminated.
Additional to the hardware reset, which is applied externally to the C515, there exists another
internal reset source, the watchdog timer. This chapter deals only with the external hardware reset.
The reset input is an active low input. An internal Schmitt trigger is used at the input for noise
rejection. Since the reset is synchronized internally, the RESET pin must be held low for at least two
machine cycles (24 oscillator periods) while the oscillator is running. With the oscillator running the
internal reset is executed during the second machine cycle and is repeated every cycle until RESET
goes high again.
During reset, pins ALE and PSEN are configured as inputs and should not be stimulated or driven
externally. (An external stimulation at these lines during reset activates several test modes which
are reserved for test purposes. This in turn may cause unpredictable output operations at several
port pins).
At the reset pin, a pullup resistor is internally connected to VCC to allow a power-up reset with an
external capacitor only. An automatic power-up reset can be obtained when VCC is applied by
connecting the reset pin to VSS via a capacitor. After VCC has been turned on, the capacitor must hold
the voltage level at the reset pin for a specific time to effect a complete reset.
Semiconductor Group
5-1
Reset / System Clock
C515
The time required for a reset operation is the oscillator start-up time plus 2 machine cycles, which,
under normal conditions, must be at least 10 - 20 ms for a crystal oscillator. This requirement is
typically met using a capacitor of 4.7 to 10 mF. The same considerations apply if the reset signal is
generated externally (figure 5-1 b). In each case it must be assured that the oscillator has started
up properly and that at least two machine cycles have passed before the reset signal goes inactive.
a)
b)
&
RESET
RESET
+
C515
C515
c)
RESET
+
C515
MCS03203
Figure 5-1
Reset Circuitries
A correct reset leaves the processor in a defined state. The program execution starts at location
0000 . After reset is internally accomplished the port latches are set to FF . This leaves port 0
H
H
floating, since it is an open drain port when not used as data/address bus. All other I/O port lines
(ports 1 to 5) output a one (1). Port 6 is an input-only port. It has no internal latch and therefore the
contents of the special function registers P6 depend on the levels applied to port 6.
The content of the internal RAM of the C515 is not affected by a reset. After power-up the content
is undefined, while it remains unchanged during a reset if the power supply is not turned off.
Semiconductor Group
5-2
Reset / System Clock
C515
5.2 Hardware Reset Timing
This section describes the timing of the hardware reset signal.
The input pin RESET is sampled once during each machine cycle. This happens in state 5 phase
2. Thus, the external reset signal is synchronized to the internal CPU timing. When the reset is
found active (low level) the internal reset procedure is started. It needs two complete machine
cycles to put the complete device to its correct reset state, i.e. all special function registers contain
their default values, the port latches contain 1's etc. Note that this reset procedure is also performed
if there is no clock available at the device. (This is done by the oscillator watchdog, which provides
an auxiliary clock for performing a perfect reset without clock at the XTAL1 and XTAL2 pins). The
RESET signal must be active for at least one machine cycle; after this time the C515 remains in its
reset state as long as the signal is active. When the signal goes inactive this transition is recognized
in the following state 5 phase 2 of the machine cycle. Then the processor starts its address output
(when configured for external ROM) in the following state 5 phase 1. One phase later (state 5 phase
2) the first falling edge at pin ALE occurs.
Figure 5-2 shows this timing for a configuration with EA = 0 (external program memory). Thus,
between the release of the RESET signal and the first falling edge at ALE there is a time period of
at least one machine cycle but less than two machine cycles.
One Machine Cycle
S4
S5
S6
S1
S2
S3
S4
S5
S6
S1
S2
S3
S4
S5
S6
S1
S2
P1 P2
RESET
P0
PCL
OUT
Inst. PCL
IN OUT
PCH
OUT
PCH
OUT
P2
ALE
MCT01879
Figure 5-2
CPU Timing after Reset
Semiconductor Group
5-3
Reset / System Clock
C515
5.3 Oscillator and Clock Circuit
XTAL1 and XTAL2 are the output and input of a single-stage on-chip inverter which can be
configured with off-chip components as a Pierce oscillator. The oscillator, in any case, drives the
internal clock generator. The clock generator provides the internal clock signals to the chip. These
signals define the internal phases, states and machine cycles.
Figure 5-3 shows the recommended oscillator circuit.
C
XTAL2
1 - 24 MHz
C
C515
XTAL1
C = 20 pF ± 10 pF for Crystal Operation
MCS03225
Figure 5-3
Recommended Oscillator Circuitry
In this application the on-chip oscillator is used as a crystal-controlled, positive-reactance oscillator
(a more detailed schematic is given in figure 5-4). lt is operated in its fundamental response mode
as an inductive reactor in parallel resonance with a capacitor external to the chip. The crystal
specifications and capacitances are non-critical. In this circuit 20 pF can be used as single
capacitance at any frequency together with a good quality crystal. A ceramic resonator can be used
in place of the crystal in cost-critical applications. If a ceramic resonator is used, the two capacitors
normally have different values depending on the oscillator frequency. We recommend consulting
the manufacturer of the ceramic resonator for value specifications of these capacitors.
Semiconductor Group
5-4
Reset / System Clock
C515
To Internal
Timing Circuitry
C515
XTAL1
XTAL2
1)
C1
C2
1)
MCS03226
Crystal or Ceramic Resonator
Figure 5-4
On-Chip Oscillator Circuitry
To drive the C515 with an external clock source, the external clock signal has to be applied to
XTAL2, as shown in figure 5-5. XTAL1 has to be left unconnected. A pullup resistor is suggested
(to increase the noise margin), but is optional if VOH of the driving gate corresponds to the VIH2
specification of XTAL2.
VCC
C515
N.C.
XTAL1
External
Clock Signal
XTAL2
MCS03227
Figure 5-5
External Clock Source
Semiconductor Group
5-5
Reset / System Clock
C515
5.4 System Clock Output
For peripheral devices requiring a system clock, the C515 provides a clock output signal derived
from the oscillator frequency as an alternate output function on pin P1.6/CLKOUT. lf bit CLK is set
(bit 6 of special function register ADCON), a clock signal with 1/12 of the oscillator frequency is
gated to pin P1.6/CLKOUT. To use this function the port pin must be programmed to a one (1),
which is also the default after reset.
Special Function Register ADCON (Address D8 )
H
Reset Value : 00X000000
B
LSB
D8
MSB
Bit No.
D8
DF
DE
DD
–
DC
DB
DA
D9
H
H
H
H
H
H
H
H
BD
CLK
BSY
ADM
MX2
MX1
MX0
ADCON
H
The shaded bits are not used for clock output control.
Bit
Function
CLK
Clockout enable bit
When set, pin P1.6/CLKOUT outputs the system clock which is 1/12 of the
oscillator frequency.
–
Reserved bit for future use. Read by CPU returns undefined value.
The system clock is high during S3P1 and S3P2 of every machine cycle and low during all other
states. Thus, the duty cycle of the clock signal is 1:6. Associated with a MOVX instruction the
system clock coincides with the last state (S3) in which a RD or WR signal is active. A timing
diagram of the system clock output is shown in figure 5-6.
Note : During slow-down operation the frequency of the CLKOUT signal is divided by 8.
Semiconductor Group
5-6
Reset / System Clock
C515
S6 S1 S2 S3 S4 S5 S6 S1 S2 S3 S4 S5 S6 S1 S2
ALE
PSEN
RD,WR
CLKOUT
MCT01858
Figure 5-6
Timing Diagram - System Clock Output
Semiconductor Group
5-7
On-Chip Peripheral Components
C515
6
On-Chip Peripheral Components
This chapter gives detailed information about all on-chip peripherals of the C515 except for the
integrated interrupt controller, which is described separately in chapter 7.
6.1
Parallel I/O
The C515 has six 8-bit I/O ports and one 8-bit input port for analog/digital input. Port 0 is an open-
drain bidirectional I/O port, while ports 1 to 5 are quasi-bidirectional I/O ports with internal pullup
resistors. That means, when configured as inputs, ports 1 to 5 will be pulled high and will source
current when externally pulled low. Port 0 will float when configured as input.
The output drivers of port 0 and 2 and the input buffers of port 0 are also used for accessing external
memory. In this application, port 0 outputs the low byte of the external memory address, time
multiplexed with the byte being written or read. Port 2 outputs the high byte of the external memory
address when the address is 16 bits wide. Otherwise, the port 2 pins continue emitting the P2 SFR
contents. In this function, port 0 is not an open-drain port, but uses a strong internal pullup FET .
6.1.1
Port Structures
The C515 generally allows digital I/O on 48 lines grouped into 6 bidirectional C501 compatible 8-bit
ports and one 8-bit analog/digital input port. Each port bit (except port 6) consists of a latch, an
output driver and an input buffer. Read and write accesses to the I/O ports P0 to P5 are performed
via their corresponding special function registers. Depending on the specific ports, multiple
functions are assigned to the port pins. These alternate functions of the port pins are listed in
table 6-1.
When port 6 is used as analog input, an analog channel is switched to the A/D converter through a
3-bit multiplexer, which is controlled by three bits in SFR ADCON (see chapter 6.4). Port 6 lines
may also be used as digital inputs. In this case they are addressed as an input port via SFR P6.
Since port 6 has no internal latch, the contents of SFR P6 only depends on the levels applied to the
input lines. It makes no sense to output a value to these input-only port by writing to the SFR P6.
This will have no effect.
Semiconductor Group
6-1
On-Chip Peripheral Components
C515
Table 6-1
Alternate Functions of Port 1 and 3
Port
Alternate
Description
Functions
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5
P1.6
P1.7
INT3 / CC0
INT4 / CC1
INT5 / CC2
INT6 / CC3
INT2
T2EX
CLKOUT
T2
External Interrupt 3 input / Capture/compare 0 input/output
External Interrupt 4 input / Capture/compare 1 input/output
External Interrupt 5 input / Capture/compare 2 input/output
External Interrupt 6 input / Capture/compare 3 input/output
External Interrupt 2 input
Timer 2 external reload/trigger input
System clock output
Timer 2 external count input
P3.0
P3.1
RxD
TxD
Serial port’s receiver data input (asynchronous) or
data input/output (synchronous)
Serial port’s transmitter data output (asynchronous)
or data clock output (synchronous)
P3.2
P3.3
P3.4
P3.5
P3.6
P3.7
INT0
INT1
T0
T1
WR
RD
External interrupt 0 input, timer 0 gate control
External interrupt 1 input, timer 1 gate control
Timer 0 external count input
Timer 1 external count input
External data memory write strobe
External data memory read strobe
Semiconductor Group
6-2
On-Chip Peripheral Components
C515
6.1.2 Standard I/O Port Circuitry
Figure 6-1 shows a functional diagram of a typical bit latch and I/O buffer, which is the core of each
of the six I/O-ports. The bit latch (one bit in the port’s SFR) is represented as a type-D flip-flop, which
will clock in a value from the internal bus in response to a "write-to-latch" signal from the CPU. The
Q output of the flip-flop is placed on the internal bus in response to a "read-latch" signal from the
CPU. The level of the port pin itself is placed on the internal bus in response to a "read-pin" signal
from the CPU. Some instructions that read from a port (i.e. from the corresponding port SFR P0 to
P4) activate the "read-latch" signal, while others activate the "read-pin" signal.
Read
Latch
Q
Int. Bus
D
Port
Latch
Port
Driver
Circuit
Port
Pin
Write
to
Latch
Q
CLK
MCS01822
Read
Pin
Figure 6-1
Basic Structure of a Port Circuitry
Semiconductor Group
6-3
On-Chip Peripheral Components
C515
The output drivers of port 1 to 5 have internal pullup FET’s (see figure 6-2). Each I/O line can be
used independently as an input or output. To be used as an input, the port bit stored in the bit latch
must contain a one (1) (that means for figure 6-2: Q=0), which turns off the output driver FET n1.
Then, for ports 1 to 5 the pin is pulled high by the internal pullups, but can be pulled low by an
external source. When externally pulled low the port pins source current (IIL or ITL). For this reason
these ports are called "quasi-bidirectional".
Read
Latch
VCC
Internal
Pull Up
Arrangement
Q
Q
Pin
Int. Bus
D
Bit
Latch
Write
to
Latch
n1
CLK
MCS01823
Read
Pin
Figure 6-2
Basic Output Driver Circuit of Ports 1 to 5
Semiconductor Group
6-4
On-Chip Peripheral Components
C515
6.1.2.1 Port 0 Circuitry
Port 0, in contrast to ports 1 to 4, is considered as "true" bidirectional, because the port 0 pins float
when configured as inputs. Thus, this port differs in not having internal pullups. The pullup FET in
the P0 output driver (see figure 6-3) is used only when the port is emitting 1’s during the external
memory accesses. Otherwise, the pullup is always off. Consequently, P0 lines that are used as
output port lines are open drain lines. Writing a "1" to the port latch leaves both output FETs off and
the pin floats. In that condition it can be used as high-impedance input. If port 0 is configured as
general I/O port and has to emit logic high-level (1), external pullups are required.
Addr./Data
VCC
Control
Read
Latch
&
=1
Port
Pin
Int. Bus
D
Q
Q
Bit
Latch
Write to
Latch
MUX
CLK
Read
Pin
MCS02434
Figure 6-3
Port 0 Circuitry
Semiconductor Group
6-5
On-Chip Peripheral Components
C515
6.1.2.2 Port 1, Port 3 to Port 5 Circuitry
The pins of ports 1, 3, 4, and 5 are multifunctional. They are port pins and also serve to implement
special features as listed in table 6-1.
Figure 6-4 shows a functional diagram of a port latch with alternate function. To pass the alternate
function to the output pin and vice versa, however, the gate between the latch and driver circuit must
be open. Thus, to use the alternate input or output functions, the corresponding bit latch in the port
SFR has to contain a one (1); otherwise the pulldown FET is on and the port pin is stuck at 0. After
reset all port latches contain ones (1).
Alternate
Output
Function
VCC
Read
Latch
Internal
Pull Up
Arrangement
Pin
Q
Q
&
Int. Bus
D
Bit
Latch
Write
to
Latch
CLK
MCS01827
Read
Pin
Alternate
Input
Function
Figure 6-4
Ports 1, 3, 4 and 5
Semiconductor Group
6-6
On-Chip Peripheral Components
C515
6.1.2.3 Port 2 Circuitry
As shown in figure 6-3 and below in figure 6-5, the output drivers of ports 0 and 2 can be switched
to an internal address or address/data bus for use in external memory accesses. In this application
they cannot be used as general purpose I/O, even if not all address lines are used externally. The
switching is done by an internal control signal dependent on the input level at the EA pin and/or the
contents of the program counter. If the ports are configured as an address/data bus, the port latches
are disconnected from the driver circuit. During this time, the P0/P2 SFR remains unchanged. Being
an address/data bus, port 0 uses a pullup FET as shown in figure 6-3. When a 16-bit address is
used, port 2 uses the additional strong pullups p1 (figure 6-6) to emit 1’s for the entire external
memory cycle instead of the weak ones (p2 and p3) used during normal port activity.
Addr. Control
VCC
Read
Latch
Internal
Pull Up
Arrangement
Port
Pin
Int. Bus
D
Q
Q
Bit
Latch
MUX
Write to
Latch
CLK
=1
Read
Pin
MCS03228
Figure 6-5
Port 2 Circuitry
If no external bus cycles are generated using data or code memory accesses, port 0 can be used
for I/O functions.
Semiconductor Group
6-7
On-Chip Peripheral Components
C515
Addr.
Control
VCC
Q
_
<
1
MUX
_
<
1
p1
p2
p3
Delay
1 State
Port
Pin
= 1
n1
VSS
= 1
= 1
Input Data (Read Pin)
MCS03229
Figure 6-6
Port 2 Pull-up Arrangement
Port 2 in I/O function works similar to the standard port driver circuitry (section 6.1.2.4) whereas in
address output function it works similar to Port 0 circuitry.
Semiconductor Group
6-8
On-Chip Peripheral Components
C515
6.1.2.4 Detailed Output Driver Circuitry
In fact, the pullups mentioned before and included in figure 6-2, 6-4 and 6-5 are pullup
arrangements.
Figure 6-7 shows the detailed output driver (pullup arrangement) circuit of the the port 1 and 3 to 5
port lines. The basic circuitry of these ports is shown in figure 6-4. The pullup arrangement of these
port lines has one n-channel pulldown FET and three pullup FETs:
VCC
Delay = 1 State
=1
_
<
1
p1
p2
p3
Port
Pin
n1
Q
VSS
=1
=1
Input Data
(Read Pin)
MCS03230
Figure 6-7
Driver Circuit of Ports 1, 3 to 6
– The pulldown FET n1 is of n-channel type. It is a very strong driver transistor which is capable
of sinking high currents (IOL); it is only activated if a "0" is programmed to the port pin. A short
circuit to VCC must be avoided if the transistor is turned on, since the high current might destroy
the FET. This also means that no “0“ must be programmed into the latch of a pin that is used
as input.
– The pullup FET p1 is of p-channel type. It is activated for two oscillator periods (S1P1 and
S1P2) if a 0-to-1 transition is programmed to the port pin, i.e. a "1" is programmed to the port
latch which contained a "0". The extra pullup can drive a similar current as the pulldown FET
n1. This provides a fast transition of the logic levels at the pin.
– The pullup FET p2 is of p-channel type. It is always activated when a "1" is in the port latch,
thus providing the logic high output level. This pullup FET sources a much lower current than
p1; therefore the pin may also be tied to ground, e.g. when used as input with logic low input
level.
Semiconductor Group
6-9
On-Chip Peripheral Components
C515
– The pullup FET p3 is of p-channel type. It is only activated if the voltage at the port pin is
higher than approximately 1.0 to 1.5 V. This provides an additional pullup current if a logic
high level shall be output at the pin (and the voltage is not forced lower than approximately
1.0 to 1.5 V). However, this transistor is turned off if the pin is driven to a logic low level, e.g
when used as input. In this configuration only the weak pullup FET p2 is active, which sources
the current IIL . If, in addition, the pullup FET p3 is activated, a higher current can be sourced
(ITL). Thus, an additional power consumption can be avoided if port pins are used as inputs
with a low level applied. However, the driving capability is stronger if a logic high level is
output.
The described activating and deactivating of the four different transistors translates into four states
the pins can be:
–
–
–
–
input low state (IL), p2 active only
input high state (IH) = steady output high state (SOH) p2 and p3 active
forced output high state (FOH), p1, p2 and p3 active
output low state (OL), n1 active
If a pin is used as input and a low level is applied, it will be in IL state, if a high level is applied, it will
switch to IH state.
If the latch is loaded with "0", the pin will be in OL state.
If the latch holds a "0" and is loaded with "1", the pin will enter FOH state for two cycles and then
switch to SOH state. If the latch holds a "1" and is reloaded with a "1" no state change will occur.
At the beginning of power-on reset the pins will be in IL state (latch is set to "1", voltage level on pin
is below of the trip point of p3). Depending on the voltage level and load applied to the pin, it will
remain in this state or will switch to IH (=SOH) state.
If it is used as output, the weak pull-up p2 will pull the voltage level at the pin above p3’s trip point
after some time and p3 will turn on and provide a strong "1". Note, however, that if the load exceeds
the drive capability of p2 (IIL), the pin might remain in the IL state and provide a week "1" until the
first 0-to-1 transition on the latch occurs. Until this the output level might stay below the trip point of
the external circuitry.
The same is true if a pin is used as bidirectional line and the external circuitry is switched from
output to input when the pin is held at "0" and the load then exceeds the p2 drive capabilities.
If the load exceeds IIL the pin can be forced to "1" by writing a "0" followed by a "1" to the port pin.
Semiconductor Group
6-10
On-Chip Peripheral Components
C515
6.1.3 Port Timing
When executing an instruction that changes the value of a port latch, the new value arrives at the
latch during S6P2 of the final cycle of the instruction. However, port latches are only sampled by
their output buffers during phase 1 of any clock period (during phase 2 the output buffer holds the
value it noticed during the previous phase 1). Consequently, the new value in the port latch will not
appear at the output pin until the next phase 1, which will be at S1P1 of the next machine cycle.
When an instruction reads a value from a port pin (e.g. MOV A, P1) the port pin is actually sampled
in state 5 phase 1 or phase 2 depending on port and alternate functions. Figure 6-8 illustrates this
port timing. It must be noted that this mechanism of sampling once per machine cycle is also used
if a port pin is to detect an "edge", e.g. when used as counter input. In this case an "edge" is
detected when the sampled value differs from the value that was sampled the cycle before.
Therefore, there must be met certain reqirements on the pulse length of signals in order to avoid
signal "edges" not being detected. The minimum time period of high and low level is one machine
cycle, which guarantees that this logic level is noticed by the port at least once.
S4
S5
S6
S1
S2
S3
P1 P2
P1 P2
P1 P2
P1 P2
P1 P2
P1 P2
XTAL2
Input sampled:
e.g. MOV A, P1
P1 active for 1 State
(driver transistor)
Old Data
New Data
Port
MCT03231
Figure 6-8
Port Timing
Semiconductor Group
6-11
On-Chip Peripheral Components
C515
6.1.4 Port Loading and Interfacing
The output buffers of ports 1 to 5 can drive TTL inputs directly. The maximum port load which still
guarantees correct logic output levels can be be looked up in the DC characteristics in the Data
Sheet of the C515 or in chapter 10 of this User’s Manual. The corresponding parameters are VOL
and VOH.
The same applies to port 0 output buffers. They do, however, require external pullups to drive
floating inputs, except when being used as the address/data bus.
When used as inputs it must be noted that the ports 1 to 5 are not floating but have internal pullup
transistors. The driving devices must be capable of sinking a sufficient current if a logic low level
shall be applied to the port pin (the parameters ITL and IIL in the DC characteristics specify these
currents). Port 0 as well as port 1 programmed to analog input function, however, have floating
inputs when used for digital input.
Semiconductor Group
6-12
On-Chip Peripheral Components
C515
6.1.5 Read-Modify-Write Feature of Ports 0 to 5
Some port-reading instructions read the latch and others read the pin. The instructions reading the
latch rather than the pin read a value, possibly change it, and then rewrite it to the latch. These are
called "read-modify-write"- instructions, which are listed in table 6-2. If the destination is a port or a
port pin, these instructions read the latch rather than the pin. Note that all other instructions which
can be used to read a port, exclusively read the port pin. In any case, reading from latch or pin,
resp., is performed by reading the SFR P0, P2 and P3; for example, "MOV A, P3" reads the value
from port 3 pins, while "ANL P3, #0AAH" reads from the latch, modifies the value and writes it back
to the latch.
It is not obvious that the last three instructions in table 6-2 are read-modify-write instructions, but
they are. The reason is that they read the port byte, all 8 bits, modify the addressed bit, then write
the complete byte back to the latch.
Table 6-2
"Read-Modify-Write"-Instructions
Instruction
ANL
Function
Logic AND; e.g. ANL P1, A
ORL
Logic OR; e.g. ORL P2, A
XRL
Logic exclusive OR; e.g. XRL P3, A
Jump if bit is set and clear bit; e.g. JBC P1.1, LABEL
Complement bit; e.g. CPL P3.0
Increment byte; e.g. INC P4
Decrement byte; e.g. DEC P5
Decrement and jump if not zero; e.g. DJNZ P3, LABEL
Move carry bit to bit y of port x
Clear bit y of port x
JBC
CPL
INC
DEC
DJNZ
MOV Px.y,C
CLR Px.y
SETB Px.y
Set bit y of port x
The reason why read-modify-write instructions are directed to the latch rather than the pin is to avoid
a possible misinterpretation of the voltage level at the pin. For example, a port bit might be used to
drive the base of a transistor. When a "1" is written to the bit, the transistor is turned on. If the CPU
then reads the same port bit at the pin rather than the latch, it will read the base voltage of the
transitor (approx. 0.7 V, i.e. a logic low level!) and interpret it as "0". For example, when modifying
a port bit by a SETB or CLR instruction, another bit in this port with the above mentioned
configuration might be changed if the value read from the pin were written back to th latch. However,
reading the latch rater than the pin will return the correct value of "1".
Semiconductor Group
6-13
On-Chip Peripheral Components
C515
6.2 Timers/Counters
The C515 contains three general purpose 16-bit timers/counters, timer 0, 1, and 2, which are useful
in many applications for timing and counting.
In "timer" function, the timer register is incremented every machine cycle. Thus one can think of it
as counting machine cycles. Since a machine cycle consists of 12 oscillator periods, the counter
rate is 1/12 of the oscillator frequency.
In "counter" function, the register is incremented in response to a 1-to-0 transition (falling edge) at
its corresponding external input pin, T0 or T1 (alternate functions of P3.4 and P3.5, resp.). In this
function the external input is sampled during S5P2 of every machine cycle. When the samples show
a high in one cycle and a low in the next cycle, the count is incremented. The new count value
appears in the register during S3P1 of the cycle following the one in which the transition was
detected. Since it takes two machine cycles (24 oscillator periods) to recognize a 1-to-0 transition,
the maximum count rate is 1/24 of the oscillator frequency. There are no restrictions on the duty
cycle of the external input signal, but to ensure that a given level is sampled at least once before it
changes, it must be held for at least one full machine cycle.
6.2.1
Timer/Counter 0 and 1
Timer / counter 0 and 1 of the C515 are fully compatible with timer / counter 0 and 1 of the C501
and can be used in the same four operating modes:
Mode 0: 8-bit timer/counter with a divide-by-32 prescaler
Mode 1: 16-bit timer/counter
Mode 2: 8-bit timer/counter with 8-bit auto-reload
Mode 3: Timer/counter 0 is configured as one 8-bit timer/counter and one 8-bit timer; Timer/
counter 1 in this mode holds its count. The effect is the same as setting TR1 = 0.
External inputs INT0 and INT1 can be programmed to function as a gate for timer/counters 0 and 1
to facilitate pulse width measurements.
Each timer consists of two 8-bit registers (TH0 and TL0 for timer/counter 0, TH1 and TL1 for timer/
counter 1) which may be combined to one timer configuration depending on the mode that is
established. The functions of the timers are controlled by two special function registers TCON and
TMOD.
In the following descriptions the symbols TH0 and TL0 are used to specify the high-byte and the
low-byte of timer 0 (TH1 and TL1 for timer 1, respectively). The operating modes are described and
shown for timer 0. If not explicity noted, this applies also to timer 1.
Semiconductor Group
6-14
On-Chip Peripheral Components
C515
6.2.1.1 Timer/Counter 0 and 1 Registers
Totally six special function registers control the timer/counter 0 and 1 operation :
– TL0/TH0 and TL1/TH1 - counter registers, low and high part
– TCON and TMOD - control and mode select registers
Special Function Register TL0 (Address 8A )
H
Reset Value : 00
H
H
H
H
Special Function Register TH0 (Address 8C )
H
Reset Value : 00
Reset Value : 00
Reset Value : 00
Special Function Register TL1 (Address 8B )
H
Special Function Register TH1 (Address 8D )
H
Bit No.
MSB
7
LSB
0
6
5
4
3
2
1
8A
H
.7
.6
.5
.4
.3
.2
.1
.0
TL0
TH0
8C
H
.7
.6
.5
.4
.3
.2
.1
.0
8B
H
.7
.7
.6
.6
.5
.5
.4
.4
.3
.3
.2
.2
.1
.1
.0
.0
TL1
TH1
8D
H
Bit
Function
TLx.7-0
x=0-1
Timer/counter 0/1 low register
Operating Mode Description
0
1
2
3
"TLx" holds the 5-bit prescaler value.
"TLx" holds the lower 8-bit part of the 16-bit timer/counter value.
"TLx" holds the 8-bit timer/counter value.
TL0 holds the 8-bit timer/counter value; TL1 is not used.
THx.7-0
x=0-1
Timer/counter 0/1 high register
Operating Mode Description
0
1
2
3
"THx" holds the 8-bit timer/counter value.
"THx" holds the higher 8-bit part of the 16-bit timer/counter value
"THx" holds the 8-bit reload value.
TH0 holds the 8-bit timer value; TH1 is not used.
Semiconductor Group
6-15
On-Chip Peripheral Components
C515
Special Function Register TCON (Address 88 )
Reset Value : 00
H
H
Bit No.
MSB
7
LSB
0
6
5
4
3
2
1
8F
8E
8D
8C
8B
8A
89
88
H
H
H
H
H
H
H
H
88
H
TF1
TR1
TF0
TR0
IE1
IT1
IE0
IT0
TCON
The shaded bits are not used in controlling timer/counter 0 and 1.
Bit
Function
TR0
Timer 0 run control bit
Set/cleared by software to turn timer/counter 0 ON/OFF.
TF0
Timer 0 overflow flag
Set by hardware on timer/counter overflow.
Cleared by hardware when processor vectors to interrupt routine.
TR1
TF1
Timer 1 run control bit
Set/cleared by software to turn timer/counter 1 ON/OFF.
Timer 1 overflow flag
Set by hardware on timer/counter overflow.
Cleared by hardware when processor vectors to interrupt routine.
Semiconductor Group
6-16
On-Chip Peripheral Components
C515
Special Function Register TMOD (Address 89 )
Reset Value : 00
H
H
Bit No.
MSB
7
LSB
0
6
5
4
3
2
1
89
H
Gate
C/T
M1
M0
Gate
C/T
M1
M0
TMOD
Timer 1 Control
Timer 0 Control
Bit
Function
GATE
Gating control
When set, timer/counter "x" is enabled only while "INT x" pin is high and "TRx"
control bit is set.
When cleared timer "x" is enabled whenever "TRx" control bit is set.
C/T
Counter or timer select bit
Set for counter operation (input from "Tx" input pin).
Cleared for timer operation (input from internal system clock).
M1
M0
Mode select bits
M1
M0
Function
0
0
8-bit timer/counter:
"THx" operates as 8-bit timer/counter
"TLx" serves as 5-bit prescaler
0
1
1
0
16-bit timer/counter.
"THx" and "TLx" are cascaded; there is no prescaler
8-bit auto-reload timer/counter.
"THx" holds a value which is to be reloaded into "TLx" each
time it overflows
1
1
Timer 0 :
TL0 is an 8-bit timer/counter controlled by the standard
timer 0 control bits. TH0 is an 8-bit timer only controlled by
timer 1 control bits.
Timer 1 :
Timer/counter 1 stops
Semiconductor Group
6-17
On-Chip Peripheral Components
C515
6.2.1.2 Mode 0
Putting either timer/counter 0,1 into mode 0 configures it as an 8-bit timer/counter with a divide-by-
32 prescaler. Figure 6-9 shows the mode 0 operation.
In this mode, the timer register is configured as a 13-bit register. As the count rolls over from all 1’s
to all 0’s, it sets the timer overflow flag TF0. The overflow flag TF0 then can be used to request an
interrupt. The counted input is enabled to the timer when TR0 = 1 and either Gate = 0 or INT0 = 1
(setting Gate = 1 allows the timer to be controlled by external input INT0, to facilitate pulse width
measurements). TR0 is a control bit in the special function register TCON; Gate is in TMOD.
The 13-bit register consists of all 8 bits of TH0 and the lower 5 bits of TL0. The upper 3 bits of TL0
are indeterminate and should be ignored. Setting the run flag (TR0) does not clear the registers.
Mode 0 operation is the same for timer 0 as for timer 1. Substitute TR0, TF0, TH0, TL0 and INT0 for
the corresponding timer 1 signals in figure 6-9. There are two different gate bits, one for timer 1
(TMOD.7) and one for timer 0 (TMOD.3).
÷ 12
OSC
C/T = 0
C/T = 1
TL0
(5 Bits)
TH0
(8 Bits)
Interrupt
TF0
P3.4/T0
Control
&
TR0
=1
Gate
_
<
1
P3.2/INTO
MCS02583
Figure 6-9
Timer/Counter 0, Mode 0: 13-Bit Timer/Counter
Semiconductor Group
6-18
On-Chip Peripheral Components
C515
6.2.1.3 Mode 1
Mode 1 is the same as mode 0, except that the timer register is running with all 16 bits. Mode 1 is
shown in figure 6-10.
÷ 12
OSC
C/T = 0
C/T = 1
Interrupt
TL0
(8 Bits)
TH0
(8 Bits)
TF0
P3.4/T0
Gate
Control
&
TR0
=1
_
<
1
P3.2/INTO
MCS02095
Figure 6-10
Timer/Counter 0, Mode 1: 16-Bit Timer/Counter
Semiconductor Group
6-19
On-Chip Peripheral Components
C515
6.2.1.4 Mode 2
Mode 2 configures the timer register as an 8-bit counter (TL0) with automatic reload, as shown in
figure 6-11. Overflow from TL0 not only sets TF0, but also reloads TL0 with the contents of TH0,
which is preset by software. The reload leaves TH0 unchanged.
Figure 6-11
Timer/Counter 0,1, Mode 2: 8-Bit Timer/Counter with Auto-Reload
Semiconductor Group
6-20
On-Chip Peripheral Components
C515
6.2.1.5 Mode 3
Mode 3 has different effects on timer 0 and timer 1. Timer 1 in mode 3 simply holds its count. The
effect is the same as setting TR1=0. Timer 0 in mode 3 establishes TL0 and TH0 as two seperate
counters. The logic for mode 3 on timer 0 is shown in figure 6-12. TL0 uses the timer 0 control bits:
C/T, Gate, TR0, INT0 and TF0. TH0 is locked into a timer function (counting machine cycles) and
takes over the use of TR1 and TF1 from timer 1. Thus, TH0 now controls the "timer 1" interrupt.
Mode 3 is provided for applications requiring an extra 8-bit timer or counter. When timer 0 is in mode
3, timer 1 can be turned on and off by switching it out of and into its own mode 3, or can still be used
by the serial channel as a baud rate generator, or in fact, in any application not requiring an interrupt
from timer 1 itself.
fOSC /12
C/T = 0
÷ 12
OSC
Interrupt
TL0
(8 Bits)
TF0
C/T = 1
P3.4/T0
Control
&
TR1
=1
Gate
_
<
1
P3.2/INT0
Interrupt
TH0
(8 Bits)
fOSC /12
TR1
TF1
Control
MCS02096
Figure 6-12
Timer/Counter 0, Mode 3: Two 8-Bit Timers/Counters
Semiconductor Group
6-21
On-Chip Peripheral Components
C515
6.2.2 Timer/Counter 2 with Additional Compare/Capture/Reload
The timer 2 with additional compare/capture/reload features is one of the most powerful peripheral
units of the C515. lt can be used for all kinds of digital signal generation and event capturing like
pulse generation, pulse width modulation, pulse width measuring etc.
Timer 2 is designed to support various automotive control applications (ignition/injection-control,
anti-lock-brake ... ) as well as industrial applications (DC-, three-phase AC- and stepper-motor
control, frequency generation, digital-to-analog conversion, process control ...). Please note that
this timer is not equivalent to timer 2 of the C501.
The C515 timer 2 in combination with the compare/capture/reload registers allows the following
operating modes:
– Compare : up to 4 PWM signals with 65535 steps at maximum and 500 ns resolution
– Capture
– Reload
: up to 4 high speed capture inputs with 500 ns resolution
: modulation of timer 2 cycle time
The block diagram in figure 6-13 shows the general configuration of timer 2 with the additional
compare/capture/reload registers. The I/O pins which can used for timer 2 control are located as
multifunctional port functions at port 1 (see table 6-3).
Table 6-3
Alternate Port Functions of Timer 2
Pin Symbol
Function
P1.0 / INT3 / CC0
P1.1 / INT4 / CC1
P1.2 / INT5 / CC2
P1.3 / INT6 / CC3
P1.5 / T2EX
Compare output / capture input for CRC register
Compare output / capture input for CC register 1
Compare output / capture input for CC register 2
Compare output / capture input for CC register 3
External reload trigger input
P1.7 / T2
External count or gate input to timer 2
Semiconductor Group
6-22
On-Chip Peripheral Components
C515
P1.5/
T2EX
_
<
1
Sync.
Sync.
÷ 12
EXF2
Interrupt
Request
T2I0
T2I1
EXEN2
Reload
P1.7/
T2
&
Reload
f OSC
OSC
÷ 24
Timer 2
TL2 TH2
T2PS
TF2
Compare
P1.0/
INT3/
CC0
P1.1/
INT4/
CC1
16 Bit
Comparator
16 Bit
Comparator
16 Bit
Comparator
16 Bit
Comparator
Input/
Output
Control
P1.2/
INT5/
CC2
Capture
P1.2/
INT6/
CC3
CCL3/CCH3
CCL2/CCH2
CCL1/CCH1
CRCL/CRCH
MCB03205
Figure 6-13
Timer 2 Block Diagram
Semiconductor Group
6-23
On-Chip Peripheral Components
C515
6.2.2.1 Timer 2 Registers
This chapter describes all timer 2 related special function registers of timer 2. The interrupt related
SFRs are also included in this section. Table 6-4 summarizes all timer 2 SFRs.
Table 6-4
Special Function Registers of the Timer 2 Unit
Symbol
Description
Address
T2CON
TL2
TH2
Timer 2 control register
Timer 2, low byte
Timer 2, high byte
C8
H
CC
H
CD
H
CCEN
CRCL
CRCH
CCL1
CCH1
CCL2
CCH2
CCL3
CCH3
IEN0
Compare / capture enable register
Compare / reload / capture register, low byte
Compare / reload / capture register, high byte
Compare / capture register 1, low byte
Compare / capture register 1, high byte
Compare / capture register 2, low byte
Compare / capture register 2, high byte
Compare / capture register 3, low byte
Compare / capture register 3, high byte
Interrupt enable register 0
C1
H
CA
H
CB
H
C2
H
C3
H
C4
H
C5
H
C6
H
C7
H
A8
H
IEN1
IRCON
Interrupt enable register 1
Interrupt control register
B8
H
C0
H
Semiconductor Group
6-24
On-Chip Peripheral Components
C515
The T2CON timer 2 control register is a bitaddressable register which controls the timer 2 function
and the compare mode of registers CRC, CC1 to CC3.
Special Function Register T2CON (Address C8 )
Reset Value : 00
H
H
Bit No.
MSB
7
LSB
0
6
5
4
3
2
1
CF
CE
CD
CC
CB
CA
C9
C8
H
H
H
H
H
H
H
H
C8
T2PS I3FR
I2FR T2R1 T2R0 T2CM T2I1
T2I0 T2CON
H
The shaded bit is not used in controlling timer/counter 2.
Bit
Function
Prescaler select bit
T2PS
When set, timer 2 is clocked in the “timer“ or “gated timer“ function with 1/24 of the
oscillator frequency. When cleared, timer 2 is clocked with 1/12 of the oscillator
frequency. T2PS must be 0 for the counter operation of timer 2.
I3FR
External interrupt 3 falling/rising edge flag
Used for capture function in combination with register CRC. lf set, a capture to
register CRC (if enabled) will occur on a positive transition at pin P1.0 / INT3 / CC0.
lf I3FR is cleared, a capture will occur on a negative transition.
T2R1
T2R0
Timer 2 reload mode selection
T2R1
T2R0
Function
0
1
1
X
0
1
Reload disabled
Mode 0 : auto-reload upon timer 2 overflow (TF2)
Mode 1 : reload on falling edge at pin P1.5 / T2EX.
T2CM
Compare mode bit for registers CRC, CC1 through CC3
When set, compare mode 1 is selected. T2CM = 0 selects compare mode 0.
T2I1
T2I0
Timer 2 input selection
T2I1
T2I0
Function
0
0
0
1
No input selected, timer 2 stops
Timer function :
input frequency = f /12 (T2PS = 0) or f /24 (T2PS = 1)
osc
osc
1
1
0
1
Counter function : external input signal at pin P1.7 / T2
Gated timer function : input controlled by pin P1.7 / T2
Semiconductor Group
6-25
On-Chip Peripheral Components
C515
Special Function Register TL2 (Address CC )
H
Reset Value : 00
H
Special Function Register TH2 (Address CD )
H
Reset Value : 00
H
Special Function Register CRCL (Address CA )
H
Special Function Register CRCH (Address CB )
H
Reset Value : 00
H
Reset Value : 00
H
Bit No.
MSB
7
LSB
0
6
5
4
3
2
1
CC
H
.7
.6
.5
.4
.3
.2
.1
LSB
TL2
TH2
CD
H
MSB
.6
.5
.4
.3
.2
.1
.0
CA
H
.7
.6
.6
.5
.5
.4
.4
.3
.3
.2
.2
.1
.1
LSB
.0
CRCL
CRCH
CB
H
MSB
Bit
Function
TL2.7-0
Timer 2 value low byte
The TL2 register holds the 8-bit low part of the 16-bit timer 2 count value.
TH2.7-0
CRCL.7-0
Timer 2 value high byte
The TH2 register holds the 8-bit high part of the 16-bit timer 2 count value.
Compare / reload / capture register low byte
CRCL is the 8-bit low byte of the 16-bit reload register of timer 2. It is also used for
compare/capture functions.
CRCH.7-0
Compare / reload / capture register high byte
CRCH is the 8-bit high byte of the 16-bit reload register of timer 2. It is also used for
compare/capture functions.
Semiconductor Group
6-26
On-Chip Peripheral Components
C515
Special Function Register IEN0 (Address A8 )
H
Reset Value : 00
H
Special Function Register IEN1 (Address B8 )
H
Reset Value : 00
H
Special Function Register IRCON (Address C0 )
H
Reset Value : 00
H
LSB
MSB
Bit No.
AF
AE
AD
AC
ES
AB
AA
A9
A8
H
H
H
H
H
H
H
H
A8
H
EAL
WDT
ET2
ET1
EX1
ET0
EX0
IEN0
Bit No.
BF
BE
BD
BC
BB
BA
B9
B8
H
H
H
H
H
H
H
H
IEN1
B8
H
EXEN2 SWDT EX6
EX5
EX4
EX3
EX2 EADC
Bit No.
C7
C6
C5
C4
C3
C2
C1
C0
H
H
H
H
H
H
H
H
C0
H
EXF2
TF2
IEX6
IEX5
IEX4
IEX3
IEX2 IADC
IRCON
The shaded bits are not used in timer/counter 2 interrupt control.
Bit
Function
ET2
Timer 2 overflow / external reload interrupt enable.
If ET2 = 0, the timer 2 interrupt is disabled.
If ET2 = 1, the timer 2 interrupt is enabled.
EXEN2
EXF2
Timer 2 external reload interrupt enable
If EXEN2 = 0, the timer 2 external reload interrupt is disabled.
If EXEN2 = 1, the timer 2 external reload interrupt is enabled. The external reload
function is not affected by EXEN2.
Timer 2 external reload flag
EXF2 is set when a reload is caused by a falling edge on pin T2EX while EXEN2 =
1. If ET2 in IEN0 is set (timer 2 interrupt enabled), EXF2 = 1 will cause an interrupt.
EXF2 can be used as an additional external interrupt when the reload function is
not used. EXF2 must be cleared by software.
TF2
Timer 2 overflow flag
Set by a timer 2 overflow and must be cleared by software. If the timer 2 interrupt
is enabled, TF2 = 1 will cause an interrupt.
Semiconductor Group
6-27
On-Chip Peripheral Components
C515
Special Function Register CCEN (Address C1 )
Reset Value : 00
H
H
Bit No.
MSB
7
LSB
0
6
5
4
3
2
1
C1
H
COCAH3 COCAL3 COCAH2 COCAL2 COCAH1 COCAL1 COCAH0 COCAL0
CCEN
Bit
Function
COCAH3
COCAL3
Compare/capture mode for CC register 3
COCAH3 COCAL3
Function
0
0
1
1
0
1
0
1
Compare/capture disabled
Capture on rising edge at pin P1.3 / INT6 / CC3
Compare enabled
Capture on write operation into register CCL3
COCAH2
COCAL2
Compare/capture mode for CC register 2
COCAH2 COCAL2
Function
0
0
1
1
0
1
0
1
Compare/capture disabled
Capture on rising edge at pin P1.2 / INT5 / CC2
Compare enabled
Capture on write operation into register CCL2
COCAH1
COCAL1
Compare/capture mode for CC register 1
COCAH1 COCAL1
Function
0
0
1
1
0
1
0
1
Compare/capture disabled
Capture on rising edge at pin P1.1 / INT4 / CC1
Compare enabled
Capture on write operation into register CCL1
COCAH0
COCAL0
Compare/capture mode for CRC register
COCAH0 COCAL0
Function
0
0
1
1
0
1
0
1
Compare/capture disabled
Capture on falling/rising edge at pin P1.0 / INT3 / CC0
Compare enabled
Capture on write operation into register CRCL
Semiconductor Group
6-28
On-Chip Peripheral Components
C515
6.2.2.2 Timer 2 Operation
The timer 2, which is a 16-bit-wide register, can operate as timer, event counter, or gated timer. The
detailed operation is described below.
Timer Mode
In timer function, the count rate is derived from the oscillator frequency. A prescaler offers the
possibility of selecting a count rate of 1/12 or 1/24 of the oscillator frequency. Thus, the 16-bit timer
register (consisting of TH2 and TL2) is either incremented in every machine cycle or in every second
machine cycle. The prescaler is selected by bit T2PS in special function register T2CON. lf T2PS is
cleared, the input frequency is 1/12 of the oscillator frequency. if T2PS is set, the 2:1 prescaler gates
1/24 of the oscillator frequency to the timer.
Gated Timer Mode
In gated timer function, the external input pin P1.7 / T2 functions as a gate to the input of timer 2. lf
T2 is high, the internal clock input is gated to the timer. T2 = 0 stops the counting procedure. This
facilitates pulse width measurements. The external gate signal is sampled once every machine
cycle.
Event Counter Mode
In the counter function, the timer 2 is incremented in response to a 1-to-0 transition at its
corresponding external input pin P1.7 / T2 In this function, the external input is sampled every
machine cycle. When the sampled inputs show a high in one cycle and a low in the next cycle, the
count is incremented. The new count value appears in the timer register in the cycle following the
one in which the transition was detected. Since it takes two machine cycles (24 oscillator periods)
to recognize a 1-to-0 transition, the maximum count rate is 1/24 of the oscillator frequency. There
are no restrictions on the duty cycle of the external input signal, but to ensure that a given level is
sampled at least once before it changes, it must be held for at least one full machine cycle.
Note: The prescaler must be off for proper counter operation of timer 2, i.e. T2PS must be 0.
In either case, no matter whether timer 2 is configured as timer, event counter, or gated timer, a
rolling-over of the count from all 1’s to all 0’s sets the timer overflow flag TF2 in SFR IRCON, which
can generate an interrupt.
lf TF2 is used to generate a timer overflow interrupt, the request flag must be cleared by the interrupt
service routine as it could be necessary to check whether it was the TF2 flag or the external reload
request flag EXF2 which requested the interrupt. Both request flags cause the program to branch to
the same vector address.
Semiconductor Group
6-29
On-Chip Peripheral Components
C515
Reload of Timer 2
The reload mode for timer 2 is selected by bits T2R0 and T2R1 in SFR T2CON. Figure 6-14 shows
the configuration of timer 2 in reload mode.
Mode 0 : When timer 2 rolls over from all l’s to all 0’s, it not only sets TF2 but also causes the timer
2 registers to be loaded with the 16-bit value in the CRC register, which is preset by
software. The reload will happen in the same machine cycle in which TF2 is set, thus
overwriting the count value 0000 .
H
Mode 1 : When a 16-bit reload from the CRC register is caused by a negative transition at the
corresponding input pin T2EX/P1.5. In addition, this transition will set flag EXF2, if bit
EXEN2 in SFR IEN1 is set. lf the timer 2 interrupt is enabled, setting EXF2 will generate
an interrupt. The external input pin T2EX is sampled in every machine cycle. When the
sampling shows a high in one cycle and a low in the next cycle, a transition will be
recognized. The reload of timer 2 registers will then take place in the cycle following the
one in which the transition was detected.
Input
Clock
TL2
TH2
T2EX
P1.5
Mode 1
Mode 0
Reload
CRCL
CRCH
TF2
_
<
Timer 2
Interrupt
Request
1
EXF2
MCS01903
EXEN2
Figure 6-14
Timer 2 in Reload Mode
Semiconductor Group
6-30
On-Chip Peripheral Components
C515
6.2.2.3 Compare Function of Registers CRC, CC1 to CC3
The compare function of a timer/register combination can be described as follows. The 16-bit value
stored in a compare/capture register is compared with the contents of the timer register. lf the count
value in the timer register matches the stored value, an appropriate output signal is generated at a
corresponding port pin, and an interrupt is requested.
The contents of a compare register can be regarded as ’time stamp’ at which a dedicated output
reacts in a predefined way (either with a positive or negative transition). Variation of this ’time stamp’
somehow changes the wave of a rectangular output signal at a port pin. This may - as a variation
of the duty cycle of a periodic signal - be used for pulse width modulation as well as for a continually
controlled generation of any kind of square wave forms. Two compare modes are implemented to
cover a wide range of possible applications.
The compare modes 0 and 1 are selected by bit T2CM in special function register T2CON. In both
compare modes, the new value arrives at the port pin 1 within the same machine cycle in which the
internal compare signal is activated.
The four registers CRC, CC1 to CC3 are multifunctional as they additionally provide a capture,
compare or reload capability (the CRC register only). A general selection of the function is done in
register CCEN. Please note that the compare interrupt CC0 can be programmed to be negative or
positive transition activated. The internal compare signal (not the output signal at the port pin!) is
active as long as the timer 2 contents is equal to the one of the appropriate compare registers, and
it has a rising and a falling edge. Thus, when using the CRC register, it can be selected whether an
interrupt should be caused when the compare signal goes active or inactive, depending on bit I3FR
in T2CON. For the CC registers 1 to 3 an interrupt is always requested when the compare signal
goes active (see figure 6-16).
6.2.2.3.1 Compare Mode 0
In mode 0, upon matching the timer and compare register contents, the output signal changes from
low to high. lt goes back to a low level on timer overflow. As long as compare mode 0 is enabled,
the appropriate output pin is controlled by the timer circuit only, and not by the user. Writing to the
port will have no effect. Figure 6-15 shows a functional diagram of a port latch in compare mode 0.
The port latch is directly controlled by the two signals timer overflow and compare. The input line
from the internal bus and the write-to-latch line are disconnected when compare mode 0 is enabled.
Compare mode 0 is ideal for generating pulse width modulated output signals, which in turn can be
used for digital-to-analog conversion via a filter network or by the controlled device itself (e.g. the
inductance of a DC or AC motor). Mode 0 may also be used for providing output clocks with initially
defined period and duty cycle. This is the mode which needs the least CPU time. Once set up, the
output goes on oscillating without any CPU intervention. Figure 6-16 and 6-17 illustrate the function
of compare mode 0.
Semiconductor Group
6-31
On-Chip Peripheral Components
C515
Port Circuit
Read Latch
VCC
Compare Register
Circuit
Compare Reg.
S
Q
Q
Port
Pin
Internal
Bus
16 Bit
Comparator
16 Bit
D
Port
Latch
Write to
Latch
Compare
Match
CLK
R
Timer Register
Timer Circuit
Timer
Overflow
Read Pin
MCS02661
Figure 6-15
Port Latch in Compare Mode 0
I3FR
Interrupt
IEXx
Shaded Function
for CRC only
Compare Register CCx
16-Bit
Set Latch
Comparator
Compare Signal
Reset Latch
16-Bit
Overflow
TH2
Timer 2
TL2
S
S
S
R
S
R
R
R
Q
Q
Q
Q
Interrupt
P1.3/
P1.2/
P1.1/
P1.0/
INT6/
CC3
INT5/
CC2
INT4/
CC1
INT3/
CC0
MCS03233
Figure 6-16
Timer 2 with Registers CCx in Compare Mode 0
Semiconductor Group
6-32
On-Chip Peripheral Components
C515
Timer Count = FFFF
H
Timer Count =
Compare Value
Contents
of
~
~
Timer 2
Timer Count = Reload Value
Interrupt can be generated
on overflow
Compare
Output
(P1.x/CCx)
MCT01906
Interrupt can be generated
on compare-match
Figure 6-17
Function of Compare Mode 0
6.2.2.3.2 Modulation Range in Compare Mode 0
Generally it can be said that for every PWM generation in compare mode 0 with n-bit wide compare
n
registers there are 2 different settings for the duty cycle. Starting with a constant low level (0%duty
cycle) as the first setting, the maximum possible duty cycle then would be :
n
(1 - 1/2 ) x 100%
This means that a variation of the duty cycle from 0% to real 100% can never be reached if the
compare register and timer register have the same length. There is always a spike which is as long
as the timer clock period.
This “spike“ may either appear when the compare register is set to the reload value (limiting the
lower end of the modulation range) or it may occur at the end of a timer period. In a timer 2/CCx
register configuration in compare mode 0 this spike is divided into two halves: one at the beginning
when the contents of the compare register is equal to the reload value of the timer; the other half
when the compare register is equal to the maximum value of the timer register (here: FFFF ).
H
Please refer to figure 6-18 where the maximum and minimum duty cycle of a compare output signal
is illustrated. Timer 2 is incremented with the machine clock (fosc/12), thus at 24-MHz operational
frequency, these spikes are both approx. 250 ns long.
Semiconductor Group
6-33
On-Chip Peripheral Components
C515
a) CCHx/CCLx = 0000 or = CRCH/CRCL (maximum duty cycle)
H
P1.x
H
L
Appr. 1/2 Machine Cycle
b) CCHx/CCLx = FFFF (minimum duty cycle)
H
Appr. 1/2 Machine Cycle
P1.x
H
L
MCT01907
Figure 6-18
Modulation Range of a PWM Signal, generated with a Timer 2/CCx Register Combination in
Compare Mode 0*
The following example shows how to calculate the modulation range for a PWM signal. To calculate
with reasonable numbers, a reduction of the resolution to 8-bit is used. Otherwise (for the maximum
resolution of 16-bit) the modulation range would be so severely limited that it would be negligible.
Example:
Timer 2 in auto-reload mode; contents of reload register CRC = FF00
H
Restriction of modulation range = 1 / 256 x 2 x 100% = 0.195%
This leads to a variation of the duty cycle from 0.195% to 99.805% for a timer 2/CCx register
configuration when 8 of 16 bits are used.
Semiconductor Group
6-34
On-Chip Peripheral Components
C515
6.2.2.3.3 Compare Mode 1
In compare mode 1, the software adaptively determines the transition of the output signal. lt is
commonly used when output signals are not related to a constant signal perlod (as in a standard
PWM Generation) but must be controlled very precisely with high resolution and without jitter. In
compare mode 1, both transitions of a signal can be controlled. Compare outputs in this mode can
be regarded as high speed outputs which are independent of the CPU activity.
lf compare mode 1 is enabled and the software writes to the appropriate output latch at the port, the
new value will not appear at the output pin until the next compare match occurs. Thus, one can
choose whether the output signal is to make a new transition (1-to-0 or 0-to-1, depending on the
actual pinlevel) or should keep its old value at the time the timer 2 count matches the stored
compare value.
Figure 6-19 and figure 6-20 show functional diagrams of the timer/compare register/port latch
configuration in compare mode 1. In this function, the port latch consists of two separate latches.
The upper latch (which acts as a “shadow latch“) can be written under software control, but its value
will only be transferred to the output latch (and thus to the port pin) in response to a compare match.
Note that the double latch structure is transparent as long as the internal compare signal is active.
While the compare signal is active, a write operation to the port will then change both latches. This
may become important when driving timer 2 with a slow external clock. In this case the compare
signal could be active for many machine cycles in which the CPU could unintentionally change the
contents of the port latch.
A read-modify-write instruction will read the user-controlled „shadow latch“ and write the modified
value back to this “shadow-latch“. A standard read instruction will - as usual - read the pin of the
corresponding compare output.
Semiconductor Group
6-35
On-Chip Peripheral Components
C515
Port Circuit
Read Latch
VCC
Compare Register
Circuit
Compare Reg.
Internal
Bus
D
Q
D
Q
Q
Port
Pin
16 Bit
Comparator
16 Bit
Shadow
Latch
Port
Latch
Compare
Match
Write to
Latch
CLK
CLK
Timer Register
Timer Circuit
Read Pin
MCS02662
Figure 6-19
Port Latch in Compare Mode 1
I3FR
Interrupt
IEXx
Shaded Function
for CRC only
Compare Register CCx
16 Bit
Port
Latch
Circuit
Comparator
Shadow Latch
Compare Signal
16 Bit
Overflow
Interrupt
TH2
TL2
Timer 2
Output Latch
P1.7
P1.3/
P1.0/
INT6/
CC3
INT3/
CC0
MCS02732
Figure 6-20
Timer 2 with Registers CCx in Compare Mode 1
(CCx stands for CRC, CC1 to CC3, IEXx stands for IEX3 to IEX6)
Semiconductor Group
6-36
On-Chip Peripheral Components
C515
6.2.2.4 Using Interrupts in Combination with the Compare Function
The compare service of registers CRC, CC1, CC2 and CC3 is assigned to alternate output functions
at port pins P1.0 to P1.3. Another option of these pins is that they can be used as external interrupt
inputs. However, when using the port lines as compare outputs then the input line from the port pin
to the interrupt system is disconnected (but the pin’s level can still be read under software control).
Thus, a change of the pin’s level will not cause a setting of the corresponding interrupt flag. In this
case, the interrupt input is directly connected to the (internal) compare signal thus providing a
compare interrupt.
The compare interrupt can be used very effectively to change the contents of the compare registers
or to determine the level of the port outputs for the next “compare match“. The principle is, that the
internal compare signal (generated at a match between timer count and register contents) not only
manipulates the compare output but also sets the corresponding interrupt request flag. Thus, the
current task of the CPU is interrupted - of course provided the priority of the compare interrupt is
higher than the present task priority - and the corresponding interrupt service routine is called. This
service routine then sets up all the necessary parameters for the next compare event.
Advantages when using compare interrupts
Firstly, there is no danger of unintentional overwriting a compare register before a match has been
reached. This could happen when the CPU writes to the compare register without knowing about
the actual timer 2 count.
Secondly, and this is the most interesting advantage of the compare feature, the output pin is
exclusively controlled by hardware therefore completely independent from any service delay which
in real time applications could be disastrous. The compare interrupt in turn is not sensitive to such
delays since it loads the parameters for the next event. This in turn is supposed to happen after a
suff icient space of time.
Please note two special cases where a program using compare interrupts could show a “surprising“
behavior :
The first configuration has already been mentioned in the description of compare mode 1. The fact
that the compare interrupts are transition activated becomes important when driving timer 2 with a
slow external clock. In this case it should be carefully considered that the compare signal is active
as long as the timer 2 count is equal to the contents of the corresponding compare register, and that
the compare signal has a rising and a falling edge. Furthermore, the “shadow latches“ used in
compare mode 1 are transparent while the compare signal is active.
Thus, with a slow input clock for timer 2, the comparator signal is active for a long time (= high
number of machine cycles) and therefore a fast interrupt controlled reload of the compare register
could not only change the “shadow latch“ - as probably intended - but also the output buffer.
When using the CRC, you can select whether an interrupt should be generated when the compare
signal goes active or inactive, depending on the status of bit I3FR in T2CON.
Initializing the interrupt to be negative transition triggered is advisable in the above case. Then the
compare signal is already inactive and any write access to the port latch just changes the contents
of the “shadow-latch“.
Please note that for CC registers 1 to 3 an interrupt is always requested when the compare signal
goes active.
Semiconductor Group
6-37
On-Chip Peripheral Components
C515
The second configuration which should be noted is when compare function is combined with
negative transition activated interrupts. lf the port latch of port P1.0 contains a 1, the interrupt
request flags IEX3 will immediately be set after enabling the compare mode for the CRC register.
The reason is that first the external interrupt input is controlled by the pin’s level. When the compare
option is enabled the interrupt logic input is switched to the internal compare signal, which carries
a low level when no true comparison is detected. So the interrupt logic sees a 1-to-0 edge and sets
the interrupt request flag.
An unintentional generation of an interrupt during compare initialization can be prevented lf the
request flag is cleared by software after the compare is activated and before the external interrupt
is enabled.
Semiconductor Group
6-38
On-Chip Peripheral Components
C515
6.2.2.5 Capture Function
Each of the compare/capture registers CC1 to CC3 and the CRC register can be used to latch the
current 16-bit value of the timer 2 registers TL2 and TH2. Two different modes are provided for this
function. In mode 0, an external event latches the timer 2 contents to a dedicated capture register.
In mode 1, a capture will occur upon writing to the low order byte of the dedicated 16-bit capture
register. This mode is provided to allow the software to read the timer 2 contents “on-the-fly“.
In mode 0, the external event causing a capture is :
– for CC registers 1 to 3: a positive transition at pins CC1 to CC3 of port 1
– for the CRC register:
a positive or negative transition at the corresponding pin, depending
on the status of the bit I3FR in SFR T2CON. lf the edge flag is
cleared, a capture occurs in response to a negative transition; lf the
edge flag is set a capture occurs in response to a positive transition
at pin P1.0 / INT3 / CC0.
In both cases the appropriate port 1 pin is used as input and the port latch must be programmed to
contain a one (1). The external input is sampled in every machine cycle. When the sampled input
shows a low (high) level in one cycle and a high (low) in the next cycle, a transition is recognized.
The timer 2 contents is latched to the appropriate capture register in the cycle following the one in
which the transition was identified.
In mode 0 a transition at the external capture inputs of registers CC1 to CC3 will also set the
corresponding external interrupt request flags IEX3 to IEX6. lf the interrupts are enabled, an
external capture signal will cause the CPU to vector to the appropriate interrupt service routine.
In mode 1 a capture occurs in response to a write instruction to the low order byte of a capture
register. The write-to-register signal (e.g. write-to-CRCL) is used to initiate a capture. The value
written to the dedicated capture register is irrelevant for this function. The timer 2 contents will be
latched into the appropriate capture register in the cycle following the write instruction. In this mode
no interrupt request will be generated.
Figure 6-21 illustrates the operation of the CRC register, while figure 6-22 shows the operation of
the compare/capture registers 1 to 3.
The two capture modes can be established individually for each capture register by bits in SFR
CCEN (compare/capture enable register). That means, in contrast to the compare modes, it is
possible to simultaneously select mode 0 for one capture register and mode 1 for another register.
Semiconductor Group
6-39
On-Chip Peripheral Components
C515
Timer 2
Interrupt
Request
Input
Clock
TL2
TH2
TF2
"Write to
CRCL"
Mode 1
Mode 0
Capture
P1.0/INT 3/
CC0
T2
CRCL
CRCH
CON.6
External
Interrupt 3
Request
IEX3
MCS01909
Figure 6-21
Timer 2 - Capture with Register CRC
Timer 2
Interrupt
Request
Input
Clock
TL2
TH2
TF2
"Write to
CCL1"
Mode 1
Mode 0
Capture
CCL1
CCH1
External
Interrupt 4
Request
P1.1/INT4/
CC1
IEX4
MCS01910
Figure 6-22
Timer 2 - Capture with Registers CC1 to CC3
Semiconductor Group
6-40
On-Chip Peripheral Components
C515
6.3 Serial Interface
The serial port of the C515 is full duplex, meaning it can transmit and receive simultaneously. It is
also receive-buffered, meaning it can commence reception of a second byte before a previously
received byte has been read from the receive register (however, if the first byte still hasn’t been read
by the time reception of the second byte is complete, one of the bytes will be lost). The serial port
receive and transmit registers are both accessed at special function register SBUF. Writing to SBUF
loads the transmit register, and reading SBUF accesses a physically separate receive register.
The serial port can operate in 4 modes (one synchronous mode, three asynchronous modes). The
baud rate clock for the serial port is derived from the oscillator frequency (mode 0, 2) or generated
either by timer 1 or by a dedicated baud rate generator (mode 1, 3).
Mode 0, Shift Register (Synchronous) Mode:
Serial data enters and exits through RxD. TxD outputs the shift clock. 8 data bits are transmitted/
received: (LSB first). The baud rate is fixed at 1/12 of the oscillator frequency. (See section 6.3.4 for
more detailed information)
Mode 1, 8-Bit UART, Variable Baud Rate:
10 bits are transmitted (through TXD) or received (through RXD): a start bit (0), 8 data bits (LSB
first), and a stop bit (1). On receive, the stop bit goes into RB8 in special function register SCON.
The baud rate is variable. (See section 6.3.5 for more detailed information)
Mode 2, 9-Bit UART, Fixed Baud Rate:
11 bits are transmitted (through TXD) or received (through RXD): a start bit (0), 8 data bits (LSB
first), a programmable 9th bit, and a stop bit (1). On transmit, the 9th data bit (TB8 in SCON) can be
assigned to the value of 0 or 1. Or, for example, the parity bit (P, in the PSW) could be moved into
TB8. On receive, the 9th data bit goes into RB8 in special function register SCON, while the stop bit
is ignored. The baud rate is programmable to either 1/32 or 1/64 of the oscillator frequency. (See
section 6.3.6 for more detailed information)
Mode 3, 9-Bit UART, Variable Baud Rate:
11 bits are transmitted (through TXD) or received (through RXD): a start bit (0), 8 data bits (LSB
first), a programmable 9th data bit, and a stop bit (1). In fact, mode 3 is the same as mode 2 in all
respects except the baud rate. The baud rate in mode 3 is variable. (See section 6.3.6 for more
detailed information)
In all four modes, transmission is initiated by any instruction that uses SBUF as a destination
register. Reception is initiated in mode 0 by the condition RI = 0 and REN = 1. Reception is initiated
in the other modes by the incoming start bit if REN = 1. The serial interfaces also provide interrupt
requests when a transmission or a reception of a frame has completed. The corresponding interrupt
request flags for serial interface 0 are TI or RI, resp. See chapter 7 of this user manual for more
details about the interrupt structure. The interrupt request flags TI and RI can also be used for
polling the serial interface 0 if the serial interrupt is not to be used (i.e. serial interrupt 0 not enabled).
Semiconductor Group
6-41
On-Chip Peripheral Components
C515
6.3.1 Multiprocessor Communication
Modes 2 and 3 have a special provision for multiprocessor communications. In these modes, 9 data
bits are received. The 9th one goes into RB8. Then a stop bit follows. The port can be programmed
such that when the stop bit is received, the serial port interrupt will be activated only if RB8 = 1. This
feature is enabled by setting bit SM2 in SCON. A way to use this feature in multiprocessor systems
is as follows.
When the master processor wants to transmit a block of data to one of several slaves, it first sends
out an address byte which identifies the target slave. An address byte differs from a data byte in
that the 9th bit is 1 in an address byte and 0 in a data byte. With SM2 = 1, no slave will be interrupted
by a data byte. An address byte, however, will interrupt all slaves, so that each slave can examine
the received byte and see if it is beeing addressed. The addressed slave will clear its SM2 bit and
prepare to receive the data bytes that will be coming. The slaves that weren't being addressed leave
their SM2s set and go on about their business, ignoring the incoming data bytes.
SM2 has no effect in mode 0. SM2 can be used in mode 1 to check the validity of the stop bit. In a
mode 1 reception, if SM2 = 1, the receive interrupt will not be activated unless a valid stop bit is
received.
6.3.2 Serial Port Registers
The serial port control and status register is the special function register SCON. This register
contains not only the mode selection bits, but also the 9th data bit for transmit and receive (TB8 and
RB8), and the serial port interrupt bits (TI and RI).
SBUF is the receive and transmit buffer of serial interface 0. Writing to SBUF loads the transmit
register and initiates transmission. Reading out SBUF accesses a physically separate receive
register.
Semiconductor Group
6-42
On-Chip Peripheral Components
C515
Special Function Register SCON (Address 98 )
H
Special Function Register SBUF (Address 99 )
H
Reset Value : 00
H
Reset Value : XX
H
Bit No.
MSB
9F
LSB
9E
9D
9C
9B
9A
99
98
H
H
H
H
H
H
H
H
98
H
SM0
SM1
SM2
REN
TB8
RB8
TI
RI
SCON
SBUF
7
6
5
4
3
2
1
0
99
H
Serial Interface Buffer Register
Bit
Function
Serial port 0 operating mode selection bits
SM0
SM1
SM0
SM1
Selected operating mode
0
0
1
1
0
1
0
1
Serial mode 0 : Shift register, fixed baud rate (fOSC/12)
Serial mode 1 : 8-bit UART, variable baud rate
Serial mode 2 : 9-bit UART, fixed baud rate (fOSC/32 or fOSC/64)
Serial mode 3 : 9-bit UART, variable baud rate
SM2
Enable serial port multiprocessor communication in modes 2 and 3
In mode 2 or 3, if SM2 is set to 1 then RI0 will not be activated if the received 9th
data bit (RB8) is 0. In mode 1, if SM2 = 1 then RI will not be activated if a valid
stop bit was not received. In mode 0, SM2 should be 0.
REN
TB8
RB8
TI
Serial port receiver enable
Enables serial reception. Set by software to enable serial reception. Cleared by
software to disable serial reception.
Serial port transmitter bit 9
TB8 is the 9th data bit that will be transmitted in modes 2 and 3. Set or cleared by
software as desired.
Serial port receiver bit 9
In modes 2 and 3, RB8 is the 9th data bit that was received. In mode 1, if SM2 = 0,
RB8 is the stop bit that was received. In mode 0, RB8 is not used.
Serial port transmitter interrupt flag
TI is set by hardware at the end of the 8th bit time in mode 0, or at the beginning
of the stop bit in the other modes, in any serial transmission. TI must be cleared
by software.
RI
Serial port receiver interrupt flag
RI is set by hardware at the end of the 8th bit time in mode 0, or halfway through
the stop bit time in the other modes, in any serial reception (exception see SM2).
RI must be cleared by software.
Semiconductor Group
6-43
On-Chip Peripheral Components
C515
6.3.3 Baud Rate Generation
There are several possibilities to generate the baud rate clock for the serial port depending on the
mode in which it is operating.
For clarification some terms regarding the difference between "baud rate clock" and "baud rate"
should be mentioned. The serial interface requires a clock rate which is 16 times the baud rate for
internal synchronization. Therefore, the baud rate generators have to provide a "baud rate clock" to
the serial interface which - there divided by 16 - results in the actual "baud rate". However, all
formulas given in the following section already include the factor and calculate the final baud rate.
Further, the abrevation fOSC refers to the external clock frequency (oscillator or external input clock
operation).
The baud rate of the serial port is controlled by two bits which are located in the special function
registers as shown below.
Special Function Register ADCON (Address D8 )
H
Special Function Register PCON (Address 87 )
H
Reset Value : 00X00000
Reset Value : 000X0000
B
B
Bit No.
MSB
DF
LSB
D8
DE
DD
–
DC
DB
DA
D9
H
H
H
H
H
H
H
H
D8
H
BD
CLK
BSY
ADM
MX2
MX1
MX0
ADCON
PCON
7
6
5
4
3
2
1
0
1)
87
H
SMOD PDS
IDLS
SD
GF1
GF0
PDE
IDLE
The shaded bits are not used in controlling the serial port baud rate.
1) This bit is available for C515-LM/1RM versions only.
Bit
Function
BD
Baud rate generator enable
When set, the baud rate of serial interface 0 is derived from a dedicated prescaler.
When cleared (default after reset), baud rate is derived from the timer 1 overflow
rate.
SMOD
Double baud rate
When set, the baud rate of the serial interface in modes 1, 2, and 3 is doubled.
After reset this bit is cleared.
Figure 6-23 shows the configuration for the baud rate generation of the serial port.
Semiconductor Group
6-44
On-Chip Peripheral Components
C515
Timer 1
Overflow
SCON.7
SCON.6
(SM0/
ADCON.7
(BD)
PCON.7
Mode 1
Mode 3
(SMOD)
SM1)
0
÷ 2
f OSC/2
1
0
1
Baud
Rate
Clock
÷ 39
÷ 6
Mode 2
Mode 0
Only one mode
can be selected
Note: The switch configuration shows the reset state.
MCB03206
Figure 6-23
Baud Rate Generation for the Serial Port
Depending on the programmed operating mode different paths are selected for the baud rate clock
generation. Figure 6-23 shows the dependencies of the serial port 0 baud rate clock generation
from the two control bits and from the mode which is selected in the special function register SCON.
6.3.3.1 Baud Rate in Mode 0
The baud rate in mode 0 is fixed to :
oscillator frequency
Mode 0 baud rate =
12
6.3.3.2 Baud Rate in Mode 2
The baud rate in mode 2 depends on the value of bit SMOD in special function register PCON. If
SMOD = 0 (which is the value after reset), the baud rate is 1/64 of the oscillator frequency. If SMOD
= 1, the baud rate is 1/32 of the oscillator frequency.
2SMOD
Mode 2 baud rate =
x oscillator frequency
64
Semiconductor Group
6-45
On-Chip Peripheral Components
C515
6.3.3.3 Baud Rate in Mode 1 and 3
In these modes the baud rate is variable and can be generated alternatively by a baud rate
generator with a fixed prescaler or by timer 1.
6.3.3.3.1 Using the Baud Rate Generator
In modes 1 and 3, the C515 can use the internal baud rate generator for the serial port. To enable
this feature, bit BD (bit 7 of special function register ADCON) must be set. This baud rate generator
divides the oscillator frequency by 2 x 39=78. Bit SMOD (PCON.7) also can be used to enable a
divide by 2 prescaler. For baud rate calculation the baud rate clock must be further divided by 16.
Therefore, at 12 MHz oscillator frequency, the commonly used baud rates 4800 baud (SMOD=0)
and 9600 (SMOD=1) are available (with 0.16 % deviation). The baud rate is determined by SMOD
and the oscillator frequency as follows :
2SMOD
x oscillator frequency
Mode 1,3 baud rate =
2496
6.3.3.3.2 Using Timer 1 to Generate Baud Rates
In mode 1 and 3 of the serial port also timer 1 can be used for generating baud rates. To enable this
feature, bit BD (bit 7 of special function register ADCON) must be reset.Then the baud rate is
determined by the timer 1 overflow rate and the value of SMOD as follows :
2SMOD
Mode 1, 3 baud rate =
x (timer 1 overflow rate)
32
The timer 1 interrupt is usually disabled in this application. Timer 1 itself can be configured for either
"timer" or "counter" operation, and in any of its operating modes. In most typical applications, it is
configured for "timer" operation in the auto-reload mode (high nibble of TMOD = 0010 ). In this
B
case the baud rate is given by the formula:
2SMOD
x oscillator frequency
Mode 1, 3 baud rate =
32 x 12 x (256 – (TH1))
Very low baud rates can be achieved with timer 1 if leaving the timer 1 interrupt enabled,
configuring the timer to run as 16-bit timer (high nibble of TMOD = 0001 ), and using the timer 1
B
interrupt for a 16-bit software reload.
Table 6-5 lists various commonly used baud rates of the different modes. It also shows how these
baud rates can be obtained using timer 1 in mode 1 or 3.
Semiconductor Group
6-46
On-Chip Peripheral Components
C515
Table 6-5
Timer 1 generated Commonly used Baud Rates
Baud Rate
fOSC (MHz)
SMOD
BD
Timer 1
Mode
Reload
Value
Mode 1, 3:
62.5 Kbaud
125 Kbaud
19.5 Kbaud
9.6 Kbaud
4.8 Kbaud
2.4 Kbaud
1.2 Kbaud
110 Baud
110 Baud
4.8 Kbaud
9.6 Kbaud
6.4 Kbaud
12.8 Kbaud
9.6 Kbaud
19.2 Kbaud
12.0
24.0
1
1
1
0
0
0
0
0
0
0
1
0
1
0
1
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
2
2
2
2
2
2
2
2
1
-
FF
H
FF
H
11.059
11.059
11.059
11.059
11.059
6.0
12.0
12.0
12.0
16.0
FD
H
FD
H
FA
H
F4
H
E8
H
72
H
FEEB
H
-
-
-
-
-
-
-
-
-
-
16.0
24.0
24.0
-
Mode 0 :
Mode 2 :
1 Mbaud
1.33 Mbaud
2 Mbaud
12.0
16.0
24.0
-
-
-
-
-
-
-
-
-
-
-
-
187.5 Kbaud
375 Kbaud
250 Kbaud
500 Kbaud
375 Kbaud
750 Kbaud
12.0
12.0
16.0
16.0
24.0
24.0
0
1
0
1
0
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Semiconductor Group
6-47
On-Chip Peripheral Components
C515
6.3.4 Details about Mode 0
Serial data enters and exists through RXD. TXD outputs the shift clock. 8 data bits are transmitted/
received: (LSB first). The baud rate is fixed at fOSC/12.
Figure 6-24 shows a simplified functional diagram of the serial port in mode 0. The associated
timing is illustrated in figure 6-25.
Transmission is initiated by any instruction that uses SBUF as a destination register. The "Write-to-
SBUF" signal at S6P2 also loads a 1 into the 9th position of the transmit shift register and tells the
TX control block to commence a transmission. The internal timing is such that one full machine
cycle will elapse between "Write-to-SBUF", and activation of SEND.
SEND enables the output of the shift register to the alternate output function line of P3.0, and also
enables SHIFT CLOCK to the alternate output function line of P3.1. SHIFT CLOCK is low during
S3, S4, and S5 of every machine cycle, and high during S6, S1 and S2. At S6P2 of every machine
cycle in which SEND is active, the contents of the transmit shift register are shifted one position to
the right.
As data bits shift out to the right, zeroes come in from the left. When the MSB of the data byte is at
the output position of the shift register, then the1 that was initially loaded into the 9th position, is just
left of the MSB, and all positions to the left of that contain zeroes. This condition flags the TX control
block to do one last shift and then deactivate SEND and set TI. Both of these actions occur at S1P1
of the 10th machine cycle after "Write-to-SBUF".
Reception is initiated by the condition REN = 1 and RI = 0. At S6P2 of the next machine cycle, the
RX control unit writes the bits 1111 1110 to the receive shift register, and in the next clock phase
activates RECEIVE.
RECEIVE enables SHIFT CLOCK to the alternate output function line of P3.1. SHIFT CLOCK
makes transitions at S3P1 and S6P1 of every machine cycle. At S6P2 of every machine cycle in
which RECEIVE is active, the contents of the receive shift register are shifted one position to the
left. The value that comes in from the right is the value that was sampled at the P3.0 pin at S5P2 of
the same machine cycle.
As data bit comes in from the right, 1’s shift out to the left. When the 0 that was initially loaded into
the rightmost position arrives at the leftmost position in the shift register, it flags the RX control block
to do one last shift and load SBUF. At S1P1 of the 10th machine cycle after the write to SCON that
cleared RI, RECEIVE is cleared and RI is set.
Semiconductor Group
6-48
On-Chip Peripheral Components
C515
Internal Bus
1
Write
to
SBUF
RXD
P3.0 Alt.
Output
Q
&
S
SBUF
Function
D
CLK
Zero Detector
Start
Shift
TX Control
Baud
Rate S6
Clock
Baud Rate
Clock
_
<
1
Send
TXD
TX Clock
TI
&
P3.1 Alt.
Output
Function
_
<
1
Serial
Port
Shift
Clock
Interrupt
&
REN
RI
1
Start
Receive
RI
RX Control
RX Clock
Shift
1 0
1
1
1
1
1
RXD
P3.0 Alt.
Input
Input Shift Register
Function
Shift
Load
SBUF
SBUF
Read
SBUF
Internal Bus
MCS02101
Figure 6-24
Serial Interface, Mode 0, Functional Diagram
Semiconductor Group
6-49
On-Chip Peripheral Components
C515
Transmit
Receive
Figure 6-25
Serial Interface, Mode 0, Timing Diagram
Semiconductor Group
6-50
On-Chip Peripheral Components
C515
6.3.5 Details about Mode 1
Ten bits are transmitted (through TXD), or received (through RXD): a start bit (0), 8 data bits (LSB
first), and a stop bit (1). On receive, the stop bit goes into RB8 in SCON. The baud rate is
determined either by the timer 1 overflow rate or by the internal baud rate generator.
Figure 6-26 shows a simplified functional diagram of the serial port in mode 1. The associated
timings for transmit/receive are illustrated in figure 6-27.
Transmission is initiated by an instruction that uses SBUF as a destination register. The "Write-to-
SBUF" signal also loads a 1 into the 9th bit position of the transmit shift register and flags the TX
control unit that a transmission is requested. Transmission starts at the next rollover in the divide-
by-16 counter. (Thus, the bit times are synchronized to the divide-by-16 counter, not to the "Write-
to-SBUF" signal).
The transmission begins with activation of SEND, which puts the start bit at TXD. One bit time later,
DATA is activated, which enables the output bit of the transmit shift register to TXD. The first shift
pulse occurs one bit time after that.
As data bits shift out to the right, zeroes are clocked in from the left. When the MSB of the data byte
is at the output position of the shift register, then the 1 that was initially loaded into the 9th position
is just to the left of the MSB, and all positions to the left of that contain zeroes. This condition flags
the TX control unit to do one last shift and then deactivate SEND and set TI. This occurs at the 10th
divide-by-16 rollover after "Write-to-SBUF".
Reception is initiated by a detected 1-to-0 transition at RXD. For this purpose RXD is sampled at a
rate of 16 times whatever baud rate has been established. When a transition is detected, the divide-
by-16 counter is immediately reset, and 1FF is written into the input shift register, and reception
H
of the rest of the frame will proceed.
The 16 states of the counter divide each bit time into 16ths. At the 7th, 8th and 9th counter states
of each bit time, the bit detector samples the value of RXD. The value accepted is the value that
was seen in at latest 2 of the 3 samples. This is done for the noise rejection. If the value accepted
during the first bit time is not 0, the receive circuits are reset and the unit goes back to looking for
another 1-to-0 transition. This is to provide rejection or false start bits. If the start bit proves valid, it
is shifted into the input shift register, and reception of the rest of the frame will proceed.
As data bits come in from the right, 1s shift out to the left. When the start bit arrives at the leftmost
position in the shift register, (which in mode 1 is a 9-bit register), it flags the RX control block to do
one last shift, load SBUF and RB8, and set RI. The signal to load SBUF and RB8, and to set RI, will
be generated if, and only if, the following conditions are met at the time the final shift pulse is
generated.
1) RI = 0, and
2) either SM2 = 0, or the received stop bit = 1
If one of these two condtions is not met, the received frame is irretrievably lost. If both conditions
are met, the stop bit goes into RB8, the 8 data bit goes into SBUF, and RI is activated. At this time,
whether the above conditions are met or not, the unit goes back to looking for a 1-to-0 transition in
RXD.
Semiconductor Group
6-51
On-Chip Peripheral Components
C515
Internal Bus
1
Write
to
SBUF
Q
&
S
_
<
1
TXD
SBUF
D
CLK
Zero Detector
Shift
TX Control
Start
Data
Send
÷ 16
TX Clock
TI
_
<
1
Baud
Rate
Clock
Serial
Port
Interrupt
÷ 16
Sample
RX
RI
Load
SBUF
1-to-0
Transition
Detector
Start
RX Control
1FF
Shift
H
Bit
Detector
Input Shift Register
(9Bits)
RXD
Shift
Load
SBUF
SBUF
Read
SBUF
Internal Bus
MCS02103
Figure 6-26
Serial Interface, Mode 1, Functional Diagram
Semiconductor Group
6-52
On-Chip Peripheral Components
C515
Transmit
Receive
Figure 6-27
Serial Interface, Mode 1, Timing Diagram
Semiconductor Group
6-53
On-Chip Peripheral Components
C515
6.3.6 Details about Modes 2 and 3
Eleven bits are transmitted (through TXD), or received (through RXD): a start bit (0), 8 data bits
(LSB first), a programmable 9th data bit, and a stop bit (1). On transmit, the 9th data bit (TB8) can
be assigned the value of 0 or 1. On receive, the 9th data bit goes into RB8 in SCON. The baud rate
is generated by either using timer 1 or the internal baud rate generator.
Figure 6-28 shows a functional diagram of the serial port in modes 2 and 3. The receive portion is
exactly the same as in mode 1. The transmit portion differs from mode 1 only in the 9th bit of the
transmit shift register. The associated timings for transmit/receive are illustrated in figure 6-29.
Transmission is initiated by any instruction that uses SBUF as a destination register. The "Write-to-
SBUF" signal also loads TB8 into the 9th bit position of the transmit shift register and flags the TX
control unit that a transmission is requested. Transmission starts at the next rollover in the divide-
by-16 counter. (Thus, the bit times are synchronized to the divide-by-16 counter, not to the "Write-
to-SBUF" signal.)
The transmission begins with activation of SEND, which puts the start bit at TXD. One bit time later,
DATA is activated, which enables the output bit of the transmit shift register to TXD. The first shift
pulse occurs one bit time after that. The first shift clocks a 1 (the stop bit) into the 9th bit position of
the shift register. Thereafter, only zeroes are clocked in. Thus, as data bits shift out to the right,
zeroes are clocked in from the left. When TB8 is at the output position of the shift register, then the
stop bit is just to the left of TB8, and all positions to the left of that contain zeroes. This condition
flags the TX control unit to do one last shift and then deactivate SEND and set TI. This occurs at
the 11th divide-by-16 rollover after "Write-to-SBUF".
Reception is initiated by a detected 1-to-0 transition at RXD. For this purpose RXD is sampled at a
rate of 16 times whatever baud rate has been established. When a transition is detected, the divide-
by-16 counter is immediately reset, and 1FF is written to the input shift register.
H
At the 7th, 8th and 9th counter states of each bit time, the bit detector samples the value of RXD.
The value accepted is the value that was seen in at least 2 of the 3 samples. If the value accepted
during the first bit time is not 0, the receive circuits are reset and the unit goes back to looking for
another 1-to-0 transition. If the start bit proves valid, it is shifted into the input shift register, and
reception of the rest of the frame will proceed.
As data bit come from the right, 1s shift out to the left. When the start bit arrives at the leftmost
position in the shift register (which in modes 2 and 3 is a 9-bit register), it flags the RX control block
to do one last shift, load SBUF and RB8, and to set RI. The signal to load SBUF and RB8, and to
set RI, will be generated if, and only if, the following conditions are met at the time the final shift
pulse is generated:
1) RI = 0, and
2) Either SM2 = 0 or the received 9th data bit = 1
If either of these conditions is not met, the received frame is irretrievably lost, and RI is not set. If
both conditions are met, the received 9th data bit goes into RB8, and the first 8 data bit goes into
SBUF. One bit time later, whether the above conditions were met or not, the unit goes back to
looking for a 1-to-0 transition at the RXD input.
Note that the value of the received stop bit is irrelevant to SBUF, RB8 or RI.
Semiconductor Group
6-54
On-Chip Peripheral Components
C515
Internal Bus
TB8
Write
to
SBUF
Q
&
S
_
<
TXD
1
SBUF
D
CLK
Zero Detector
Stop Bit
Generation
Shift
Start
Data
TX Control
Send
÷ 16
TX Clock
TI
_
<
1
Baud
Rate
Clock
Serial
Port
Interrupt
÷ 16
Sample
RX Clock
RI
Load
SBUF
1-to-0
Transition
Detector
Start
RX Control
Shift
1FF
Bit
Detector
Input Shift Register
(9Bits)
RXD
Shift
Load
SBUF
SBUF
Read
SBUF
Internal Bus
MCS02105
Figure 6-28
Serial Interface, Mode 2 and 3, Functional Diagram
Semiconductor Group
6-55
On-Chip Peripheral Components
C515
Transmit
Receive
Figure 6-29
Serial Interface, Mode 2 and 3, Timing Diagram
Semiconductor Group
6-56
On-Chip Peripheral Components
C515
6.4 A/D Converter
The C515 provides an A/D converter with the following features:
– 8 multiplexed input channels
– The possibility of using the analog inputs (port 6) also as digital inputs
– Programmable internal reference voltages (16 steps each) via resistor array
– 8-bit resolution within the selected reference voltage range
– Internal start-of-conversion trigger
– Interrupt request generation after each conversion
For the conversion, the method of successive approximation via capacitor array is used. The
externally applied reference voltage range has to be held on a fixed value within the specifications
(see section "A/D Converter Characteristics" in chapter 10). The internal reference voltages can be
varied to reduce the reference voltage range of the A/D converter and thus to achieve a higher
resolution. Figure 6-30 shows a block diagram of the A/D converter.
6.4.1 A/D Converter Operation
An internal start of a single A/D conversion is triggered by a write-to-DAPR instruction. When single
conversion mode is selected (bit ADM=0) only one A/D conversion is performed. In continuous
mode (bit ADM=1), after completion of an A/D conversion a new A/D conversion is triggered
automatically until bit ADM is reset.
The busy flag BSY (ADCON.4) is automatically set when an A/D conversion is in progress. After
completion of the conversion it is reset by hardware. This flag can be read only, a write has no
effect. The interrupt request flag IADC (IRCON.0) is set when an A/D conversion is completed.
The bits MX0 to MX2 in special function register ADCON are used for selection of the analog input
channel.
Port 6 is a dual purpose input port. lf the input voltage meets the specified logic levels, it can also
be used as digital inputs regardless of whether the pin levels are sampled by the A/D converter at
the same time.
Semiconductor Group
6-57
On-Chip Peripheral Components
C515
Internal
Bus
IEN1 (B8
)
H
EXEN2 SWDT EX6
IRCON (C0
EX5
IEX5
BSY
EX4
IEX4
ADM
EX3
IEX3
MX2
ECAN EADC
)
H
EXF2
TF2
IEX6
0
IADC
MX0
ADCON (D8
)
H
_
BD
CLK
MX1
ADDAT
(D9
)
H
Single/
Continuous
Mode
LBS
.1
.2
.3
.4
Port 6
MUX
S & H
.5
A/D
.6
Converter
MSB
Conversion Clock fADC
Input Clock fIN
fOSC /2
÷ 4
Write to
DAPR
Start of
Conversion
VINTAREF VINTAGND
VAREF
VAGND
Internal Reference Voltages
DAPR (DA
.7
)
H
.6
.5
.4
.3
.2
.1
.0
Internal
Bus
Programming of
VINTAREF
Programming of
VINTAGND
Shaded bit locations are not used in ADC-functions.
MCB03207
Figure 6-30
A/D Converter Block Diagram
Semiconductor Group
6-58
On-Chip Peripheral Components
C515
6.4.2 A/D Converter Registers
This section describes the bits/functions of the registers which are used by the A/D converter.
– ADCON (A/D converter control register)
– ADDAT (A/D converter data register)
– IEN1 and IRCON (A/D converter Interrupt control bits)
– DAPR (D/A converter program register) for the programmable reference voltages.
6.4.2.1 A/D Converter Control Register ADCON
Special function register ADCON which is is used to set the operating modes, to check the status,
and to select one of eight analog input channels.
Special Function Register ADCON (Address D8 ) )
H
Reset Value : 00X00000
B
Bit No. MSB
LSB
0
7
6
5
4
3
2
1
D8
–
BSY
ADM
MX2
MX1
MX0 ADCON
BD
CLK
H
The shaded bits are not used for A/D converter control.
Bit
Function
BSY
Busy flag
This flag indicates whether a conversion is in progress (BSY = 1). The flag is
set by hardware during an A/D conversion and cleared by hardware when the
conversion is completed.
ADM
A/D conversion mode
When set, a continuous A/D conversion is selected. If cleared during a running
A/D conversion, the conversion is stopped after current conversion process is
completed.
MX2 - MX0
A/D converter input channel select bits
Bits MX2-0 are used for selection of the analog input channels.The analog
inputs are selected according to the following table :
MX2
MX1
MX0
Selected Analog Input
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
P6.0 / AIN0
P6.1 / AIN1
P6.2 / AIN2
P6.3 / AIN3
P6.4 / AIN4
P6.5 / AIN5
P6.6 / AIN6
P6.7 / AIN7
Semiconductor Group
6-59
On-Chip Peripheral Components
C515
Note :Generally, before entering the power-down mode, an A/D conversion in progress must be
stopped. If a single A/D conversion is running, it must be terminated by polling the BSY bit or
waiting for the A/D conversion interrupt. In continuous conversion mode, bit ADM must be
cleared and the last A/D conversion must be terminated before entering the power-down
mode.
A single A/D conversion is started by writing to SFR ADDAT with dummy data. A continuous
conversion is started under the following conditions :
– By setting bit ADM during a running single A/D conversion
– By setting bit ADM when at least one A/D conversion has occured after the last reset
operation.
– By writing ADDAT with dummy data after bit ADM has been set before (if no A/D conversion
has occured after the last reset operation).
When bit ADM is reset by software in continuous conversion mode, the just running A/D conversion
is stopped after its end.
6.4.2.2 A/D Converter Data Register ADDAT
This register holds the result of the 8-bit conversion. The most significant bit of the 8-bit conversion
result is bit 7 and the least significant bit is bit 0 of the ADDAT register. The data remains in ADDAT
until it is overwritten by the next converted data. ADDAT can be read or written under software
control. If the A/D converter of the C515 is not used, register ADDAT can be used as an additional
general purpose register.
Special Function Register ADDAT (Address D9 )
H
Reset Value : 00
H
Bit No. MSB
LSB
0
7
6
5
4
3
2
1
.7
D9
.2
.1
.6
.5
.4
.3
.0
ADDAT
H
Semiconductor Group
6-60
On-Chip Peripheral Components
C515
6.4.2.3 A/D Converter Interrupt Control Bits in IEN1 and IRCON
The A/D converter interrupt is controlled by bits which are located in the SFRs IEN1 and IRCON.
Special Function Register IEN1 (Address B8 )
H
Special Function Register IRCON (Address C0 )
H
Reset Value : 00
Reset Value : 00
H
H
LSB
B8
MSB
Bit No.
BF
BE
BD
BC
BB
BA
B9
H
H
H
H
H
H
H
H
B8
H
EXEN2 SWDT EX6
EX5
EX4
EX3 ECAN EADC
IEN1
C7
C6
C5
C4
H
C3
C2
C1
C0
H
H
H
H
H
H
H
IRCON
IADC
C0
H
IEX6 IEX5
IEX4
IEX3
IEX2
EXF2
TF2
The shaded bits are not used for A/D converter control.
Bit
Function
EADC
Enable A/D converter interrupt
If EADC = 0, the A/D converter interrupt is disabled.
IADC
A/D converter interrupt request flag
Set by hardware at the end of an A/D conversion. Must be cleared by software.
Semiconductor Group
6-61
On-Chip Peripheral Components
C515
6.4.2.4 Programmable Reference Voltages of the A/D Converter (DAPR Register)
The C515 has two pins to which a reference voltage range for the on-chip A/D converter is applied
(pin VAREF for the upper voltage and pin VAGND for the lower voltage). In contrast to conventional A/
D converters it is now possible to use not only these externally applied reference voltages for the
conversion but also internally generated reference voltages which are derived from the externally
applied ones. For this purpose a resistor ladder provides 16 equidistant voltage levels between
V
AREF and VAGND. These steps can individually be assigned as upper and lower reference voltage for
the converter itself. These internally generated reference voltages are called VlntAREF and VlntAGND
.
The internal reference voltage programming can be thought of as a programmable "D/A converter"
which provides the voltages VIntARFF and VIntAGND for the A/D converter itself.
Special Function Register DAPR (Address DA ) )
H
Reset Value : 00
H
Bit No. MSB
LSB
0
7
6
5
4
3
2
1
.5
.0
DA
.4
.3
.2
.1
DAPR
.7
.6
H
Bit
Function
DAPR.7-.4
Programming of VIntAREF
These bits are used for adjustment of the internal VIntAREF voltage.
DAPR.3-.0
Programming of VIntAGND
These bits are used for adjustment of the internal VIntAGND voltage.
Any write-access to DAPR starts conversion.
The SFR DAPR is provided for programming the internal reference voltages VIntAREF and VlntAGND. For
this purpose the internal reference voltages can be programmed in steps of 1/16 of the external
reference voltages (VAREF – VAGND) by four bits each in register DAPR. Bits 0 to 3 specify VlntAGND
,
while bits 4 to 7 specify VIntAREF. A minimum of 1 V difference is required between the internal
reference voltages VlntARF and VIntAGND for proper operation of the A/D converter. This means, for
example, in the case where VAREF is 5 V and VAGND is 0 V, there must be at least four steps difference
between the internal reference voltages VIntAREF and VIntAGND
.
The values of VIntAGND and VIntAREF are given by the formulas:
DAPR.3-.0
V
IntAGND = VAGND
+
(VAREF – VAGND
)
)
16
with DAPR.3-.0 < C ;
H
DAPR.7-.4
16
VIntAREF = VAGND
+
(VAREF – VAGND
with DAPR.7-.4 > 3 ;
H
Semiconductor Group
6-62
On-Chip Peripheral Components
C515
DAPR.3-.0 is the contents of the low-order nibble, and DAPR.7-.4 the contents of the high-order
nibble of DAPR.
If DAPR.3-.0 or DAPR.7-.4 = 0, the internal reference voltages correspond to the external reference
voltages VAGND and VAREF, respectively.
If VAINPUT > VIntAREF, the conversion result is FF , if VAINPUT < VIntAGDN , the conversion result is 00
(VAINPUT is the analog input voltage). If the external reference voltages VAGND = 0 V and VAREF = +5 V
(with respect to VSS and VCC) are applied, then the following internal reference voltages VIntAGND and
H
H
VIntAREF shown in table 6-6 can be adjusted via the special function register DAPR.
Table 6-6
Adjustable Internal Reference Voltages
Step
DAPR (.3-.0)
DAPR (.7-.4)
VIntAGND
VIntAREF
0
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
0.0
5.0
1
0.3125
0.625
0.9375
1.25
1.5625
1.875
2.1875
2.5
–
2
–
3
–
4
1.25
5
1.5625
1.875
2.1875
2.5
6
7
8
9
2.8125
3.125
3.4375
3.75
–
2.8125
3.125
3.4375
3.75
10
11
12
13
14
15
4.0625
4.375
4.68754
–
–
The programmability of the internal reference voltages allows adjusting the internal voltage range
to the range of the external analog input voltage or it may be used to increase the resolution of the
converted analog input voltage by starting a second conversion with a compressed internal
reference voltage range close to the previously measured analog value. Figures 7-30 and 7-31
illustrate these applications.
Semiconductor Group
6-63
On-Chip Peripheral Components
C515
AN0
AN1
AN..
5.00 V
VAREF
4.375 V
2.5 V
3.125 V
2.5 V VINTAREF
1.25 V VINTAGND
0.625 V
0 V
VAGND
MCA01899
Figure 6-31
Adjusting the Internal Reference Voltages within Range of the External Analog Input
Voltages
First Conversion
20 mV Resolution
Second Conversion
5 mV Resolution
5.00 V
VAREF
3.125 V
VINTAREF
1.875 V
VINTAGND
0 V
VAGND
MCA01900
Sample
Time
Sample
Time
Figure 6-32
Increasing the Resolution by a Second Conversion
Semiconductor Group
6-64
On-Chip Peripheral Components
C515
The external reference voltage supply need only be applied when the A/D converter is used,
otherwise the pins VAREF and VAGND may be left unconnected. The reference voltage supply has to
meet some requirements concerning the level of VAGND and VAREF and the output impedance of the
supply voltage (see also "A/D Converter Characteristics" in the data sheet).
– The voltage VAREF must meet the following specification :
V
AREF = VCC + 0.25 V
– The voltage VAGND must meet a similar specification :
AGND = VSS + 0.2 V
V
– The differential output impedance of the analog reference supply voltage should be less than
1 kW.
lf the above mentioned operating conditions are not met the accuracy of the converter may be
decreased.
Furthermore, the analog input voltage VAINPUT must not exceed the range from (VAGND – 0.2 V) to
(VAREF + 0.2 V). Otherwise, a static input current might result at the corresponding analog input
which will also affect the accuracy of the other input channels.
Semiconductor Group
6-65
On-Chip Peripheral Components
C515
6.4.3 A/D Conversion Timing
An A/D conversion is internally started by writing the SFR DAPR. A write to SFR DAPR will start a
new conversion even if a conversion is currently in progress. The conversion begins with the next
machine cycle, and the BSY flag in SFR ADCON will be set.
The A/D conversion procedure is divided into three parts :
– Sample phase (t ), used for sampling the analog input voltage.
S
– Conversion phase (t ), used for the real A/D conversion.
CO
– Write result phase (t ), used for writing the conversion result into the ADDAT register.
WR
Sample Time t :
S
During this time the internal capacitor array is connected to the selected analog input channel and
is loaded with the analog voltage to be converted. The analog voltage is internally fed to a voltage
comparator. With beginning of the sample phase the BSY bit in SFR ADCON is set.
Conversion Time t
:
CO
During the conversion time the analog voltage is converted into a 8-bit digital value using the
successive approximation technique with a binary weighted capacitor network.
Write Result Time t
:
WR
At the result phase the conversion result is written into the ADDAT register.
The total A/D conversion time is defined by t which is the sum of the two phase times t and
ADCC
S
t
. The duration of the three phases of an A/D conversion is specified as shown in figure 6-33.
CO
This figure also shows how an A/D conversion is embedded into the microcontroller cycle scheme
using the relation 6 x t = 1 instruction cycle. It also shows the behaviour of the busy flag (BSY)
IN
and the interrupt flag (IADC) during an A/D conversion.
Semiconductor Group
6-66
On-Chip Peripheral Components
C515
Start of an
A/D Conversion
Result is written
into ADDAT
BSY Bit
Sample
Phase
t S
Conversion Phase
t CO
Write
Result
Phase
t WR
tADCC
A/D Conversion Time Cycle Time
t WR = t IN
tADCC = t S +t CO = 40t IN + 32t IN = 72t IN
with t IN = 2xt CLCL
Write Result Cycle
MOV A, ADDAT
MOV ADDAT,#0
x-1
1 Instruction Cycle
x
1
2
3
4
5
11
12
13
14
15
16
Start of next conversion
(in continuous mode)
tADCC = 80tIN
Write
ADDAT
Start of A/D
conversion cycle
A/D Conversion Cycle
Cont. conv.
Single conv.
BSY Bit
IADC Bit
First instr. of an
interrupt routine
MCT03236
Figure 6-33
A/D Conversion Timing
Semiconductor Group
6-67
On-Chip Peripheral Components
C515
An A/D conversion is always started with the beginning of a processor cycle when it has been
initiated by writing SFR ADDAT. The ADDAT write operation may take one or two machine cycles.
In figure 6-33, the instruction MOV ADDAT,#0 starts the A/D conversion (machine cycle X-1 and
X). The total A/D conversion (sample and conversion phase) is finished with the beginning of the
14th machine cycle after the A/D conversion start. In the next machine cycle the conversion result
is written into the ADDAT register and can be read in the same cycle by an instruction (e.g. MOV
A,ADDAT). If continuous conversion is selected (bit ADM set), the next conversion is started with
the beginning of the machine cycle which follows the write result cycle.
The BSY bit is set at the beginning of the first A/D conversion machine cycle and reset at the
beginning of the write result cycle. If continuous conversion is selected, BSY is again set with the
beginning of the machine cycle which follows the write result cycle. This means that in continuous
conversion mode BSY is not set for a complete machine cycle. Therefore, in continuous conversion
mode it is not recommended to poll the BSY bit using e.g. the JNB instruction.
The interrupt flag IADC is set in the 12th instruction cycle of an A/D conversion. If the A/D converter
interrupt is enabled and the A/D converter interrupt is priorized to be serviced immediately, the first
instruction of the interrupt service routine will be executed in the next machine cycle which follows
the write result cycle. IADC must be reset by software.
Depending on the application, typically there are three methods to handle the A/D conversion in the
C515 :
– Software delay
The machine cycles of the A/D conversion are counted and the program executes a software
delay (e.g. NOPs) before reading the A/D conversion result in the write result cycle. This is
the fastest method to get the result of an A/D conversion.
– Polling BSY bit
The BSY bit is polled and the program waits until BSY=0. Attention : a polling JB instruction
which is two machine cycles long, possibly may not recognize the BSY=0 condition during the
write result cycle in the continuous conversion mode.
– A/D conversion interrupt
After the start of an A/D conversion the A/D converter interrupt is enabled. The result of the
A/D conversion is read in the interrupt service routine. If other C515 interrupts are enabled,
the interrupt latency must be regarded. Therefore, this software method is the slowest method
to get the result of an A/D conversion.
Depending on the oscillator frequency of the C515 the total time of an A/D conversion is calculated
according the formula given in figure 6-33. Table 6-7 shows some conversion times for typical clock
rates.
Table 6-7
A/D Conversion Times
f
[MHz]
t [ns]
Total Conversion Time
[ms]
IN
OSC
t
ADCC
12 MHz
16 MHz
24 MHz
166.7
125
12
9
83.3
6
Semiconductor Group
6-68
Interrupt System
C515
7
Interrupt System
The C515 provides 12 interrupt sources with four priority levels. Five interrupts can be generated by
the on-chip peripherals (timer 0, timer 1, timer 2, A/D converter, and serial interface) and seven
interrupts may be triggered externally (P3.2/INT0, P3.3/INT1, P1.4/INT2, P1.0/INT3, P1.1/INT4,
P1.2/INT5, P1.3/INT6).
This chapter shows the interrupt structure, the interrupt vectors and the interrupt related special
function registers. Figure 7-1 and 7-2 give a general overview of the interrupt sources and illustrate
the request and the control flags which are described in the next sections.
Semiconductor Group
7-1
Interrupt System
C515
Highest
Priority Level
P3.2/
INT0
IE0
0003
0043
EX0
IEN0.0
H
H
TCON.1
IT0
TCON.0
Lowest
Priority Level
A/D Converter
IADC
EADC
IRCON.0
IEN1.0
IP1.0
IP0.0
Timer 0
Overflow
TF0
000B
004B
ET0
IEN0.1
H
H
TCON.5
P1.4/
INT2
IEX2
EX2
IEN1.1
IRCON.1
I2FR
T2CON.5
IP1.1
IP0.1
P3.3/
INT1
IE1
0013
0053
EX1
IEN0.2
H
H
TCON.3
IT1
TCON.2
P1.0/
INT3
CC0
IEX3
EX3
IEN1.2
IRCON.2
I3FR
T2CON.6
EAL
IEN0.7
IP1.2
IP0.2
Bit addressable
MCS03208
Request Flag is
cleared by hardware
Figure 7-1
Interrupt Structure, Overview Part 1
Semiconductor Group
7-2
Interrupt System
C515
Highest
Priority Level
Timer 1
Overflow
TF1
001B
005B
ET1
IEN0.3
H
H
TCON.7
Lowest
Priority Level
P1.1/
INT4
CC1
IEX4
EX4
IRCON.3
IEN1.3
IP1.3
IP0.3
RI
_
<
1
SCON.0
USART
P1.2/
0023
0063
ES
IEN0.4
H
H
TI
SCON.1
IEX5
INT5
CC2
EX5
IRCON.4
IEN1.4
IP1.4
IP0.4
Timer 2
Overflow
TF2
IRCON.6
_
<
1
P1.5/
T2EX
EXF2
002B
006B
EXEN2
IEN1.7
ET2
IEN0.5
H
H
IRCON.7
P1.3/
INT6
CC3
IEX6
IRCON.5
EX6
IEN1.5
EAL
IEN0.7
IP1.5
IP0.5
Bit addressable
Request Flag is
MCS03209
cleared by hardware
Figure 7-2
Interrupt Structure, Overview Part 2
Semiconductor Group
7-3
Interrupt System
C515
7.1 Interrupt Registers
7.1.1 Interrupt Enable Registers
Each interrupt vector can be individually enabled or disabled by setting or clearing the
corresponding bit in the interrupt enable registers IEN0 and IEN1. Register IEN0 also contains the
global disable bit (EAL), which can be cleared to disable all interrupts at once. Generally, after reset
all interrupt enable bits are set to 0. That means that the corresponding interrupts are disabled.
The IEN0 register contains the general enable/disable flags of the external interrupts 0 and 1, the
timer interrupts, and the USART interrupt.
Special Function Register IEN0 (Address A8 )
H
Reset Value : 00
H
LSB
A8
MSB
Bit No.
AF
AE
AD
AC
ES
AB
AA
A9
H
H
H
H
H
H
H
H
A8
H
EAL
WDT
ET2
ET1
EX1
ET0
EX0
IEN0
The shaded bit is not used for interrupt control.
Bit
Function
EAL
Enable/disable all interrupts.
If EAL=0, no interrupt will be acknowledged.
If EAL=1, each interrupt source is individually enabled or disabled by setting or
clearing its enable bit.
ET2
ES
Timer 2 overflow / external reload interrupt enable.
If ET2 = 0, the timer 2 interrupt is disabled.
If ET2 = 1, the timer 2 interrupt is enabled.
Serial channel (USART) interrupt enable
If ES = 0, the serial channel interrupt 0 is disabled.
If ES = 1, the serial channel interrupt 0 is enabled.
ET1
EX1
ET0
EX0
Timer 1 overflow interrupt enable.
If ET1 = 0, the timer 1 interrupt is disabled.
If ET1 = 1, the timer 1 interrupt is enabled.
External interrupt 1 enable.
If EX1 = 0, the external interrupt 1 is disabled.
If EX1 = 1, the external interrupt 1 is enabled.
Timer 0 overflow interrupt enable.
If ET0 = 0, the timer 0 interrupt is disabled.
If ET0 = 1, the timer 0 interrupt is enabled.
External interrupt 0 enable.
If EX0 = 0, the external interrupt 0 is disabled.
If EX0 = 1, the external interrupt 0 is disabled.
Semiconductor Group
7-4
Interrupt System
C515
The IEN1 register contains enable/disable flags of the timer 2 external timer reload interrupt, the
external interrupts 2 to 6, and the A/D converter interrupt.
Special Function Register IEN1 (Address B8 )
H
Reset Value : 00
H
LSB
B8
MSB
Bit No.
BF
BE
BD
BC
BB
BA
B9
H
H
H
H
H
H
H
H
B8
H
EXEN2 SWDT EX6
EX5
EX4
EX3
EX2 EADC
IEN1
The shaded bit is not used for interrupt control.
Bit
Function
EXEN2
Timer 2 external reload interrupt enable
If EXEN2 = 0, the timer 2 external reload interrupt is disabled.
If EXEN2 = 1, the timer 2 external reload interrupt is enabled. The external reload
function is not affected by EXEN2.
EX6
EX5
EX4
EX3
EX2
EADC
External interrupt 6 / capture/compare interrupt 3 enable
If EX6 = 0, external interrupt 6 is disabled.
If EX6 = 1, external interrupt 6 is enabled.
External interrupt 5 / capture/compare interrupt 2 enable
If EX5 = 0, external interrupt 5 is disabled.
If EX5 = 1, external interrupt 5 is enabled.
External interrupt 4 / capture/compare interrupt 1 enable
If EX4 = 0, external interrupt 4 is disabled.
If EX4 = 1, external interrupt 4 is enabled.
External interrupt 3 / capture/compare interrupt 0 enable
If EX3 = 0, external interrupt 3 is disabled.
If EX3 = 1, external interrupt 3 is enabled.
External interrupt 2 / capture/compare interrupt 4 enable
If EX2 = 0, external interrupt 2 is disabled.
If EX2 = 1, external interrupt 2 is enabled.
A/D converter interrupt enable
If EADC = 0, the A/D converter interrupt is disabled.
If EADC = 1, the A/D converter interrupt is enabled.
Semiconductor Group
7-5
Interrupt System
C515
7.1.2 Interrupt Request / Control Flags
Special Function Register TCON (Address 88 )
H
Reset Value : 00
H
LSB
88
MSB
Bit No.
8F
8E
8D
8C
8B
8A
89
H
H
H
H
H
H
H
H
88
H
TF1
TR1
TF0
TR0
IE1
IT1
IE0
IT0
TCON
The shaded bits are not used for interrupt control.
Bit
Function
TF1
Timer 1 overflow flag
Set by hardware on timer/counter 1 overflow. Cleared by hardware when
processor vectors to interrupt routine.
TF0
IE1
IT1
IE0
IT0
Timer 0 overflow flag
Set by hardware on timer/counter 0 overflow. Cleared by hardware when
processor vectors to interrupt routine.
External interrupt 1 request flag
Set by hardware when external interrupt 1 edge is detected. Cleared by hardware
when processor vectors to interrupt routine.
External interrupt 1 level/edge trigger control flag
If IT1 = 0, low level triggered external interrupt 1 is selected.
If IT1 = 1, falling edge triggered external interrupt 1 is selected.
External interrupt 0 request flag
Set by hardware when external interrupt 0 edge is detected. Cleared by hardware
when processor vectors to interrupt routine.
External interrupt 0 level/edge trigger control flag
If IT0 = 0, low level triggered external interrupt 0 is selected.
If IT0 = 1, falling edge triggered external interrupt 0 is selected.
The external interrupts 0 and 1 (INT0 and INT1) can each be either level-activated or negative
transition-activated, depending on bits IT0 and IT1 in register TCON. The flags that actually
generate these interrupts are bits IE0 and lE1 in TCON. When an external interrupt is generated, the
flag that generated this interrupt is cleared by the hardware when the service routine is vectored too,
but only if the interrupt was transition-activated. lf the interrupt was level-activated, then the
requesting external source directly controls the request flag, rather than the on-chip hardware.
The timer 0 and timer 1 interrupts are generated by TF0 and TF1 in register TCON, which are set
by a rollover in their respective timer/counter registers. When a timer interrupt is generated, the flag
that generated it is cleared by the on-chip hardware when the service routine is vectored too.
Semiconductor Group
7-6
Interrupt System
C515
Special Function Register T2CON (Address C8 )
H
Reset Value : 00
H
LSB
MSB
Bit No.
CF
CE
CD
CC
CB
CA
C9
H
C8
H
H
H
H
H
H
H
C8
H
T2PS I3FR
I2FR T2R1 T2R0 T2CM T2I1
T2I0
T2CON
The shaded bits are not used for interrupt control.
Bit
Function
I3FR
External interrupt 3 rising/falling edge control flag
If I3FR = 0, the external interrupt 3 is activated by a falling edge at P1.0/INT3/CC0.
If I3FR = 1, the external interrupt 3 is activated by a rising edge at P1.0/INT3/CC0.
I2FR
External interrupt 2 rising/falling edge control flag
If I2FR = 0, the external interrupt 2 is activated by a falling edge at P1.4/INT2.
If I2FR = 1, the external interrupt 2 is activated by a rising edge at P1.4/INT2.
The external interrupt 2 (INT2) can be either positive or negative transition-activated depending on
bit I2FR in register T2CON. The flag that actually generates this interrupt is bit IEX2 in register
IRCON. lf an interrupt 2 is generated, flag IEX2 is cleared by hardware when the service routine is
vectored to.
The external interrupt 3 (INT3) can be either positive or negative transition-activated, depending
on bit I3FR in register T2CON. The flag that actually generates this interrupt is bit IEX3 in register
IRCON. In addition, this flag will be set if a compare event occurs at pin P1.0/INT3/CC0, regardless
of the compare mode established and the transition at the respective pin. The flag IEX3 is cleared
by hardware when the service routine is vectored to.
Semiconductor Group
7-7
Interrupt System
C515
Special Function Register IRCON (Address C0 )
H
Reset Value : 00
H
LSB
MSB
Bit No.
C7
C6
C5
C4
C3
C2
C1
H
C0
H
H
H
H
H
H
H
C0
H
EXF2
TF2
IEX6
IEX5
IEX4
IEX3
IEX2 IADC
IRCON
Bit
Function
EXF2
Timer 2 external reload flag
EXF2 is set when a reload is caused by a falling edge on pin T2EX while EXEN2 =
1. If ET2 in IEN0 is set (timer 2 interrupt enabled), EXF2 = 1 will cause an interrupt.
EXF2 can be used as an additional external interrupt when the reload function is
not used. EXF2 must be cleared by software.
TF2
Timer 2 overflow flag
Set by a timer 2 overflow and must be cleared by software. If the timer 2 interrupt
is enabled, TF2 = 1 will cause an interrupt.
IEX6
External interrupt 6 edge flag
Set by hardware when external interrupt edge was detected or when a compare
event occurred at pin P1.3/INT6/CC3. Cleared by hardware when processor
vectors to interrupt routine.
IEX5
IEX4
IEX3
External interrupt 5 edge flag
Set by hardware when external interrupt edge was detected or when a compare
event occurred at pin P1.2/INT5/CC2. Cleared by hardware when processor
vectors to interrupt routine.
External interrupt 4 edge flag
Set by hardware when external interrupt edge was detected or when a compare
event occurred at pin P1.1/INT4/CC1. Cleared by hardware when processor
vectors to interrupt routine.
External interrupt 3 edge flag
Set by hardware when external interrupt edge was detected or when a compare
event occurred at pin P1.0/INT3/CC0. Cleared by hardware when processor
vectors to interrupt routine.
IEX2
External interrupt 2 edge flag
Set by hardware when external interrupt edge was detected at pin P1.4/INT2.
Cleared by hardware when processor vectors to interrupt routine.
IADC
A/D converter interrupt request flag
Set by hardware at the end of an A/D conversion. Must be cleared by software.
Semiconductor Group
7-8
Interrupt System
C515
The timer 2 interrupt is generated by the logical OR of bit TF2 in register T2CON and bit EXF2 in
register IRCON. Neither of these flags is cleared by hardware when the service routine is vectored
to. In fact, the service routine may have to determine whether it was TF2 or EXF2 that generated the
interrupt, and the bit will have to be cleared by software.
The A/D converter interrupt is generated by IADC bit in register IRCON. If an interrupt is
generated, in any case the converted result in ADDAT is valid on the first instruction of the interrupt
service routine. lf continuous conversion is established, IADC is set once during each conversion.
lf an A/D converter interrupt is generated, flag IADC will have to be cleared by software.
The external interrupts 4 to 6 (INT4, INT5, INT6) are positive transition-activated. The flags that
actually generate these interrupts are bits IEX4, IEX5, and IEX6 in register IRCON. In addition,
these flags will be set if a compare event occurs at the corresponding output pin P1.1/ INT4/CC1,
P1.2/INT5/CC2, and P1.3/INT6/CC3, regardless of the compare mode established and the
transition at the respective pin. When an interrupt is generated, the flag that generated it is cleared
by the on-chip hardware when the service routine is vectored too.
All of these interrupt request bits that generate interrupts can be set or cleared by software, with the
same result as if they had been set or cleared by hardware. That is, interrupts can be generated or
pending interrupts can be cancelled by software. The only exceptions are the request flags IE0 and
lE1. lf the external interrupts 0 and 1 are programmed to be level-activated, IE0 and lE1 are
controlled by the external source via pin INT0 and INT1, respectively. Thus, writing a one to these
bits will not set the request flag IE0 and/or lE1. In this mode, interrupts 0 and 1 can only be
generated by software and by writing a 0 to the corresponding pins INT0 (P3.2) and INT1 (P3.3),
provided that this will not affect any peripheral circuit connected to the pins.
Semiconductor Group
7-9
Interrupt System
C515
Special Function Register SCON (Address. 98 )
H
Reset Value : 00
H
LSB
MSB
Bit No.
9F
9E
9D
9C
9B
9A
99
TI
98
H
H
H
H
H
H
H
H
98
H
SM0
SM1
SM2
REN
TB8
RB8
RI
SCON
The shaded bits are not used for interrupt control.
Bit
Function
TI
Serial interface transmitter interrupt flag
Set by hardware at the end of a serial data transmission. Must be cleared by
software.
RI
Serial interface receiver interrupt flag
Set by hardware if a serial data byte has been received. Must be cleared by
software.
The serial port interrupt is generated by a logical OR of flag RI and TI in SFR SCON. Neither of
these flags is cleared by hardware when the service routine is vectored too. In fact, the service
routine will normally have to determine whether it was the receive interrupt flag or the transmission
interrupt flag that generated the interrupt, and the bit will have to be cleared by software.
Semiconductor Group
7-10
Interrupt System
C515
7.1.3 Interrupt Priority Registers
The lower six bits of these two registers are used to define the interrupt priority level of the interrupt
groups as they are defined in table 7-1 in the next section.
Special Function Register IP0 (Address A9 )
H
Special Function Register IP1 (Address B9 )
H
Reset Value : X0000000
Reset Value : XX000000
B
B
LSB
MSB
Bit No.
7
6
5
4
3
2
1
0
A9
H
–
WDTS IP0.5 IP0.4 IP0.3 IP0.2 IP0.1 IP0.0
IP0
IP1
Bit No.
7
6
5
4
3
2
1
0
B9
H
–
–
IP1.5 IP1.4 IP1.3 IP1.2 IP1.1 IP1.0
The shaded bits are not used for interrupt control.
Bit
Function
IP1.x
IP0.x
Interrupt group priority level bits (x=1-6, see table 7-1)
IP1.x
IP0.x
Function
0
0
1
1
0
1
0
1
Interrupt group x is set to priority level 0 (lowest)
Interrupt group x is set to priority level 1
Interrupt group x is set to priority level 2
Interrupt group x is set to priority level 3 (highest)
Semiconductor Group
7-11
Interrupt System
C515
7.2 Interrupt Priority Level Structure
The following table shows the interrupt grouping of the C515 interrupt sources.
Table 7-1
Interrupt Source Structure
Interrupt Associated Interrupts
Priority
Group
High Priority
Low Priority
1
2
3
4
5
6
External interrupt 0
Timer 0 overflow
External interrupt 1
Timer 1 overflow
Serial channel interrupt
Timer 2 interrupt
A/D converter interrupt
External interrupt 2
External interrupt 3
External interrupt 4
External interrupt 5
External interrupt 6
High
Low
Each pair of interrupt sources can be programmed individually to one of four priority levels by setting
or clearing one bit in the special function register IP0 and one in IP1. A low-priority interrupt can be
interrupted by a high-priority interrupt, but not by another interrupt of the same or a lower priority. An
interrupt of the highest priority level cannot be interrupted by another interrupt source.
lf two or more requests of different priority leveis are received simultaneously, the request of the
highest priority is serviced first. lf requests of the same priority level are received simultaneously, an
internal polling sequence determines which request is to be serviced first. Thus, within each priority
level there is a second priority structure determined by the polling sequence, as follows.
– Within one interrupt group the „left“ interrupt is serviced first
– The interrupt groups are serviced from top to bottom of the table.
Semiconductor Group
7-12
Interrupt System
C515
7.3 How Interrupts are Handled
The interrupt flags are sampled at S5P2 in each machine cycle. The sampled flags are polled during
the following machine cycle. If one of the flags was in a set condition at S5P2 of the preceeding
cycle, the polling cycle will find it and the interrupt system will generate a LCALL to the appropriate
service routine, provided this hardware-generated LCALL is not blocked by any of the following
conditions:
1. An interrupt of equal or higher priority is already in progress.
2. The current (polling) cycle is not in the final cycle of the instruction in progress.
3. The instruction in progress is RETI or any write access to registers IEN0 and IEN1 or IP0/IP1.
Any of these three conditions will block the generation of the LCALL to the interrupt service routine.
Condition 2 ensures that the instruction in progress is completed before vectoring to any service
routine. Condition 3 ensures that if the instruction in progress is RETI or any write access to
registers IEN0/IEN1 or IP0/IP1, then at least one more instruction will be executed before any
interrupt is vectored too; this delay guarantees that changes of the interrupt status can be observed
by the CPU.
The polling cycle is repeated with each machine cycle, and the values polled are the values that
were present at S5P2 of the previous machine cycle. Note that if any interrupt flag is active but not
being responded to for one of the conditions already mentioned, or if the flag is no longer active
when the blocking condition is removed, the denied interrupt will not be serviced. In other words, the
fact that the interrupt flag was once active but not serviced is not remembered. Every polling cycle
interrogates only the pending interrupt requests.
The polling cycle/LCALL sequence is illustrated in figure 7-3.
C1
C2
C3
C4
C5
S5P2
Interrupts
are polled
Long Call to Interrupt
Vector Address
Interrupt
Routine
Interrupt
is latched
MCT01859
Figure 7-3
Interrupt Response Timing Diagram
Semiconductor Group
7-13
Interrupt System
C515
Note that if an interrupt of a higher priority level goes active prior to S5P2 in the machine cycle
labeled C3 in figure 7-3 then, in accordance with the above rules, it will be vectored to during C5
and C6 without any instruction for the lower priority routine to be executed.
Thus, the processor acknowledges an interrupt request by executing a hardware-generated LCALL
to the appropriate servicing routine. In some cases it also clears the flag that generated the
interrupt, while in other cases it does not; then this has to be done by the user's software. The
hardware clears the external interrupt flags IE0 and IE1 only if they were transition-activated. The
hardware-generated LCALL pushes the contents of the program counter onto the stack (but it does
not save the PSW) and reloads the program counter with an address that depends on the source of
the interrupt being vectored too, as shown in the following table 7-2.
Table 7-2
Interrupt Source and Vectors
Interrupt Source
External Interrupt 0
Timer 0 Overflow
Interrupt Vector Address
Interrupt Request Flags
0003
H
IE0
000B
H
TF0
External Interrupt 1
Timer 1 Overflow
0013
H
IE1
001B
H
TF1
Serial Channel
0023
H
RI / TI
TF2 / EXF2
IADC
IEX2
IEX3
IEX4
IEX5
IEX6
Timer 2 Overflow / Ext. Reload
A/D Converter
002B
H
0043
H
External Interrupt 2
External Interrupt 3
External Interrupt 4
External Interrupt 5
External Interrupt 6
004B
H
0053
H
005B
H
0063
H
006B
H
Execution proceeds from that location until the RETI instruction is encountered. The RETI
instruction informs the processor that the interrupt routine is no longer in progress, then pops the
two top bytes from the stack and reloads the program counter. Execution of the interrupted program
continues from the point where it was stopped. Note that the RETI instruction is very important
because it informs the processor that the program left the current interrupt priority level. A simple
RET instruction would also have returned execution to the interrupted program, but it would have
left the interrupt control system thinking an interrupt was still in progress. In this case no interrupt of
the same or lower priority level would be acknowledged.
Semiconductor Group
7-14
Interrupt System
C515
7.4 External Interrupts
The external interrupts 0 and 1 can be programmed to be level-activated or negative-transition
activated by setting or clearing bit IT0, respectively in register TCON. If ITx = 0 (x = 0 or 1), external
interrupt x is triggered by a detected low level at the INTx pin. If ITx = 1, external interrupt x is
negative edge-triggered. In this mode, if successive samples of the INTx pin show a high in one
cycle and a low in the next cycle, interrupt request flag IEx in TCON is set. Flag bit IEx=1 then
requests the interrupt.
If the external interrupt 0 or 1 is level-activated, the external source has to hold the request active
until the requested interrupt is actually generated. Then it has to deactivate the request before the
interrupt service routine is completed, or else another interrupt will be generated.
The external interrupts 2 and 3 can be programmed to be negative or positive transition-activated
by setting or clearing bit I2FR or I3FR in register T2CON. lf IxFR = 0 (x = 2 or 3), the external
interrupt x is negative transition-activated. lf IxFR = 1, the external interrupt is triggered by a positive
transition.
The external interrupts 4, 5, and 6 are activated only by a positive transition. The external timer 2
reload trigger interrupt request flag EXF2 will be activated by a negative transition at pin Pl.5/T2EX
but only if bit EXEN2 is set.
Since the external interrupt pins (INT2 to INT6) are sampled once in each machine cycle, an input
high or low should be held for at least 6 oscillator periods to ensure sampling. lf the external interrupt
is transition-activated, the external source has to hold the request pin low (high for INT2 and INT3,
if it is programmed to be negative transition-active) for at least one cycle, and then hold it high (low)
for at least one cycle to ensure that the transition is recognized so that the corresponding interrupt
request flag will be set (see figure 7-4). The external interrupt request flags will automatically be
cleared by the CPU when the service routine is called.
Semiconductor Group
7-15
Interrupt System
C515
a) Level-Activated Interrupt
P3.x/INTx
Low-Level Threshold
> 1 Machine Cycle
b) Transition-Activated Interrupt
High-Level Threshold
e.g. P3.x/INTx
Low-Level Threshold
> 1 Machine Cycle
> 1 Machine Cycle
MCD01860
Transition to
be detected
Figure 7-4
External Interrupt Detection
Semiconductor Group
7-16
Interrupt System
C515
7.5 Interrupt Response Time
If an external interrupt is recognized, its corresponding request flag is set at S5P2 in every machine
cycle. The value is not polled by the circuitry until the next machine cycle. If the request is active and
conditions are right for it to be acknowledged, a hardware subroutine call to the requested service
routine will be next instruction to be executed. The call itself takes two cycles. Thus a minimum of
three complete machine cycles will elapse between activation and external interrupt request and the
beginning of execution of the first instruction of the service routine.
A longer response time would be obtained if the request was blocked by one of the three previously
listed conditions. If an interrupt of equal or higer priority is already in progress, the additional wait
time obviously depends on the nature of the other interrupt's service routine. If the instruction in
progress is not in its final cycle, the additional wait time cannot be more than 3 cycles since the
longest instructions (MUL and DIV) are only 4 cycles long; and, if the instruction in progress is RETI
or a write access to registers IEN0, IEN1 or IP0, IP1 the additional wait time cannot be more than
5 cycles (a maximum of one more cycle to complete the instruction in progress, plus 4 cycles to
complete the next instruction, if the instruction is MUL or DIV).
Thus a single interrupt system, the response time is always more than 3 cycles and less than
9 cycles.
Semiconductor Group
7-17
Fail Safe Mechanisms
C515
8
Fail Safe Mechanisms
8.1 Watchdog Timer
8.1.1 General Operation
As a means of graceful recovery from software or hardware upset a watchdog timer is provided in
the C515. lf the software fails to clear the watchdog timer at least every 65532 ms (at 12 MHz clock
rate), an internal hardware reset will be initiated. The software can be designed such that the
watchdog times out if the program does not progress properly. The watchdog will also time out if the
software error was due to hardware-related problems. This prevents the controller from
malfunctioning for longer than 65 ms if a 12-MHz oscillator is used.
The watchdog timer is a 16-bit counter which is incremented once every machine cycle. After an
external reset the watchdog timer is disabled and cleared to 0000 .
H
8.1.2 Starting the Watchdog Timer
There are two ways to start the watchdog timer depending on the level applied to pin PE/SWD. This
pin serves two functions, because it is also used for blocking the power saving modes. (see also
chapter 9).
8.1.2.1 The First Possibility of Starting the Watchdog Timer
The automatic start of the watchdog timer directly during an external HW reset is achieved by
strapping pin PE/SWD to VCC. In this case the power saving modes (power down mode, idle mode
and slow down mode) are also disabled and cannot be started by software. If pin PE/SWD is left
unconnected, a weak pull-up transistor ensures the automatic start of the watchdog timer.
The self-start of the watchdog timer by a pin option has been implemented to provide high system
security in electrically very noisy environments.
Note: The automatic start of the watchdog timer is only performed if PE/SWD (power-save
enable/start watchdog timer) is held at high level while RESET is active. A positive transition
at PE/SWD pin during normal program execution will not start the watchdog timer.
8.1.2.2 The Second Possibility of Starting the Watchdog Timer
The watchdog timer can also be started by software. Setting of bit SWDT in SFR IEN1 starts the
watchdog timer. After having been started, the bit WDTS in SFR IP0 is set. Note that the watchdog
timer cannot be stopped by software.
See chapter 9 for entering the power saving modes by software.
Semiconductor Group
8-1
Fail Safe Mechanisms
C515
8.1.3 Refreshing the Watchdog Timer
Once started, the watchdog timer can only be cleared to 0000 by first setting bit WDT and with the
H
next instruction setting bit SWDT. Bit WDT will automatically be cleared during the second machine
cycle after having been set. For this reason, setting SWDT bit has to be a one cycle instruction (e.g.
SETB SWDT). This double instruction clearing of the watchdog timer was implemented to minimize
the chance of unintentionally clearing the watchdog. To prevent the watchdog from overflowing, it
must be cleared periodically.
Setting only bit SWDT does not reload the watchdog timer automatically to 0000 . A watchdog
H
timer reset operation occurs only by using the double instruction refresh sequence SETB WDT /
SETB SWDT.
8.1.4 Watchdog Reset and Watchdog Status Flag
lf the software fails to clear the watchdog in time, an internally generated watchdog reset is entered
at the counter state FFFC and lasts four instruction cycles. This internal reset differs from an
H
external reset only to the extent that the watchdog timer is not disabled. Bit WDTS allows the
software to examine from which source the reset was initiated. lf it is set, the reset was caused by
a watchdog timer overflow.
Figure 8-1 shows a block diagram of the watchdog timer.
f OSC
÷ 12
16-Bit Watchdog Timer
Reset
WDT Reset if WDT count is between
FFFC - FFFF
H
H
IP0 ( A9
-
)
H
-
WDTS
-
-
-
-
-
External HW Reset
PE/SWD
Control Logic
-
-
WDT
-
-
-
-
-
-
-
-
-
-
-
-
IEN0 ( A8
IEN1 ( B8
)
)
H
H
SWDT
MCB03210
Figure 8-1
Block Diagram of the Watchdog Timer
Semiconductor Group
8-2
Fail Safe Mechanisms
C515
8.1.5 WDT Control and Status Flags
The watchdog timer is controlled by two control flags (located in SFR IEN0 and IEN1) and one
status flags (located in SFR IP0).
Special Function Register IEN0 (Address A8 )
H
Reset Value : 00
Reset Value : 00
Reset Value : X0000000
H
H
B
Special Function Register IEN1 (Address B8 )
H
Special Function Register IP0 (Address A9 )
H
LSB
A8
MSB
AF
AE
AD
AC
ES
AB
AA
A9
H
H
H
H
H
H
H
H
A8
B8
EAL
BF
WDT
BE
ET2
BD
ET1
EX1
BA
ET0
EX0
B8
IEN0
H
BC
BB
EX4
3
B9
H
H
H
H
H
H
H
H
EXEN2 SWDT EX6
EX5
4
EX3
2
EX2 EADC
IEN1
IP0
H
Bit No.
7
–
6
5
1
0
A9
H
WDTS IP0.5 IP0.4 IP0.3 IP0.2 IP0.1 IP0.0
The shaded bits are not used for fail save control.
Bit
Function
WDT
Watchdog timer refresh flag.
Set to initiate a refresh of the watchdog timer. Must be set directly
before SWDT is set to prevent an unintentional refresh of the
watchdog timer. WDT is reset by hardware two processor cycles
after it has been set.
SWDT
WDTS
Watchdog timer start/refresh flag.
Set to activate the watchdog timer. When directly set after setting
WDT, a watchdog timer refresh/reset is performed. Bit SDWT is reset
by hardware two processor cycles after it has been set.
Watchdog timer status flag.
Set by hardware when a watchdog Timer reset occured. Can be
cleared and set by software.
Semiconductor Group
8-3
Power Saving Modes
C515
9
Power Saving Modes
The C515 provides two basic power saving modes, the idle mode and the power down mode.
Additionally, a slow down mode is available. This power saving mode reduces the internal clock rate
in normal operating mode and it can be also used for further power reduction in idle mode. All the
power saving modes are initiated by software.
9.1 Hardware Enable for the Use of the Power Saving Modes
To provide power saving modes together with effective protection against unintentional entering of
these modes, the C515 has an extra pin disabling the use of the power saving modes. As this pin
will most likely be used only in critical applications it is combined with an automatic start of the
watchdog timer (see the description in chapter 8 “Fail Save Mechanisms”). This pin is called PE/
SWD (power saving enable/start watchdog timer) and its function is as follows:
PE/SWD = 1 (logic high level)
– Use of the power saving modes is not possible. The instruction sequences used for entering
these modes will not affect the normal operation of the device.
– lf and only if PE/SWD is held at high level during reset, the watchdog timer is started
immediately after reset is released.
PE/SWD = 0 (logic low level)
– All power saving modes can be activated as described in the following sections
– The watchdog timer has to be started by software if system protection is desired.
When left unconnected, the pin PE/SWD is pulled to high level by a weak internal pullup. This is
done to provide system protection by default.
The logic level applied to pin PE/SWD can be changed during program execution in order to allow
or block the use of the power saving modes without any effect on the on-chip watchdog circuitry;
(the watchdog timer is started only if PE/SWD is on high level up to the moment when reset is
released; a change at PE/SWD during program execution has no effect on the watchdog timer; this
only enables or disables the use of the power saving modes.). A change of the pin’s level is detected
in state 3, phase 1. A Schmitt trigger is used at the input to reduce susceptibility to noise.
In addition to the hardware enable/disable of the power saving modes, a double-instruction
sequence which is described in the corresponding sections is necessary to enter power down and
idle mode. The combination of all these safety precautions provide a maximum of system
protection.
Application Example for Switching Pin PE/SWD
For most applications in noisy environments, components external to the chip are used to give
warning of a power failure or a turn off of the power supply. These circuits could be used to control
the PE/SWD pin. The possible steps to go into power down mode could then be as follows:
– A power-fail signal forces the controller to go into a high priority interrupt routine. This interrupt
routine saves the actual program status. At the same time pin PE/SWD is pulled low by the
power-fail signal.
– Finally the controller enters power down mode by executing the relevant double-instruction
sequence.
Semiconductor Group
9-1
Power Saving Modes
C515
9.2 Power Saving Mode Control Register
The functions of the power saving modes are controlled by bits which are located in the special
function register PCON. The bits PDE, PDS and IDLE, IDLS located in SFR PCON select the power
down mode or the idle mode, respectively. If the power down mode and the idle mode are set at the
same time, power down takes precedence. Furthermore, register PCON contains two general
purpose flags. For example, the flag bits GF0 and GF1 can be used to give an indication if an
interrupt occurred during normal operation or during an idle. For this, an instruction that activates
idle can also set one or both flag bits. When idle is terminated by an interrupt, the interrupt service
routine can examine the flag bits.
Special Function Register PCON (Address 87
Reset Value : 00
H)
H
LSB
0
Bit No. MSB
7
6
5
4
3
2
1
87
PCON
SMOD
PDS
IDLS
SD
GF1
GF0
PDE
IDLE
H
The function of the shaded bit is not described in this section.
Symbol
Function
PDS
Power down start bit
The instruction that sets the PDS flag bit is the last instruction before entering
the power down mode
IDLS
SD
Idle start bit
The instruction that sets the IDLS flag bit is the last instruction before entering
the idle mode.
Slow down mode bit
When set, the slow down mode is enabled. This function is available in the
C515-LM/1RM versions only.
GF1
GF0
PDE
General purpose flag
General purpose flag
Power down enable bit
When set, starting of the power down is enabled
IDLE
Idle mode enable bit
When set, starting of the idle mode is enabled
Note: The PDS bit, which controls the software power down mode is forced to logic low whenever
the external PE/SWD pin is held at logic high level. Changing the logic level of the PE/SWD
pin from high to low will irregularly terminate the software power down mode and is not
permitted.
Semiconductor Group
9-2
Power Saving Modes
C515
9.3 Idle Mode
In the idle mode the oscillator of the C515 continues to run, but the CPU is gated off from the clock
signal. However, the interrupt system, the serial port, the A/D converter, and all timers with the
exception of the watchdog timer are further provided with the clock. The CPU status is preserved in
its entirety: the stack pointer, program counter, program status word, accumulator, and all other
registers maintain their data during idle mode.
The reduction of power consumption, which can be achieved by this feature depends on the number
of peripherals running. If all timers are stopped and the A/D converter, and the serial interfaces are
not running, the maximum power reduction can be achieved. This state is also the test condition for
the idle mode ICC.
Thus, the user has to take care which peripheral should continue to run and which has to be stopped
during idle mode. Also the state of all port pins – either the pins controlled by their latches or
controlled by their secondary functions – depends on the status of the controller when entering idle
mode.
Normally, the port pins hold the logical state they had at the time when the idle mode was activated.
If some pins are programmed to serve as alternate functions they still continue to output during idle
mode if the assigned function is on. This especially applies to the serial interface in case it cannot
finish reception or transmission during normal operation. The control signals ALE and PSEN are
held at logic high levels.
As in normal operation mode, the ports can be used as inputs during idle mode. Thus a capture or
reload operation can be triggered, the timers can be used to count external events, and external
interrupts will be detected.
The idle mode is a useful feature which makes it possible to "freeze" the processor's status - either
for a predefined time, or until an external event reverts the controller to normal operation, as
discussed below. The watchdog timer is the only peripheral which is automatically stopped during
idle mode.
Semiconductor Group
9-3
Power Saving Modes
C515
The idle mode is entered by two consecutive instructions. The first instruction sets the flag bit IDLE
(PCON.0) and must not set bit IDLS (PCON.5), the following instruction sets the start bit IDLS
(PCON.5) and must not set bit IDLE (PCON.0). The hardware ensures that a concurrent setting of
both bits, IDLE and IDLS, does not initiate the idle mode. Bits IDLE and IDLS will automatically be
cleared after being set. If one of these register bits is read the value that appears is 0. This double
instruction is implemented to minimize the chance of an unintentional entering of the idle mode
which would leave the watchdog timer's task of system protection without effect.
Note:
PCON is not a bit-addressable register, so the above mentioned sequence for entering the idle
mode is obtained by byte-handling instructions, as shown in the following example:
ORL
ORL
PCON,#00000001B
PCON,#00100000B
;Set bit IDLE, bit IDLS must not be set
;Set bit IDLS, bit IDLE must not be set
The instruction that sets bit IDLS is the last instruction executed before going into idle mode.
There are two ways to terminate the idle mode:
– The idle mode can be terminated by activating any enabled interrupt. The CPU operation is
resumed, the interrupt will be serviced and the next intsruction to be executed after the RETI
instruction will be the one following the instruction that had set the bit IDLS.
– The other way to terminate the idle mode, is a hardware reset. Since the oscillator is still
running, the hardware reset must be held active only for two machine cycles for a complete
reset.
Semiconductor Group
9-4
Power Saving Modes
C515
9.4 Slow Down Mode Operation (C515-LM/1RM only)
In some applications, where power consumption and dissipation are critical, the controller might run
for a certain time at reduced speed (e.g. if the controller is waiting for an input signal). Since in
CMOS devices there is an almost linear dependence of the operating frequency and the power
supply current, a reduction of the operating frequency results in reduced power consumption.
In the slow down mode all signal frequencies that are derived from the oscillator clock are divided
by 8.
The slow down mode is activated by setting the bit SD in SFR PCON. If the slow down mode is
enabled, the clock signals for the CPU and the peripheral units are reduced to 1/8 of the nominal
system clock rate. The controller actually enters the slow down mode after a short synchronization
period (max. two machine cycles). The slow down mode is terminated by clearing bit SD.
The slow down mode can be combined with the idle mode by performing the following double
instruction sequence:
ORL PCON,#00000001B
ORL PCON,#00110000B
; preparing idle mode: set bit IDLE (IDLS not set)
; entering idle mode combined with the slow down mode:
; (IDLS and SD set)
There are two ways to terminate the combined Idle and Slow Down Mode :
– The idle mode can be terminated by activation of any enabled interrupt. The CPU operation
is resumed, the interrupt will be serviced and the next instruction to be executed after the RETI
instruction will be the one following the instruction that had set the bits IDLS and SD.
Nevertheless the slow down mode keeps enabled and if required has to be terminated by
clearing the bit SD in the corresponding interrupt service routine or at any point in the program
where the user no longer requires the slow-down mode power saving.
– The other possibility of terminating the combined idle and slow down mode is a hardware
reset. Since the oscillator is still running, the hardware reset has to be held active for only two
machine cycles for a complete reset.
The slow down feature is not available for C515-LN/1RN versions.
Semiconductor Group
9-5
Power Saving Modes
C515
9.5 Power Down Mode
In the power down mode, the RC osciillator and the on-chip oscillator which operates with the XTAL
pins is stopped. Therefore, all functions of the microcontroller are stopped and only the contents of
the on-chip RAM and the SFR's are maintained. The port pins, which are controlled by their port
latches, output the values that are held by their SFR's. The port pins which serve the alternate
output functions show the values they had at the end of the last cycle of the instruction which
initiated the power down mode. ALE and PSEN held at logic low level (see table 9-1).
In the power down mode of operation, VCC can be reduced to minimize power consumption. It must
be ensured, however, that is VCC not reduced before the power down mode is invoked, and that VCC
is restored to its normal operating level before the power down mode is terminated.
The power down mode can be left only by a hardware reset. Leaving the power down mode puts the
microcontroller with its SFRs into the reset state, and it should not be done before VCC is restored
to its nominal operating level.
9.5.1 Invoking Power Down Mode
The power down mode is entered by two consecutive instructions. The first instruction has to set the
flag bit PDE (PCON.1) and must not set bit PDS (PCON.6), the following instruction has to set the
start bit PDS (PCON.6) and must not set bit PDE (PCON.1). The hardware ensures that a
concurrent setting of both bits, PDE and PDS, does not initiate the power down mode. Bits PDE and
PDS will automatically be cleared after having been set and the value shown by reading one of
these bits is always 0. This double instruction is implemented to minimize the chance of
unintentionally entering the power down mode which could possibly ”freeze” the chip's activity in an
undesired status.
PCON is not a bit-addressable register, so the above mentioned sequence for entering the power
down mode is obtained by byte-handling instructions, as shown in the following example:
ORL
ORL
PCON,#00000010B
PCON,#01000000B
;set bit PDE, bit PDS must not be set
;set bit PDS, bit PDE must not be set, enter power down
The instruction that sets bit PDS is the last instruction executed before going into power down
mode. When the double instruction sequence shown above is used, the power down mode can only
be left by a reset operation.
Note : Before entering the power down mode, an A/D conversion in progress must be stopped.
9.5.2 Exit from Power Down Mode
If power down mode is exit via a hardware reset, the microcontroller with its SFRs is put into the
hardware reset state and the content of RAM is not changed. The reset signal that terminates the
power down mode also restarts the RC oscillator and the on-chip oscillatror. The reset operation
should not be activated before VCC is restored to its normal operating level and must be held active
long enough to allow the oscillator to restart and stabilize (similar to power-on reset).
Semiconductor Group
9-6
Power Saving Modes
C515
9.6 State of Pins in the Power Saving Modes
In the idle mode and in the power down mode the port pins of the C515 have a well defined status
which is listed in the following table 9-1. This state of some pins also depends on the location of the
code memory (internal or external).
Table 9-1
Status of External Pins During Idle and Software Power Down Mode
Outputs
Last Instruction Executed from
Internal Code Memory
Last Instruction Executed from
External Code Memory
Idle
Power Down
Low
Idle
Power Down
Low
ALE
High
High
Data
Data
Data /
High
PSEN
Low
High
Low
PORT 0
PORT 2
PORT 1, 3, 4
Data
Float
Float
Data
Address
Data /
Data
Data /
Data /
alternate outputs last output
alternate outputs last output
Semiconductor Group
9-7
Device Specifications
C515
10
Device Specifications
10.1
Absolute Maximum Ratings
Ambient temperature under bias (TA) .............................................................. 0 ˚C to + 110 ˚C
Storage temperature (TST) ...............................................................................– 65 ˚C to + 150 ˚C
Voltage on VCC pins with respect to ground (VSS) ............................................– 0.5 V to 6.5 V
Voltage on any pin with respect to ground (VSS)..............................................– 0.5 V to VCC + 0.5 V
Input current on any pin during overload condition..........................................– 10 mA to + 10 mA
Absolute sum of all input currents during overload condition ..........................| 100 mA |
Power dissipation.............................................................................................TBD
Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage of the device. This is a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for longer
periods may affect device reliability. During overload conditions (VIN > VCC or VIN < VSS) the
Voltage on VCC pins with respect to ground (VSS) must not exceed the values defined by the
absolute maximum ratings.
Semiconductor Group
10-1
Device Specifications
C515
10.2
DC Characteristics
VCC = 5 V + 10%, – 15%; VSS = 0 V
TA = 0 to 70 °C
TA = – 40 to 85 °C
TA = – 40 to 110 °C
for the SAB-C515
for the SAF-C515
for the SAH-C515
Parameter
Symbol
Limit Values
Unit Test Condition
min.
max.
Input low voltages
all except EA
EA pin
VIL
VIL1
– 0.5
– 0.5
0.2 VCC - 0.1
0.2 VCC - 0.3
V
V
–
–
Input high voltages
all except XTAL2 and RESET
XTAL2 pin
VIH
VIH1
VIH2
0.2 VCC + 0.9 VCC + 0.5
V
V
V
–
–
–
0.7 VCC
0.6 VCC
V
CC + 0.5
RESET pin
VCC + 0.5
Output low voltages
Ports 1, 2, 3, 4, 5
Port 0, ALE, PSEN
VOL
VOL1
–
–
0.45
0.45
V
V
IOL = 1.6 mA 1)
IOL = 3.2 mA 1)
Output high voltages
Ports 1, 2, 3, 4, 5
VOH
2.4
0.9 VCC
2.4
–
–
–
–
V
V
V
V
I
I
I
I
OH = – 80 mA
OH = – 10 mA)
OH = – 800 mA 2)
OH = – 80 mA 2)
Port 0 an 2 in external bus mode, VOH2
ALE, PSEN
0.9 VCC
Logic 0 input current
Ports 1, 2, 3, 4, 5
IIL
– 10
– 65
– 70
mA
mA
VIN = 0.45 V
VIN = 2 V
Logical 0-to-1 transition current ITL
– 650
Ports 1, 2, 3, 4, 5
Input leakage current
Port 0, AIN0-7 (Port 6), EA
ILI
–
± 1
mA
0.45 < VIN < VCC
Input low current
to RESET for reset
XTAL2
ILI2
ILI3
ILI4
–10
–
–
– 100
– 15
– 20
mA
mA
mA
VIN = 0.45 V
VIN = 0.45 V
VIN = 0.45 V
PE
Pin capacitance
Overload current
Notes see next page
CIO
–
–
10
pF
fc = 1 MHz,
TA = 25 °C
7) 8)
IOV
± 5
mA
Semiconductor Group
10-2
Device Specifications
C515
Power Supply Current
Parameter
Symbol
Limit Values
Unit Test Condition
typ. 9)
max. 10)
4)
Active mode
Idle mode
12 MHz
16 MHz
24 MHz
11.0
13.7
19.1
14.8
18.2
25
mA
mA
mA
ICC
ICC
ICC
5)
12 MHz
16 MHz
24 MHz
5.8
6.9
9.1
8.1
9.6
12.8
mA
mA
mA
ICC
ICC
ICC
6)
Active mode with
12 MHz
16 MHz
24 MHz
4.2
4.9
6.3
6.1
7.0
8.8
mA
mA
mA
ICC
ICC
ICC
slow-down enabled
3)
Power-down mode
IPD
10
30
mA
1) Capacitive loading on ports 0 and 2 may cause spurious noise pulses to be superimposed on the VOL of ALE
and ports1, 3, 4, and 5. The noise is due to external bus capacitance discharging into the port 0 and port 2 pins
when these pins make 1-to-0 transitions during bus operation. In the worst case (capacitive loading > 100 pF),
the noise pulse on ALE line may exceed 0.8 V. In such cases it may be desirable to qualify ALE with a schmitt-
trigger, or use an address latch with a schmitt-trigger strobe input.
2) Capacitive loading on ports 0 and 2 may cause the VOH on ALE and PSEN to momentarily fall below the
0.9 VCC specification when the address lines are stabilizing.
3) IPD (power-down mode) is measured under following conditions:
EA = Port 0 = Port 6 =VCC ; RESET = VCC; XTAL1 = N.C.; PE = XTAL2 = VSS ; VAGND = VSS ; VAREF = VCC ; all
other pins are disconnected. The typical IPD current is measured at VCC = 5V.
4) ICC (active mode) is measured with:
XTAL2 driven with tCLCH , tCHCL = 5 ns , VIL = VSS + 0.5 V, VIH = VCC – 0.5 V; XTAL1 = N.C.;
EA = Port 0 = Port 6 = VCC ; RESET = VSS ; all other pins are disconnected.
5) ICC (idle mode) is measured with all output pins disconnected and with all peripherals disabled;
XTAL2 driven with tCLCH , tCHCL = 5 ns, VIL = VSS + 0.5 V, VIH = VCC – 0.5 V; XTAL1 = N.C.;
EA = Port 0 = Port 6 = VCC ; RESET = VCC ; all other pins are disconnected;
6) ICC (active mode with slow-down mode) is measured with :
XTAL2 driven with tCLCH , tCHCL = 5 ns , VIL = VSS + 0.5 V, VIH = VCC – 0.5 V; XTAL1 = N.C.;
EA = Port 0 = Port 6 = VCC ; RESET = VCC ; all other pins are disconnected; the microcontroller is put into
slow-down mode by software; all peripheral units are not activated.
7) Overload conditions occur if the standard operating conditions are exceeded, ie. the voltage on any pin
exceeds the specified range (i.e. VOV > VCC + 0.5 V or VOV < VSS - 0.5 V). The supply voltage VCC and VSS must
remain within the specified limits. The absolute sum of input currents on all port pins may not exceed 50 mA.
8) Not 100% tested, guaranteed by design characterization
9) The typical ICC values are periodically measured at TA = +25 ˚C and VCC = 5 V but not 100% tested.
10)The maximum ICC values are measured under worst case conditions (TA = 0 ˚C or -40 ˚C and VCC = 5.5 V)
Semiconductor Group
10-3
Device Specifications
C515
30
mA
25
I CC max
I CC typ
I CC
Active Mode
Active Mode
20
15
10
5
Idle Mode
Idle Mode
Active Mode with Slow Down
0
0
4
8
12
16
20
MHz
24
fOSC
Active mode
Idle mode
: I CC typ = 0.68 x fOSC + 2.8
: I CC max = 0.85 x fOSC + 4.6
: I CC typ = 0.28 x fOSC + 2.4
: I CC max = 0.39 x fOSC + 3.4
Active mode with slow-down : I CC typ = 0.18 x fOSC + 2.0
: I CC max = 0.23 x fOSC + 3.3
f
OSC is the oscillator frequency in MHz. I CC values are given in mA.
MCD03282
ICC Diagram
Semiconductor Group
10-4
Device Specifications
C515
10.3
A/D Converter Characteristics
VCC = 5 V + 10%, – 15%; VSS = 0 V
TA = 0 to 70 °C
TA = – 40 to 85 °C
TA = – 40 to 110 °C
for the SAB-C515
for the SAF-C515
for the SAH-C515
VCC – 0.25 V £ VAREF £ VCC + 0.1 V; VSS – 0.1 V £ VAGND £ VSS + 0.2 V; VIntAREF - VIntAGND ³ 1 V;
Parameter
Symbol
Limit Values
Unit Test Condition
min.
max.
1)
Analog input voltage
VAIN
VAGND
-
VAREF
+
V
0.2
0.2
A/D converter input clock
Sample time
t IN
–
–
–
–
2 x t CLCL
40 x tIN
72 x tIN
± 1
ns
2)
tS
ns
3)
Conversion cycle time
Total unadjusted error
tADCC
ns
TUE
LSB
V
IntAREF = VAREF = VCC
IntAGND = VAGND = VSS
5) 6)
4)
V
tIN in [ns]
Internal resistance of
reference voltage source
RAREF
RASRC
CAIN
–
–
–
4 x tIN /500 kW
- 1
2) 6)
tS in [ns]
Internal resistance of
analog source
tS / 500 - 1 kW
6)
ADC input capacitance
45
pF
Notes:
1) V
may exeed V
or V
up to the absolute maximum ratings. However, the conversion result in
these cases will be 00 or FF , respectively.
AIN
AGND
AREF
H
H
2) During the sample time the input capacitance C
can be charged/discharged by the external source. The
AIN
internal resistance of the analog source must allow the capacitance to reach their final voltage level within t .
After the end of the sample time t , changes of the analog input voltage have no effect on the conversion
S
result.
S
3) This parameter includes the sample time t and the conversion time t . The values for the conversion clock
S
CO
t
is always 4 x t .
ADC
IN
4) T
is tested at V
AREF
= 5.0 V, V
AGND
= 0 V, V
= 4.9 V. It is guaranteed by design characterization for all
UE
CC
other voltages within the defined voltage range.
If an overload condition occurs on maximum 2 not selected analog input pins and the absolute sum of input
overload currents on all analog input pins does not exceed 10 mA, an additional conversion error of 1/2 LSB
is permissible.
5) During the conversion the ADC’s capacitance must be repeatedly charged or discharged. The internal
resistance of the reference source must allow the capacitance to reach their final voltage level within the
indicated time. The maximum internal resistance results from the programmed conversion timing.
6) Not 100% tested, but guaranteed by design characterization.
Semiconductor Group
10-5
Device Specifications
C515
10.4
AC Characteristics (16 MHz)
VCC = 5 V + 10%, – 15%; VSS = 0 V
TA = 0 to 70 °C
TA = – 40 to 85 °C
TA = – 40 to 110 °C
for the SAB-C515
for the SAF-C515
for the SAH-C515
(CL for port 0, ALE and PSEN outputs = 100 pF; CL for all other outputs = 80 pF)
Program Memory Characteristics
Parameter
Symbol
Limit Values
Variable Clock
1/tCLCL = 1 MHz to 16 MHz
Unit
16 MHz
Clock
min. max. min.
max.
ALE pulse width
tLHLL
tAVLL
tLLAX
tLLIV
85
33
28
–
–
2tCLCL – 40
–
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Address setup to ALE
Address hold after ALE
ALE low to valid instruction in
ALE to PSEN
–
t
CLCL – 30
CLCL – 35
–
–
t
–
150
–
–
4tCLCL – 100
tLLPL
tPLPH
tPLIV
38
153
–
tCLCL – 25
–
PSEN pulse width
–
3tCLCL – 35
–
PSEN to valid instruction in
88
–
–
0
–
3tCLCL – 100
Input instruction hold after PSEN tPXIX
0
–
*)
Input instruction float after PSEN tPXIZ
–
43
–
tCLCL – 20
*)
Address valid after PSEN
Address to valid instruction in
Address float to PSEN
tPXAV
tAVIV
tAZPL
55
–
tCLCL – 8
–
198
–
–
0
5tCLCL – 115
0
–
*)
Interfacing the C515 to devices with float times up to 55 ns is permissible. This limited bus contention will not
cause any damage to port 0 drivers.
CLKOUT Timing
Parameter
Symbol
Limit Values
Variable Clock
1/tCLCL = 3.5 MHz to 16 MHz
Unit
16 MHz
Clock
min. max. min.
max.
ALE to CLKOUT
tLLSH
tSHSL
tSLSH
tSLLH
398
85
–
7 tCLCL – 40
2 tCLCL – 40
10 tCLCL – 40
–
–
–
ns
ns
ns
ns
CLKOUT high time
CLKOUT low time
CLKOUT low to ALE high
–
585
23
–
103
tCLCL – 40
tCLCL + 40
Semiconductor Group
10-6
Device Specifications
C515
AC Characteristics (16 MHz) (cont’d)
External Data Memory Characteristics
Parameter
Symbol
Limit Values
Unit
16 MHz
Clock
Variable Clock
1/tCLCL = 1 MHz to 16 MHz
min. max. min.
max.
RD pulse width
tRLRH
tWLWH
tLLAX2
tRLDV
tRHDX
tRHDZ
tLLDV
275
275
90
–
–
6tCLCL – 100
–
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
WR pulse width
–
6tCLCL – 100
–
Address hold after ALE
RD to valid data in
–
2tCLCL – 35
–
148
–
–
5tCLCL – 165
–
Data hold after RD
0
0
Data float after RD
–
55
350
398
238
–
–
2tCLCL – 70
8tCLCL – 150
9tCLCL – 165
3tCLCL + 50
–
ALE to valid data in
Address to valid data in
ALE to WR or RD
–
–
tAVDV
tLLWL
tAVWL
tWHLH
tQVWX
tQVWH
tWHQX
tRLAZ
–
–
138
120
23
13
288
13
–
3tCLCL – 50
4tCLCL – 130
Address valid to WR or RD
WR or RD high to ALE high
Data valid to WR transition
Data setup before WR
Data hold after WR
Address float after RD
103
–
t
CLCL – 40
CLCL – 50
tCLCL + 40
t
–
–
–
0
–
7tCLCL – 150
CLCL – 50
–
t
0
–
External Clock Drive Characteristics
Parameter
Symbol
Limit Values
Variable Clock
Unit
Freq. = 1 MHz to 16 MHz
min.
62.5
20
20
–
max.
Oscillator period
High time
tCLCL
tCHCX
tCLCX
tCLCH
tCHCL
1000
ns
ns
ns
ns
ns
t
CLCL – tCLCX
CLCL – tCHCX
Low time
t
Rise time
20
20
Fall time
–
Semiconductor Group
10-7
Device Specifications
C515
10.5
AC Characteristics (24 MHz)
VCC = 5 V + 10%, – 15%; VSS = 0 V
TA = 0 to 70 °C
TA = – 40 to 85 °C
TA = – 40 to 110 °C
for the SAB-C515
for the SAF-C515
for the SAH-C515
(CL for port 0, ALE and PSEN outputs = 100 pF; CL for all other outputs = 80 pF)
Program Memory Characteristics
Parameter
Symbol
Limit Values
Variable Clock
1/tCLCL = 1 MHz to 24 MHz
Unit
24 MHz
Clock
min. max. min.
max.
ALE pulse width
tLHLL
tAVLL
tLLAX
tLLIV
43
17
17
–
–
2tCLCL – 40
–
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Address setup to ALE
Address hold after ALE
ALE low to valid instruction in
ALE to PSEN
–
t
CLCL – 25
CLCL – 25
–
–
t
–
80
–
–
4tCLCL – 87
tLLPL
tPLPH
tPLIV
22
95
–
tCLCL – 20
–
PSEN pulse width
–
3tCLCL – 30
–
PSEN to valid instruction in
60
–
–
0
–
3tCLCL – 65
Input instruction hold after PSEN tPXIX
0
–
*)
Input instruction float after PSEN tPXIZ
–
32
–
tCLCL – 10
*)
Address valid after PSEN
Address to valid instruction in
Address float to PSEN
tPXAV
tAVIV
tAZPL
37
–
tCLCL – 5
–
148
–
–
0
5tCLCL – 60
0
–
*) Interfacing the C501 to devices with float times up to 37 ns is permissible. This limited bus contention will not
cause any damage to port 0 Drivers.
CLKOUT Timing
Parameter
Symbol
Limit Values
Variable Clock
1/tCLCL = 3.5 MHz to 24 MHz
Unit
24 MHz
Clock
min. max. min.
max.
ALE to CLKOUT
tLLSH
tSHSL
tSLSH
tSLLH
252
43
–
7 tCLCL – 40
2 tCLCL – 40
10 tCLCL – 40
–
–
–
ns
ns
ns
ns
CLKOUT high time
CLKOUT low time
CLKOUT low to ALE high
–
377
2
–
82
tCLCL – 40
tCLCL + 40
Semiconductor Group
10-8
Device Specifications
C515
AC Characteristics (24 MHz) (cont’d)
External Data Memory Characteristics
Parameter
Symbol
Limit Values
Unit
24 MHz
Clock
Variable Clock
1/tCLCL = 1 MHz to 24 MHz
min. max. min.
max.
RD pulse width
tRLRH
tWLWH
tLLAX2
tRLDV
tRHDX
tRHDZ
tLLDV
180
180
48
–
–
6tCLCL – 70
–
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
WR pulse width
–
6tCLCL – 70
–
Address hold after ALE
RD to valid data in
–
2tCLCL – 35
–
118
–
–
5tCLCL – 90
–
Data hold after RD
0
0
Data float after RD
–
63
200
220
175
–
–
2tCLCL – 20
8tCLCL – 133
9tCLCL – 155
3tCLCL + 50
–
ALE to valid data in
Address to valid data in
ALE to WR or RD
–
–
tAVDV
tLLWL
tAVWL
tWHLH
tQVWX
tQVWH
tWHQX
tRLAZ
–
–
75
67
17
5
3tCLCL – 50
4tCLCL – 97
Address valid to WR or RD
WR or RD high to ALE high
Data valid to WR transition
Data setup before WR
Data hold after WR
Address float after RD
67
–
t
CLCL – 25
CLCL – 37
tCLCL + 25
t
–
–
–
0
170
15
–
–
7tCLCL – 122
CLCL – 27
–
t
0
–
External Clock Drive Characteristics
Parameter
Symbol
Limit Values
Variable Clock
Unit
Freq. = 1 MHz to 24 MHz
min.
41.7
12
12
–
max.
Oscillator period
High time
tCLCL
tCHCX
tCLCX
tCLCH
tCHCL
1000
ns
ns
ns
ns
ns
t
CLCL – tCLCX
CLCL – tCHCX
Low time
t
Rise time
12
12
Fall time
–
Semiconductor Group
10-9
Device Specifications
C515
t LHLL
ALE
tAVLL
t PLPH
t LLPL
t LLIV
t PLIV
PSEN
t AZPL
t LLAX
t PXAV
t PXIZ
t PXIX
Port 0
A0 - A7
Instr.IN
A0 - A7
t AVIV
Port 2
A8 - A15
A8 - A15
MCT00096
Program Memory Read Cycle
Semiconductor Group
10-10
Device Specifications
C515
tWHLH
ALE
PSEN
RD
t LLDV
t LLWL
t RLRH
t RLDV
t AVLL
tRHDZ
t LLAX2
t RLAZ
tRHDX
A0 - A7 from
Ri or DPL
A0 - A7
from PCL
Instr.
IN
Port 0
Data IN
tAVWL
t AVDV
Port 2
P2.0 - P2.7 or A8 - A15 from DPH
A8 - A15 from PCH
MCT00097
Data Memory Read Cycle
Semiconductor Group
10-11
Device Specifications
C515
tWHLH
ALE
PSEN
WR
t LLWL
t WLWH
tQVWX
t AVLL
tWHQX
t LLAX2
tQVWH
A0 - A7 from
Ri or DPL
A0 - A7
Instr.IN
Port 0
Port 2
Data OUT
from PCL
tAVWL
P2.0 - P2.7 or A8 - A15 from DPH
A8 - A15 from PCH
MCT00098
Data Memory Write Cycle
Semiconductor Group
10-12
Device Specifications
C515
t SLLH
ALE
t LLSH
t SHSL
t LLSH
CLK OUT
t SLSH
PSEN
RD,WR
Program Memory Access
Data Memory Access
MCT00083
CLKOUT Timing
tCLCL
V
CC- 0.5V
0.45V
0.7 VCC
0.2 VCC- 0.1
tCLCX
tCHCX
MCT00033
tCHCL
tCLCH
External Clock Drive on XTAL2
Semiconductor Group
10-13
Device Specifications
C515
10.6
ROM Verification Characteristics for the C515-1R
ROM Verification Mode 1
Parameter
Symbol
Limit Values
Unit
min.
max.
tAVQV
Address to valid data
–
10 tCLCL
ns
P1.0 - P1.7
P2.0 - P2.4
Address
New Address
New Data Out
tAVQV
Port 0
Data OUT
Address : P1.0 - P1.7 = A0 - A7
Inputs : PSEN =VSS
ALE, EA =VIH
P2.0 - P2.4 = A8 - A12
Data :
P0.0 - P0.7 = D0 - D7
RESET =VIL2
MCT03212
ROM Verification Mode 1
Semiconductor Group
10-14
Device Specifications
C515
ROM Verification Mode 2
Parameter
Symbol
Limit Values
Unit
min.
typ
2 tCLCL
12 tCLCL
–
max.
tAWD
tACY
ALE pulse width
–
–
ns
ALE period
–
–
ns
tDVA
Data valid after ALE
Data stable after ALE
P3.5 setup to ALE low
Oscillator frequency
–
4 tCLCL
ns
tDSA
8 tCLCL
–
–
ns
tAS
–
1
tCLCL
–
ns
1/ tCLCL
–
24
MHz
t ACY
t AWD
ALE
t DSA
t DVA
Port 0
P3.5
Data Valid
t AS
MCT02613
ROM Verification Mode 2
Semiconductor Group
10-15
Device Specifications
C515
VCC -0.5 V
0.2 VCC+0.9
0.2 VCC -0.1
Test Points
0.45 V
MCT00039
AC Inputs during testing are driven at VCC - 0.5 V for a logic ’1’ and 0.45 V for a logic ’0’.
Timing measurements are made at VIHmin for a logic ’1’ and VILmax for a logic ’0’.
AC Testing: Input, Output Waveforms
-0.1 V
VOH
V
Load +0.1 V
Timing Reference
Points
VLoad
-0.1 V
VLoad
VOL +0.1 V
MCT00038
For timing purposes a port pin is no longer floating when a 100 mV change from load voltage
occurs and begins to float when a 100 mV change from the loaded VOH/VOL level occurs.
IOL/IOH ³ ± 20 mA
AC Testing: Float Waveforms
Crystal Oscillator Mode
Driving from External Source
C
N.C.
XTAL1
XTAL2
XTAL1
XTAL2
1-24 MHz
C
External Oscillator
Signal
Crystal Mode : C = 20 pF±10 pF (incl. stray capacitance)
MCS03204
Recommended Oscillator Circuits for Crystal Oscillator
Semiconductor Group
10-16
Device Specifications
C515
10.7
Package Information (P-LCC-68)
Plastic Package, P-LCC-68 (SMD)
(Plastic Lead Chip-Carrier)
1.2 x 45˚
1.27
0.81 max
23.3 ±0.3
24.21 ±0.071)
25.28 -0.26
0.38
M
A-B D 34x
0.43 ±0.1
0.18
M
D 68x
0.1
A-B
20.32
D
A
B
Index Marking
68
1
0.5 x 45˚
3 x
1.1 x 45˚
24.21 ±0.071)
25.28 -0.26
GPL05099
1) Does not include plastic or metal protrusions of 0.15 max per side
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”
Dimensions in mm
SMD = Surface Mounted Device
Semiconductor Group
10-17
Device Specifications
C515
10.8
Package Information (P-MQFP-80)
Plastic Package, P-MQFP-80-1 (SMD)
(Plastic Metric Quad Flat Package)
H
0.65
±0.08
0.88
80x
0.3
C
0.1
12.35
17.2
14 1)
M
0.12
A-B D C
0.2 A-B D 80x
0.2 A-B D 4x
H
D
B
A
80
1
Index Marking
0.6x45˚
1) Does not include plastic or metal protrusions of 0.25 max per side
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”
Dimensions in mm
SMD = Surface Mounted Device
Semiconductor Group
10-18
Index
C515
11
Index
COCAH0 . . . . . . . . . . . . . . . . . . . . 3-7, 6-28
COCAH1 . . . . . . . . . . . . . . . . . . . . 3-7, 6-28
COCAH2 . . . . . . . . . . . . . . . . . . . . 3-7, 6-28
COCAH3 . . . . . . . . . . . . . . . . . . . . 3-7, 6-28
COCAL0 . . . . . . . . . . . . . . . . . . . . 3-7, 6-28
COCAL1 . . . . . . . . . . . . . . . . . . . . 3-7, 6-28
COCAL2 . . . . . . . . . . . . . . . . . . . . 3-7, 6-28
COCAL3 . . . . . . . . . . . . . . . . . . . . 3-7, 6-28
CPU
Accumulator . . . . . . . . . . . . . . . . . . . .2-2
B register . . . . . . . . . . . . . . . . . . . . . . .2-3
Basic timing . . . . . . . . . . . . . . . . . . . . .2-4
Fetch/execute diagram . . . . . . . . . . . .2-5
Functionality . . . . . . . . . . . . . . . . . . . .2-2
Program status word . . . . . . . . . . . . . .2-2
Stack pointer . . . . . . . . . . . . . . . . . . . .2-3
CPU timing . . . . . . . . . . . . . . . . . . . . . . .2-5
CRCH . . . . . . . . . . . . . . . . . . 3-4, 3-7, 6-26
CRCL . . . . . . . . . . . . . . . . . . 3-4, 3-7, 6-26
CY . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3, 3-7
A
A/D converter . . . . . . . . . . . . . . .6-57–6-68
Conversion timing . . . . . . . . . .6-66–6-68
General operation . . . . . . . . . . . . . . 6-57
Programmable reference voltages . 6-62–
6-65
Registers . . . . . . . . . . . . . . . . .6-59–6-61
A/D converter characteristics . . . . . . . 10-5
Absolute maximum ratings . . . . . . . . . 10-1
AC . . . . . . . . . . . . . . . . . . . . . . . . . .2-3, 3-7
AC characteristics . . . . . . . . . . .10-6–10-16
16 MHz timing . . . . . . . . . . . . .10-6–10-7
24 MHz timing . . . . . . . . . . . . .10-8–10-9
CLKOUT timing . . . . . . . . . . . . . . . 10-13
Data memory read cycle . . . . . . . . 10-11
Data memory write cycle . . . . . . . . 10-12
External clock timing . . . . . . . . . . . 10-13
Program memory read cycle . . . . . 10-10
ROM verification mode 1 . . . . . . . . 10-14
ROM verification mode 2 . . . . . . . . 10-15
AC Testing
Float waveforms . . . . . . . . . . . . . . 10-16
Input/output waveforms . . . . . . . . . 10-16
ACC . . . . . . . . . . . . . . . . . . . . . . . . .3-4, 3-7
ADCON . . . . . 3-4, 3-5, 3-7, 5-6, 6-44, 6-59
ADDAT . . . . . . . . . . . . . . . . . 3-4, 3-7, 6-60
ADM . . . . . . . . . . . . . . . . . . . . . . .3-7, 6-59
ALE signal . . . . . . . . . . . . . . . . . . . . . . . 4-4
D
E
DAPR . . . . . . . . . . . . . . . . . . 3-4, 3-7, 6-62
DC characteristics . . . . . . . . . . . . 10-2–10-4
Device characteristics . . . . . . . . 10-1–10-18
DPH . . . . . . . . . . . . . . . . . . . . . . . . 3-4, 3-6
DPL . . . . . . . . . . . . . . . . . . . . . . . . . 3-4, 3-6
EADC . . . . . . . . . . . . . . . . . . 3-6, 6-61, 7-5
EAL . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 7-4
EALE . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-4
Emulation concept . . . . . . . . . . . . . . . . .4-5
ES . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 7-4
ET0 . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 7-4
ET1 . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 7-4
ET2 . . . . . . . . . . . . . . . . . . . . 3-6, 6-27, 7-4
EX0 . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 7-4
EX1 . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 7-4
EX2 . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 7-5
EX3 . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 7-5
EX4 . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 7-5
EX5 . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 7-5
EX6 . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 7-5
Execution of instructions . . . . . . . . . . . . .2-4
EXEN2 . . . . . . . . . . . . . . . . . 3-6, 6-27, 7-5
EXF2 . . . . . . . . . . . . . . . . . . . 3-7, 6-27, 7-8
External bus interface . . . . . . . . . . . 4-1–4-4
ALE signal . . . . . . . . . . . . . . . . . . . . . .4-4
B
C
B . . . . . . . . . . . . . . . . . . . . . . . . . . .3-4, 3-7
Basic CPU timing . . . . . . . . . . . . . . . . . 2-4
BD . . . . . . . . . . . . . . . . . . . . . . . . .3-7, 6-44
Block diagram . . . . . . . . . . . . . . . . . . . . 2-1
BSY . . . . . . . . . . . . . . . . . . . . . . . .3-7, 6-59
C/T . . . . . . . . . . . . . . . . . . . . . . . . .3-6, 6-17
CCEN . . . . . . . . . . . . . . . . . . 3-4, 3-7, 6-28
CCH1 . . . . . . . . . . . . . . . . . . . 3-4, 3-7, 6-31
CCH2 . . . . . . . . . . . . . . . . . . . 3-4, 3-7, 6-31
CCH3 . . . . . . . . . . . . . . . . . . . 3-4, 3-7, 6-31
CCL1 . . . . . . . . . . . . . . . . . . . . . . .3-4, 6-31
CCL2 . . . . . . . . . . . . . . . . . . . 3-4, 3-7, 6-31
CCL3 . . . . . . . . . . . . . . . . . . . 3-4, 3-7, 6-31
CLK . . . . . . . . . . . . . . . . . . . . . . . . .3-7, 5-6
CLKOUT . . . . . . . . . . . . . . . . . . . . .3-6, 5-6
Semiconductor Group
11-1
Index
C515
Overlapping of data/program memory 4-3
Program memory access . . . . . . . . . . 4-3
Program/data memory timing . . . . . . 4-2
PSEN signal . . . . . . . . . . . . . . . . . . . . 4-3
Role of P0 and P2 . . . . . . . . . . . . . . . 4-1
External interrupts . . . . . . . . . . . . . . .7-15
Handling procedure . . . . . . . . . . . . . .7-13
Priority registers . . . . . . . . . . . . . . . .7-11
Priority within level structure . . . . . . .7-12
Request flags . . . . . . . . . . . . . . 7-6–7-10
Response time . . . . . . . . . . . . . . . . .7-17
Sources and vector addresses . . . . .7-14
IP0 . . . . . . . . . . . . . . . . . 3-5, 3-6, 7-11, 8-4
IP1 . . . . . . . . . . . . . . . . . . . . 3-4, 3-6, 7-11
IRCON . . . . . . . . . 3-4, 3-7, 6-27, 6-61, 7-8
IT0 . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 7-6
IT1 . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 7-6
F
F0 . . . . . . . . . . . . . . . . . . . . . . . . . .2-3, 3-7
F1 . . . . . . . . . . . . . . . . . . . . . . . . . .2-3, 3-7
Fail save mechanisms . . . . . . . . . . .8-1–8-4
Features . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Functional units . . . . . . . . . . . . . . . . . . . 1-1
Fundamental structure . . . . . . . . . . . . . 2-1
L
G
Logic symbol . . . . . . . . . . . . . . . . . . . . . .1-3
GATE . . . . . . . . . . . . . . . . . . . . . . .3-6, 6-17
GF0 . . . . . . . . . . . . . . . . . . . . . . . . .3-6, 9-2
GF1 . . . . . . . . . . . . . . . . . . . . . . . . .3-6, 9-2
M
M0 . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 6-17
M1 . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 6-17
Memory organization . . . . . . . . . . . 3-1–3-2
Data memory . . . . . . . . . . . . . . . . . . . .3-2
General purpose registers . . . . . . . . . .3-2
Memory map . . . . . . . . . . . . . . . . . . . .3-1
Program memory . . . . . . . . . . . . . . . .3-2
MX0 . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-7
MX1 . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-7
MX2 . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-7
MX2-0 . . . . . . . . . . . . . . . . . . . . . . . . . .6-59
H
I
Hardware reset . . . . . . . . . . . . . . . . . . . 5-1
I/O ports . . . . . . . . . . . . . . . . . . . . .6-1–6-13
I2FR . . . . . . . . . . . . . . . . . . . . . . . . .3-7, 7-7
I3FR . . . . . . . . . . . . . . . . . . . . 3-7, 6-25, 7-7
IADC . . . . . . . . . . . . . . . . . . . 3-7, 6-61, 7-8
IDLE . . . . . . . . . . . . . . . . . . . . . . . .3-6, 9-2
Idle mode . . . . . . . . . . . . . . . . . . . . .9-3–9-4
IDLS . . . . . . . . . . . . . . . . . . . . . . . .3-6, 9-2
IE0 . . . . . . . . . . . . . . . . . . . . . . . . . .3-6, 7-6
IE1 . . . . . . . . . . . . . . . . . . . . . . . . . .3-6, 7-6
IEN0 . . . . . . . . 3-4, 3-5, 3-6, 6-27, 7-4, 8-4
IEN1 . . . .3-4, 3-5, 3-6, 6-27, 6-61, 7-5, 8-4
IEX2 . . . . . . . . . . . . . . . . . . . . . . . . .3-7, 7-8
IEX3 . . . . . . . . . . . . . . . . . . . . . . . . .3-7, 7-8
IEX4 . . . . . . . . . . . . . . . . . . . . . . . . .3-7, 7-8
IEX5 . . . . . . . . . . . . . . . . . . . . . . . . .3-7, 7-8
IEX6 . . . . . . . . . . . . . . . . . . . . . 3-7, 7-8, 7-8
INT0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
INT1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
INT2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
INT3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
INT4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
INT5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
INT6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
Interrupt system . . . . . . . . . . . . . . .7-1–7-17
Interrupts
O
P
Oscillator operation . . . . . . . . . . . . . 5-4–5-5
External clock source . . . . . . . . . . . . .5-5
On-chip oscillator circuitry . . . . . . . . . .5-5
Recommended oscillator circuit . . . . .5-4
OV . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3, 3-7
P . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3, 3-7
P0 . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4, 3-6
P1 . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5, 3-6
P2 . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5, 3-6
P3 . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5, 3-6
P4 . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5, 3-7
P5 . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5, 3-7
P6 . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5, 3-7
Package information (P-LCC-68) . . . .10-17
Package information (P-MQFP-80) . .10-18
Parallel I/O . . . . . . . . . . . . . . . . . . 6-1–6-13
PCON . . . . . . . . . . . . . . . 3-5, 3-6, 6-44, 9-2
PDE . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 9-2
Block diagram . . . . . . . . . . . . . . .7-2–7-3
Enable registers . . . . . . . . . . . . . .7-4–7-5
Semiconductor Group
11-2
Index
C515
PDS . . . . . . . . . . . . . . . . . . . . . . . . .3-6, 9-2
Pin configuration . . . . . . . . . . . . . . . . . . 1-4
P-MQFP-80 package . . . . . . . . . .1-4, 1-5
Pin definitions and functions . . . . .1-6–1-10
Ports . . . . . . . . . . . . . . . . . . . . . . .6-1–6-13
Alternate functions . . . . . . . . . . . . . . . 6-2
Loading and interfacing . . . . . . . . . . 6-12
Output driver circuitry . . . . . . . . .6-9–6-10
Output/input sample timing . . . . . . . 6-11
Read-modify-write operation . . . . . . 6-13
Types and structures . . . . . . . . . . . . . 6-1
Port 0 circuitry . . . . . . . . . . . . . . . . 6-5
Port 1/3/4/5 circuitry . . . . . . . . . . . . 6-6
Port 2 circuitry . . . . . . . . . . . . . . . . 6-7
Standard I/O port circuitry . . . .6-3–6-4
Power down mode . . . . . . . . . . . . . . . . . 9-6
Entry procedure . . . . . . . . . . . . . . . . . 9-6
Exit procedure . . . . . . . . . . . . . . . . . . 9-6
Power saving modes . . . . . . . . . . . .9-1–9-7
Control register . . . . . . . . . . . . . . . . . 9-2
Hardware enable . . . . . . . . . . . . . . . . 9-1
Idle mode . . . . . . . . . . . . . . . . . . .9-3–9-4
Power down mode . . . . . . . . . . . . . . . 9-6
Slow down mode . . . . . . . . . . . . . . . . 9-5
State of pins . . . . . . . . . . . . . . . . . . . . 9-7
Power supply current . . . . . . . . . .10-3–10-4
PSEN signal . . . . . . . . . . . . . . . . . . . . . 4-3
PSW . . . . . . . . . . . . . . . . . . . . 2-3, 3-4, 3-7
S
SBUF . . . . . . . . . . . . . . . . . . 3-5, 3-6, 6-43
SCON . . . . . . . . . . 3-4, 3-5, 3-6, 6-43, 7-10
SD . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 9-2
Serial interface (USART) . . . . . . 6-41–6-56
Baudrate generation . . . . . . . . . . . . .6-44
with internal baud rate generator . .6-46
with timer 1 . . . . . . . . . . . . . . . . . .6-46
Multiprocessor communication . . . . .6-42
Operating mode 0 . . . . . . . . . . 6-48–6-50
Operating mode 1 . . . . . . . . . . 6-51–6-53
Operating mode 2 and 3 . . . . . 6-54–6-56
Registers . . . . . . . . . . . . . . . . . 6-42–6-43
Slow down mode . . . . . . . . . . . . . . . . . .9-5
SM0 . . . . . . . . . . . . . . . . . . . . . . . 3-6, 6-43
SM1 . . . . . . . . . . . . . . . . . . 3-6, 6-43, 6-43
SM2 . . . . . . . . . . . . . . . . . . . . . . . 3-6, 6-43
SMOD . . . . . . . . . . . . . . . . . . . . . . 3-6, 6-44
SP . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4, 3-6
Special Function Registers . . . . . . . . . . .3-3
Table - address ordered . . . . . . . 3-6–3-7
Table - functional order . . . . . . . . 3-4–3-5
SWDT . . . . . . . . . . . . . . . . . . . . . . . 3-6, 8-4
SYSCON . . . . . . . . . . . . . . . . . 3-4, 3-6, 4-4
System clock output . . . . . . . . . . . . 5-6–5-7
T
T0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-6
T1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-6
T2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-6
T2CM . . . . . . . . . . . . . . . . . . . . . . 3-7, 6-25
T2CON . . . . . . . . . . 3-4, 3-5, 3-7, 6-25, 7-7
T2EX . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-6
T2I0 . . . . . . . . . . . . . . . . . . . . . . . . 3-7, 6-25
T2I1 . . . . . . . . . . . . . . . . . . . . . . . . 3-7, 6-25
T2PS . . . . . . . . . . . . . . . . . . . . . . . 3-7, 6-25
T2R0 . . . . . . . . . . . . . . . . . . . . . . . 3-7, 6-25
T2R1 . . . . . . . . . . . . . . . . . . . . . . . 3-7, 6-25
TB8 . . . . . . . . . . . . . . . . . . . . . . . . 3-6, 6-43
TCON . . . . . . . . . . . . . . . 3-4, 3-6, 6-16, 7-6
TF0 . . . . . . . . . . . . . . . . . . . . 3-6, 6-16, 7-6
TF1 . . . . . . . . . . . . . . . . . . . . 3-6, 6-16, 7-6
TF2 . . . . . . . . . . . . . . . . . . . . 3-7, 6-27, 7-8
TH0 . . . . . . . . . . . . . . . . . . . . 3-4, 3-6, 6-15
TH1 . . . . . . . . . . . . . . . . . . . . 3-4, 3-6, 6-15
TH2 . . . . . . . . . . . . . . . . . . . . 3-4, 3-7, 6-26
TI . . . . . . . . . . . . . . . . . . . . . 3-6, 6-43, 7-10
Timer/counter . . . . . . . . . . . . . . . 6-14–6-40
R
RB8 . . . . . . . . . . . . . . . . . . . . . . . .3-6, 6-43
RD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
Recommended oscillator circuits . . . . 10-16
REN . . . . . . . . . . . . . . . . . . . . . . . .3-6, 6-43
Reset . . . . . . . . . . . . . . . . . . . . . . . .5-1–5-3
Hardware reset timing . . . . . . . . . . . . 5-3
Reset circuitries . . . . . . . . . . . . . . . . . 5-2
RI . . . . . . . . . . . . . . . . . . . . . 3-6, 6-43, 7-10
ROM protection . . . . . . . . . . . . . . . .4-6–4-8
Protected ROM mode . . . . . . . . . . . . 4-7
Protected ROM verification example . 4-8
Protected ROM verify timing . . . . . . . 4-7
Unprotected ROM mode . . . . . . . . . . 4-6
Unprotected ROM verify timing . . . . . 4-6
RS0 . . . . . . . . . . . . . . . . . . . . . . . . .2-3, 3-7
RS1 . . . . . . . . . . . . . . . . . . . . . . . . .2-3, 3-7
RxD . . . . . . . . . . . . . . . . . . . . . . . .3-6, 6-41
Semiconductor Group
11-3
Index
C515
Timer/counter 0 and 1 . . . . . . .6-14–6-21
Mode 0, 13-bit timer/counter . . . . 6-18
Mode 1, 16-bit timer/counter . . . . 6-19
Mode 2, 8-bit rel. timer/counter . . 6-20
Mode 3, two 8-bit timer/counter . . 6-21
Registers . . . . . . . . . . . . . . .6-15–6-17
Timer/counter 2 . . . . . . . . . . . .6-22–6-40
Alternate port functions . . . . . . . . 6-22
Block diagram . . . . . . . . . . . . . . . 6-23
Capture function . . . . . . . . . .6-39–6-40
Compare function . . . . . . . . .6-31–6-36
Compare mode 0 . . . . . . . . .6-31–6-34
Compare mode 1 . . . . . . . . .6-35–6-36
Compare mode interrupts . . . . . . 6-37
General operation . . . . . . . . . . . . 6-29
Registers . . . . . . . . . . . . . . .6-24–6-28
Reload mode . . . . . . . . . . . . . . . . 6-30
Timings
CLKOUT timing . . . . . . . . . . . . . . . 10-13
Data memory read cycle . . . . . . . . 10-11
Data memory write cycle . . . . . . . . 10-12
External clock timing . . . . . . . . . . . 10-13
Program memory read cycle . . . . . 10-10
ROM verification mode 1 . . . . . . . . 10-14
ROM verification mode 2 . . . . . . . . 10-15
TL0 . . . . . . . . . . . . . . . . . . . . 3-4, 3-6, 6-15
TL1 . . . . . . . . . . . . . . . . . . . . 3-4, 3-6, 6-15
TL2 . . . . . . . . . . . . . . . . . . . . 3-5, 3-7, 6-26
TMOD . . . . . . . . . . . . . . . . . . 3-4, 3-6, 6-17
TR0 . . . . . . . . . . . . . . . . . . . . . . . .3-6, 6-16
TR1 . . . . . . . . . . . . . . . . . . . . . . . .3-6, 6-16
TxD . . . . . . . . . . . . . . . . . . . . . . . .3-6, 6-41
W
Watchdog timer . . . . . . . . . . . . . . . .8-1–8-4
Block diagram . . . . . . . . . . . . . . . . . . 8-3
Control and status flags . . . . . . . . . . . 8-4
General operation . . . . . . . . . . . . . . . 8-1
Refreshing of the WDT . . . . . . . . . . . 8-2
Reset operation . . . . . . . . . . . . . . . . . 8-2
Starting of the WDT . . . . . . . . . . . . . . 8-1
WDT . . . . . . . . . . . . . . . . . . . . . . . .3-6, 8-4
WDTS . . . . . . . . . . . . . . . . . . . . . . .3-6, 8-4
WR . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
Semiconductor Group
11-4
相关型号：
C5150
NPN TRIPLE DIFFUSED MESA TYPE (HORIZONTAL DEFLECTION OUTPUT FOR GIHG RESOLUTION DISPLAY, COLOR TV. HIGH SPEED SWITCHING APPLICATIONS)
TOSHIBA
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