CYAT82687-100AA54_技术文档

CYAT8268X

PSoC™ Automotive Multitouch Generation

6XL Hybrid In-cell

Datasheet

Features

• In-Cell touchscreen controller

• Multitouch capacitive touchscreen controller

- 32-bit Arm® Cortex® CPU

- Register-configurable

- Noise-suppression technologies for display and EMI

• AutoArmor improves both electromagnetic emissions and immunity

- Water rejection and wet-finger tracking using DualSense

- Multitouch glove with automatic mode switching

• Ten fingers with thin glove (≤ 1 mm thick)

• Two fingers with thick glove (≤ 5 mm thick)

- Fingernail tracking

- Large object rejection

- Automatic baseline tracking to environmental changes

- Field upgrades via bootloader

- Manufacturing Test Kit (MTK)

- Touchscreen sensor self-test

• System performance (configuration dependent)

- Screen sizes up to 15-inch diagonal

• 6.0 mm electrode pitch; 16:10 aspect ratio

- Up to 54 RX channels, 1836 intersections; 16:10 aspect ratio (34 TX × 54 RX)

- Reports up to ten fingers

- Small finger support down to 5 mm

- Refresh rate up to 250 Hz; other rates configurable

• Power (configuration-dependent)

- 1.71 V to 1.95 V and 3.0 V to 5.5 V logic and digital I/Os supply

- 3.0 V to 5.5 V analog supply

- 30 mW average power

- 30 μW typical deep-sleep power

• Sensor and system design (configuration-dependent)

- Supports In-Cell sensors

• TX/VCOM share the same layer

• RX ITO layer on/above the color filter

• Communication interface

- I²C slave at 100 and 400 kbps

• Package

- 100-pin TQFP 14 × 14 × 1.4 mm (0.5-mm pitch)

• Ambient temperature range

- Automotive-A: –40°C to 85°C

- Automotive-S: –40°C to 105°C

Datasheet

www.infineon.com

Please read the Important Notice and Warnings at the end of this document

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Datasheet

Table of contents

Features ...........................................................................................................................................1

Table of contents...............................................................................................................................2

1 Touchscreen System overview.........................................................................................................3

2 CYAT8268X overview.......................................................................................................................4

3 Features overview ..........................................................................................................................5

3.1 AutoArmor...............................................................................................................................................................5

3.2 Water rejection........................................................................................................................................................5

3.3 Wet-finger tracking .................................................................................................................................................5

3.4 Glove........................................................................................................................................................................5

3.5 Automatic Mode switching.....................................................................................................................................5

3.6 Large finger tracking...............................................................................................................................................5

3.7 Large object detection and rejection.....................................................................................................................5

4 Touchscreen System specifications ..................................................................................................6

4.1 System Performance specifications ......................................................................................................................6

5 Power supply information ...............................................................................................................8

5.1 Required external components..............................................................................................................................8

5.2 Voltage coefficient ..................................................................................................................................................8

6 Pin information ............................................................................................................................10

7 Electrical specifications.................................................................................................................27

7.1 Absolute maximum ratings ..................................................................................................................................27

7.2 Operating temperature ........................................................................................................................................27

7.3 DC specifications...................................................................................................................................................28

7.3.1 Flash specifications............................................................................................................................................28

7.3.2 Chip-level DC specifications ..............................................................................................................................29

7.3.3 I/O Port 0 (P0[0:1]) DC specifications................................................................................................................30

7.3.4 I/O Port 1 (P1[0:6]), Port 2 (P2[0:1]), and XRES DC specifications....................................................................31

7.4 AC specifications...................................................................................................................................................32

7.4.1 SWD interface AC specifications........................................................................................................................32

7.4.2 Chip-level AC specifications ..............................................................................................................................32

7.4.3 I2C specifications ...............................................................................................................................................33

8 Packaging diagrams......................................................................................................................35

8.1 Thermal impedance and moisture sensitivity.....................................................................................................35

8.2 Solder reflow specifications .................................................................................................................................35

9 Ordering information ....................................................................................................................36

9.1 Ordering code definitions.....................................................................................................................................36

10 Acronyms ...................................................................................................................................37

11 Reference documents..................................................................................................................38

12 Document conventions................................................................................................................40

12.1 Units of measure .................................................................................................................................................40

12.2 Port nomenclature..............................................................................................................................................40

13 Glossary .....................................................................................................................................41

Revision history ..............................................................................................................................43

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Touchscreen System overview

1

Touchscreen System overview

3.0–5.5 V

1.8 V

1.0 

1 µF

4.7 µF

1 µF

0.1 µF

1 µF

0.1 µF

I²C

VDDA VDDA

VDDA_Q

VCCD VDDD

Host

Processor

Interrupt/Wake

RX

RX (Ncol)

Sense

Pins

CYAT8268X

VSS

InCell LCD panel

VDDA_Q

1 µF

Row Sensors

TX (Nrow)

Display Driver (DDI)

Figure 1

CYAT8268X typical system diagram

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CYAT8268X overview

2

CYAT8268X overview

A capacitive touchscreen detects changes in capacitance to determine the location of one or more fingers on the

surface of the touchscreen. A typical touchscreen system consists of a capacitive touchscreen sensor, an FPC

bonded to the sensor, and the touchscreen controller mounted on the FPC. The FPC connects the touchscreen

controller to the host processor. Users can interact with the displayed user interface through finger movements

and gestures on the surface of the touchscreen.

CYAT8268X is a capacitive touchscreen controller with the sensing and processing technology to resolve the

locations and report the positions of up to ten fingers on the touchscreen. The touchscreen controller converts

an array of sensor capacitances into an array of digital values, which are processed by touch-detection and

position-resolution algorithms in the controller. These algorithms determine the location and signal magnitude

of each finger on the touchscreen.

Infineon provides:

• Application firmware

• Design guidance for the sensor and FPC

• Touchscreen sensor MTK

The CYAT8268X functional block diagram is shown in Figure 2. This device contains a high-performance Arm®

32-bit CPU with an integrated hardware multiply unit. This CPU controls all sensing and processing of measured

capacitance results to allow tracking and reporting touches. The controller is optimized for low power and fast

response time, with built-in support for manufacturing test. The touchscreen controller communicates with a

host through an I²C slave interface at up to 400 kbps.

CYAT8268X collects the touchscreen sensor information using the touch subsystem.

Touchscreen subsystem communicates with the external display driver (DDI) to enable TX drive in the embedded

display lines and receives signals from RX sensors through the RX channels of the touchscreen controller.

Therefore the capacitive scan is executed synchronously with the display refresh.

Infineon reference documents are available under NDA through your local Infineon sales representative. You can

also direct your requests to automotive@cypress.com.

Figure 2

CYAT8268X functional block diagram

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Features overview

3

Features overview

3.1

AutoArmor

AutoArmor improves both electromagnetic emissions and immunity. It ensures no false finger touches when

CYAT8268X is exposed to electromagnetic waves.

3.2

Water rejection

Water droplets can cause false touches to be reported. However, CYAT8268X continues to operate in the presence

of water droplets or condensation. CYAT8268X enables water rejection using DualSense, Infineon’s patented self-

and mutual-capacitance sensing ability.

3.3

Wet-finger tracking

In a touchscreen system, moisture on fingers can cause false touches to be reported and make tracking of fingers

across the screen difficult. CYAT8268X can detect and track fingers that are wet and enable more robust

functionality of the touchscreen, using DualSense. This includes sweaty fingers touching the screen or fingers

moving across a mist-covered screen.

3.4

Glove

CYAT8268X detects and tracks gloved fingers. Glove support allows navigating the touchscreen without having

to remove gloves or without the use of expensive conductive gloves. Tracking of gloved fingers is supported by

automatic mode switching, which automatically transitions between tracking gloved fingers and other

touch-tracking modes. Ten-finger glove-touch is supported for thin gloves ( 1 mm thick) and two-finger

operation is supported for thick gloves ( 5 mm thick).

3.5

Automatic Mode switching

CYAT8268X supports automatic mode switching which detects and tracks a new touch object type without

requiring manual selection of the touch type from the user. Automatic mode switching allows an uninterrupted

user experience when switching between a bare finger, gloved finger, fingernail, or wet finger.

3.6

Large finger tracking

A well-designed touchscreen system must correctly report a large finger or thumb as only a single touch. If this is

not supported, a large finger can incorrectly be reported as two or more touches, hampering the user experience.

When an object, such as a thumb, is pressed against the touchscreen sensor, CYAT8268X ensures that only one

touch is reported at the center of the object.

3.7

Large object detection and rejection

It is important to be able to detect the presence of a large object on the touchscreen sensor. Common example

is a palm touching the screen when typing. CYAT8268X can determine the presence of a large object, such as a

fist or palm, from the touchscreen data. This presence may either be rejected or reported to the host.

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Touchscreen System specifications

4

Touchscreen System specifications

This section specifies the touchscreen system performance delivered by CYAT8268X. For definitions, justification

of parameters, and test methodologies, refer to the Infineon specification PSoC™ Automotive Multitouch

Touchscreen Controller User Interface Performance Definitions (001-49389)^[1]

.

4.1

System Performance specifications

The system performance specifications in Table 1^[2]and Table 2^[3]are valid under these conditions:

–40°C ≤ T_A≤ 85°C^[4]for Grade-A devices, –40°C ≤ T_A≤ 105°C^[4]for Grade-S devices; 1.71 V ≤ V_DDD≤ 1.95 V or

3.0 V ≤ V_DDD≤ 5.5 V, 1.71 V ≤ V_CCD≤ 1.95 V, 3.0 V ≤ V_DDA≤ 5.5 V, unless otherwise noted. Typical values are specified

at T_A= 25°C, V_DDD= V_CCD= 1.8 V, core low dropout regulator (LDO) disabled, and V_DDA= 3 V, unless otherwise

noted. Data is validated using a 10.1-inch sensor with 4.2 mm electrode pitch. Contact your local Infineon sales

representative for information on the system performance conditions to guaranteethe specifications providedin

Table 1. The performance conditions and specifications are valid onlyfor sensors approved by Infineon for use

with CYAT8268X and produced by qualified Infineon partners. Contact automotive@cypress.com to discuss any

deviations.

Table 1

Category

System performance specifications (Configuration dependent)

Description

Conditions

Min

Typ

Max

Units

Jitter

Delta in reported X, Y

position, for non-moving

finger

5–12 mm diameter finger

–

0.4

–

mm

Refresh rate

Response

time

–

One finger on panel

First finger down

100

–

120

–

250^[5]

30

Hz

ms

Active response time

Power

In Active state

1 finger, 120-Hz refresh

rate

Active state for 25% of

touch activity and

in Deep Sleep state for

75% of touch activity.

–

120

–

mW

Average power^[6]

30

In Deep Sleep state

–

30

–

μW

Notes

5. Requires setting TX pulses for mutual-cap and self-cap to 8 and no noise in the environment.

6. Average power is the power consumed during the Active and Deep Sleep states, and is calculated using this

equation: 0.25 × 120 mW + 0.75 × 0.030 mW = 30 mW.

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Power supply information

5

Power supply information

CYAT8268X contains five external power domains: VDDA, VDDA_Q, VDDD, and VCCD. VDDA supplies power to the

chip’s TX pump and drivers. VDDA_Q supplies power to the RX analog circuitry. VDDD supplies power to the digital

I/Os, core LDO regulator, supply monitors, and external reset circuitry (XRES). VCCD supplies power to the CPU

core, and may be configured as an input or output, depending on if a 1.71–1.95-V V_DDDsupply is used.

5.1

Required external components

The touch controller device requires external components for proper device operation. Quantities are dependent

on the power supply configuration used. External capacitors require an X5R dielectric characteristic or better. It

is recommended to use an X7R dielectric characteristic or better for high-frequency 0.1-µF/0.22-µF capacitors.

VDDA:

- 1.0-Ω, 5% tolerance resistor

- 0.1-µF capacitor

- 1-µF capacitor

VDDA_Q:

- 0.1-µF capacitor (only required on one of the VDDA_Q pins)

- Two 1.0-µF capacitors (one at each end of the package)

- 1.0-Ω, 5% tolerance resistor

VDDD:

- 1-μF capacitor if VCCD and VDDD are connected (shown in Figure 3 and Figure 4) or 0.1-μF capacitor

if VDDD  3.0 V.

VCCD:

- 1-µF capacitor if VCCD and VDDD are connected (shown in Figure 3 and Figure 4)

- 100-nF capacitor

5.2

Voltage coefficient

The actual capacitance of external capacitors may be reduced with higher bias voltage. Check the capacitor

datasheet for the voltage coefficient. Capacitors used for power supply decoupling or filtering are operated under

a continuous DC-bias. Many capacitors used with DC power across them provide less than their target

capacitance, and their capacitance is not constant across their working voltage range. When selecting capacitors

for use with this device verify that the selected components provide the required capacitance under the specific

operating conditions of temperature and voltage used in your design. While the temperature ratings of a

capacitor are normally found as part of its catalog part number (for example, X7R, C0G, Y5V), the matching voltage

coefficient may only be available on the component datasheet or direct from the manufacturer. Use of

components that do not provide the required capacitance under the actual operating conditions may cause the

device to perform to less than the datasheet specifications.

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Power supply information

The available power configurations are shown.

CYAT8268X

VDDD

VCCD

3.0–5.5 V

4.7 μF 100 nF

1.0 Ω

100 nF

VDDA_Q

1 μF

100 nF

1 μF

VDDA_Q

VDDA

VSS

1 μF

1.0 Ω

1 μF

100 nF

1 μF

GND

VSS

Figure 3

Dual supplies (no 1.8 V)

CYAT8268X

VDDD

VCCD

1.8 V 5%

4.7 μF 1 μF

1.0 Ω

100 nF

VDDA_Q

3.0–5.5 V

1 μF

100 nF

1 μF

VDDA_Q

VDDA

1 μF

1.0 Ω

VDDA

1 μF

100 nF

1 μF

GND

VSS

Figure 4

Dual supplies (inc. 1.8 V)

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Pin information

6

Pin information

CYAT8268X is available in 100-pin TQFP package. This section lists pin names, descriptions, and mappings to the

physical package. Input and output pins may have more than one possible configuration. Guidance for each

configuration option is provided below:

Y: Y pins may be configured as receive (RX) sense, allowing each design to be optimized based on the sensor

pattern and layout. See Infineon specification, PSoC™ Automotive Multitouch Touchscreen Controller Module

Design Best Practices (001-50467), for guidelines. Unused Y pins should be left unconnected. RX pins are tied to

VSS internally during the Deep Sleep power state.

P0/P1/P2: Unused port 0, port 1, and port 2 pins should be left unconnected.

External Reset (XRES): If the XRES pin is unused, it must be connected to V_DDD(either directly or through an

external resistor).

SWD: Serial wire debug (SWD) is the recommended programming mode for all designs. If SWD is not used on the

target board, use the bootloader to upgrade firmware.

Do Not Use (DNU): DNU pins must be left unconnected to ensure proper device operation.

COMM_INT: The COMM_INT pin is required. This interrupt pin is used for the host communication. If resistive

mode is used, note that all I/Os are Hi-Z during chip initialization (after XRES or Bootloader Exit), so an additional

external resistor is recommended.

Pin configurations: Multiple pin configurations are supported using Touch Tuning Host Emulator (TTHE)

software. Pins are configured using the TTHE Pin Configuration Wizard.

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Pin information

Table 3

100-pin TQFP, 31 RX, CYAT8268X ^[7]

Type

No.

Name

Description

Digital

Analog

I/O

–

1

2

3

Y12

Y11

Y10

–

RX channel 12

RX channel 11

RX channel 10

RX channel 9

RX channel 8

RX channel 7

RX channel 6

RX channel 5

RX channel 4

RX channel 3

RX channel 2

RX channel 1

RX channel 0

Do not use

4

5

6

7

8

9

Y09

Y08

Y07

Y06

Y05

Y04

Y03

Y02

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

Y01

Y00

DNU

VSS

–

Do not use

–

Do not use

Power

Connect to ground

External active LOW reset

I2C SCL

XRES

P0[0]

P0[1]

I

–

I/O

I2C SDA

HSMODE_REQ (Request High Sensitivity Mode - lower touch refresh

rate - output)

32

P1[0]

I/O

–

33

34

P1[1]

P1[2]

I/O

–

HSYNC (Horizontal Timing signal - input)

TXDRIVE (Drive TX signal hi/lo - output)

Note

7. See “Pin information” on page 10 for details on pin configuration.

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Pin information

Table 3

100-pin TQFP, 31 RX, CYAT8268X ^[7](continued)

Type

No.

Name

Description

Digital

I/O

Analog

35

36

P1[3]

P1[4]

–

VSYNC (Vertical blanking timing signal - input)

ERROR (Set high when internal error is detected - output)

I/O

HSMODE_ACK (Acknowledge High Sensitivity Mode - lower touch

refresh rate - input)

37

P1[5]

I/O

–

38

39

40

41

42

43

44

45

P1[6]

P2[0]

P2[1]

VCCD

VDDD

VSS

I/O

–

COMM_INT

SWDIO / CMODE_REQ (Request Custom Mode - output)

SWDCLK / CMODE_ACK (Acknowledge Custom Mode - input)

Power

Digital core power supply input/output

Digital power supply input

Connect to ground

TX analog power supply input

RX analog power supply input

TX analog power supply input

Do not use

Connect to ground

Do not use

Power

VSS

VDDA

46 VDDA_Q

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

VDDA

DNU

VSS

DNU

–

Power

–

Do not use

Note

7. See “Pin information” on page 10 for details on pin configuration.

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Pin information

Table 3

100-pin TQFP, 31 RX, CYAT8268X ^[7](continued)

Type

No.

Name

Description

Digital

Analog

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

DNU

Y30

–

I/O

Do not use

RX channel 30

RX channel 29

RX channel 28

RX channel 27

Y29

Y28

Y27

85 VDDA_Q

Power

RX analog power supply input

Connect to ground

RX channel 26

RX channel 25

RX channel 24

RX channel 23

RX channel 22

RX channel 21

RX channel 20

RX channel 19

RX channel 18

RX channel 17

RX channel 16

RX channel 15

RX channel 14

RX channel 13

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

VSS

Y26

Y25

Y24

Y23

Y22

Y21

Y20

Y19

Y18

Y17

Y16

Y15

Y14

Y13

–

I/O

Note

7. See “Pin information” on page 10 for details on pin configuration.

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Pin information

Y12

Y11

1

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

DNU

VSS

DNU

2

Y10

3

Y09

4

Y08

5

Y07

6

Y06

7

Y05

8

Y04

9

Y03

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

Y02

CYAT8268X

100-Pin TQFP

31 RX channels

Y01

Y00

DNU

Figure 5

100-pin TQFP, 31 RX, CYAT8268X

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Pin information

Table 4

100-pin TQFP, 39 RX, CYAT8268X ^[8]

Type

No.

Name

Description

Digital

Analog

I/O

–

1

2

3

Y12

Y11

Y10

–

RX channel 12

RX channel 11

RX channel 10

RX channel 9

RX channel 8

RX channel 7

RX channel 6

RX channel 5

RX channel 4

RX channel 3

RX channel 2

RX channel 1

RX channel 0

Do not use

4

5

6

7

8

9

Y09

Y08

Y07

Y06

Y05

Y04

Y03

Y02

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

Y01

Y00

DNU

VSS

–

Do not use

–

Do not use

Power

Connect to ground

External active LOW reset

I2C SCL

XRES

P0[0]

P0[1]

I

–

I/O

I2C SDA

HSMODE_REQ (Request High Sensitivity Mode - lower touch refresh

rate - output)

32

P1[0]

I/O

–

33

34

P1[1]

P1[2]

I/O

–

HSYNC (Horizontal Timing signal - input)

TXDRIVE (Drive TX signal hi/lo - output)

Note

8. See “Pin information” on page 10 for details on pin configuration.

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Pin information

Table 4

100-pin TQFP, 39 RX, CYAT8268X ^[8](continued)

Type

No.

Name

Description

Digital

I/O

Analog

35

36

P1[3]

P1[4]

–

VSYNC (Vertical blanking timing signal - input)

ERROR (Set high when internal error is detected - output)

I/O

HSMODE_ACK (Acknowledge High Sensitivity Mode - lower touch

refresh rate - input)

37

P1[5]

I/O

–

38

39

40

41

42

43

44

45

P1[6]

P2[0]

P2[1]

VCCD

VDDD

VSS

I/O

–

COMM_INT

SWDIO / CMODE_REQ (Request Custom Mode - output)

SWDCLK / CMODE_ACK (Acknowledge Custom Mode - input)

Power

Digital core power supply input/output

Digital power supply input

Connect to ground

TX analog power supply input

RX analog power supply input

TX analog power supply input

Do not use

Connect to ground

Do not use

Power

VSS

VDDA

46 VDDA_Q

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

VDDA

DNU

VSS

DNU

–

Power

–

Do not use

Note

8. See “Pin information” on page 10 for details on pin configuration.

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Pin information

Table 4

100-pin TQFP, 39 RX, CYAT8268X ^[8](continued)

Type

No.

Name

Description

Digital

Analog

–

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

DNU

Y38

Y37

Y36

Y35

Y34

Y33

Y32

Y31

Y30

Y29

Y28

Y27

–

Do not use

–

I/O

RX channel 38

RX channel 37

RX channel 36

RX channel 35

RX channel 34

RX channel 33

RX channel 32

RX channel 31

RX channel 30

RX channel 29

RX channel 28

RX channel 27

85 VDDA_Q

Power

RX analog power supply input

Connect to ground

RX channel 26

RX channel 25

RX channel 24

RX channel 23

RX channel 22

RX channel 21

RX channel 20

RX channel 19

RX channel 18

RX channel 17

RX channel 16

RX channel 15

RX channel 14

RX channel 13

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

VSS

Y26

Y25

Y24

Y23

Y22

Y21

Y20

Y19

Y18

Y17

Y16

Y15

Y14

Y13

–

I/O

Note

8. See “Pin information” on page 10 for details on pin configuration.

Datasheet

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PSoC™ Automotive Multitouch Generation 6XL Hybrid In-cell

Datasheet

Pin information

Y12

Y11

1

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

Y36

2

Y37

Y10

3

Y38

Y09

4

DNU

VSS

DNU

Y08

5

Y07

6

Y06

7

Y05

8

Y04

9

Y03

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

Y02

CYAT8268X

100-Pin TQFP

39 RX channels

Y01

Y00

DNU

Figure 6

100-pin TQFP, 39 RX, CYAT8268X

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Datasheet

Pin information

Table 5

100-pin TQFP, 46 RX, CYAT8268X ^[9]

No.

Name

Digital

Analog

Description

1

2

3

4

5

6

7

8

Y12

Y11

Y10

Y09

Y08

Y07

Y06

Y05

Y04

Y03

Y02

Y01

Y00

DNU

VSS

–

I/O

–

RX channel 12

RX channel 11

RX channel 10

RX channel 9

RX channel 8

RX channel 7

RX channel 6

RX channel 5

RX channel 4

RX channel 3

RX channel 2

RX channel 1

RX channel 0

Do not use

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

–

Do not use

–

Do not use

Power

Connect to ground

External active LOW reset

I2C SCL

XRES

P0[0]

P0[1]

I

–

I/O

I2C SDA

HSMODE_REQ (Request High Sensitivity Mode - lower touch refresh

rate - output)

32

P1[0]

I/O

–

33

34

35

P1[1]

P1[2]

P1[3]

I/O

–

HSYNC (Horizontal Timing signal - input)

TXDRIVE (Drive TX signal hi/lo - output)

VSYNC (Vertical blanking timing signal - input)

Note

9. See “Pin information” on page 10 for details on pin configuration.

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Datasheet

Pin information

Table 5

100-pin TQFP, 46 RX, CYAT8268X ^[9](continued)

No.

36

Name

P1[4]

P1[5]

Digital

I/O

Analog

Description

–

ERROR (Set high when internal error is detected - output)

HSMODE_ACK (Acknowledge High Sensitivity Mode - lower touch

refresh rate - input)

37

I/O

38

39

40

41

42

43

44

45

P1[6]

P2[0]

P2[1]

VCCD

VDDD

VSS

I/O

–

COMM_INT

SWDIO / CMODE_REQ (Request Custom Mode - output)

SWDCLK / CMODE_ACK (Acknowledge Custom Mode - input)

Digital core power supply input/output

Digital power supply input

Connect to ground

TX analog power supply input

RX analog power supply input

TX analog power supply input

Do not use

Connect to ground

Do not use

Power

VSS

VDDA

46 VDDA_Q

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

VDDA

DNU

VSS

DNU

Y45

–

Power

–

Do not use

RX channel 45

RX channel 44

RX channel 43

RX channel 42

–

I/O

Y44

Y43

Y42

Y41

RX channel 41

RX channel 40

Y40

Note

9. See “Pin information” on page 10 for details on pin configuration.

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Pin information

Table 5

100-pin TQFP, 46 RX, CYAT8268X ^[9](continued)

No.

Name

Digital

Analog

Description

72

73

74

75

76

77

78

79

80

81

82

83

84

Y39

Y38

Y37

Y36

Y35

Y34

Y33

Y32

Y31

Y30

Y29

Y28

Y27

–

I/O

RX channel 39

RX channel 38

RX channel 37

RX channel 36

RX channel 35

RX channel 34

RX channel 33

RX channel 32

RX channel 31

RX channel 30

RX channel 29

RX channel 28

RX channel 27

85 VDDA_Q

Power

RX analog power supply input

Connect to ground

RX channel 26

RX channel 25

RX channel 24

RX channel 23

RX channel 22

RX channel 21

RX channel 20

RX channel 19

RX channel 18

RX channel 17

RX channel 16

RX channel 15

RX channel 14

RX channel 13

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

VSS

Y26

Y25

Y24

Y23

Y22

Y21

Y20

Y19

Y18

Y17

Y16

Y15

Y14

Y13

–

I/O

Note

9. See “Pin information” on page 10 for details on pin configuration.

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Datasheet

Pin information

Y12

Y11

1

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

Y36

2

Y37

Y10

3

Y38

Y09

4

Y39

Y08

5

Y40

Y07

6

Y41

Y06

7

Y42

Y05

8

Y43

Y04

9

Y44

Y03

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

Y45

Y02

DNU

VSS

DNU

CYAT8268X

100-Pin TQFP

46 RX channels

Y01

Y00

DNU

Figure 7

100-pin TQFP, 46 RX, CYAT8268X

Datasheet

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Datasheet

Pin information

Table 6

100-pin TQFP, 54 RX, CYAT8268X ^[10]

Type

No.

Name

Description

Digital

Analog

I/O

–

1

2

3

Y12

Y11

Y10

–

RX channel 12

RX channel 11

RX channel 10

RX channel 9

RX channel 8

RX channel 7

RX channel 6

RX channel 5

RX channel 4

RX channel 3

RX channel 2

RX channel 1

RX channel 0

Do not use

4

5

6

7

8

9

Y09

Y08

Y07

Y06

Y05

Y04

Y03

Y02

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

Y01

Y00

DNU

VSS

–

Do not use

–

Do not use

Power

Connect to ground

External active LOW reset

I2C SCL

XRES

P0[0]

P0[1]

I

–

I/O

I2C SDA

HSMODE_REQ (Request High Sensitvity Mode - lower touch refresh

rate - output)

32

P1[0]

I/O

–

33

34

35

P1[1]

P1[2]

P1[3]

I/O

–

HSYNC (Horizontal Timing signal - input)

TXDRIVE (Drive TX signal hi/lo - output)

VSYNC (Vertical blanking timing signal - input)

Note

10.See “Pin information” on page 10 for details on pin configuration.

Datasheet

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Pin information

Table 6

100-pin TQFP, 54 RX, CYAT8268X ^[10](continued)

Type

No.

Name

Description

Digital

Analog

36

37

P1[4]

P1[5]

I/O

–

ERROR (Set high when internal error is detected - output)

HSMODE_ACK (Acknowledge High Sensitivity Mode - lower touch

refresh rate - input)

I/O

–

38

39

40

41

42

43

44

45

P1[6]

P2[0]

P2[1]

VCCD

VDDD

VSS

I/O

–

COMM_INT

SWDIO / CMODE_REQ (Request Custom Mode - output)

SWDCLK / CMODE_ACK (Acknowledge Custom Mode - input)

Power

Digital core power supply input/output

Digital power supply input

Connect to ground

TX analog power supply input

RX analog power supply input

TX pump reservoir and filter capacitor connection point

Do not use

RX channel 53

Connect to ground

RX channel 52

RX channel 51

RX channel 50

Power

VSS

VDDA

46 VDDA_Q

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

VCCTX

DNU

Y53

VSS

Y52

Y51

Y50

Y49

Y48

Y47

Y46

Y45

Y44

Y43

Y42

Y41

–

I/O

Power

–

I/O

RX channel 49

RX channel 48

RX channel 47

RX channel 46

RX channel 45

RX channel 44

RX channel 43

RX channel 42

RX channel 41

Y40

RX channel 40

Note

10.See “Pin information” on page 10 for details on pin configuration.

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Pin information

Table 6

100-pin TQFP, 54 RX, CYAT8268X ^[10](continued)

Type

No.

Name

Description

Digital

Analog

I/O

72

73

74

75

76

77

78

79

80

81

82

83

84

Y39

Y38

Y37

Y36

Y35

Y34

Y33

Y32

Y31

Y30

Y29

Y28

Y27

–

RX channel 39

RX channel 38

RX channel 37

RX channel 36

RX channel 35

RX channel 34

RX channel 33

RX channel 32

RX channel 31

RX channel 30

RX channel 29

RX channel 28

RX channel 27

I/O

85 VDDA_Q

Power

RX analog power supply input

Connect to ground

RX channel 26

RX channel 25

RX channel 24

RX channel 23

RX channel 22

RX channel 21

RX channel 20

RX channel 19

RX channel 18

RX channel 17

RX channel 16

RX channel 15

RX channel 14

RX channel 13

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

VSS

Y26

Y25

Y24

Y23

Y22

Y21

Y20

Y19

Y18

Y17

Y16

Y15

Y14

Y13

–

I/O

Note

10.See “Pin information” on page 10 for details on pin configuration.

Datasheet

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Pin information

Y12

Y11

1

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

Y36

Y37

Y38

Y39

Y40

Y41

Y42

Y43

Y44

Y45

Y46

Y47

Y48

Y49

Y50

Y51

Y52

VSS

Y53

DNU

2

Y10

3

Y09

4

Y08

5

Y07

6

Y06

7

Y05

8

Y04

9

Y03

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

Y02

CYAT8268X

100-Pin TQFP

54 RX channels

Y01

Y00

DNU

Figure 8

100-pin TQFP, 54 RX, CYAT8268X

Datasheet

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Datasheet

Electrical specifications

7

Electrical specifications

This section lists CYAT8268X DC and AC electrical specifications.

7.1

Absolute maximum ratings

Table 7

Absolute maximum ratings

Symbol

T_STG

V_DDD

V_DDA

V_DDDR

Description

Storage temperature

Digital supply voltage

Analog supply voltage

Amplitude (V_PP) of digital

(V_DDD) supply ripple riding

on the DC voltage

Amplitude (V_PP) of analog

(V_DDA) supply ripple riding

on the DC voltage (TX pump

enabled)

Amplitude (V_PP) of analog

(V_DDA) supply ripple riding

on the DC voltage (TX pump

disabled)

Conditions

Min

–55

V_SS– 0.5

–

Typ

25

–

Max

125^[11]

6

100

Units

°C

–

V

DC to 20 MHz

mV

[12]

V_DDAR

DC to 20 MHz

–

100

DC to 150 kHz^[13]

150 kHz^[13]to 20 MHz

–

15

15 +

20 dB/decade

> 150 kHz^[13]

V_CCD

V_GPIO

Core supply voltage

Port 0 pin voltage

Port 1 / Port 2 pin voltage

Current into I/O pin

Electrostatic discharge

voltage, charge device

model

–

V_SS– 0.5

–25

–

2.3

6

7

V

Driver enabled

Driver disabled

–

V_DDD+ 0.5

I_IO

ESD_CDM

50

–

mA

V

750

ESD_HBM

Electrostatic discharge

voltage, human body model

100-pin TQFP

128-pin TQFP

6000

4000

–

7.2

Operating temperature

Table 8

Symbol

T_A

Operating temperature

Description

Ambient temperature

(A-grade)

Ambient temperature

(S-grade)

Conditions

Min

–40

Typ

–

Max

85

Units

°C

–

T_A

–40

–

105

Notes

11.Storing programmed devices at or above the ambient temperature specified by Flash_DRmay reduce flash

data retention time.

12.Analog supply ripple specifications are valid for the supply presented to the external resistor (for example,

label “V” Figure 4), not at the device VDDA and VDDA_Q pin.

13.If a 2.2-µF capacitor is used in place of a 1-µF capacitor, the threshold is 80 kHz.

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Electrical specifications

7.3

DC specifications

The specifications in this section are valid under these conditions:

–40°C  T_A 85°C for Grade-A devices, –40°C  T_A 105°C for Grade-S devices.

7.3.1

Flash specifications

The specifications in Table 9 are valid under these conditions: 1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V,

1.71 V  V_CCD 1.95 V, and 3.0 V  V_DDA 5.5 V. Typical values are specified at T_A= 25°C, V_DDD= V_CCD= 1.8 V, core

LDO disabled, and V_DDA= 3.0 V.

Table 9

Symbol

Flash_ENPBFlash write endurance

Flash specifications

Description

Conditions

Erase/write cycles per

block

Following maximum Flash

write cycles (Flash_ENPB),

T_A 55°C

Following maximum Flash

write cycles (Flash_ENPB),

T_A> 55°C

Min

10,000

Typ

–

Max

–

Units

cycles

Flash_DR

Flash data retention

20^[14]

–

years

10^[14]

Note

14.Storing programmed devices at or above the ambient temperature specified by Flash_DRmay reduce flash

data retention time. Infineon provides a retention calculator to calculate the retention lifetime based on

customer’s individual temperature profiles for operation over the ambient temperature range for the

device’s temperature rating. For more information, contact our support team at support@infineon.com.

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Electrical specifications

7.3.2

Chip-level DC specifications

The specifications in Table 10 are valid under these conditions: 1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V,

1.71 V  V_CCD 1.95 V, and 3.0 V  V_DDA 5.5 V. Typical values are specified at T_A= 25°C, V_DDD= V_CCD= 1.8 V, core

LDO disabled, and V_DDA= 3.0 V.

Table 10

Symbol

V_DDD

Chip-level DC specifications

Description

Digital supply voltage

Conditions

Core LDO enabled

(V_CCDoutput)

Min

3.0

Typ

–

Max

5.5

Units

V

Core LDO disabled

1.71

–

1.8

1.95

–

(V_CCDinput)^[15]

V_CCD

Digital core supply voltage Core LDO enabled

(V_CCDoutput)

Core LDO disabled

1.71

1.95

(V_CCDinput)^[15]

[15]

V_DDA

Analog supply voltage

V_DDAramp rate from ground –

to minimum voltage

TX pump disabled

3.0

–

5.5

100

PSA_RAMP

V/ms

PSD_RAMP

V_DDDramp rate from ground –

to minimum voltage

1^[16]

–

40

PSD_RAMPDOWNV_DDDramp down rate from

1.5 V to 1.0 V

–

I_{DDD_ACT}

I_{DDA_ACT}

I_{DDD_DS}

I_{DDA_DS}

I_{DDD_XR}

V_DDDactive current

V_DDAactive current

V_DDDdeep sleep current

V_DDAdeep sleep current

V_DDDcurrent, XRES = LOW

–

20

15

3

2

5

1

25

5

50

20

–

25

mA

µA

1.71 V ≤ V_DDD≤ 1.95 V

3.0 V ≤ V_DDD≤ 5.5 V

–

I_{DDA_XR}

I_{DDD_P}

V_DDAcurrent, XRES = LOW

V_DDDflash programming

and flash verify current

mA

Notes

15.These Min and Max limits are inclusive of noise. For proper operation, V_DDAor V_DDDwith combined noise

cannot go below or above the specified Min or Max limits.

16.If minimum ramp rate cannot be met, XRES should be asserted during voltage ramp (1.5 V > V_DDD> 1.0 V for

ramp-down or until voltage is stable for ramp-up). Note that a glitch on the I²C bus could occur during

voltage ramp in this case.

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Electrical specifications

7.3.3

I/O Port 0 (P0[0:1]) DC specifications

The Port 0 specifications in Table 11 are valid under these conditions: 1.71 V  V_DDD 1.95 V or

3.0 V  V_DDD 5.5 V, 1.71 V  V_CCD 1.95 V, and 3.0 V  V_DDA 5.5 V. Typical values are specified at T_A= 25°C,

V_DDD= V_CCD= 1.8 V, core LDO disabled, and V_DDA= 3.0 V.

Table 11

Symbol

V_IH

I/O Port 0 (P0[0:1]) DC specifications

Description

Input high voltage

Conditions

CMOS mode

Min

0.7 × V_DDD

Typ

–

Max

–

Units

V

1.8 V mode, V_EXT^[18]= 1.8 V, 0.7 × V_EXT

3.0 V ≤ V_DDD≤ 5.5 V

V_IL

Input low voltage

CMOS mode

–

0.3 × V_DDD

0.3 × V_EXT

1.8 V mode, V_EXT^[18]= 1.8 V,

3.0 V ≤ V_DDD≤ 5.5 V

V_OH

High output voltage

Reference to V_DDD

,

V

_DDD– 0.5

–

I_OH= 1 mA, V_DDD= 1.8 V

Reference to V_DDD

,

V_DDD– 0.6

I

_OH= 4 mA, V_DDD= 3.0 V

V_OL

Low output voltage

Input hysteresis

Output rise time Fast-Strong 25 pF load,

10%–90% V_DDD= 3.3 V

V_DDD≥ 1.71 V, I_OL= 10 mA

–

0.6

0.4

–

V

–

_DDD≥ 1.71 V, I_OL= 3 mA

–

0.1 × V_DDD

2

V_H

T_{RISE_OV}

12

ns

Output rise time

Slow-Strong

Output fall time Fast-Strong 25 pF load,

10%–90% V_DDD= 3.3 V

Output fall time

Slow-Strong

Input leakage current

(absolute value)

25 pF load,

10%–90% V_DDD= 3.3 V

10

1.5

10

–

60

12

60

T_{FALL_OV}

25 pF load,

10%–90% V_DDD= 3.3 V

T_A= 25°C, V_DDD= 3.0 V

T_A= 25°C, V_DDD= 0.0 V

[17]

I_IL

–

14

10

7

nA

µA

pF

C_IN

Input pin capacitance

Package and pin dependent

T_A= 25°C

C_OUT

R_INT

Output pin capacitance

Package and pin dependent

T_A= 25°C

–

7

Internal pull-up / pull-down Pin configured for internal

resistance

3.5

5.6

8.5

k

pull-up or pull-down; note

that all I/Os are Hi-Z during

chip initialization (after

XRES or Bootloader Exit)

Notes

17.Gang tested with all I/Os to 1 µA.

18.V_EXTis the external supply used to bias the pull-up resistor when used on an I²C bus.

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Electrical specifications

7.3.4

I/O Port 1 (P1[0:6]), Port 2 (P2[0:1]), and XRES DC specifications

The specifications in Table 12 are valid under these conditions: 1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V,

1.71 V  V_CCD 1.95 V, and 3.0 V  V_DDA 5.5 V. Typical values are specified at T_A= 25°C, V_DDD= V_CCD= 1.8 V, core

LDO disabled, and V_DDA= 3.0 V.

Table 12

Symbol

V_IH

I/O Port 1 (P1[0:6]), Port 2 (P2[0:1]), and XRES DC specifications

Description

Conditions

Min

Typ

–

Max

–

Units

Input voltage high threshold 1.8 V configuration

1.26

V

CMOS configuration

0.7 × V_DDD

–

XRES

Input voltage low threshold 1.8 V configuration

CMOS configuration

1.35

–

0.54

0.3 × V_DDD

V_IL

XRES

–

0.45

–

0.6

–

V_OH

V_OL

High output voltage

Low Output Voltage

Input hysteresis voltage

I_OH= 4 mA, V_DDD= 3.0 V

_OH= 1 mA, V_DDD= 1.8 V

I_OL= 8 mA, V_DDD= 3.3 V

_OL= 4 mA, V_DDD= 1.8 V

V_DDD– 0.6

V_DDD– 0.5

I

–

I

–

0.1 × V_DDD

2

V_H

T_{RISE_G}

Output rise time Fast-Strong 25 pF load,

10%–90% V_DDD= 3.3 V

12

ns

Output rise time

Slow-Strong

Output fall time Fast-Strong 25 pF load,

10%–90% V_DDD= 3.3 V

Output fall time

Slow-Strong

Input leakage (absolute

value)

25 pF load,

10%–90% V_DDD= 3.3 V

–

2

–

60

12

60

2

T_{FALL_G}

25 pF load,

10%–90% V_DDD= 3.3 V

–

[19]

I_IL

–

nA

pF

C_IN

Input pin capacitance

Package and pin dependent

T_A= 25°C

–

7

C_OUT

Output pin capacitance

Package and pin dependent

T_A= 25°C

–

7

[20]

R_INT

Internal pull-up/pull-down Pin configured for internal

resistance pull-up or pull-down

3.5

5.6

8.5

k

Notes

19.Gang tested with all I/Os to 1 µA.

20.XRES is input only with no internal pull-up or pull-down resistor.

Datasheet

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Datasheet

Electrical specifications

7.4

AC specifications

The specifications in this section are valid under these conditions:

–40°C  T_A 85°C for Grade-A devices, –40°C  T_A 105°C for Grade-S devices.

7.4.1

SWD interface AC specifications

The specifications in Table 13 are valid under these conditions: 1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V,

1.71 V  V_CCD 1.95 V, 3.0 V  V_DDA 5.5 V, and C_LOAD= 25 pF. Typical values are specified at T_A= 25°C,

V_DDD= V_CCD= 1.8 V, core LDO disabled, and V_DDA= 3.0 V.

Table 13

Symbol

f_SWDCLK

SWD interface AC specifications

Description

Conditions

Min

–

Typ

–

Max

14

8

Units

MHz

SWDCLK frequency

3.3 V  V_DDD 5 V

1.71 V  V_DDD3.3 V

T = 1 / f_SWDCLK

T_{SWDI_SETUP}SWDIO input setup before

SWDCLK HIGH

T / 4

–

ns

T_{SWDI_HOLD}SWDCIO input hold after

SWDCLK HIGH

T_{SWDO_VALID}SWDCLK HIGH to SWDIO

output valid

T_{SWDO_HOLD}SWDIO output hold after

SWDCLK HIGH

T = 1 / f_SWDCLK

T / 4

–

T / 2

–

1

7.4.2

Chip-level AC specifications

The specifications in Table 14 are valid under these conditions: 1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V,

1.71 V  V_CCD 1.95 V, and 3.0 V  V_DDA 5.5 V. Typical values are specified at T_A= 25°C, V_DDD= V_CCD= 1.8 V, core

LDO disabled, and V_DDA= 3.0 V.

Table 14

Symbol

T_XRST

Chip-level AC specifications

Description

Conditions

Min

10

Typ

–

Max

–

Units

µs

After V_DDDis valid

External reset (XRES) pulse

width

T_READY

T_CAL

Time from deassertion of

XRES to COMM_INT

Calibration routine

execution time

–

35

2500

±2

ms

%

F_IMOTOL1Frequency variation

at 37 MHz and 48 MHz

T_READY

XRES

COMM_INT

Figure 9

COMM_INT timing diagram

Datasheet

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Datasheet

Electrical specifications

7.4.3

I²C specifications

The specifications in Table 15 are valid under these conditions: 1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V,

1.71 V  V_CCD 1.95 V, and 3.0 V  V_DDA 5.5 V. Typical values are specified at T_A= 25°C, V_DDD= V_CCD= 1.8 V, core

LDO disabled, and V_DDA= 3.0 V. CYAT8268X does not require a clock-stretch capable host, but is fully compatible

with systems that perform clock-stretching.

To ensure proper I²C functionality in extreme bus conditions, refer to Infineon’s application note Using

CY8CTMA4/5XX I²C in Systems With Slow Clock Edges (001-81514)^[21]

.

Important Note: The P0[0] and P0[1] pins have I/O cells optimized for use on multi-drop buses. When the touch

device is powered off, the pin drivers do not load the attached bus, such that other devices attached to them may

continue to communicate.

T_SUDATI2C

70%

30%

70%

30%

SDA

SCL

1/f_SCL

T_HDSTAI2C

T_SPI2C

T_LOWI2C

T_BUFI2C

70%

30%

70%

30%

T_HIGHI2C

T_SUSTAI2C

T_SUSTOI2C

T_HDDATI2C

T_HDSTAI2C

Sr

P

S

Legend

S: I²C Start Condition

Sr: I²C Repeat Start Condition

P: I²C Stop Condition

Figure 10

I²C Bus timing diagram for Fast/Standard Mode

Note

21.Extreme bus conditions are considered to be a combination of the following conditions: High-capacitive bus

load, slow SCL fall time, and fast SDA rise/fall time. Infineon reference documents are available under NDA

through your local Infineon sales representative. You can also direct your requests to

automotive@cypress.com.

Datasheet

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Datasheet

Electrical specifications

Table 15

Symbol

f_SCLI2C

AC characteristics of the I²C SDA and SCL pins

Description

Standard Mode

Fast Mode

Units

Min

0

Max

100

–

Min

Max

400

–

SCL clock frequency

0

kHz

µs

T_HDSTAI2CHold time (repeated) start condition. After this

period, the first clock pulse is generated.

4

0.6

T_LOWI2C

T_HIGHI2C

LOW period of SCL clock

HIGH period of SCL clock

4.7

4

–

1.3

0.6

–

T_SUSTAI2CSetup time for repeated start condition

T_HDDATI2CData hold time

4.7

0

–

0.6

0

–

T_SUDATI2CData setup time

250

–

100

–

T_VDDATI2CData valid time

T_VDACKI2CData acknowledge time

T_SUSTOI2CSetup time for stop condition

–

4

3.45

–

0.6

0.9

–

V_HH

Input hysteresis high voltage,

1.71 V  V_DDD 1.95 V or 3.0 V  V_DDD 5.5 V

0.1 × V_DDD

–

0.1 × V_DDD

–

V

T_BUFI2C

T_SPI2C

Bus free time between a stop and start

condition

Pulse width of spikes that are suppressed by

input filter

4.7

–

1.3

50

–

µs

ns

C_BUS

V_{IL_I2C}

V_{IH_I2C}

Capacitance load for SDA or SCL

Input low voltage

Input high voltage

–

–0.5

0.7 × V_DDD

400

0.3 × V_DDD

–

–0.5

0.7 × V_DDD

400

0.3 × V_DDD

pF

V

–

V_{OL_I2C_L}Output low voltage (V_DDD≤ 2 V, 3 mA sink)

–

0.2 × V_DDD

–

0.2 × V_DDD

V_{OL_I2C_H}Output low voltage (V_DDD> 3 V, 3 mA sink)

–

0.4

3

–

0.4

3

6

I_{OL_I2C}

V_{H_I2C}

Output low current

Output low current V_OL= 0.6 V

Input hysteresis

mA

mV

0.1 × V_DDD

–

0.1 × V_DDD

–

Datasheet

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Datasheet

Packaging diagrams

8

Packaging diagrams

This section provides the CYAT8268X device packaging specifications.

51-85048 *K

Figure 11

100-pin TQFP (14 × 14 × 1.4 mm) A100SA/AZ0AB package outline, 51-85048

8.1

Thermal impedance and moisture sensitivity

Table 16

Thermal impedance and moisture sensitivity

Moisture sensitivity

level

Package

100-pin TQFP

Typical _JMAX

Typical _JA

Typical _JC

150°C

46°C/W ^[22]

6°C/W ^[22]

3

8.2

Solder reflow specifications

Table 17 lists the maximum solder reflow peak temperature.

Important Note

Thermal ramp rate during preheat should be 3°C/s or lower. The packaged device supports Pb-free solder reflow

profile as per section 5.6 of J-STD-020.D1.

Table 17

Solder reflow specifications

Package

All packages

Maximum peak temperature

Time at maximum temperature

260°C

30 seconds

Note

22.Measured at 25°C ambient on a 4-layer PCB.

Datasheet

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Datasheet

Ordering information

9

Ordering information

Table 18 lists the CYAT8268X touchscreen controllers.

Table 18

Ordering information ^[23]

MPN

CYAT82687-100AA31

CYAT82687-100AS31

CYAT82687-100AA39

CYAT82687-100AS39

CYAT82687-100AA46

CYAT82687-100AS46

CYAT82687-100AA54

CYAT82687-100AS54

31

39

46

54

10



9.1

Ordering code definitions

-

CY AT

X

XXX XXX

X

XX

T

Packaging:

T = Tape and reel

Blank/non-T = Tray

Num ber of receive channels: 54, 46, 39, 31

Tem perature range:

A = -40°C to +85°C

S = -40°C to +105°C

Package type: A = TQFP

Num ber of pins: 100

Product feature set: See ordering inform ation table

Sensor configuration: 2 = In-Cell

M arket segm ent:

6 = Autom otive slider;

7 = Autom otive Touchpad;

8 = Autom otive Touchscreen

Business unit: AT = Autom otive

M arketing code: CY = CYPRESS (an Infineon com pany)

Note

23.All devices have the following base features: Water Rejection, DisplayArmor™, AutoArmor™, DualSense™,

CAPSENSE™ buttons, and Large Object Detection and Rejection.

Datasheet

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Datasheet

Acronyms

10

Acronyms

Table 19

Acronym

CPU

DNU

DSD

EMI

Acronyms used in this document

Description

central processing unit

do not use

dual-solid diamond pattern

electromagnetic interference

exposed pad

EP

ESD

FPC

GPS

I²C

electrostatic discharge

flexible printed circuit

global positioning system

inter-integrated circuit

input/output

I/O

ITO

indium tin oxide

LCD

liquid crystal display

low dropout regulator

Manhattan-3 pattern

manufacturing test kit

printed circuit board

polyethylene terephthalate

packet interface protocol

programmable system-on-chip

quad flat no-lead

LDO

MH3

MTK

PCB

PET

PIP

PSoC™

QFN

RF

radio frequency

serial I²C clock

SCL

SD

signal disparity

SDA

SOL

SMT

SNR

SSD

SWD

SWDCLK

TRM

TTHE

V_PP

serial I²C data

sensor-on-lens

surface mount technology

signal-to-noise ratio

single-solid diamond pattern

serial wire debug

serial wire debug clock

technical reference manual

touch tuning host emulator

volts peak-to-peak

Datasheet

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Datasheet

Reference documents

11

Reference documents

Infineon has created a collection of documents to support the design of PSoC™ Automotive Multitouch

touchscreen controllers.

The following list will guide you in identifying the proper document for your task:

• PCB/FPC schematic and layout design

• ITO panel design

• Driver development

• Manufacturing (MFG)

• System performance evaluation

Infineon’s PSoC™ Automotive Multitouch technology is Infineon confidential information and is protected

through a Non-Disclosure Agreement (NDA). These documents are not publicly available on the Infineon website.

Contact your local Infineon office to request any of these documents pursuant to the aforementioned NDA. You

can also direct your requests to automotive@cypress.com.

Datasheet

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Datasheet

Reference documents

Table 20

Document

Reference specifications

Document title

PCB

ITO

Description

Driver MFG System

number

FPC panel

Solution specifications

001-49389

PSoC™ Automotive

Multitouch

Contains Infineon

touchscreen

–

✔

–

✔

Touchscreen Controller performance parameter

Performance

Parameters

definitions, justification

for parameters, and

parameter test

methodologies.

001-50467

PSoC™ Automotive

Multitouch

A system-level design

guide for building a

✔

–

Touchscreen Controller capacitive touchscreen

Module Design Best

Practices

module, covering topics

such as touchscreen

traces, shielding,

mechanical design,

FPC/PCB design, and

LCD considerations.

001-81514

Using CY8CTMA4/5XX

I²C in Systems With

Slow Clock Edges

Discusses how to ensure

proper I²C functionality

in extreme bus

✔

–

conditions^[24]

.

001-83948

001-63571

Touch Tuning Host

Emulator Guide

Describes the Touch

Tuning Host Emulator

Software

Describes the

CY3295-MTK

–

✔

CY3295-MTK PSoC™

Multitouch

Manufacturing Test Kit Manufacturing Test Kit

User Guide

✔

–

001-81891

The Touch Driver for

Android (TTDA) User

Guide

Contains information on

the example Android

touch driver

–

✔

–

External specifications: These specifications are not created or owned by Infineon, but directions on how to

acquire or access them can be provided upon request by contacting automotive@cypress.com.

UM10204

ISO11452

I²C-bus specification and user manual

Component test methods for electrical

disturbances in Road Vehicles Package

✔

–

✔

CISPR25

Vehicles, boats and internal combustion engines –

Radio disturbance characteristics – Limits and

methods of measurement for the protection of

on-board receivers

✔

–

✔

J-STD-020D.1 Moisture/Reflow

Sensitivity

Classification for

Nonhermetic Surface

Mount Devices

–

✔

Note

24.Extreme bus conditions are considered to be a combination of the following conditions: High-capacitive bus

load, slow SCL fall time, and fast SDA rise/fall time.

Datasheet

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Datasheet

Document conventions

12

Document conventions

12.1

Units of measure

Table 21

Symbol

°C

µA

µF

µs

µW

Ω

Units of measure

Unit of measure

degrees Celsius

microampere

microfarad

microsecond

microwatt

ohm

Hz

hertz

k

kilo-ohm

kbps

kHz

mA

mm

ms

kilobits per second

kilohertz

milliampere

millimeter

millisecond

millivolt

mV

mW

Mbps

MHz

nA

ns

pF

milliwatt

megabits per second

megahertz

nanoampere

nanosecond

picofarad

s

second

12.2

Port nomenclature

Px[y] describes a particular bit “y” available within an I/O port “x.” For example, P4[2] reads “port 4, bit 2."

Px[y:z] describes a particular range of bits “y to z” within an I/O port named “Px.” For example, P4[0:5] refers to

bits 0 through 5 within an I/O port named P4.

Datasheet

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Datasheet

Glossary

13

Glossary

Table 22

Term

Glossary

Definition

accuracy

The maximum position error across the touchscreen, measured in millimeters, along a

straight line between the actual finger position and the reported finger position. Accuracy

is measured across the core and full panel. See Infineon’s PSoC™ Automotive Multitouch

Touchscreen Controller Performance Parameters (001-49389)^[25]specification for more

information.

All-Points

Cypress brand name for PSoC™ Automotive Multitouch devices capable of tracking the

motion of multiple fingers.

AMOLED/OLED

conversion

Type of display using Active Matrix (AM) Organic Light Emitting Diodes (OLED).

The process of measuring the capacitance of an electrode connected to a pin (self

capacitance) or the capacitance between a pair of electrodes connected to different pins

(mutual capacitance). The result is a number that can be processed by the channel engine

and CPU.

core

That portion of the touchscreen, responsive to touch, less a perimeter area whose width

is the larger of 3.5 mm or half the width of the finger (for example, less a perimeter band

4.5-mm wide for a 9-mm finger).

core LDO

Low Drop Out Regulator that sources power to the digital core when enabled. Input to the

LDO is VDDD. Output of the LDO is connected to the digital supply pin VCCD. When the core

LDO is disabled, power must be externally applied to the digital core supply pin VCCD.

cover lens

DCVCOM

linearity

The top layer in the touchscreen stackup that provides mechanical stability and

protection for the touchscreen sensor.

Type of Liquid Crystal Display where the common electrode (VCOM) is driven by DC

voltage.

The deviation of the position data from a best-fit straight line across the touchscreen,

measured in millimeters. Linearity is measured across the core and full panel. See

Infineon’s PSoC™ Automotive Multitouch Touchscreen Controller Performance Parameters

(001-49389)^[25]specification for more information.

mutual

capacitance

The capacitance between two touchscreen electrodes.

refresh rate

The frequency at which consecutive frames of touchscreen data are made available in a

data buffer while a finger is present on the touchscreen. See Infineon’s PSoC™ Automotive

Multitouch Touchscreen Controller Performance Parameters (001-49389)^[25]specification

for more information.

RX

Receive. A touchscreen electrode or touchscreen controller sense pin, mapped or

switched to a charge sensing circuit within the controller (known as a receive channel).

scan

sense pin

The conversion of all sensor capacitances to digital values.

A pin that can be multiplexed to RX or TX.

signal-to-noise

ratio (SNR)

The ratio between a capacitive finger signal and system noise.

signal disparity

(SD)

The ratio of maximum measured signal when the touchscreen is grounded and maximum

measured signal when the touchscreen is isolated from ground.

Note

25.Cypress reference documents are available under NDA through your local Infineon sales representative. You

can also direct your requests to automotive@cypress.com.

Datasheet

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Datasheet

Glossary

Table 22

Term

Glossary ^(continued)

Definition

stackup

TX

Layers of materials, in defined assembly order, that make up a touchscreen sensor.

Transmit. A touchscreen electrode or touchscreen controller sense pin, mapped or

switched to a charge forcing circuit within the controller. This charge forcing circuit drives

a periodic waveform onto one or more touchscreen electrodes, which are coupled

through mutual capacitance to adjacent receive electrodes.

Datasheet

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Datasheet

Revision history

Document

Date

Description of changes

revision

**

2016-09-30

New datasheet.

Updated Pin information:

Updated Figure 7.

*A

*B

2016-10-26

2017-09-01

Updated Table 6.

Updated to new template.

Updated Ordering information:

No change in part numbers.

Updated Ordering code definitions.

Updated to new template.

Completing Sunset Review.

Updated Packaging diagrams:

*C

*D

*E

2020-04-13

2020-10-29

2021-03-30

spec 51-85048 – Changed revision from *J to *K.

Obsolete document.

Completing Sunset Review.

Reactivated document.

Updated to new template.

Updated Touchscreen System overview:

Updated Figure 1.

Updated Power supply information:

Updated Figure 3.

Updated Figure 4.

Updated Electrical specifications:

Updated DC specifications:

Updated Chip-level DC specifications:

Updated Table 10.

Updated I/O Port 0 (P0[0:1]) DC specifications:

Referred Note “XRES is input only with no internal pull-up or pull-down

resistor.” in R_INTparameter in Table 11.

*F

2021-04-22

Updated AC specifications:

Updated Chip-level AC specifications:

Updated Table 14.

Updated I2C specifications:

Updated Table 15.

Updated Packaging diagrams:

No change in revisions.

Updated Thermal impedance and moisture sensitivity:

Added Note 22 and referred the same note in values of Typical _JAand

Typical _JCcorresponding to 100-pin TQFP in Table 16.

Datasheet

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Datasheet

Revision history

Document

Date

Description of changes

revision

Updated Pin information:

Updated description.

Updated Electrical specifications:

Updated Absolute maximum ratings:

Updated all details corresponding to V_DDDRand V_DDARparameters in

Table 7.

Updated DC specifications:

Updated Chip-level DC specifications:

Updated all details corresponding to PSD_RAMPand added PSD_RAMPDOWN

parameters in Table 10.

*G

2021-08-18

Updated I/O Port 0 (P0[0:1]) DC specifications:

Removed Note “XRES is input only with no internal pull-up or pull-down

resistor.” and its reference in R_INTparameter in Table 11.

Updated details under “Conditions” column corresponding to R_INT

parameter in Table 11.

Updated Packaging diagrams:

Updated Thermal impedance and moisture sensitivity:

Updated and added details corresponding to 100-pin TQFP in Table 16.

Updated to the PSoC™ Automotive Multitouch branding guidelines.

Updated Electrical specifications:

*H

*I

2022-05-19

2022-08-08

Updated Absolute maximum ratings:

Updated all details corresponding to ESD_HBMparameter in Table 7.

Updated Document Title to read as “CYAT8268X, PSoC™ Automotive

Multitouch Generation 6XL Hybrid In-cell Datasheet”.

Updated Electrical specifications:

Updated Absolute maximum ratings:

Updated Table 7.

Migrated to Infineon template.

Datasheet

44

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Datasheet

Revision history

Document

Date

Description of changes

revision

Updated Touchscreen System specifications:

Updated System Performance specifications:

Updated description.

Updated Electrical specifications:

Updated DC specifications:

Added description.

Updated Flash specifications:

Updated description.

Updated Table 9.

Updated Note 11.

Updated Chip-level DC specifications:

Updated description.

Updated I/O Port 0 (P0[0:1]) DC specifications:

Updated description.

*J

2023-05-09

Updated Table 11.

Updated I/O Port 1 (P1[0:6]), Port 2 (P2[0:1]), and XRES DC

specifications:

Updated description.

Updated Table 12.

Updated AC specifications:

Added description.

Updated SWD interface AC specifications:

Updated description.

Updated Chip-level AC specifications:

Updated description.

Updated I2C specifications:

Updated description.

Updated to new template.

Completing Sunset Review.

Datasheet

45

002-16705 Rev. *J

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Please read the Important Notice and Warnings at the end of this document

Trademarks

All referenced product or service names and trademarks are the property of their respective owners.

IMPORTANT NOTICE

WARNINGS

The information given in this document shall in no Due to technical requirements products may contain

Edition 2023-05-09

Published by

event be regarded as a guarantee of conditions or dangerous substances. For information on the types

characteristics (“Beschaffenheitsgarantie”).

in question please contact your nearest Infineon

Technologies office.

With respect to any examples, hints or any typical

Infineon Technologies AG

81726 Munich, Germany

values stated herein and/or any information Except as otherwise explicitly approved by Infineon

regarding the application of the product, Infineon Technologies in a written document signed by

Technologies hereby disclaims any and all authorized

representatives

of

Infineon

warranties and liabilities of any kind, including Technologies, Infineon Technologies’ products may

without limitation warranties of non-infringement of not be used in any applications where a failure of the

intellectual property rights of any third party.

product or any consequences of the use thereof can

reasonably be expected to result in personal injury.

In addition, any information given in this document

is subject to customer’s compliance with its

obligations stated in this document and any

applicable legal requirements, norms and standards

concerning customer’s products and any use of the

product of Infineon Technologies in customer’s

applications.

Do you have a question about this

document?

Email:

erratum@infineon.com

The data contained in this document is exclusively

intended for technically trained staff. It is the

responsibility of customer’s technical departments

to evaluate the suitability of the product for the

intended application and the completeness of the

product information given in this document with

respect to such application.

Document reference

002-16705 Rev. *J


型号：	CYAT82687-100AA54
厂家：	Infineon
描述：	PSoC™ Automotive Multitouch Gen6XL
文件：	总46页 (文件大小：524K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CYAT82687-100AA54 [INFINEON]

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