FS200R07A5E3_S6 [INFINEON]

Flat Baseplate;


型号：	FS200R07A5E3_S6
厂家：	Infineon
描述：	Flat Baseplate
文件：	总14页 (文件大小：1426K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HybridPACK™ꢀLightꢀModule

FS200R07A5E3_S6

FinalꢀDataꢀSheet

V3.0,ꢀ2015-03-24

AutomotiveꢀHighꢀPower

FS200R07A5E3_S6

HybridPACKªꢀLightꢀModule

1ꢀꢀꢀꢀꢀFeaturesꢀ/ꢀDescription

V_CES= 700V

I_{C nom}= 200A / I_CRM= 400A

TypicalꢀApplications

Description

• HybridꢀElectricalꢀVehiclesꢀ(H)EV

The HybridPACK^TMLight is a very compact six-pack

module (705V/200A) targeting mild hybrid vehicles

with power levels up to 20kW. The module is based

on established solder and screw interconnections

known from HybridPACK^TM1. Improved stray

inductance and blocking voltage offer lowest

conduction and switching losses especially at

inverter maximum ratings.

• Optimized for automotive applications with DC link

voltagesꢀupꢀtoꢀ450ꢀV

ElectricalꢀFeatures

• Increasedꢀblockingꢀvoltageꢀcapabilityꢀtoꢀ705V

• LowꢀSwitchingꢀLosses

• T_vjꢀopꢀ=ꢀ150°C

• TrenchꢀIGBTꢀ3

• V_CEsatꢀꢀwithꢀpositiveꢀTemperatureꢀCoefficient

MechanicalꢀFeatures

• 2.5ꢀkVꢀACꢀ1minꢀInsulation

• Al₂O₃ꢀSubstrateꢀwithꢀLowꢀThermalꢀResistance

• Highꢀmechanicalꢀrobustness

• IntegratedꢀNTCꢀtemperatureꢀsensor

• CopperꢀBaseꢀPlate

• RoHSꢀcompliant

ProductꢀName

OrderingꢀCode

SP001150884

FS200R07A5E3_S6

Final Data Sheet

V3.0,ꢀꢀ2015-03-24

FS200R07A5E3_S6

HybridPACKªꢀLightꢀModule

2ꢀꢀꢀꢀꢀIGBT,Inverter

2.1ꢀꢀꢀꢀMaximumꢀRatedꢀValues

Parameter

Conditions

Symbol

V_CES

I_{C nom}

I_CRM

Value

705

Unit

Collector-emitterꢀvoltage

T_vj= 25°C

ContinuousꢀDCꢀcollectorꢀcurrent

Repetitiveꢀpeakꢀcollectorꢀcurrent

Totalꢀpowerꢀdissipation

T_C= 75°C, T_{vj max}= 175°C

t_P= 1 ms

200

400

T_C= 25°C, T_{vj max}= 175°C

P_tot

630

Gate-emitterꢀpeakꢀvoltage

V_GES

+/-20

2.2ꢀꢀꢀꢀCharacteristicꢀValues

min. typ. max.

Collector-emitterꢀsaturationꢀvoltage

I_C= 200 A, V_GE= 15 V

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

1,45 1,70

1,60

1,70

V_{CE sat}

Gateꢀthresholdꢀvoltage

Gateꢀcharge

I_C= 3,20 mA, V_CE= V_GE

V_GE= -15 V ... 15 V

T_vj= 25°C

V_GEth

Q_G

4,90 5,80 6,50

µC

Ω

2,15

2,0

Internalꢀgateꢀresistor

T_vj= 25°C

R_Gint

C_ies

C_res

I_CES

I_GES

Inputꢀcapacitance

f = 1 MHz, V_CE= 25 V, V_GE= 0 V

V_CE= 450 V, V_GE= 0 V

13,0

0,38

0,1

Reverseꢀtransferꢀcapacitance

Collector-emitterꢀcut-offꢀcurrent

Gate-emitterꢀleakageꢀcurrent

Turn-onꢀdelayꢀtime,ꢀinductiveꢀload

V_CE= 0 V, V_GE= 20 V

400

I_C= 200 A, V_CE= 300 V

V_GE= ±15 V

R_Gon= 2,4 Ω

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

0,12

0,14

t_{d on}

µs

Riseꢀtime,ꢀinductiveꢀload

Turn-offꢀdelayꢀtime,ꢀinductiveꢀload

Fallꢀtime,ꢀinductiveꢀload

Turn-onꢀenergyꢀlossꢀperꢀpulse

Turn-offꢀenergyꢀlossꢀperꢀpulse

SCꢀdata

I_C= 200 A, V_CE= 300 V

V_GE= ±15 V

R_Gon= 2,4 Ω

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

0,05

0,06

t_r

I_C= 200 A, V_CE= 300 V

V_GE= ±15 V

R_Goff= 2,4 Ω

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

0,33

0,36

0,37

t_{d off}

I_C= 200 A, V_CE= 300 V

V_GE= ±15 V

R_Goff= 2,4 Ω

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

0,04

0,06

0,07

t_f

I_C= 200 A, V_CE= 300 V, L_S= 25 nH

V_GE= ±15 V, di/dt = 3500 A/µs (T_vj= 150°C) T_vj= 125°C

R_Gon= 2,4 Ω

T_vj= 25°C

2,40

3,50

3,70

E_on

E_off

T_vj= 150°C

I_C= 200 A, V_CE= 300 V, L_S= 25 nH

V_GE= ±15 V, du/dt = 3500 V/µs (T_vj= 150°C) T_vj= 125°C

R_Goff= 2,4 Ω

T_vj= 25°C

6,20

7,50

8,00

T_vj= 150°C

V_GE≤ 15 V, V_CC= 360 V

V_CEmax= V_CES-L_sCE·di/dt

I_SC

t_P≤ 6 µs, T_vj= 150°C

1000

Thermalꢀresistance,ꢀjunctionꢀtoꢀcase

Thermalꢀresistance,ꢀcaseꢀtoꢀheatsink

perꢀIGBT

R_thJC

R_thCH

T_{vj op}

0,238 K/W

K/W

0,116

_Pasteꢀ=ꢀ1ꢀW/(m·K)ꢀꢀꢀ/ꢀꢀꢀꢀλ_greaseꢀ=ꢀ1ꢀW/(m·K)

Temperatureꢀunderꢀswitchingꢀconditions

t_opcontinuous

-40

150

°C

Final Data Sheet

V3.0,ꢀꢀ2015-03-24

FS200R07A5E3_S6

HybridPACKªꢀLightꢀModule

3ꢀꢀꢀꢀꢀDiode,ꢀInverter

3.1ꢀꢀꢀꢀMaximumꢀRatedꢀValues

Parameter

Conditions

Symbol

V_RRM

I_F

Value

705

Unit

Repetitiveꢀpeakꢀreverseꢀvoltage

ContinuousꢀDCꢀforwardꢀcurrent

Repetitiveꢀpeakꢀforwardꢀcurrent

I²tꢀ-ꢀvalue

T_vj= 25°C

200

t_P= 1 ms

I_FRM

400

V_R= 0 V, t_P= 10 ms, T_vj= 125°C

V_R= 0 V, t_P= 10 ms, T_vj= 150°C

2100

2000

A²s

I²t

3.2ꢀꢀꢀꢀCharacteristicꢀValues

min. typ. max.

Forwardꢀvoltage

I_F= 200 A, V_GE= 0 V

T_vj= 25 °C

T_vj= 125 °C

T_vj= 150°C

1,55 1,90

1,50

1,45

V_F

I_RM

Q_r

Peakꢀreverseꢀrecoveryꢀcurrent

Recoveredꢀcharge

I_F= 200 A, - di_F/dt = 3500 A/µs (T_vj= 150°C) T_vj= 25 °C

V_R= 300 V

V_GE= -15 V

99,0

135

140

T_vj= 125 °C

T_vj= 150°C

I_F= 200 A, - di_F/dt = 3500 A/µs (T_vj= 150°C) T_vj= 25 °C

V_R= 300 V

V_GE= -15 V

6,90

13,5

17,0

µC

T_vj= 125 °C

T_vj= 150°C

Reverseꢀrecoveryꢀenergy

I_F= 200 A, - di_F/dt = 3500 A/µs (T_vj= 150°C) T_vj= 25 °C

1,80

3,40

4,20

V_R= 300 V

V_GE= -15 V

T_vj= 125 °C

T_vj= 150°C

E_rec

Thermalꢀresistance,ꢀjunctionꢀtoꢀcase

Thermalꢀresistance,ꢀcaseꢀtoꢀheatsink

perꢀdiode

R_thJC

R_thCH

T_{vj op}

0,455 K/W

K/W

perꢀdiode

0,114

_Pasteꢀ=ꢀ1ꢀW/(m·K)ꢀꢀꢀ/ꢀꢀꢀꢀλ_greaseꢀ=ꢀ1ꢀW/(m·K)

Temperatureꢀunderꢀswitchingꢀconditions

t_opcontinuous

-40

150

°C

4ꢀꢀꢀꢀꢀNTC-Thermistor

Parameter

min. typ. max.

Conditions

Symbol

R₂₅

Value

Unit

kΩ

Ratedꢀresistance

DeviationꢀofꢀR100

Powerꢀdissipation

B-value

T_C= 25°C

5,00

T_C= 100°C, R₁₀₀= 493 Ω

T_C= 25°C

∆R/R

P₂₅

20,0 mW

R₂= R₂₅exp [B_25/50(1/T₂- 1/(298,15 K))]

R₂= R₂₅exp [B_25/80(1/T₂- 1/(298,15 K))]

R₂= R₂₅exp [B_25/100(1/T₂- 1/(298,15 K))]

B_25/50

B_25/80

B_25/100

3375

3411

3433

B-value

Specificationꢀaccordingꢀtoꢀtheꢀvalidꢀapplicationꢀnote.

Final Data Sheet

V3.0,ꢀꢀ2015-03-24

FS200R07A5E3_S6

HybridPACKªꢀLightꢀModule

5ꢀꢀꢀꢀꢀModule

Parameter

Conditions

Symbol

Value

2,5

Unit

Isolationꢀtestꢀvoltage

Materialꢀofꢀmoduleꢀbaseplate

Internalꢀisolation

RMS, f = 50 Hz, t = 1 min.

V_ISOL

ꢀ

ꢀ kV

ꢀ

basicꢀinsulationꢀ(classꢀ1,ꢀIECꢀ61140)

Al₂O₃

Creepageꢀdistance

terminalꢀtoꢀheatsink

terminalꢀtoꢀterminal

12,0

6,1

d_Creep

ꢀ

ꢀ mm

Clearance

terminalꢀtoꢀheatsink

terminalꢀtoꢀterminal

12,0

6,1

d_Clear

CTI

ꢀ

ꢀ mm

Comperativeꢀtrackingꢀindex

> 200

ꢀ

min. typ. max.

Strayꢀinductanceꢀmodule

Moduleꢀleadꢀresistance,ꢀterminalsꢀ-ꢀchip

Storageꢀtemperature

L_sCE

R_CC'+EE'

T_stg

mΩ

°C

T_Cꢀ=ꢀ25ꢀ°C,ꢀperꢀswitch

1,50

-40

3,00

3,0

125

Mountingꢀtorqueꢀforꢀmodulꢀmounting

Terminalꢀconnectionꢀtorque

Weight

ScrewꢀM5ꢀbaseplateꢀtoꢀheatsink

ScrewꢀM6

6,00 Nm

6,0

340

Final Data Sheet

V3.0,ꢀꢀ2015-03-24

FS200R07A5E3_S6

HybridPACKªꢀLightꢀModule

6ꢀꢀꢀꢀꢀCharacteristicsꢀDiagrams

outputꢀcharacteristicꢀIGBT,Inverterꢀ(typical)

I_Cꢀ=ꢀfꢀ(V_CE

)

V_GEꢀ=ꢀ15ꢀV

T_vjꢀ=ꢀ150°C

400

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

V_GE= 19V

V_GE= 17V

V_GE= 15V

V_GE= 13V

V_GE= 11V

V_GE= 9V

350

300

250

200

150

100

350

300

250

200

150

100

0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2 2,4 2,6

0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 4,0 4,5 5,0

V_CE[V]

transferꢀcharacteristicꢀIGBT,Inverterꢀ(typical)

switchingꢀlossesꢀIGBT,Inverterꢀ(typical)

E_onꢀ=ꢀfꢀ(I_C),ꢀE_offꢀ=ꢀfꢀ(I_C)

I_Cꢀ=ꢀfꢀ(V_GE

)

V_CEꢀ=ꢀ20ꢀV

V_GEꢀ=ꢀ±15ꢀV,ꢀR_Gonꢀ=ꢀ2.4ꢀΩ,ꢀR_Goffꢀ=ꢀ2.4ꢀΩ,ꢀV_CEꢀ=ꢀ300ꢀV

400

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

E_on, T_vj= 125°C

E_off, T_vj= 125°C

E_on, T_vj= 150°C

E_off, T_vj= 150°C

350

300

250

200

150

100

200

I_C[A]

300

400

V_GE[V]

Final Data Sheet

V3.0,ꢀꢀ2015-03-24

FS200R07A5E3_S6

HybridPACKªꢀLightꢀModule

switchingꢀlossesꢀIGBT,Inverterꢀ(typical)

E_onꢀ=ꢀfꢀ(R_G),ꢀE_offꢀ=ꢀfꢀ(R_G)

transientꢀthermalꢀimpedanceꢀIGBT,Inverterꢀ

Z_thJCꢀ=ꢀfꢀ(t)

V_GEꢀ=ꢀ±15ꢀV,ꢀI_Cꢀ=ꢀ200ꢀA,ꢀV_CEꢀ=ꢀ300ꢀV

E_on, T_vj= 125°C

E_off, T_vj= 125°C

E_on, T_vj= 150°C

Z_thJC: IGBT

E_off, T_vj= 150°C

0,1

0,01

r_i[K/W]: 0,018357

τ_i[s]: 0,00030623 0,00685582 0,03632409 3,761787

0,03340009 0,1723305 0,0123576

0,001

10 12 14 16 18 20 22 24

0,001

0,01

0,1

t [s]

R_G[Ω]

reverseꢀbiasꢀsafeꢀoperatingꢀareaꢀIGBT,Inverterꢀ(RBSOA)

I_Cꢀ=ꢀfꢀ(V_CE

forwardꢀcharacteristicꢀofꢀDiode,ꢀInverterꢀ(typical)

I_Fꢀ=ꢀfꢀ(V_F)

)

V_GEꢀ=ꢀ±15ꢀV,ꢀR_Goffꢀ=ꢀ2.4ꢀΩ,ꢀT_vjꢀ=ꢀ150°C

450

400

Ic, Modul

T_vj= 25°C

I_C, Chip

T_vj= 125°C

T_vj= 150°C

400

350

300

250

200

150

100

350

300

250

200

150

100

200

300

400

V_CE[V]

500

600

700

800

0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0

V_F[V]

Final Data Sheet

V3.0,ꢀꢀ2015-03-24

FS200R07A5E3_S6

HybridPACKªꢀLightꢀModule

switchingꢀlossesꢀDiode,ꢀInverterꢀ(typical)

E_recꢀ=ꢀfꢀ(I_F)

switchingꢀlossesꢀDiode,ꢀInverterꢀ(typical)

E_recꢀ=ꢀfꢀ(R_G)

R_Gonꢀ=ꢀ2.4ꢀΩ,ꢀV_CEꢀ=ꢀ300ꢀV

I_Fꢀ=ꢀ200ꢀA,ꢀV_CEꢀ=ꢀ300ꢀV

E_rec, T_vj= 125°C

E_rec, T_vj= 150°C

E_rec, T_vj= 125°C

E_rec, T_vj= 150°C

100

150

200

I_F[A]

250

300

350

400

10 12 14 16 18 20 22 24

R_G[Ω]

transientꢀthermalꢀimpedanceꢀDiode,ꢀInverterꢀ

NTC-Thermistor-temperatureꢀcharacteristicꢀ(typical)

Z_thJCꢀ=ꢀfꢀ(t)

Rꢀ=ꢀfꢀ(T)

100000

Z_thJC: Diode

R_typ

0,1

10000

1000

100

0,01

r_i[K/W]: 0,04020411 0,08725309 0,2943841 0,03291171

τ_i[s]: 0,00027502 0,00926944 0,04728454 1,529583

0,001

0,01

0,1

t [s]

T_C[°C]

100

120

140

160

Final Data Sheet

V3.0,ꢀꢀ2015-03-24

FS200R07A5E3_S6

HybridPACKªꢀLightꢀModule

7ꢀꢀꢀꢀꢀCircuitꢀdiagram

Final Data Sheet

V3.0,ꢀꢀ2015-03-24

FS200R07A5E3_S6

HybridPACKªꢀLightꢀModule

8ꢀꢀꢀꢀꢀPackageꢀoutlines

(21)

110B0,3

103B0,3

(41)

(39)

P0,65ABC-D

37,75

(39)

(41)

F 0,3ABC-D

measurement

height for Pin Position

tolerance (see detail G)

H-H ( 2 : 1 )

G ( 5 : 1 )

18x

1,15B0,06

18x

0,85ABC-D

4x for screw P2,5 mm

Signalpin position tolerance,

measurement height

(see detail H-H)

10mm deep

0,65ABC-D

NTC 2x G E

G E

Signalpin position tolerance,

measurement height

(see detail H-H)

23 24 9 10 25 11 12

P1,0ABC-D

1mm deep

F 0,5ABC-D

(41)

Drawing: D00051611_00.B

edges general tolerances surface

ISO 8015 principle of independency

dimensions ISO 14405 GG

26 13 14 15 16 27 17 18 28

G E G E G E

1. DIN 16742-TG6

2. DIN ISO 2768-mk

DIN ISO

13715

method of least-squares

DIN EN ISO

1302

target geometry according CAD file

with general tolerances

5x Screw M6 - 10mm deep

4x P5,5B0,1

All dimensions refer to module in delivery condition

P1,0ABC-D

Final Data Sheet

V3.0,ꢀꢀ2015-03-24

FS200R07A5E3_S6

HybridPACKªꢀLightꢀModule

9ꢀꢀꢀꢀꢀLabelꢀCodes

9.1ꢀꢀꢀꢀModuleꢀCode

CodeꢀFormat

Data Matrix

Encoding

ASCII Text

SymbolꢀSize

Standard

16x16

IEC24720 and IEC16022

CodeꢀContent

Content

Digit

Exampleꢀ(below)

Module Serial Number

Module Material Number

Production Order Number

Datecode (Production Year)

Datecode (Production Week)

1 - 5

71549

142846

55054991

6 - 11

12 - 19

20 - 21

22 - 23

Example

71549142846550549911530

9.2ꢀꢀꢀꢀPackingꢀCode

CodeꢀFormat

Code128

Code Set A

34 digits

Encoding

SymbolꢀSize

Standard

IEC8859-1

CodeꢀContent

Content

Identifier

Digit

2 - 9

12 - 19

21 - 25

28 - 31

33 - 34

Exampleꢀ(below)

95056609

2X0003E0

754389

1139

Backend Construction Number

Production Lot Number

Serial Number

Date Code

Box Quantity

Example

X950566091T2X0003E0S754389D1139Q15

Final Data Sheet

V3.0,ꢀꢀ2015-03-24

FS200R07A5E3_S6

HybridPACKªꢀLightꢀModule

RevisionꢀHistory

Major changes since previous revision

Revision History

Reference

V1.0

Date

Description

Initial Version

preliminary data

final data

2013-09-10

2014-11-01

2015-03-24

V2.0

V3.0

Final Data Sheet

V3.0,ꢀꢀ2015-03-24

FS200R07A5E3_S6

HybridPACKªꢀLightꢀModule

Termsꢀ&ꢀConditionsꢀofꢀusage

ꢀ

Editionꢀ2014-05-30

Publishedꢀby

InfineonꢀTechnologiesꢀAG

81726ꢀMunich,ꢀGermany

AllꢀRightsꢀReserved.

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(http://www.infineon.com)

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Technologies,ꢀifꢀaꢀfailureꢀofꢀsuchꢀcomponentsꢀcanꢀreasonablyꢀbeꢀexpectedꢀtoꢀcauseꢀtheꢀfailureꢀofꢀthatꢀlife-supportꢀdeviceꢀorꢀsystemꢀorꢀtoꢀaffect

theꢀsafetyꢀorꢀeffectivenessꢀofꢀthatꢀdeviceꢀorꢀsystem.ꢀLifeꢀsupportꢀdevicesꢀorꢀsystemsꢀareꢀintendedꢀtoꢀbeꢀimplantedꢀinꢀtheꢀhumanꢀbodyꢀorꢀto

supportꢀand/orꢀmaintainꢀandꢀsustainꢀand/orꢀprotectꢀhumanꢀlife.ꢀIfꢀtheyꢀfail,ꢀitꢀisꢀreasonableꢀtoꢀassumeꢀthatꢀtheꢀhealthꢀofꢀtheꢀuserꢀorꢀotherꢀpersons

mayꢀbeꢀendangered.

Trademarks

ꢀ

TrademarksꢀofꢀInfineonꢀTechnologiesꢀAG

AURIX™,ꢀC166™,ꢀCanPAK™,ꢀCIPOS™,ꢀCIPURSE™,ꢀEconoPACK™,ꢀCoolMOS™,ꢀCoolSET™,ꢀCORECONTROL™,ꢀCROSSAVE™,ꢀDAVE™,

DI-POL™,ꢀEasyPIM™,ꢀEconoBRIDGE™,ꢀEconoDUAL™,ꢀEconoPIM™,ꢀEconoPACK™,ꢀEiceDRIVER™,ꢀeupec™,ꢀFCOS™,ꢀHITFET™,

HybridPACK™,ꢀI²RF™,ꢀISOFACE™,ꢀIsoPACK™,ꢀMIPAQ™,ꢀModSTACK™,ꢀmy-d™,ꢀNovalithIC™,ꢀOptiMOS™,ꢀORIGA™,ꢀPOWERCODE™,

PRIMARION™,ꢀPrimePACK™,ꢀPrimeSTACK™,ꢀPRO-SIL™,ꢀPROFET™,ꢀRASIC™,ꢀReverSave™,ꢀSatRIC™,ꢀSIEGET™,ꢀSINDRION™,

SIPMOS™,ꢀSmartLEWIS™,ꢀSOLIDꢀFLASH™,ꢀTEMPFET™,ꢀthinQꢁ™,ꢀTRENCHSTOP™,ꢀTriCore™.

OtherꢀTrademarks

AdvanceꢀDesignꢀSystem™ꢀ(ADS)ꢀofꢀAgilentꢀTechnologies,ꢀAMBA™,ꢀARM™,ꢀMULTI-ICE™,ꢀKEIL™,ꢀPRIMECELL™,ꢀREALVIEW™,ꢀTHUMB™,

µVision™ꢀofꢀARMꢀLimited,ꢀUK.ꢀAUTOSAR™ꢀisꢀlicensedꢀbyꢀAUTOSARꢀdevelopmentꢀpartnership.ꢀBluetooth™ꢀofꢀBluetoothꢀSIGꢀInc.ꢀCAT-iq™ꢀof

DECTꢀForum.ꢀCOLOSSUS™,ꢀFirstGPS™ꢀofꢀTrimbleꢀNavigationꢀLtd.ꢀEMV™ꢀofꢀEMVCo,ꢀLLCꢀ(VisaꢀHoldingsꢀInc.).ꢀEPCOS™ꢀofꢀEpcosꢀAG.

FLEXGO™ꢀofꢀMicrosoftꢀCorporation.ꢀFlexRay™ꢀisꢀlicensedꢀbyꢀFlexRayꢀConsortium.ꢀHYPERTERMINAL™ꢀofꢀHilgraeveꢀIncorporated.ꢀIEC™ꢀof

CommissionꢀElectrotechniqueꢀInternationale.ꢀIrDA™ꢀofꢀInfraredꢀDataꢀAssociationꢀCorporation.ꢀISO™ꢀofꢀINTERNATIONALꢀORGANIZATION

FORꢀSTANDARDIZATION.ꢀMATLAB™ꢀofꢀMathWorks,ꢀInc.ꢀMAXIM™ꢀofꢀMaximꢀIntegratedꢀProducts,ꢀInc.ꢀMICROTEC™,ꢀNUCLEUS™ꢀofꢀMentor

GraphicsꢀCorporation.ꢀMIPI™ꢀofꢀMIPIꢀAlliance,ꢀInc.ꢀMIPS™ꢀofꢀMIPSꢀTechnologies,ꢀInc.,ꢀUSA.ꢀmuRata™ꢀofꢀMURATAꢀMANUFACTURINGꢀCO.,

MICROWAVEꢀOFFICE™ꢀ(MWO)ꢀofꢀAppliedꢀWaveꢀResearchꢀInc.,ꢀOmniVision™ꢀofꢀOmniVisionꢀTechnologies,ꢀInc.ꢀOpenwave™ꢀOpenwave

SystemsꢀInc.ꢀREDꢀHAT™ꢀRedꢀHat,ꢀInc.ꢀRFMD™ꢀRFꢀMicroꢀDevices,ꢀInc.ꢀSIRIUS™ꢀofꢀSiriusꢀSatelliteꢀRadioꢀInc.ꢀSOLARIS™ꢀofꢀSun

Microsystems,ꢀInc.ꢀSPANSION™ꢀofꢀSpansionꢀLLCꢀLtd.ꢀSymbian™ꢀofꢀSymbianꢀSoftwareꢀLimited.ꢀTAIYOꢀYUDEN™ꢀofꢀTaiyoꢀYudenꢀCo.

TEAKLITE™ꢀofꢀCEVA,ꢀInc.ꢀTEKTRONIX™ꢀofꢀTektronixꢀInc.ꢀTOKO™ꢀofꢀTOKOꢀKABUSHIKIꢀKAISHAꢀTA.ꢀUNIX™ꢀofꢀX/OpenꢀCompanyꢀLimited.

VERILOG™,ꢀPALLADIUM™ꢀofꢀCadenceꢀDesignꢀSystems,ꢀInc.ꢀVLYNQ™ꢀofꢀTexasꢀInstrumentsꢀIncorporated.ꢀVXWORKS™,ꢀWINDꢀRIVER™ꢀof

WINDꢀRIVERꢀSYSTEMS,ꢀINC.ꢀZETEX™ꢀofꢀDiodesꢀZetexꢀLimited.

Last update

2011-11-11

Final Data Sheet

V3.0,ꢀꢀ2015-03-24

wꢀwꢀwꢀ.ꢀiꢀnꢀfꢀiꢀnꢀeꢀoꢀnꢀ.ꢀcꢀoꢀm

PublishedꢀbyꢀInfineonꢀTechnologiesꢀAG

FS200R07A5E3_S6 [INFINEON]

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