CYAT81658-64AS48 [INFINEON]
PSoC™ Automotive Multitouch Gen6L;
| 型号： | CYAT81658-64AS48 |
| 厂家： | 
Infineon |
| 描述： | PSoC™ Automotive Multitouch Gen6L |
| 文件： | 总52页 (文件大小：551K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CYAT8165X/7165X
PSoC™ Automotive Multitouch Generation
6L
Datasheet
Features
• Automotive Electronics Council (AEC) Q100 qualified
• Multitouch capacitive touchscreen (CYAT8165X)/trackpad (CYAT7165X) controller
- 32-bit Arm® Cortex® CPU
- Register-configurable
- Noise-suppression technologies for display and EMI
• Effective 20-V drive for higher signal-to-noise ratio (SNR)[1]
• AutoArmor improves both electromagnetic emissions and immunity
• External display synchronization
- Water rejection and wet-finger tracking using DualSense
- Multitouch glove with automatic mode switching
• Ten fingers with thin glove ( 1-mm thick)
• Two fingers with thick glove ( 5-mm thick)
- Large object rejection
- Automatic baseline tracking to environmental changes
- Low-power look-for-touch mode
- Field upgrades via bootloader
- Manufacturing Test Kit (MTK)
- Touchscreen sensor self-test
- Low power CAPSENSE™ wake-up button with power consumption of 50 µA
- Low power wake-on-touchscreen with power consumption of 120 µA
• System performance (configuration dependent)
- Screen sizes up to 8.5-inch diagonal
• 6.2-mm electrode pitch; 16:9 aspect ratio
- Up to 48 sense pins, 560 intersections; 16:9 aspect ratio (28 × 20)
- Reports up to 10 fingers
- Small finger support down to 4 mm
- Refresh rate up to 250 Hz; other rates configurable
- TX frequency up to 350 kHz
Note
1. Effective voltage when using 17 multi-phase TX and 5-V VCCTX supply.
Datasheet
www.infineon.com
Please read the Important Notice and Warnings at the end of this document
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Datasheet
Features
• Power (configuration-dependent)
- 1.71 V to 1.95 V and 3.0 V to 5.5 V logic and digital I/Os supply
- 3.0 V to 5.5 V analog supply
- 9-mW average power
- 11-µW typical deep-sleep power
• Sensor and system design (configuration-dependent)
- Supports a variety of touchscreen sensors and stackups
• Manhattan, diamond
• Sensor-on-Lens (SOL)
• On-cell
• Plastic (PET) and glass-sensor substrates
• LCD, AMOLED, and IPS displays
• Metal mesh
• Communication interface
- I2C slave at 100 and 400 kbps
- SPI slave bit rates up to 8 Mbps
• Package
- 100-pin TQFP 14 × 14 × 1.4 mm (0.5-mm pitch)
- 64-pin TQFP 10 × 10 × 1.4 mm (0.5-mm pitch)
- 56-pin QFN wettable flank, 8 × 8 × 1 mm (0.5-mm pitch)
• Ambient temperature range
- Automotive-A: –40°C to 85°C
- Automotive-S: –40°C to 105°C
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Table of contents
Table of contents
Features ...........................................................................................................................................1
Table of contents...............................................................................................................................3
1 Touchscreen system overview .........................................................................................................4
2 CYAT8165X/7165X overview.............................................................................................................5
3 Features overview ..........................................................................................................................6
3.1 AutoArmor...............................................................................................................................................................6
3.2 Water rejection........................................................................................................................................................6
3.3 Wet-finger tracking .................................................................................................................................................6
3.4 Glove........................................................................................................................................................................6
3.5 Automatic mode switching ....................................................................................................................................6
3.6 Large finger tracking...............................................................................................................................................6
3.7 Large object detection and rejection.....................................................................................................................6
3.8 Look-for-Touch .......................................................................................................................................................6
4 Touchscreen system specifications ..................................................................................................7
4.1 System performance specifications ......................................................................................................................7
5 System design options ....................................................................................................................9
5.1 CAPSENSE™ button/FPC support...........................................................................................................................9
5.2 Sensors ....................................................................................................................................................................9
6 Power supply information .............................................................................................................11
6.1 Required external components............................................................................................................................11
6.2 Voltage coefficient ................................................................................................................................................12
7 Power States summary .................................................................................................................15
8 Pin information ............................................................................................................................17
9 Electrical Specifications ................................................................................................................28
9.1 Absolute maximum ratings ..................................................................................................................................28
9.2 Operating temperature ........................................................................................................................................28
9.3 DC specifications...................................................................................................................................................29
9.3.1 Flash specifications............................................................................................................................................29
9.3.2 Chip-level DC specifications ..............................................................................................................................30
9.3.3 I/O port 0 (P0[0:1]) DC specifications ................................................................................................................31
9.3.4 I/O port 1 (P1[0:3]) and XRES DC specifications ...............................................................................................32
9.4 AC specifications...................................................................................................................................................33
9.4.1 SWD interface AC specifications........................................................................................................................33
9.4.2 Chip-level AC specifications ..............................................................................................................................33
9.4.3 I2C specifications ...............................................................................................................................................34
9.4.4 SPI specifications...............................................................................................................................................36
10 Packaging information ................................................................................................................37
10.1 Thermal impedance and moisture sensitivity...................................................................................................39
10.2 Solder reflow specifications ...............................................................................................................................39
11 Ordering information ..................................................................................................................40
11.1 Ordering code definitions...................................................................................................................................41
12 Reference documents..................................................................................................................42
13 Acronyms ...................................................................................................................................43
14 Document conventions................................................................................................................44
14.1 Units of measure .................................................................................................................................................44
14.2 Port nomenclature..............................................................................................................................................44
15 Glossary .....................................................................................................................................45
Revision history ..............................................................................................................................47
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Touchscreen system overview
1
Touchscreen system overview
3.0 V-4.7 V
1.8 V
1.0 ohm
1.0 ohm
4.7 µF
0.1 µF
1.0 µF
1.0 µF
1.0 µF
0.1 µF
0.1 µF
2
VDDA
VDDA_Q VCCD VDDD
/
I C SPI
Touchscreen
Sensor
RX
Sense
pins
Host Reset
Wake
Host
Processor
Touch
Controller
Interrupt
VSS
VSS
TX
Sense
pins
VCCTX
0.22 µF
Figure 1
CYAT8165X/7165X typical system diagram
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CYAT8165X/7165X overview
2
CYAT8165X/7165X overview
A capacitive touchscreen detects changes in capacitance to determine the location of one or more fingers on the
surface of the touchscreen. A typical touchscreen system consists of a capacitive touchscreen sensor, an FPC
bonded to the sensor, and the touchscreen controller mounted on the FPC. The FPC connects the touchscreen
controller to the host processor. Users can interact with the displayed user interface through finger movements
and gestures on the surface of the touchscreen.
CYAT8165X/7165X is a capacitive touchscreen controller with the sensing and processing technology to resolve
the locations and report the positions of up to ten fingers on the touchscreen. The touchscreen controller
converts an array of sensor capacitances into an array of digital values, which are processed by touch-detection
and position-resolution algorithms in the controller. These algorithms determine the location and signal
magnitude of each finger on the touchscreen.
Infineon provides:
• Application firmware
• Design guidance for the sensor and FPC
• Touchscreen sensor MTK
The CYAT8165X/7165X functional block diagram is shown in Figure 2. This device contains a high-performance
Arm® 32-bit CPU with an integrated hardware multiply unit. This CPU controls all sensing and processing of
measured capacitance results to allow tracking and reporting touches. The controller is optimized for low power
and fast response time, with built-in support for manufacturing test. The touchscreen controller communicates
with a host through an I2C slave interface at up to 400 kbps or an SPI interface at up to 8 Mbps.
CYAT8165X/7165X collects the touchscreen sensor information using the touch subsystem. This touch subsystem
consists of a 5-V TX pump, TX drivers, RX channels, and a programmable transmit/receive (TX/RX) multiplexer.
The multiplexer electrically connects the analog front end of each RX channel and TX driver to the appropriate
row and column electrodes of the touchscreen sensor.
The controller TX/RX multiplexer allows flexibility of chip placement on the FPC. All pins connecting to the
touchscreen sensor are programmable as either TX or RX. Reference documents are available under NDA through
your local Infineon sales representative. You can also direct your requests to automotive@infineon.com.
Figure 2
CYAT8165X/7165X functional block diagram
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Features overview
3
Features overview
3.1
AutoArmor
AutoArmor improves both electromagnetic emissions and immunity. It ensures no false finger touches when
CYAT8165X/7165X is exposed to electromagnetic waves.
3.2
Water rejection
Water droplets can cause false touches to be reported. However, CYAT8165X/7165X continues to operate in the
presence of water droplets or condensation. CYAT8165X/7165X enables water rejection using DualSense,
Infineon’s patented self- and mutual-capacitance sensing ability.
3.3
Wet-finger tracking
In a touchscreen system, moisture on fingers can cause false touches to be reported and make tracking of fingers
across the screen difficult. CYAT8165X/7165X can detect and track fingers that are wet and enable more robust
functionality of the touchscreen, using DualSense. This includes sweaty fingers touching the screen or fingers
moving across a mist-covered screen.
3.4
Glove
CYAT8165X/7165X detects and tracks gloved fingers. Glove support allows navigating the touchscreen without
having to remove gloves or without the use of expensive conductive gloves. Tracking of gloved fingers is
supported by automatic mode switching, which automatically transitions between tracking gloved fingers and
other touch-tracking modes. Ten-finger glove-touch is supported for thin gloves ( 1-mm thick) and two-finger
operation is supported for thick gloves ( 5-mm thick).
3.5
Automatic mode switching
CYAT8165X/7165X supports automatic mode switching which detects and tracks a new touch object type without
requiring manual selection of the touch type from the user. Automatic mode switching allows an uninterrupted
user experience when switching between a bare finger, gloved finger, fingernail, or wet finger.
3.6
Large finger tracking
A well-designed touchscreen system must correctly report a large finger or thumb as only a single touch. If this is
not supported, a large finger can incorrectly be reported as two or more touches, hampering the user experience.
When an object, such as a thumb, is pressed against the touchscreen sensor, CYAT8165X/7165X ensures that only
one touch is reported at the center of the object.
3.7
Large object detection and rejection
It is important to be able to detect the presence of a large object on the touchscreen sensor. Common example
is touching a palm on the screen when typing. CYAT8165X/7165X can determine the presence of a large object,
such as a fist or palm, from the touchscreen data. This presence may either be rejected or reported to the host.
3.8
Look-for-Touch
Look-for-touch is a low-power and fast-wakeup mode, in which the touchscreen sensor is measured for an
increase in self-capacitance. An increase in self-capacitance indicates that a touch is present. Because it is only
necessary to detect a finger’s presence, and not location, the sensing can be done at a much lower SNR, requiring less
time and power. Look-for-touch sensing is used to implement multiple functions, including wake-on-touch and fast
first-touch response.
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Touchscreen system specifications
4
Touchscreen system specifications
This section specifies the touchscreen system performance delivered by CYAT8165X/7165X. For definitions,
justification of parameters, and test methodologies, refer to the Infineon specification PSoC™ Automotive
Multitouch Touchscreen Controller User Interface Performance Definitions (001-49389)[2]
.
4.1
System performance specifications
The system performance specifications in Table 1[3] and Table 2[4] are valid under these conditions:
–40°C TA 85°C[5] for Grade-A devices, –40°C TA 105°C[5] for Grade-S devices; 1.71 V VDDD 1.95 V or
3.0 V VDDD 5.5 V, 1.71 V VCCD 1.95 V, 3.0 V VDDA 5.5 V, unless otherwise noted. Typical values are specified
at TA = 25°C, VDDD = VCCD = 1.8 V, core low dropout regulator (LDO) disabled, and VDDA = 3 V, unless otherwise
noted. Data is validated using a 7.4-inch sensor with 5.5-mm electrode pitch. Contact the Infineon sales
representative for information on the system performance conditions toguaranteethe specifications in Table 1.
The performance conditions and specifications are valid onlyfor sensors approved by Infineon for use with
CYAT8165X/7165X and produced by qualified Infineon partners. Contact automotive@infineon.com to discuss
any deviations.
Table 1
Category
Typical system performance specifications (Configuration dependent)
Conditions
6–12 mm diameter finger
Glove ( 1 mm thick)
Glove (1 < thick 5 mm)
Core
0.5
2
4
0.25
2
Unit
Accuracy
Linearity
mm
6–12 mm diameter finger
Glove ( 1 mm thick)
Glove (1< thick 5 mm)
4
Notes
2. Infineon reference documents are available under NDA through your local Infineon sales representative. You
can also direct your requests to automotive@infineon.com.
3. Typical, as represented by 85% of the sample data measured. Accuracy is measured at points across the entire
panel at 1.1-mm intervals. Linearity is measured on lines drawn across the panel (vertically, horizontally, and
diagonally) separated by 1.1 mm.
4. Typical, as represented by the average values from the Infineon specification, PSoC™ Automotive Multitouch
Touchscreen Controller User Interface Performance Definitions (001-49389).
5. System performance specifications are dependent on the combination of touch controller, display,
touchscreen, and environment noise and temperature. Infineon guarantees the performance of the touch
controller over this temperature range, but system performance may be impacted by the response of these
other elements.
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Touchscreen system specifications
Table 2
Category
System performance specifications (Configuration dependent)
Description
Conditions
Min
Typ
Max Unit
mm
Delta in reported X, Y
position, for non-moving
finger
Jitter
5–12 mm diameter finger
–
0.5
–
Refresh rate
Response
time
–
One finger on panel
First finger down
60
–
100 250[6] Hz
Active response time
–
30
ms
Low power
wake-up
button
Power consumption
In Active state
In Active Look-for-Touch
state
3.3 V, 100 ms scan rate
–
50
–
µA
1 finger, 60-Hz refresh rate
–
–
–
–
–
180
30
mW
µW
Power
Active state for 25% of touch
activity and in Deep Sleep state for
75% of touch activity.
Average power[7]
–
–
9
–
–
In Deep Sleep state
–
11
Notes
6. Requires setting TX pulses for mutual-cap and self-cap to 8 and no noise in the environment.
7. See “Power States summary” on page 15 for power state transition details and refresh interval
configuration for each state. Average power is the power consumed during the Active and Deep Sleep states,
and is calculated using this equation: 0.25 × 120 mW + 0.75 × 0.030 mW = 30 mW.
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System design options
5
System design options
5.1
CAPSENSE™ button/FPC support
The CYAT8165X/7165X controller supports a maximum of 10 physical CAPSENSE™ buttons.
Detailed FPC development guidelines, including EMI shielding, are available in the PSoC™ Automotive
Multitouch Touchscreen Controller Module Design Best Practices (001-50467).
5.2
Sensors
Infineon supports the following sensor patterns:
• Single-Solid Diamond (SSD)
• Dual-Solid Diamond (DSD)
• Manhattan-3 (MH3)
Figure 3 through Figure 5 show examples of SSD, DSD, and MH3 sensor patterns and unit cells.
Unit Cell
Screen
Row
Column
Figure 3
Single-solid diamond pattern and unit cell
Unit Cell
Screen
Row
Column
Figure 4
Dual-solid diamond unit cell
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System design options
Screen
Unit Cell
Row
Column
Figure 5
Manhattan-3 pattern and unit cell
Infineon continues to develop additional patterns and materials to increase performance and decrease system
cost.
The specific sensor pattern used varies based on the mechanical, electrical, optical, and cost constraints; all of
these factors must be considered for an optimal solution. Here are some examples:
• Overlays/lens thickness < 1 mm should not use SSD due to large signal disparity (SD).
• DCVCOM LCDs, with strong image-related noise, require an air gap, a shield layer, or a self-shielding pattern
such as MH3.
To learn more about how to design sensors using stackups and materials, see the PSoC™ Automotive
Multitouch Touchscreen Controller Module Design Best Practices (001-50467).
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Power supply information
6
Power supply information
CYAT8165X/7165X contains four power pins: VDDA, VDDA_Q, VDDD, and VCCD. VDDA supplies power to the chip’s
analog circuitry, TX pump, and drivers. VDDA_Q supplies power to the RX analog circuitry. VDDD supplies power
to the digital I/Os, core LDO regulator, supply monitors, and external reset circuitry (XRES). VCCD supplies power
to the CPU core, and may be configured as an input or output, depending on if a 1.71–1.95-V VDDD supply is used.
6.1
Required external components
The touch controller requires external components for proper device operation. Quantities are dependent on the
power supply configuration used. External capacitors require an X5R dielectric characteristic or better. It is
recommended to use an X7R dielectric characteristic or better for high-frequency 0.1-µF/0.22-µF capacitors.
VDDA:
• 1.0-, 5% tolerance resistor
• 0.1-µF capacitor
• 1-µF capacitor (2.2-µF in high low-frequency noise)
VDDA_Q:
• 1.0-, 5% tolerance resistor
• 0.1-µF capacitor
• 1-µF capacitor (2.2-µF in high low-frequency noise)
VDDD:
• 0.1-µF capacitor
• 4.7-µF capacitor
VCCD:
• 0.1-µF capacitor
VCCTX:
• 0.22-µF capacitor (configurations with the VCCTX pump enabled)
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Power supply information
6.2
Voltage coefficient
The actual capacitance of external capacitors may be reduced with higher bias voltage. Check the capacitor
datasheet for the voltage coefficient. Capacitors used for power supply decoupling or filtering are operated under
a continuous DC-bias. Many capacitors used with DC power across them provide less than their target
capacitance, and their capacitance is not constant across their working voltage range. When selecting capacitors
for use with this device verify that the selected components provide the required capacitance under the specific
operating conditions of temperature and voltage used in your design. While the temperature ratings of a
capacitor are normally found as part of its catalog part number (for example, X7R, C0G, Y5V), the matching voltage
coefficient may only be available on the component datasheet or direct from the manufacturer. Use of
components that do not provide the required capacitance under the actual operating conditions may cause the
device to perform to less than the datasheet specifications.
The available power configurations, with the TX pump enabled, are shown in Figure 6 and Figure 8. Figure 7,
Figure 9, and Figure 10 show power supply configurations with the TX pump disabled.
CYAT8165X
VDDD
VCCD
1.8 V ±5%
4.7 µF
1 µF 100 nF
1.0
VDDA_Q
VDDA
3.0 - 4.7 V
1 µF 100 nF
1.0
1 µF 100 nF
VCCTX
220 nF
GND
VSS
Figure 6
Dual supplies (inc. 1.8 V), TX pump enabled
CYAT8165X
VDDD
VCCD
1.8 V ±5%
4.7 F
1.0
1 F 100 nF
VDDA_Q
VDDA
3.0 - 5.5 V
1 F
100 nF
1.0
VCCTX
1 F 100 nF
GND
VSS
Figure 7
Dual supplies (inc. 1.8 V), TX pump disabled
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Power supply information
CYAT8165X
VDDD
VCCD
4.7 F
1.0
100 nF
100 nF
VDDA_Q
VDDA
3.0 - 4.7 V
1 F 100 nF
1.0
1 F
100 nF
VCCTX
220 nF
GND
VSS
VSS
Figure 8
Single supply, TX pump enabled
CYAT8165X
VDDD
VCCD
4.7 F
100 nF
100 nF
1.0
VDDA_Q
VDDA
3.0 - 5.5 V
1 F
100 nF
1.0
VCCTX
1 F 100 nF
GND
VSS
VSS
Figure 9
Single supply, TX pump disabled
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Power supply information
CYAT8165X
VDDD
VCCD
3.0 - 5.5 V
4.7 F
1.0
100 nF
100 nF
VDDA_Q
VDDA
3.0 - 5.5 V
1 F 100 nF
1.0
VCCTX
1 F
100 nF
GND
VSS
Figure 10
Dual supplies (no 1.8 V), TX pump disabled
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Power States summary
7
Power States summary
The CYAT8165X/7165X controller has four power states, illustrated in Figure 11:
• Active, where the touchscreen is actively scanned to determine the presence of a touch and identify the touch
coordinates.
• Active Look-for-touch, where the device performs a fast self-capacitive scan to determine if a touch exists.
• Low Power, where the touchscreen is scanned for touch presence at a much slower rate.
• Deep Sleep, where the touchscreen is not scanned and CYAT8165X/7165X is in a low power state with no
processing.
The CYAT8165X/7165X controller automatically manages transitions between three power states (Active, Active
Look-for-touch, and Low Power). The host can force transition in and out of the fourth power state (Deep Sleep).
The Active state emphasizes low refresh time for accurate finger tracking, the Active Look-for-touch state allows
fast first-touch response, and the Low Power state enables low power consumption during periods of no touch
activity. In all three states, the CYAT8165X/7165X controller periodically scans the panel to determine the
presence of a touch. If a touch is present, the controller either enters or remains in the Active state where it
identifies the touch coordinates. These tasks occur at different rates in the three states and the detection of
touches affects transitions between the states. Transition from Active to Active Look-for-touch occurs when no
touch is detected.
Host can request to disable Low-Power thus forcing CYAT81X controller to stay out of the Low-Power state at all
times for the fastest response to the first touch on the panel.
The following parameters configure power states, which can be configured by the host:
• Refresh Interval (register ACT_INTRVL) sets the minimum time between the start of subsequent touchscreen
scans in the Active state.
• Active Look-for-touch interval (register ACT_LFT_INTRVL) sets the minimum refresh time in the Active
Look-for-touch state.
• Active Mode Timeout (register TCH_TMOUT) sets the period of time in which no touch is detected during the
Active Look-for-touch state before transitioning to the Low Power state.
• Low-Power Interval (register LP_INTRVL) sets the time in the Low Power state between touchscreen scans.
• Deep Sleep is entered via a command from the host to move the device into the Deep Sleep state. Automatic
entry into the Low Power state is enabled by setting the LOW_POWER_ENABLE parameter.
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Power States summary
Launch Touch Application
Active
No Touch
Touch Detected
Touch Detected
Request
Set Power = SLEEP
Active
Look-for-
Touch
No Touch for greater than
TCH_ TMOUT
&
LOW_ POWER_ ENABLE
Request
Set Power
=SLEEP
Request
Set Power=ON
Wakeup from
Low Power Requested
Low Power
Deep Sleep
Request
Set Power= SLEEP
Figure 11
CYAT8165X/7165X power states and transitions
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Pin information
8
Pin information
CYAT8165X is available in 100-pin TQFP and 64-pin TQFP packages. CYAT7165X is available in a 56-pin QFN
package. This section lists pin names, descriptions, and mappings to the physical package. Input and output pins
may have more than one possible configuration. Guidance for each configuration option is provided below:
XY: XY pins may be configured as either transmit (TX) drive or receive (RX) sense, allowing each design to be
optimized based on the sensor pattern and layout. See PSoC™ Automotive Multitouch Touchscreen Controller
Module Design Best Practices (001-50467), for guidelines. To configure the device for lowest power, leave
unused XY pins unconnected. TX and RX pins are tied to VSS internally during the Deep Sleep power state.
P1: Unused port 1 pin should be left unconnected.
External Reset (XRES): If the XRES pin is unused, it must be connected to VDDD (either directly or through an
external resistor).
SWD: Serial wire debug (SWD) is the recommended programming mode for all designs. If SWD is not used on the
target board, use the bootloader to upgrade firmware.
Do Not Use (DNU): DNU pins must be left unconnected to ensure proper device operation.
COMM_INT: The COMM_INT pin is required. This interrupt pin is used for the host communication. If resistive
mode is used, note that all I/Os are Hi-Z during chip initialization (after XRES or Bootloader Exit), so an additional
external resistor is recommended.
P1[0] (WAKE): Wake pin indicates the status of the low power wake up button.
P1[1] (HOST RESET): The Host reset pin is used to send a reset pulse to the host controller on specific predefined
conditions on low power wake up button.
Pin Configurations: Multiple pin configurations are supported using the Touch Tuning Host Emulator (TTHE)
software. Pins are configured using the TTHE Pin Configuration Wizard.
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Pin information
Table 3
Pin No.
100-pin TQFP Pin List
Type
Name
Description
TX/RX sense pin 19, RX channel 4
Digital
Analog
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
–
1
XY19
XY18
XY17
XY16
XY15
XY14
XY13
XY12
XY11
XY10
XY09
XY08
XY07
XY06
XY05
XY04
DNU
DNU
DNU
DNU
DNU
DNU
DNU
XY03
XY02
XY01
XY00
VSS
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
2
TX/RX sense pin 18, RX channel 3
TX/RX sense pin 17, RX channel 2
TX/RX sense pin 16, RX channel 1
TX/RX sense pin 15, RX channel 0
TX/RX sense pin 14, RX channel 8
TX/RX sense pin 13, RX channel 7
TX/RX sense pin 12, RX channel 6
TX/RX sense pin 11, RX channel 5
TX/RX sense pin 10, RX channel 4
TX/RX sense pin 09, RX channel 3
TX/RX sense pin 08, RX channel 2
TX/RX sense pin 07, RX channel 1
TX/RX sense pin 06, RX channel 0
TX/RX sense pin 05, RX channel 8
TX/RX sense pin 04, RX channel 7
Do not use
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
–
Do not use
–
Do not use
–
Do not use
–
Do not use
–
Do not use
–
Do not use
I/O
I/O
I/O
I/O
TX/RX sense pin 03, RX channel 6
TX/RX sense pin 02, RX channel 5
TX/RX sense pin 01, RX channel 4
TX/RX sense pin 00, RX channel 3
Connect to ground
Power
P0[0]
P0[1]
XRES
P1[0]
P1[1]
P1[2]
P1[3]
DNU
I/O
I/O
I
–
–
–
–
–
–
–
–
I2C SCL / SPI SCLK
I2C SDA / SPI MOSI
External active LOW reset, no internal pull-up
SWDCLK / SPI MISO / EXT_START / WAKE
SWDIO / SPI SS / EXT_SYNC / HOST_RESET
ERROR - Set high when internal error is detected
COMM_INT
I/O
I/O
I/O
I/O
–
Do not use
Datasheet
18
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Datasheet
Pin information
Table 3
Pin No.
100-pin TQFP Pin List (continued)
Type
Name
Description
Digital
Analog
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
DNU
DNU
DNU
DNU
VCCD
VDDD
VSS
–
–
–
–
–
–
–
–
Do not use
Do not use
Do not use
Do not use
Power
Digital core power supply input/output
Digital power supply input
Connect to ground
Power
Power
Power
Power
Power
Power
VSS
Connect to ground
VDDA
VDDA_Q
VCCTX
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
XY47
XY46
DNU
XY45
XY44
XY43
XY42
XY41
XY40
DNU
DNU
DNU
XY39
XY38
XY37
XY36
XY35
XY34
TX analog power supply input
RX analog power supply input
TX pump reservoir and filter capacitor connection point
Do not use
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Do not use
–
Do not use
–
Do not use
–
Do not use
–
Do not use
–
Do not use
–
Do not use
I/O
I/O
–
TX/RX sense pin 47, RX channel 16
TX/RX sense pin 46, RX channel 15
Do not use
I/O
I/O
I/O
I/O
I/O
I/O
–
TX/RX sense pin 45, RX channel 14
TX/RX sense pin 44, RX channel 13
TX/RX sense pin 43, RX channel 12
TX/RX sense pin 42, RX channel 11
TX/RX sense pin 41, RX channel 10
TX/RX sense pin 40, RX channel 9
Do not use
–
Do not use
–
Do not use
I/O
I/O
I/O
I/O
I/O
I/O
TX/RX sense pin 39, RX channel 16
TX/RX sense pin 38, RX channel 15
TX/RX sense pin 37, RX channel 14
TX/RX sense pin 36, RX channel 13
TX/RX sense pin 35, RX channel 12
TX/RX sense pin 34, RX channel 11
Datasheet
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Pin information
Table 3
Pin No.
100-pin TQFP Pin List (continued)
Type
Name
Description
Digital
Analog
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
–
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
XY33
XY32
XY31
XY30
XY29
XY28
XY27
XY26
XY25
XY24
DNU
DNU
VSS
–
–
–
–
–
–
–
–
–
–
–
–
TX/RX sense pin 33, RX channel 10
TX/RX sense pin 32, RX channel 9
TX/RX sense pin 31, RX channel 16
TX/RX sense pin 30, RX channel 15
TX/RX sense pin 29, RX channel 14
TX/RX sense pin 28, RX channel 13
TX/RX sense pin 27, RX channel 12
TX/RX sense pin 26, RX channel 11
TX/RX sense pin 25, RX channel 10
TX/RX sense pin 24, RX channel 9
Do not use
–
Do not use
Power
Connect to ground
DNU
DNU
DNU
DNU
DNU
DNU
DNU
XY23
XY22
DNU
DNU
XY21
XY20
DNU
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Do not use
Do not use
–
Do not use
–
Do not use
–
Do not use
–
Do not use
–
Do not use
I/O
I/O
–
TX/RX sense pin 23, RX channel 8
TX/RX sense pin 22, RX channel 7
Do not use
–
Do not use
I/O
I/O
–
TX/RX sense pin 21, RX channel 6
TX/RX sense pin 20, RX channel 5
Do not use
Datasheet
20
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Pin information
XY19
XY18
XY17
XY16
XY15
XY14
XY13
XY12
XY11
XY10
XY09
XY08
XY07
XY06
XY05
XY04
DNU
DNU
DNU
DNU
DNU
DNU
DNU
XY03
XY02
1
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
XY32
XY33
XY34
XY35
XY36
XY37
XY38
XY39
DNU
DNU
DNU
XY40
XY41
XY42
XY43
XY44
XY45
DNU
XY46
XY47
DNU
DNU
DNU
DNU
DNU
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
CYAT8165X
100-Pin TQFP
48 Sense I/O
Figure 12
100-pin TQFP pinout[8]
Note
8. See “Pin information” on page 17 for details on pin configuration.
Datasheet
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Datasheet
Pin information
Table 4
Pin No.
64-pin TQFP pin list
Type
Name
Description
TX/RX sense pin 17, Rx channel 2
Digital
Analog
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
1
XY17
XY16
XY15
XY14
XY13
XY12
XY11
XY10
XY09
XY08
XY07
XY06
XY05
XY04
XY03
XY02
XY01
XY00
VSS
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
2
TX/RX sense pin 16, Rx channel 1
TX/RX sense pin 15, Rx channel 0
TX/RX sense pin 14, Rx channel 8
TX/RX sense pin 13, Rx channel 7
TX/RX sense pin 12, Rx channel 6
TX/RX sense pin 11, Rx channel 5
TX/RX sense pin 10, Rx channel 4
TX/RX sense pin 09, Rx channel 3
TX/RX sense pin 08, Rx channel 2
TX/RX sense pin 07, Rx channel 1
TX/RX sense pin 06, Rx channel 0
TX/RX sense pin 05, Rx channel 8
TX/RX sense pin 04, Rx channel 7
TX/RX sense pin 03, Rx channel 6
TX/RX sense pin 02, Rx channel 5
TX/RX sense pin 01, Rx channel 4
TX/RX sense pin 00, Rx channel 3
Connect to ground
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
Power
P0[0]
P0[1]
XRES
P1[0]
P1[1]
P1[2]
P1[3]
VCCD
VDDD
VSS
I/O
I/O
I
–
–
–
–
–
–
–
I2C SCL / SPI SCLK
I2C SDA / SPI MOSI
External active LOW reset, no internal pull-up
SWDCLK / SPI MISO / EXT_START / WAKE
SWDIO / SPI SS / EXT_SYNC / HOST_RESET
ERROR - Set high when internal error is detected
COMM_INT
I/O
I/O
I/O
I/O
Power
Digital core power supply input/output
Digital power supply input
Power
Power
Power
Power
Power
Power
Connect to ground
VSS
Connect to ground
VDDA
VDDA_Q
VCCTX
XY47
XY46
XY45
Tx/Rx power supply input
Tx/Rx power supply input
TX pump reservoir and filter capacitor connection point
TX/RX sense pin 47, Rx channel 16
TX/RX sense pin 46, Rx channel 15
TX/RX sense pin 45, Rx channel 14
–
–
–
I/O
I/O
I/O
Datasheet
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Datasheet
Pin information
Table 4
Pin No.
64-pin TQFP pin list (continued)
Type
Name
Description
TX/RX sense pin 44, Rx channel 13
Digital
Analog
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
XY44
XY43
XY42
XY41
XY40
XY39
XY38
XY37
XY36
XY35
XY34
XY33
XY32
XY31
XY30
XY29
XY28
XY27
XY26
XY25
XY24
VSS
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
TX/RX sense pin 43, Rx channel 12
TX/RX sense pin 42, Rx channel 11
TX/RX sense pin 41, Rx channel 10
TX/RX sense pin 40, Rx channel 09
TX/RX sense pin 39, Rx channel 16
TX/RX sense pin 38, Rx channel 15
TX/RX sense pin 37, Rx channel 14
TX/RX sense pin 36, Rx channel 13
TX/RX sense pin 35, Rx channel 12
TX/RX sense pin 34, Rx channel 11
TX/RX sense pin 33, Rx channel 10
TX/RX sense pin 32, Rx channel 09
TX/RX sense pin 31, Rx channel 16
TX/RX sense pin 30, Rx channel 15
TX/RX sense pin 29, Rx channel 14
TX/RX sense pin 28, Rx channel 13
TX/RX sense pin 27, Rx channel 12
TX/RX sense pin 26, Rx channel 11
TX/RX sense pin 25, Rx channel 10
TX/RX sense pin 24, Rx channel 09
Connect to ground
Power
XY23
XY22
XY21
XY20
XY19
XY18
–
–
–
–
–
–
I/O
I/O
I/O
I/O
I/O
I/O
TX/RX sense pin 23, Rx channel 8
TX/RX sense pin 22, Rx channel 7
TX/RX sense pin 21, Rx channel 6
TX/RX sense pin 20, Rx channel 5
TX/RX sense pin 19, Rx channel 4
TX/RX sense pin 18, Rx channel 3
Datasheet
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Pin information
XY17
XY16
XY15
XY14
XY13
XY12
XY11
XY10
XY09
XY08
XY07
XY06
XY05
XY04
XY03
XY02
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
XY33
XY34
XY35
XY36
XY37
XY38
XY39
XY40
XY41
XY42
XY43
2
3
4
5
6
7
CYAT8165X
64-Pin TQFP
48 Sense I/O
8
9
10
11
12
13
14
15
16
XY44
XY45
XY46
XY47
VCCTX
Figure 13
64-pin TQFP pinout[9]
Note
9. See “Pin information” on page 17 for details on pin configuration.
Datasheet
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Pin information
Table 5
Pin
56-pin QFN pin list
Type
Name
Description
TX/RX sense pin 13, RX channel 0
Digital
Analog
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
1
XY13
XY12
XY11
XY10
XY09
XY08
XY07
XY06
XY05
XY04
XY03
XY02
XY01
XY00
VSS
–
–
–
–
–
–
–
–
–
–
–
–
–
–
2
TX/RX sense pin 12, RX channel 8
TX/RX sense pin 11, RX channel 7
TX/RX sense pin 10, RX channel 6
TX/RX sense pin 09, RX channel 5
TX/RX sense pin 08, RX channel 4
TX/RX sense pin 07, RX channel 3
TX/RX sense pin 06, RX channel 2
TX/RX sense pin 05, RX channel 1
TX/RX sense pin 04, RX channel 0
TX/RX sense pin 03, RX channel 8
TX/RX sense pin 02, RX channel 7
TX/RX sense pin 01, RX channel 6
TX/RX sense pin 00, RX channel 5
Connect to ground
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
Power
P0[0]
P0[1]
XRES
P1[0]
P1[1]
P1[2]
P1[3]
VCCD
VDDD
VSS
I/O
I/O
I
–
–
–
–
–
–
–
I2C SCL / SPI SCLK
I2C SDA / SPI MOSI
External active LOW reset, no internal pull-up
SWDCLK / SPI MISO / EXT_START / WAKE
SWDIO / SPI SS / EXT_SYNC / HOST_RESET
ERROR - Set high when internal error is detected
COMM_INT
I/O
I/O
I/O
I/O
Power
Digital core power supply input/output
Digital power supply input
Power
Power
Power
Power
Power
Connect to ground
VSS
Connect to ground
VDDA
VCCTX
XY40
XY39
XY38
XY37
XY36
XY35
XY34
XY33
Tx/Rx power supply input
TX pump reservoir and filter capacitor connection point
TX/RX sense pin 40, RX channel 13
TX/RX sense pin 39, RX channel 12
TX/RX sense pin 38, RX channel 11
TX/RX sense pin 37, RX channel 10
TX/RX sense pin 36, RX channel 9
TX/RX sense pin 35, RX channel 16
TX/RX sense pin 34, RX channel 15
TX/RX sense pin 33, RX channel 14
–
–
–
–
–
–
–
–
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Datasheet
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Pin information
Table 5
Pin
56-pin QFN pin list (continued)
Type
Name
Description
TX/RX sense pin 32, RX channel 13
Digital
Analog
I/O
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
XY32
XY31
XY30
XY29
XY28
XY27
XY26
XY25
XY24
XY23
XY22
VSS
–
–
–
–
–
–
–
–
–
–
–
I/O
TX/RX sense pin 31, RX channel 12
TX/RX sense pin 30, RX channel 11
TX/RX sense pin 29, RX channel 16
TX/RX sense pin 28, RX channel 15
TX/RX sense pin 27, RX channel 14
TX/RX sense pin 26, RX channel 13
TX/RX sense pin 25, RX channel 12
TX/RX sense pin 24, RX channel 11
TX/RX sense pin 23, RX channel 10
TX/RX sense pin 22, RX channel 9
Connect to ground
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Power
XY21
XY20
XY19
XY18
XY17
XY16
XY15
XY14
–
–
–
–
–
–
–
–
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
TX/RX sense pin 21, RX channel 8
TX/RX sense pin 20, RX channel 7
TX/RX sense pin 19, RX channel 6
TX/RX sense pin 18, RX channel 5
TX/RX sense pin 17, RX channel 4
TX/RX sense pin 16, RX channel 3
TX/RX sense pin 15, RX channel 2
TX/RX sense pin 14, RX channel 1
Datasheet
26
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2023-05-09
PSoC™ Automotive Multitouch Generation 6L
Datasheet
Pin information
XY13
XY12
XY11
XY10
XY09
XY08
XY07
XY06
XY05
XY04
XY03
XY02
XY01
XY00
1
42
41
40
39
38
37
36
35
34
33
32
31
30
29
XY27
XY28
XY29
XY30
XY31
XY32
XY33
XY34
XY35
XY36
XY37
XY38
XY39
XY40
2
3
4
5
CYAT7165X
56-Pin QFN
41 Sense I/O
6
7
8
9
10
11
12
13
14
Figure 14
56-pin QFN pinout[10]
Note
10.See “Pin information” on page 17 for details on pin configuration.
Datasheet
27
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Electrical Specifications
9
Electrical Specifications
This section lists CYAT8165X/7165X DC and AC electrical specifications.
9.1
Absolute maximum ratings
Table 6
Absolute maximum ratings
Description
Symbol
Conditions
Min
–55
VSS – 0.5
VSS – 0.5
–
Typ
25
–
–
–
Max
125
6
6
100
Unit
°C
V
TSTG
Storage temperature
Digital supply voltage
Analog supply voltage
Amplitude (VPP) of digital
(VDDD) supply ripple riding
on the DC voltage
Amplitude (VPP) of analog
(VDDA) supply ripple riding
on the DC voltage (TX pump
enabled)
–
–
–
VDDD
VDDA
VDDDR
DC to 20 MHz
mV
[11]
VDDAR
DC to 20 MHz
–
–
100
Amplitude (VPP) of analog
(VDDA) supply ripple riding
on the DC voltage (TX pump
disabled)
DC to 150 kHz[12]
150 kHz[12] to 20 MHz
–
–
–
–
15
15 +
20 dB/decade
>150 kHz[12]
VCCD
VGPIO
Core supply voltage
Port 0 pin voltage
Port 0 pin voltage
Port 1 pin voltage
Current into I/O pin
–
VSS – 0.5
VSS – 0.5
VSS – 0.5
VSS – 0.5
–25
–
–
–
–
–
–
2.3
6
7
V
Driver enabled
Driver disabled
–
–
VDDD + 0.5
IIO
ESDCDM
50
–
mA
V
Electrostatic discharge
voltage
Charge device model
1500
ESDHBM
Electrostatic discharge
voltage
Human body model
5000
–
–
9.2
Operating temperature
Table 7
Symbol
TA
Operating temperature
Description
Ambient temperature
(A-grade)
Ambient temperature
(S-grade)
Conditions
Min
–40
Typ
–
Max
85
Unit
°C
–
–
TA
–40
–
105
Note
11.Analog supply ripple specifications are valid for the supply presented to the external resistor (for example,
label “V” in Figure 6), not at the device VDDA and VDDA_Q pin.
12.If a 2.2-µF capacitor is used in place of a 1-µF capacitor, the threshold is 80 kHz.
Datasheet
28
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Datasheet
Electrical Specifications
9.3
DC specifications
The specifications in this section are valid under these conditions:
–40°C TA 85°C for Grade-A devices, –40°C TA 105°C for Grade-S devices.
9.3.1
Flash specifications
The specifications in Table 8 are valid under these conditions: 1.71 V VDDD 1.95 V or 3.0 V VDDD 5.5 V,
1.71 V VCCD 1.95 V, and 3.0 V VDDA 5.5 V. Typical values are specified at TA = 25°C, VDDD = VCCD = 1.8 V, core
LDO disabled, and VDDA = 3.0 V.
Table 8
Symbol
Flash specifications
Description
Conditions
Min
Typ
Max
Unit
FlashENPB Flash write endurance
Erase/write cycles per
block
Following maximum Flash
write cycles (FlashENPB),
TA 55°C
Following maximum Flash
write cycles (FlashENPB),
TA > 55°C
10,000
–
–
cycles
FlashDR
Flash data retention
20[13]
–
–
–
–
years
10[13]
Note
13.Storing programmed devices at or above the ambient temperature specified by FlashDR may reduce flash
data retention time. Infineon provides a retention calculator to calculate the retention lifetime based on
customer’s individual temperature profiles for operation over the ambient temperature range for the
device’s temperature rating. For more information, contact our support team at support@infineon.com.
Datasheet
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Datasheet
Electrical Specifications
9.3.2
Chip-level DC specifications
The specifications in Table 9 are valid under these conditions: 1.71 V VDDD 1.95 V or 3.0 V VDDD 5.5 V,
1.71 V VCCD 1.95 V, and 3.0 V VDDA 5.5 V. Typical values are specified at TA = 25°C, VDDD = VCCD = 1.8 V, core
LDO disabled, and VDDA = 3.0 V.
Table 9
Symbol
Chip-Level DC specifications
Description
Conditions
Min
Typ
Max
Unit
VDDD
Digital supply voltage
Core LDO enabled
(VCCD output)
3.0
–
5.5
V
Core LDO disabled
1.71
–
1.8
1.8
1.8
1.95
–
(VCCD input)[14]
VCCD
Digital core supply
voltage
Core LDO enabled
(VCCD output)
Core LDO disabled
1.71
1.95
(VCCD input)[14]
[14]
VDDA
Analog supply voltage TX pump enabled
TX pump disabled
3.0
3.0
3.0
–
–
–
4.7
5.5
5.5
VCCTX
VCCTX supply operating Input to external
voltage range
low-pass filter, external
VCCTX configuration
PSARAMP
VDDA ramp rate from
ground to minimum
voltage
VDDD ramp rate from
ground to minimum
voltage
–
–
–
–
–
–
–
100
40
V/ms
PSDRAMP
1[15]
1[15]
PSDRAMPDOWN
VDDD ramp down rate
from 1.5 V to 1.0 V
40
IDDD_ACT
IDDA_ACT
IDDD_DS
IDDA_DS
IDDD_XR
VDDD active current
VDDA active current
VDDD deep sleep current –
VDDA deep sleep current –
VDDD current,
XRES = LOW
–
–
–
–
–
–
–
–
–
20
15
3
2
5
50
20
–
–
–
mA
µA
1.71 V VDDD 1.95 V
3.0 V VDDD 5.5 V
–
1
25
–
–
IDDA_XR
IDDD_P
VDDA current,
XRES = LOW
VDDD flash
–
–
5
25
mA
programming and flash
verify current
Notes
14.These Min and Max limits are inclusive of noise. For proper operation, VDDA or VDDD with combined noise
cannot go below or above the specified Min or Max limits.
15.If minimum ramp rate cannot be met, XRES should be asserted during voltage ramp (1.5 V > VDDD >1.0 V for
ramp-down or until voltage is stable for ramp-up). Note that a glitch on the I2C bus could occur during
voltage ramp in this case.
Datasheet
30
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2023-05-09
PSoC™ Automotive Multitouch Generation 6L
Datasheet
Electrical Specifications
9.3.3
I/O port 0 (P0[0:1]) DC specifications
The port 0 specifications in Table 10 are valid under these conditions: 1.71 V VDDD 1.95 V or
3.0 V VDDD 5.5 V, 1.71 V VCCD 1.95 V, and 3.0 V VDDA 5.5 V. Typical values are specified at TA = 25°C,
VDDD = VCCD = 1.8 V, core LDO disabled, and VDDA = 3.0 V.
Table 10
Symbol
VIH
I/O port 0 (P0[0:1]) DC specifications
Description
Conditions
Min
0.7 × VDDD
0.7 × VEXT
Typ
–
–
Max
–
–
Unit
V
Input high voltage
CMOS mode
1.8-V mode, VEXT[16] = 1.8 V,
3.0 V VDDD 5.5 V
VIL
Input low voltage
CMOS mode
–
–
–
–
0.3 × VDDD
0.3 × VEXT
1.8-V mode, VEXT[16] = 1.8 V,
3.0 V VDDD 5.5 V
VOH
High output voltage
Reference to VDDD
,
V
DDD – 0.5
–
–
–
–
IOH = 1 mA, VDDD = 1.8 V
Reference to VDDD
,
VDDD – 0.6
I
OH = 4 mA, VDDD = 3.0 V
VOL
Low output voltage
Input hysteresis
Output rise time Fast-Strong 25 pF load,
10%–90% VDDD = 3.3 V
V
V
–
DDD 1.71 V, IOL = 10 mA
DDD 1.71 V, IOL = 3 mA
–
–
–
–
–
0.6
0.4
–
–
0.1 × VDDD
2
VH
TRISE_OV
12
ns
Output rise time
Slow-Strong
Output fall time Fast-Strong 25 pF load,
10%–90% VDDD = 3.3 V
Output fall time
Slow-Strong
Input leakage current
(absolute value)
25 pF load,
10%–90% VDDD = 3.3 V
10
1.5
10
–
–
–
60
12
60
TFALL_OV
25 pF load,
10%–90% VDDD = 3.3 V
TA = 25°C, VDDD = 3.0 V
TA = 25°C, VDDD = 0.0 V
[17]
IIL
–
–
–
–
–
–
14
10
7
nA
µA
pF
CIN
Input pin capacitance
Package and pin dependent
TA = 25°C
COUT
RINT
Output pin capacitance
Package and pin dependent
TA = 25°C
–
–
7
Internal pull-up / pull-down Pin configured for internal
resistance
3.5
5.6
8.5
k
pull-up or pull-down; note
that all I/Os are Hi-Z during
chip initialization (after XRES
or Bootloader Exit)
Notes
16.VEXT is the external supply used to bias the pull-up resistor when used on an I2C bus.
17.Gang tested with all I/Os to 1 µA.
Datasheet
31
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Electrical Specifications
9.3.4
I/O port 1 (P1[0:3]) and XRES DC specifications
The specifications in Table 11 are valid under these conditions: 1.71 V VDDD 1.95 V or 3.0 V VDDD 5.5 V,
1.71 V VCCD 1.95 V, and 3.0 V VDDA 5.5 V. Typical values are specified at TA = 25°C, VDDD = VCCD = 1.8 V, core
LDO disabled, and VDDA = 3.0 V.
Table 11
Symbol
VIH
I/O port 1 (P1[0:3]) and XRES DC specifications
Description Conditions
Min
Typ
–
Max
Unit
Input voltage high threshold 1.8-V configuration
1.26
–
V
CMOS configuration
0.7 × VDDD
–
–
XRES
Input voltage low threshold 1.8-V configuration
CMOS configuration
1.35
–
–
VIL
–
–
0.54
–
–
0.3 × VDDD
XRES
–
–
0.45
–
VOH
VOL
High output voltage
Low Output Voltage
Input hysteresis voltage
IOH = 4 mA, VDDD = 3.0 V
OH = 1 mA, VDDD = 1.8 V
IOL = 8 mA, VDDD = 3.3 V
OL = 4 mA, VDDD = 1.8 V
VDDD – 0.6
–
I
VDDD – 0.5
–
–
–
–
0.6
0.6
–
I
–
0.1 × VDDD
2
–
VH
–
–
TRISE_G
Output rise time Fast-Strong 25 pF load,
10%–90% VDDD = 3.3 V
–
12
ns
Output rise time
Slow-Strong
25 pF load,
10%–90% VDDD = 3.3 V
–
2
–
–
60
12
60
2
TFALL_G
Output fall time Fast-Strong 25 pF load,
10%–90% VDDD = 3.3 V
Output fall time
Slow-Strong
25 pF load,
10%–90% VDDD = 3.3 V
–
–
[18]
IIL
Input leakage (absolute
value)
–
–
nA
pF
CIN
Input pin capacitance
Package and pin dependent
TA = 25°C
–
–
7
COUT
Output pin capacitance
Package and pin dependent
TA = 25°C
–
–
7
[19]
RINT
Internal pull-up/pull-down Pin configured for internal
resistance pull-up or pull-down
3.5
5.6
8.5
k
Notes
18.Gang tested with all I/Os to 1 µA.
19.XRES is input only with no internal pull-up or pull-down resistor.
Datasheet
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Electrical Specifications
9.4
AC specifications
The specifications in this section are valid under these conditions:
–40°C TA 85°C for Grade-A devices, –40°C TA 105°C for Grade-S devices.
9.4.1
SWD interface AC specifications
The specifications in Table 12 are valid under these conditions: 1.71 V VDDD 1.95 V or 3.0 V VDDD 5.5 V,
1.71 V VCCD 1.95 V, 3.0 V VDDA 5.5 V, and CLOAD = 25 pF. Typical values are specified at TA = 25°C,
VDDD = VCCD = 1.8 V, core LDO disabled, and VDDA = 3.0 V.
Table 12
Symbol
fSWDCLK
SWD interface AC specifications
Description
Conditions
Min
–
–
Typ
–
–
Max
14
8
Unit
MHz
SWDCLK frequency
3.3 V VDDD 5 V
1.71 V VDDD 3.3 V
T = 1 / fSWDCLK
TSWDI_SETUP SWDIO input setup before
SWDCLK HIGH
T / 4
–
–
ns
TSWDI_HOLD SWDIO input hold after
SWDCLK HIGH
TSWDO_VALID SWDCLK HIGH to SWDIO
output valid
TSWDO_HOLD SWDIO output hold after
SWDCLK HIGH
T = 1 / fSWDCLK
T = 1 / fSWDCLK
T = 1 / fSWDCLK
T / 4
–
–
–
–
T / 2
–
–
1
9.4.2
Chip-level AC specifications
The specifications in Table 13 are valid under these conditions: 1.71 V VDDD 1.95 V or 3.0 V VDDD 5.5 V,
1.71 V VCCD 1.95 V, and 3.0 V VDDA 5.5 V. Typical values are specified at TA = 25°C, VDDD = VCCD = 1.8 V, core
LDO disabled, and VDDA = 3.0 V.
Table 13
Symbol
Chip-Level AC specifications
Description
Conditions
Min Typ Max Unit
TXRST
After VDDD is valid
10
–
–
–
–
µs
External reset (XRES) pulse width
Time from deassertion of XRES to
COMM_INT
TREADY
–
35
ms
TCAL
FIMOTOL1
Calibration routine execution time –
Frequency variation at 37 MHz and –
48 MHz
–
–
–
–
2000
2
%
TCOMM_EXIT_CRC
Time from EXIT BTLDR command POST_SHORT_OPEN_CTRL
–
40
–
ms
(with CRC checking) to SYS INFO
MODE
- “Disabled All” [20]
TREADY
XRES
COMM_INT
Figure 15
Note
COMM_INT timing diagram
20.For other POST_SHORT_OPEN_CTRL settings, the additional test time is project dependent.
Datasheet
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Electrical Specifications
9.4.3
I2C specifications
The specifications in Table 14 are valid under these conditions: 1.71 V VDDD 1.95 V or 3.0 V VDDD 5.5 V,
1.71 V VCCD 1.95 V, and 3.0 V VDDA 5.5 V. Typical values are specified at TA = 25°C, VDDD = VCCD = 1.8 V, core
LDO disabled, and VDDA = 3.0 V. CYAT8165X/7165X does not require a clock-stretch capable host, but is fully
compatible with systems that perform clock-stretching.
To ensure proper I2C functionality in extreme bus conditions, refer to Infineon’s application note Using
CY8CTMA4/5XX I2C in Systems With Slow Clock Edges (001-81514)[21]
.
Important Note: The P0[0] and P0[1] pins have I/O cells optimized for use on multi-drop buses. When the touch
device is powered off, the pin drivers do not load the attached bus, such that other devices attached to them may
continue to communicate.
TSUDATI2C
70%
30%
70%
30%
SDA
SCL
1/fSCL
THDSTAI2C
TSPI2C
TLOWI2C
TBUFI2C
70%
30%
70%
30%
THIGHI2C
TSUSTAI2C
TSUSTOI2C
THDDATI2C
THDSTAI2C
Sr
P
S
S
Legend
S: I2C Start Condition
Sr: I2C Repeat Start Condition
P: I2C Stop Condition
Figure 16
I2C bus timing diagram for fast/standard mode
Note
21.Extreme bus conditions are considered to be a combination of the following conditions: High-capacitive bus
load, slow SCL fall time, and fast SDA rise/fall time. Infineon reference documents are available under NDA
through your local Infineon sales representative. You can also direct your requests to
automotive@infineon.com.
Datasheet
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Electrical Specifications
Table 14
Symbol
fSCLI2C
AC characteristics of the I2C SDA and SCL pins
Description
Standard Mode
Fast Mode
Unit
Min
0
Max
100
–
Min
Max
400
–
SCL clock frequency
0
kHz
µs
THDSTAI2C Hold time (repeated) start condition. After this
period, the first clock pulse is generated.
4
0.6
TLOWI2C
THIGHI2C
LOW period of SCL clock
HIGH period of SCL clock
4.7
4
–
–
1.3
0.6
–
–
TSUSTAI2C Setup time for repeated start condition
THDDATI2C Data hold time
4.7
0
–
–
0.6
0
–
–
TSUDATI2C Data setup time
TVDDATI2C Data valid time
TVDACKI2C Data acknowledge time
TSUSTOI2C Setup time for stop condition
250
–
–
4
–
100
–
–
0.6
–
ns
µs
3.45
3.45
–
0.9
0.9
–
VHH
Input hysteresis high voltage,
1.71 V VDDD 1.95 V or 3.0 V VDDD 5.5 V
0.1 × VDDD
–
0.1 × VDDD
–
V
TBUFI2C
TSPI2C
Bus free time between a stop and start condition
Pulse width of spikes that are suppressed by
input filter
4.7
–
–
–
1.3
50
–
–
µs
ns
CBUS
VIL_I2C
VIH_I2C
Capacitance load for SDA or SCL
Input low voltage
Input high voltage
–
–0.5
0.7 × VDDD
400
0.3 × VDDD
–
–0.5
0.7 × VDDD
400
0.3 × VDDD
pF
V
–
–
VOL_I2C_L Output low voltage (VDDD 2 V, 3 mA sink)
–
0.2 × VDDD
–
0.2 × VDDD
VOL_I2C_H Output low voltage (VDDD > 3 V, 3 mA sink)
–
–
–
0.4
3
–
–
–
–
0.4
3
6
IOL_I2C
VH_I2C
Output low current
Output low current VOL = 0.6 V
Input hysteresis
mA
mV
0.1 × VDDD
–
0.1 × VDDD
–
Datasheet
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002-10076 Rev. *S
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Electrical Specifications
9.4.4
SPI specifications
The specifications listed in Table 15 are valid under these conditions: 1.71 V VDDD 1.95 V or
3.0 V VDDD 5.5 V, 1.71 V VCCD 1.95 V, 3.0 V VDDA 5.5 V, and CLOAD = 25 pF. Typical values are specified at
TA = 25°C, VDDD = VCCD = 1.8 V, core LDO disabled, and VDDA = 3.0 V.
TSCLK_SS
TSS_SCLK
SS
1/fSCLK
70%
30%
70%
30%
70%
30%
70%
30%
70%
30%
THIGH
TLOW
SCLK
(CPOL = 0)
(INPUT)
TDELAY
70%
30%
MISO
70%
30%
MOSI
THOLD
TSETUP
Figure 17
SPI timing diagram
Table 15
Parameter
fSCLK
1/fSCLK
SDRSPI
AC characteristics of SPI pins
Description
SCLK clock frequency
SPI SCLK cycle time (period)
Conditions
Min
–
125
–
125
Typ
–
–
–
–
Max
Unit
MHz
ns
Mbps
ns
–
–
–
–
8
–
8
–
Sustained data rate for SPI transaction
TIDLESPI
Time between consecutive SPI
transactions (duration between SS
deactivation and the following SS
activation)
TLOW
SCLK LOW time
SCLK HIGH time
–
–
–
–
50
50
30
30
0
0
125
125
–
–
–
–
–
–
–
–
–
–
THIGH
TSETUP
THOLD
TDELAY
MOSI setup to SCLK
MOSI hold from SCLK
MISO delay (hold) high voltage
MISO delay (hold) low voltage
Time from SS LOW to first SCLK
Time from last SCLK to SS HIGH
–
–
45
65
–
V
V
DDD 3 V
DDD < 2 V
TSS_SCLK
TSCLK_SS
–
–
–
Datasheet
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Packaging information
10
Packaging information
This section shows the CYAT8165X/7165X device packaging specifications.
51-85048 *K
100-pin TQFP (14 × 14 × 1.4 mm) A100SA/AZ0AB package outline, 51-85048
Figure 18
51-85051 *D
Figure 19
64-pin TQFP (10 × 10 × 1.4 mm) A64SB package outline, 51-85051
Datasheet
37
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Packaging information
001-76517 *A
Figure 20
56-pin QFN ((8 × 8 × 1.0 mm) LW56 4.5 × 5.2 E-Pad (Subcon punch type, wettable flanks))
package outline, 001-76517
Datasheet
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Packaging information
10.1
Thermal impedance and moisture sensitivity
Table 16
Thermal impedance and moisture sensitivity
Moisture sensitivity
level
[22]
[22]
Package
Typical JMAX
Typical JA
Typical JC
100-pin TQFP
64-pin TQFP
56-pin QFN
120°C
125°C
125°C
33.3°C/W
42.8°C/W
18.0°C/W
7.6°C/W
7.0°C/W
3.5°C/W
3
3
3
10.2
Solder reflow specifications
Table 17 lists the maximum solder reflow peak temperature.
Important Note
Thermal ramp rate during preheat should be 3°C/s or lower. The packaged device supports Pb-free solder reflow
profile as per section 5.6 of J-STD-020.D1.
Table 17
Solder reflow specifications
Package
Maximum peak temperature
Time at maximum temperature
All packages
260°C
30 seconds
Note
22.Measured at 25°C ambient on a 4-layer PCB.
Datasheet
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Ordering information
11
Ordering information
Table 18 lists the CYAT8165X/7165X touchscreen/trackpad controllers.
Table 18
Ordering information [23]
CYAT81650-100AA48
48
48
48
48
48
48
48
48
48
48
48
48
48
48
48
48
48
48
48
48
41
41
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
–
–
–
–
–
–
–
–
✔
✔
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
100-pin TQFP
100-pin TQFP
100-pin TQFP
100-pin TQFP
100-pin TQFP
100-pin TQFP
100-pin TQFP
100-pin TQFP
100-pin TQFP
100-pin TQFP
64-pin TQFP
64-pin TQFP
64-pin TQFP
64-pin TQFP
64-pin TQFP
64-pin TQFP
64-pin TQFP
64-pin TQFP
64-pin TQFP
64-pin TQFP
56-pin QFN
CYAT81650-100AS48
CYAT81652-100AA48
CYAT81652-100AS48
CYAT81655-100AA48
CYAT81655-100AS48
CYAT81658-100AA48
CYAT81658-100AS48
CYAT81659-100AA48
CYAT81659-100AS48
CYAT81650-64AA48
CYAT81650-64AS48
CYAT81652-64AA48
CYAT81652-64AS48
CYAT81655-64AA48
CYAT81655-64AS48
CYAT81658-64AA48
CYAT81658-64AS48
CYAT81659-64AA48
CYAT81659-64AS48
CYAT71658-56LWS41[25]
CYAT71658-56LWA41[25]
✔
✔
✔
✔
✔
✔
✔
✔
–
✔
✔
✔
✔
✔
✔
✔
✔
–
✔
✔
✔
✔
✔
✔
✔
✔
–
–
✔
✔
✔
✔
✔
✔
–
–
–
–
✔
✔
✔
✔
✔
✔
✔
✔
–
✔
✔
✔
✔
–
–
–
–
–
–
–
–
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
–
✔
✔
✔
✔
✔
✔
–
✔
✔
✔
✔
56-pin QFN
Notes
23.All devices have the following base features: Water Rejection, DisplayArmor™, AutoArmor™, DualSense™,
CAPSENSE™ buttons, and Large Object Detection and Rejection.
24.Not compatible with SPI due to pin limitations.
25.These are trackpad part numbers.
Datasheet
40
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2023-05-09
PSoC™ Automotive Multitouch Generation 6L
Datasheet
Ordering information
11.1
Ordering code definitions
XX
X
CY
X
X
XXX
X
AT
XXX
X
Packaging:
T = Tape and reel;
Blank/non-T = Tray
Number of sense I/Os: 48, 41
Temperature range:
A = –40°C to 85°C;
S = –40°C to 105°C
Package type:
A = TQFP;
LW = QFN
Number of pins: 100, 64, 56
Product feature set: See Ordering information table
Sensor configuration: 1 = Discrete sensors
Market segment:
6 = Automotive slider;
7 = Automotive trackpad;
8 = Automotive touchscreen
Business unit: AT = Automotive
Marketing code: CY = CYPRESS (an Infineon company)
Datasheet
41
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Reference documents
12
Reference documents
Infineon has created a collection of documents to support the design of PSoC™ Automotive Multitouch
touchscreen controllers.
The following list will guide you in identifying the proper document for your task:
• PCB/FPC Schematic and Layout Design
• ITO Panel Design
• Driver Development
• Manufacturing (MFG)
• System Performance Evaluation
Infineon’s PSoC™ Automotive Multitouch technology is Infineon confidential information and is protected
through a Non-Disclosure Agreement (NDA). These documents are not publicly available on the Infineon website.
Contact your local Infineon office to request any of these documents pursuant to the aforementioned NDA. You
can also direct your requests to automotive@infineon.com.
Table 19
Reference specifications
Document
number
PCB
FPC
ITO
Document title
Description
Driver
MFG System
panel
Solution specifications
001-49389
PSoC™ Automotive Multitouch
Contains Infineon touchscreen
performance parameter
definitions, justification for
parameters, and parameter test
methodologies.
–
✔
✔
–
–
–
✔
Touchscreen Controller
Performance Parameters
001-50467
PSoC™ Automotive Multitouch
Touchscreen Controller Module
Design Best Practices
A system-level design guide for
building a capacitive touchscreen
module, covering topics such as
touchscreen traces, shielding,
mechanical design, FPC/PCB
design, and LCD considerations.
✔
–
–
001-81514
Using CY8CTMA4/5XX I2C in
Discusses how to ensure proper I2C
✔
–
–
–
–
Systems With Slow Clock Edges
functionality in extreme bus
conditions[26]
.
001-83948
001-63571
Touch Tuning Host Emulator Guide Describes the Touch Tuning Host
Emulator Software
–
–
–
–
–
–
–
✔
CY3295-MTK PSoC™ Multitouch
Describes the CY3295-MTK
✔
–
Manufacturing Test Kit User Guide Manufacturing Test Kit
External Specifications - These specifications are not created or owned by Infineon, but directions on how to acquire or access them can
be provided upon request by contacting automotive@infineon.com.
UM10204
ISO11452
I2C-bus specification and user manual
✔
✔
–
–
–
–
–
–
✔
✔
Component test methods for electrical disturbances in Road Vehicles
Package
CISPR25
Vehicles, boats and internal combustion engines – Radio disturbance
characteristics – Limits and methods of measurement for the protection
of on-board receivers
✔
✔
–
–
–
–
–
–
✔
✔
J-STD-020D.1 Moisture/Reflow Sensitivity
Classification for non hermetic
surface mount devices
Note
26.Extreme bus conditions are considered to be a combination of the following conditions: High-capacitive bus
load, slow SCL fall time, and fast SDA rise/fall time.
Datasheet
42
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Acronyms
13
Acronyms
Table 20
Acronym
CPU
DNU
DSD
EMI
ESD
FPC
I2C
Acronyms
Description
central processing unit
do not use
dual-solid diamond pattern (Figure 4)
electromagnetic interference
electrostatic discharge
flexible printed circuit
inter-integrated circuit
input/output
I/O
ITO
indium tin oxide
LCD
liquid crystal display
low dropout regulator
Manhattan-3 pattern (Figure 5)
manufacturing test kit
printed circuit board
polyethylene terephthalate
programmable system-on-chip
quad flat no-lead
LDO
MH3
MTK
PCB
PET
PSoC™
QFN
SCL
serial I2C clock
SD
SDA
signal disparity
serial I2C data
SOL
sensor-on-lens
SMT
SNR
SSD
SWD
SWDCLK
TQFP
TRM
TTHE
VPP
surface mount technology
signal-to-noise ratio
single-solid diamond pattern (Figure 3)
serial wire debug
serial wire debug clock
thin quad flat pack
technical reference manual
touch tuning host emulator
volts peak-to-peak
Datasheet
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Document conventions
14
Document conventions
14.1
Units of measure
Table 21
Symbol
°C
µA
µF
µs
µW
Units of measure
Unit of measure
degrees Celsius
microampere
microfarad
microsecond
microwatt
ohm
Hz
hertz
k
kilo-ohm
kbps
kHz
mA
mm
ms
kilobits per second
kilohertz
milliampere
millimeter
millisecond
millivolt
mV
mW
Mbps
MHz
nA
ns
pF
milliwatt
megabits per second
megahertz
nanoampere
nanosecond
picofarad
s
second
14.2
Port nomenclature
Px[y] describes a particular bit “y” available within an I/O port “x”. For example, P4[2] reads “port 4, bit 2”.
Px[y:z] describes a particular range of bits “y to z” within an I/O port named “Px”. For example, P4[0:5] refers to
bits 0 through 5 within an I/O port named P4.
Datasheet
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Glossary
15
Glossary
Table 22
Term
Glossary
Definition
accuracy
The maximum position error across the touchscreen, measured in millimeters, along a
straight line between the actual finger position and the reported finger position. Accuracy
is measured across the core and full panel. See Infineon’s PSoC™ Automotive Multitouch
Touchscreen Controller Performance Parameters (001-49389)[27] specification for more
information.
All-Points
Infineon brand name for PSoC™ Automotive Multitouch devices capable of tracking the
motion of multiple fingers.
AMOLED/OLED
conversion
Type of display using Active Matrix (AM) Organic Light Emitting Diodes (OLED).
The process of measuring the capacitance of an electrode connected to a pin (self
capacitance) or the capacitance between a pair of electrodes connected to different pins
(mutual capacitance). The result is a number that can be processed by the channel engine
and CPU.
core
That portion of the touchscreen, responsive to touch, less a perimeter area whose width
is the larger of 3.5 mm or half the width of the finger (for example, less a perimeter band
4.5-mm wide for a 9-mm finger).
core LDO
Low Drop Out Regulator that sources power to the digital core when enabled. Input to the
LDO is VDDD. Output of the LDO is connected to the digital supply pin VCCD. When the core
LDO is disabled, power must be externally applied to the digital core supply pin VCCD.
cover lens
DCVCOM
linearity
The top layer in the touchscreen stackup that provides mechanical stability and
protection for the touchscreen sensor.
Type of Liquid Crystal Display where the common electrode (VCOM) is driven by DC
voltage.
The deviation of the position data from a best-fit straight line across the touchscreen,
measured in millimeters. Linearity is measured across the core and full panel. See
Infineon’s PSoC™ Automotive Multitouch Touchscreen Controller Performance Parameters
(001-49389)[27] specification for more information.
mutual
capacitance
The capacitance between two touchscreen electrodes.
refresh rate
The frequency at which consecutive frames of touchscreen data are made available in a
data buffer while a finger is present on the touchscreen. See Infineon’s PSoC™ Automotive
Multitouch Touchscreen Controller Performance Parameters (001-49389)[27] specification
for more information.
RX
Receive. A touchscreen electrode or touchscreen controller sense pin, mapped or
switched to a charge sensing circuit within the controller (known as a receive channel).
Note
27.Infineon reference documents are available under NDA through your local Infineon sales representative.
You can also direct your requests to automotive@infineon.com.
Datasheet
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Glossary
Table 22
Term
Glossary (continued)
Definition
scan
The conversion of all sensor capacitances to digital values.
sense pin
A pin that can be multiplexed to RX or TX.
signal-to-noise
ratio (SNR)
The ratio between a capacitive finger signal and system noise.
signal disparity
(SD)
The ratio of maximum measured signal when the touchscreen is grounded and maximum
measured signal when the touchscreen is isolated from ground.
stackup
TX
Layers of materials, in defined assembly order, that make up a touchscreen sensor.
Transmit. A touchscreen electrode or touchscreen controller sense pin, mapped or
switched to a charge forcing circuit within the controller. This charge forcing circuit drives
a periodic waveform onto one or more touchscreen electrodes, which are coupled
through mutual capacitance to adjacent receive electrodes.
Datasheet
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Revision history
Revision history
Document
Date
Description of changes
revision
**
2016-02-23
New datasheet.
Updated Power supply information:
Updated Figure 6.
Updated Figure 7.
Updated Figure 8.
Updated Figure 9.
Updated Figure 10.
Updated Pin information:
Updated Table 3.
Updated Figure 12.
*A
2016-06-24
Updated Electrical Specifications:
Updated AC specifications:
Updated Chip-level AC specifications:
Updated Table 13:
Added FIMOTOL1 parameter and its corresponding details.
Updated Ordering information:
Updated Table 18:
No change in part numbers.
Added a column “5-V Tx”.
Updated to new template.
Updated Features:
Updated description.
Updated Pin information:
Updated Table 3.
*B
*C
2016-07-11
2016-08-08
Updated Electrical Specifications:
Updated DC specifications:
Updated Chip-level DC specifications:
Updated Table 9:
Updated details in “Units” column corresponding to PSARAMP and PSDRAMP
parameters.
Added Note 15 and referred the same note in “Min” value of PSDRAMP
parameter.
Changed status from Advance to Preliminary.
Updated Pin information:
Updated description.
Updated Electrical Specifications:
Updated DC specifications:
Updated Flash specifications:
Updated Table 8:
*D
2016-09-07
Updated Note 13.
Updated Ordering information:
Updated Table 18:
Updated part numbers.
Updated Reference documents:
Updated Table 19.
Updated to new template.
Datasheet
47
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Revision history
Document
Date
Description of changes
revision
Updated Touchscreen system specifications:
Updated System performance specifications:
Updated Table 1.
Updated Table 2.
Updated Ordering information:
Updated Table 18:
*E
2016-12-19
No change in part numbers.
Removed columns “5-V Tx” and “Display Armor”.
Updated to new template.
Completing Sunset Review.
Changed status from Preliminary to Final.
Updated Features:
Updated description.
Updated Touchscreen system overview:
Updated Figure 1.
Updated Touchscreen system specifications:
Updated System performance specifications:
Updated Table 2.
*F
2017-04-05
Updated Pin information:
Updated description.
Updated Ordering information:
Updated Table 18:
Updated part numbers.
Updated Ordering code definitions.
Updated to new template.
Updated Features:
Updated description.
Updated Electrical Specifications:
Updated DC specifications:
Updated Flash specifications:
Updated Table 8 (Replaced TJ with TA in “Conditions” column
corresponding to FlashDR parameter).
Updated Ordering information:
Updated Table 18:
*G
2018-02-06
No change in part numbers.
Updated Ordering code definitions.
Updated to new template.
Completing Sunset Review.
Updated Packaging information:
Added spec 51-85051 *D.
Updated Ordering information:
Updated Table 18:
*H
*I
2018-05-03
2018-05-23
Updated part numbers.
Updated Ordering code definitions.
Updated Packaging information:
Added spec 001-76517 *A.
Updated Ordering information:
Updated Table 18:
Updated part numbers.
Updated Ordering code definitions.
Datasheet
48
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Revision history
Document
Date
Description of changes
revision
Added “CONFIDENTIAL - RELEASED ONLY UNDER NONDISCLOSURE
AGREEMENT (NDA)” at the bottom of all pages.
Removed 56-pin QFN Package related information in all instances across the
document.
Updated Packaging information:
spec 51-85048 – Changed revision from *J to *K.
Removed spec 001-76517 *A.
*J
2019-02-21
Updated Ordering information:
Updated Table 18:
Updated part numbers.
Updated Ordering code definitions.
Completing Sunset Review.
Added 56-pin QFN Package related information in all instances across the
document.
Updated Pin information:
Updated Table 4 (Replaced “VDDA” with “VDDA_Q” in “Name” column
corresponding to pin 32).
Updated Figure 13 (Replaced “VDDA” with “VDDA_Q” corresponding to
pin 32).
*K
2019-04-25
Updated Packaging information:
Added spec 001-76517 *A.
Updated Ordering information:
Updated Table 18:
No change in part numbers.
Added “Custom generic part numbers with customized firmware available
for trackpad applications.” at the bottom of table.
Updated Ordering code definitions.
Updated Pin information:
Updated Figure 14.
Updated Ordering information:
No change in part numbers.
Added “For 56-pin QFN with 41 sense pins, contact Sales.” at the bottom of
table.
*L
2020-01-31
2020-04-28
Completing Sunset Review.
Updated Ordering information:
Updated Table 18:
Updated part numbers.
*M
Added Note 25 and referred the same note in CYAT71658-56LWS41 and
CYAT71658-56LWA41.
Datasheet
49
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PSoC™ Automotive Multitouch Generation 6L
Datasheet
Revision history
Document
Date
Description of changes
revision
Updated Document Title to read as “CYAT8165X/7165X (41/48 I/Os),
Automotive TrueTouch® Multi-Touch All-Points Touchscreen/Trackpad
Controller Datasheet”.
Add trackpad related information in all instances across the document.
Updated Electrical Specifications:
Updated DC specifications:
Updated Chip-level DC specifications:
Updated Table 9.
Updated AC specifications:
*N
2020-12-07
Updated Chip-level AC specifications:
Updated Table 13.
Updated I2C specifications:
Updated Table 14.
Updated Packaging information:
Updated Thermal impedance and moisture sensitivity:
Updated Table 16.
Updated Ordering information:
No change in part numbers.
Updated Ordering code definitions.
Updated Touchscreen system specifications:
Updated System performance specifications:
Updated Table 2.
Updated Pin information:
Updated description.
Updated Electrical Specifications:
Updated Absolute maximum ratings:
Updated Table 6.
Updated DC specifications:
Updated Chip-level DC specifications:
Updated Table 9.
*O
2021-08-09
Updated I/O port 0 (P0[0:1]) DC specifications:
Updated Table 10.
Updated Packaging information:
Updated Thermal impedance and moisture sensitivity:
Updated Table 16.
Updated Ordering information:
No change in part numbers.
Added Note 24 and referred the same note in “Wake up Button Support (or)
Wake-on-Screen Support” column in Table 18.
Updated Document Title to read as “CYAT8165X/7165X (41/48 I/Os), PSoC™
Automotive Multitouch All-Points Touchscreen/Trackpad Controller
Datasheet”.
Updated to the PSoC™ Automotive Multitouch branding guidelines.
Updated Power supply information:
Updated Voltage coefficient:
*P
2022-05-16
Updated Figure 6 (Updated caption only).
Updated Figure 7 (Updated caption only).
Updated Figure 8 (Updated caption only).
Updated Figure 9 (Updated caption only).
Updated Figure 10 (Updated caption only).
Updated Document Title to read as “CYAT8165X/7165X, PSoC™ Automotive
Multitouch Generation 6L Datasheet”.
*Q
*R
2022-08-18
2022-11-07
Migrated to Infineon template.
Updated Pin information:
Updated Figure 14.
Datasheet
50
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2023-05-09
PSoC™ Automotive Multitouch Generation 6L
Datasheet
Revision history
Document
Date
Description of changes
revision
Updated Touchscreen system specifications:
Updated System performance specifications:
Updated description.
Updated Electrical Specifications:
Updated DC specifications:
Added description.
Updated Flash specifications:
Updated description.
Updated Table 8.
Updated Note 13.
Updated Chip-level DC specifications:
Updated description.
Updated I/O port 0 (P0[0:1]) DC specifications:
Updated description.
Updated Table 10.
*S
2023-05-09
Updated I/O port 1 (P1[0:3]) and XRES DC specifications:
Updated description.
Updated Table 11.
Updated AC specifications:
Added description.
Updated SWD interface AC specifications:
Updated description.
Updated Chip-level AC specifications:
Updated description.
Updated I2C specifications:
Updated description.
Updated SPI specifications:
Updated description.
Updated to new template.
Completing Sunset Review.
Datasheet
51
002-10076 Rev. *S
2023-05-09
Please read the Important Notice and Warnings at the end of this document
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
IMPORTANT NOTICE
WARNINGS
The information given in this document shall in no Due to technical requirements products may contain
Edition 2023-05-09
Published by
event be regarded as a guarantee of conditions or dangerous substances. For information on the types
characteristics (“Beschaffenheitsgarantie”).
in question please contact your nearest Infineon
Technologies office.
With respect to any examples, hints or any typical
Infineon Technologies AG
81726 Munich, Germany
values stated herein and/or any information Except as otherwise explicitly approved by Infineon
regarding the application of the product, Infineon Technologies in a written document signed by
Technologies hereby disclaims any and all authorized
representatives
of
Infineon
warranties and liabilities of any kind, including Technologies, Infineon Technologies’ products may
without limitation warranties of non-infringement of not be used in any applications where a failure of the
intellectual property rights of any third party.
product or any consequences of the use thereof can
reasonably be expected to result in personal injury.
© 2023 Infineon Technologies AG.
All Rights Reserved.
In addition, any information given in this document
is subject to customer’s compliance with its
obligations stated in this document and any
applicable legal requirements, norms and standards
concerning customer’s products and any use of the
product of Infineon Technologies in customer’s
applications.
Do you have a question about this
document?
Email:
erratum@infineon.com
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments
to evaluate the suitability of the product for the
intended application and the completeness of the
product information given in this document with
respect to such application.
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