FS03MR12A6MA1B [INFINEON]
PinFin Base Plate;
| 型号： | FS03MR12A6MA1B |
| 厂家： | 
Infineon |
| 描述： | PinFin Base Plate |
| 文件： | 总15页 (文件大小：1591K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FS03MR12A6MA1B
™
HybridPACK Drive module
™
™
HybridPACK Drive module with CoolSiC Automotive MOSFET
Features
• Electrical features
- VDSS = 1200 V
- ID nom = 400 A
- New semiconductor material - Silicon Carbide
- Low RDSon
- Low Switching Losses
- Low Qg and Crss
- Low Inductive Design <10nH
- Tvj op = 150 °C
• Mechanical features
- 4.2 kV DC 1 sec Insulation
- High Creepage and Clearance Distances
- Compact design
- High Power Density
- Direct Cooled PinFin Base Plate
- High Performance Si3N4 Ceramic
- Guiding elements for PCB and cooler assembly
- Integrated NTC temperature sensor
- PressFIT Contact Technology
- RoHS compliant
- UL 94 V0 module frame
Potential applications
• Automotive Applications
• Hybrid Electrical Vehicles (H)EV
• Motor Drives
• Commercial Agriculture Vehicles
Description
T
T
T
Type
Package
Marking
™
FS03MR12A6MA1B
HybridPACK Drive Module
SP001720764
Datasheet
www.infineon.com
Please read the Important Notice and Warnings at the end of this document
1.00
2021-03-23
FS03MR12A6MA1B
™
HybridPACK Drive module
Table of contents
Table of contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Body diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
NTC-Thermistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Module label code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
1
2
3
4
5
6
7
8
Datasheet
2
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FS03MR12A6MA1B
™
HybridPACK Drive module
1 Package
1
Package
Table 1
Insulation coordination
Symbol Note or test condition
Parameter
Values
4.2
Unit
Isolation test voltage
VISOL
RMS, f = 0 Hz, t = 1 sec
kV
Material of module
baseplate
Ni+Cu1)
Internal isolation
Creepage distance
Creepage distance
Clearance
basic insulation (class 1, IEC 61140)
Si3N4
9.0
dCreep terminal to heatsink
mm
mm
mm
mm
dCreep terminal to terminal
dClear terminal to heatsink
dClear terminal to terminal
CTI
9.0
4.5
Clearance
4.5
Comparative tracking index
1) Ni plated Cu baseplate
> 200
Table 2
Characteristic values
Parameter
Symbol Note or test condition
Values
Min. Typ. Max.
641)
Unit
Pressure drop in cooling
circuit
Δp
ΔV/Δt = 10 dm³/min, 50% water/50%
ethylenglycol, TF = 60 °C
mbar
bar
Maximum pressure in
cooling circuit
p
Tbaseplate < 40°C (relative pressure)
Tbaseplate > 40°C (relative pressure)
2.5
2.0
8.5
Stray inductance module
LsCE
nH
Module lead resistance,
terminals - chip
RCC'+EE' TF = 25°C, per switch
0.75
mΩ
Storage temperature
Tstg
-40
1.8
125
2.2
°C
Mounting torque for modul
mounting
M
Screw M4 baseplate to heatsink
2.0
Nm
Weight
G
720
g
1) Cooler design and flow direction according to application note AN-HPDPERF-ASSEMBLY.
2
MOSFET
Table 3
Maximum rated values
Symbol Note or test condition
Parameter
Values
1200
Unit
Drain-source voltage
DC drain current
VDSS
Tvj = 25 °C
V
A
A
V
ID nom VGS = 15 V, TF = 60 °C
Tvjmax = 175 °C
400
Pulsed drain current
Gate-source voltage
ID pulse verified by design, tp limited by Tvjmax
800
VGSS
-10/+20
Datasheet
3
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FS03MR12A6MA1B
™
HybridPACK Drive module
2 MOSFET
Table 4
Characteristic values
Parameter
Symbol Note or test condition
Values
Unit
Min. Typ. Max.
Drain-source on resistance
Gate threshold voltage
RDS(on) ID = 400 A, VGS = 15 V
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
2.75
4.00
4.55
4.40
3.70 mΩ
VGS(th) ID = 240 mA, VGS = VDS
,
3.25
5.55
V
(tested afte 1 ms pulse
at VGS= +20 V)
Total gate charge
Internal gate resistor
Input capacitance
QG
RGint
Ciss
VDS = 600 V, VGS = -5/+15 V
1.32
0.23
42.6
µC
Ω
Tvj = 25 °C
Tvj = 25 °C
f = 1 MHz, VDS = 600 V,
VGS = 0 V
nF
Output capacitance
Coss
Crss
f = 1 MHz, VDS = 600 V,
VGS = 0 V
Tvj = 25 °C
Tvj = 25 °C
Tvj = 25 °C
1.86
0.17
438
nF
nF
µJ
Reverse transfer capacitance
COSS stored energy
f = 1 MHz, VDS = 600 V,
VGS = 0 V
EOSS
VDS = 600 V,
VGS = -5/+15 V
Drain-source leakage current
Gate-source leakage current
IDSX
IGSS
td on
VGS = -5 V, VDSS = 1200 V Tvj = 25 °C
VGS = 20 V, VDS = 0 V Tvj = 25 °C
100
400
µA
nA
ns
Turn-on delay time,
inductive load
ID = 400 A, RGon = 5.1 Ω, Tvj = 25 °C
77
62
VGS = -5/+15 V,
Tvj = 125 °C
VDS = 600 V
Tvj = 150 °C
59
Rise time (inductive load)
tr
td off
tf
ID = 400 A, RGon = 5.1 Ω, Tvj = 25 °C
79
ns
ns
VGS = -5/+15 V,
Tvj = 125 °C
VDS = 600 V
70
Tvj = 150 °C
69
Tuen-off delay time,
inductive load
ID = 400 A, RGoff = 5.1 Ω, Tvj = 25 °C
263
287
294
64
VGS = -5/+15 V,
Tvj = 125 °C
VDS = 600 V
Tvj = 150 °C
Fall time (inductive load)
ID = 400 A, RGoff = 5.1 Ω, Tvj = 25 °C
ns
VGS = -5/+15 V,
Tvj = 125 °C
VDS = 600 V
64
Tvj = 150 °C
65
Turn-on energy loss per
pulse
Eon
ID = 400 A, RGon = 5.1 Ω, Tvj = 25 °C,
19.48
mJ
VGS = -5/+15 V,
di/dt = 4 kA/µs
VDS = 600 V, Lσ = 20 nH
Tvj = 125 °C,
19.85
20.16
di/dt = 4.6 kA/µs
Tvj = 150 °C,
di/dt = 4.6 kA/µs
Datasheet
4
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FS03MR12A6MA1B
™
HybridPACK Drive module
3 Body diode
Table 4
Characteristic values (continued)
Symbol Note or test condition
Parameter
Values
Min. Typ. Max.
17.61
Unit
Tuen-off energy loss per
Eoff
ID = 400 A, RGoff = 5.1 Ω, Tvj = 25 °C,
mJ
pulse
VGS = -5/+15 V,
du/dt = 7.3 kV/µs
VDS = 600 V, Lσ = 20 nH
Tvj = 125 °C,
17.95
18.21
5300
4800
du/dt = 7.2 kV/µs
Tvj = 150 °C,
du/dt = 7.1 kV/µs
Short circuit data
ISC
VGS = -5/+15 V,
VDD = 800 V,
tSC = 3 µs,
Tvj = 25 °C
A
VDSmax = VDSS-LsDS*di/dt,
RG = 5.1 Ω
tSC = 3 µs,
Tvj = 150 °C
Thermal resistance, junction
to cooling fluid
RthJF
Tvj op
per MOSFET, ∆V/∆t = 10.0 dm³/min; fluid =
50% water/50% ethylenglycol, TF = 60 °C
0.1 0.1081 K/W
)
Temperature under
switching conditions
-40
150
°C
1) EoL criteria see AQG324, verified by characterization with 4.5 sigma. Cooler design and flow direction according
to application note AN-HPDPERF-ASSEMBLY
3
Body diode
Table 5
Maximum rated values
Symbol Note or test condition
ISD Tvjmax = 175 °C, VGS = -5 V TF = 60 °C
Parameter
Values
Unit
DC body diode forward
current
210
A
Pulsed body diode current
ISD pulse verified by design, tp limited by Tvjmax
800
A
Table 6
Characteristic values
Parameter
Symbol Note or test condition
Values
Unit
Min. Typ. Max.
Forward voltage
VDSR
ISD = 400 A, VGS = -5 V
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
4.42
4.22
4.16
165
287
309
6.15
V
Peak reverse recovery
current
Irrm
ISD = 400 A, Vr = 600 V,
VGS = -5 V
A
Datasheet
5
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FS03MR12A6MA1B
™
HybridPACK Drive module
4 NTC-Thermistor
Table 6
Characteristic values (continued)
Symbol Note or test condition
Parameter
Values
Unit
Min. Typ. Max.
Recovered charge
Qrr
ISD = 400 A, Vr = 600 V,
VGS = -5 V
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
11.20
18.10
19.30
1.4
µC
Reverse recovery energy
Erec
ISD = 400 A, Vr = 600 V,
VGS = -5 V
Tvj = 25 °C,
-di/dt = 5.9 kA/µs
mJ
Tvj = 125 °C,
4.1
4.7
-di/dt = 6.9 kA/µs
Tvj = 150 °C,
-di/dt = 6.9 kA/µs
4
NTC-Thermistor
Table 7
Characteristic values
Parameter
Symbol Note or test condition
Values
Unit
Min. Typ. Max.
Rated resistance
Deviation of R100
Power dissipation
B-value
R25
ΔR/R
P25
TNTC = 25 °C
5
kΩ
%
TNTC = 25 °C, R100 = 493 Ω
TNTC = 25 °C
-5
5
20
mW
K
B25/50 R2 = R25 exp[B25/50(1/T2-1/(298,15 K))]
B25/80 R2 = R25 exp[B25/80(1/T2-1/(298,15 K))]
B25/100 R2 = R25 exp[B25/100(1/T2-1/(298,15 K))]
3375
3411
3433
B-value
K
B-value
K
Datasheet
6
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FS03MR12A6MA1B
™
HybridPACK Drive module
5 Characteristics diagrams
5
Characteristics diagrams
pressure drop in cooling circuit,
Δp = f(ΔV/Δt)
TF = 60 °C, fluid = 50% water/50% ethylenglycol
output characteristic (typical), MOSFET
ID = f(VDS
VGS = 15 V
)
120
100
80
60
40
20
0
800
600
400
200
0
-200
-400
-600
-800
-4.0 -3.0 -2.0 -1.0 0.0
1.0
2.0
3.0
4.0
4
5
6
7
8
9
10 11 12 13 14
output characteristic (typical), MOSFET
ID = f(VDS
transfer characteristic (typical), MOSFET
ID = f(VGS
)
)
Tvj = 25 °C
VDS = 20 V
800
800
600
400
200
0
600
400
200
0
0.0
1.0
2.0
3.0
4.0
5.0
2
4
6
8
10
12
Datasheet
7
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FS03MR12A6MA1B
™
HybridPACK Drive module
5 Characteristics diagrams
Drain source on-resistance (typical), MOSFET
RDS(on) = f(Tvj)
drain source on-resistance (typical), MOSFET
RDS(on) = f(ID)
ID = 400 A, VGS = 15 V
VGS = 15 V
5
4
3
2
1
0
6
5
4
3
2
1
0
25
50
75
100
125
150
0
100 200 300 400 500 600 700 800
capacity characteristic (typical), MOSFET
C = f(VDS
switching losses (typical), MOSFET
E = f(RG)
)
f = 1 MHz, VGS = 0.0 V, Tvj = 25 °C
ID = 400 A, VDS = 600 V, VGS = -5.0/15.0 V
120
100
80
60
40
20
0
100
10
1
0.1
0
100
200
300
400
500
600
5
10
15
20
25
30
Datasheet
8
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FS03MR12A6MA1B
™
HybridPACK Drive module
5 Characteristics diagrams
switching losses (typical), MOSFET
E = f(ID)
thermal impedance , MOSFET
RthJF = f(dv/dt)
VDS = 600 V, RGoff = 5.1 Ω, RGon = 5.1 Ω, VGS = -5.0/15.0 V
fluid = 50% water/50% ethylenglycol , TF = 60 °C
50
40
30
20
10
0
0.120
0.114
0.108
0.102
0.096
0.090
0
200
400
600
800
4
6
8
10
12
14
transient thermal impedance , MOSFET
Zth = f(t)
forward characteristic body diode (typical), MOSFET
ISD = f(VSD
)
ΔV/Δt = 10 dm³/min, fluid = 50% water/50%
ethylenglycol , TF = 60 °C
Tvj = 25 °C
1
800
700
600
500
400
300
200
100
0
0.1
0.01
0.001
0
1
2
3
4
5
6
0.001
0.01
0.1
1
10
Datasheet
9
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FS03MR12A6MA1B
™
HybridPACK Drive module
5 Characteristics diagrams
Switching losses body diode (typical), MOSFET
Switching losses body diode (typical), MOSFET
Erec = f(RG)
Erec = f(ISD
)
Vr = 600 V, RGon = 5.1 Ω, VGS = -5.0/15.0 V
Vr = 600 V, ISD = 400 A, VGS = -5.0/15.0 V
10
10
8
6
4
2
0
8
6
4
2
0
0
200
400
600
800
5
10
15
20
25
30
Reverse bias safe operating area (RBSOA), MOSFET
ID = f(VDS
temperature characteristic (typical), NTC-Thermistor
R = f(TNTC
)
)
RGoff = 5.1 Ω, VGS = +15V/-5 V, Tvj = 150 °C
1000
100000
10000
1000
800
600
400
200
0
100
0
200
400
600
800 1000 1200 1400
0
20
40
60
80 100 120 140 160
Datasheet
10
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FS03MR12A6MA1B
™
HybridPACK Drive module
6 Circuit diagram
6
Circuit diagram
P1
P2
P3
D1.2
D1.1
D3.2
D5.2
D5.1
T1
D3.1
T
T
T
T2
T3
G1
S1
G3
S3
G5
S5
U
V
W
D2
D4
D6
T4
T5
G2
G4
G6
S2.1
S2.2
S4.1
S4.2
S6.1
S6.2
T6
N1
N2
N3
Figure 2
Datasheet
11
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FS03MR12A6MA1B
™
HybridPACK Drive module
7 Package outlines
7
Package outlines
Ø5,3±0,15{
B
n0,6 FG
A
j
n1,2 DE
F
6x(N1-N3;P1-P3)
G
6x
n5,5±0,1
6x
14±0,2 6x
D
6x
22,25±0,4
16,25
9,75±0,4
1±0,15
16±0,2
n0,5 DE
A
j
n1,6 BC
Y
B
N2
P2
P1
N1
N3
P3
8x
5±0,4
0
X
0
0
G4
G6
G2
D4
D6
15,5±0,5
D2
D3.2 S4.2
D5.2 S6.2
D1.2 S2.2
S4.1
S6.1
S2.1
4±0,3
T1
T2
T3
T4
T5
T6
6,35±0,5
A
G1 S1
G3
G5 S5
D5.1
S3
66,5±0,5
D1.1
D3.1
82
87±0,4
90,75±0,4
98,25
82
C
V
U
W
C
1±0,15
E
3x
104,25±0,4
3x
n5,5±0,1
3x
14±0,2
H
n0,6 H I
A
j
n1,2 DE
3x(U;V;W)
I
B
S
D2
D3
D4
X-Y ( 1 : 1 )
8x
L
8x
Y
N2
P2
N3
N1
P1
P3
n0,8 LM
n1,6 B C
D1
9,3±0,2
A
j
0
8
A
M
c 0,3 CZ
X
G2
G4
G6
D2
D4
D6
6x common
zones
D1-D2
18,85
origin axis generated by
D1.2,S2.2,G2,S2.1,D2,D3.2,S4.2,
G4,S4.1,D4,D5.2,S6.2,G6,S6.1,D6
D1.2 S2.2
D3.2 S4.2
D5.2 S6.2
S2.1 Z
S4.1
S6.1
dimensioned for
EJOT Delta PT
WN5451 30 x 10
J
K
D2-D3
D3-D4
D8-D7
D7-D6
D6-D5
R
51,85
59,35
67,15
69,85
74,1
82
T1
T3
T4
T5
T6
T
T2
G1 S1
G3S3
D3.1
G5 S5
D5.1
D1.1
3,94±0,5
C
U
V
W
D8
refers
D7
D6
D5
to local CZ
Areas R,S or T
(19,75)
Z ( 1,5 : 1 )
Drawing: D00112361 Rev07
general
edges
surface
**
**
tolerances
KJ
BC
A
j
1. DIN
DIN EN ISO
1302
G2
S2.1
DIN ISO 13715
16742-TG4
2. DIN ISO
2768-mK
30x
D1.2
S2.2
** Pin positions
checked with pin gauge
according to Application Note
AN-HPD_ASSEMBLY
All dimensions refer to module in
delivery condition
Figure 3
Datasheet
12
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2021-03-23
FS03MR12A6MA1B
™
HybridPACK Drive module
8 Module label code
8
Module label code
Module label code
Code format
Encoding
Data Matrix
ASCII text
Barcode Code128
Code Set A
23 digits
Symbol size
Standard
16x16
IEC24720 and IEC16022
IEC8859-1
Code content
Content
Digit
1 – 5
6 - 11
12 - 19
20 – 21
22 – 23
Example
71549
142846
55054991
15
Module serial number
Module material number
Production order number
Date code (production year)
Date code (production week)
30
Example
71549142846550549911530
71549142846550549911530
Packing label code
Code format
Encoding
Barcode Code128
Code Set A
Symbol size
Standard
34 digits
IEC8859-1
Code content
Content
Identifier
X
1T
S
9D
Q
Digit
2 – 9
12 – 19
21 – 25
28 – 31
33 – 34
Example
Module serial number
Module material number
Production order number
Date code (production year)
Date code (production week)
95056609
2X0003E0
754389
1139
15
Example
X950566091T2X0003E0S754389D1139Q15
Figure 4
Datasheet
13
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2021-03-23
FS03MR12A6MA1B
™
HybridPACK Drive module
Revision history
Revision history
Revision
Date of release Description of changes
v1.0
v1.1
-
2017-11-06
2018-11-28
-
Target datasheet
Target datasheet
Datasheet migrated to new system:¨
•
•
Layout changed
Revision number scheme changed: 0.xy = Target/Preliminary; 1.xy =
Final
1.00
2021-03-23
Final datasheet
Datasheet
14
1.00
2021-03-23
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Edition 2021-03-23
Published by
Infineon Technologies AG
81726 Munich, Germany
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