CYAT61659-64AA48_技术文档

CYAT6165X

PSoC™ Automotive Multitouch Generation

6L Slider

Datasheet

Features

• Automotive Electronics Council (AEC) AEC-Q100 qualified

• Multitouch capacitive slider controller

- 32-bit Arm® Cortex® CPU

- Register-configurable

- Noise-suppression technologies for EMI

• Effective 20-V drive for higher signal-to-noise ratio (SNR)^[1]

• AutoArmor improves both electromagnetic emissions and immunity

- Water rejection and wet-finger tracking using DualSense

- Multitouch glove with automatic mode switching

• Ten fingers with thin glove ( 1-mm thick)

• Two fingers with thick glove ( 5-mm thick)

- Up to 3 TX configuration supported

- Large object rejection

- Supports 1 TX single layer configuration

- Automatic baseline tracking to environmental changes

- Low-power look-for-touch mode

- Field upgrades via bootloader

- Infineon Manufacturing Test Kit (MTK)

- Slider sensor self-test

- Low power CAPSENSE™ wake-up button with power consumption of 50 A

• System performance (configuration dependent)

- Up to 48 sense pins, 135 intersections (45 RX and 3TX)

- Swipe speed of up to 1000 mm/sec

- Reports up to ten fingers

- Small finger support down to 4 mm

- Support up to 10 capacitive sensing buttons

- Refresh rate up to 250 Hz; other rates configurable

- TX frequency up to 350 kHz

Note

1. Effective voltage when using 17 multi-phase TX and 5-V V_CCTXsupply.

Datasheet

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Please read the Important Notice and Warnings at the end of this document

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Features

• Power (configuration-dependent)

- 1.71-V to 1.95-V and 3.0-V to 5.5-V logic and digital I/Os supply

- 3.0-V to 5.5-V analog supply

- 9-mW average power

- 11-µW typical deep-sleep power

• Sensor and system design (configuration-dependent)

- Supports a variety of slider sensors and stackups

• Manhattan, diamond

• Plastic (PET) and glass-sensor substrates

• Metal mesh

• Communication interface

- I²C slave at 100 and 400 kbps

- SPI slave bit rates up to 8 Mbps

• Package

- 56-pin QFN wettable flank, 8 × 8 × 1 mm, 0.5-mm pin-pitch

- 64-pin TQFP 10 × 10 × 1.4 mm, 0.5-mm pin-pitch

• Ambient temperature range

- Automotive-A: –40°C to 85°C

- Automotive-S: –40°C to 105°C

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Table of contents

Features ...........................................................................................................................................1

Table of contents...............................................................................................................................3

1 Slider system overview ...................................................................................................................4

2 CYAT6165X overview.......................................................................................................................5

3 Features overview ..........................................................................................................................6

3.1 AutoArmor...............................................................................................................................................................6

3.2 Water rejection........................................................................................................................................................6

3.3 Wet-finger tracking .................................................................................................................................................6

3.4 Glove........................................................................................................................................................................6

3.5 Automatic mode switching ....................................................................................................................................6

3.6 Large finger tracking...............................................................................................................................................6

3.7 Large object detection and rejection.....................................................................................................................6

3.8 Look-for-Touch .......................................................................................................................................................6

4 Slider system specifications.............................................................................................................7

4.1 System performance specifications ......................................................................................................................7

5 System design options ....................................................................................................................9

5.1 CAPSENSE™ button/FPC support...........................................................................................................................9

5.2 Sensors ....................................................................................................................................................................9

6 Power supply information .............................................................................................................11

6.1 Required external components............................................................................................................................11

6.2 Voltage coefficient ................................................................................................................................................12

7 Power states summary..................................................................................................................15

8 Pin information ............................................................................................................................16

9 Electrical Specifications ................................................................................................................22

9.1 Absolute maximum ratings ..................................................................................................................................22

9.2 Operating temperature ........................................................................................................................................22

9.3 DC specifications...................................................................................................................................................23

9.3.1 Flash specifications............................................................................................................................................23

9.3.2 Chip-level DC specifications ..............................................................................................................................24

9.3.3 I/O port 0 (P0[0:1]) DC specifications ................................................................................................................25

9.3.4 I/O port 1 (P1[0:3]) and XRES DC specifications ...............................................................................................26

9.4 AC specifications...................................................................................................................................................27

9.4.1 SWD interface AC specifications........................................................................................................................27

9.4.2 Chip-level AC specifications ..............................................................................................................................28

9.4.3 I2C specifications ...............................................................................................................................................29

9.4.4 SPI specifications...............................................................................................................................................31

10 Packaging information ................................................................................................................32

10.1 Thermal impedance and moisture sensitivity...................................................................................................33

10.2 Solder reflow specifications ...............................................................................................................................33

11 Ordering information ..................................................................................................................34

11.1 Ordering code definitions...................................................................................................................................34

12 Acronyms ...................................................................................................................................35

13 Reference documents..................................................................................................................36

14 Document conventions................................................................................................................37

14.1 Units of measure .................................................................................................................................................37

14.2 Port nomenclature..............................................................................................................................................37

15 Glossary .....................................................................................................................................38

Revision history ..............................................................................................................................39

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Slider system overview

1

Slider system overview

3.0-4.7 V

1.8 V

1.0 

4.7 µF

0.1 µF

1.0 µF

0.1 µF

1.0 µF

0.1 µF

1.0 µF

VDDA

VDDA_Q

VCCD VDDD

I²C/SPI

Slider Sensor

TX

Host Reset

Sense

Host

Processor

WAKE

Touch

Controller

Interrupt

RX

Sense

Pins

VSS

VCCTX

0.22 µF

Figure 1

CYAT6165X typical system diagram

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CYAT6165X overview

2

CYAT6165X overview

A capacitive slider detects changes in capacitance to determine the location of one or more fingers on the surface

of the slider. A typical slider system consists of a capacitive slider sensor, an FPC bonded to the sensor, and the

slider controller mounted on the FPC. The FPC connects the slider controller to the host processor. Users can

interact with the user interface through finger movements and gestures on the surface of the slider.

CYAT6165X is a capacitive slider controller with the sensing and processing technology to resolve the locations

and report the positions of up to ten fingers on the slider. The slider controller converts an array of sensor

capacitances into an array of digital values, which are processed by touch-detection and position-resolution

algorithms in the controller. These algorithms determine the location and signal magnitude of each finger on the

slider.

Infineon provides:

• Application firmware

• Design guidance for the sensor and FPC

• Slider sensor MTK

The CYAT6165X functional block diagram is shown in Figure 2. This device contains a high-performance Arm®

32-bit CPU with an integrated hardware multiply unit. This CPU controls all sensing and processing of measured

capacitance results to allow tracking and reporting touches. The controller is optimized for low power and fast

response time, with built-in support for manufacturing test. The slider controller communicates with a host

through an I²C slave interface at up to 400 kbps or an SPI interface at up to 8 Mbps.

CYAT6165X collects the slider sensor information using the touch subsystem. This touch subsystem consists of a

5-V TX pump, TX drivers, RX channels, and a programmable transmit/receive (TX/RX) multiplexer. The multiplexer

electrically connects the analog front end of each RX channel and TX driver to the appropriate row and column

electrodes of the slider sensor.

The controller TX/RX multiplexer allows flexibility of chip placement on the FPC. All pins connecting to the slider

sensor are programmable as either TX or RX.

Infineon reference documents are available under NDA through your local Infineon sales representative. You can

also direct your requests to automotive@infineon.com.

5 V TX pump

Digital sequencer

Channel Engine

RX Channel

0

1

ADC

Arm® Cortex®

48-MHz CPU

Communication

I²C/ SPI

DSP

ADC

RX Channel 15

RX Channel 16

SRAM

ROM

FLASH

Figure 2

CYAT6165X functional block diagram

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Features overview

3

Features overview

3.1

AutoArmor

AutoArmor improves both electromagnetic emissions and immunity. It ensures no false finger touches when

CYAT6165X is exposed to electromagnetic waves.

3.2

Water rejection

Water droplets can cause false touches to be reported. However, CYAT6165X continues to operate in the presence

of water droplets or condensation. CYAT6165X enables water rejection using DualSense, Infineon’s patented self-

and mutual-capacitance sensing ability.

3.3

Wet-finger tracking

In a slider system, moisture on fingers can cause false touches to be reported and make tracking of fingers across

the slider difficult. CYAT6165X can detect and track fingers that are wet and enable more robust functionality of

the slider, using DualSense. This includes sweaty fingers touching the slider or fingers moving across a

mist-covered slider.

3.4

Glove

CYAT6165X detects and tracks gloved fingers. Glove support allows navigating the slider without having to

remove gloves or without the use of expensive conductive gloves. Tracking of gloved fingers is supported by

automatic mode switching, which automatically transitions between tracking gloved fingers and other

touch-tracking modes. Ten-finger glove-touch is supported for thin gloves ( 1-mm thick) and two-finger

operation is supported for thick gloves ( 5-mm thick).

3.5

Automatic mode switching

CYAT6165X supports automatic mode switching which detects and tracks a new touch object type without

requiring manual selection of the touch type from the user. Automatic mode switching allows an uninterrupted

user experience when switching between a bare finger, gloved finger, fingernail, or wet finger.

3.6

Large finger tracking

A well-designed slider system must correctly report a large finger or thumb as only a single touch. If this is not

supported, a large finger can incorrectly be reported as two or more touches, hampering the user experience.

When an object, such as a thumb, is pressed against the slider sensor, CYAT6165X ensures that only one touch is

reported at the center of the object.

3.7

Large object detection and rejection

It is important to be able to detect the presence of a large object on the slider sensor. CYAT6165X can determine

the presence of a large object, such as a fist or palm, from the slider data. This presence may either be rejected

or reported to the host.

3.8

Look-for-Touch

Look-for-touch is a low-power and fast-wakeup mode, in which the slider sensor is measured for an increase in

self-capacitance. An increase in self-capacitance indicates that a touch is present. Because it is only necessary to detect

a finger’s presence, and not location, the sensing can be done at a much lower SNR, requiring less time and power.

Look-for-touch sensing is used to implement multiple functions, including wake-on-touch and fast first-touch

response.

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Slider system specifications

4

Slider system specifications

This section specifies the slider system performance delivered by CYAT6165X. For definitions, justification of

parameters, and test methodologies, refer to the Infineon specification PSoC™ Automotive Multitouch

Touchscreen Controller User Interface Performance Definitions (001-49389)^[2]

.

4.1

System performance specifications

The system performance specifications in Table 1^[3]and Table 2^[4]are valid under these conditions:

–40°C  T_A 85°C^[5]for Grade-A devices, –40°C  T_A 105°C^[5]for Grade-S devices; 1.71 V  V_DDD 1.95 V or

3.0 V  V_DDD 5.5 V, 1.71 V  V_CCD 1.95 V, 3.0 V  V_DDA 5.5 V, unless otherwise noted. Typical values are specified

at T_A= 25°C, V_DDD= V_CCD= 1.8 V, core low dropout regulator (LDO) disabled, and V_DDA= 3 V, unless otherwise

noted. Data is validated using 1 TX configuration, 5-mm electrode pitch. Contact your local Infineon sales

representative for information on the system performance conditions toguaranteethe specifications in Table 1.

The performance conditions and specifications are valid onlyfor sensors approved by Infineon for use with

CYAT6165X and produced by qualified Infineon partners.

Contact automotive@infineon.com to discuss any deviations.

Table 1

Category

System performance specifications (Configuration dependent)

Description

Conditions

Min

Typ

Max

Unit

Jitter

Delta in reported X,Y

position, for non-moving

finger

5–12 mm diameter

finger

–

0.5

–

mm

Refresh rate

Response

time

–

One finger on panel

First finger down

60

–

200

–

250^[6]

30

Hz

ms

Active response time

Swipe speed –

–

300

50

1000

–

mm/sec

µA

Low power Power consumption

wake-up

button

3.3 V, 100 ms scan rate

Power

In Active state

1 finger, 60-Hz refresh

rate

–

9

180

30

–

mW

µW

In Active look-for-touch

state

Average power^[7]

Active state for 25% of

touch activity and in

Deep Sleep state for

75% of touch activity.

In deepsleep state

–

11

–

Notes

6. Requires setting TX pulses for mutual-cap and self-cap to 8 and no noise in the environment.

7. See “Power states summary” on page 15 for power state transition details and refresh interval configuration

for each state. Average power is the power consumed during the active and deep sleep states, and is

calculated using this equation: 0.25 × 120 mW + 0.75 × 0.030 mW = 30 mW.

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System design options

5

System design options

5.1

CAPSENSE™ button/FPC support

The CYAT6165X controller supports a maximum of 10 physical CAPSENSE™ buttons.

Detailed FPC development guidelines, including EMI shielding, are available in the PSoC™ Automotive

Multitouch Touchscreen Controller Module Design Best Practices (001-50467).

5.2

Sensors

Infineon supports the following sensor patterns:

• Single-solid diamond (SSD)

• Dual-solid diamond (DSD)

• Manhattan-3 (MH3)

Figure 3 through Figure 5 show examples of SSD, DSD, and MH3 sensor patterns and unit cells.

Unit Cell

Slider

Row

Column

Figure 3

Single-solid diamond pattern and unit cell

Unit Cell

Slider

Row

Column

Figure 4

Dual-solid diamond unit cell

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System design options

Slider

Unit Cell

Row

Column

Figure 5

Manhattan-3 pattern and unit cell

Infineon continues to develop additional patterns and materials to increase performance and decrease system

cost.

The specific sensor pattern used varies based on the mechanical, electrical, optical, and cost constraints; all of

these factors must be considered for an optimal solution.

Following is an example:

• Overlays/lens thickness < 1 mm should not use SSD due to large signal disparity (SD).

To learn more about how to design sensors using stackups and materials, see the PSoC™ Automotive

Multitouch Touchscreen Controller Module Design Best Practices (001-50467).

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Power supply information

6

Power supply information

CYAT6165X contains four power pins: VDDA, VDDA_Q, VDDD, and VCCD. VDDA supplies power to the chip’s

analog circuitry, TX pump, and drivers. VDDA_Q supplies power to the RX analog circuitry. VDDD supplies power

to the digital I/Os, core LDO regulator, supply monitors, and external reset circuitry (XRES). VCCD supplies power

to the CPU core, and may be configured as an input or output, depending on if a 1.71–1.95-V V_DDDsupply is used.

6.1

Required external components

The touch controller requires external components for proper device operation. Quantities are dependent on

the power supply configuration used. External capacitors require an X5R dielectric characteristic or better. It is

recommended to use an X7R dielectric characteristic or better for high-frequency 0.1-µF/0.22-µF capacitors.

VDDA:

• 1.0-Ω, 5% tolerance resistor

• 0.1-µF capacitor

• 1-µF capacitor (2.2-µF in high low-frequency noise)

VDDA_Q:

• 1.0-Ω, 5% tolerance resistor

• 0.1-µF capacitor

• 1-µF capacitor (2.2-µF in high low-frequency noise)

VDDD:

• 0.1-µF capacitor

• 4.7-µF capacitor

VCCD:

• 0.1-µF capacitor

VCCTX:

• 0.22-µF capacitor (configurations with the VCCTX pump enabled)

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Power supply information

6.2

Voltage coefficient

The actual capacitance of external capacitors may be reduced with higher bias voltage. Check the capacitor

datasheet for the voltage coefficient. Capacitors used for power supply decoupling or filtering are operated

under a continuous DC-bias. Many capacitors used with DC power across them provide less than their target

capacitance, and their capacitance is not constant across their working voltage range. When selecting

capacitors for use with this device verify that the selected components provide the required capacitance under

the specific operating conditions of temperature and voltage used in your design. While the temperature ratings

of a capacitor are normally found as part of its catalog part number (for example, X7R, C0G, Y5V), the matching

voltage coefficient may only be available on the component datasheet or direct from the manufacturer. Use of

components that do not provide the required capacitance under the actual operating conditions may cause the

device to perform to less than the datasheet specifications.

The available power configurations, with the TX pump enabled, are shown in Figure 6 and Figure 8. Figure 7,

Figure 9, and Figure 10 show power supply configurations with the TX pump disabled.

CYAT6165X

VDDD

VCCD

1.8 V ±5%

4.7 µF

1 µF 100 nF

1.0 

VDDA_Q

VDDA

3.0–4.7 V

1 µF 100 nF

1.0 

1 µF 100 nF

VCCTX

220 nF

GND

VSS

Figure 6

Dual supplies (inc. 1.8 V), TX pump enabled

CYAT6165X

VDDD

VCCD

1.8 V ±5%

4.7 F

1.0 

1 F 100 nF

VDDA_Q

VDDA

3.0–5.5 V

1 F

100 nF

1.0 

VCCTX

1 F 100 nF

GND

VSS

Figure 7

Dual supplies (inc. 1.8 V), TX pump disabled

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Power supply information

CYAT6165X

VDDD

VCCD

4.7 F

1.0 

100 nF

VDDA_Q

VDDA

3.0–4.7 V

1 F 100 nF

1.0 

1 F

100 nF

VCCTX

220 nF

GND

VSS

Figure 8

Single supply, TX pump enabled

CYAT6165X

VDDD

VCCD

4.7 F

100 nF

1.0 

VDDA_Q

VDDA

3.0–5.5 V

1 F

100 nF

1.0 

VCCTX

1 F 100 nF

GND

VSS

Figure 9

Single supply, TX pump disabled

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Power supply information

CYAT6165X

VDDD

VCCD

3.0–5.5 V

4.7 F

1.0 

100 nF

VDDA_Q

VDDA

3.0–5.5 V

1 F 100 nF

1.0 

VCCTX

1 F

100 nF

GND

VSS

Figure 10

Dual supplies (no 1.8 V), TX pump disabled

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Power states summary

7

Power states summary

The CYAT6165X controller has four power states, illustrated in Figure 11:

• Active, where the slider is actively scanned to determine the presence of a touch and identify the touch

coordinates.

• Active look-for-touch, where the device performs a fast self-capacitive scan to determine if a touch exists.

• Low power, where the slider is scanned for touch presence at a much slower rate.

• Deepsleep, where the slider is not scanned and CYAT6165X is in a low power state with no processing.

The CYAT6165X controller automatically manages transitions between three power states (Active, Active

Look-for-touch, and Low Power). The host can force transition in and out of the fourth power state (Deepsleep).

The active state emphasizes low refresh time for accurate finger tracking, the active look-for-touch state allows

fast first-touch response, and the low power state enables low power consumption during periods of no touch

activity. In all three states, the CYAT6165X controller periodically scans the panel to determine the presence of a

touch. If a touch is present, the controller either enters or remains in the active state where it identifies the touch

coordinates. These tasks occur at different rates in the three states and the detection of touches affects

transitions between the states. Transition from active to active look-for-touch occurs when no touch is detected.

Host can request to disable low-power thus forcing CYAT61X controller to stay out of the Low-Power state at all

times for the fastest response to the first touch on the panel.

The following parameters configure power states, which can be configured by the host:

• Refresh interval (register ACT_INTRVL) sets the minimum time between the start of subsequent slider scans in

the active state.

• Active Look-for-touch interval (register ACT_LFT_INTRVL) sets the minimum refresh time in the active

look-for-touch state.

• Active Mode Timeout (register TCH_TMOUT) sets the period of time in which no touch is detected during the

active look-for-touch state before transitioning to the low power state.

• Low-Power Interval (register LP_INTRVL) sets the time in the low power state between slider scans.

• Deep Sleep is entered via a command from the host to move the device into the Deepsleep state. Automatic

entry into the low power state is enabled by setting the LOW_POWER_ENABLE parameter.

Launch Touch Application

Active

No Touch

Touch Detected

Request

Set Power = SLEEP

Active

Look-for-

Touch

No Touch for greater than

TCH_ TMOUT

&

LOW_ POWER_ ENABLE

Request

Set Power

=SLEEP

Request

Set Power=ON

Wakeup from

Low Power Requested

Low Power

Deep Sleep

Request

Set Power= SLEEP

Figure 11

CYAT6165X power states and transitions

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Pin information

8

Pin information

CYAT6165X is available in a 56-pin QFN wettable flank package and 64-pin TQFP package. This section lists pin

names, descriptions, and mappings to the physical package. Input and output pins may have more than one

possible configuration. Guidance for each configuration option is provided below:

XY: XY pins may be configured as either transmit (TX) drive or receive (RX) sense, allowing each design to be

optimized based on the sensor pattern and layout. See PSoC™ Automotive Multitouch Touchscreen Controller

Module Design Best Practices (001-50467), for guidelines. To configure the device for lowest power, leave

unused XY pins unconnected. TX and RX pins are tied to VSS internally during the Deepsleep power state.

P1: Unused port 1 pin should be left unconnected.

External Reset (XRES): If the XRES pin is unused, it must be connected to V_DDD(either directly or through an

external resistor).

SWD: Serial wire debug (SWD) is the recommended programming mode for all designs. If SWD is not used on the

target board, use the bootloader to upgrade firmware.

COMM_INT: The COMM_INT pin is required. This interrupt pin is used for the host communication. If resistive

mode is used, note that all I/Os are Hi-Z during chip initialization (after XRES or Bootloader Exit), so an additional

external resistor is recommended.

P1[0] (WAKE): Wake pin indicates the status of the low power wake up button.

P1[1] (HOST RESET): The Host reset pin is used to send a reset pulse to the host controller on specific predefined

conditions.

Pin Configurations: Multiple pin configurations are supported using the Touch Tuning Host Emulator (TTHE)

software. Pins are configured using the TTHE Pin Configuration Wizard.

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Pin information

Table 3

56-pin QFN pin list

Type

Name

Description

TX/RX sense pin 13, RX channel 0

Digital

Analog

I/O

1

2

3

XY13

XY12

XY11

XY10

XY09

XY08

XY07

XY06

XY05

XY04

XY03

XY02

XY01

XY00

VSS

–

TX/RX sense pin 12, RX channel 8

TX/RX sense pin 11, RX channel 7

TX/RX sense pin 10, RX channel 6

TX/RX sense pin 09, RX channel 5

TX/RX sense pin 08, RX channel 4

TX/RX sense pin 07, RX channel 3

TX/RX sense pin 06, RX channel 2

TX/RX sense pin 05, RX channel 1

TX/RX sense pin 04, RX channel 0

TX/RX sense pin 03, RX channel 8

TX/RX sense pin 02, RX channel 7

TX/RX sense pin 01, RX channel 6

TX/RX sense pin 00, RX channel 5

Connect to ground

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

Power

P0[0]

P0[1]

XRES

P1[0]

P1[1]

P1[2]

P1[3]

VCCD

VDDD

VSS

I/O

I

I/O

–

I2C SCL / SPI SCLK

I2C SDA / SPI MOSI

External active LOW reset, no internal pull-up

SWDCLK / SPI MISO / EXT_START / WAKE

SWDIO / SPI SS / EXT_SYNC / HOST_RESET

ERROR - Set high when internal error is detected

COMM_INT

Digital core power supply input/output

Digital power supply input

Connect to ground

Power

VSS

Connect to ground

Tx/Rx power supply input

VDDA

VCCTX

XY40

XY39

XY38

XY37

XY36

XY35

XY34

XY33

XY32

XY31

TX pump reservoir and filter capacitor connection point

TX/RX sense pin 40, RX channel 13

TX/RX sense pin 39, RX channel 12

TX/RX sense pin 38, RX channel 11

TX/RX sense pin 37, RX channel 10

TX/RX sense pin 36, RX channel 9

TX/RX sense pin 35, RX channel 16

TX/RX sense pin 34, RX channel 15

TX/RX sense pin 33, RX channel 14

TX/RX sense pin 32, RX channel 13

TX/RX sense pin 31, RX channel 12

–

I/O

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Pin information

Table 3

56-pin QFN pin list ^(continued)

Type

Name

Description

TX/RX sense pin 30, RX channel 11

Digital

Analog

I/O

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

XY30

XY29

XY28

XY27

XY26

XY25

XY24

XY23

XY22

VSS

–

TX/RX sense pin 29, RX channel 16

TX/RX sense pin 28, RX channel 15

TX/RX sense pin 27, RX channel 14

TX/RX sense pin 26, RX channel 13

TX/RX sense pin 25, RX channel 12

TX/RX sense pin 24, RX channel 11

TX/RX sense pin 23, RX channel 10

TX/RX sense pin 22, RX channel 9

Connect to ground

TX/RX sense pin 21, RX channel 8

TX/RX sense pin 20, RX channel 7

TX/RX sense pin 19, RX channel 6

TX/RX sense pin 18, RX channel 5

TX/RX sense pin 17, RX channel 4

TX/RX sense pin 16, RX channel 3

TX/RX sense pin 15, RX channel 2

TX/RX sense pin 14, RX channel 1

I/O

Power

XY21

XY20

XY19

XY18

XY17

XY16

XY15

XY14

–

I/O

56 55 54 53 52 51 50 49 48 47 46 45 44 43

XY13

XY12

XY11

XY10

XY09

XY08

XY07

XY06

XY05

XY04

XY03

XY02

XY01

1

2

42

41

40

39

38

37

36

35

34

33

32

31

30

29

XY27

XY28

XY29

XY30

XY31

XY32

XY33

XY34

XY35

XY36

XY37

XY38

XY39

XY40

3

4

5

6

Touch Controller

(QFN 56)

7

8

Top View

9

10

11

12

13

14

XY00

15 16 17 18 19 20 21 22 23 24 25 26 27 28

Figure 12

56-pin QFN pinout

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Datasheet

Pin information

Table 4

Pin No.

64-pin TQFP pin list

Type

Name

Description

TX/RX sense pin 17, Rx channel 2

Digital

Analog

I/O

1

2

3

XY17

XY16

XY15

XY14

XY13

XY12

XY11

XY10

XY09

XY08

XY07

XY06

XY05

XY04

XY03

XY02

XY01

XY00

VSS

–

TX/RX sense pin 16, Rx channel 1

TX/RX sense pin 15, Rx channel 0

TX/RX sense pin 14, Rx channel 8

TX/RX sense pin 13, Rx channel 7

TX/RX sense pin 12, Rx channel 6

TX/RX sense pin 11, Rx channel 5

TX/RX sense pin 10, Rx channel 4

TX/RX sense pin 09, Rx channel 3

TX/RX sense pin 08, Rx channel 2

TX/RX sense pin 07, Rx channel 1

TX/RX sense pin 06, Rx channel 0

TX/RX sense pin 05, Rx channel 8

TX/RX sense pin 04, Rx channel 7

TX/RX sense pin 03, Rx channel 6

TX/RX sense pin 02, Rx channel 5

TX/RX sense pin 01, Rx channel 4

TX/RX sense pin 00, Rx channel 3

Connect to ground

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

Power

P0[0]

P0[1]

XRES

P1[0]

P1[1]

P1[2]

P1[3]

VCCD

VDDD

VSS

I/O

I

I/O

–

I2C SCL / SPI SCLK

I2C SDA / SPI MOSI

External active LOW reset, no internal pull-up

SWDCLK / SPI MISO / EXT_START /WAKE

SWDIO / SPI SS / EXT_SYNC / HOST_RESET

ERROR - Set high when internal error is detected

COMM_INT

Digital core power supply input/output

Digital power supply input

Connect to ground

Tx/Rx power supply input

TX pump reservoir and filter capacitor connection point

TX/RX sense pin 47, Rx channel 16

TX/RX sense pin 46, Rx channel 15

TX/RX sense pin 45, Rx channel 14

TX/RX sense pin 44, Rx channel 13

TX/RX sense pin 43, Rx channel 12

Power

VSS

VDDA

VDDA_Q

VCCTX

XY47

XY46

XY45

XY44

XY43

–

I/O

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Pin information

Table 4

Pin No.

64-pin TQFP pin list ^(continued)

Type

Name

Description

TX/RX sense pin 42, Rx channel 11

Digital

Analog

I/O

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

XY42

XY41

XY40

XY39

XY38

XY37

XY36

XY35

XY34

XY33

XY32

XY31

XY30

XY29

XY28

XY27

XY26

XY25

XY24

VSS

–

TX/RX sense pin 41, Rx channel 10

TX/RX sense pin 40, Rx channel 09

TX/RX sense pin 39, Rx channel 16

TX/RX sense pin 38, Rx channel 15

TX/RX sense pin 37, Rx channel 14

TX/RX sense pin 36, Rx channel 13

TX/RX sense pin 35, Rx channel 12

TX/RX sense pin 34, Rx channel 11

TX/RX sense pin 33, Rx channel 10

TX/RX sense pin 32, Rx channel 09

TX/RX sense pin 31, Rx channel 16

TX/RX sense pin 30, Rx channel 15

TX/RX sense pin 29, Rx channel 14

TX/RX sense pin 28, Rx channel 13

TX/RX sense pin 27, Rx channel 12

TX/RX sense pin 26, Rx channel 11

TX/RX sense pin 25, Rx channel 10

TX/RX sense pin 24, Rx channel 09

Connect to ground

Power

XY23

XY22

XY21

XY20

XY19

XY18

–

I/O

TX/RX sense pin 23, Rx channel 8

TX/RX sense pin 22, Rx channel 7

TX/RX sense pin 21, Rx channel 6

TX/RX sense pin 20, Rx channel 5

TX/RX sense pin 19, Rx channel 4

TX/RX sense pin 18, Rx channel 3

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Datasheet

Pin information

XY17

XY16

XY15

XY14

XY13

XY12

XY11

XY10

XY09

XY08

XY07

XY06

XY05

XY04

XY03

XY02

1

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

XY33

XY34

XY35

XY36

XY37

XY38

XY39

XY40

XY41

XY42

XY43

2

3

4

5

6

7

CYAT6165X

64-Pin TQFP

48 Sense I/O

8

9

10

11

12

13

14

15

16

XY44

XY45

XY46

XY47

VCCTX

Figure 13

64-pin TQFP pinout

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Electrical Specifications

9

Electrical Specifications

This section lists CYAT6165X DC and AC electrical specifications.

9.1

Absolute maximum ratings

Table 5

Absolute maximum ratings

Description

Symbol

Conditions

Min

–55

V_SS– 0.5

–

Typ

25

–

Max

125

6

100

Unit

°C

V

T_STG

Storage temperature

Digital supply voltage

Analog supply voltage

Amplitude (V_PP) of digital

(V_DDD) supply ripple riding

on the DC voltage

Amplitude (V_PP) of analog

(V_DDA) supply ripple riding

on the DC voltage (TX pump

enabled)

–

V_DDD

V_DDA

V_DDDR

DC to 20 MHz

mV

[8]

V_DDAR

DC to 20 MHz

–

100

Amplitude (V_PP) of analog

(V_DDA) supply ripple riding

on the DC voltage (TX pump

disabled)

DC to 150 kHz^[9]

150 kHz^[9]to 20 MHz

–

15

15 +

20 dB/decade

> 150 kHz^[9]

V_CCD

V_GPIO

Core supply voltage

Port 0 pin voltage

Port 1 pin voltage

Current into I/O pin

–

V_SS– 0.5

–25

–

2.3

6

7

V

Driver enabled

Driver disabled

–

V_DDD+ 0.5

I_IO

ESD_CDM

50

–

mA

V

Electrostatic discharge

voltage

Charge device model

1500

ESD_HBM

Electrostatic discharge

voltage

Human body model

5000

–

9.2

Operating temperature

Table 6

Symbol

T_A

Operating temperature

Description

Ambient temperature

(A-grade)

Ambient temperature

(S-grade)

Conditions

Min

–40

Typ

–

Max

85

Unit

°C

–

T_A

–40

–

105

Notes

8. Analog supply ripple specifications are valid for the supply presented to the external resistor (for example,

label “V” in Figure 6), not at the device VDDA and VDDA_Q pin.

9. If a 2.2-µF capacitor is used in place of a 1-µF capacitor, the threshold is 80 kHz.

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Electrical Specifications

9.3

DC specifications

The specifications in this section are valid under these conditions:

–40°C  T_A 85°C for Grade-A devices, –40°C  T_A 105°C for Grade-S devices.

9.3.1

Flash specifications

The specifications in Table 7 are valid under these conditions: 1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V,

1.71 V  V_CCD 1.95 V, and 3.0 V  V_DDA 5.5 V. Typical values are specified at T_A= 25°C, V_DDD= V_CCD= 1.8 V, core

LDO disabled, and V_DDA= 3.0 V.

Table 7

Symbol

Flash specifications

Description

Conditions

Min

Typ

Max

Unit

Flash_ENPBFlash write endurance

Erase/write cycles per

block

Following maximum Flash

write cycles (Flash_ENPB),

T_A 55°C

Following maximum Flash

write cycles (Flash_ENPB),

T_A> 55°C

10,000

–

cycles

Flash_DR

Flash data retention

20^[10]

–

years

10^[10]

Note

10.Storing programmed devices at or above the ambient temperature specified by Flash_DRmay reduce flash

data retention time. Infineon provides a retention calculator to calculate the retention lifetime based on

customer’s individual temperature profiles for operation over the ambient temperature range for the

device’s temperature rating. For more information, contact our support team at support@infineon.com.

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Electrical Specifications

9.3.2

Chip-level DC specifications

The specifications in Table 8 are valid under these conditions: 1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V,

1.71 V  V_CCD 1.95 V, and 3.0 V  V_DDA 5.5 V. Typical values are specified at T_A= 25°C, V_DDD= V_CCD= 1.8 V, core

LDO disabled, and V_DDA= 3.0 V.

Table 8

Symbol

Chip-level DC specifications

Description

Conditions

Min

Typ

Max

Unit

V_DDD

V_CCD

V_DDA

Digital supply voltage

Core LDO enabled

(V_CCDoutput)

3.0

–

5.5

V

Core LDO disabled

1.71

–

1.8

1.95

–

(V_CCDinput)^[11]

Digital core supply voltage Core LDO enabled

(V_CCDoutput)

Core LDO disabled

1.71

1.95

(V_CCDinput)^[11]

[11]

Analog supply voltage

TX pump enabled

TX pump disabled

Input to external

low-pass filter,

external V_CCTX

configuration

3.0

–

4.7

5.5

V_CCTX

V_CCTXsupply operating

voltage range

PSA_RAMP

V_DDAramp rate from ground –

to minimum voltage

V_DDDramp rate from ground –

to minimum voltage

–

100

40

V/ms

PSD_RAMP

1^[12]

PSD_RAMPDOWN

V_DDDramp down rate from

1.5 V to 1.0 V

–

40

I_{DDD_ACT}

I_{DDA_ACT}

I_{DDD_DS}

I_{DDA_DS}

I_{DDD_XR}

V_DDDactive current

V_DDAactive current

V_DDDdeep sleep current

V_DDAdeep sleep current

V_DDDcurrent, XRES = LOW

–

20

15

3

2

5

1

25

5

50

20

–

25

mA

µA

1.71 V  V_DDD 1.95 V

3.0 V  V_DDD 5.5 V

–

I_{DDA_XR}

I_{DDD_P}

V_DDAcurrent, XRES = LOW

V_DDDflash programming and –

flash verify current

mA

Notes

11.These Min and Max limits are inclusive of noise. For proper operation, V_DDAor V_DDDwith combined noise

cannot go below or above the specified Min or Max limits.

12.If minimum ramp rate cannot be met, XRES should be asserted during voltage ramp (1.5 V > V_DDD>1.0 V for

ramp-down or until voltage is stable for ramp-up). Note that a glitch on the I²C bus could occur during voltage

ramp in this case.

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Electrical Specifications

9.3.3

I/O port 0 (P0[0:1]) DC specifications

The port 0 specifications in Table 9 are valid under these conditions: 1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V,

1.71 V  V_CCD 1.95 V, and 3.0 V  V_DDA5.5 V. Typical values are specified at T_A= 25°C, V_DDD= V_CCD= 1.8 V, core

LDO disabled, and V_DDA= 3.0 V.

Table 9

Symbol

V_IH

I/O port 0 (P0[0:1]) DC specifications

Description

Conditions

Min

0.7 × V_DDD

0.7 × V_EXT

Typ

–

Max

–

Unit

V

Input high voltage

CMOS mode

1.8-V mode, V_EXT^[14]= 1.8 V,

3.0 V  V_DDD 5.5 V

V_IL

Input low voltage

CMOS mode

–

0.3 × V_DDD

0.3 × V_EXT

1.8-V mode, V_EXT^[14]= 1.8 V,

3.0 V  V_DDD 5.5 V

V_OH

High output voltage

Reference to V_DDD, I_OH= 1 mA, V_DDD– 0.5

V_DDD= 1.8 V

Reference to V_DDD, I_OH= 4 mA, V_DDD– 0.6

V_DDD= 3.0 V

–

V_OL

Low output voltage

Input hysteresis

Output rise time Fast-Strong 25 pF load,

10%–90% V_DDD= 3.3 V

V

–

_DDD 1.71 V, I_OL= 10 mA

_DDD 1.71 V, I_OL= 3 mA

–

0.6

0.4

–

0.1 × V_DDD

2

V_H

T_{RISE_OV}

12

ns

Output rise time

Slow-Strong

Output fall time Fast-Strong 25 pF load,

10%–90% V_DDD= 3.3 V

Output fall time Slow-Strong 25 pF load,

10%–90% V_DDD= 3.3 V

25 pF load,

10%–90% V_DDD= 3.3 V

10

1.5

10

–

60

12

60

T_{FALL_OV}

[13]

I_IL

Input leakage current

(absolute value)

T_A= 25°C, V_DDD= 3.0 V

T_A= 25°C, V_DDD= 0.0 V

Package and pin dependent

T_A= 25°C

–

14

10

7

nA

µA

pF

C_IN

Input pin capacitance

C_OUT

R_INT

Output pin capacitance

Package and pin dependent

T_A= 25°C

–

7

Internal pull-up / pull-down Pin configured for internal

resistance

3.5

5.6

8.5

k

pull-up or pull-down; note

that all I/Os are Hi-Z during

chip initialization (after XRES

or Bootloader Exit)

Notes

13.Gang tested with all I/Os to 1 µA.

14.V_EXTis the external supply used to bias the pull-up resistor when used on an I²C bus.

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Electrical Specifications

9.3.4

I/O port 1 (P1[0:3]) and XRES DC specifications

The specifications in Table 10 are valid under these conditions: 1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V,

1.71 V  V_CCD 1.95 V, and 3.0 V  V_DDA 5.5 V. Typical values are specified at T_A= 25°C, V_DDD= V_CCD= 1.8 V, core

LDO disabled, and V_DDA= 3.0 V.

Table 10

Symbol

V_IH

I/O port 1 (P1[0:3]) and XRES DC specifications

Description Conditions

Input voltage high threshold 1.8-V configuration

Min

1.26

Typ

–

Max

–

Unit

V

CMOS configuration

0.7 × V_DDD

–

XRES

Input voltage low threshold 1.8-V configuration

CMOS configuration

1.35

–

0.54

0.3 × V_DDD

V_IL

XRES

–

0.45

–

0.6

–

V_OH

V_OL

High output voltage

Low Output Voltage

Input hysteresis voltage

I_OH= 4 mA, V_DDD= 3.0 V

_OH= 1 mA, V_DDD= 1.8 V

I_OL= 8 mA, V_DDD= 3.3 V

_OL= 4 mA, V_DDD= 1.8 V

V_DDD– 0.6

V_DDD– 0.5

I

–

I

–

0.1 × V_DDD

2

V_H

T_{RISE_G}

Output rise time Fast-Strong 25 pF load,

10%–90% V_DDD= 3.3 V

12

ns

Output rise time

Slow-Strong

Output fall time Fast-Strong 25 pF load,

10%–90% V_DDD= 3.3 V

Output fall time

Slow-Strong

Input leakage (absolute

value)

25 pF load,

10%–90% V_DDD= 3.3 V

–

2

–

60

12

60

2

T_{FALL_G}

25 pF load,

10%–90% V_DDD= 3.3 V

–

[15]

I_IL

–

nA

pF

C_IN

Input pin capacitance

Package and pin dependent

T_A= 25°C

–

7

C_OUT

Output pin capacitance

Package and pin dependent

T_A= 25°C

–

7

[16]

R_INT

Internal pull-up/pull-down Pin configured for internal

resistance pull-up or pull-down

3.5

5.6

8.5

k

Notes

15.Gang tested with all I/Os to 1 µA.

16.XRES is input only with no internal pull-up or pull-down resistor.

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Electrical Specifications

9.4

AC specifications

The specifications in this section are valid under these conditions:

–40°C  T_A 85°C for Grade-A devices, –40°C  T_A 105°C for Grade-S devices.

9.4.1

SWD interface AC specifications

The specifications in Table 11 are valid under these conditions: 1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V,

1.71 V  V_CCD 1.95 V, 3.0 V  V_DDA 5.5 V, and C_LOAD= 25 pF. Typical values are specified at T_A= 25°C,

V_DDD= V_CCD= 1.8 V, core LDO disabled, and V_DDA= 3.0 V.

Table 11

Symbol

f_SWDCLK

SWD interface AC specifications

Description

Conditions

Min

–

Typ

–

Max

14

8

Unit

MHz

SWDCLK frequency

3.3 V  V_DDD 5 V

1.71 V  V_DDD3.3 V

T = 1 / f_SWDCLK

T_{SWDI_SETUP}SWDIO input setup before

SWDCLK HIGH

T / 4

–

ns

T_{SWDI_HOLD}SWDIO input hold after

SWDCLK HIGH

T_{SWDO_VALID}SWDCLK HIGH to SWDIO

output valid

T_{SWDO_HOLD}SWDIO output hold after

SWDCLK HIGH

T = 1 / f_SWDCLK

T / 4

–

T / 2

–

1

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Electrical Specifications

9.4.2

Chip-level AC specifications

The specifications in Table 12 are valid under these conditions: 1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V,

1.71 V  V_CCD 1.95 V, and 3.0 V  V_DDA 5.5 V. Typical values are specified at T_A= 25°C, V_DDD= V_CCD= 1.8 V, core

LDO disabled, and V_DDA= 3.0 V.

Table 12

Symbol

T_XRST

Chip-level AC specifications

Description

Conditions

After V_DDDis valid

Min

10

Typ

–

Max

–

Unit

µs

External reset

(XRES) pulse width

T_READY

Time from

deassertion of

XRES to COMM_INT

–

35

ms

T_CAL

Calibration routine

execution time

Frequency

variation at 37 MHz

and 48 MHz

–

2000

F_IMOTOL1

2

%

T_{COMM_EXIT_CRC}

Time from EXIT

POST_SHORT_OPEN_CTRL -

–

40

–

ms

BTLDR command “Disabled All” ^[17]

(with CRC

checking) to SYS

INFO MODE

T_READY

XRES

COMM_INT

Figure 14

COMM_INT timing diagram

Note

17.For POST_SHORT_OPEN_CTRL - “Enabled All”, there will be an additional 100 ms during startup.

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Electrical Specifications

9.4.3

I²C specifications

The specifications in Table 13 are valid under these conditions: 1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V,

1.71 V  V_CCD 1.95 V, and 3.0 V  V_DDA 5.5 V. Typical values are specified at T_A= 25°C, V_DDD= V_CCD= 1.8 V, core

LDO disabled, and V_DDA= 3.0 V. CYAT6165X does not require a clock-stretch capable host, but is fully compatible

with systems that perform clock-stretching.

To ensure proper I²C functionality in extreme bus conditions, refer to Infineon’s application note Using

CY8CTMA4/5XX I²C in Systems With Slow Clock Edges (001-81514)^[18]

.

Important Note: The P0[0] and P0[1] pins have I/O cells optimized for use on multi-drop buses. When the touch

device is powered off, the pin drivers do not load the attached bus, such that other devices attached to them may

continue to communicate.

T_SUDATI2C

70%

30%

70%

30%

SDA

SCL

1/f_SCL

T_HDSTAI2C

T_SPI2C

T_LOWI2C

T_BUFI2C

70%

30%

70%

30%

T_HIGHI2C

T_SUSTAI2C

T_SUSTOI2C

T_HDDATI2C

T_HDSTAI2C

Sr

P

S

Legend

S: I²C Start Condition

Sr: I²C Repeat Start Condition

P: I²C Stop Condition

Figure 15

I²C Bus timing diagram for fast/standard mode

Note

18.Extreme bus conditions are considered to be a combination of the following conditions: High-capacitive bus

load, slow SCL fall time, and fast SDA rise/fall time. Infineon reference documents are available under NDA

through your local Infineon sales representative. You can also direct your requests to

automotive@infineon.com.

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Electrical Specifications

Table 13

Symbol

f_SCLI2C

AC characteristics of the I²C SDA and SCL pins

Description

Standard Mode

Fast Mode

Unit

Min

0

Max

100

–

Min

Max

400

–

SCL clock frequency

0

kHz

µs

T_HDSTAI2CHold time (repeated) start condition. After this

period, the first clock pulse is generated.

4

0.6

T_LOWI2C

T_HIGHI2C

LOW period of SCL clock

HIGH period of SCL clock

4.7

4

–

1.3

0.6

–

T_SUSTAI2CSetup time for repeated start condition

T_HDDATI2CData hold time

4.7

0

–

0.6

0

–

T_SUDATI2CData setup time

T_VDDATI2CData valid time

T_VDACKI2CData acknowledge time

T_SUSTOI2CSetup time for stop condition

250

–

4

–

100

–

0.6

–

ns

µs

3.45

–

0.9

–

V_HH

Input hysteresis high voltage,

1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V

0.1 × V_DDD

–

0.1 × V_DDD

–

V

T_BUFI2C

T_SPI2C

Bus free time between a stop and start condition

Pulse width of spikes that are suppressed by

input filter

4.7

–

1.3

50

–

µs

ns

C_BUS

V_{IL_I2C}

V_{IH_I2C}

Capacitance load for SDA or SCL

Input low voltage

Input high voltage

–

–0.5

0.7 × V_DDD

400

0.3 × V_DDD

–

–0.5

0.7 × V_DDD

400

0.3 × V_DDD

pF

V

–

V_{OL_I2C_L}Output low voltage (V_DDD 2 V, 3 mA sink)

–

0.2 × V_DDD

–

0.2 × V_DDD

V_{OL_I2C_H}Output low voltage (V_DDD> 3 V, 3 mA sink)

–

0.4

3

–

0.4

3

6

I_{OL_I2C}

V_{H_I2C}

Output low current

Output low current V_OL= 0.6 V

Input hysteresis

mA

mV

0.1 × V_DDD

–

0.1 × V_DDD

–

Datasheet

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Datasheet

Electrical Specifications

9.4.4

SPI specifications

The specifications listed in Table 14 are valid under these conditions: 1.71 V  V_DDD 1.95 V or

3.0 V  V_DDD 5.5 V, 1.71 V  V_CCD 1.95 V, 3.0 V  V_DDA 5.5 V, and C_LOAD= 25 pF. Typical values are specified at

T_A= 25°C, V_DDD= V_CCD= 1.8 V, core LDO disabled, and V_DDA= 3.0 V.

T_{SCLK_SS}

T_{SS_SCLK}

SS

1/f_SCLK

70%

30%

70%

30%

70%

30%

70%

30%

70%

30%

T_HIGH

T_LOW

SCLK

(CPOL = 0)

(INPUT)

T_DELAY

70%

30%

MISO

70%

30%

MOSI

T_HOLD

T_SETUP

Figure 16

SPI timing diagram

Table 14

Parameter

f_SCLK

1/f_SCLK

SDR_SPI

AC characteristics of SPI pins

Description

Conditions

Min

Typ

–

Max

Unit

MHz

ns

SCLK clock frequency

–

125

–

8

–

8

SPI SCLK cycle time (period) –

Sustained data rate for SPI

transaction

Time between consecutive

SPI transactions (duration

between SS deactivation

and the following SS

activation)

–

Mbps

T_IDLESPI

125

–

ns

T_LOW

SCLK LOW time

SCLK HIGH time

MOSI setup to SCLK

MOSI hold from SCLK

MISO delay (hold) high

voltage

–

V

50

30

0

–

45

T_HIGH

T_SETUP

T_HOLD

T_DELAY

_DDD 3 V

MISO delay (hold) low

voltage

Time from SS LOW to first

SCLK

Time from last SCLK to SS

HIGH

V

–

_DDD< 2 V

0

–

65

–

T_{SS_SCLK}

T_{SCLK_SS}

125

–

Datasheet

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Datasheet

Packaging information

10

Packaging information

This section provides the CYAT6165X device packaging specifications.

001-76517 *A

Figure 17

56-pin QFN ((8 × 8 × 1.0 mm) LW56 4.5 × 5.2 E-Pad (Subcon punch type)) package outline,

001-76517

51-85051 *D

Figure 18

64-pin TQFP (10 × 10 × 1.4 mm) A64SB package outline, 51-85051

Datasheet

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Datasheet

Packaging information

10.1

Thermal impedance and moisture sensitivity

Table 15

Thermal impedance and moisture sensitivity

Package

56-pin QFN

64-pin TQFP

Typical _JMAX

125°C

Typical _JA

18.0°C/W ^[19]

42.8°C/W ^[19]

Typical _JC

3.5°C/W ^[19]

7.0°C/W ^[19]

Moisture sensitivity level

3

125°C

10.2

Solder reflow specifications

Table 16 lists the maximum solder reflow peak temperature.

Important Note

Thermal ramp rate during preheat should be 3°C/s or lower. The packaged device supports Pb-free solder reflow

profile as per section 5.6 of J-STD-020.D1.

Table 16

Solder reflow specifications

Package

Maximum peak temperature

Time at maximum temperature

All packages

260°C

30 seconds

Note

19.Measured at 25°C ambient on a 4-layer PCB.

Datasheet

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Datasheet

Ordering information

11

Ordering information

Table 17 lists the CYAT6165X slider controllers.

Table 17

Ordering information^[20]

CYAT61652-56LWA41

CYAT61652-56LWS41

CYAT61658-56LWA41

CYAT61658-56LWS41

CYAT61659-56LWA41

CYAT61659-56LWS41

CYAT61652-64AA48

CYAT61652-64AS48

CYAT61658-64AA48

CYAT61658-64AS48

CYAT61659-64AA48

CYAT61659-64AS48

41

48

10

✔

–

✔

–

56-pin QFN

64-pin TQFP

✔

–

✔

–

✔

–

✔

11.1

Ordering code definitions

XX

-

XX

C Y A T

X

XXX XX

X

P a ck a g in g :

T = T a p e a n d re e l

B la n k /n o n -T = T ray

N u m b e r o f se n se I/O s: 4 1 o r 4 8

T e m p e ra tu re ra n g e :

A = -4 0 °C to 8 5 °C ;

S = -4 0 °C to 1 0 5 °C

P a ck a g e ty p e :

L W = 5 6-p in w e tta b le fla n k Q FN

A = 6 4 -p in T Q FP

N u m b e r o f p in s: 5 6 o r 6 4

P ro d u ct fe a tu re se t: S e e O rd e rin g in fo rm atio n tab le

S e n so r co n fig u ra tio n : 1 = D isc re te se n so rs

M a rk e t se g m e n t:

6 = A u to m o tive slid e r

7 = A u to m o tive tra c kp a d

8 = A u to m o tive T o u c h sc re e n

B u sin e ss u n it: A T = A u to m o tive

M a rk e tin g co d e : C Y = CYPRESS (an Infineon com pany)

Notes

20.All devices have the following base features: Water Rejection, DisplayArmor™, AutoArmor™, DualSense™,

CAPSENSE™ buttons, and Large Object Detection and Rejection.

21.Not compatible with SPI due to pin limitations.

Datasheet

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Datasheet

Acronyms

12

Acronyms

Table 18

Acronym

CPU

DNU

DSD

EMI

ESD

FPC

I²C

Acronyms used in this document

Description

central processing unit

do not use

dual-solid diamond pattern (Figure 4)

electromagnetic interference

electrostatic discharge

flexible printed circuit

inter-integrated circuit

input/output

I/O

ITO

indium tin oxide

LDO

MH3

MTK

PCB

PET

QFN

SCL

low dropout regulator

Manhattan-3 pattern (Figure 5)

manufacturing test kit

printed circuit board

polyethylene terephthalate

quad flat no-lead

serial I²C clock

SD

SDA

signal disparity

serial I²C data

SMT

SNR

SSD

SWD

SWDCLK

TQFP

TRM

TTHE

V_PP

surface mount technology

signal-to-noise ratio

single-solid diamond pattern (Figure 3)

serial wire debug

serial wire debug clock

thin quad flat pack

technical reference manual

touch tuning host emulator

volts peak-to-peak

Datasheet

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Datasheet

Reference documents

13

Reference documents

Infineon has created a collection of documents to support the design of PSoC™ Automotive Multitouch slider

controllers.

The following list will guide you in identifying the proper document for your task:

• PCB/FPC Schematic and Layout Design

• ITO Panel Design

• Driver Development

• Manufacturing (MFG)

• System Performance Evaluation

Infineon’s PSoC™ Automotive Multitouch technology is Infineon confidential information and is protected

through a Non-Disclosure Agreement (NDA). These documents are not publicly available on the Infineon website.

Contact your local Infineon office to request any of these documents pursuant to the aforementioned NDA. You

can also direct your requests to automotive@infineon.com.

Table 19

Reference specifications

Document

number

PCB

FPC

ITO

Document title

Description

Driver MFG System

panel

Solution specifications

001-49389

PSoC™ Automotive Multitouch

Contains Infineon touchscreen

performance parameter

–

✔

–

✔

Touchscreen Controller User

Interface Performance Definitions definitions, justification for

parameters, and parameter test

methodologies.

001-50467

PSoC™ Automotive Multitouch

Touchscreen Controller Module

Design Best Practices

A system-level design guide for

building a capacitive touchscreen

module, covering topics such as

touchscreen traces, shielding,

mechanical design, FPC/PCB

design, and LCD considerations.

✔

–

001-81514

AN81514 - Using I2C In Systems

With Slow Clock Edges

Discusses how to ensure proper I²C

✔

–

functionality in extreme bus

conditions^[22]

.

001-83948

001-63571

Touch Tuning Host Emulator User Describes the Touch Tuning Host

–

✔

Guide

Emulator Software

CY3295-MTK PSoC™ Multitouch

Describes the CY3295-MTK

✔

–

Manufacturing Test Kit User Guide Manufacturing Test Kit

External Specifications - These specifications are not created or owned by Infineon, but directions on how to acquire or access them can

be provided upon request by contacting automotive@infineon.com.

UM10204

ISO11452

I²C-bus specification and user manual

✔

–

✔

Component test methods for electrical disturbances in Road Vehicles

Package

CISPR25

Vehicles, boats and internal combustion engines – Radio disturbance

characteristics – Limits and methods of measurement for the protection

of on-board receivers

✔

–

✔

J-STD-020D.1

Moisture/Reflow Sensitivity

Classification for non hermetic

surface mount devices

Note

22.Extreme bus conditions are considered to be a combination of the following conditions: High-capacitive bus

load, slow SCL fall time, and fast SDA rise/fall time.

Datasheet

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Datasheet

Document conventions

14

Document conventions

14.1

Units of measure

Table 20

Symbol

°C

µA

µF

µs

µW

µ

Units of measure

Unit of measure

degrees Celsius

microampere

microfarad

microsecond

microwatt

ohm

Hz

hertz

k

kilo-ohm

kbps

kHz

mA

mm

ms

mV

mW

Mbps

MHz

nA

kilobits per second

kilohertz

milliampere

millimeter

millisecond

millivolt

milliwatt

megabits per second

megahertz

nanoampere

nanosecond

picofarad

ns

pF

s

second

14.2

Port nomenclature

Px[y] describes a particular bit “y” available within an I/O port “x.” For example, P4[2] reads “port 4, bit 2."

Px[y:z] describes a particular range of bits “y to z” within an I/O port named “Px.” For example, P4[0:5] refers to

bits 0 through 5 within an I/O port named P4.

Datasheet

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Datasheet

Glossary

15

Glossary

Table 21

Term

Glossary

Definition

The maximum position error across the slider, measured in millimeters, along a straight

line between the actual finger position and the reported finger position. Accuracy is

measured across the core and full panel. See Infineon’s PSoC™ Automotive Multitouch

Touchscreen Controller Performance Parameters (001-49389)^[23]specification for

more information.

accuracy

Infineon brand name for PSoC™ Automotive Multitouch devices capable of tracking the

motion of multiple fingers.

All-Points

The process of measuring the capacitance of an electrode connected to a pin (self

capacitance) or the capacitance between a pair of electrodes connected to different pins

(mutual capacitance). The result is a number that can be processed by the channel engine

and CPU.

conversion

That portion of the slider, responsive to touch, less a perimeter area whose width is the

larger of 3.5 mm or half the width of the finger (for example, less a perimeter band 4.5-mm

wide for a 9-mm finger).

core

Low Drop Out Regulator that sources power to the digital core when enabled. Input to the

LDO is VDDD. Output of the LDO is connected to the digital supply pin VCCD. When the core

LDO is disabled, power must be externally applied to the digital core supply pin VCCD.

core LDO

The top layer in the slider stackup that provides mechanical stability and protection for

the slider sensor.

cover lens

mutual

capacitance

The capacitance between two slider electrodes.

The frequency at which consecutive frames of slider data are made available in a data

buffer while a finger is present on the slider. See Infineon’s PSoC™ Automotive

Multitouch Touchscreen Controller Performance Parameters (001-49389)^[23]

specification for more information.

Receive. A slider electrode or slider controller sense pin, mapped or switched to a charge

sensing circuit within the controller (known as a receive channel).

refresh rate

RX

scan

sense pin

The conversion of all sensor capacitances to digital values.

A pin that can be multiplexed to RX or TX.

signal-to-noise

ratio (SNR)

The ratio between a capacitive finger signal and system noise.

signal disparity

(SD)

The ratio of maximum measured signal when the slider is grounded and maximum

measured signal when the slider is isolated from ground.

stackup

Layers of materials, in defined assembly order, that make up a slider sensor.

Transmit. A slider electrode or slider controller sense pin, mapped or switched to a charge

forcing circuit within the controller. This charge forcing circuit drives a periodic waveform

onto one or more slider electrodes, which are coupled through mutual capacitance to

adjacent receive electrodes.

TX

Note

23.Infineon reference documents are available under NDA through your local Infineon sales representative. You

can also direct your requests to automotive@infineon.com.

Datasheet

38

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Datasheet

Revision history

Document

Date

Description of changes

revision

**

2017-03-30

New datasheet.

Updated Ordering information:

Updated Table 17:

*A

*B

2018-05-03

2019-02-22

Updated part numbers.

Updated “Confidential” watermark at the bottom of page as

“CONFIDENTIAL - RELEASED ONLY UNDER NONDISCLOSURE AGREEMENT

(NDA)”.

Updated Reference documents:

Updated Table 19:

Updated spec titles in “Document Title” column.

Completing Sunset Review.

Updated Pin information:

Updated Table 4 (Replaced “VDDA” with “VDDA_Q” in “Name” column

corresponding to pin 32).

*C

2019-05-08

Updated Figure 13 (Replaced “VDDA” with “VDDA_Q” corresponding to

pin 32).

Add trackpad related information in all instances across the document.

Updated Electrical Specifications:

Updated DC specifications:

Updated Chip-level DC specifications:

Updated Table 8.

Updated AC specifications:

Updated Chip-level AC specifications:

Updated Table 12.

*D

2020-11-26

Updated I2C specifications:

Updated Table 13.

Updated Packaging information:

Updated Thermal impedance and moisture sensitivity:

Updated Table 15.

Updated Ordering information:

No change in part numbers.

Updated Ordering code definitions.

Datasheet

39

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PSoC™ Automotive Multitouch Generation 6L Slider

Datasheet

Revision history

Document

Date

Description of changes

revision

Updated Pin information:

Updated description.

Updated Electrical Specifications:

Updated Absolute maximum ratings:

Updated Table 5.

Updated DC specifications:

Updated Chip-level DC specifications:

Updated Table 8.

Updated I/O port 0 (P0[0:1]) DC specifications:

Updated Table 9.

*E

2021-08-18

Updated Packaging information:

Updated Thermal impedance and moisture sensitivity:

Updated Table 15.

Updated Ordering information:

No change in part numbers.

Added Note 21 and referred the same note in “Wake up Button Support”

column in Table 17.

Updated Document Title to read as “CYAT6165X (41/48 I/Os), PSoC™

Automotive Multitouch All-Points Slider Controller Datasheet”.

Updated to the PSoC™ Automotive Multitouch branding guidelines.

Updated Power supply information:

Updated Voltage coefficient:

*F

2022-05-16

2022-08-18

Updated Figure 6 (Updated caption only).

Updated Figure 7 (Updated caption only).

Updated Figure 8 (Updated caption only).

Updated Figure 9 (Updated caption only).

Updated Figure 10 (Updated caption only).

Updated Document Title to read as “CYAT6165X, PSoC™ Automotive

Multitouch Generation 6L Slider Datasheet”.

Migrated to Infineon template.

*G

Datasheet

40

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PSoC™ Automotive Multitouch Generation 6L Slider

Datasheet

Revision history

Document

Date

Description of changes

revision

Updated Slider system specifications:

Updated System performance specifications:

Updated description.

Updated Electrical Specifications:

Updated DC specifications:

Added description.

Updated Flash specifications:

Updated description.

Updated Table 7.

Updated Note 10.

Updated Chip-level DC specifications:

Updated description.

Updated I/O port 0 (P0[0:1]) DC specifications:

Updated description.

Updated Table 9.

*H

2023-05-11

Updated I/O port 1 (P1[0:3]) and XRES DC specifications:

Updated description.

Updated Table 10.

Updated AC specifications:

Added description.

Updated SWD interface AC specifications:

Updated description.

Updated Chip-level AC specifications:

Updated description.

Updated I2C specifications:

Updated description.

Updated SPI specifications:

Updated description.

Updated to new template.

Completing Sunset Review.

Datasheet

41

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Please read the Important Notice and Warnings at the end of this document

Trademarks

All referenced product or service names and trademarks are the property of their respective owners.

IMPORTANT NOTICE

WARNINGS

The information given in this document shall in no Due to technical requirements products may contain

Edition 2023-05-11

Published by

event be regarded as a guarantee of conditions or dangerous substances. For information on the types

characteristics (“Beschaffenheitsgarantie”).

in question please contact your nearest Infineon

Technologies office.

With respect to any examples, hints or any typical

Infineon Technologies AG

81726 Munich, Germany

values stated herein and/or any information Except as otherwise explicitly approved by Infineon

regarding the application of the product, Infineon Technologies in a written document signed by

Technologies hereby disclaims any and all authorized

representatives

of

Infineon

warranties and liabilities of any kind, including Technologies, Infineon Technologies’ products may

without limitation warranties of non-infringement of not be used in any applications where a failure of the

intellectual property rights of any third party.

product or any consequences of the use thereof can

reasonably be expected to result in personal injury.

In addition, any information given in this document

is subject to customer’s compliance with its

obligations stated in this document and any

applicable legal requirements, norms and standards

concerning customer’s products and any use of the

product of Infineon Technologies in customer’s

applications.

Do you have a question about this

document?

Email:

erratum@infineon.com

The data contained in this document is exclusively

intended for technically trained staff. It is the

responsibility of customer’s technical departments

to evaluate the suitability of the product for the

intended application and the completeness of the

product information given in this document with

respect to such application.

Document reference

002-19012 Rev. *H


型号：	CYAT61659-64AA48
厂家：	Infineon
描述：	PSoC™ Automotive Multitouch Gen6L
文件：	总42页 (文件大小：467K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CYAT61659-64AA48 [INFINEON]

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