ESD5V3U2U-03LRH [INFINEON]
Ultra-Low Capacitance ESD Diode Array; 超低电容ESD二极管阵列
| 型号： | ESD5V3U2U-03LRH |
| 厂家： | 
Infineon |
| 描述： | Ultra-Low Capacitance ESD Diode Array |
| 文件： | 总8页 (文件大小：554K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ESD5V3U2U...
Ultra-Low Capacitance ESD Diode Array
• ESD / transient protection of high-speed
data lines exceeding
IEC61000-4-2 (ESD): 20 kV (air / contact)
IEC61000-4-4 (EFT): 40 A (5/50 ns)
IEC61000-4-5 (surge): 3 A (8/20 µs)
• Max. working voltage: 5.3 V
• Extremely low capacitance: down to 0.2 pF
• Very low clamping voltage: 12 V typ.
• Extremely low forward clamping voltage: 4 V typ.
• Very low reverse current: < 1 nA typ.
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101
Applications
• USB 2.0, 10/100/1000 Ethernet, FireWire, DVI
HDMI, S-ATA
• Mobile communication
• Consumer products (STB, MP3; DVD, DSC...)
• LCD displays, camera
• Notebooks and destop computers, peripherals
ESD5V3U2U-03F
ESD5V3U2U-03LRH
1
2
3
Type
ESD5V3U2U-03F
Package
TSFP-3
Configuration
2 lines, uni-directional*
Marking
Z1
ESD5V3U2U-03LRH
TSLP-3-7
2 lines, uni-directional*
Z1
* or 1 line, bi-directional between pins 1 and 2, if pin 3 is not connected
2008-09-04
1
ESD5V3U2U...
Maximum Ratings at T = 25°C, unless otherwise specified
Parameter
ESD contact/ air discharge
Peak pulse current (t = 8 / 20 µs)
Symbol
V
ESD
I
pp
Value
20
Unit
kV
A
1)
2)
3
p
°C
Operating temperature range
Storage temperature
T
T
-40...125
-65...150
op
stg
Electrical Characteristics at T = 25°C, unless otherwise specified
A
Parameter
Symbol
Values
Unit
min.
typ. max.
Characteristics -
-
6
-
-
5.3
-
V
Reverse working voltage
Breakdown voltage
V
V
RWM
(BR)
I
= 1 mA, from pin 1 to 3
(BR)
-
< 1
50
nA
V
Reverse current
I
R
V = 5.3 V, from pin 1 to 3
R
Clamping voltage
V
V
CL
FC
2)
I
= 1 A, t = 8/20µs , from 1/2 to 3
-
-
10
12
13
15
PP
p
2)
I
= 3 A, t = 8/20µs , from 1/2 to 3
PP
p
Forward clamping voltage
2)
I
= 1 A, t = 8/20µs , from 3 to 1/2
-
-
2
4
4
6
PP
p
2)
I
= 3 A, t = 8/20µs , from 3 to 1/2
PP
p
pF
Line capacitance, V = 0 V, f = 1 MHz
from pin 1/2 to 3
from pin 1 to 2, pin 3 not connected
C
T
R
3)
-
-
0.4
0.2
0.6
0.4
1V
according to IEC61000-4-2
ESD
2I according to IEC61000-4-5
pp
3Total capacitance line to ground
2008-09-04
2
ESD5V3U2U...
Clamping voltage, V = ƒ(I )
Forward clamping voltage V = ƒ(I )
FC PP
cl
pp
t = 8 / 20 µs, from pin 1/2 to 3
t = 8 / 20 µs, from pin 3 to 1/2
p
p
13
V
6
V
11
10
9
4
3
2
1
0
8
7
6
A
A
0
1
2
4
0
1
2
3
5
I
I
pp
pp
Reverse current I = ƒ (T )
Diode capacitance C = ƒ (V )
R
A
T
R
V = Parameter, from pin 1/2 to 3
f = 1MHz, from pin 1/2 to 3
R
10 -6
A
0.6
pF
10 -7
10 -8
0.4
0.3
0.2
0.1
0
10 -9
10 -10
10 -11
25
°C
V
50
75
100
150
0
1
2
3
5
T
V
R
A
2008-09-04
3
ESD5V3U2U...
Line capacitance C = ƒ (f)
Line capacitance C = ƒ(T )
T A
T
V = parameter, from pin 1/2 to 3
V = 0 V, f = 1 MHz
R
R
0.7
pF
0.6
pF
0.5
VR=0V
0.4
5.3 V
0.4
0.3
0.2
0.1
0
VR=5.3V
0 V
0.3
0.2
0.1
0
MHz
°C
0
500
1000
1500
2000
3000
-50
-25
0
25
50
100
T
f
A
2008-09-04
4
ESD5V3U2U...
Application example ESD5V3U2U...
2 lines, uni-directional
2 protected high-speed I/O data lines
ESD sensitive
device
I/O
I/O
2
1
The protection diode should be
placed very close to the location
where the ESD or other transients
can occur to keep loops and
inductances as small as possible.
Pin 3 should be connected directly to
a ground plane on the board.
0.4 pF typ.
3
Application example ESD5V3U2U...
1 line, bi-directional
1 protected high-speed I/O data lines
ESD sensitive
I/O
I/O
device
2
1
The protection diode should be
placed very close to the location
where the ESD or other transients
can occur to keep loops and
inductances as small as possible.
Pin 3 should not be connected on
the board.
0.2 pF typ.
3
2008-09-04
5
Package TSFP-3
ESD5V3U2U...
Package Outline
0.0ꢀ
1.2
0.0ꢀ
0.04
0.2
0.ꢀꢀ
3
1
2
0.0ꢀ
0.0ꢀ
0.0ꢀ
0.2
0.1ꢀ
0.4
0.0ꢀ
0.4
Foot Print
0.4
0.4
0.4
Marking Layout (Example)
Manufacturer
BCR847BF
Type code
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
0.3
0.7
1.3ꢀ
Pin 1
2008-09-04
6
Package TSLP-3-7
ESD5V3U2U...
Package Outline
Top view
Bottom view
+0.01
-0.03
0.39
0.0ꢀ
0.6
Cathode2)
marking
1)
0.03ꢀ
0.0ꢀ MAX.
0.ꢀ
3
2
3
1
1
2
0.0ꢀ
1)
0.3ꢀ
Pin 1
marking
0.03ꢀ
2x0.1ꢀ
1) Dimension applies to plated terminal
2) Only for diodes, cathode marking on pin 3
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.6
0.4ꢀ
R0.1
0.2
0.22ꢀ
0.2
0.17
0.22ꢀ
0.1ꢀ
Copper
Solder mask
Stencil apertures
Marking Layout
Type code
Type code
Pin 1 marking
Cathode marking
Standard
Only for diodes, cathode marking on pin 3
Standard Packing
Reel ø180 mm = 1ꢀ.000 Pieces/Reel
Standard
4
Only for diodes, cathode marking on pin 3
0.ꢀ
4
Pin 1
marking
Cathode
marking
0.76
0.76
2008-09-04
7
ESD5V3U2U...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
2008-09-04
8
相关型号：
ESD5V3U2U-03LRH-E6327
Trans Voltage Suppressor Diode, 5.3V V(RWM), Unidirectional, 2 Element, Silicon, ROHS COMPLIANT, TSLP-3-7, 3 PIN
INFINEON
ESD5V3U2U03FH6327XTSA1
Trans Voltage Suppressor Diode, 5.3V V(RWM), Unidirectional, 2 Element, Silicon, ROHS COMPLIANT, TSFP-3, 3 PIN
INFINEON
ESD5V3U2U03LRHE6327XTMA1
Trans Voltage Suppressor Diode, 5.3V V(RWM), Unidirectional, 2 Element, Silicon, ROHS COMPLIANT, TSLP-3-7, 3 PIN
INFINEON
ESD5V3U4UHDMIE6327XTSA1
Trans Voltage Suppressor Diode, 5.3V V(RWM), Unidirectional, 4 Element, Silicon, GREEN, PLASTIC, TSLP-9-1, 9 PIN
INFINEON
©2020 ICPDF网 联系我们和版权申明